KR102160775B1 - A light emitting device package - Google Patents

Abstract

The embodiment includes a package body having a cavity consisting of a side surface and a bottom, a light emitting device disposed in the cavity, and a first coating layer disposed on the side surface of the cavity and made of a white resin, and the package body is made of black resin. It is made, it is possible to implement a high contrast between lighting and turning off, it is possible to improve the light extraction efficiency.

Description

Light emitting device package {A LIGHT EMITTING DEVICE PACKAGE}

The embodiment relates to a light emitting device package.

Light-emitting devices such as light emitting diodes (LEDs) and laser diodes (LDs) using a group 3-5 or group 2-6 compound semiconductor material of semiconductors are red and red due to the development of thin film growth technology and device materials. Various colors such as green, blue, and ultraviolet light can be implemented, and efficient white light can be realized by using fluorescent materials or by combining colors. Low power consumption, semi-permanent life, and fast compared to conventional light sources such as fluorescent lamps and incandescent lamps. It has the advantages of response speed, safety and environmental friendliness.

Accordingly, a light-emitting diode backlight that replaces a transmission module of optical communication means, a cold cathode fluorescene lamp (CCFL) constituting a backlight of an LCD (Liquid Crystal Display) display device, and white light that can replace a fluorescent or incandescent bulb Applications are expanding to diode lighting devices, automobile headlights and traffic lights.

Light emitting device packages are widely used in lighting devices and display devices. The light emitting device package may generally include a body, lead frames positioned within the body, and a light emitting device (eg, an LED) positioned on one of the lead frames.

The embodiment provides a light emitting device package capable of implementing high contrast between lighting and turning off and improving light extraction efficiency.

A light emitting device package according to an embodiment includes: a package body having a cavity formed of a side surface and a bottom; A light-emitting element disposed in the cavity; And a first coating layer disposed on the side surface of the cavity and made of white resin, and the package body is made of black resin.

The package body may include a sidewall surrounding the cavity, and a thickness of the first coating layer may be thinner than a thickness of a sidewall of the package body.

The thickness of the first coating layer may be 25 um to 100 um.

The package body may be made of polyphtalamide (PPA) resin mixed with carbon black, epoxy mold compound (EMC) resin, or black silicon.

The first coating layer may be made of a PPA resin mixed with titanium oxide, a white EMC resin, or white silicon.

The light emitting device package may include first and second lead frames disposed on the body to be spaced apart from each other, and having an upper surface exposed by the cavity; And a molding part filled in the cavity, and the light emitting device may be disposed on an upper surface of the first lead frame.

The light emitting device package may further include a second coating layer disposed on upper surfaces of the first and second lead frames, a bottom of the cavity, and upper and side surfaces of the light emitting device.

The light emitting device package may include a wire connecting the light emitting device and the second lead frame; And a second coating layer disposed on upper surfaces of the first and second lead frames, a bottom of the cavity, an upper surface and a side surface of the light emitting device, and a surface of the wire.

The first and second coating layers are formed of a mixture of silicon and a diffusion agent, and the diffusion agent may include at least one of TiO ₂ , ZnO, CaCo ₃ , Al ₂ O ₃ , or BaSO ₄ .

The weight ratio of the diffusion agent to the silicon of the first and second coating layers may be 0.1 wt% to 10 wt%.

The embodiment can implement high contrast between lighting and turning off, and improve light extraction efficiency.

1 is a perspective view of a light emitting device package according to an embodiment.
2 shows a plan view of the light emitting device package shown in FIG. 1.
3 is a cross-sectional view of the light emitting device package shown in FIG. 1 in the AB direction.
4 shows the cavity of the package body shown in FIG. 3.
5 is a plan view of a light emitting device package according to another embodiment.
6 is a cross-sectional view of the light emitting device package shown in FIG. 5 in the AB direction.
7 shows a lighting device including a light emitting device package according to an embodiment.
8 illustrates a display device including a light emitting device package according to an exemplary embodiment.
9 shows a head lamp including a light emitting device package according to an embodiment.

Hereinafter, embodiments will be clearly revealed through the accompanying drawings and descriptions of the embodiments. In the description of the embodiment, each layer (film), region, pattern, or structure is "on" or "under" of the substrate, each layer (film), region, pad or patterns. In the case of being described as being formed in, "on" and "under" include both "directly" or "indirectly" formed do. In addition, the standards for the top/top or bottom/bottom of each layer will be described based on the drawings.

In the drawings, the sizes are exaggerated, omitted, or schematically illustrated for convenience and clarity of description. Also, the size of each component does not fully reflect the actual size. Also, the same reference numerals denote the same elements throughout the description of the drawings.

1 is a perspective view of a light emitting device package 100 according to an embodiment, FIG. 2 is a plan view of the light emitting device package shown in FIG. 1, and FIG. 3 is an AB of the light emitting device package 100 shown in FIG. It shows a cross-sectional view in the direction, and FIG. 4 shows the cavity of the package body shown in FIG. 3.

1 and 2, the light emitting device package 100 includes a package body 110, at least one first lead frame 122, 124, 126, and at least one second lead frame 132, 134, 136, and at least one light emitting device. (142, 144, 159), at least one Zener diode (152, 154), a coating layer 150, wires (161 to 167), and a molding unit (170).

The package body 110 has a cavity 105 with an open top and a bottom 101 and a side surface 102.

The cavity 105 of the package body 110 may have a cross-sectional shape of a cup shape, a concave container shape, etc., and the side surface 102 of the cavity 105 is perpendicular to the bottom 101 of the cavity 105 Or it can be inclined.

The shape of the cavity 105 of the package body 110 as viewed from above may be a circle, an oval, or a polygon (eg, a quadrangle), and a corner portion of the cavity 105 of the package body 110 having a polygon may be a curved surface, It is not limited to this.

The package body 110 absorbs light in order to increase the contrast between the light-emitting elements 142, 144, and 159 on and off, or may be made of a member having a low light reflectance, for example, black resin. , Can be formed through injection molding.

For example, the package body 110 may be made of a polyphthalamide (PPA) resin mixed with carbon black, a black epoxy mold compound (EMC) resin, or black silicon.

The package body 110 may include a lower body 112 and a side wall 115 positioned on the lower body 112 and surrounding the cavity 105.

At least one first lead frame 122, 124, 126 and at least one second lead frame 132, 134, 136 may be disposed on the surface of the package body to be electrically separated from each other. Also, the number of the first lead frames 122, 124, and 126 may be plural, and the number of the second lead frames 132, 134, and 136 may be plural.

In FIGS. 1 to 3, the number of first lead frames 122, 124, and 126 may be three, and the number of second lead frames 132, 134 and 136 may be three, but are not limited thereto.

The first lead frames 122, 124, and 126 may be disposed on the surface of the package body 110 to be electrically separated from each other. For example, the first lead frames 122, 124, and 126 may be disposed spaced apart from each other on the lower body 112, and a part of the lower body 112 may be disposed between the first lead frames 122, 124, and 126. I can.

One end of each of the first lead frames 122, 124, and 126 may be exposed outside the package body 110. For example, one end of each of the first lead frames 122, 124, and 126 may extend to be disposed on a lower surface of the lower body 112 by passing through the first side surface of the lower body 112.

The second lead frames 132, 134, and 136 may be disposed on the surface of the package body 110 to be electrically separated from each other. For example, the second lead frames 132, 134, and 136 may be disposed spaced apart from each other on the lower body 112, and another part of the lower body 112 may be disposed between the second lead frames 132, 134, and 136. have.

In addition, the second lead frames 132, 134, 136 may be spaced apart from the first lead frames 122, 124, 126 and disposed on the lower body 112, and the first lead frames 122, 124, 126 and the second lead frames 132, 134, 136 Another part of the lower body 112 may be disposed between ).

One end of each of the second lead frames 132, 134, and 136 may be exposed outside the package body 110. For example, one end of each of the second lead frames 132, 134, and 136 may extend to be disposed on the lower surface of the lower body 112 by passing through the second side surface of the lower body 112. At this time, the first side and the second side of the lower body 112 may face each other, but the embodiment is not limited thereto.

An upper surface of each of the first lead frames 122, 124, and 126 and an upper surface of each of the second lead frames 132, 134 and 136 may be exposed by the cavity 105.

A first groove 301 may be provided on the upper surfaces of the first lead frames 122, 124, and 126 in contact with the sidewall 115, and a first groove 301 may be provided on the lower surfaces of the first lead frames 122, 124, and 126 in contact with the lower body 112. 2 grooves 302 may be provided.

In addition, a third groove 303 may be provided on the upper surfaces of the second lead frames 132, 134, and 136 in contact with the sidewall 115, and the lower surfaces of the second lead frames 132, 134, and 136 in contact with the lower body 112 A fourth groove 304 may be provided.

The package body 110 may be filled in the first to fourth grooves 301 to 304. The first to fourth grooves 301 to 304 may improve airtightness by lengthening the penetration path of moisture or air.

In addition, the first to fourth grooves 301 to 304 may increase the contact area with the package body 110 to improve adhesion between the package body 110 and the first and second lead frames 122,124,126,132,134,136.

The at least one light emitting device 142, 144, 159 is disposed in the cavity 105 and may be disposed on an upper surface of any one of at least one first lead frame and at least one second lead frame.

For example, the first light emitting device 142 may be disposed on the upper surface of the first lead frame 122 exposed by the cavity 105, and the second light emitting device 144 is exposed by the cavity 105 The third light emitting device 159 may be disposed on the upper surface of the first lead frame 126 to be formed, and the third light emitting device 159 may be disposed on the second lead frame 134 exposed by the cavity 105.

It may be electrically connected to at least one first lead frame (122, 126) and at least one second lead frame (132, 136).

The at least one light emitting device 142, 144, 159 is electrically connected to at least one first lead frame 122, 124, 126 and at least one second lead frame 132, 134, 136 by at least one of die bonding or wire bonding. Can be connected to.

For example, the at least one light emitting device 142, 144, 159 may be electrically connected to the first lead frames 122, 126 and the second lead frames 132,136 by the wires 161 to 164, 166.

The at least one light emitting device 142, 144, 159 may be a vertical type, a horizontal type, or a flip chip type light emitting device, and may generate at least one of red, blue, and yellow light. For example, the light-emitting elements 142 and 144 may be blue LED chips that generate blue light, and the light-emitting elements 159 may be red LED chips that generate red light, but are not limited thereto.

In FIG. 1, three light-emitting elements are disposed in the cavity 105, but embodiments are not limited thereto, and the number of light-emitting elements disposed in the cavity 105 may be one or more.

At least one Zener diode 152, 154 is disposed in the cavity 105, and is disposed on an upper surface of any one of at least one first lead frame 122, 124, 126 and at least one second lead frame 132, 134, 136. I can.

For example, the first Zener diode 152 may be disposed on the upper surface of the second lead frame 132 exposed by the cavity 105, and the second Zener diode 154 is exposed by the cavity 105 It may be disposed on the upper surface of the second lead frame (136).

The Zener diode 152 may be electrically connected to the first lead frame 122 by the wire 165, and the Zener diode 154 may be electrically connected to the first lead frame 126 by the wire 167. have.

The coating layer 150 is disposed on the side surface 102 of the cavity 105. That is, the coating layer 150 may be disposed on the inner circumferential surface of the sidewall of the upper body 115.

For example, the coating layer 150 may cover the entire side surface 102 of the cavity 105.

The coating layer 150 may be made of a material having a higher reflectance than the package body 110, for example, a white resin, and may reflect light irradiated from at least one light emitting device 142, 144, 159.

The coating layer 150 may be formed using a mask and a spray coating method. As for the mask, the side surface 102 of the cavity 105 is exposed, the portion of the package body 110 excluding the side surface 102 of the cavity 105, and the upper surface of the first lead frame 122,124,126, and the second lead frame It may have a shape that blocks the upper surface of (132,134,136).

The coating layer 150 may be formed by spray coating a white resin on the side surface 102 of the cavity 105 exposed by the mask.

For example, the coating layer 150 may be made of a PPA resin mixed with titanium oxide, a white Epoxy Mold Compound (EMC) resin, or white silicon.

Since the coating layer is formed on the sidewall 115 of the package body 110 using spray coating, the thickness D2 of the coating layer 150 may be thinner than the thickness D1 of the sidewall 115 of the package body 110. I can. As described above, since the embodiment uses spray coating, the process can be simplified compared to using the double molding process.

For example, when the sidewalls 115 of the cavity 105 are inclined and the thickness of the sidewalls 115 is not constant, the thickness D1 of the sidewalls 115 of the package body 110 is the minimum thickness of the sidewalls 115 Can mean

For example, the thickness D2 of the coating layer 150 may be thinner than the thickness D1 of the uppermost end of the sidewall 115 of the package body 110 (D2<D1).

The thickness (D2) of the coating layer 150 formed by the spray coating method may be uniform over the entire area of the side surface 102 of the cavity 105, and the thickness (D2) of the coating layer 150 may be 25um ~ 100um. have.

When the thickness D2 of the coating layer 150 is less than 25 μm, the side surface 102 of the cavity 105 may be exposed because the thickness is thin, and thus, reflectance may decrease and light efficiency may decrease.

The reason why the thickness D2 of the coating layer 150 is 100 μm or less is to reduce unnecessary manufacturing costs because there is little difference in reflectance even if the thickness D2 of the coating layer 150 exceeds 100 μm.

The molding part 170 is filled in the cavity 105 to seal at least one light emitting device 142, 144, 159, and at least one Zener diode 152, 154, and wires 161 to 167. The molding part 170 may be made of a transparent polymer resin such as epoxy or silicone.

The molding part 170 may contact the top surfaces of the first lead frames 122, 124, and 126, the top surfaces of the second lead frames 132, 134, and 136, the bottom 101 of the cavity 105, and the coating layer 150. have.

The molding unit 170 may include a phosphor capable of changing the wavelength of light irradiated from at least one light emitting device 142, 144, 159, and may include a diffusing agent for diffusing light.

Since the entire package body 110 is made of black resin and has a structure in which a coating layer 150 made of white resin is disposed on the side surface 102 of the cavity 105, the embodiment is at least one light emitting device (142,144,159). ), it is possible to implement a high contrast (contrast) between the on and off.

In addition, since the light irradiated from at least one light emitting device 142, 144, 159 by the coating layer 150 is blocked from being absorbed by the package body 110 and is reflected outside the package body 110, the embodiment has light extraction efficiency. Can be improved, and as a result, the light output can be improved.

In addition, since the package body 110 is formed through a single molding process and the coating layer 150 is formed on the formed package body 110 by using a mask and spray coating, the process is simplified compared to using a double molding process. I can make it.

5 is a plan view of a light emitting device package 200 according to another embodiment, and FIG. 6 is a cross-sectional view of the light emitting device package 200 shown in FIG. 5 in the AB direction.

The same reference numerals as those in FIGS. 2 to 4 denote the same configuration, and the description of the same configuration will be simplified or omitted.

5 and 6, the light emitting device package 200 includes a package body 110, at least one first lead frame 122, 124, 126, and at least one second lead frame 132, 134, 136, and at least one light emitting device. (142, 144, 159), at least one Zener diode (152, 154), a coating layer 210, wires (161 to 167), and a molding unit (170).

The coating layer 210 shown in FIGS. 5 and 6 may have different positions and materials from the coating layer 150 shown in FIG. 3.

The coating layer 210 may include a first coating layer 210-1 and a second coating layer 210-2.

The first coating layer 210-1 is disposed on the side surface 102 of the cavity 105 and may be the same as the coating layer 150 illustrated in FIGS. 2 and 3.

The second coating layer 210-2 is the top surface of the first and second lead frames 122, 124, 126, 132, 134, 136 exposed by the cavity 105, the bottom 101 of the cavity 105, and at least one light emitting device 142, 144, 159 It may be disposed on the top and side surfaces of, the top and side surfaces of the at least one Zener diode 152 and 154, and the surfaces of the wires 161 to 167. For example, the second coating layer 210-2 may be wrapped to seal the wires 161 to 167.

Since the coating layer 210 is formed by spray coating, the thickness of the first coating layer 210-1 and the second coating layer 210-2 may be uniform. For example, the thickness of the first coating layer 210-1 may be the same as the thickness of the second coating layer 210-2.

The coating layer 210 may serve to diffuse and scatter light.

Due to this light diffusion and scattering function, the coating layer 210 includes the package body 110 and the first and second lead frames 122, 124, 126, 132, 134, 136, and Zener diodes ( 152, 154) and the wires (161 to 167) can be blocked from being absorbed, and the light irradiated from at least one light emitting device (142, 144, 159) can be reflected out of the package body 110, whereby the embodiment is light extraction efficiency And light output can be improved.

In addition, the coating layer 210 disposed on the surface of the at least one light emitting device 142,144,159 can diffuse and scatter light irradiated from the light emitting devices 142,144,159, whereby the embodiment improves light extraction efficiency and light output. I can.

The coating layer 210 may be in the form of a mixture of silicon and a diffusion agent.

For example, the diffusion agent is a material in the form of particles for diffusing light, and may include at least one of TiO ₂ , ZnO, CaCo ₃ , Al ₂ O ₃ , or BaSO ₄ .

For example, the weight ratio (wt%) of the diffusion agent to silicon of the coating layer 210 may be 0.1 wt% to 10 wt%.

When the weight ratio (wt%) of the diffusion agent to silicon of the coating layer 210 is less than 0.1 wt%, the degree of diffusion and scattering of the coating layer 210 is reduced, and thus the package body 110, the first and second lead frames Absorption of light by the (122, 124, 126, 132, 134, 136), Zener diodes 152, 154, and wires 161 to 167 may increase, and thus, light extraction efficiency and light output may decrease.

In addition, when the weight ratio (wt%) of the diffusion agent to silicon of the coating layer 210 exceeds 10 wt%, the degree of diffusion and scattering of the coating layer 210 increases, so that the light irradiated from the light emitting elements 142,144,159 The amount transmitted through the coating layer 210 positioned on the (142,144) surface may be reduced, and thus, light extraction efficiency and light output may be reduced.

7 shows a lighting device including a light emitting device package according to an embodiment.

Referring to FIG. 7, the lighting device may include a cover 1100, a light source module 1200, a radiator 1400, a power supply unit 1600, an inner case 1700, and a socket 1800. In addition, the lighting device according to the embodiment may further include one or more of the member 1300 and the holder 1500.

The cover 1100 may have a shape of a bulb or a hemisphere, and may have a shape with a hollow and an open portion. The cover 1100 may be optically coupled to the light source module 1200. For example, the cover 1100 may diffuse, scatter, or excite light provided from the light source module 1200. The cover 1100 may be a kind of optical member. The cover 1100 may be coupled to the radiator 1400. The cover 1100 may have a coupling portion that is coupled to the radiator 1400.

A milky white paint may be coated on the inner surface of the cover 1100. The milky white paint may include a diffuser that diffuses light. The surface roughness of the inner surface of the cover 1100 may be larger than the surface roughness of the outer surface of the cover 1100. This is to sufficiently scatter and diffuse light from the light source module 1200 to emit it to the outside.

The material of the cover 1100 may be glass, plastic, polypropylene (PP), polyethylene (PE), polycarbonate (PC), or the like. Here, polycarbonate is excellent in light resistance, heat resistance, and strength. The cover 1100 may be transparent so that the light source module 1200 is visible from the outside, but is not limited thereto and may be opaque. The cover 1100 may be formed through blow molding.

The light source module 1200 may be disposed on one surface of the radiator 1400, and heat generated from the light source module 1200 may be conducted to the radiator 1400. The light source module 1200 may include a light source unit 1210, a connection plate 1230, and a connector 1250.

The light source unit 1210 may include any one of the embodiments 100 to 200.

The member 1300 may be disposed on the upper surface of the radiator 1400 and has a plurality of light source units 1210 and a guide groove 1310 into which the connector 1250 is inserted. The guide groove 1310 may correspond to or be aligned with the substrate and the connector 1250 of the light source unit 1210.

The surface of the member 1300 may be coated or coated with a light reflective material.

For example, the surface of the member 1300 may be coated or coated with a white paint. The member 1300 may reflect light reflected on the inner surface of the cover 1100 and returning toward the light source module 1200 back toward the cover 1100. Therefore, it is possible to improve the light efficiency of the lighting device according to the embodiment.

The member 1300 may be made of an insulating material, for example. The connection plate 1230 of the light source module 1200 may include an electrically conductive material. Accordingly, electrical contact may be made between the radiator 1400 and the connection plate 1230. The member 1300 may be formed of an insulating material to block an electrical short between the connection plate 1230 and the radiator 1400. The radiator 1400 may receive heat from the light source module 1200 and heat from the power supply unit 1600 to radiate heat.

The holder 1500 blocks the receiving groove 1719 of the insulating part 1710 of the inner case 1700. Accordingly, the power supply unit 1600 accommodated in the insulating unit 1710 of the inner case 1700 may be sealed. The holder 1500 may have a guide protrusion 1510, and the guide protrusion 1510 may have a hole through which the protrusion 1610 of the power supply unit 1600 passes.

The power supply unit 1600 processes or converts an electrical signal provided from the outside and provides it to the light source module 1200. The power supply unit 1600 may be accommodated in the storage groove 1919 of the inner case 1700, and may be sealed inside the inner case 1700 by the holder 1500. The power supply unit 1600 may include a protrusion 1610, a guide unit 1630, a base 1650, and an extension 1670.

The guide part 1630 may have a shape protruding from one side of the base 1650 to the outside. The guide part 1630 may be inserted into the holder 1500. A number of parts may be disposed on one surface of the base 1650. A number of components include, for example, a DC converter that converts AC power provided from an external power source into a DC power source, a driving chip that controls the driving of the light source module 1200, and an electrostatic device (ESD) for protecting the light source module 1200. discharge) protection element, etc., but is not limited thereto.

The extension part 1670 may have a shape protruding outward from the other side of the base 1650. The extension part 1670 may be inserted into the connection part 1750 of the inner case 1700 and may receive an electrical signal from the outside. For example, the extension part 1670 may be the same as or less than the width of the connection part 1750 of the inner case 1700. Each end of the "+ wire" and "- wire" may be electrically connected to the extension part 1670, and the other end of the "+ wire" and "- wire" may be electrically connected to the socket 1800. .

The inner case 1700 may include a molding unit together with a power supply unit 1600 therein. The molding portion is a portion in which the molding liquid is solidified, and allows the power supply unit 1600 to be fixed inside the inner case 1700.

8 illustrates a display device including a light emitting device package according to an exemplary embodiment.

Referring to FIG. 8, the display device 800 includes a bottom cover 810, a reflective plate 820 disposed on the bottom cover 810, light emitting modules 830 and 835 emitting light, and a reflecting plate 820. ) And an optical sheet including a light guide plate 840 disposed in front of the light guide plate 840 and guiding light emitted from the light emitting modules 830 and 835 to the front of the display device, and prism sheets 850 and 860 disposed in front of the light guide plate 840, A display panel 870 disposed in front of the optical sheet, an image signal output circuit 872 connected to the display panel 870 and supplying an image signal to the display panel 870, and disposed in front of the display panel 870 A color filter 880 may be included. Here, the bottom cover 810, the reflector 820, the light emitting modules 830 and 835, the light guide plate 840, and the optical sheet may form a backlight unit.

The light emitting module may include light emitting device packages 835 mounted on the substrate 830. Here, the substrate 830 may be a PCB or the like. The light emitting device package 835 may be any one of the above-described embodiments 100 and 200.

The bottom cover 810 may accommodate components in the display device 800. In addition, the reflective plate 820 may be provided as a separate component as shown in the drawing, and may be provided in a form coated with a material having high reflectivity on the rear surface of the light guide plate 840 or the front surface of the bottom cover 810. .

Here, the reflective plate 820 may be made of a material that has high reflectivity and is ultra-thin, and may be made of polyethylene terephtalate (PET).

Further, the light guide plate 830 may be formed of polymethylmethacrylate (PMMA), polycarbonate (PC), or polyethylene (PolyEthylene; PE).

In addition, the first prism sheet 850 may be formed of a light-transmitting and elastic polymer material on one surface of the support film, and the polymer may have a prism layer in which a plurality of three-dimensional structures are repeatedly formed. Here, the plurality of patterns may be repeatedly provided in a stripe type with floors and valleys as shown.

In addition, in the second prism sheet 860, the directions of the ridges and valleys on one surface of the support film may be perpendicular to the direction of the ridges and valleys on one surface of the support film in the first prism sheet 850. This is to evenly distribute the light transmitted from the light emitting module and the reflective sheet to the front surface of the display panel 1870.

Further, although not shown, a diffusion sheet may be disposed between the light guide plate 840 and the first prism sheet 850. The diffusion sheet may be made of polyester and polycarbonate-based materials, and the light projection angle may be maximized through refraction and scattering of light incident from the backlight unit. In addition, the diffusion sheet includes a support layer containing a light diffusing agent, a first layer and a second layer formed on the light exit surface (in the direction of the first prism sheet) and the light incident surface (in the direction of the reflection sheet) and do not contain a light diffusion agent. It may include.

In the embodiment, the diffusion sheet, the first prism sheet 850, and the second prism sheet 860 form an optical sheet, and the optical sheet is formed of a different combination, for example, a micro lens array, or a diffusion sheet and a micro lens array. Or a combination of a single prism sheet and a micro lens array.

The display panel 870 may include a liquid crystal display. In addition to the liquid crystal display panel 860, other types of display devices requiring a light source may be provided.

9 shows a head lamp 900 including a light emitting device package according to an embodiment. Referring to FIG. 9, the head lamp 900 includes a light emitting module 901, a reflector 902, a shade 903, and a lens 904.

The light emitting module 901 may include a plurality of light emitting device packages (not shown) disposed on a substrate (not shown). In this case, the light emitting device package may be any one of the above-described embodiments 100 and 200.

The reflector 902 reflects the light 911 irradiated from the light emitting module 901 in a predetermined direction, for example, forward 912.

The shade 903 is disposed between the reflector 902 and the lens 904, and is reflected by the reflector 902 to block or reflect a part of the light directed to the lens 904 to form a light distribution pattern desired by the designer. As an example, one side portion 903-1 and the other side portion 903-2 of the shade 903 may have different heights.

The light irradiated from the light emitting module 901 may be reflected by the reflector 902 and the shade 903 and then transmitted through the lens 904 to face the vehicle body. The lens 904 may refract light reflected by the reflector 902 forward.

Features, structures, effects, and the like described in the embodiments above are included in at least one embodiment of the present invention, and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, etc. illustrated in each embodiment may be combined or modified for other embodiments by a person having ordinary knowledge in the field to which the embodiments belong. Accordingly, contents related to such combinations and modifications should be construed as being included in the scope of the present invention.

110: package body 122, 124, 126: first lead frame
132,134,136: second lead frame 142,144: light-emitting element
150: coating layer 152,154: Zener diode
161 to 167: wires 170: molding part.

Claims (10)

A package body having a cavity consisting of side and bottom;
A first lead frame and a second lead frame disposed on the body to be spaced apart from each other and having an upper surface exposed by the cavity;
A light-emitting element disposed on the upper surface of the first lead frame exposed by the cavity;
A wire connecting the light emitting device and the second lead frame;
A first coating layer disposed on the side of the cavity and made of a white resin;
A second coating layer disposed on upper surfaces of the first and second lead frames exposed by the cavity, the bottom of the cavity, and upper and side surfaces of the light emitting device; And
And a molding part filled in the cavity and in contact with the first coating layer and the second coating layer,
The second coating layer is wrapped to seal the surface of the wire,
The package body is a light emitting device package made of black resin. The method of claim 1,
The package body includes a side wall surrounding the cavity,
The thickness of the first coating layer is thinner than the thickness of the sidewall of the package body,
The first coating layer has a thickness of 25 um to 100 um. delete The method of claim 1,
The package body is made of a carbon black mixed PPA (polyphtalamide) resin, black EMC (Epoxy Mold Compound) resin, or black silicon,
The first coating layer is a light emitting device package made of a PPA resin mixed with titanium oxide, a white EMC resin, or white silicon. delete delete delete delete The method of claim 1,
Each of the first coating layer and the second coating layer is a mixture of silicon and a diffusion agent,
The diffusion agent includes at least one of TiO ₂ , ZnO, CaCo ₃ , Al ₂ O ₃ , or BaSO ₄ ,
The light emitting device package in which the weight ratio of the diffusion agent to silicon of the first and second coating layers is 0.1 wt% to 10 wt%. The method of claim 1,
A Zener diode disposed on the upper surface of the second lead frame exposed by the cavity,
The second coating layer is a light emitting device package including portions disposed on top and side surfaces of the Zener diode.

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