KR20140147054A - Curable composition, cured film manufactured by using the curable composition and display device having the same - Google Patents
Curable composition, cured film manufactured by using the curable composition and display device having the same Download PDFInfo
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- KR20140147054A KR20140147054A KR20140074452A KR20140074452A KR20140147054A KR 20140147054 A KR20140147054 A KR 20140147054A KR 20140074452 A KR20140074452 A KR 20140074452A KR 20140074452 A KR20140074452 A KR 20140074452A KR 20140147054 A KR20140147054 A KR 20140147054A
- Authority
- KR
- South Korea
- Prior art keywords
- formula
- curable composition
- cured film
- independently
- carbon atoms
- Prior art date
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- 239000000203 mixture Substances 0.000 title claims abstract description 55
- 239000000126 substance Substances 0.000 claims abstract description 27
- 150000001875 compounds Chemical class 0.000 claims abstract description 26
- 239000011230 binding agent Substances 0.000 claims abstract description 17
- 239000011347 resin Substances 0.000 claims abstract description 17
- 229920005989 resin Polymers 0.000 claims abstract description 17
- 239000000178 monomer Substances 0.000 claims abstract description 9
- 125000004432 carbon atom Chemical group C* 0.000 claims description 20
- 125000000217 alkyl group Chemical group 0.000 claims description 13
- 239000004094 surface-active agent Substances 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 6
- 125000003545 alkoxy group Chemical group 0.000 claims description 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 5
- 238000002834 transmittance Methods 0.000 claims description 5
- 125000003118 aryl group Chemical group 0.000 claims description 4
- 239000007822 coupling agent Substances 0.000 claims description 4
- 239000003505 polymerization initiator Substances 0.000 claims description 4
- 238000012719 thermal polymerization Methods 0.000 claims description 4
- 229920001187 thermosetting polymer Polymers 0.000 claims description 4
- 239000010936 titanium Substances 0.000 claims description 4
- 239000002318 adhesion promoter Substances 0.000 claims description 3
- 125000002947 alkylene group Chemical group 0.000 claims description 3
- 239000000945 filler Substances 0.000 claims description 3
- 125000005843 halogen group Chemical group 0.000 claims description 3
- 239000004014 plasticizer Substances 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 claims description 2
- 239000010703 silicon Substances 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- 239000011342 resin composition Substances 0.000 claims 1
- 229910010272 inorganic material Inorganic materials 0.000 abstract description 4
- 150000002484 inorganic compounds Chemical class 0.000 abstract 1
- 150000002894 organic compounds Chemical class 0.000 abstract 1
- 239000010408 film Substances 0.000 description 35
- 239000004973 liquid crystal related substance Substances 0.000 description 7
- 239000002904 solvent Substances 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 4
- 238000001723 curing Methods 0.000 description 4
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 4
- 239000002270 dispersing agent Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- XLLIQLLCWZCATF-UHFFFAOYSA-N ethylene glycol monomethyl ether acetate Natural products COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 4
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- VXUYXOFXAQZZMF-UHFFFAOYSA-N titanium(IV) isopropoxide Chemical compound CC(C)O[Ti](OC(C)C)(OC(C)C)OC(C)C VXUYXOFXAQZZMF-UHFFFAOYSA-N 0.000 description 4
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- -1 silane compound Chemical class 0.000 description 3
- YXIWHUQXZSMYRE-UHFFFAOYSA-N 1,3-benzothiazole-2-thiol Chemical compound C1=CC=C2SC(S)=NC2=C1 YXIWHUQXZSMYRE-UHFFFAOYSA-N 0.000 description 2
- 229920001621 AMOLED Polymers 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 2
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- FFOPEPMHKILNIT-UHFFFAOYSA-N Isopropyl butyrate Chemical compound CCCC(=O)OC(C)C FFOPEPMHKILNIT-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- LXEKPEMOWBOYRF-UHFFFAOYSA-N [2-[(1-azaniumyl-1-imino-2-methylpropan-2-yl)diazenyl]-2-methylpropanimidoyl]azanium;dichloride Chemical compound Cl.Cl.NC(=N)C(C)(C)N=NC(C)(C)C(N)=N LXEKPEMOWBOYRF-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- XUPYJHCZDLZNFP-UHFFFAOYSA-N butyl butanoate Chemical compound CCCCOC(=O)CCC XUPYJHCZDLZNFP-UHFFFAOYSA-N 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- BGTOWKSIORTVQH-UHFFFAOYSA-N cyclopentanone Chemical compound O=C1CCCC1 BGTOWKSIORTVQH-UHFFFAOYSA-N 0.000 description 2
- OLLFKUHHDPMQFR-UHFFFAOYSA-N dihydroxy(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](O)(O)C1=CC=CC=C1 OLLFKUHHDPMQFR-UHFFFAOYSA-N 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- CATSNJVOTSVZJV-UHFFFAOYSA-N heptan-2-one Chemical compound CCCCCC(C)=O CATSNJVOTSVZJV-UHFFFAOYSA-N 0.000 description 2
- MLFHJEHSLIIPHL-UHFFFAOYSA-N isoamyl acetate Chemical compound CC(C)CCOC(C)=O MLFHJEHSLIIPHL-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000010943 off-gassing Methods 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- NAWXUBYGYWOOIX-SFHVURJKSA-N (2s)-2-[[4-[2-(2,4-diaminoquinazolin-6-yl)ethyl]benzoyl]amino]-4-methylidenepentanedioic acid Chemical compound C1=CC2=NC(N)=NC(N)=C2C=C1CCC1=CC=C(C(=O)N[C@@H](CC(=C)C(O)=O)C(O)=O)C=C1 NAWXUBYGYWOOIX-SFHVURJKSA-N 0.000 description 1
- MYWOJODOMFBVCB-UHFFFAOYSA-N 1,2,6-trimethylphenanthrene Chemical compound CC1=CC=C2C3=CC(C)=CC=C3C=CC2=C1C MYWOJODOMFBVCB-UHFFFAOYSA-N 0.000 description 1
- LZDKZFUFMNSQCJ-UHFFFAOYSA-N 1,2-diethoxyethane Chemical compound CCOCCOCC LZDKZFUFMNSQCJ-UHFFFAOYSA-N 0.000 description 1
- LEEANUDEDHYDTG-UHFFFAOYSA-N 1,2-dimethoxypropane Chemical compound COCC(C)OC LEEANUDEDHYDTG-UHFFFAOYSA-N 0.000 description 1
- YHMYGUUIMTVXNW-UHFFFAOYSA-N 1,3-dihydrobenzimidazole-2-thione Chemical compound C1=CC=C2NC(S)=NC2=C1 YHMYGUUIMTVXNW-UHFFFAOYSA-N 0.000 description 1
- HNAGHMKIPMKKBB-UHFFFAOYSA-N 1-benzylpyrrolidine-3-carboxamide Chemical compound C1C(C(=O)N)CCN1CC1=CC=CC=C1 HNAGHMKIPMKKBB-UHFFFAOYSA-N 0.000 description 1
- RRQYJINTUHWNHW-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxyethoxy)ethane Chemical compound CCOCCOCCOCC RRQYJINTUHWNHW-UHFFFAOYSA-N 0.000 description 1
- CNJRPYFBORAQAU-UHFFFAOYSA-N 1-ethoxy-2-(2-methoxyethoxy)ethane Chemical compound CCOCCOCCOC CNJRPYFBORAQAU-UHFFFAOYSA-N 0.000 description 1
- LIPRQQHINVWJCH-UHFFFAOYSA-N 1-ethoxypropan-2-yl acetate Chemical compound CCOCC(C)OC(C)=O LIPRQQHINVWJCH-UHFFFAOYSA-N 0.000 description 1
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 1
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 description 1
- HFZLSTDPRQSZCQ-UHFFFAOYSA-N 1-pyrrolidin-3-ylpyrrolidine Chemical compound C1CCCN1C1CNCC1 HFZLSTDPRQSZCQ-UHFFFAOYSA-N 0.000 description 1
- IMQFZQVZKBIPCQ-UHFFFAOYSA-N 2,2-bis(3-sulfanylpropanoyloxymethyl)butyl 3-sulfanylpropanoate Chemical compound SCCC(=O)OCC(CC)(COC(=O)CCS)COC(=O)CCS IMQFZQVZKBIPCQ-UHFFFAOYSA-N 0.000 description 1
- WDZGTNIUZZMDIA-UHFFFAOYSA-N 2-(hydroxymethyl)-2-methylpropane-1,3-diol 2-sulfanylacetic acid Chemical compound OC(=O)CS.OC(=O)CS.OC(=O)CS.OCC(C)(CO)CO WDZGTNIUZZMDIA-UHFFFAOYSA-N 0.000 description 1
- HQPZDTQSGNKMOM-UHFFFAOYSA-N 2-(hydroxymethyl)-2-methylpropane-1,3-diol;3-sulfanylpropanoic acid Chemical compound OC(=O)CCS.OC(=O)CCS.OC(=O)CCS.OCC(C)(CO)CO HQPZDTQSGNKMOM-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- DEDUBNVYPMOFDR-UHFFFAOYSA-N 2-ethoxypropan-1-ol Chemical compound CCOC(C)CO DEDUBNVYPMOFDR-UHFFFAOYSA-N 0.000 description 1
- FLFWJIBUZQARMD-UHFFFAOYSA-N 2-mercapto-1,3-benzoxazole Chemical compound C1=CC=C2OC(S)=NC2=C1 FLFWJIBUZQARMD-UHFFFAOYSA-N 0.000 description 1
- YTTFFPATQICAQN-UHFFFAOYSA-N 2-methoxypropan-1-ol Chemical compound COC(C)CO YTTFFPATQICAQN-UHFFFAOYSA-N 0.000 description 1
- QCAHUFWKIQLBNB-UHFFFAOYSA-N 3-(3-methoxypropoxy)propan-1-ol Chemical compound COCCCOCCCO QCAHUFWKIQLBNB-UHFFFAOYSA-N 0.000 description 1
- DKIDEFUBRARXTE-UHFFFAOYSA-M 3-mercaptopropionate Chemical compound [O-]C(=O)CCS DKIDEFUBRARXTE-UHFFFAOYSA-M 0.000 description 1
- JSGVZVOGOQILFM-UHFFFAOYSA-N 3-methoxy-1-butanol Chemical compound COC(C)CCO JSGVZVOGOQILFM-UHFFFAOYSA-N 0.000 description 1
- SWROZTPXWPQPMQ-UHFFFAOYSA-N C(C)(=O)OCCCC.C(C)OCCC(=O)OCC Chemical compound C(C)(=O)OCCCC.C(C)OCCC(=O)OCC SWROZTPXWPQPMQ-UHFFFAOYSA-N 0.000 description 1
- XXRCUYVCPSWGCC-UHFFFAOYSA-N Ethyl pyruvate Chemical compound CCOC(=O)C(C)=O XXRCUYVCPSWGCC-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- PWGOWIIEVDAYTC-UHFFFAOYSA-N ICR-170 Chemical compound Cl.Cl.C1=C(OC)C=C2C(NCCCN(CCCl)CC)=C(C=CC(Cl)=C3)C3=NC2=C1 PWGOWIIEVDAYTC-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- XQAVYBWWWZMURF-UHFFFAOYSA-N OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OCC(CO)(CO)CO Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OCC(CO)(CO)CO XQAVYBWWWZMURF-UHFFFAOYSA-N 0.000 description 1
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 1
- 239000007875 V-40 Substances 0.000 description 1
- AVTLBBWTUPQRAY-BUHFOSPRSA-N V-59 Substances CCC(C)(C#N)\N=N\C(C)(CC)C#N AVTLBBWTUPQRAY-BUHFOSPRSA-N 0.000 description 1
- 239000007877 V-601 Substances 0.000 description 1
- WYGWHHGCAGTUCH-ISLYRVAYSA-N V-65 Substances CC(C)CC(C)(C#N)\N=N\C(C)(C#N)CC(C)C WYGWHHGCAGTUCH-ISLYRVAYSA-N 0.000 description 1
- 239000007874 V-70 Substances 0.000 description 1
- OCCLJFJGIDIZKK-UHFFFAOYSA-N [2-(hydroxymethyl)-3-(3-sulfanylpropanoyloxy)-2-(3-sulfanylpropanoyloxymethyl)propyl] 3-sulfanylpropanoate Chemical compound SCCC(=O)OCC(CO)(COC(=O)CCS)COC(=O)CCS OCCLJFJGIDIZKK-UHFFFAOYSA-N 0.000 description 1
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 1
- HSZUHSXXAOWGQY-UHFFFAOYSA-N [2-methyl-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(C)(COC(=O)C=C)COC(=O)C=C HSZUHSXXAOWGQY-UHFFFAOYSA-N 0.000 description 1
- RUDUCNPHDIMQCY-UHFFFAOYSA-N [3-(2-sulfanylacetyl)oxy-2,2-bis[(2-sulfanylacetyl)oxymethyl]propyl] 2-sulfanylacetate Chemical compound SCC(=O)OCC(COC(=O)CS)(COC(=O)CS)COC(=O)CS RUDUCNPHDIMQCY-UHFFFAOYSA-N 0.000 description 1
- FCOXGXKAORLROD-UHFFFAOYSA-N [3-hydroxy-2,2-bis(hydroxymethyl)propyl] 3-sulfanylpropanoate Chemical compound OCC(CO)(CO)COC(=O)CCS FCOXGXKAORLROD-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- OBNCKNCVKJNDBV-UHFFFAOYSA-N butanoic acid ethyl ester Natural products CCCC(=O)OCC OBNCKNCVKJNDBV-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229940019778 diethylene glycol diethyl ether Drugs 0.000 description 1
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- BHXIWUJLHYHGSJ-UHFFFAOYSA-N ethyl 3-ethoxypropanoate Chemical compound CCOCCC(=O)OCC BHXIWUJLHYHGSJ-UHFFFAOYSA-N 0.000 description 1
- IJUHLFUALMUWOM-UHFFFAOYSA-N ethyl 3-methoxypropanoate Chemical compound CCOC(=O)CCOC IJUHLFUALMUWOM-UHFFFAOYSA-N 0.000 description 1
- 229940117360 ethyl pyruvate Drugs 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 239000000976 ink Substances 0.000 description 1
- GJRQTCIYDGXPES-UHFFFAOYSA-N iso-butyl acetate Natural products CC(C)COC(C)=O GJRQTCIYDGXPES-UHFFFAOYSA-N 0.000 description 1
- 229940117955 isoamyl acetate Drugs 0.000 description 1
- FGKJLKRYENPLQH-UHFFFAOYSA-M isocaproate Chemical compound CC(C)CCC([O-])=O FGKJLKRYENPLQH-UHFFFAOYSA-M 0.000 description 1
- OQAGVSWESNCJJT-UHFFFAOYSA-N isovaleric acid methyl ester Natural products COC(=O)CC(C)C OQAGVSWESNCJJT-UHFFFAOYSA-N 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- HSDFKDZBJMDHFF-UHFFFAOYSA-N methyl 3-ethoxypropanoate Chemical compound CCOCCC(=O)OC HSDFKDZBJMDHFF-UHFFFAOYSA-N 0.000 description 1
- SYWIXHZXHQDFOO-UHFFFAOYSA-N methyl n-phenyliminocarbamate Chemical compound COC(=O)N=NC1=CC=CC=C1 SYWIXHZXHQDFOO-UHFFFAOYSA-N 0.000 description 1
- YKYONYBAUNKHLG-UHFFFAOYSA-N n-Propyl acetate Natural products CCCOC(C)=O YKYONYBAUNKHLG-UHFFFAOYSA-N 0.000 description 1
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 229940090181 propyl acetate Drugs 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 239000012925 reference material Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
- 150000003609 titanium compounds Chemical class 0.000 description 1
- 229940096522 trimethylolpropane triacrylate Drugs 0.000 description 1
- 238000000870 ultraviolet spectroscopy Methods 0.000 description 1
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F230/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal
- C08F230/04—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal
- C08F230/08—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal containing silicon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F230/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal
- C08F230/04—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Electroluminescent Light Sources (AREA)
- Optical Filters (AREA)
Abstract
Description
본 명세서는 경화성 조성물, 이로 제조된 경화막 및 이를 포함하는 디스플레이 장치에 관한 것이다.TECHNICAL FIELD The present invention relates to a curable composition, a cured film produced thereby, and a display device including the same.
최근 디스플레이 시장에서 가장 큰 비중을 차지하고 있는 액정표시장치(LCD) 및 발광다이오드(LED)의 백라이트유닛(BLU)을 이용한 액정표시장치(LCD)에 이어 유기발광소자(OLED)를 이용한 디스플레이에 대한 관심이 점점 커지고 있다. 통상 유기발광소자(OLED)는 박막으로 제조할 수 있을 뿐만 아니라 향상된 색 특성을 얻을 수 있고 응답 속도가 액정 구동을 이용하는 액정표시장치(LCD)보다 현저히 빠르기 때문에 3차원 텔레비전(3D TV) 제품에는 더 적합하다는 장점을 가지고 있다.Liquid crystal displays (LCDs) using backlight units (BLU) of liquid crystal displays (LCDs) and light emitting diodes (LEDs), which occupy the largest portion in the display market in recent years, Is getting bigger. In general, organic light emitting devices (OLEDs) can be manufactured not only in thin films but also in improved color characteristics, and the response speed is significantly faster than that of a liquid crystal display (LCD) using liquid crystal driving. It has the advantage of being suitable.
현재 소형 모바일 시장에서는 이미 능동형 유기발광소자(AMOLED, Active matrix organic light emitting diodes) 제품이 상용화되어 출시되고 있고, 대형 TV에 대해서도 다양한 방식과 기술이 시도되고 있다. 이 중에서도 백색 유기발광소자 (WOLED)는 유기발광소자(OLED)를 이용하는 대형 디스플레이 제품에 좀 더 용이하게 적용할 수 있는 기술로 각 화소별로 컬러를 구현하기 위해서는 별도의 칼라 필터 층을 필요로 하게 된다.In the small mobile market, active matrix organic light emitting diodes (AMOLED) and commercial matrix organic light emitting diodes (OLED) have already been commercialized. Various methods and technologies have been tried for large TVs. Among them, the white organic light emitting diode (WOLED) is a technique that can be more easily applied to a large display product using an organic light emitting diode (OLED), and a separate color filter layer is required in order to implement color for each pixel .
반면, 유기발광소자(OLED)는 미세한 양의 유기물 성분이나 수분에 의해 쉽게 열화되어 수명이 단축될 가능성이 있다. 이 때문에, 칼라 필터를 형성하는데 사용되는 재료들 중에서 방출가스(out-gassing)를 방출하는 재료가 많으면, OLED 소자의 기능에 안 좋은 영향을 끼칠 수 있다.On the other hand, the organic light emitting diode (OLED) is easily deteriorated by a minute amount of an organic matter component or moisture, and the lifetime may be shortened. For this reason, if there are many materials that emit out-gassing among the materials used for forming the color filter, it may have a bad influence on the function of the OLED element.
본 명세서는 경화성 조성물, 이로 제조된 경화막 및 이를 포함하는 디스플레이 장치를 제공하고자 한다.The present invention is intended to provide a curable composition, a cured film made therefrom, and a display device including the same.
본 명세서는 하기 화학식 1로 표시되는 1 이상의 화합물 및 하기 화학식 2로 표시되는 1 이상의 화합물을 포함하는 단량체 혼합물을 이용하여 제조된 바인더 수지를 포함하는 경화성 조성물을 제공한다. The present invention provides a curable composition comprising a binder resin prepared by using a monomer mixture comprising at least one compound represented by the following formula (1) and at least one compound represented by the following formula (2).
[화학식 1][Chemical Formula 1]
[화학식 2](2)
상기 화학식 1 및 2에서, In the above Formulas 1 and 2,
R1 및 Y1은 각각 독립적으로 히드록시기, 선형 또는 가지형 알콕시 또는 할로겐기이고, R1 and Y1 are each independently a hydroxyl group, a linear or branched alkoxy or halogen group,
R2 및 Y2는 각각 독립적으로 H, 탄소수 6 내지 12의 아릴기 또는 탄소수 1 내지 10의 알킬기이며, R2 and Y2 are each independently H, an aryl group having 6 to 12 carbon atoms or an alkyl group having 1 to 10 carbon atoms,
R3 및 Y3는 각각 독립적으로 탄소수 1 내지 10의 알킬렌기이고,R3 and Y3 each independently represent an alkylene group having 1 to 10 carbon atoms,
R4, R5, R6, Y4, Y5 및 Y6는 각각 독립적으로 H 또는 탄소수 1 내지 10의 알킬기이며,R4, R5, R6, Y4, Y5 and Y6 are each independently H or an alkyl group having 1 to 10 carbon atoms,
l 및 o는 각각 독립적으로 2 내지 4의 정수이고, l and o are each independently an integer of 2 to 4,
m, n, p 및 q는 각각 독립적으로 0 내지 2의 정수이며, m, n, p and q are each independently an integer of 0 to 2,
l+m+n=4, o+p+q= 2 내지 4이다.l + m + n = 4, o + p + q = 2 to 4.
본 명세서는 상기 경화성 조성물로 제조된 경화막을 제공한다. The present disclosure provides a cured film made from the curable composition.
본 명세서는 상기 경화막을 포함하는 디스플레이 장치를 제공한다. The present specification provides a display device including the cured film.
본 명세서는 유기-무기 화합물을 바인더 수지로 사용하여 제조된 경화막으로부터 배출되는 가스의 양이 줄어드는 효과가 있다.The present specification has the effect of reducing the amount of gas discharged from a cured film produced by using an organic-inorganic compound as a binder resin.
이하에서 본 명세서에 대하여 상세히 설명한다.Hereinafter, the present invention will be described in detail.
본 명세서는 유기-무기 화합물로 제조된 바인더 수지를 포함하는 경화성 조성물을 제공한다.The present disclosure provides a curable composition comprising a binder resin made from an organic-inorganic compound.
본 명세서는 1 이상의 실란화합물과 1 이상의 티타늄화합물로 제조된 바인더 수지를 포함하는 경화성 조성물을 제공한다. The present disclosure provides a curable composition comprising a binder resin made of at least one silane compound and at least one titanium compound.
본 명세서는 하기 화학식 1로 표시되는 1 이상의 화합물 및 하기 화학식 2로 표시되는 1 이상의 화합물로 제조된 바인더 수지를 포함하는 경화성 조성물을 제공한다. The present invention provides a curable composition comprising at least one compound represented by the following formula (1) and at least one compound represented by the following formula (2).
[화학식 1][Chemical Formula 1]
[화학식 2](2)
상기 화학식 1 및 2에서, In the above Formulas 1 and 2,
R1 및 Y1은 각각 독립적으로 히드록시기, 선형 또는 가지형 알콕시 또는 할로겐기이고, R1 and Y1 are each independently a hydroxyl group, a linear or branched alkoxy or halogen group,
R2 및 Y2는 각각 독립적으로 H, 탄소수 6 내지 12의 아릴기 또는 탄소수 1 내지 10의 알킬기이며, R2 and Y2 are each independently H, an aryl group having 6 to 12 carbon atoms or an alkyl group having 1 to 10 carbon atoms,
R3 및 Y3는 각각 독립적으로 탄소수 1 내지 10의 알킬렌기이고,R3 and Y3 each independently represent an alkylene group having 1 to 10 carbon atoms,
R4, R5, R6, Y4, Y5 및 Y6는 각각 독립적으로 H 또는 탄소수 1 내지 10의 알킬기이며,R4, R5, R6, Y4, Y5 and Y6 are each independently H or an alkyl group having 1 to 10 carbon atoms,
l 및 o는 각각 독립적으로 2 내지 4의 정수이고, l and o are each independently an integer of 2 to 4,
m, n, p 및 q는 각각 독립적으로 0 내지 2의 정수이며, m, n, p and q are each independently an integer of 0 to 2,
l+m+n=4, o+p+q= 2 내지 4이다.l + m + n = 4, o + p + q = 2 to 4.
본 명세서는 R1 및 Y1은 각각 독립적으로 히드록시기 또는 선형 또는 가지형 알콕시일 수 있다. In the present specification, R1 and Y1 each independently may be a hydroxy group or a linear or branched alkoxy.
본 명세서는 n은 1 내지 2의 정수이고 m은 0이거나 m은 1 내지 2의 정수이고 n은 0이며, Wherein n is an integer from 1 to 2 and m is 0, m is an integer from 1 to 2, n is 0,
l은 2 내지 4의 정수일 수 있다. and l may be an integer of 2 to 4.
본 명세서는 o가 4일 수 있다. In the present specification, o may be four.
본 명세서에서, 상기 화학식 1로 표시되는 화합물은 하기 화학식 3 또는 4로 표시될 수 있다. In the present specification, the compound represented by the formula (1) may be represented by the following formula (3) or (4).
[화학식 3](3)
[화학식 4][Chemical Formula 4]
상기 화학식 3 및 4에서, R1, R2, R3, R4, R5, R6, l, m 및 n는 화학식 1의 정의와 같다.R1, R2, R3, R4, R5, R6, l, m and n are as defined in the formula (1).
본 명세서에서, 상기 화학식 1로 표시되는 화합물은 하기 화학식 5 또는 6으로 표시될 수 있다.In the present specification, the compound represented by the formula (1) may be represented by the following formula (5) or (6).
[화학식 5][Chemical Formula 5]
[화학식 6][Chemical Formula 6]
상기 화학식 5 및 6에서, R2, R3, R4, R5, R6, l, m 및 n는 화학식 1의 정의와 같으며, R은 탄소수 1 내지 10의 선형 또는 가지형 알킬기이다.In the general formulas (5) and (6), R2, R3, R4, R5, R6, l, m and n are as defined in formula (1), and R is a linear or branched alkyl group having 1 to 10 carbon atoms.
본 명세서에서, 상기 화학식 1로 표시되는 화합물은 하기 화학식 7로 표시될 수 있다.In the present specification, the compound represented by the formula (1) may be represented by the following formula (7).
[화학식 7](7)
상기 화학식 7에서, R3, R4, R5 및 R6는 화학식 1의 정의와 같으며, R은 탄소수 1 내지 10의 선형 또는 가지형 알킬기이다.In the above formula (7), R3, R4, R5 and R6 are as defined in the formula (1), and R is a linear or branched alkyl group having 1 to 10 carbon atoms.
본 명세서에서, 상기 화학식 1로 표시되는 화합물은 하기 화학식 8 또는 9로 표시될 수 있다.In the present specification, the compound represented by the formula (1) may be represented by the following formula (8) or (9).
[화학식 8][Chemical Formula 8]
[화학식 9][Chemical Formula 9]
상기 화학식 8 및 9에서, R2, R3, R4, R5, R6, l 및 n는 화학식 1의 정의와 같다.R 2, R 3, R 4, R 5, R 6, l and n in the general formulas (8) and (9)
본 명세서에서, 상기 화학식 1로 표시되는 화합물은 하기 화학식 10 또는 11로 표시될 수 있다.In the present specification, the compound represented by the formula (1) may be represented by the following formula (10) or (11).
[화학식 10][Chemical formula 10]
[화학식 11](11)
상기 화학식 10 및 11에서, R3 및 R4는 화학식 1의 정의와 같으며, R은 탄소수 1 내지 10의 알킬기이고, R7은 탄소수 6 내지 12의 아릴기이다.In the general formulas (10) and (11), R 3 and R 4 are as defined in the formula (1), R is an alkyl group having 1 to 10 carbon atoms, and R 7 is an aryl group having 6 to 12 carbon atoms.
본 명세서에서, 상기 화학식 1로 표시되는 화합물은 하기 화학식 12 또는 13로 표시될 수 있다.In the present specification, the compound represented by the formula (1) may be represented by the following formula (12) or (13).
[화학식 12][Chemical Formula 12]
[화학식 13][Chemical Formula 13]
상기 화학식 12에서, R3 및 R4는 화학식 1의 정의와 같다.In the above formula (12), R 3 and R 4 are as defined in formula (1).
본 명세서에서, 상기 화학식 2로 표시되는 화합물은 하기 화학식 14로 표시될 수 있다. In the present specification, the compound represented by Formula 2 may be represented by Formula 14 below.
[화학식 14][Chemical Formula 14]
상기 화학식 14에서, Y1, Y2, o 및 p는 화학식 2의 정의와 같다.Y1, Y2, o and p are as defined in the formula (2).
본 명세서에서, 상기 화학식 2로 표시되는 화합물은 하기 화학식 15로 표시될 수 있다. In the present specification, the compound represented by the formula (2) may be represented by the following formula (15).
[화학식 15][Chemical Formula 15]
상기 화학식 15에서, Y2, o 및 p는 화학식 2의 정의와 같으며, R은 탄소수 1 내지 10의 선형 또는 가지형 알킬기이다.Y2, o and p are as defined in the formula (2), and R is a linear or branched alkyl group having 1 to 10 carbon atoms.
본 명세서에서, 상기 화학식 2로 표시되는 화합물은 하기 화학식 16으로 표시될 수 있다. In the present specification, the compound represented by the formula (2) may be represented by the following formula (16).
[화학식 16][Chemical Formula 16]
상기 화학식 16에서, R은 탄소수 1 내지 10의 선형 또는 가지형 알킬기이다.In Formula 16, R is a linear or branched alkyl group having 1 to 10 carbon atoms.
본 명세서에서, 상기 화학식 2로 표시되는 화합물은 하기 화학식 17로 표시될 수 있다.In the present specification, the compound represented by the formula (2) may be represented by the following formula (17).
[화학식 17][Chemical Formula 17]
본 명세서의 일 실시상태에 따르면, 상기 바인더 수지 내에서 화학식 1로 표시되는 1 이상의 화합물과 화학식 2로 표시되는 1 이상의 화합물의 몰비가 5:1 내지 1:5일 수 있다. According to one embodiment of the present invention, the molar ratio of the at least one compound represented by the formula (1) to the at least one compound represented by the formula (2) in the binder resin may be 5: 1 to 1: 5.
본 명세서의 일 실시상태에 따르면, 상기 바인더 수지 내에서 티타늄(Ti)과 실리콘(Si)의 몰비가 5:1 내지 1:5일 수 있다. According to one embodiment of the present invention, the molar ratio of titanium (Ti) to silicon (Si) in the binder resin may be 5: 1 to 1: 5.
본 명세서의 일 실시상태에 따르면, 상기 바인더 수지의 중량평균분자량은 1000 이상 10000 이하일 수 있다. According to one embodiment of the present invention, the weight average molecular weight of the binder resin may be 1000 or more and 10,000 or less.
본 명세서의 일 실시상태에 따르면, 상기 바인더 수지의 산가는 0 KOH mg/g 이상 100 KOH mg/g 이하일 수 있다. According to one embodiment of the present invention, the acid value of the binder resin may be 0 KOH mg / g or more and 100 KOH mg / g or less.
본 명세서의 일 실시상태에 따르면, 상기 경화성 조성물 총 중량을 기준으로 바인더 수지의 함량은 2 중량% 이상 50 중량% 이하일 수 있다. 이 경우 이를 사용하여 제조된 경화막으로부터 배출되는 가스의 양이 줄어드는 효과가 있다.According to one embodiment of the present invention, the content of the binder resin may be 2 wt% or more and 50 wt% or less based on the total weight of the curable composition. In this case, there is an effect that the amount of gas discharged from the cured film manufactured using the same is reduced.
본 명세서에서, 에틸렌성 불포화 이중결합을 갖는 다관능성 모노머, 열중합 개시제, 계면활성제, 경화촉진제, 가소제, 접착 촉진제, 충전제, 커플링제, 분산제 및 용매 중 어느 하나 이상을 더 포함할 수 있다. In the present specification, it may further include at least one of a polyfunctional monomer having an ethylenically unsaturated double bond, a thermal polymerization initiator, a surfactant, a curing accelerator, a plasticizer, an adhesion promoter, a filler, a coupling agent, a dispersant and a solvent.
상기 에틸렌성 불포화 이중결합을 갖는 다관능성 모노머는 트리메틸올 에탄 트리 아크릴레이트, 트리메틸올 프로판 트리아크릴레이트, 네오펜틸글리콜(메타)아크릴레이트, 펜타에리트리톨 테트라 아크릴레이트, 펜타에리트리톨 트리 아크릴레이트, 디펜타에리트리톨 펜타 아크릴레이트 등을 사용할 수 있으며, 그 외에 사용가능한 다관능성 모노머로는 비스페놀 A 유도체의 에폭시아크릴레이트, 노볼락-에폭시아크릴레이트, 우레탄계의 다관능성 아크릴레이트로 U-324A, U15HA 또는 U-4HA 등을 사용할 수 있다. 상기 에틸렌성 불포화 이중결합을 가지는 다관능성 모노머는 단독 또는 2 종 이상을 혼합하여 사용할 수도 있다.The multifunctional monomer having an ethylenically unsaturated double bond may be selected from the group consisting of trimethylol ethane triacrylate, trimethylol propane triacrylate, neopentyl glycol (meth) acrylate, pentaerythritol tetraacrylate, pentaerythritol triacrylate, di Pentaerythritol pentaacrylate, and the like. Other multifunctional monomers that can be used include epoxy acrylates of bisphenol A derivatives, novolac-epoxy acrylates, and urethane-based polyfunctional acrylates such as U-324A, U15HA, or U -4HA and the like can be used. The multifunctional monomers having an ethylenically unsaturated double bond may be used singly or in combination of two or more.
상기 열중합 개시제는 아조계 화합물인 Wako Pure chemical Industris. Ltd.의 아조 니트릴계인 V-60, V-65, V-59, V-70, V-40; 아조 에스터계인 V-601; 아조 아미드계인 VA-086, VA-085, VA-080, Vam-110, Vam-111, VF-096; 아조 아미딘계인 V-50, VA-044, VA-046B, Aam-027, VA-060, VA-057, VA-061; 및 매크로아조계 개시제인 VPS-0501, VPS-1001, VPE-0201, VPE-0401, VPE-0601, VPTG-0301 등을 추가로 사용할 수 있으나, 이에만 한정되는 것은 아니다.The thermal polymerization initiator may be an azo-based compound such as Wako Pure Chemical Industris. V-60, V-65, V-59, V-70, and V-40, which are azonitrile compounds, Azoester type V-601; VA-086, VA-085, VA-080, Vam-110, Vam-111, VF-096; V-50, VA-044, VA-046B, Aam-027, VA-060, VA-057, VA-061; And VPS-0501, VPS-1001, VPE-0201, VPE-0401, VPE-0601 and VPTG-0301 which are macroadjugging initiators may be further used.
상기 계면활성제는 실리콘계 계면활성제 또는 플루오린계 계면활성제를 사용할 수 있다. 구체적으로, 실리콘계 계면활성제는 BYK-Chemie 사의 BYK-077, BYK-085, BYK-300, BYK-301, BYK-302, BYK-306, BYK-307, BYK-310, BYK-320, BYK-322, BYK-323, BYK-325, BYK-330, BYK-331, BYK-333, BYK-335, BYK-341v344, BYK-345v346, BYK-348, BYK-354, BYK-355, BYK-356, BYK-358, BYK-361, BYK-370, BYK-371, BYK-375, BYK-380 또는 BYK-390 등을 사용할 수 있으며, 플루오린계 계면활성제로는 DIC(DaiNippon Ink & Chemicals) 사의 F-114, F-177, F-410, F-411, F-450, F-493, F-494, F-443, F-444, F-445, F-446, F-470, F-471, F-472SF, F-474, F-475, F-477, F-478, F-479, F-480SF, F-482, F-483, F-484, F-486, F-487, F-172D, MCF-350SF, TF-1025SF, TF-1117SF, TF-1026SF, TF-1128, TF-1127, TF-1129, TF-1126, TF-1130, TF-1116SF, TF-1131, TF1132, TF1027SF, TF-1441 또는 TF-1442 등을 사용할 수 있으나, 이에만 한정되는 것은 아니다.The surfactant may be a silicone surfactant or a fluorine surfactant. Specifically, the silicone surfactant is BYK-077, BYK-085, BYK-300, BYK-301, BYK-302, BYK-306, BYK-307, BYK-310, BYK- , BYK-323, BYK-325, BYK-330, BYK-331, BYK-333, BYK-335, BYK-341v344, BYK-345v346, BYK-348, BYK-354, BYK-355, BYK-370, BYK-371, BYK-370, BYK-380 and BYK-390 may be used. Examples of the fluorine surfactant include DIC (Dai Nippon Ink & Chemicals) F-177, F-410, F-411, F-450, F-493, F-494, F-443, F-444, F- F-474, F-477, F-478, F-479, F-480SF, F-482, F-483, F- MCF-350SF, TF-1025SF, TF-1117SF, TF-1026SF, TF-1128, TF-1127, TF-1129, TF- 1126, TF- 1441 or TF-1442 may be used, but the present invention is not limited thereto.
상기 경화촉진제로는, 예컨대 F-475 (DaiNippon Ink & Chemicals), 2-머캡토벤조이미다졸, 2-머캡토벤조티아졸, 2-머캡토벤조옥사졸, 2,5-디머캡토-1,3,4-티아디아졸, 2-머캡토-4,6-디메틸아미노피리딘, 펜타에리스리톨 테트라키스(3-머캡토프로피오네이트), 펜타에리스리톨 트리스(3-머캡토프로피오네이트), 펜타에리스리톨 테트라키스(2-머캡토아세테이트), 펜타에리스리톨 트리스(2-머캡토아세테이트), 트리메틸올프로판 트리스(2-머캡토아세테이트), 트리메틸올프로판 트리스(3-머캡토프로피오네이트), 트리메틸올에탄 트리스(2-머캡토아세테이트), 및 트리메틸올에탄 트리스(3-머캡토프로피오네이트)로 이루어진 군으로부터 선택된 1 종 이상을 포함할 수 있다. Examples of the curing accelerator include F-475 (Dai Nippon Ink & Chemicals), 2-mercaptobenzimidazole, 2-mercaptobenzothiazole, 2- mercaptobenzoxazole, (3-mercaptopropionate), pentaerythritol tris (3-mercaptopropionate), pentaerythritol (3-mercaptopropionate), pentaerythritol tetrakis (2-mercaptoacetate), trimethylolpropane tris (2-mercaptoacetate), trimethylolpropane tris (3-mercaptopropionate), trimethylolethane Tris (2-mercaptoacetate), and trimethylolethane tris (3-mercaptopropionate).
상기 커플링제로 3-메타아크릴옥시프로필트리메톡시실란 등일 수 있으며, 상기 분산제로 폴리에스테르계 분산제 등일 수 있으나, 이에만 한정되는 것은 아니다.The coupling agent may be 3-methacryloxypropyltrimethoxysilane, and the dispersing agent may be a polyester dispersing agent or the like, but is not limited thereto.
상기 용매는 프로필렌글리콜 모노메틸 에테르, 에틸렌글리콜 모노메틸 에테르 아세테이트, 프로필렌글리콜 모노메틸 에테르 아세테이트, 프로필렌글리콜 모노에틸 에테르 아세테이트, 디에틸렌글리콜 디메틸 에테르, 시클로헥사논, 2-헵타논, 3-헵타논, 2-히드록시에틸프로피오네이트, 3-메틸-3-메톡시부틸프로피오네이트, 에틸-3-메톡시프로피오네이트, 메틸-3-에톡시프로피오네이트, 에틸-3-에톡시프로피오네이트, 부틸아세테이트, 아밀퍼메이트, 이소아밀아세테이트, 이소부틸아세테이트, 부틸프로피오네이트, 이소프로필부티레이트, 에틸부티레이트, 부틸부티레이트, 에틸피루베이트, γ-부티롤아세테이트, 메틸 에틸 케톤, 메틸셀로솔브, 에틸셀로솔브, 에틸렌글리콜 디메틸 에테르, 에틸렌글리콜 디에틸 에테르, 프로필렌글리콜 디메틸 에테르, 프로필렌글리콜 디에틸 에테르, 디에틸렌글리콜 디에틸에테르, 디에틸렌글리콜 메틸 에틸 에테르, 2-에톡시 프로판올, 2-메톡시 프로판올, 3-메톡시 부탄올, 시클로헥사논, 시클로펜타논, 3-메톡시부틸 아세테이트, 에틸 3-에톡시프로피오네이트, 에틸 셀로솔브아세테이트, 메틸 셀로솔브아세테이트, 부틸 아세테이트, 에틸 아세테이트, 프로필 아세테이트 또는 디프로필렌글리콜 모노메틸 에테르 등으로 이루어진 그룹으로부터 선택될 수 있으나, 이에만 한정되는 것은 아니다.The solvent is selected from the group consisting of propylene glycol monomethyl ether, ethylene glycol monomethyl ether acetate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, diethylene glycol dimethyl ether, cyclohexanone, 2-heptanone, 3- 3-methoxypropionate, ethyl-3-methoxypropionate, methyl-3-ethoxypropionate, ethyl-3-ethoxypropionate Butyl acetate, butyl acetate, butyl acetate, amyl perate, isoamyl acetate, isobutyl acetate, butyl propionate, isopropyl butyrate, ethyl butyrate, butyl butyrate, ethyl pyruvate, , Ethyl cellosolve, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, propylene glycol dimethyl ether, Diethylene glycol diethyl ether, diethylene glycol methyl ethyl ether, 2-ethoxypropanol, 2-methoxypropanol, 3-methoxybutanol, cyclohexanone, cyclopentanone, 3-methoxy But are not limited to, butyl acetate, ethyl 3-ethoxypropionate, ethyl cellosolve acetate, methyl cellosolve acetate, butyl acetate, ethyl acetate, propyl acetate or dipropylene glycol monomethyl ether, It is not.
상기 에틸렌성 불포화 이중결합을 갖는 다관능성 모노머, 열중합 개시제, 계면활성제, 경화촉진제, 가소제, 접착 촉진제, 충전제, 커플링제, 분산제 또는 용매는 당 기술분야에 일반적으로 알려져 있는 것들을 사용할 수 있다.As the polyfunctional monomer having an ethylenically unsaturated double bond, a thermal polymerization initiator, a surfactant, a curing accelerator, a plasticizer, an adhesion promoter, a filler, a coupling agent, a dispersant or a solvent, those generally known in the art can be used.
본 명세서의 일 실시상태에 따르면, 상기 경화성 조성물은 계면활성제 및 용매를 포함할 수 있다. According to one embodiment of the present disclosure, the curable composition may comprise a surfactant and a solvent.
본 명세서의 일 실시상태에 따르면, 상기 경화성 조성물 총 중량을 기준으로 계면활성제의 함량은 0.01 중량% 이상 10 중량% 이하일 수 있다.According to one embodiment of the present invention, the content of the surfactant may be 0.01 wt% or more and 10 wt% or less based on the total weight of the curable composition.
본 명세서의 일 실시상태에 따르면, 상기 경화성 조성물 총 중량을 기준으로 용매의 함량은 40 중량% 이상 90 중량% 이하일 수 있다.According to one embodiment of the present invention, the content of the solvent may be 40 wt% or more and 90 wt% or less based on the total weight of the curable composition.
본 명세서는 상기 경화성 조성물로 제조된 경화막을 제공한다. The present disclosure provides a cured film made from the curable composition.
본 명세서에 따른 경화성 조성물은 롤 코터(roll coater), 커튼 코터(curtain coater), 스핀 코터(spin coater), 슬롯 다이 코터, 각종 인쇄, 침적 등의 방법을 통해, 금속, 종이, 유리 플라스틱 기판 등의 지지체 상에 적용될 수 있다. The curable composition according to the present invention may be applied to a substrate such as a metal, a paper, a glass plastic substrate or the like through a roll coater, a curtain coater, a spin coater, a slot die coater, Lt; / RTI > support.
본 명세서의 일 실시상태에 따른 상기 경화성 조성물은 필름 등의 지지체 상에 도포한 후 기타 지지체 상에 전사하여 경화막을 제조할 수 있다. 또한, 상기 경화성 조성물을 제 1의 지지체에 도포한 후 블랭킷 등에 전사하고, 다시 제 2의 지지체에 전사하는 것도 가능하며, 그 적용 방법은 특별히 한정되지 않는다.The curable composition according to one embodiment of the present invention may be applied onto a support such as a film and then transferred onto another support to prepare a cured film. It is also possible to apply the curable composition to a first support, transfer it to a blanket or the like, and transfer it to a second support again, and the application method is not particularly limited.
이때, 상기 경화성 조성물은 광경화성 조성물 또는 열경화성 조성물일 수 있다. 본 명세서에 따른 경화성 조성물은 열경화성 조성물이 바람직하다. At this time, the curable composition may be a photo-curing composition or a thermosetting composition. The curable composition according to the present invention is preferably a thermosetting composition.
본 명세서의 일 실시상태에 따르면, 상기 경화막을 제조하기 위하여, 상기 경화성 조성물을 80 ℃ 이상 100℃ 이하에서 1분 내지 2분 동안 전열처리(pre-baked)한 후 200 ℃ 이상 250 ℃ 이하에서 5분 내지 60분 동안 방치하여 후열처리(post-baked)할 수 있다. According to one embodiment of the present invention, in order to produce the cured film, the curable composition is pre-baked at 80 ° C or more and 100 ° C or less for 1 minute to 2 minutes, Min to 60 minutes to post-baked.
또한, 경우에 따라 동일한 효과를 얻기 위해 적외선 램프 등을 사용할 수도 있으며 특별히 이러한 방법에 국한되지 않는다.In some cases, an infrared lamp or the like may be used to obtain the same effect, and the present invention is not limited thereto.
본 명세서의 일 실시상태에 따르면, 상기 경화성 조성물로 제조된 경화막은 디스플레이용일 수 있다.According to one embodiment of the present disclosure, the cured film made of the curable composition may be for display.
본 명세서의 상기 경화성 조성물은 유리 또는 필름을 기재로 하는 터치 패널의 투명 보호막에 사용할 수 있다. 구체적으로 터치 센서의 보호막(protecting layer)으로서 상기 경화막이 사용될 수 있다. The curable composition of the present invention can be used for a transparent protective film of a touch panel made of glass or a film. Specifically, the cured film may be used as a protective layer of a touch sensor.
또한, 박막 트랜지스터 액정 표시 장치 컬러필터 제조에 사용되는 투명 또는 착색층의 박막재료나 일반적인 경화성 도료나 잉크, 접착제, 인쇄판, 인쇄배선반용 열경화제 등에 사용될 수 있으며 그 용도에 제한을 특별히 두지는 않는다.In addition, it can be used as a transparent or colored layer thin film material used for manufacturing a thin film transistor liquid crystal display device color filter, general curable paint, ink, adhesive, printing plate, thermal curing agent for printed wiring board and the like.
본 명세서는 유기-무기 화합물을 바인더 수지로 사용하여 제조된 경화막으로부터 배출되는 가스의 양이 줄어드는 효과가 있다.The present specification has the effect of reducing the amount of gas discharged from a cured film produced by using an organic-inorganic compound as a binder resin.
본 명세서는 상기 경화막을 포함하는 보호막을 제공한다. 구체적으로, 상기 보호막은 투명 보호막일 수 있다. The present invention provides a protective film comprising the cured film. Specifically, the protective film may be a transparent protective film.
본 명세서의 일 실시상태에 따르면, 상기 경화막은 가시광선 투과율이 85 %이상일 수 있다. 보다 구체적으로, 상기 투과율은 90 % 또는 95 %이상일 수 있다.According to one embodiment of the present disclosure, the cured film may have a visible light transmittance of 85% or more. More specifically, the transmittance may be 90% or 95% or more.
본 명세서는 기판 상에 상기 경화성 조성물을 도포하는 단계; 및 상기 도포된 경화성 조성물을 경화시키는 단계를 포함하는 경화막의 제조방법을 제공한다.The present application discloses a method of manufacturing a semiconductor device, comprising: applying the curable composition on a substrate; And a step of curing the applied curable composition.
본 명세서의 일 실시상태에 따르면, 상기 도포된 경화성 조성물은 열에 의해 경화될 수 있다. According to one embodiment of the present disclosure, the applied curable composition can be cured by heat.
본 명세서는 상기 경화막을 포함하는 디스플레이 장치를 제공한다. The present specification provides a display device including the cured film.
상기 디스플레이 장치는 플라즈마 디스플레이 패널(Plasma Display Panel, PDP), 터치패널, 발광 다이오드(Light Emitting Diode, LED), 유기 발광 소자(Organic Light Emitting Diode, OLED), 액정 표시 장치(Liquid Crystal Display, LCD), 박막 트랜지스터 액정 표시 장치(Thin FIlm Transistor- Liquid Crystal Display, TFT-LCD) 및 음극선관(Cathode Ray Tube, CRT) 중 어느 하나일 수 있다.The display device may include a plasma display panel (PDP), a touch panel, a light emitting diode (LED), an organic light emitting diode (OLED), a liquid crystal display (LCD) , A thin film transistor liquid crystal display (TFT-LCD), and a cathode ray tube (CRT).
본 명세서는 상기 경화막을 포함하는 컬러 필터를 제공한다. The present specification provides a color filter comprising the cured film.
상기 컬러필터는 블랙매트리스, 컬러패턴 및 공통 전극을 더 포함할 수 있다. 상기 컬러패턴은 적색 패턴, 녹색 패턴 및 청색 패턴(RGB패턴)을 포함할 수 있으나, 이에 한정되는 것은 아니다.The color filter may further include a black mattress, a color pattern, and a common electrode. The color pattern may include, but is not limited to, a red pattern, a green pattern, and a blue pattern (RGB pattern).
본 명세서의 일 실시상태에 따르면, 상기 컬러필터는 블랙매트리스, 컬러패턴 및 공통 전극 상에 구비되는 오버코트층 또는 평탄화층으로서 상기 경화막을 포함할 수 있다. According to one embodiment of the present disclosure, the color filter may include the cured film as the overcoat layer or the planarization layer provided on the black mattress, the color pattern, and the common electrode.
본 명세서의 일 실시상태에 따르면, 상기 컬러필터 상에 형성된 경화막의 평탄화도는 50%이상인 것이 바람직하다.According to one embodiment of the present invention, the planarization degree of the cured film formed on the color filter is preferably 50% or more.
상기 평탄화도의 실험조건은 유리 기판 위에 선폭 50 μm, 두께 1.5 μm, 선과 선 사이의 간격이 50 μm가 되도록 선 및 간격 패턴(line-and space pattern)을 형성하여 테스트 기판을 완성하였고, 상기 테스트 기판 위에 본 발명에서 얻어진 경화막 조성물을 두께 5 μm가 되도록 100 ℃에서 200초 동안 전열처리(pre-baked) 공정을 수행하여 용매를 휘발시켰다. 이 후 상기 경화막을 다시 230 ℃ 오븐에 30분 동안 방치하여 열경화 반응을 진행시켰다. 상기 경화된 막 표면의 요철을 측정하고, 그 값을 1.5로 나눈 값을 1에서 뺀 후 100을 곱해 평탄화도를 계산하였다. The test conditions for the planarization degree were a line-and-space pattern formed on a glass substrate such that the line width and the space pattern were 50 μm and 1.5 μm and the line and line spacing was 50 μm. On the substrate, the cured film composition obtained in the present invention was subjected to a pre-baked process at 100 캜 for 200 seconds so as to have a thickness of 5 탆 to volatilize the solvent. Thereafter, the cured film was further left in an oven at 230 ° C for 30 minutes to conduct a thermosetting reaction. The unevenness of the surface of the cured film was measured, the value obtained by dividing the value by 1.5 was subtracted from 1, and then multiplied by 100 to calculate the degree of planarization.
예를 들어, 경화막의 요철의 깊이가 0.5 μm라고 가정하면, 상기 경화막의 평탄화도는 (1-0.5/1.5)×100= 67%이다.For example, assuming that the depth of the unevenness of the cured film is 0.5 占 퐉, the degree of planarization of the cured film is (1-0.5 / 1.5) 占 100 = 67%.
본 명세서의 일 구현예에 따르면, 상기 컬러필터 상에 형성된 경화막의 내화학성은 70℃에서 10분 동안 N-메틸피롤리돈에 침지하는 조건에서 두께 변화를 기준으로 10% 이내인 것이 바람직하다.According to one embodiment of the present invention, it is preferable that the chemical resistance of the cured film formed on the color filter is within 10% based on the change in thickness under the condition of immersing in N-methylpyrrolidone at 70 캜 for 10 minutes.
이하의 합성예, 실시예 및 비교예를 통하여 본 명세서를 더욱 구체적으로 설명한다. 다만, 하기의 합성예, 실시예 및 비교예는 본 명세서를 예시하기 위한 것일 뿐, 이들만으로 본 명세서가 한정되는 것은 아니다.The present specification will be described in more detail with reference to the following Synthesis Examples, Examples and Comparative Examples. However, the following synthesis examples, examples, and comparative examples are for illustrative purposes only, and the present invention is not limited thereto.
[실시예 1][Example 1]
경화성 조성물의 총 중량에 대해 바인더 수지로 메타아크릴옥시프로필 트라이메톡시실란, 타이타니움 이소프로폭사이드, 다이페닐실란다이올이 1:1:3의 몰비로 형성된 공중합체 19.94 중량%, 계면활성제로 F-475 (DaiNippon Ink & Chemicals) 0.06 중량% 용매로 프로필렌 글리콜 모노메틸 에테르 아세테이트 80 중량%를 혼합하였으며, 상기 혼합물을 5 시간 동안 교반하여 조성물을 제조하였다.19.94% by weight of a copolymer of methacryloxypropyltrimethoxysilane, titanium isopropoxide and diphenylsilane diol as a binder resin in a molar ratio of 1: 1: 3, based on the total weight of the curable composition, 80% by weight of propylene glycol monomethyl ether acetate was mixed with 0.06% by weight of F-475 (DaiNippon Ink & Chemicals) as a solvent, and the mixture was stirred for 5 hours to prepare a composition.
[실시예 2][Example 2]
경화성 조성물의 총 중량에 대해 상기 실시예 1의 수지 바인더를 저온 경화형수지 바인더로 메타아크릴옥시프로필 트라이메톡시실란, 타이타니움 이소프로폭사이드, 다이페닐실란다이올 0.5:1.5:3의 몰비로 형성된 공중합체 19.94 중량%, 이외의 성분은 실시예 1과 동일하게 하여 경화성 조성물을 제조하였다.The resin binder of Example 1 was added to the curable composition in a molar ratio of methacryloxypropyltrimethoxysilane, titanium isopropoxide and diphenylsilanediol of 0.5: 1.5: 3 as a low-temperature curable resin binder 19.94% by weight of the formed copolymer, and the other components were the same as in Example 1 to prepare a curable composition.
[비교예 1][Comparative Example 1]
경화성 조성물의 총 중량에 대해 바인더 수지로 벤질(메타)아크릴레이트, N-페닐말레이미드, 스타이렌 (stylene)과 (메타)아크릴산이 50:10:10:30의 몰비로 형성된 유기 공중합체 (Mw = 7,500, A.V. 125) 19.94 중량%를 사용하였으며, 이외의 성분은 실시예 1과 동일하게 하여 경화성 조성물을 제조하였다.(Meth) acrylate, N-phenylmaleimide, styrene and (meth) acrylic acid in a molar ratio of 50: 10: 10: 30 as a binder resin with respect to the total weight of the curable composition = 7,500, AV 125) 19.94% by weight, and the other components were the same as Example 1 to prepare a curable composition.
[실험예 1][Experimental Example 1]
가시광선 투과율 측정Visible light transmittance measurement
상기 실시예 1 내지 2 및 비교예 1 에 의해 제조된 경화성 조성물 용액을 각각 유리에 스핀 코팅(spin coating)한 후, 약 90℃에서 100초 동안 전열 처리(pre-baked)하였다. 이때, 형성된 각각의 필름의 두께는 2 mm가 되도록 스핀 코팅 조건을 조절하였다. 그런 다음 230 ℃에서 30분간 후열 처리하여 필름을 형성한 후 자외선 가시 분광 광도계(UV/Vis, ultraviolet Visible spectrophotometer)를 이용하여 380 nm에서 780 nm 사이의 파장에서 투과율을 측정하였다.Each of the curable composition solutions prepared in Examples 1 and 2 and Comparative Example 1 was spin-coated on glass and then pre-baked at about 90 ° C for 100 seconds. At this time, spin coating conditions were adjusted so that the thickness of each formed film was 2 mm. Then, the film was post-heat treated at 230 ° C. for 30 minutes, and then the transmittance was measured at a wavelength of 380 nm to 780 nm using an ultraviolet visible spectrophotometer (UV / Vis).
[실험예 2][Experimental Example 2]
아웃가싱(Out-gassing) 측정Out-gassing measurement
상기 실시예 1 내지 2 및 비교예 1 에 의해 제조된 경화성 조성물 용액을 각각 유리에 스핀 코팅(spin coating)한 후, 약 90℃에서 100초 동안 전열 처리(pre-baked)하였다. 이때, 형성된 각각의 필름의 두께는 2 mm가 되도록 스핀 코팅 조건을 조절하였다. 그런 다음 230 ℃에서 30분간 후열 처리하여 필름을 형성한 후 0.5 cm × 5 cm로 자른 다음 얻어진 5개의 기판을 이용하였다.Each of the curable composition solutions prepared in Examples 1 and 2 and Comparative Example 1 was spin-coated on glass and then pre-baked at about 90 ° C for 100 seconds. At this time, spin coating conditions were adjusted so that the thickness of each formed film was 2 mm. Then, the film was post-heated at 230 ° C for 30 minutes to form a film, and cut into 0.5 cm × 5 cm. Then, the obtained five substrates were used.
상기와 같이 준비된 시료를 230℃ 고온에서 20분간 열처리하면서 나오는 가스 성분을 -40 ℃의 온도에서 콜드 트랩(cold trap)한 후 (퍼지앤트랩(Purge & Trap) 방법), 트랩(trap)된 성분을 톨루엔(toluene)을 기준(reference) 물질로 하여 가스 크로마토그래프 질량분석계 (GC-MS, gas chromatograph-mass spectrometer)를 통해 정량 및 정성분석하였다.The prepared sample was subjected to a cold trap (purge & trap) method at a temperature of -40 DEG C after the gas component was heated at 230 DEG C for 20 minutes and then the trapped component Was quantitatively and qualitatively analyzed with a gas chromatograph-mass spectrometer (GC-MS) using toluene as a reference material.
Claims (13)
[화학식 1]
[화학식 2]
상기 화학식 1 및 2에서,
R1 및 Y1은 각각 독립적으로 히드록시기, 선형 또는 가지형 알콕시 또는 할로겐기이고,
R2 및 Y2는 각각 독립적으로 H, 탄소수 6 내지 12의 아릴기 또는 탄소수 1 내지 10의 알킬기이며,
R3 및 Y3는 각각 독립적으로 탄소수 1 내지 10의 알킬렌기이고,
R4, R5, R6, Y4, Y5 및 Y6는 각각 독립적으로 H 또는 탄소수 1 내지 10의 알킬기이며,
l 및 o는 각각 독립적으로 2 내지 4의 정수이고,
m, n, p 및 q는 각각 독립적으로 0 내지 2의 정수이며,
l+m+n=4, o+p+q= 2 내지 4이다.A curable composition comprising a binder resin prepared by using a monomer mixture comprising at least one compound represented by the following formula (1) and at least one compound represented by the following formula (2)
[Chemical Formula 1]
(2)
In the above Formulas 1 and 2,
R1 and Y1 are each independently a hydroxyl group, a linear or branched alkoxy or halogen group,
R2 and Y2 are each independently H, an aryl group having 6 to 12 carbon atoms or an alkyl group having 1 to 10 carbon atoms,
R3 and Y3 each independently represent an alkylene group having 1 to 10 carbon atoms,
R4, R5, R6, Y4, Y5 and Y6 are each independently H or an alkyl group having 1 to 10 carbon atoms,
l and o are each independently an integer of 2 to 4,
m, n, p and q are each independently an integer of 0 to 2,
l + m + n = 4, o + p + q = 2 to 4.
[화학식 3]
[화학식 4]
상기 화학식 3 및 4에서, R1, R2, R3, R4, R5, R6, l, m 및 n는 화학식 1의 정의와 같다.The curable composition according to claim 1, wherein the compound represented by Formula 1 is represented by Formula 3 or 4:
(3)
[Chemical Formula 4]
R1, R2, R3, R4, R5, R6, l, m and n are as defined in the formula (1).
[화학식 5]
[화학식 6]
상기 화학식 5 및 6에서, R2, R3, R4, R5, R6, l, m 및 n는 화학식 1의 정의와 같으며, R은 탄소수 1 내지 10의 선형 또는 가지형 알킬기이다.The curable composition according to claim 1, wherein the compound represented by Formula 1 is represented by Formula 5 or 6:
[Chemical Formula 5]
[Chemical Formula 6]
In the general formulas (5) and (6), R2, R3, R4, R5, R6, l, m and n are as defined in formula (1), and R is a linear or branched alkyl group having 1 to 10 carbon atoms.
[화학식 14]
상기 화학식 14에서, Y1, Y2, o 및 p는 화학식 2의 정의와 같다.The curable composition according to claim 1, wherein the compound represented by Formula 2 is represented by Formula 14:
[Chemical Formula 14]
Y1, Y2, o and p are as defined in the formula (2).
[화학식 15]
상기 화학식 15에서, Y2, o 및 p는 화학식 2의 정의와 같으며, R은 탄소수 1 내지 10의 선형 또는 가지형 알킬기이다.The curable composition according to claim 1, wherein the compound represented by Formula 2 is represented by Formula 15:
[Chemical Formula 15]
Y2, o and p are as defined in the formula (2), and R is a linear or branched alkyl group having 1 to 10 carbon atoms.
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KR20010018075A (en) | 1999-08-17 | 2001-03-05 | 성재갑 | Photosensitive resin composition |
KR100845403B1 (en) * | 2007-04-16 | 2008-07-10 | 유창국 | Organic / Inorganic Hybrid Coatings, Manufacturing Method and Thermosetting Method |
KR20120015996A (en) * | 2010-08-12 | 2012-02-22 | 주식회사 엘지화학 | Thermosetting Protective Film Resin Composition |
WO2012093910A2 (en) * | 2011-01-06 | 2012-07-12 | 주식회사 엘지화학 | Curable composition |
JP2013053272A (en) * | 2011-09-06 | 2013-03-21 | Cemedine Co Ltd | Curable composition |
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KR20010018075A (en) | 1999-08-17 | 2001-03-05 | 성재갑 | Photosensitive resin composition |
KR100845403B1 (en) * | 2007-04-16 | 2008-07-10 | 유창국 | Organic / Inorganic Hybrid Coatings, Manufacturing Method and Thermosetting Method |
KR20120015996A (en) * | 2010-08-12 | 2012-02-22 | 주식회사 엘지화학 | Thermosetting Protective Film Resin Composition |
WO2012093910A2 (en) * | 2011-01-06 | 2012-07-12 | 주식회사 엘지화학 | Curable composition |
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