KR20130045686A - Light emitting device, light emitting device package, and light unit - Google Patents

Abstract

The light emitting device according to the embodiment includes a first semiconductor layer of a first conductivity type, a first active layer under the first semiconductor layer of the first conductivity type, and a second semiconductor layer of a second conductivity type under the first active layer. A first light emitting structure comprising; A first reflective electrode electrically connected to the second semiconductor layer under the first light emitting structure; A second light emitting structure comprising a third semiconductor layer of a first conductivity type, a second active layer under the third conductive layer of the first conductivity type, and a fourth semiconductor layer of a second conductivity type under the second active layer; A second reflective electrode electrically connected to the fourth semiconductor layer under the second light emitting structure; A contact unit electrically connected to the first semiconductor layer and the second reflective electrode; A first connection wire electrically connected to the first reflective electrode; A second connection wiring electrically connected to the second reflection electrode; .

Description

Light-Emitting Device, Light-Emitting Device Package and Light Unit {LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE PACKAGE, AND LIGHT UNIT}

Embodiments relate to a light emitting device, a light emitting device package, and a light unit.

Light emitting diodes (LEDs) are widely used as light emitting devices. Light-emitting diodes use the properties of compound semiconductors to convert electrical signals into light, such as infrared, visible and ultraviolet light.

As the light efficiency of light emitting devices increases, light emitting devices have been applied to various fields including display devices and lighting devices.

The embodiment provides a light emitting device, a light emitting device package, and a light unit including a plurality of light emitting cells electrically secured and electrically connected.

The embodiment provides a light emitting device, a light emitting device package, and a light unit capable of selectively controlling a voltage supply of each light emitting cell with respect to a plurality of light emitting cells.

The light emitting device according to the embodiment includes a first semiconductor layer of a first conductivity type, a first active layer under the first semiconductor layer of the first conductivity type, and a second semiconductor layer of a second conductivity type under the first active layer. A first light emitting structure comprising; A first reflective electrode electrically connected to the second semiconductor layer under the first light emitting structure; A second light emitting structure comprising a third semiconductor layer of a first conductivity type, a second active layer under the third conductive layer of the first conductivity type, and a fourth semiconductor layer of a second conductivity type under the second active layer; A second reflective electrode electrically connected to the fourth semiconductor layer under the second light emitting structure; A contact unit electrically connected to the first semiconductor layer and the second reflective electrode; A first connection wire electrically connected to the first reflective electrode; A second connection wiring electrically connected to the second reflection electrode; .

The light emitting device according to the embodiment may include a first conductive semiconductor layer, an active layer under the first conductive semiconductor layer, and a second conductive semiconductor layer under the active layer; A plurality of light emitting cells each comprising; A contact unit electrically connected to a first conductive semiconductor layer of a first light emitting cell among the plurality of light emitting cells and electrically connected to a second conductive semiconductor layer of a second light emitting cell adjacent to the first light emitting cell; A first connection wire having one end exposed to the outside and the other end electrically connected to the second conductive semiconductor layer of the first light emitting cell; A second connection wiring having one end exposed to the outside and the other end electrically connected to the second conductive semiconductor layer of the second light emitting cell; .

The light emitting device package according to the embodiment includes a body; A light emitting element disposed on the body; A first lead electrode and a second lead electrode electrically connected to the light emitting device; The light emitting device includes a first semiconductor layer of a first conductivity type, a first active layer under the first conductive layer of the first conductivity type, and a second semiconductor layer of a second conductivity type under the first active layer. A first light emitting structure comprising a; A first reflective electrode electrically connected to the second semiconductor layer under the first light emitting structure; A second light emitting structure comprising a third semiconductor layer of a first conductivity type, a second active layer under the third conductive layer of the first conductivity type, and a fourth semiconductor layer of a second conductivity type under the second active layer; A second reflective electrode electrically connected to the fourth semiconductor layer under the second light emitting structure; A contact unit electrically connected to the first semiconductor layer and the second reflective electrode; A first connection wire electrically connected to the first reflective electrode; A second connection wiring electrically connected to the second reflection electrode; .

The light emitting device package according to the embodiment includes a body; A light emitting element disposed on the body; A first lead electrode and a second lead electrode electrically connected to the light emitting device; The light emitting device includes: a first conductive semiconductor layer, an active layer under the first conductive semiconductor layer, and a second conductive semiconductor layer under the active layer; A plurality of light emitting cells each comprising; A contact unit electrically connected to a first conductive semiconductor layer of a first light emitting cell among the plurality of light emitting cells and electrically connected to a second conductive semiconductor layer of a second light emitting cell adjacent to the first light emitting cell; A first connection wire having one end exposed to the outside and the other end electrically connected to the second conductive semiconductor layer of the first light emitting cell; A second connection wiring having one end exposed to the outside and the other end electrically connected to the second conductive semiconductor layer of the second light emitting cell; .

According to an embodiment, a light unit includes a substrate; A light emitting device disposed on the substrate; An optical member through which light provided from the light emitting device passes; The light emitting device includes a first semiconductor layer of a first conductivity type, a first active layer under the first semiconductor layer of the first conductivity type, and a second semiconductor layer of a second conductivity type under the first active layer. A first light emitting structure comprising a; A first reflective electrode electrically connected to the second semiconductor layer under the first light emitting structure; A second light emitting structure comprising a third semiconductor layer of a first conductivity type, a second active layer under the third conductive layer of the first conductivity type, and a fourth semiconductor layer of a second conductivity type under the second active layer; A second reflective electrode electrically connected to the fourth semiconductor layer under the second light emitting structure; A contact unit electrically connected to the first semiconductor layer and the second reflective electrode; A first connection wire electrically connected to the first reflective electrode; A second connection wiring electrically connected to the second reflection electrode; .

According to an embodiment, a light unit includes a substrate; A light emitting device disposed on the substrate; An optical member through which light provided from the light emitting device passes; The light emitting device includes: a first conductive semiconductor layer, an active layer under the first conductive semiconductor layer, and a second conductive semiconductor layer under the active layer; A plurality of light emitting cells each comprising; A contact unit electrically connected to a first conductive semiconductor layer of a first light emitting cell among the plurality of light emitting cells and electrically connected to a second conductive semiconductor layer of a second light emitting cell adjacent to the first light emitting cell; A first connection wire having one end exposed to the outside and the other end electrically connected to the second conductive semiconductor layer of the first light emitting cell; A second connection wiring having one end exposed to the outside and the other end electrically connected to the second conductive semiconductor layer of the second light emitting cell; .

The light emitting device, the light emitting device package, and the light unit according to the embodiment may provide a plurality of light emitting cells electrically secured and electrically connected.

The light emitting device, the light emitting device package, and the light unit according to the embodiment may selectively control the voltage supply of each light emitting cell with respect to the plurality of light emitting cells.

1 is a view showing a light emitting device according to an embodiment.
2 to 7 illustrate a method of manufacturing a light emitting device according to the embodiment.
8 to 12 are views showing a modified example of the light emitting device according to the embodiment.
13 is a view showing a light emitting device package according to the embodiment.
14 is a diagram illustrating a display device according to an exemplary embodiment.
15 is a diagram illustrating another example of a display device according to an exemplary embodiment.
16 is a view showing a lighting apparatus according to an embodiment.

In the description of the embodiments, it is to be understood that each layer (film), region, pattern or structure may be referred to as being "on" or "under" a substrate, each layer It is to be understood that the terms " on "and " under" include both " directly "or" indirectly " do. In addition, the criteria for the top / bottom or bottom / bottom of each layer are described with reference to the drawings.

The thickness and size of each layer in the drawings are exaggerated, omitted, or schematically shown for convenience and clarity of explanation. In addition, the size of each component does not necessarily reflect the actual size.

Hereinafter, a light emitting device, a light emitting device package, a light unit, and a light emitting device manufacturing method according to embodiments will be described in detail with reference to the accompanying drawings.

1 is a view illustrating a light emitting device according to an embodiment.

As shown in FIG. 1, the light emitting device according to the embodiment may include a first light emitting structure 10, a second light emitting structure 20, a third light emitting structure 30, a first reflective electrode 17, and a second light emitting device. The reflective electrode 27 and the third reflective electrode 37 may be included. 1 illustrates a case where three light emitting structures are disposed, the light emitting device according to the embodiment may include two light emitting structures and may also include four or more light emitting structures. The plurality of light emitting structures may be electrically connected to each other.

The first light emitting structure 10 may include a first semiconductor layer 11 of a first conductivity type, a first active layer 12, and a second semiconductor layer 13 of a second conductivity type. The first active layer 12 may be disposed between the first semiconductor layer 11 of the first conductivity type and the second semiconductor layer 13 of the second conductivity type. The first active layer 12 may be disposed under the first semiconductor layer 11 of the first conductivity type, and the second semiconductor layer 13 of the second conductivity type may be below the first active layer 12. Can be placed in.

For example, the first semiconductor layer 11 of the first conductivity type is formed of an n-type semiconductor layer to which an n-type dopant is added as the first conductivity type dopant, and the second semiconductor layer 13 of the second conductivity type. The second conductive dopant may be formed of a p-type semiconductor layer to which a p-type dopant is added. Further, the first semiconductor layer 11 of the first conductivity type may be formed of a p-type semiconductor layer, and the second semiconductor layer 13 of the second conductivity type may be formed of an n-type semiconductor layer.

The first semiconductor layer 11 of the first conductivity type may include, for example, an n-type semiconductor layer. The first semiconductor layer 11 of the first conductivity type may be implemented as a compound semiconductor. The first semiconductor layer 11 of the first conductivity type may be implemented as, for example, a group II-VI or group III-V compound semiconductor.

For example, the first conductivity type of the first semiconductor layer (11) is _{In x Al y Ga 1 -x- y} N (0≤x≤1, 0≤y≤1, 0≤x + y≤1) the composition formula It can be implemented with a semiconductor material having a. The first semiconductor layer 11 of the first conductivity type may be selected from, for example, GaN, AlN, AlGaN, InGaN, InN, InAlGaN, AlInN, AlGaAs, GaP, GaAs, GaAsP, AlGaInP, and the like. N-type dopants such as Sn, Se, Te, and the like may be doped.

The first active layer 12 is electrons (or holes) injected through the first semiconductor layer 11 of the first conductivity type and holes injected through the second semiconductor layer 13 of the second conductivity type ( Or electrons) meet each other and emit light due to a band gap difference of an energy band according to a material of forming the first active layer 12. The first active layer 12 may be formed of any one of a single well structure, a multiple well structure, a quantum dot structure, or a quantum line structure, but is not limited thereto.

The first active layer 12 may be implemented with a compound semiconductor. The first active layer 12 may be implemented by way of example to the Group II -VI group or a group III -V compound semiconductor. The first active layer 12 is by way of example _{In x Al y Ga 1 -x- y} N It can be implemented with a semiconductor material having a composition formula of (0 ≦ x ≦ 1, 0 ≦ y ≦ 1, 0 ≦ x + y ≦ 1). When the first active layer 12 is implemented as the multi-well structure, the first active layer 12 may be implemented by stacking a plurality of well layers and a plurality of barrier layers. For example, an InGaN well layer / It may be implemented in a cycle of the GaN barrier layer.

The second semiconductor layer 13 of the second conductivity type may be implemented with, for example, a p-type semiconductor layer. The second semiconductor layer 13 of the second conductivity type may be implemented as a compound semiconductor. The second semiconductor layer 13 of the second conductivity type may be implemented as, for example, a group II-VI or group III-V compound semiconductor.

I pray on, the second conductive type second semiconductor layer (13) is _{In x Al y Ga 1 -x- y} N (0≤x≤1, 0≤y≤1, 0≤x + y≤1) It can be implemented with a semiconductor material having a compositional formula. The second conductive second semiconductor layer 13 may be selected from, for example, GaN, AlN, AlGaN, InGaN, InN, InAlGaN, AlInN, AlGaAs, GaP, GaAs, GaAsP, AlGaInP, and the like. P-type dopants such as, Ca, Sr, and Ba may be doped.

The first semiconductor layer 11 of the first conductivity type may include a p-type semiconductor layer, and the second semiconductor layer 13 of the second conductivity type may include an n-type semiconductor layer. In addition, a semiconductor layer including an n-type or p-type semiconductor layer may be further formed under the second conductive layer 13 of the second conductivity type. Accordingly, the first light emitting structure 10 may have at least one of np, pn, npn, and pnp junction structures. In addition, the doping concentrations of the impurities in the first semiconductor layer 11 of the first conductivity type and the second semiconductor layer 13 of the second conductivity type may be uniformly or nonuniformly formed. That is, the structure of the first light emitting structure 10 may be variously formed, but is not limited thereto.

In addition, a first conductive InGaN / GaN superlattice structure or an InGaN / InGaN superlattice structure may be formed between the first semiconductor layer 11 of the first conductivity type and the first active layer 12. In addition, a second conductive AlGaN layer may be formed between the second semiconductor layer 13 of the second conductivity type and the first active layer 12.

The second light emitting structure 20 may include a third semiconductor layer 21 of a first conductivity type, a second active layer 22, and a fourth semiconductor layer 23 of a second conductivity type. The second active layer 22 may be disposed between the third semiconductor layer 21 of the first conductivity type and the fourth semiconductor layer 23 of the second conductivity type. The second active layer 22 may be disposed below the third semiconductor layer 21 of the first conductivity type, and the fourth semiconductor layer 23 of the second conductivity type may be below the second active layer 22. Can be placed in. The second light emitting structure 20 may be similarly formed in accordance with the first light emitting structure 10 described above.

In addition, the third light emitting structure 30 may include a fifth semiconductor layer 31 of a first conductivity type, a third active layer 32, and a sixth semiconductor layer 33 of a second conductivity type. The third active layer 32 may be disposed between the fifth semiconductor layer 31 of the first conductivity type and the sixth semiconductor layer 33 of the second conductivity type. The third active layer 32 may be disposed under the fifth semiconductor layer 31 of the first conductivity type, and the sixth semiconductor layer 33 of the second conductivity type may be below the third active layer 32. Can be placed in. The third light emitting structure 30 may be similarly formed in accordance with the first light emitting structure 10 described above.

The first ohmic contact layer 15 and the first reflective electrode 17 may be disposed under the first light emitting structure 10. The first channel layer 16 may be disposed under the first light emitting structure 10 and around the first ohmic contact layer 15.

The first channel layer 16 may be formed of, for example, a material having electrical insulation or a material having low electrical conductivity compared to the first light emitting structure 10. The first channel layer 16 may be formed of, for example, oxide or nitride. For example, the first channel layer 16 may include Si0 ₂ , Si _x O _y , Si ₃ N ₄ , Si _x N _y , SiO _x N _y , Al ₂ O ₃ , TiO ₂ , ITO, AZO, ZnO, or the like. At least one selected from the group consisting of may be formed. The first channel layer 16 may also be referred to as an isolation layer.

A first current blocking layer (CBL) 18 may be disposed between the first light emitting structure 10 and the first ohmic contact layer 15. The first current blocking layer 18 may improve the luminous efficiency of the light emitting device according to the embodiment by alleviating the phenomenon that the current is concentrated in a portion of the first active layer 12.

The first current blocking layer 18 may be electrically insulating, or may be formed using a material that forms a Schottky contact with the first light emitting structure 10. The first current blocking layer 18 may be formed of an oxide, nitride, or metal. The first current blocking layer 18 may include, for example, at least one of SiO ₂ , SiO _x , SiO _x N _y , Si ₃ N ₄ , Al ₂ O _{3 ,} TiO _x , Ti, Al, Cr. Can be.

The first metal layer 19 may be disposed under the first light emitting structure 10 and around the first reflective electrode 17. The first metal layer 19 may be disposed around the first ohmic contact layer 15 and below the first reflective electrode 17.

The first ohmic contact layer 15 may be formed of, for example, a transparent conductive oxide layer. The first ohmic contact layer 15 may be formed of, for example, indium tin oxide (ITO), indium zinc oxide (IZO), aluminum zinc oxide (AZO), aluminum gallium zinc oxide (AGZO), indium zinc tin oxide (IZTO) or IAZO. (Indium Aluminum Zinc Oxide), IGZO (Indium Gallium Zinc Oxide), IGTO (Indium Gallium Tin Oxide), ATO (Antimony Tin Oxide), GZO (Gallium Zinc Oxide), IZON (IZO Nitride), ZnO, IrOx, RuOx, NiO It may be formed of at least one material selected from Pt, Ag.

The first reflective electrode 17 may be formed of a metal material having a high reflectance. For example, the first reflective electrode 17 may be formed of a metal or an alloy including at least one of Ag, Ni, Al, Rh, Pd, Ir, Ru, Mg, Zn, Pt, Cu, Au, and Hf. In addition, the first reflecting electrode 17 may be formed of the metal or the alloy, Indium-Tin-Oxide (ITO), Indium-Zinc-Oxide (IZO), Indium-Zinc-Tin-Oxide (IZTO), and Indium-Aluminum (AZO). Transmissive conductive materials such as -Zinc-Oxide), Indium-Gallium-Zinc-Oxide (IGZO), Indium-Gallium-Tin-Oxide (IGTO), Aluminum-Zinc-Oxide (AZO), and Antimony-Tin-Oxide (ATO) It can be formed in a multi-layer using. For example, in an embodiment, the first reflective electrode 17 may include at least one of Ag, Al, Ag-Pd-Cu alloy, or Ag-Cu alloy.

The first ohmic contact layer 15 may be formed to be in ohmic contact with the first light emitting structure 10. In addition, the first reflective electrode 17 may function to increase the amount of light extracted to the outside by reflecting light incident from the first light emitting structure 10. The first metal layer 19 may include at least one of Cu, Ni, Ti, Cr, W, Pt, V, Fe, and Mo materials.

In addition, a second ohmic contact layer 25 and the second reflective electrode 27 may be disposed under the second light emitting structure 20. The second channel layer 26 may be disposed under the second light emitting structure 20 and around the second ohmic contact layer 25.

The second channel layer 26 may be formed of, for example, a material having electrical insulation or a material having low electrical conductivity compared to the second light emitting structure 20. The second channel layer 26 may be formed of, for example, oxide or nitride. For example, the second channel layer 26 may include Si0 ₂ , Si _x O _y , Si ₃ N ₄ , Si _x N _y , SiO _x N _y , Al ₂ O ₃ , TiO ₂ , ITO, AZO, ZnO, or the like. At least one selected from the group consisting of may be formed. The second channel layer 26 may be referred to as an isolation layer.

A second current blocking layer 28 may be disposed between the second light emitting structure 20 and the second ohmic contact layer 25. The second current blocking layer 28 may improve the luminous efficiency of the light emitting device according to the embodiment by alleviating a phenomenon in which current is concentrated in a portion of the second active layer 22.

The second current blocking layer 28 may have electrical insulation or may be formed using a material for forming a schottky contact with the second light emitting structure 20. The second current blocking layer 28 may be formed of an oxide, nitride, or metal. The second current blocking layer 28 may include, for example, at least one of SiO ₂ , SiO _x , SiO _x N _y , Si ₃ N ₄ , Al ₂ O _{3 ,} TiO _x , Ti, Al, Cr. Can be.

The second metal layer 29 may be disposed under the second light emitting structure 20 and around the second reflective electrode 27. The second metal layer 29 may be disposed around the second ohmic contact layer 25 and below the second reflective electrode 27.

The second ohmic contact layer 25 may be formed of, for example, a transparent conductive oxide layer. The second ohmic contact layer 25 may be formed of, for example, indium tin oxide (ITO), indium zinc oxide (IZO), aluminum zinc oxide (AZO), aluminum gallium zinc oxide (AGZO), indium zinc tin oxide (IZTO), or IAZO. (Indium Aluminum Zinc Oxide), IGZO (Indium Gallium Zinc Oxide), IGTO (Indium Gallium Tin Oxide), ATO (Antimony Tin Oxide), GZO (Gallium Zinc Oxide), IZON (IZO Nitride), ZnO, IrOx, RuOx, NiO It may be formed of at least one material selected from Pt, Ag.

The second reflecting electrode 27 may be formed of a metal material having a high reflectance. For example, the second reflective electrode 27 may be formed of a metal or an alloy including at least one of Ag, Ni, Al, Rh, Pd, Ir, Ru, Mg, Zn, Pt, Cu, Au, and Hf. In addition, the third reflecting electrode 37 may be formed of the metal or the alloy, Indium-Tin-Oxide (ITO), Indium-Zinc-Oxide (IZO), Indium-Zinc-Tin-Oxide (IZTO), and Indium-Aluminum (AZO). Transmissive conductive materials such as -Zinc-Oxide), Indium-Gallium-Zinc-Oxide (IGZO), Indium-Gallium-Tin-Oxide (IGTO), Aluminum-Zinc-Oxide (AZO), and Antimony-Tin-Oxide (ATO) It can be formed in a multi-layer using. For example, in the exemplary embodiment, the second reflective electrode 27 may include at least one of Ag, Al, Ag-Pd-Cu alloy, or Ag-Cu alloy.

The second ohmic contact layer 25 may be formed in ohmic contact with the second light emitting structure 20. In addition, the second reflective electrode 27 may perform a function of increasing the amount of light extracted to the outside by reflecting light incident from the second light emitting structure 20. The second metal layer 29 may include at least one of Cu, Ni, Ti, Cr, W, Pt, V, Fe, and Mo materials.

In addition, a third ohmic contact layer 35 and the third reflective electrode 37 may be disposed under the third light emitting structure 30. A third channel layer 36 may be disposed under the third light emitting structure 30 and around the third ohmic contact layer 35.

The third channel layer 36 may be formed of, for example, a material having electrical insulation or a material having low electrical conductivity compared to the third light emitting structure 30. The third channel layer 36 may be formed of, for example, oxide or nitride. For example, the third channel layer 36 may include Si0 ₂ , Si _x O _y , Si ₃ N ₄ , Si _x N _y , SiO _x N _y , Al ₂ O ₃ , TiO ₂ , ITO, AZO, ZnO, or the like. At least one selected from the group consisting of may be formed. The third channel layer 36 may be referred to as an isolation layer.

A third current blocking layer 38 may be disposed between the third light emitting structure 30 and the third ohmic contact layer 35. The third current blocking layer 38 may improve the luminous efficiency of the light emitting device according to the embodiment by alleviating a phenomenon in which current is concentrated in a portion of the third active layer 32.

The third current blocking layer 38 may be electrically insulating, or may be formed using a material that forms a Schottky contact with the third light emitting structure 30. The third current blocking layer 38 may be formed of oxide, nitride, or metal. The third current blocking layer 38 may include, for example, at least one of SiO ₂ , SiO _x , SiO _x N _y , Si ₃ N ₄ , Al ₂ O _{3 ,} TiO _x , Ti, Al, Cr. Can be.

A third metal layer 39 may be disposed under the third light emitting structure 30 and around the third reflective electrode 37. The third metal layer 39 may be disposed around the third ohmic contact layer 35 and below the third reflective electrode 37.

The third ohmic contact layer 35 may be formed of, for example, a transparent conductive oxide layer. For example, the third ohmic contact layer 35 may be formed of indium tin oxide (ITO), indium zinc oxide (IZO), aluminum zinc oxide (AZO), aluminum gallium zinc oxide (AGZO), indium zinc tin oxide (IZTO) or IAZO. (Indium Aluminum Zinc Oxide), IGZO (Indium Gallium Zinc Oxide), IGTO (Indium Gallium Tin Oxide), ATO (Antimony Tin Oxide), GZO (Gallium Zinc Oxide), IZON (IZO Nitride), ZnO, IrOx, RuOx, NiO It may be formed of at least one material selected from Pt, Ag.

The third reflective electrode 37 may be formed of a metal material having a high reflectance. For example, the third reflective electrode 37 may be formed of a metal or an alloy including at least one of Ag, Ni, Al, Rh, Pd, Ir, Ru, Mg, Zn, Pt, Cu, Au, and Hf. In addition, the third reflecting electrode 37 may be formed of the metal or the alloy, Indium-Tin-Oxide (ITO), Indium-Zinc-Oxide (IZO), Indium-Zinc-Tin-Oxide (IZTO), and Indium-Aluminum (AZO). Transmissive conductive materials such as -Zinc-Oxide), Indium-Gallium-Zinc-Oxide (IGZO), Indium-Gallium-Tin-Oxide (IGTO), Aluminum-Zinc-Oxide (AZO), and Antimony-Tin-Oxide (ATO) It can be formed in a multi-layer using. For example, in an embodiment, the third reflective electrode 37 may include at least one of Ag, Al, Ag-Pd-Cu alloy, or Ag-Cu alloy.

The third ohmic contact layer 35 may be formed to be in ohmic contact with the third light emitting structure 30. In addition, the third reflective electrode 37 may perform a function of increasing the amount of light extracted to the outside by reflecting light incident from the third light emitting structure 30. The third metal layer 39 may include at least one of Cu, Ni, Ti, Cr, W, Pt, V, Fe, and Mo materials.

The first insulating layer 41 may be disposed on the side surface of the first light emitting structure 10. The first insulating layer 41 may be disposed on the first light emitting structure 10. The first insulating layer 41 may be formed of oxide or nitride. The first insulating layer 41 is, for example, SiO ₂ , SiO _x , SiO _x N _y , Si ₃ N ₄ , Al ₂ O ₃ It may be formed of a material having a light transmitting and insulating properties. The first insulating layer 41 may be made of an insulating material, such as TiO ₂ , AlN.

The second insulating layer 51 may be disposed on the side of the second light emitting structure 20. The second insulating layer 51 may be disposed on the second light emitting structure 20. The second insulating layer 51 may be formed of oxide or nitride. The second insulating layer 51 is, for example, SiO ₂ , SiO _x , SiO _x N _y , Si ₃ N ₄ , Al ₂ O ₃ It may be formed of a material having a light transmitting and insulating properties. The second insulating layer 51 may be made of an insulating material such as TiO ₂ , AlN, or the like.

The third insulating layer 61 may be disposed on the side surface of the third light emitting structure 30. The third insulating layer 61 may be disposed on the third light emitting structure 30. The third insulating layer 61 may be formed of oxide or nitride. The third insulating layer 61 is, for example, SiO ₂ , SiO _x , SiO _x N _y , Si ₃ N ₄ , Al ₂ O ₃ It may be formed of a material having a light transmitting and insulating properties. The third insulating layer 61 may be made of an insulating material such as TiO ₂ , AlN.

The first contact portion 43 may be disposed between the first light emitting structure 10 and the second light emitting structure 20. The first contact portion 43 electrically connects the first conductive layer 11 of the first conductivity type to the second reflective electrode 27. The first contact portion 43 may contact an upper portion of the first semiconductor layer 11 of the first conductivity type. The first contact portion 43 may be in contact with the second metal layer 29. The first contact portion 43 may be in contact with the second metal layer 29. The first contact portion 43 may be electrically connected to the fourth semiconductor layer 23 of the second conductivity type. The first semiconductor layer 11 of the first conductivity type may be electrically connected to the fourth semiconductor layer 23 of the second conductivity type through the first contact portion 43.

The first contact portion 43 may be formed of at least one material selected from, for example, Cr, Al, Ti, Ni, Pt, and V. In addition, the first contact portion 43 may be formed of, for example, a transparent conductive oxide layer. The first contact portion 43 may include, for example, indium tin oxide (ITO), indium zinc oxide (IZO), aluminum zinc oxide (AZO), aluminum gallium zinc oxide (AGZO), indium zinc tin oxide (IZTO), and IAZO ( Among Indium Aluminum Zinc Oxide (IGZO), Indium Gallium Zinc Oxide (IGZO), Indium Gallium Tin Oxide (IGTO), Antimony Tin Oxide (ATO), Gallium Zinc Oxide (GZO), IZON (IZO Nitride), ZnO, IrOx, RuOx, NiO It may be formed of at least one material selected.

The first contact portion 43 may contact an upper portion of the first semiconductor layer 11 of the first conductivity type. For example, the first semiconductor layer 11 of the first conductivity type may be implemented including a GaN layer. In this case, considering the growth direction and the etching direction of the semiconductor layer, the first contact portion 43 may be in contact with the N face (N face) of the first semiconductor layer 11 of the first conductivity type.

The first insulating layer 41 may be disposed between the first contact portion 43 and the second semiconductor layer 13 of the second conductivity type. The first insulating layer 41 may be disposed between the first contact portion 43 and the first active layer 12. Some regions of the first contact portion 43 may be disposed on the first insulating layer 41. The first contact portion 43 may be in contact with the top and side surfaces of the first insulating layer 41.

A second contact portion 53 may be disposed between the second light emitting structure 20 and the third light emitting structure 30. The second contact portion 53 electrically connects the third conductive layer 21 of the first conductivity type to the third reflective electrode 37. The second contact portion 53 may contact the upper portion of the third semiconductor layer 21 of the first conductivity type. The second contact portion 53 may be in contact with the third metal layer 39. The second contact portion 53 may be electrically connected to the sixth semiconductor layer 33 of the second conductivity type. The third semiconductor layer 21 of the first conductivity type may be electrically connected to the sixth semiconductor layer 33 of the second conductivity type through the second contact portion 53.

The second contact portion 53 may be formed of at least one material selected from, for example, Cr, Al, Ti, Ni, Pt, and V. In addition, the second contact portion 53 may be formed of, for example, a transparent conductive oxide layer. The second contact portion 53 may be formed of, for example, indium tin oxide (ITO), indium zinc oxide (IZO), aluminum zinc oxide (AZO), aluminum gallium zinc oxide (AGZO), indium zinc tin oxide (IZTO) or IAZO Among Indium Aluminum Zinc Oxide (IGZO), Indium Gallium Zinc Oxide (IGZO), Indium Gallium Tin Oxide (IGTO), Antimony Tin Oxide (ATO), Gallium Zinc Oxide (GZO), IZON (IZO Nitride), ZnO, IrOx, RuOx, NiO It may be formed of at least one material selected.

The second contact portion 53 may contact the upper portion of the third semiconductor layer 21 of the first conductivity type. For example, the third semiconductor layer 21 of the first conductivity type may be implemented including a GaN layer. In this case, considering the growth direction and the etching direction of the semiconductor layer, the second contact portion 53 may contact the N face of the third semiconductor layer 21 of the first conductivity type.

A second insulating layer 51 may be disposed between the second contact portion 53 and the fourth semiconductor layer 23 of the second conductivity type. The second insulating layer 51 may be disposed between the second contact portion 53 and the second active layer 22. Some regions of the second contact portion 53 may be disposed on the second insulating layer 51. The second contact portion 53 may contact the top and side surfaces of the second insulating layer 51.

The fourth insulating layer 40 may be disposed under the first metal layer 19, the second metal layer 29, and the third metal layer 39. The fourth insulating layer 40 may be formed of oxide or nitride. The fourth insulating layer 40 is, for example, SiO ₂ , SiO _x , SiO _x N _y , Si ₃ N ₄ , Al ₂ O ₃ It may be formed of a material having a light transmitting and insulating properties. The fourth insulating layer 40 may be made of an insulating material, such as TiO ₂ , AlN. The fourth insulating layer 40 insulates the first metal layer 19 from the second metal layer 29. The fourth insulating layer 40 insulates the second metal layer 29 and the third metal layer 39 from each other.

The first connection wire 91 electrically connected to the first reflective electrode 17 may be disposed. One end of the first connection line 91 may be exposed to the outside. One end of the first connection line 91 may be exposed on the first channel layer 16. The other end of the first connection line 91 may be electrically connected to the first reflective electrode 17. The other end of the first connection line 91 may be in contact with the first metal layer 19. A portion of the first connection line 91 may contact the upper surface of the first metal layer 19.

A second connection wire 92 electrically connected to the second reflective electrode 27 may be disposed. One end of the second connection line 92 may be exposed to the outside. One end of the second connection line 92 may be exposed on the upper portion of the first channel layer 16. The other end of the second connection line 92 may be electrically connected to the second reflective electrode 27. The other end of the second connection line 92 may be in contact with the second metal layer 29. A portion of the second connection line 92 may contact the bottom surface of the second metal layer 29. The fourth insulating layer 40 may be disposed between the second connection line 92 and the first metal layer 19. The first region of the second connection line 92 may be disposed on the first channel layer 16. The second region of the second connection line 92 may pass through the first channel layer 16. The third region of the second connection line 92 may pass through the fourth insulating layer 40. The fourth region of the second connection line 92 may contact the bottom surface of the fourth insulating layer 40.

A third connection wire 93 electrically connected to the third reflective electrode 37 may be disposed. One end of the third connection line 93 may be exposed to the outside. One end of the third connection line 93 may be exposed on the upper portion of the first channel layer 16. The other end of the third connection line 93 may be electrically connected to the third reflective electrode 37. The other end of the third connection line 93 may be in contact with the third metal layer 39. A portion of the third connection line 93 may contact the lower surface of the third metal layer 39. A fifth insulating layer 45 may be disposed between the third connection line 93 and the second connection line 92. The first region of the third connection line 93 may be disposed on the first channel layer 16. The second region of the third connection line 93 may pass through the first channel layer 16. The third region of the third connection line 93 may pass through the fourth insulating layer 40. The fourth region of the third connection wiring 93 may be in contact with the lower surface of the fifth insulating layer 45.

The fifth insulating layer 45 may be formed of oxide or nitride. The fifth insulating layer 45 may include, for example, SiO ₂ , SiO _x , SiO _x N _y , Si ₃ N ₄ , Al ₂ O ₃ It may be formed of a material having a light transmitting and insulating properties. The fifth insulating layer 45 may be made of an insulating material, such as TiO ₂ , AlN. The fifth insulating layer 45 may be implemented, for example, in a thickness of 50 nanometers to 3000 nanometers.

The sixth insulating layer 47 may be disposed under the third connection line 93. The sixth insulating layer 47 may be formed of oxide or nitride. The sixth insulating layer 47 is, for example, SiO ₂ , SiO _x , SiO _x N _y , Si ₃ N ₄ , Al ₂ O ₃ It may be formed of a material having a light transmitting and insulating properties. The sixth insulating layer 47 may be formed of an insulating material such as TiO ₂ , AlN, or the like. The sixth insulating layer 47 may be implemented to have a thickness of, for example, 50 nanometers to 3000 nanometers.

The diffusion barrier layer 50, the bonding layer 60, and the support member 70 may be disposed under the sixth insulating layer 47.

In the diffusion barrier layer 50, a material included in the bonding layer 60 may be formed in the process of providing the bonding layer 60 with the first reflecting electrode 17, the second reflecting electrode 27, and the first reflecting layer 60. A function of preventing diffusion in the direction of the three reflective electrodes 37 may be performed. In the diffusion barrier layer 50, a material such as tin (Sn) included in the bonding layer 60 may be formed of the first reflective electrode 17, the second reflective electrode 27, and the third reflective electrode 37. ), Etc. can be prevented. The diffusion barrier layer 50 may include at least one of Cu, Ni, Ti-W, W, Pt, V, Fe, and Mo materials.

The bonding layer 60 may include at least one of Ti, Au, Sn, Ni, Cr, Ga, In, Bi, Cu, Ag, Nb, Pd, . The support member 70 may support the light emitting device according to the embodiment and perform a heat radiation function. The bonding layer 60 may be implemented as a seed layer.

The supporting member 70 may be a semiconductor substrate (for example, Si, Ge, GaN, GaAs, or the like) into which Ti, Cr, Ni, Al, Pt, Au, W, Cu, Mo, Cu- ZnO, SiC, SiGe, and the like). In addition, the support member 70 may be implemented with an insulating material. The support member 70 may be made of a material such as Al ₂ O ₃ , SiO ₂ .

Meanwhile, the electrode 80 may be disposed on the fifth semiconductor layer 31 of the first conductivity type. The electrode 80 may be electrically connected to the fifth semiconductor layer 31 of the first conductivity type. The electrode 80 may be in contact with an upper surface of the fifth semiconductor layer 31 of the first conductivity type.

According to an embodiment, the first light emitting structure 10 and the first through the first connection line 91, the second connection line 92, the third connection line 93, and the electrode 80. The power may be applied to the second light emitting structure 20 and the third light emitting structure 30. The first light emitting structure 10, the second light emitting structure 20, and the third light emitting structure 30 are electrically connected to each other. Accordingly, when power is applied through the first connection wire 91, the second connection wire 92, the third connection wire 93, and the electrode 80, the first light emitting structure 10, Light may be provided from the second light emitting structure 20 and the third light emitting structure 30.

According to an embodiment, the first connection line 91, the second connection line 92, the third connection line 93, and the electrode 80 may be implemented in a multilayer structure. The first connection wire 91, the second connection wire 92, the third connection wire 93, and the electrode 80 may be implemented as an ohmic contact layer, an intermediate layer, and an upper layer. The ohmic contact layer may implement an ohmic contact by including a material selected from Cr, V, W, Ti, and Zn. The intermediate layer may be formed of a material selected from Ni, Cu, Al, and the like. The upper layer may comprise, for example, Au.

A light extraction pattern may be provided on upper surfaces of the first light emitting structure 10, the second light emitting structure 20, and the third light emitting structure 30. Concave-convex patterns may be provided on upper surfaces of the first light emitting structure 10, the second light emitting structure 20, and the third light emitting structure 30. Accordingly, according to the embodiment, the effect of extracting external light can be increased.

According to an embodiment, the light emitting structures may be electrically connected to each other through the first contact portion 43 and the second contact portion 53. In addition, according to an embodiment, the first connecting wire 91, the second connecting wire 92, the third connecting wire 93, and the electrode 80 may be electrically connected to an external terminal through wire bonding. Can be.

That is, the first connection wire 91, the second connection wire 92, and the third connection wire 93 may be supplied with power through an external terminal and wire bonding in an externally exposed area. The second reflecting electrode 27 may be electrically connected to the first semiconductor layer 11 of the first conductivity type and may be electrically connected to the second connection line 92. The third reflective electrode 37 may be electrically connected to the third semiconductor layer 21 of the first conductivity type and may be electrically connected to the third connection line 93.

Accordingly, an operating voltage of each light emitting structure may be selected through selective power connection to the first connection line 91, the second connection line 92, and the third connection line 93.

For example, when a power source is connected to the first connection wire 91 and the electrode 80, the first light emitting structure 10, the second light emitting structure 20, and the third light emitting structure are operated at an operating voltage V1. 30 can be emitted. When the power source is connected to the second connection line 92 and the electrode 80, the second light emitting structure 20 and the third light emitting structure 30 may emit light at an operating voltage V2. At this time, for example, the voltage of V1 may have a larger value than that of V2. In addition, when a power source is connected to the third connection line 93 and the electrode 80, the third light emitting structure 30 may emit light at an operating voltage V3. At this time, for example, the voltage of V2 may have a larger value than that of V3.

In addition, although only three light emitting cells are illustrated in the embodiment, four or more connection wirings connected to the light emitting cells and the reflective electrodes of the light emitting cells may be formed to operate similarly to those described above. In addition, different power sources of the respective connection wires may be connected to control the operating voltage of each light emitting structure.

According to the embodiment, it is possible to implement a plurality of light emitting structures having various voltages in one light emitting device, and to secure a process margin for the operating voltage.

In example embodiments, the fourth insulating layer 40 is disposed under the first metal layer 19, the second metal layer 29, and the third metal layer 39. Accordingly, the fourth insulating layer 40 can stably support the first light emitting structure 10, the second light emitting structure 20, and the third light emitting structure 30 without any step between the components. do.

Accordingly, in the case of the high voltage vertical light emitting device using the conventional vertical light emitting device, there is a case in which a depression occurs due to the step in the process of attaching the supporting substrate 70, etc., according to the present embodiment. Can be prevented. In addition, in the case of a high-voltage vertical light emitting device using a conventional vertical light emitting device, a short is generated between light emitting cells when the chip is arranged. In this embodiment, a short between light emitting cells is generated. It can be prevented from occurring. Accordingly, according to the embodiment, it is possible to improve the electrical reliability of the light emitting device.

The light emitting device according to the embodiment includes a plurality of light emitting cells. Each of the light emitting cells may include a second conductive semiconductor layer, an active layer on the second conductive semiconductor layer, and a first conductive semiconductor layer on the active layer. Each light emitting cell may include a reflective electrode under the second conductive semiconductor layer.

One of the plurality of light emitting cells may include a contact portion electrically connected to a first conductive semiconductor layer of a first light emitting cell and electrically connected to a second conductive semiconductor layer of a second light emitting cell adjacent to the first light emitting cell. .

According to an embodiment, one end of the second light emitting cell is exposed to the outside and the other end is electrically connected to the second conductive semiconductor layer of the first light emitting cell, and one end of the second light emitting cell is exposed to the outside. It may include a second connection wiring electrically connected to the second conductive semiconductor layer. The contact part may contact an upper surface of the first conductivity type semiconductor layer of the first light emitting cell.

An insulating layer may be disposed between the second conductive semiconductor layer of the first light emitting cell and the second connection wiring. And a channel layer disposed on a portion of the insulating layer, wherein the first region of the second connection wiring is disposed on the channel layer, and the second region of the second connection wiring passes through the channel layer. The third region of the second connection line may pass through the insulating layer.

The electrode may include an electrode electrically connected to the first conductivity-type semiconductor layer of the second light emitting cell. Accordingly, when power is supplied to the first connection wire, the second connection wire, and the electrode, the first light emitting cell and the second light emitting cell are electrically connected to emit light.

Next, a method of manufacturing the light emitting device according to the embodiment will be described with reference to FIGS. 2 to 7.

According to the method of manufacturing the light emitting device according to the embodiment, as shown in FIG. 2, the first conductive semiconductor layer 11a, the active layer 12a, and the second conductive semiconductor layer 13a are formed on the substrate 5. do. The first conductive semiconductor layer 11a, the active layer 12a, and the second conductive semiconductor layer 13a may be defined as a light emitting structure 10a.

The substrate 5 may be formed of, for example, at least one of sapphire substrate (Al ₂ O ₃ ), SiC, GaAs, GaN, ZnO, Si, GaP, InP, Ge, but is not limited thereto. A buffer layer may be further formed between the first semiconductor layer 11 of the first conductivity type and the substrate 5.

For example, the first conductivity type semiconductor layer 11a is formed of an n type semiconductor layer to which an n type dopant is added as a first conductivity type dopant, and the second conductivity type semiconductor layer 13a is a second conductivity type dopant. As a p-type dopant may be formed as a p-type semiconductor layer. In addition, the first conductivity type semiconductor layer 11a may be formed of a p-type semiconductor layer, and the second conductivity type semiconductor layer 13a may be formed of an n-type semiconductor layer.

The first conductivity-type semiconductor layer 11a may include, for example, an n-type semiconductor layer. The first conductive semiconductor layer (11a) is of a semiconductor material having a compositional formula of _{In x Al y Ga 1 -x- y} N (0≤x≤1, 0≤y≤1, 0≤x + y≤1) Can be formed. The first conductive semiconductor layer 11a may be selected from, for example, InAlGaN, GaN, AlGaN, AlInN, InGaN, AlN, InN, and the like, and doped with n-type dopants such as Si, Ge, Sn, Se, Te, or the like. Can be.

In the active layer 12a, electrons (or holes) injected through the first conductive semiconductor layer 11a and holes (or electrons) injected through the second conductive semiconductor layer 13a meet each other. It is a layer that emits light due to a band gap difference of an energy band according to a material forming the active layer 12a. The active layer 12a may be formed of any one of a single quantum well structure, a multi quantum well structure (MQW), a quantum dot structure, or a quantum line structure, but is not limited thereto.

It said active layer (12a) may be formed of a semiconductor material having a compositional formula of _{In x Al y Ga 1 -x- y} N (0≤x≤1, 0≤y≤1, 0≤x + y≤1). When the active layer 12a is formed of the multi quantum well structure, the active layer 12a may be formed by stacking a plurality of well layers and a plurality of barrier layers, for example, an InGaN well layer / GaN barrier layer. It may be formed in a cycle.

The second conductivity-type semiconductor layer 13a may be implemented as, for example, a p-type semiconductor layer. The second conductive type semiconductor layer (13a) is of a semiconductor material having a compositional formula of _{In x Al y Ga 1 -x- y} N (0≤x≤1, 0≤y≤1, 0≤x + y≤1) Can be formed. The second conductive semiconductor layer 13a may be selected from, for example, InAlGaN, GaN, AlGaN, InGaN, AlInN, AlN, InN, and the like, and dopants such as Mg, Zn, Ca, Sr, and Ba may be doped. Can be.

Meanwhile, the first conductivity type semiconductor layer 11a may include a p-type semiconductor layer, and the second conductivity type semiconductor layer 13a may include an n-type semiconductor layer. In addition, a semiconductor layer including an n-type or p-type semiconductor layer may be further formed on the second conductive type semiconductor layer 13a. Thus, the light emitting structure 10a may include a np, pn, npn, Or a structure thereof. In addition, the doping concentrations of the impurities in the first conductive semiconductor layer 11a and the second conductive semiconductor layer 13a may be uniformly or non-uniformly formed. That is, the structure of the light emitting structure 10a may be variously formed, but is not limited thereto.

In addition, a first conductivity type InGaN / GaN superlattice structure or an InGaN / InGaN superlattice structure may be formed between the first conductivity type semiconductor layer 11a and the active layer 12a. In addition, a second conductive AlGaN layer may be formed between the second conductive semiconductor layer 13a and the active layer 12a.

Next, as shown in FIG. 3, current blocking layers 18, 28, 38 and channel layers 16, 36 are formed on the second conductivity-type semiconductor layer 13a.

Subsequently, as shown in FIG. 4, the first ohmic contact layer 15 and the first reflective electrode 17 are formed on the first region of the second conductive semiconductor layer 13a. In addition, a second ohmic contact layer 25 and a second reflective electrode 27 are formed on the second region of the second conductive semiconductor layer 13a, and the third region of the second conductive semiconductor layer 13a is formed. The third ohmic contact layer 35 and the third reflective electrode 37 are formed thereon.

The first ohmic contact layer 15, the second ohmic contact layer 25, and the third ohmic contact layer 35 may be formed of, for example, a transparent conductive oxide layer. The first ohmic contact layer 15, the second ohmic contact layer 25, and the third ohmic contact layer 35 are, for example, indium tin oxide (ITO), indium zinc oxide (IZO), and aluminum zinc (AZO). Oxide), Aluminum Gallium Zinc Oxide (AGZO), Indium Zinc Tin Oxide (IZTO), Indium Aluminum Zinc Oxide (IAZO), Indium Gallium Zinc Oxide (IGZO), Indium Gallium Tin Oxide (IGTO), Antimony Tin Oxide (ATO), It may be formed of at least one material selected from gallium zinc oxide (GZO), IZO (IZO Nitride), ZnO, IrOx, RuOx, NiO, Pt, Ag.

The first reflective electrode 17, the second reflective electrode 27, and the third reflective electrode 37 may be formed of a metal material having high reflectance. For example, the first reflection electrode 17, the second reflection electrode 27, and the third reflection electrode 37 may be formed of Ag, Ni, Al, Rh, Pd, Ir, Ru, Mg, Zn, Pt, Cu, It may be formed of a metal or an alloy containing at least one of Au and Hf. In addition, the first reflection electrode 17, the second reflection electrode 27, and the third reflection electrode 37 may be formed of the metal or the alloy, indium tin oxide (ITO), or indium zinc oxide (IZO). ), Indium-Zinc-Tin-Oxide (IZTO), Indium-Aluminum-Zinc-Oxide (IAZO), Indium-Gallium-Zinc-Oxide (IGZO), Indium-Gallium-Tin-Oxide (IGTO), Aluminum- It may be formed in multiple layers using a light transmissive conductive material such as Zinc-Oxide) or ATO (Antimony-Tin-Oxide). For example, the first reflective electrode 17, the second reflective electrode 27, and the third reflective electrode 37 may be formed of Ag, Al, Ag-Pd-Cu alloy, or Ag-Cu. It may include at least one of the alloys.

In addition, as illustrated in FIG. 4, a first metal layer 19 is formed on the first reflective electrode 17, a second metal layer 29 is formed on the second reflective electrode 27, and the second The third metal layer 39 is formed on the third reflective electrode 37. Subsequently, a fourth insulating layer 40 is formed on the first metal layer 19, the second metal layer 29, and the third metal layer 39.

Meanwhile, the process of forming each layer described above is one example, and the process order may be variously modified.

Next, as shown in FIG. 5, a second connection wire 92a is electrically connected to the second metal layer 27. In addition, a fifth insulating layer 45 is formed on the second connection wiring 92a, and a third connection wiring 93a is formed on the fifth insulating layer 45.

Subsequently, as shown in FIG. 6, a sixth insulating layer 47 is formed on the third connection wiring 93a. The diffusion barrier layer 50, the bonding layer 60, and the support member 70 are formed on the sixth insulating layer 47.

In the diffusion barrier layer 50, a material included in the bonding layer 60 may be formed in the process of providing the bonding layer 60 with the first reflecting electrode 17, the second reflecting electrode 27, and the first reflecting layer 60. A function of preventing diffusion in the direction of the three reflective electrodes 37 may be performed. The diffusion barrier layer 50 may prevent a material such as tin (Sn) included in the bonding layer 60 from affecting the first reflective electrode 17 or the like. The diffusion barrier layer 50 may include at least one of Cu, Ni, Ti-W, W, and Pt materials.

The bonding layer 60 may include a barrier metal or a bonding metal, and may include, for example, at least one of Ti, Au, Sn, Ni, Cr, Ga, In, Bi, Cu, Ag, or Ta. . The support member 70 may support the light emitting device according to the embodiment.

The supporting member 70 may be a semiconductor substrate (for example, Si, Ge, GaN, GaAs, or the like) into which Ti, Cr, Ni, Al, Pt, Au, W, Cu, Mo, Cu- ZnO, SiC, SiGe, and the like). In addition, the support member 70 may be implemented with an insulating material. The support member 70 may be made of a material such as Al ₂ O ₃ , SiO ₂ .

Next, the substrate 5 is removed from the first conductivity type semiconductor layer 11a. As one example, the substrate 5 may be removed by a laser lift off (LLO) process. The laser lift-off process LLO is a process of irradiating a lower surface of the substrate 5 to peel the substrate 5 and the first conductive semiconductor layer 11a from each other.

As illustrated in FIG. 7, an isolation etching is performed to separate the first light emitting structure 10, the second light emitting structure 20, and the third light emitting structure 30. The isolation etching can be performed by, for example, dry etching such as ICP (Inductively Coupled Plasma), but is not limited thereto. Partial regions of the first channel layer 16, the second channel layer 26, and the third channel layer 36 may be exposed by the isolation etching.

In addition, a light extraction pattern may be provided on an upper surface of the first light emitting structure 10, the second light emitting structure 20, and the third light emitting structure 30. Concave-convex patterns may be provided on upper surfaces of the first light emitting structure 10, the second light emitting structure 20, and the third light emitting structure 30. Accordingly, according to the embodiment, the effect of extracting external light can be increased. According to the embodiment, the upper surface of the first light emitting structure 10, the second light emitting structure 20, the third light emitting structure 30 may be formed in the N plane, when the Ga surface Compared with the surface roughness, the light extraction efficiency can be further improved.

Next, as shown in FIG. 7, the first insulating layer 41, the second insulating layer 51, and the third insulating layer 61 may be formed. The first insulating layer 41 may be formed around the first light emitting structure 10. The first insulating layer 41 may be formed on the first light emitting structure 10. The second insulating layer 51 may be formed around the second light emitting structure 20. The second insulating layer 51 may be formed on the second light emitting structure 20. The third insulating layer 61 may be formed around the third light emitting structure 30. The third insulating layer 61 may be formed on the third light emitting structure 30.

In addition, the first contact portion 43 and the second contact portion 53 may be formed. The first contact portion 43 may be disposed between the first light emitting structure 10 and the second light emitting structure 20. A second contact portion 53 may be disposed between the second light emitting structure 20 and the third light emitting structure 30.

The first contact portion 43 electrically connects the first conductive layer 11 of the first conductivity type to the second reflective electrode 27. The first contact portion 43 may contact an upper portion of the first semiconductor layer 11 of the first conductivity type. The first contact portion 43 may be in contact with the second metal layer 29. The first contact portion 43 may be in contact with the second metal layer 29. The first contact portion 43 may be electrically connected to the fourth semiconductor layer 23 of the second conductivity type. The first semiconductor layer 11 of the first conductivity type may be electrically connected to the fourth semiconductor layer 23 of the second conductivity type through the first contact portion 43.

The first contact portion 43 may be formed of at least one material selected from, for example, Cr, Al, Ti, Ni, Pt, and V. In addition, the first contact portion 43 may be formed of, for example, a transparent conductive oxide layer. The first contact portion 43 may include, for example, indium tin oxide (ITO), indium zinc oxide (IZO), aluminum zinc oxide (AZO), aluminum gallium zinc oxide (AGZO), indium zinc tin oxide (IZTO), and IAZO ( Among Indium Aluminum Zinc Oxide (IGZO), Indium Gallium Zinc Oxide (IGZO), Indium Gallium Tin Oxide (IGTO), Antimony Tin Oxide (ATO), Gallium Zinc Oxide (GZO), IZON (IZO Nitride), ZnO, IrOx, RuOx, NiO It may be formed of at least one material selected.

The first contact portion 43 may contact an upper portion of the first semiconductor layer 11 of the first conductivity type. For example, the first semiconductor layer 11 of the first conductivity type may be implemented including a GaN layer. In this case, considering the growth direction and the etching direction of the semiconductor layer, the first contact portion 43 may be in contact with the N face (N face) of the first semiconductor layer 11 of the first conductivity type.

The first insulating layer 41 may be disposed between the first contact portion 43 and the second semiconductor layer 13 of the second conductivity type. The first insulating layer 41 may be disposed between the first contact portion 43 and the first active layer 12. Some regions of the first contact portion 43 may be disposed on the first insulating layer 41. The first contact portion 43 may be in contact with the top and side surfaces of the first insulating layer 41.

The second contact portion 53 electrically connects the third conductive layer 21 of the first conductivity type to the third reflective electrode 37. The second contact portion 53 may contact the upper portion of the third semiconductor layer 21 of the first conductivity type. The second contact portion 53 may be in contact with the third metal layer 39. The second contact portion 53 may be in contact with the third metal layer 39. The second contact portion 53 may be electrically connected to the sixth semiconductor layer 33 of the second conductivity type. The third semiconductor layer 21 of the first conductivity type may be electrically connected to the sixth semiconductor layer 33 of the second conductivity type through the second contact portion 53.

The second contact portion 53 may be formed of at least one material selected from, for example, Cr, Al, Ti, Ni, Pt, and V. In addition, the second contact portion 53 may be formed of, for example, a transparent conductive oxide layer. The second contact portion 53 may be formed of, for example, indium tin oxide (ITO), indium zinc oxide (IZO), aluminum zinc oxide (AZO), aluminum gallium zinc oxide (AGZO), indium zinc tin oxide (IZTO) or IAZO Among Indium Aluminum Zinc Oxide (IGZO), Indium Gallium Zinc Oxide (IGZO), Indium Gallium Tin Oxide (IGTO), Antimony Tin Oxide (ATO), Gallium Zinc Oxide (GZO), IZON (IZO Nitride), ZnO, IrOx, RuOx, NiO It may be formed of at least one material selected.

The second contact portion 53 may contact the upper portion of the third semiconductor layer 21 of the first conductivity type. For example, the third semiconductor layer 21 of the first conductivity type may be implemented including a GaN layer. In this case, considering the growth direction and the etching direction of the semiconductor layer, the second contact portion 53 may contact the N face of the third semiconductor layer 21 of the first conductivity type.

In addition, as shown in FIG. 7, an electrode 80 may be formed on the fifth semiconductor layer 31 of the first conductivity type. The electrode 80 may be electrically connected to the fifth semiconductor layer 31 of the first conductivity type. The electrode 80 may be in contact with an upper surface of the fifth semiconductor layer 31 of the first conductivity type.

First connection wires 91 electrically connected to the first reflective electrodes 17 may be formed. One end of the first connection line 91 may be exposed to the outside. One end of the first connection line 91 may be exposed on the first channel layer 16. The other end of the first connection line 91 may be electrically connected to the first reflective electrode 17. The other end of the first connection line 91 may be in contact with the first metal layer 19. A portion of the first connection line 91 may contact the upper surface of the first metal layer 19.

A second connection wire 92 may be formed to be electrically connected to the second reflective electrode 27. One end of the second connection line 92 may be exposed to the outside. One end of the second connection line 92 may be exposed on the upper portion of the first channel layer 16. The other end of the second connection line 92 may be electrically connected to the second reflective electrode 27. The other end of the second connection line 92 may be in contact with the second metal layer 29. A portion of the second connection line 92 may contact the bottom surface of the second metal layer 29. The fourth insulating layer 40 may be disposed between the second connection line 92 and the first metal layer 19. The first region of the second connection line 92 may be disposed on the first channel layer 16. The second region of the second connection line 92 may pass through the first channel layer 16. The third region of the second connection line 92 may pass through the fourth insulating layer 40. The fourth region of the second connection line 92 may contact the bottom surface of the fourth insulating layer 40.

A third connection wiring 93 electrically connected to the third reflective electrode 37 may be formed. One end of the third connection line 93 may be exposed to the outside. One end of the third connection line 93 may be exposed on the upper portion of the first channel layer 16. The other end of the third connection line 93 may be electrically connected to the third reflective electrode 37. The other end of the third connection line 93 may be in contact with the third metal layer 39. A portion of the third connection line 93 may contact the lower surface of the third metal layer 39. A fifth insulating layer 45 may be disposed between the third connection line 93 and the second connection line 92. The first region of the third connection line 93 may be disposed on the first channel layer 16. The second region of the third connection line 93 may pass through the first channel layer 16. The third region of the third connection line 93 may pass through the fourth insulating layer 40. The fourth region of the third connection wiring 93 may be in contact with the lower surface of the fifth insulating layer 45.

According to an embodiment, the first connection line 91, the second connection line 92, the third connection line 93, and the electrode 80 may be implemented in a multilayer structure. The first connection wire 91, the second connection wire 92, the third connection wire 93, and the electrode 80 may be implemented as an ohmic contact layer, an intermediate layer, and an upper layer. The ohmic contact layer may implement an ohmic contact by including a material selected from Cr, V, W, Ti, and Zn. The intermediate layer may be formed of a material selected from Ni, Cu, Al, and the like. The upper layer may comprise, for example, Au.

According to an embodiment, the light emitting structures may be electrically connected to each other through the first contact portion 43 and the second contact portion 53. In addition, according to an embodiment, the first connecting wire 91, the second connecting wire 92, the third connecting wire 93, and the electrode 80 may be electrically connected to an external terminal through wire bonding. Can be.

That is, the first connection wire 91, the second connection wire 92, and the third connection wire 93 may be supplied with power through an external terminal and wire bonding in an externally exposed area. The second reflecting electrode 27 may be electrically connected to the first semiconductor layer 11 of the first conductivity type and may be electrically connected to the second connection line 92. The third reflective electrode 37 may be electrically connected to the third semiconductor layer 21 of the first conductivity type and may be electrically connected to the third connection line 93.

Accordingly, an operating voltage of each light emitting structure may be selected through selective power connection to the first connection line 91, the second connection line 92, and the third connection line 93. According to the embodiment, it is possible to implement a plurality of light emitting structures having various voltages in one light emitting device, and to secure a process margin for the operating voltage.

In example embodiments, the fourth insulating layer 40 may be formed under the first metal layer 19, the second metal layer 29, and the third metal layer 39. Accordingly, the fourth insulating layer 40 can stably support the first light emitting structure 10, the second light emitting structure 20, and the third light emitting structure 30 without any step between the components. do.

Accordingly, in the case of the high voltage vertical light emitting device using the conventional vertical light emitting device, there is a case in which a depression occurs due to the step in the process of attaching the supporting substrate 70, etc., according to the present embodiment. Can be prevented. In addition, in the case of a high-voltage vertical light emitting device using a conventional vertical light emitting device, a short is generated between light emitting cells when the chip is arranged. In this embodiment, a short between light emitting cells is generated. It can be prevented from occurring. Accordingly, according to the embodiment, it is possible to improve the electrical reliability of the light emitting device.

8 is a view showing another example of the light emitting device according to the embodiment. In the description of the light emitting device according to the exemplary embodiment illustrated in FIG. 8, the description of parts overlapping with those described with reference to FIG. 1 will be omitted.

According to an embodiment, the first contact portion 63 may be electrically connected to the lower surface of the first semiconductor layer 11 of the first conductivity type. One end of the first contact portion 63 may contact the bottom surface of the first semiconductor layer 11 of the first conductivity type. The other end of the first contact portion 63 may be electrically connected to the second metal layer 29. The first contact portion 63 may be electrically connected to the second reflective electrode 27. A seventh insulating layer 61 may be disposed between the first contact portion 63 and the first active layer 12. The seventh insulating layer 61 may be disposed between the first contact portion 63 and the second semiconductor layer 13 of the second conductivity type.

According to an embodiment, the second contact portion 73 may be electrically connected to the lower surface of the third semiconductor layer 21 of the first conductivity type. One end of the second contact portion 73 may be in contact with a lower surface of the third semiconductor layer 21 of the first conductivity type. The other end of the second contact portion 73 may be electrically connected to the third metal layer 39. The second contact portion 73 may be electrically connected to the third reflective electrode 37. An eighth insulating layer 71 may be disposed between the second contact portion 73 and the second active layer 22. The eighth insulating layer 71 may be disposed between the second contact portion 73 and the fourth semiconductor layer 23 of the second conductivity type.

The first contact portion 63 and the second contact portion 73 may be, for example, indium tin oxide (ITO), indium zinc oxide (IZO), aluminum zinc oxide (AZO), aluminum gallium zinc oxide (AGZO), or IZTO. (Indium Zinc Tin Oxide), IAZO (Indium Aluminum Zinc Oxide), IGZO (Indium Gallium Zinc Oxide), IGTO (Indium Gallium Tin Oxide), Antimony Tin Oxide (ATO), Gallium Zinc Oxide (GZO), IZON (IZO Nitride) , ZnO, IrOx, RuOx, NiO may be formed of at least one material selected from.

The first contact portion 63 may be in contact with the first semiconductor layer 11 of the first conductivity type. The second contact portion 73 may be in contact with the third semiconductor layer 21 of the first conductivity type. For example, the first semiconductor layer 11 of the first conductivity type may be implemented including a GaN layer. In addition, the first conductive third semiconductor layer 21 may be implemented to include a GaN layer. In this case, considering the growth direction and the etching direction of the semiconductor layer, the first contact portion 63 is in contact with a Ga face of the first semiconductor layer 11 of the first conductivity type, and the second The contact portion 73 may be in contact with a Ga face of the third semiconductor layer 21 of the first conductivity type. Accordingly, the first contact portion 63 and the second contact portion 73 can secure excellent and stable operating voltage characteristics.

According to an embodiment, the light emitting structures adjacent to each other may be electrically connected through the first contact portion 63 and the second contact portion 73. In addition, according to an embodiment, the first connecting wire 91, the second connecting wire 92, the third connecting wire 93, and the electrode 80 may be electrically connected to an external terminal through wire bonding. Can be.

That is, the first connection wire 91, the second connection wire 92, and the third connection wire 93 may be supplied with power through an external terminal and wire bonding in an externally exposed area. The second reflecting electrode 27 may be electrically connected to the first semiconductor layer 11 of the first conductivity type and may be electrically connected to the second connection line 92. The third reflective electrode 37 may be electrically connected to the third semiconductor layer 21 of the first conductivity type and may be electrically connected to the third connection line 93.

Accordingly, an operating voltage of each light emitting structure may be selected through selective power connection to the first connection line 91, the second connection line 92, and the third connection line 93. According to the embodiment, it is possible to implement a plurality of light emitting structures having various voltages in one light emitting device, and to secure a process margin for the operating voltage.

In example embodiments, the fourth insulating layer 40 may be formed under the first metal layer 19, the second metal layer 29, and the third metal layer 39. Accordingly, the fourth insulating layer 40 can stably support the first light emitting structure 10, the second light emitting structure 20, and the third light emitting structure 30 without any step between the components. do.

Accordingly, in the case of the high voltage vertical light emitting device using the conventional vertical light emitting device, there is a case in which a depression occurs due to the step in the process of attaching the supporting substrate 70, etc., according to the present embodiment. Can be prevented. In addition, in the case of a high-voltage vertical light emitting device using a conventional vertical light emitting device, a short is generated between light emitting cells when the chip is arranged. In this embodiment, a short between light emitting cells is generated. It can be prevented from occurring. Accordingly, according to the embodiment, it is possible to improve the electrical reliability of the light emitting device.

9 is a view showing another example of a light emitting device according to the embodiment. In the description of the light emitting device according to the exemplary embodiment illustrated in FIG. 9, the description of parts overlapping with those described with reference to FIG. 1 will be omitted.

According to the light emitting device according to the embodiment, the first ohmic reflective electrode 81 may be disposed under the first light emitting structure 10. The first ohmic reflective electrode 81 may be implemented to perform the functions of both the first reflective electrode 17 and the first ohmic contact layer 15 described with reference to FIG. 1. Accordingly, the first ohmic reflective electrode 81 is in ohmic contact with the second semiconductor layer 13 of the second conductivity type, and may function to reflect light incident from the first light emitting structure 10. have.

In addition, a second ohmic reflective electrode 83 may be disposed under the second light emitting structure 20. The second ohmic reflective electrode 83 may be implemented to perform both the functions of the second reflective electrode 27 and the second ohmic contact layer 25 described with reference to FIG. 1. Accordingly, the second ohmic reflective electrode 83 is in ohmic contact with the fourth semiconductor layer 23 of the second conductivity type, and may function to reflect light incident from the second light emitting structure 20. have.

In addition, a third ohmic reflective electrode 85 may be disposed under the third light emitting structure 30. The third ohmic reflective electrode 85 may be implemented to perform both the functions of the third reflective electrode 37 and the third ohmic contact layer 35 described with reference to FIG. 1. Accordingly, the third ohmic reflective electrode 85 may be in ohmic contact with the sixth semiconductor layer 33 of the second conductivity type, and may reflect a light incident from the third light emitting structure 30. have.

According to an embodiment, the light emitting structures may be electrically connected to each other through the first contact portion 43 and the second contact portion 53. In addition, according to an embodiment, the first connecting wire 91, the second connecting wire 92, the third connecting wire 93, and the electrode 80 may be electrically connected to an external terminal through wire bonding. Can be.

That is, the first connection wire 91, the second connection wire 92, and the third connection wire 93 may be supplied with power through an external terminal and wire bonding in an externally exposed area. The second reflecting electrode 27 may be electrically connected to the first semiconductor layer 11 of the first conductivity type and may be electrically connected to the second connection line 92. The third reflective electrode 37 may be electrically connected to the third semiconductor layer 21 of the first conductivity type and may be electrically connected to the third connection line 93.

Accordingly, an operating voltage of each light emitting structure may be selected through selective power connection to the first connection line 91, the second connection line 92, and the third connection line 93.

For example, when a power source is connected to the first connection wire 91 and the electrode 80, the first light emitting structure 10, the second light emitting structure 20, and the third light emitting structure are operated at an operating voltage V1. 30 can be emitted. When the power source is connected to the second connection line 92 and the electrode 80, the second light emitting structure 20 and the third light emitting structure 30 may emit light at an operating voltage V2. At this time, for example, the voltage of V1 may have a larger value than that of V2. In addition, when a power source is connected to the third connection line 93 and the electrode 80, the third light emitting structure 30 may emit light at an operating voltage V3. At this time, for example, the voltage of V2 may have a larger value than that of V3.

In addition, although only three light emitting cells are illustrated in the embodiment, four or more connection wirings connected to the light emitting cells and the reflective electrodes of the light emitting cells may be formed to operate similarly to those described above. In addition, different power sources of the respective connection wires may be connected to control the operating voltage of each light emitting structure.

According to the embodiment, it is possible to implement a plurality of light emitting structures having various voltages in one light emitting device, and to secure a process margin for the operating voltage.

In example embodiments, the fourth insulating layer 40 may be formed under the first metal layer 19, the second metal layer 29, and the third metal layer 39. Accordingly, the fourth insulating layer 40 can stably support the first light emitting structure 10, the second light emitting structure 20, and the third light emitting structure 30 without any step between the components. do.

Accordingly, in the case of the high voltage vertical light emitting device using the conventional vertical light emitting device, there is a case in which a depression occurs due to the step in the process of attaching the supporting substrate 70, etc., according to the present embodiment. Can be prevented. In addition, in the case of a high-voltage vertical light emitting device using a conventional vertical light emitting device, a short is generated between light emitting cells when the chip is arranged. In this embodiment, a short between light emitting cells is generated. It can be prevented from occurring. Accordingly, according to the embodiment, it is possible to improve the electrical reliability of the light emitting device.

10 is a view showing another example of a light emitting device according to the embodiment. In the description of the light emitting device according to the exemplary embodiment illustrated in FIG. 10, a description of parts overlapping with those described with reference to FIG. 8 will be omitted.

According to the light emitting device according to the embodiment, the first ohmic reflective electrode 81 may be disposed under the first light emitting structure 10. The first ohmic reflective electrode 81 may be implemented to perform the functions of both the first reflective electrode 17 and the first ohmic contact layer 15 described with reference to FIG. 8. Accordingly, the first ohmic reflective electrode 81 is in ohmic contact with the second semiconductor layer 13 of the second conductivity type, and may function to reflect light incident from the first light emitting structure 10. have.

In addition, a second ohmic reflective electrode 83 may be disposed under the second light emitting structure 20. The second ohmic reflective electrode 83 may be implemented to perform both the functions of the second reflective electrode 27 and the second ohmic contact layer 25 described with reference to FIG. 8. Accordingly, the second ohmic reflective electrode 83 is in ohmic contact with the fourth semiconductor layer 23 of the second conductivity type, and may function to reflect light incident from the second light emitting structure 20. have.

In addition, a third ohmic reflective electrode 85 may be disposed under the third light emitting structure 30. The third ohmic reflective electrode 85 may be implemented to perform both the functions of the third reflective electrode 37 and the third ohmic contact layer 35 described with reference to FIG. 8. Accordingly, the third ohmic reflective electrode 85 may be in ohmic contact with the sixth semiconductor layer 33 of the second conductivity type, and may reflect a light incident from the third light emitting structure 30. have.

According to an embodiment, the light emitting structures adjacent to each other may be electrically connected through the first contact portion 63 and the second contact portion 73. In addition, according to an embodiment, the first connecting wire 91, the second connecting wire 92, the third connecting wire 93, and the electrode 80 may be electrically connected to an external terminal through wire bonding. Can be.

That is, the first connection wire 91, the second connection wire 92, and the third connection wire 93 may be supplied with power through an external terminal and wire bonding in an externally exposed area. The second reflecting electrode 27 may be electrically connected to the first semiconductor layer 11 of the first conductivity type and may be electrically connected to the second connection line 92. The third reflective electrode 37 may be electrically connected to the third semiconductor layer 21 of the first conductivity type and may be electrically connected to the third connection line 93.

Accordingly, an operating voltage of each light emitting structure may be selected through selective power connection to the first connection line 91, the second connection line 92, and the third connection line 93. According to the embodiment, it is possible to implement a plurality of light emitting structures having various voltages in one light emitting device, and to secure a process margin for the operating voltage.

In example embodiments, the fourth insulating layer 40 may be formed under the first metal layer 19, the second metal layer 29, and the third metal layer 39. Accordingly, the fourth insulating layer 40 can stably support the first light emitting structure 10, the second light emitting structure 20, and the third light emitting structure 30 without any step between the components. do.

Accordingly, in the case of the high voltage vertical light emitting device using the conventional vertical light emitting device, there is a case in which a depression occurs due to the step in the process of attaching the supporting substrate 70, etc., according to the present embodiment. Can be prevented. In addition, in the case of a high-voltage vertical light emitting device using a conventional vertical light emitting device, a short is generated between light emitting cells when the chip is arranged. In this embodiment, a short between light emitting cells is generated. It can be prevented from occurring. Accordingly, according to the embodiment, it is possible to improve the electrical reliability of the light emitting device.

11 is a view showing another example of a light emitting device according to the embodiment. In the description of the light emitting device according to the exemplary embodiment illustrated in FIG. 11, the description of parts overlapping with those described with reference to FIG. 1 will be omitted.

The light emitting device according to the embodiment may further include a partition wall 95, as shown in FIG. 11. The partition wall 95 may be disposed around the first connection line 91, the second connection line 92, and the third connection line 93. For example, the barrier 95 may be formed of an insulator including an oxide or a nitride. The partition wall 95 prevents a short between adjacent wires when a wire is connected to the first connection wire 91, the second connection wire 92, and the third connection wire 93. can do. The partition wall 95 may be formed together when the first insulating layer 41, the second insulating layer 51, and the third insulating layer 61 are formed, or may be formed by a separate process.

12 is a view showing another example of a light emitting device according to the embodiment. In the description of the light emitting device according to the exemplary embodiment illustrated in FIG. 12, a description of portions overlapping with those described with reference to FIG. 8 will be omitted.

The light emitting device according to the embodiment may further include a partition wall 95, as shown in FIG. The partition wall 95 may be disposed around the first connection line 91, the second connection line 92, and the third connection line 93. For example, the barrier 95 may be formed of an insulator including an oxide or a nitride. The partition wall 95 prevents a short between the adjacent wires when a wire is connected to the first connection wire 91, the second connection wire 92, and the third connection wire 93. can do. The partition wall 95 may be formed together when the first insulating layer 41, the second insulating layer 51, and the third insulating layer 61 are formed, or may be formed by a separate process.

13 is a view showing a light emitting device package to which the light emitting device according to the embodiment is applied.

Referring to FIG. 13, the light emitting device package according to the embodiment may include a body 120, a first lead electrode 131 and a second lead electrode 132 disposed on the body 120, and the body 120. The light emitting device 100 according to the embodiment, which is provided to and electrically connected to the first lead electrode 131 and the second lead electrode 132, and the molding member 140 surrounding the light emitting device 100. Include.

The body 120 may include a silicon material, a synthetic resin material, or a metal material, and an inclined surface may be formed around the light emitting device 100.

The first lead electrode 131 and the second lead electrode 132 are electrically separated from each other, and provide power to the light emitting device 100. In addition, the first lead electrode 131 and the second lead electrode 132 may increase light efficiency by reflecting light generated from the light emitting device 100, and heat generated from the light emitting device 100. It may also play a role in discharging it to the outside.

The light emitting device 100 may be disposed on the body 120 or on the first lead electrode 131 or the second lead electrode 132.

The light emitting device 100 may be electrically connected to the first lead electrode 131 and the second lead electrode 132 by any one of a wire method, a flip chip method, and a die bonding method.

The molding member 140 may surround the light emitting device 100 to protect the light emitting device 100. In addition, the molding member 140 may include a phosphor to change the wavelength of light emitted from the light emitting device 100.

A plurality of light emitting devices or light emitting device packages may be arranged on a substrate, and an optical member such as a lens, a light guide plate, a prism sheet, and a diffusion sheet may be disposed on an optical path of the light emitting device package. Such a light emitting device package, a substrate, and an optical member can function as a light unit. The light unit may be implemented as a top view or a side view type and may be provided in a display device such as a portable terminal and a notebook computer, or may be variously applied to a lighting device and a pointing device. Still another embodiment may be embodied as a lighting device including the light emitting device or the light emitting device package described in the above embodiments. For example, the lighting device may include a lamp, a streetlight, an electric signboard, and a headlight.

The light emitting device according to the embodiment may be applied to the light unit. The light unit may include a structure in which a plurality of light emitting elements are arranged, and may include the display device illustrated in FIGS. 14 and 15 and the illumination device illustrated in FIG. 16.

Referring to FIG. 14, the display device 1000 according to the embodiment includes a light guide plate 1041, a light emitting module 1031 that provides light to the light guide plate 1041, and a reflective member 1022 under the light guide plate 1041. ), An optical sheet 1051 on the light guide plate 1041, a display panel 1061, a light guide plate 1041, a light emitting module 1031, and a reflective member 1022 on the optical sheet 1051. The bottom cover 1011 may be included, but is not limited thereto.

The bottom cover 1011, the reflective sheet 1022, the light guide plate 1041, and the optical sheet 1051 can be defined as a light unit 1050.

The light guide plate 1041 diffuses light to serve as a surface light source. The light guide plate 1041 is made of a transparent material, for example, acrylic resin-based such as polymethyl metaacrylate (PMMA), polyethylene terephthlate (PET), polycarbonate (PC), cycloolefin copolymer (COC), and polyethylene naphthalate (PEN). It may include one of the resins.

The light emitting module 1031 provides light to at least one side of the light guide plate 1041, and ultimately serves as a light source of the display device.

At least one light emitting module 1031 may be provided, and light may be provided directly or indirectly from one side of the light guide plate 1041. The light emitting module 1031 may include a substrate 1033 and a light emitting device or a light emitting device package 200 according to the embodiment described above. The light emitting device package 200 may be arrayed on the substrate 1033 at predetermined intervals.

The substrate 1033 may be a printed circuit board (PCB) including a circuit pattern. However, the substrate 1033 may include not only a general PCB but also a metal core PCB (MCPCB, Metal Core PCB), a flexible PCB (FPCB, Flexible PCB) and the like, but is not limited thereto. When the light emitting device package 200 is provided on the side surface of the bottom cover 1011 or on the heat dissipation plate, the substrate 1033 may be removed. Here, a part of the heat dissipation plate may contact the upper surface of the bottom cover 1011.

In addition, the plurality of light emitting device packages 200 may be mounted such that an emission surface from which light is emitted is spaced apart from the light guide plate 1041 by a predetermined distance, but is not limited thereto. The light emitting device package 200 may directly or indirectly provide light to a light incident portion that is one side of the light guide plate 1041, but is not limited thereto.

The reflective member 1022 may be disposed under the light guide plate 1041. The reflective member 1022 may improve the luminance of the light unit 1050 by reflecting light incident to the lower surface of the light guide plate 1041 and pointing upward. The reflective member 1022 may be formed of, for example, PET, PC, or PVC resin, but is not limited thereto. The reflective member 1022 may be an upper surface of the bottom cover 1011, but is not limited thereto.

The bottom cover 1011 may house the light guide plate 1041, the light emitting module 1031, the reflective member 1022, and the like. To this end, the bottom cover 1011 may be provided with a housing portion 1012 having a box-like shape with an opened upper surface, but the present invention is not limited thereto. The bottom cover 1011 may be combined with the top cover, but is not limited thereto.

The bottom cover 1011 may be formed of a metal material or a resin material, and may be manufactured using a process such as press molding or extrusion molding. In addition, the bottom cover 1011 may include a metal or a non-metal material having good thermal conductivity, but the present invention is not limited thereto.

The display panel 1061 is, for example, an LCD panel, including first and second transparent substrates facing each other, and a liquid crystal layer interposed between the first and second substrates. A polarizing plate may be attached to at least one surface of the display panel 1061, but the present invention is not limited thereto. The display panel 1061 displays information by light passing through the optical sheet 1051. The display device 1000 may be applied to various portable terminals, monitors of notebook computers, monitors of laptop computers, televisions, and the like.

The optical sheet 1051 is disposed between the display panel 1061 and the light guide plate 1041 and includes at least one light transmissive sheet. The optical sheet 1051 may include at least one of a sheet such as, for example, a diffusion sheet, a horizontal and vertical prism sheet, and a brightness enhancement sheet. The diffusion sheet diffuses the incident light, the horizontal and / or vertical prism sheet focuses the incident light into the display area, and the brightness enhancement sheet reuses the lost light to improve the brightness. A protective sheet may be disposed on the display panel 1061, but the present invention is not limited thereto.

Here, the optical path of the light emitting module 1031 may include the light guide plate 1041 and the optical sheet 1051 as an optical member, but the present invention is not limited thereto.

15 is a diagram illustrating another example of a display device according to an exemplary embodiment.

Referring to FIG. 15, the display device 1100 includes a bottom cover 1152, a substrate 1020 on which the light emitting device 100 disclosed above is arranged, an optical member 1154, and a display panel 1155.

The substrate 1020 and the light emitting device package 200 may be defined as a light emitting module 1060. The bottom cover 1152, at least one light emitting module 1060, and the optical member 1154 may be defined as a light unit.

The bottom cover 1152 may include an accommodating part 1153, but is not limited thereto.

Here, the optical member 1154 may include at least one of a lens, a light guide plate, a diffusion sheet, a horizontal and vertical prism sheet, and a brightness enhancement sheet. The light guide plate may be made of a PC material or a poly methy methacrylate (PMMA) material, and the light guide plate may be removed. The diffusion sheet diffuses the incident light, the horizontal and vertical prism sheets focus the incident light onto the display area, and the brightness enhancement sheet reuses the lost light to improve the brightness.

The optical member 1154 is disposed on the light emitting module 1060, and performs surface light source, diffusion, condensing, etc. of the light emitted from the light emitting module 1060.

16 is a perspective view of a lighting apparatus according to the embodiment.

Referring to FIG. 16, the lighting device 1500 may include a case 1510, a light emitting module 1530 installed in the case 1510, and a connection terminal installed in the case 1510 and receiving power from an external power source. 1520).

The case 1510 may be formed of a material having good heat dissipation, and may be formed of, for example, a metal material or a resin material.

The light emitting module 1530 may include a substrate 1532 and a light emitting device or a light emitting device package 200 according to an embodiment provided on the substrate 1532. The plurality of light emitting device packages 200 may be arranged in a matrix form or spaced apart at predetermined intervals.

The substrate 1532 may be a circuit pattern printed on an insulator. For example, a general printed circuit board (PCB), a metal core PCB, a flexible PCB, a ceramic PCB, FR-4 substrates and the like.

In addition, the substrate 1532 may be formed of a material that reflects light efficiently, or a surface may be coated with a color, for example, white or silver, in which the light is efficiently reflected.

At least one light emitting device package 200 may be disposed on the substrate 1532. Each of the light emitting device packages 200 may include at least one light emitting diode (LED) chip. The LED chip may include a colored light emitting diode emitting red, green, blue or white colored light, and a UV emitting diode emitting ultraviolet (UV) light.

The light emitting module 1530 may be arranged to have a combination of various light emitting device packages 200 to obtain color and luminance. For example, a white light emitting diode, a red light emitting diode, and a green light emitting diode may be combined to secure high color rendering (CRI).

The connection terminal 1520 may be electrically connected to the light emitting module 1530 to supply power. The connection terminal 1520 is coupled to an external power source in a socket manner, but is not limited thereto. For example, the connection terminal 1520 may be formed in a pin shape and inserted into an external power source, or may be connected to the external power source by a wire.

According to the embodiment, the light emitting device may be packaged and mounted on the substrate to be implemented as a light emitting module, or may be mounted and packaged as an LED chip to be implemented as a light emitting module.

Features, structures, effects, and the like described in the above embodiments are included in at least one embodiment of the present invention, and are not necessarily limited to only one embodiment. Further, the features, structures, effects, and the like illustrated in the embodiments can be combined and modified by other persons having ordinary skill in the art to which the embodiments belong. Therefore, it should be understood that the present invention is not limited to these combinations and modifications.

In addition, the above description has been made with reference to the embodiments, which are merely exemplary and are not intended to limit the present invention. Those skilled in the art to which the present invention pertains will be illustrated above in the range without departing from the essential characteristics of the present embodiment. It will be appreciated that various modifications and applications are possible. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

10: first light emitting structure 11: first semiconductor layer
12: first active layer 13: second semiconductor layer
15: first ohmic contact layer 17: first reflective electrode
19: first metal layer 20: second light emitting structure
21: third semiconductor layer 22: second active layer
23: fourth semiconductor layer 25: second ohmic contact layer
27: second reflective electrode 29: second metal layer
30: third light emitting structure 31: fifth semiconductor layer
32: third active layer 33: sixth semiconductor layer
35: third ohmic contact layer 37: third reflective electrode
39: third metal layer 40: fourth insulating layer
41: first insulating layer 43: first contact portion
45: fifth insulating layer 47: sixth insulating layer
50: diffusion barrier layer 51: second insulating layer
53: second contact portion 60: bonding layer
61: third insulating layer 70: support member
80: electrode 91: first connection wiring
92: second connection wiring 93: third connection wiring

Claims (16)

A first light emitting structure comprising a first semiconductor layer of a first conductivity type, a first active layer under the first conductive layer of the first conductivity type, and a second semiconductor layer of a second conductivity type under the first active layer;
A first reflective electrode electrically connected to the second semiconductor layer under the first light emitting structure;
A second light emitting structure comprising a third semiconductor layer of a first conductivity type, a second active layer under the third conductive layer of the first conductivity type, and a fourth semiconductor layer of a second conductivity type under the second active layer;
A second reflective electrode electrically connected to the fourth semiconductor layer under the second light emitting structure;
A contact unit electrically connected to the first semiconductor layer and the second reflective electrode;
A first connection wire electrically connected to the first reflective electrode;
A second connection wiring electrically connected to the second reflection electrode;
Light emitting device comprising a. The method of claim 1,
And the contact portion is in contact with the first semiconductor layer of the first conductivity type. The method of claim 1,
A light emitting device in which a portion of the first connection line and the second connection line are exposed to the outside. The method of claim 1,
A light emitting device comprising irregularities provided on an upper surface of the first semiconductor layer of the first conductivity type. The method of claim 1,
And the contact portion is in contact with the N surface of the first semiconductor layer when the first semiconductor layer of the first conductivity type includes a GaN layer. The method of claim 1,
And the contact portion is in contact with the Ga surface of the first semiconductor layer when the first semiconductor layer of the first conductivity type comprises a GaN layer. The method of claim 1,
Light emitting device comprising an insulating layer between the first reflective electrode and the second connection wiring. The method of claim 7, wherein
And a channel layer disposed on a portion of the insulating layer, wherein a first region of the second connection wiring is disposed on the channel layer, and a second region of the second connection wiring passes through the channel layer. The third region of the second connection line passes through the insulating layer. The method of claim 1,
The contact portion is in contact with the inside of the first semiconductor layer of the first conductivity type. A first conductivity type semiconductor layer, an active layer below the first conductivity type semiconductor layer, and a second conductivity type semiconductor layer below the active layer; A plurality of light emitting cells each comprising;
A contact unit electrically connected to a first conductive semiconductor layer of a first light emitting cell among the plurality of light emitting cells and electrically connected to a second conductive semiconductor layer of a second light emitting cell adjacent to the first light emitting cell;
A first connection wire having one end exposed to the outside and the other end electrically connected to the second conductive semiconductor layer of the first light emitting cell;
A second connection wiring having one end exposed to the outside and the other end electrically connected to the second conductive semiconductor layer of the second light emitting cell;
Light emitting device comprising a. The method of claim 10,
The contact portion is in contact with the upper surface of the first conductivity type semiconductor layer of the first light emitting cell. The method of claim 10,
A light emitting device comprising an insulating layer between the second conductive semiconductor layer and the second connection wiring. The method of claim 12,
And a channel layer disposed over a portion of the insulating layer, wherein a first region of the second connection wiring is disposed on the channel layer, and a second region of the second connection wiring passes through the channel layer. The third region of the second connection line passes through the insulating layer. The method of claim 10,
The contact portion is in contact with the inside of the first conductivity type semiconductor layer of the first light emitting cell. Body;
The light emitting device according to any one of claims 1 to 14, which is disposed on the body.
A first lead electrode and a second lead electrode electrically connected to the light emitting device;
Emitting device package. Board;
A light emitting element according to any one of claims 1 to 14 arranged on the substrate;
An optical member through which light provided from the light emitting device passes;
Light unit comprising a.

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