KR20110131545A - Light emitting device package and method of manufacturing the same - Google Patents
Light emitting device package and method of manufacturing the same Download PDFInfo
- Publication number
- KR20110131545A KR20110131545A KR1020100051024A KR20100051024A KR20110131545A KR 20110131545 A KR20110131545 A KR 20110131545A KR 1020100051024 A KR1020100051024 A KR 1020100051024A KR 20100051024 A KR20100051024 A KR 20100051024A KR 20110131545 A KR20110131545 A KR 20110131545A
- Authority
- KR
- South Korea
- Prior art keywords
- light emitting
- emitting device
- device package
- conversion member
- mounting
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- 238000006243 chemical reaction Methods 0.000 claims abstract description 28
- 239000011521 glass Substances 0.000 claims abstract description 20
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 15
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 36
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 14
- 239000000843 powder Substances 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 13
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 8
- 239000000203 mixture Substances 0.000 claims description 7
- 239000003960 organic solvent Substances 0.000 claims description 6
- 230000008878 coupling Effects 0.000 claims description 4
- 238000010168 coupling process Methods 0.000 claims description 4
- 238000005859 coupling reaction Methods 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 claims description 3
- 238000000059 patterning Methods 0.000 claims description 2
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229910000980 Aluminium gallium arsenide Inorganic materials 0.000 description 1
- 229910002601 GaN Inorganic materials 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
A light emitting device package and a method of manufacturing the same are provided.
The light emitting device package according to the embodiment of the present invention has an electrode terminal on the surface, the mounting portion made of glass; A light emitting device mounted on the mounting part and electrically connected to the electrode terminal; A cover part formed of glass and provided on the mounting part to cover and encapsulate the light emitting device by recessing the cavity; And a light conversion member containing a phosphor and filled in the cavity.
Description
The present invention relates to a light emitting device package and a method of manufacturing the same, and more particularly, to a light emitting device package having a high heat resistance and high reliability characteristics and a method of manufacturing the same.
A light emitting device (LED) refers to a semiconductor device capable of realizing various colors of light by configuring a light emitting source by changing compound semiconductor materials such as GaAs, AlGaAs, GaN, InGaInP, and the like.
Such light emitting devices are widely used in various fields such as TVs, computers, lighting, automobiles, etc. due to their excellent monochromatic peak wavelength, excellent light efficiency, miniaturization, eco-friendliness, and low power consumption. It is going out.
A general light emitting device package is formed by mounting a light emitting device in a main body of a cup structure formed of PPA resin, and injecting a curable polymer solution mixed with a phosphor into an epoxy or silicon polymer solution into a packaging member and curing the same.
Such a conventional light emitting device package has the following problems.
Resin parts, such as the body and packaging members, are very vulnerable to heat. As the demand for high output light emitting devices increases, the biggest characteristic required in the lighting market is high heat resistance, and in order to manufacture a light emitting device package capable of guaranteeing high reliability, the heat vulnerable characteristics of the main body and the packaging member should be improved.
In addition, since the structure distributed in the polymer solution is different according to the density and size distribution of the phosphor, the dispersion of color coordinates becomes very wide. In addition, when several kinds of phosphors are used at the same time, a problem occurs in that layers are formed according to the phosphors. In order to improve the color coordinate scattering characteristics of the light emitting device, phosphors should be dispersed. In a structure using a mixture of silicon and phosphors, it is difficult to disperse the phosphors.
An object of the present invention is to provide a light emitting device package having a high heat resistance and high reliability made of glass (glass) and a method of manufacturing the same.
The light emitting device package according to the embodiment of the present invention has an electrode terminal on the surface, the mounting portion made of glass; A light emitting device mounted on the mounting part and electrically connected to the electrode terminal; A cover part formed of glass and provided on the mounting part to cover and encapsulate the light emitting device by recessing the cavity; And a light conversion member containing a phosphor and filled in the cavity.
In addition, the light conversion member may be dispersed by containing phosphors in isopropyl alcohol (IPA), butanol, an organic solvent, or a mixture thereof.
In addition, the light conversion member may further contain a powder of Al 2 O 3 or B 2 O 3 or a powder of Al 2 O 3 and B 2 O 3 .
In addition, the mounting unit may further include a reflecting unit on a surface opposite to the surface on which the light emitting device is mounted.
On the other hand, the method of manufacturing a light emitting device package according to an embodiment of the present invention comprises the steps of preparing a cover portion base material of the plate structure made of glass; Preparing a cover part having a plurality of cavities recessed on the cover part substrate; Injecting and filling a light conversion member into the plurality of cavities; Preparing a mounting portion of a plate structure made of glass; Patterning an electrode terminal on the mounting portion, and mounting and providing a plurality of light emitting devices; Coupling the mounting portion on the cover portion such that the light emitting elements are respectively accommodated in the cavity; And dicing along the cutting line.
The method may further include providing a reflector on an opposite surface of the mounting unit in which the light emitting device is mounted.
In addition, the light conversion member may be dispersed by containing phosphors in isopropyl alcohol (IPA), butanol, an organic solvent, or a mixture thereof.
In addition, the light conversion member may further contain a powder of Al 2 O 3 or B 2 O 3 or a powder of Al 2 O 3 and B 2 O 3 .
In addition, the coupling of the mounting part on the cover part may include curing the light conversion member while the light emitting element is immersed in the light conversion member.
The method may further include forming a connection terminal connected to the electrode terminal after the dicing to supply power from the outside.
According to the present invention, by manufacturing a light emitting device package using glass having excellent heat resistance, it has an effect of obtaining high heat resistance and high reliability.
In addition, it is possible to improve the dispersibility of the phosphor to improve the color scattering characteristics, and it is possible to minimize the light efficiency degradation due to deterioration of the phosphor.
In addition, the manufacturing process is easy, mass production is possible, there is an effect that the productivity is improved.
1 is a cross-sectional view schematically showing a light emitting device package according to an embodiment of the present invention.
2 to 8 are schematic views sequentially showing a manufacturing process of the light emitting device package of FIG.
A light emitting device package and a method for manufacturing the same according to an embodiment of the present invention will be described with reference to the drawings.
However, embodiments of the present invention may be modified in many different forms and the scope of the present invention is not limited to the embodiments described below. The embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art.
Therefore, the shape and size of the components shown in the drawings may be exaggerated for more clear description, components having substantially the same configuration and function in the drawings will use the same reference numerals.
A light emitting device package according to an exemplary embodiment of the present invention will be described with reference to FIG. 1.
1 is a cross-sectional view schematically showing a light emitting device package according to an embodiment of the present invention.
Referring to FIG. 1, a light emitting device package according to an exemplary embodiment of the present invention may include a mounting unit, a light emitting device, a cover unit, and a light conversion member.
The mounting part may have a plate shape having a flat upper surface and a lower surface, and may have an electrode terminal patterned on a surface thereof. The electrode terminal is preferably a transparent electrode for light transmission, and may be formed by depositing indium tin oxide (ITO), but is not limited thereto.
The mounting part may be made of glass having excellent heat resistance, and therefore, the mounting part may not be deteriorated by high temperature heat generated from the light emitting device, thereby improving reliability.
The mounting unit may further include a reflecting unit on a surface opposite to the surface on which the light emitting device is mounted, thereby reflecting light emitted from the light emitting device provided on the mounting unit to improve light extraction efficiency.
The reflector may be provided by plating or depositing silver, or may be provided by attaching a thin film.
The light emitting device is mounted on the mounting portion and is electrically connected to the electrode terminal. Although the drawings illustrate wire bonding using wires, it is also possible to be connected by flip chip bonding through solder bumps (not shown).
The light emitting device is a kind of semiconductor device that emits light having a predetermined wavelength by a power source applied from the outside. In the embodiment according to the present invention, a single light emitting device is provided, but is not limited thereto. It is also possible to provide a light emitting element.
In addition, a zener diode (not shown) may be further provided together with the light emitting device.
The cover part is provided on the mounting part so as to form a cavity of a cup structure on one side to cover and encapsulate the light emitting device.
In particular, the cover portion may be made of a glass material having excellent heat resistance as the mounting portion. Therefore, the problem that the epoxy or silicon-based resin packaging member covering and encapsulating the package body or the light emitting device formed of PPA resin, which is vulnerable to heat, is degraded by the heat generated in the light emitting device, thereby reducing reliability. .
The light conversion member contains a phosphor therein and is filled in the cavity.
The light conversion member is characterized in that the phosphor is contained in isopropyl alcohol (IPA), butanol, an organic solvent, or a paste formed by mixing them. In particular, it does not use epoxy or silicone-based resins that are susceptible to heat as in the prior art and can withstand high temperatures (about 400 ° C.), thereby improving heat resistance characteristics.
In addition, the light conversion member may further contain a powder of Al 2 O 3 or B 2 O 3 or a mixture of Al 2 O 3 and B 2 O 3 . In this case, the dispersibility of the phosphor can be improved, and it is possible to improve color scattering characteristics of the completed light emitting device package.
In addition, when the powder is mixed with the phosphor in a nano size, the heat resistance is further improved, and thus the reliability is more improved.
As such, the light emitting device package according to the embodiment of the present invention does not use epoxy or silicone resin, which is susceptible to heat, and has a high heat resistance and high reliability by forming a package using glass having excellent heat resistance, and has color scattering characteristics and light emission. It has an excellent effect of improving optical characteristics such as efficiency.
Meanwhile, a method of manufacturing a light emitting device package according to an embodiment of the present invention will be described with reference to FIGS. 2 to 8.
2 to 8 are schematic views sequentially showing a manufacturing process of the light emitting device package of FIG.
First, as shown in Fig. 2, the upper and lower surfaces have a flat plate structure, and a cover part base 20 'made of glass is prepared.
Next, as shown in FIG. 3, the
The cavity may be additionally formed through etching or the like on the cover part substrate of FIG. 2, or the cover part substrate may be manufactured in a state in which the cavity is formed during manufacture of the cover part substrate of FIG. 2.
Next, in the state in which the cover portion is disposed such that the cavity faces upward as shown in FIG. 4, a light conversion member is injected into the cavity through a dispenser, not shown, and filled.
In this case, the light conversion member may be a dispersion containing phosphors contained in isopropyl alcohol (IPA), butanol, an organic solvent or a paste formed by mixing them, Al 2 O 3 or B 2 O 3 with excellent heat resistance It may further contain a powder of or a powder mixed with Al 2 O 3 and B 2 O 3 .
In particular, the powder of Al 2 O 3 or B 2 O 3 or a mixture of Al 2 O 3 and B 2 O 3 is preferably formed in a nano size and contained together with the phosphor, the powder of the phosphor The acidity may be improved to improve color scattering characteristics of the light emitting device package.
In addition, by further improving the heat resistance characteristics, the effect is more improved.
On the other hand, as shown in Fig. 5, a mounting portion having a plate structure made of glass is prepared, and an electrode terminal is patterned on the mounting portion. A plurality of light emitting device packages may be mounted to be electrically connected to the electrode terminals.
Next, as shown in FIG. 6, in the step of mounting and providing the light emitting device, a reflecting unit may be provided on an opposite surface of the mounting unit in which the light emitting device is mounted.
The reflector may reflect light emitted from the light emitting device package to improve luminous efficiency, and may be provided by silver plating or deposition or attached in a thin film form.
As described above, the mounting part including the electrode terminal, the light emitting device package, and the reflecting part may prepare the mounting parts of FIGS. 5 and 6 after preparing the cover part having the light conversion member in the cavity as shown in FIGS. 2 to 4. 5 and 6, the cover part of FIGS. 2 to 4 may be prepared, and the mounting part and the cover part may be prepared at the same time.
Next, as illustrated in FIG. 7, the mounting unit is coupled to the cover unit such that the light emitting devices are respectively accommodated in the cavity.
In this case, the light conversion member is provided in the cavity in a liquid state, and the mounting part and the cover part are coupled by curing the light conversion member while the light emitting element is immersed in the light conversion member.
In addition, as a method for maintaining airtightness in joining the mounting portion and the cover portion, a method of hardening by further providing a paste glass (not shown) on the surface of the cover portion in contact with the mounting portion is possible.
Next, as illustrated in FIG. 8, dicing along a cutting line in a state in which the mounting unit and the cover unit are coupled may produce a light emitting device package divided into a plurality of single products.
In addition, each package unit may be connected to the electrode terminal to form a connection terminal for supplying power from the outside on the outer surface of the package.
As described above, the light emitting device package formed by combining a mounting part and a cover part made of glass having excellent heat resistance characteristics effectively improves the problems caused by a package made of PPA resin or silicone resin, which is susceptible to heat, and thus, improves reliability and light. In addition to improving the characteristics, it has the advantage of improving the fairness and manufacturing cost according to mass production.
10 ....... Mounting
12 .......
20 .......
30 .......
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Claims (10)
A light emitting device mounted on the mounting part and electrically connected to the electrode terminal;
A cover part formed of glass and provided on the mounting part to cover and encapsulate the light emitting device by recessing the cavity; And
A light conversion member containing a phosphor and filled in the cavity;
Light emitting device package comprising a.
The light conversion member is a light emitting device package, characterized in that the phosphor is dispersed in isopropyl alcohol (IPA), butanol, an organic solvent or a mixture thereof.
The light conversion member further comprises a powder of Al 2 O 3 or B 2 O 3 or a powder of Al 2 O 3 and B 2 O 3 .
The mounting unit further comprises a reflective unit on the opposite side of the surface on which the light emitting device is mounted.
Preparing a cover part having a plurality of cavities recessed on the cover part substrate;
Injecting and filling a light conversion member into the plurality of cavities;
Preparing a mounting portion of a plate structure made of glass;
Patterning an electrode terminal on the mounting portion, and mounting and providing a plurality of light emitting devices;
Coupling the mounting portion on the cover portion such that the light emitting elements are respectively accommodated in the cavity; And
Dicing along a cutting line;
Method of manufacturing a light emitting device package comprising a.
The method of manufacturing a light emitting device package further comprising the step of providing a reflector on the opposite surface of the mounting portion in which the light emitting device is mounted in the mounting step.
The light conversion member is a method of manufacturing a light emitting device package, characterized in that the phosphor is dispersed in isopropyl alcohol (IPA), butanol, an organic solvent or a mixture thereof.
The light conversion member further comprises a powder of Al 2 O 3 or B 2 O 3 or a powder of Al 2 O 3 and B 2 O 3 manufacturing method of a light emitting device package.
Coupling the mounting portion on the cover portion comprises the step of curing the light conversion element in the state of immersing the light emitting element in the light conversion member.
And after the dicing step, connecting the electrode terminal to form a connection terminal for supplying power from the outside.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020100051024A KR20110131545A (en) | 2010-05-31 | 2010-05-31 | Light emitting device package and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020100051024A KR20110131545A (en) | 2010-05-31 | 2010-05-31 | Light emitting device package and method of manufacturing the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20110131545A true KR20110131545A (en) | 2011-12-07 |
Family
ID=45499896
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020100051024A KR20110131545A (en) | 2010-05-31 | 2010-05-31 | Light emitting device package and method of manufacturing the same |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR20110131545A (en) |
-
2010
- 2010-05-31 KR KR1020100051024A patent/KR20110131545A/en not_active Application Discontinuation
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