KR20110059250A - Carrier tape lint removing method - Google Patents
Carrier tape lint removing method Download PDFInfo
- Publication number
- KR20110059250A KR20110059250A KR1020090115916A KR20090115916A KR20110059250A KR 20110059250 A KR20110059250 A KR 20110059250A KR 1020090115916 A KR1020090115916 A KR 1020090115916A KR 20090115916 A KR20090115916 A KR 20090115916A KR 20110059250 A KR20110059250 A KR 20110059250A
- Authority
- KR
- South Korea
- Prior art keywords
- carrier tape
- lint
- laser
- receiving hole
- present
- Prior art date
Links
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/354—Working by laser beam, e.g. welding, cutting or boring for surface treatment by melting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/361—Removing material for deburring or mechanical trimming
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0084—Containers and magazines for components, e.g. tube-like magazines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
- H05K13/0215—Interconnecting of containers, e.g. splicing of tapes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0417—Feeding with belts or tapes
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Wire Bonding (AREA)
Abstract
The present invention relates to a method for removing lint from a carrier tape, and more particularly, to a method for removing lint from a carrier tape that can effectively remove lint generated during a puncturing process of a carrier tape at a low cost.
The present invention provides a method for removing lint from a lint removing method formed on an inner side of a receiving hole of a carrier tape, wherein the carrier tape is irradiated with four lasers to remove the lint. Provides a method of removing lint.
According to the present invention, it is possible to provide a method for removing lint of the carrier tape which can remove the carrier tape more efficiently and economically using a laser.
Description
The present invention relates to a method for removing lint from a carrier tape, and more particularly, to a method for removing lint from a carrier tape that can effectively remove lint generated during a puncturing process of a carrier tape at a low cost.
In devices having electronic components such as field effect transistors (FETs), resistors or capacitors, and LED components such as light emitting diodes (LEDs), the weight, size, and operating frequency of the products are being increased. Electronic components have been manufactured to be lighter, thinner and shorter. These small electronic products are automatically inserted into the circuit board. In general, in order to continuously supply the electronic parts to the automatic insertion device for automatically inserting the electronic parts into the circuit board, the electronic parts can be accommodated at regular intervals to accommodate the electronic parts. Electronic component carrier tapes having rectangular holes or receiving holes are used.
1 is a plan view of a carrier tape, and FIG. 2 is a cross-sectional view illustrating a state in which an electronic component is mounted on a carrier tape. As shown in these figures, the
The receiving
Figure 6 is a method for explaining a conventional method used to remove such lint (100). The
In such a conventional method of removing the
In addition, since hot air is continuously supplied to the carrier tape, a problem arises in that the carrier tape is deformed (contracted) by heat.
In order to solve this problem, the applicant of the present application removes lint of the carrier tape using a laser irradiation apparatus as shown in FIG. 7, but simply uses a laser irradiation apparatus 9 as shown in FIG. In the case of the method of irradiating a laser to the receiving hole (4), the laser irradiation to the entirety of the receiving hole, this method has the disadvantage that the energy efficiency is very low. In the conventional method, as shown in FIG. 8, the filter f is used to convert the laser light into the same shape as that of the receiving hole and irradiate the laser light, which requires a laser generator having a very large energy. By the way, the portion to be irradiated with the laser is actually the portion where lint is formed (marked with hatched in FIG. 9), and the portion indicated with dots in FIG. Since the laser was irradiated to the part where it was, a problem of inefficiency occurred.
SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and it is an object of the present invention to provide a lint removal means that can remove lint formed in the carrier tape receiving hole by using a laser more efficiently and economically. .
The present invention as a means for solving the above problems,
In the method of removing lint formed on the inner side of the receiving hole of the carrier tape,
The present invention provides a method for removing lint from a carrier tape, wherein the lint is removed by irradiating a laser to four sides of a quadrangle formed by an inner surface of the receiving hole.
Irradiation of the laser,
It is preferable that the one end of the quadrangle forming the receiving hole is continuously formed in a clockwise or counterclockwise direction and finished at the one point.
Irradiation of the laser is preferably made in the process of conveying the carrier tape.
More preferably, the laser is irradiated along four sides of the quadrangle of the accommodation hole by moving a mirror reflecting the laser generated by the laser generator.
According to the present invention, it is possible to provide a method for removing lint of the carrier tape which can remove the carrier tape more efficiently and economically using a laser.
Hereinafter, with reference to the drawings will be described with respect to the method of removing the lint of the carrier tape in accordance with one preferred embodiment of the present invention will be described in detail for the practice of the present invention.
10 and 11 are views for explaining the lint removal method according to an embodiment of the present invention, Figure 12 is an enlarged view of the receiving hole of the carrier tape is removed lint by the present invention.
The basic technical idea of the method for removing the lint of the carrier tape according to the present invention is to remove the lint generated on the carrier tape by using the laser generated by the laser irradiation apparatus.
The conventional method of removing lint of a carrier tape using a laser shown in FIG. 7 employs a method of removing lint of a moving carrier tape by periodically irradiating a laser beam shown as a dot island in FIG. 10.
However, as described in the description of the prior art, in the case of the laser beam shown by the dotted line in FIG. 10, a very high energy level laser has to be used, and thus the cost for generating the laser is very large.
The invention derived to solve this problem is irradiated along the four sides of the
In order to remove the lint of the carrier tape more efficiently, it is preferable to remove the lint by continuously irradiating the laser in a clockwise or counterclockwise direction at any point forming the inner surface of the
In order to more effectively remove lint from the carrier tape, the lint of the carrier tape is removed during the movement of the carrier tape rather than irradiating a laser while the carrier tape is stopped. The movement of the carrier tape is a movement around the carrier tape on either side, similar to the perforation of the carrier tape. The invention which can remove such an efficient carrier tape is invention of
The invention according to
FIG. 11 is a view for explaining one method of removing lint from the carrier tape while the carrier tape is moving.
The arrows marked a1, a2, a3, a4 on the figure are vectors indicating the speed at which the carrier tape moves. All the same reference numerals are used to illustrate the removal along all four sides of the same size.
First, a method of removing the lint by continuously irradiating a laser from a vertex in the upper left on the drawing to a vertex in the upper right will be described.
Since the carrier tape is moving at the speed of the vector marked a1, the laser removes lint while moving at a speed greater than a1, as indicated by b1.
The next step is to remove the lint while the laser is continuously irradiated from the upper right corner of the receiving hole to the lower right corner. When the laser moves in the direction indicated by b2, the relative velocity vector between the receiving hole and the laser beam is accepted. Remove the lint by moving from the vertex in the upper right of the ball to the lower right.
The next step is to remove the lint while irradiating the laser continuously from the vertex at the lower right of the receiving hole to the vertex at the lower left. The carrier tape is moving at the speed of the vector denoted by a3, and the linear velocity of the laser can be moved at a relatively slower speed than the speed of the carrier tape as in the vector denoted by b3. At this time, the size of b3 is one example, and for faster processing, the line speed of the laser may be moved in the direction opposite to the vector denoted by a3.
The next step is to remove the lint while irradiating the laser continuously from the vertex at the lower left of the accommodation hole to the vertex at the upper left, and this step completes the removal of the lint at the accommodation hole. Since the carrier tape is moving at the speed of the vector denoted by a4, the line speed of the laser moves at the speed of the vector denoted by b4, moving from the vertex in the lower left of the receiving hole to the vertex in the upper left. Will be removed.
12 is one example of the receiving hole is removed lint by the present invention. Unlike the photo of the receiving hole shown in Figure 5 can be confirmed that most of the lint is removed.
While the above has described the specific contents for the practice of the present invention by describing the preferred embodiment of the present invention, the technical idea of the present invention is not limited to the described embodiment and within the scope that does not contradict the technical idea of the present invention. It can be implemented by the method of removing lint of the carrier tape of various forms.
1 is a plan view of a carrier tape.
FIG. 2 is a view for explaining a state in which an electronic component is held on a carrier tape shown in FIG. 1. FIG.
3 is a view for schematically explaining equipment for punching a carrier tape.
FIG. 4 is an enlarged view of lint generated during the puncturing of the carrier tape shown in FIG. 3. FIG.
5 is an enlarged view of the accommodation hole in the enlarged view shown in FIG.
6 and 7 schematically show a conventional lint removing device.
8 and 9 are views for explaining the problem of the lint removing apparatus using the laser shown in FIG.
10 and 11 are views for explaining the lint removal method according to an embodiment of the present invention.
12 is an enlarged view of the receiving hole of the carrier tape from which the lint is removed by the present invention.
** Explanation of symbols for the main parts of the drawing **
4: receiving hole 8: laser beam
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090115916A KR20110059250A (en) | 2009-11-27 | 2009-11-27 | Carrier tape lint removing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090115916A KR20110059250A (en) | 2009-11-27 | 2009-11-27 | Carrier tape lint removing method |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20110059250A true KR20110059250A (en) | 2011-06-02 |
Family
ID=44394427
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020090115916A KR20110059250A (en) | 2009-11-27 | 2009-11-27 | Carrier tape lint removing method |
Country Status (1)
Country | Link |
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KR (1) | KR20110059250A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AT525662B1 (en) * | 2021-12-21 | 2023-06-15 | Systemrocket Gmbh | Process for removing at least one SMD component from an SMD tape |
-
2009
- 2009-11-27 KR KR1020090115916A patent/KR20110059250A/en not_active Application Discontinuation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AT525662B1 (en) * | 2021-12-21 | 2023-06-15 | Systemrocket Gmbh | Process for removing at least one SMD component from an SMD tape |
AT525662A4 (en) * | 2021-12-21 | 2023-06-15 | Systemrocket Gmbh | Process for removing at least one SMD component from an SMD tape |
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