[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

KR20110059250A - Carrier tape lint removing method - Google Patents

Carrier tape lint removing method Download PDF

Info

Publication number
KR20110059250A
KR20110059250A KR1020090115916A KR20090115916A KR20110059250A KR 20110059250 A KR20110059250 A KR 20110059250A KR 1020090115916 A KR1020090115916 A KR 1020090115916A KR 20090115916 A KR20090115916 A KR 20090115916A KR 20110059250 A KR20110059250 A KR 20110059250A
Authority
KR
South Korea
Prior art keywords
carrier tape
lint
laser
receiving hole
present
Prior art date
Application number
KR1020090115916A
Other languages
Korean (ko)
Inventor
우종완
Original Assignee
선우아이디 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 선우아이디 주식회사 filed Critical 선우아이디 주식회사
Priority to KR1020090115916A priority Critical patent/KR20110059250A/en
Publication of KR20110059250A publication Critical patent/KR20110059250A/en

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/354Working by laser beam, e.g. welding, cutting or boring for surface treatment by melting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/361Removing material for deburring or mechanical trimming
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0084Containers and magazines for components, e.g. tube-like magazines
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02Feeding of components
    • H05K13/0215Interconnecting of containers, e.g. splicing of tapes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0417Feeding with belts or tapes

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)

Abstract

The present invention relates to a method for removing lint from a carrier tape, and more particularly, to a method for removing lint from a carrier tape that can effectively remove lint generated during a puncturing process of a carrier tape at a low cost.

The present invention provides a method for removing lint from a lint removing method formed on an inner side of a receiving hole of a carrier tape, wherein the carrier tape is irradiated with four lasers to remove the lint. Provides a method of removing lint.

According to the present invention, it is possible to provide a method for removing lint of the carrier tape which can remove the carrier tape more efficiently and economically using a laser.

Description

Carrier tape lint removing method

The present invention relates to a method for removing lint from a carrier tape, and more particularly, to a method for removing lint from a carrier tape that can effectively remove lint generated during a puncturing process of a carrier tape at a low cost.

In devices having electronic components such as field effect transistors (FETs), resistors or capacitors, and LED components such as light emitting diodes (LEDs), the weight, size, and operating frequency of the products are being increased. Electronic components have been manufactured to be lighter, thinner and shorter. These small electronic products are automatically inserted into the circuit board. In general, in order to continuously supply the electronic parts to the automatic insertion device for automatically inserting the electronic parts into the circuit board, the electronic parts can be accommodated at regular intervals to accommodate the electronic parts. Electronic component carrier tapes having rectangular holes or receiving holes are used.

1 is a plan view of a carrier tape, and FIG. 2 is a cross-sectional view illustrating a state in which an electronic component is mounted on a carrier tape. As shown in these figures, the carrier tape 3 is formed with a plurality of accommodation holes 4 for accommodating the electronic component 5 at regular intervals, and the carrier tape 3 along one side edge thereof. A large number of circular conveying holes 6 are formed to convey the precise pitch. On both sides of the carrier tape 3, as shown in Fig. 2, a protective tape 7 is attached. The lower protective tape 7b is attached to the rear surface of the carrier tape 3 and the electronic component accommodating hole 3a is attached. After accommodating the necessary electronic components 5, the upper protective tape 7a is again attached thereon so that the carrier tape 3 can accommodate the electronic components 5 therein.

The receiving hole 4 is made by the drilling equipment as shown briefly in Figure 3, the inner surface (4a) of the receiving hole 4 in the drilling process using the punch (P) lint difficult to visually identify (100; see enlarged view of FIGS. 4 and 5). An enlarged view of the entire carrier tape is shown in FIG. 4, and an enlarged view of the accommodation hole is shown in FIG. 5. Since the lint 100 may contaminate the electronic parts during the transfer of the electronic parts accommodated in the accommodation hole 4, the lint 100 is necessarily removed as a post-treatment process.

Figure 6 is a method for explaining a conventional method used to remove such lint (100). The carrier tape 3 is continuously conveyed from the left side to the right side in the drawing (in the direction of the arrow shown in FIG. 5). At this time, the carrier tape 3 is provided above the receiving hole 4 of the carrier tape 3. Air is injected to remove the lint 100 while the high-temperature air passes through the receiving hole 4. Although not shown in the inside of the heat blower 1, a heating wire is provided to heat the air supplied to the heat blower 1. Arrows shown in the drawing indicate the flow direction of air at high temperature and high pressure.

In such a conventional method of removing the lint 100, the injection of air at a high temperature and high pressure is continuously injected because it is more advantageous to continuously inject air for efficient heating of the air. Therefore, the high-temperature, high-pressure air is not injected only to the accommodating hole 4 in which the lint 100 is formed, but is continuously injected to the carrier tape 3 at a predetermined width so that the heating strip 8 is formed at the portion indicated by hatching in FIG. 3. . In fact, the heating strip 8 is yellowish discoloration, so it is not aesthetically desirable, and there is a problem that may cause the performance of the carrier tape 3 to be degraded.

In addition, since hot air is continuously supplied to the carrier tape, a problem arises in that the carrier tape is deformed (contracted) by heat.

In order to solve this problem, the applicant of the present application removes lint of the carrier tape using a laser irradiation apparatus as shown in FIG. 7, but simply uses a laser irradiation apparatus 9 as shown in FIG. In the case of the method of irradiating a laser to the receiving hole (4), the laser irradiation to the entirety of the receiving hole, this method has the disadvantage that the energy efficiency is very low. In the conventional method, as shown in FIG. 8, the filter f is used to convert the laser light into the same shape as that of the receiving hole and irradiate the laser light, which requires a laser generator having a very large energy. By the way, the portion to be irradiated with the laser is actually the portion where lint is formed (marked with hatched in FIG. 9), and the portion indicated with dots in FIG. Since the laser was irradiated to the part where it was, a problem of inefficiency occurred.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and it is an object of the present invention to provide a lint removal means that can remove lint formed in the carrier tape receiving hole by using a laser more efficiently and economically. .

The present invention as a means for solving the above problems,

In the method of removing lint formed on the inner side of the receiving hole of the carrier tape,

The present invention provides a method for removing lint from a carrier tape, wherein the lint is removed by irradiating a laser to four sides of a quadrangle formed by an inner surface of the receiving hole.

Irradiation of the laser,

It is preferable that the one end of the quadrangle forming the receiving hole is continuously formed in a clockwise or counterclockwise direction and finished at the one point.

Irradiation of the laser is preferably made in the process of conveying the carrier tape.

More preferably, the laser is irradiated along four sides of the quadrangle of the accommodation hole by moving a mirror reflecting the laser generated by the laser generator.

According to the present invention, it is possible to provide a method for removing lint of the carrier tape which can remove the carrier tape more efficiently and economically using a laser.

Hereinafter, with reference to the drawings will be described with respect to the method of removing the lint of the carrier tape in accordance with one preferred embodiment of the present invention will be described in detail for the practice of the present invention.

10 and 11 are views for explaining the lint removal method according to an embodiment of the present invention, Figure 12 is an enlarged view of the receiving hole of the carrier tape is removed lint by the present invention.

The basic technical idea of the method for removing the lint of the carrier tape according to the present invention is to remove the lint generated on the carrier tape by using the laser generated by the laser irradiation apparatus.

The conventional method of removing lint of a carrier tape using a laser shown in FIG. 7 employs a method of removing lint of a moving carrier tape by periodically irradiating a laser beam shown as a dot island in FIG. 10.

However, as described in the description of the prior art, in the case of the laser beam shown by the dotted line in FIG. 10, a very high energy level laser has to be used, and thus the cost for generating the laser is very large.

The invention derived to solve this problem is irradiated along the four sides of the receiving hole 4 by using a laser having a lower energy level due to the cross-sectional area of the laser beam as indicated by 8 in FIG. 10. The lint is removed, and this invention is invention of Claim 1.

In order to remove the lint of the carrier tape more efficiently, it is preferable to remove the lint by continuously irradiating the laser in a clockwise or counterclockwise direction at any point forming the inner surface of the receiving hole 4. The invention is an invention described in claim 2 of the present invention.

In order to more effectively remove lint from the carrier tape, the lint of the carrier tape is removed during the movement of the carrier tape rather than irradiating a laser while the carrier tape is stopped. The movement of the carrier tape is a movement around the carrier tape on either side, similar to the perforation of the carrier tape. The invention which can remove such an efficient carrier tape is invention of Claim 3.

The invention according to claim 4 is to irradiate a laser beam generated by a laser irradiation apparatus to each side of the carrier tape by using a mirror to continuously irradiate the laser while moving the mirror. Since it is difficult to move the laser light minutely by moving the laser irradiation device itself, which generates the laser, it is reflected on the mirror, but the laser light is moved by controlling the movement of the mirror using a controller.

FIG. 11 is a view for explaining one method of removing lint from the carrier tape while the carrier tape is moving.

The arrows marked a1, a2, a3, a4 on the figure are vectors indicating the speed at which the carrier tape moves. All the same reference numerals are used to illustrate the removal along all four sides of the same size.

First, a method of removing the lint by continuously irradiating a laser from a vertex in the upper left on the drawing to a vertex in the upper right will be described.

Since the carrier tape is moving at the speed of the vector marked a1, the laser removes lint while moving at a speed greater than a1, as indicated by b1.

The next step is to remove the lint while the laser is continuously irradiated from the upper right corner of the receiving hole to the lower right corner. When the laser moves in the direction indicated by b2, the relative velocity vector between the receiving hole and the laser beam is accepted. Remove the lint by moving from the vertex in the upper right of the ball to the lower right.

The next step is to remove the lint while irradiating the laser continuously from the vertex at the lower right of the receiving hole to the vertex at the lower left. The carrier tape is moving at the speed of the vector denoted by a3, and the linear velocity of the laser can be moved at a relatively slower speed than the speed of the carrier tape as in the vector denoted by b3. At this time, the size of b3 is one example, and for faster processing, the line speed of the laser may be moved in the direction opposite to the vector denoted by a3.

The next step is to remove the lint while irradiating the laser continuously from the vertex at the lower left of the accommodation hole to the vertex at the upper left, and this step completes the removal of the lint at the accommodation hole. Since the carrier tape is moving at the speed of the vector denoted by a4, the line speed of the laser moves at the speed of the vector denoted by b4, moving from the vertex in the lower left of the receiving hole to the vertex in the upper left. Will be removed.

12 is one example of the receiving hole is removed lint by the present invention. Unlike the photo of the receiving hole shown in Figure 5 can be confirmed that most of the lint is removed.

While the above has described the specific contents for the practice of the present invention by describing the preferred embodiment of the present invention, the technical idea of the present invention is not limited to the described embodiment and within the scope that does not contradict the technical idea of the present invention. It can be implemented by the method of removing lint of the carrier tape of various forms.

1 is a plan view of a carrier tape.

FIG. 2 is a view for explaining a state in which an electronic component is held on a carrier tape shown in FIG. 1. FIG.

3 is a view for schematically explaining equipment for punching a carrier tape.

FIG. 4 is an enlarged view of lint generated during the puncturing of the carrier tape shown in FIG. 3. FIG.

5 is an enlarged view of the accommodation hole in the enlarged view shown in FIG.

6 and 7 schematically show a conventional lint removing device.

8 and 9 are views for explaining the problem of the lint removing apparatus using the laser shown in FIG.

10 and 11 are views for explaining the lint removal method according to an embodiment of the present invention.

12 is an enlarged view of the receiving hole of the carrier tape from which the lint is removed by the present invention.

** Explanation of symbols for the main parts of the drawing **

4: receiving hole 8: laser beam

Claims (4)

In the method of removing lint formed on the inner side of the receiving hole of the carrier tape, The lint removal method of the carrier tape characterized by removing the said lint by irradiating a laser to the four sides of the rectangle formed by the inner surface of the said accommodation hole. The method of claim 1, Irradiation of the laser, The lint removal method of the carrier tape, characterized in that the one end of the square forming the receiving hole in a continuous clockwise or counterclockwise direction is finished at one point. The method of claim 1, Irradiation of the laser is a lint removal method of a carrier tape, characterized in that the carrier tape is carried in the process of conveying. The method according to any one of claims 1 to 3, The laser is irradiated along the four sides of the square forming the receiving hole by removing the lint of the carrier tape, characterized in that by moving the mirror reflecting the laser generated in the laser generator.
KR1020090115916A 2009-11-27 2009-11-27 Carrier tape lint removing method KR20110059250A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020090115916A KR20110059250A (en) 2009-11-27 2009-11-27 Carrier tape lint removing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020090115916A KR20110059250A (en) 2009-11-27 2009-11-27 Carrier tape lint removing method

Publications (1)

Publication Number Publication Date
KR20110059250A true KR20110059250A (en) 2011-06-02

Family

ID=44394427

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020090115916A KR20110059250A (en) 2009-11-27 2009-11-27 Carrier tape lint removing method

Country Status (1)

Country Link
KR (1) KR20110059250A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT525662B1 (en) * 2021-12-21 2023-06-15 Systemrocket Gmbh Process for removing at least one SMD component from an SMD tape

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT525662B1 (en) * 2021-12-21 2023-06-15 Systemrocket Gmbh Process for removing at least one SMD component from an SMD tape
AT525662A4 (en) * 2021-12-21 2023-06-15 Systemrocket Gmbh Process for removing at least one SMD component from an SMD tape

Similar Documents

Publication Publication Date Title
KR100849164B1 (en) Carrier tape lint removing method
KR102240327B1 (en) Drilling holes with minimal taper in cured silicone
CN106141444B (en) Laser processing device
JP5261168B2 (en) Cutting apparatus and method for manufacturing electronic parts
JP6870974B2 (en) How to divide the work piece
CN107017159B (en) Processing method of packaging substrate
KR20110059250A (en) Carrier tape lint removing method
ES2927866T3 (en) Cutting method for substrates based on polymer resin mold compounds and system thereof
US20150273868A1 (en) Printing unit and printing apparatus
JP2012051710A (en) Conveyor apparatus
JP2003504836A (en) Method and apparatus for removing molding burrs
JP2016157889A (en) Light irradiation element and linear light irradiation device
KR20110059262A (en) Carrier tape lint removing method
JPWO2017168641A1 (en) Parts supply device
CN102528290A (en) Method for processing optical device unit
JP5651667B2 (en) Substrate transport device, substrate working device, and transport belt
WO2017026286A1 (en) Solder bonding method for mounting component and solder bonding apparatus for mounting component
JP5713157B2 (en) Bonding equipment
JP2016072584A (en) Light-emitting module
EP3699103A1 (en) Method, apparatus and system for attaching a label on a product
JP5222963B2 (en) Light guide plate, lighting device having light guide plate, and method of manufacturing light guide plate
KR102194332B1 (en) Reel to reel reflow apparatus of semiconductor device
WO2004034764A1 (en) Method of forming dimensionally precise slots in resilient mask of miniature component carrier
KR20120009350A (en) Carrier tape burr removing Appaturus
JP5485570B2 (en) Light irradiation apparatus and light irradiation method

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E601 Decision to refuse application