KR102194332B1 - Reel to reel reflow apparatus of semiconductor device - Google Patents

Abstract

A disclosed reel-to-reel reflow apparatus of a semiconductor element comprises: an unwind unit to which a flexible circuit board on which a semiconductor element is mounted is supplied; a reflow unit for supplying hot air to the semiconductor element mounted on the supplied flexible circuit board, and performing a reflow process in a manner which supplies hot air in a state in close contact with the size range of the semiconductor element; and a winding unit for recovering the flexible circuit board on which the reflow process has been completed. Accordingly, it is possible to improve the semiconductor yield by preventing chip deformation and damage of the semiconductor element in advance.

Description

Reel-to-reel reflow device of semiconductor device {REEL TO REEL REFLOW APPARATUS OF SEMICONDUCTOR DEVICE}

The present invention (Disclosure) relates to a reel-to-reel reflow device for a semiconductor device. Specifically, when a flexible circuit board on which a semiconductor device is mounted is supplied, through a hot air supply nozzle in close contact with the semiconductor device size range. The present invention relates to a reel-to-reel reflow apparatus for a semiconductor device capable of improving semiconductor yield by preventing chip deformation and damage of a semiconductor device in advance by supplying hot air locally.

Here, background technology related to the present invention is provided, and these do not necessarily mean known technology (This section provides background information related to the present disclosure which is not necessarily prior art).

With the miniaturization and weight reduction of electronic devices, various electronic components are being highly integrated in recent years. In response to this, high density circuit patterns used for printed circuit boards (PCBs) are also required, and circuit patterns composed of fine line widths and wiring pitches are required. It is being produced.

In particular, COF (chip on film) is a type of TAB (Tape Automated Bonding) created in the United States as an alternative to wire bonding and has been continuously developed until now. Films that serve as chips and substrates By connecting (film), it plays a role to exchange signals with external electronic components.

On the other hand, a reflow process has been proposed among surface mount technology (SMT) for mounting a semiconductor device on a substrate, and the mass reflow process mainly used in this reflow process includes solder balls, solder pads, and solder paste. A plurality of substrates with solder material attached are placed on a conveyor belt, and the substrate is continuously moved by the conveyor belt and passed through a heating section equipped with an infrared heater, thereby applying heat to the solder material on the substrate through the infrared heater. Semiconductor devices can be attached to the substrate.

In the reflow process using the conventional infrared heater as described above, when heating the entire reflow space with infrared rays, there is a problem in that COF is deformed and some of the chips are damaged by thermal shock.

1. Korean Patent Application Publication No. 10-2011-0026671 (published on March 16, 2011)

In the present invention (Disclosure), when a flexible circuit board on which a semiconductor device is mounted is supplied, hot air is locally supplied through a hot air supply nozzle in close contact with the size range of the semiconductor device, thereby preventing chip deformation and damage of the semiconductor device. It is an object of the present invention to provide a reel-to-reel reflow device for a semiconductor device capable of improving the semiconductor yield by preventing the problem.

In addition, the present invention (Disclosure) is to supply hot air to the semiconductor device through the hot air supply nozzle, but by circulating and resupplying the supplied hot air, the reel-to-reel reflow device of a semiconductor device capable of improving reflow efficiency. Provides for the purpose of work.

In addition, the present invention (Disclosure) supplies hot air while moving the hot air supply nozzle within the size range of the semiconductor device mounted on the flexible circuit board, and simultaneously reflows through a plurality of hot air supply nozzles corresponding to a plurality of semiconductor devices. An object of the present invention is to provide a reel-to-reel reflow device for a semiconductor device capable of further improving reflow efficiency by performing a process.

Here, a summary of the present invention is provided, and this section provides a general summary of the disclosure and is not a comprehensive disclosure of its full scope or all of its features).

In order to solve the above problems, the reel-to-reel reflow apparatus of a semiconductor device according to any one of the various aspects describing the present invention is an unwind unit to which a flexible circuit board on which a semiconductor device is mounted is supplied. ; A reflow unit for supplying hot air to the semiconductor device mounted on the supplied flexible circuit board, and performing a reflow process in a manner that supplies the hot air in a state in close contact with the size range of the semiconductor device; And a winding unit for recovering the flexible circuit board on which the reflow process has been completed.

In the reel-to-reel reflow apparatus of a semiconductor device according to an aspect of the present invention, the reflow unit comprises: the hot flavor supply region to block the influence of the hot air on the hot flavor supply region other than the hot air supply region. It may include a heat shield for covering;

In the reel-to-reel reflow apparatus of a semiconductor device according to an aspect of the invention, the reflow unit supplies the hot air and then circulates and resupplies the supplied hot air, and the hot air is supplied to the semiconductor device. A hot air supply nozzle having a supplied hot air supply path and a hot air circulation path through which the hot air is circulated; An air pump supplying air to the plurality of hot air supply nozzles; A heater that applies heat to the supplied air; And a circulation fan provided in the hot air circulation path to circulate the hot air.

In the reel-to-reel reflow apparatus of a semiconductor device according to an aspect of the present invention, the reflow unit may further include an opening/closing valve for discharging the hot air by opening the hot air circulation path to communicate with the outside.

In the reel-to-reel reflow apparatus of a semiconductor device according to an aspect of the invention, the hot air supply nozzle may supply the hot air to the semiconductor device while moving according to a preset path within the size range of the semiconductor device. have.

In the reel-to-reel reflow apparatus of a semiconductor device according to an aspect of the invention, the hot air supply nozzle is provided with a plurality of the semiconductor devices to be subjected to the reflow process to transmit the hot air to the semiconductor device. Each can be supplied.

In the reel-to-reel reflow apparatus of a semiconductor device according to an aspect of the present invention, a reflow inspection unit provided at a rear end of the reflow unit to inspect a state in which the reflow process has been performed; may further include.

According to the present invention, when a flexible circuit board on which a semiconductor device is mounted is supplied, hot air is locally supplied through a hot air supply nozzle that is in close contact with the size range of the semiconductor device, thereby preventing chip deformation and damage of the semiconductor device in advance. Thus, it is possible to improve the semiconductor yield.

Further, according to the present invention, the hot air is supplied to the semiconductor device through the hot air supply nozzle, and reflow efficiency can be improved by circulating and resupplying the supplied hot air.

In addition, according to the present invention, the hot air supply nozzle moves within the size range of the semiconductor device mounted on the flexible circuit board to supply hot air, and the reflow process is simultaneously performed through a plurality of hot air supply nozzles corresponding to the plurality of semiconductor devices. By performing, the reflow efficiency can be further improved.

1 is a diagram illustrating a reel-to-reel reflow apparatus of a semiconductor device according to an embodiment of the present invention,
2 is a view for explaining supply of hot air to the surface and supply of hot air to the back of a semiconductor device according to an embodiment of the present invention,
3 and 4 are views illustrating a hot air supply nozzle provided in a reflow unit according to an embodiment of the present invention,
5 is a view for explaining a heat shield provided in the hot flavor supply region according to an embodiment of the present invention,
6 and 7 are diagrams for explaining a reflow process according to an embodiment of the present invention.

Hereinafter, an embodiment implementing the reel-to-reel reflow apparatus of a semiconductor device according to the present invention will be described in detail with reference to the drawings.

However, the intrinsic technical idea of the present invention cannot be said to be limited by the embodiments to be described below, and the intrinsic technical idea of the present invention is given below by a person skilled in the art. It turns out to cover the range that can be easily proposed by a method of substitution or change of the embodiment described in FIG.

In addition, since the terms used below are selected for convenience of description, in grasping the intrinsic technical idea of the present invention, it is not limited to the dictionary meaning and is appropriately interpreted as a meaning consistent with the technical idea of the present invention. Should be.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a diagram illustrating a reel-to-reel reflow device of a semiconductor device according to an embodiment of the present invention, and FIG. 2 is a view for explaining supplying hot air to the surface and supplying hot air to the back surface of a semiconductor device according to an embodiment of the present invention 3 and 4 are views illustrating a hot air supply nozzle provided in the reflow unit according to an embodiment of the present invention, and FIG. 5 is a heat shield provided in the hot flavor supply region according to an embodiment of the present invention. 6 and 7 are diagrams for describing a reflow process according to an embodiment of the present invention.

1 to 7, a reel-to-reel reflow apparatus of a semiconductor device according to an embodiment of the present invention includes an unwind unit 110, a reflow unit 120, and a reflow inspection unit. 130), may include a wind unit (wind 140), and the like.

The unwind part 110 is supplied with the flexible circuit board 10 on which the semiconductor device 20 is mounted, and the flexible circuit board 10 has a flexible property, and is polyimide (PI), Polyethylene terephthalate (PET), polycarbonate (PC; polycarbonate), polyethylene naphtalate (PEN), polyarylate (PAR), polyetherimide (PEI), and polyether sulfone (PES). ; polyether Sulphone) may include at least one material selected from, and representatively, a chip on film (COF) or the like may be used.

The unwind part 110 includes a supply roll 111 on which the flexible circuit board 10 is wound and a dancer roll for maintaining the tension of the flexible circuit board 10 supplied by being unwound from the supply roll 111. 113) may be provided.

In addition, the unwind unit 110, the reflow unit 120, the inspection unit 130, and the winding unit 140 may be provided with a plurality of transfer rolls R for inducing the transfer of the flexible circuit board 10. have.

The reflow unit 120 supplies hot air to the semiconductor device 20 mounted on the supplied flexible circuit board 10, but supplies hot air in close contact with the size range of the semiconductor device 20. By performing a reflow process, as shown in FIG. 2, hot air is supplied to the surface of the semiconductor device 20 to be attached to the flexible circuit board 10, or a semi-structure device to be attached to the flexible circuit board 10 Hot air can be supplied to the back of (20).

Here, the DDI (display driver IC) is a display driving chip that adjusts a number of pixels constituting the display to realize various colors. It converts the received digital signal into an RGB analog value to display a smartphone, tablet PC, or TV. It is a device that delivers an image to a panel to realize an image.

The reflow unit 120 as described above includes a hot air supply nozzle 121, a hot air supply path 122, a hot air circulation path 123, an air pump 124, and a heater 125 provided inside the vacuum chamber C. , A circulation fan 126, an on/off valve 127, a heat shield 128, and the like.

Here, the hot air supply nozzle 121 supplies hot air to the semiconductor device 20 mounted on the flexible circuit board 10, and then circulates and resupplies the supplied hot air, but the hot air is supplied to the semiconductor device 20 A hot air supply path 122 and a hot air circulation path 123 through which hot air is circulated may be provided, respectively, and may be provided in various shapes such as a circular shape or a polygonal cross section.

In this hot air supply nozzle 121, the hot air supply path 122 and the hot air circulation path 123 are adjacent to each other so that the hot air supplied through the hot air supply path 122 can be circulated again through the hot air circulation path 123. It may be provided as, and the length of the partition wall (w2) partitioning them is formed relatively smaller than the outer wall (w1) of the hot air supply path 122 and the hot air circulation path 123, the hot air supply path 122 After the hot air supplied through the semiconductor device 20 is supplied to the front or rear surface of the semiconductor device 20, it may be recovered and circulated through the hot air circulation path 123 according to the operation of the circulation fan 126.

The hot air supply nozzle 121 as described above is provided in the form of a hot air supply path 122 and a hot air circulation path 123 as shown in FIG. 3, or a hot air supply path as shown in FIG. A plurality of pairs of 122 and the hot air circulation path 123 may be provided.

In addition, the air pump 124 supplies air to the hot air supply nozzle 121, which can be supplied by pumping air to the hot air supply path 122, and the heater 125 applies heat to the supplied air. The hot air within a preset temperature range may be supplied to the semiconductor device 20 by applying heat to the air provided on the hot air supply path 122 including, etc. It goes without saying that a supply valve 124a is provided between the air pump 124 and the hot air supply path 122 to supply or block air.

In addition, the circulation fan 126 is provided in the hot air circulation path 123 to circulate hot air, and the hot air supplied through the hot air supply path 122 is inside the hot air circulation path 123 adjacent to the hot air supply path 122 Through the circulation fan 126 provided in, it can be purified to the front end of the heater 125 again, and accordingly, the hot air can be supplied back to the semiconductor device 20 along the hot air supply path 122.

That is, the hot air supplied through the hot air supply path 122 is circulated through the hot air circulation path 123 again and supplied to the semiconductor device 20, thereby improving the attachment efficiency of the semiconductor device 20 using the hot air. Reflow process time can be shortened.

In addition, the opening/closing valve 127 is provided in the hot air supply nozzle 121 so that the hot air circulation path 123 communicates with the outside when it is opened. When stopping the supply of hot air to the semiconductor device 20 through this, the hot air supply path 122 ) And the hot air circulating inside the hot air circulation path 123 is discharged to the rear end of the hot air supply nozzle 121 through the opening of the on-off valve 127, thereby blocking the supply of additional hot air to the semiconductor device 20 ) Damage can be prevented in advance.

On the other hand, the reflow unit 120 covers the hot flavor supply area (NHA) in order to block the influence of the hot air on the hot flavor supply area (NHA: no heating area) other than the hot air supply area (HA heating area). It may further include a heat shield 128 for blocking heat conduction, and may be provided with a material such as SUS (Steel Use Stainless), an insulating material, ceramic, etc. to block heat conduction, and may be provided in a thickness range of 0.1-10mm.

For example, the heat shielding film 128 is a semiconductor device 20 to cover a hot flavor supply region NHA, which is a region other than the hot air supply region HA in which the semiconductor device 20 is disposed, as shown in FIG. 2. ), it is possible to prevent thermal damage to various devices around the semiconductor device 20. At this time, by having a separation distance (G) of 0.9-1.1mm between the edge tip of the semiconductor device 20 and the tip tip of the heat shielding film 128, the hot air supplied to the semiconductor device 20 Heat damage can be prevented as much as possible.

In addition, the heat shield 128 may be provided in a rectangular shape adjacent to the boundary portion of the semiconductor device 20 supplying hot air as shown on the left side of FIG. 5, and as shown in the right side of FIG. Only the hot air supply area HA may be provided in an open shape according to the shape (ie, a rectangular shape) of the semiconductor device 20 for supplying the hot air, and such a shape may be provided as necessary (ie, a semiconductor device supplying hot air ( Of course, it can be formed in various ways depending on the shape of 20).

The hot air supply nozzle 121 as described above is provided in the form of a hot air supply path 122 and a hot air circulation path 123 as shown in FIG. 3, or a hot air supply path as shown in FIG. Since a plurality of pairs of 122 and the hot air circulation path 123 are provided, it is possible to efficiently supply and attach hot air to the semiconductor devices 20 of various sizes.

Meanwhile, the hot air supply nozzle 121 as described above can supply hot air to the semiconductor device 20 while moving according to a preset path within the size range of the semiconductor device 20. As shown in FIG. By supplying hot air while moving in the direction a→b→c according to the size range of the device 20, damage and deformation of other devices can be prevented. Here, since the moving means of the hot air supply nozzle 121 has been presented in various ways in the related art, a detailed description thereof will be omitted.

In addition, the hot air supply nozzle 121 may be provided with a plurality of semiconductor devices 20, which are the targets of the reflow process, to supply hot air to the semiconductor devices 20, respectively, and even in this case, as shown in FIG. By supplying hot air while moving in the direction a'→b'→c' to each of the semiconductor devices 20, damage and deformation of the other adjacent semiconductor devices 20 can be prevented.

On the other hand, in the case of a conventional reflow process using a laser beam, since the laser beam output strength is relatively strong, when the laser beam irradiates and heats the solder material, the degree of melting of the solder material is required due to the output strength. There is a problem in that the solder material is spread by melting more than the standard as described above. In the reflow unit 120 according to the embodiment of the present invention as described above, the semiconductor device has a melting degree as much as a required standard by controlling the supply of hot air. Since the hot air can be supplied only to the hot air supply area HA so that the device 20 can be attached, the semiconductor product yield can be improved.

The reflow inspection unit 130 is provided at the rear end of the reflow unit 120 to inspect the state in which the reflow process has been performed. For example, the shape of the end of the solder material through a reflow process including a vision camera Reflow defects may be inspected by inspecting the two-dimensional shape or by measuring the height of the solder material after determining the contour of the solder material from the end of the solder material to inspect the three-dimensional shape of the solder material.

The reflow inspection unit 130 may be provided inside the vacuum chamber C in which the reflow unit 120 is provided.

The winding unit 140 recovers the flexible circuit board 10 on which the reflow process has been completed, and the recovery roll 141 recovers the flexible circuit board 10 and the flexible circuit board 10 recovered by the recovery roll 141 ) May be provided with a dancer roll 143 for maintaining the tension.

Accordingly, the present invention prevents chip deformation and damage of the semiconductor device in advance by locally supplying hot air through a hot air supply nozzle that is in close contact with the size range of the semiconductor device when the flexible circuit board on which the semiconductor device is mounted is supplied. Thus, it is possible to improve the semiconductor yield.

In the present invention, the hot air is supplied to the semiconductor device through the hot air supply nozzle, and reflow efficiency can be improved by circulating and resupplying the supplied hot air.

In addition, the present invention supplies hot air while moving the hot air supply nozzle within the size range of the semiconductor device mounted on the flexible circuit board, and simultaneously performing a reflow process through a plurality of hot air supply nozzles corresponding to a plurality of semiconductor devices. , The reflow efficiency can be further improved.

Claims (7)

An unwind unit to which a flexible circuit board on which a semiconductor device is mounted is supplied;
A reflow unit for supplying hot air to the semiconductor device mounted on the supplied flexible circuit board, and performing a reflow process in a manner that supplies the hot air in a state in close contact with the size range of the semiconductor device; And
Includes; a winding unit for recovering the flexible circuit board in which the reflow process is completed,
The reflow unit,
It is provided in a material selected from SUS (Steel Use Stainless), insulation and ceramic, and a thickness range of 0.1-10mm, and covers the hot flavor supply area to block the influence of the hot air on the hot flavor supply area other than the hot air supply area. However, a heat shield having an end of the semiconductor device with a separation distance of 0.9-1.1 mm from the edge of the semiconductor device;
A hot air supply nozzle having a hot air supply path through which the hot air is supplied to the semiconductor device and a hot air circulation path through which the hot air is circulated;
An air pump supplying air to the hot air supply nozzle;
A heater that applies heat to the supplied air;
A circulation fan provided in the hot air circulation path to circulate the hot air; And
Including; an opening and closing valve for discharging the hot air by opening the hot air circulation path to communicate with the outside,
The hot air supply nozzle is a reel-to-reel reflow device of a semiconductor device for supplying the hot air to the semiconductor device while moving according to a preset path within a size range of the semiconductor device. delete delete delete delete The method according to claim 1,
A reel-to-reel reflow device of a semiconductor device, wherein a plurality of hot air supply nozzles are provided when there are a plurality of semiconductor devices to be subjected to the reflow process to respectively supply the hot air to the semiconductor devices. The method according to claim 1 or 6,
The reel-to-reel reflow device of the semiconductor device,
A reflow inspection unit provided at a rear end of the reflow unit to inspect a state in which the reflow process has been performed.

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