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KR20100079524A - Apparatus and method for dispensing resin - Google Patents

Apparatus and method for dispensing resin Download PDF

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Publication number
KR20100079524A
KR20100079524A KR1020080138044A KR20080138044A KR20100079524A KR 20100079524 A KR20100079524 A KR 20100079524A KR 1020080138044 A KR1020080138044 A KR 1020080138044A KR 20080138044 A KR20080138044 A KR 20080138044A KR 20100079524 A KR20100079524 A KR 20100079524A
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KR
South Korea
Prior art keywords
unit
substrate
moving
head
holder
Prior art date
Application number
KR1020080138044A
Other languages
Korean (ko)
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KR101052277B1 (en
Inventor
강동성
Original Assignee
주식회사 프로텍
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Priority to KR1020080138044A priority Critical patent/KR101052277B1/en
Publication of KR20100079524A publication Critical patent/KR20100079524A/en
Application granted granted Critical
Publication of KR101052277B1 publication Critical patent/KR101052277B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

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  • Engineering & Computer Science (AREA)
  • Coating Apparatus (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Abstract

PURPOSE: An apparatus and a method for dispensing resin are provided to rapidly perform resin coating by controlling two heads which coat resin on a substrate in a work area. CONSTITUTION: A transfer unit(103) moves a substrate to a work area. A head unit(105) spreads resin on the substrate located in the work area. A movable unit transfers the head unit. A reverse unit(104) comprises a holding unit and a holding unit rotation apparatus. The holding unit is arranged in the work area and holds the substrate which is transferred to the work area. The holding unit rotation apparatus turns the substrate holding the holding unit upside down. A control device controls the operation of the transfer unit, the head unit, the movable unit, and the reverse unit.

Description

Resin Coating Apparatus and Resin Coating Method {APPARATUS AND METHOD FOR DISPENSING RESIN}

The present invention relates to a resin coating device, and more particularly, to a resin coating device and a resin coating method for applying a resin to a substrate for bonding a semiconductor device to the substrate.

In general, a semiconductor device such as a semiconductor chip is electrically connected to a substrate on which a circuit pattern is formed through a fine connection member such as a metal ball. When a plurality of metal balls are arranged on one surface of the substrate, the semiconductor elements are placed thereon, and heat is applied to the semiconductor elements to be bonded to the substrate while some of the metal balls are melted. However, since the bonding force between the semiconductor device and the substrate is weak only by the adhesive force of the metal ball, a viscous resin such as epoxy resin should be applied between the semiconductor device and the substrate to increase the bonding force.

When resin is applied around the semiconductor element connected to the substrate by the metal ball, the resin penetrates into the space between the semiconductor element and the substrate by capillary action to fill the space between the metal balls. This process is called underfill, and a resin coating device is used for this underfill process. The resin filling the space between the metal balls not only increases the bonding force between the semiconductor element and the substrate, but also mitigates external shocks, provides insulation, and responds to thermal stresses caused by the difference in thermal expansion coefficients of materials. It serves to stably hold the semiconductor element, the connection member, and the substrate.

The resin coating device includes a head unit for injecting resin into a target portion, which is mounted on a moving unit to move the resin back, forth, left, and right on a substrate to perform a resin coating operation. Since the moving range of the head unit by the moving unit is limited, the substrate is transferred to the work area of the head unit by a transfer unit such as a conveyor. When the resin coating operation is completed, the substrate is transferred to the unloading position by the transfer unit again.

In recent years, as the types of electronic devices using semiconductor devices increase, the types of substrates used for electronic devices are diversified, and substrates on which semiconductor devices are mounted on both front and rear surfaces are also used.

However, the conventional resin coating apparatus is not suitable for performing the resin coating operation on both sides of the substrate. In other words, when applying resin to both sides of the substrate using a conventional resin coating device, the substrate is loaded into the transfer unit to perform a resin coating operation on one surface, and when the resin coating is completed on one surface, the substrate is unloaded and then turned over. Since the supply back to the work area of the head unit, the work is cumbersome and the work time is greatly increased.

In addition, the conventional resin coating apparatus has a disadvantage in that the resin coating time for the substrate is long when the head unit has only one head for ejecting the resin, when a plurality of semiconductor elements are coupled to the substrate.

The present invention has been made to solve the above problems, and an object thereof is to provide a resin coating apparatus and a resin coating method capable of quickly performing a resin coating operation on both sides of a substrate.

Resin coating apparatus according to an embodiment of the present invention for achieving the above object, a transfer unit for transferring the substrate to the work area, a head unit for applying the resin to the substrate located in the work area, and the head A moving unit for moving the unit, an inverting unit disposed in the working area for inverting the upper and lower surfaces of the substrate located in the working area, operation of the transfer unit, the head unit, the moving unit, and the inverting unit It includes a control device for controlling the. The inversion unit has a holding unit for holding a substrate transferred to the work area and a holding unit rotating device for rotating the holding unit holding a substrate.

Here, the holding unit may be disposed to face each other with the substrates transferred to the working area therebetween, and may include a first holder and a second holder for holding respective opposite ends of the substrate.

The holding unit rotating apparatus may include a first rotation shaft coupled to the first holder, a second rotation shaft coupled to the second holder, and a shaft drive source for rotating the first rotation shaft and the second rotation shaft. Can be.

The shaft rotating apparatus may further include a power transmission mechanism connecting one driving source and each of the driving source, the first rotating shaft, and the second rotating shaft to synchronously rotate the first rotating shaft and the second rotating shaft. can do.

The resin coating apparatus according to an embodiment of the present invention may further include a conveying unit disposed in the work area to discharge the substrate transferred to the work area from the work area.

In addition, each of the first holder and the second holder may have a first support member and a second support member disposed to face each other to respectively support both sides of the substrate, and the transport unit may include the first holder. A first conveyance belt disposed between the first support member and the second support member, a second conveyance belt disposed between the first support member and the second support member of the second holder, and the first conveyance belt It may include a belt drive source for driving the belt and the second carrying belt.

Resin coating apparatus according to an embodiment of the present invention, the gap adjusting unit for moving at least one of the first holder and the second holder, so as to vary the gap between the first holder and the second holder. It may further include.

Here, the gap adjusting unit may include a holder slider coupled to at least one of the first holder and the second holder, and a slider drive source for moving the holder slider.

Resin coating apparatus according to an embodiment of the present invention, may further include a reverse unit lifting device for lifting the reverse unit.

Here, the inversion unit lifting device may include a lifting frame for supporting the inversion unit, and a frame driving source for lifting the lifting frame.

The head unit includes a head frame coupled to the moving unit, a fixed head installed on the head frame having a first nozzle for resin application, and a moving head installed on the head frame having a second nozzle for resin application; And an X-axis moving device for moving the moving head in the X direction perpendicular to the transfer direction of the substrate with respect to the head frame, and moving the moving head in the Y direction parallel to the transfer direction of the substrate with respect to the head frame. It may include a Y-axis moving device for.

The head unit includes a first Z axis moving device for moving the fixed head in the Z direction perpendicular to the Y direction and the X direction, and a second Z axis moving for moving the moving head in the Z direction. The apparatus may further include.

Resin coating method according to an embodiment of the present invention for achieving the above object, (a) transferring the substrate to the work area along the substrate transfer path, (b) a resin on one surface of the substrate located in the work area (C) inverting the upper and lower surfaces by inverting the substrate located in the work area, (d) applying resin to the other surface of the substrate located in the work area, and (e) in the work area. Ejecting the substrate.

Here, the step (b) and the step (d) is to apply a resin to the substrate located in the work area while moving the two heads that can apply the resin together, any one of the two heads The resin can be applied while moving relative to.

Since the resin coating apparatus according to the present invention can invert the substrate located in the work area, in order to apply the resin to both surfaces of the substrate, it is a troublesome to turn over the substrate on which the resin is applied on one surface and to supply it to the work area again. It can be avoided.

In addition, the resin coating apparatus according to the present invention, since the head unit is provided with two heads that operate independently of each other, the two heads can be applied to the substrate on the substrate located in the work area at the same time. Therefore, the resin coating operation on the substrate can be made quickly.

Hereinafter, a resin spreading apparatus and a resin spreading method according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. In the drawings, the size and shape of the components, etc. may be exaggerated or simplified to aid in understanding the invention.

1 is a plan view schematically showing a resin coating apparatus according to an embodiment of the present invention, Figure 2 is a block diagram showing the main components of the resin coating apparatus according to an embodiment of the present invention.

As shown in Figure 1 and 2, the resin coating apparatus 100 according to an embodiment of the present invention, a plurality of transfer unit 103 for transferring the substrate along a straight substrate transfer path 101, Two inversion units 104 disposed in the substrate transfer path 101, two head units 105 for applying resin to the substrates located on the inversion units 104, and each head unit 105, respectively. Two moving units 106 for moving, and a control unit 107 for controlling the operation of the units.

The moving unit 106 has the head unit 105 perpendicular to the substrate transfer path 101 so that the head unit 105 can apply the resin to the resin coating portion of the substrate being transported along the substrate transfer path 101. Move in the Y direction perpendicular to the direction and X direction. When the resin spreading operation is not performed, the moving unit 106 causes the head unit 105 to stand in a standby position deviating from the substrate transfer path 101. The moving unit 106 is disposed in the first fixed beam 111 and the second fixed beam 112 in the X direction, and disposed in the Y direction, and both ends thereof are respectively disposed in the first and second fixed beams 111 and 112. And a moving beam 113 coupled to be slidably movable.

Although not shown, each of the first and second fixed beams 111 and 112 may be provided with guide rails in parallel with the X direction, and both ends of the moving beams 113 may slide on each of the two guide rails. The combined beam sliders are respectively combined. In addition, each of the first and second fixed beams 111 and 112 is provided with a beam driving source for moving each of both ends of the moving beam 113 at the same direction and at the same speed. As the beam driving source, a linear motor capable of linearly moving the moving beam 113 along the guide rail may be used. In addition to the liner motor, a screw shaft device, a rack-pinion device, a belt device, or various other linear drive devices may be used as the beam driving source. The head unit 105 may move in the X direction by the movement of the moving beam 113.

The moving beam 113 is provided with a guide rail 114 parallel to the Y direction, and the head unit slider 115 to which the head unit 105 is coupled is provided at the guide rail 114. Although not shown, the moving beam 113 is provided with a slider drive source capable of moving the head unit slider 115 along the guide rail 114. A linear motor may be used as the slider drive source. In addition, other types of linear driving devices may be used as the slider driving source. The head unit 105 may move in the Y direction by the movement of the head unit slider 115.

In the substrate transfer path 101, two work areas 102 are disposed in which the head unit 105 can apply resin to the substrate, and the inversion unit 104 is located in each of these work areas 102. . Each work area 102 is located within the movement range of each of the two head units 105. In the resin coating apparatus 100 according to the exemplary embodiment of the present invention, after the substrates are supplied to the two working regions 102, the resin coating operation may be performed at the same time in these working regions 102. It can be shortened. The series of operations of the resin spreading apparatus 100 is controlled by the controller 107.

In the present invention, the substrate transfer path 101 is not limited to a straight line from a loading position at which the substrate is loaded as shown to an unloading position at which the substrate is unloaded. And the number of the transfer unit 103, the reversing unit 104, the head unit 105, the moving unit 106 may be variously changed. Although not shown, a loading unit for automatically loading the substrate into the first transfer unit 103 may be installed upstream of the substrate transfer path 101, and a resin may be applied downstream of the substrate transfer path 101. An unloading unit for unloading the substrate from the last transfer unit 103 may be installed.

As shown in Figure 3, the transfer unit 103 is a conveyor 121 for substrate transfer, a conveyor drive source 122 for driving the conveyor 121, a gap adjusting unit for adjusting the width of the conveyor 121 123. The conveyor 121 includes a first transfer rail 124 for supporting one side of the substrate and a second transfer rail 125 for supporting the other side of the substrate. Each of the first and second conveyance rails 124 and 125 has a conveyance belt 126 traveling by receiving a driving force of the conveyor drive source 122. The drive shaft 127 is coupled to the conveyor drive source 122, and the driving force of the conveyor drive source 122 is simultaneously transmitted to the two transfer belts 126 through the drive shaft 122. Therefore, the two transfer belts 126 travel at the same traveling direction and at the same traveling speed to transfer the substrate.

The gap adjusting unit 123 includes a pair of transfer rail sliders 128 coupled to the second transfer rails 125 and a slider drive source 129 for moving the transfer rail sliders 128. The pair of transfer rail sliders 128 are slidably coupled to each of the pair of guide rails 132 coupled to the main base 131. The screw shaft 133 is coupled to the slider drive source 129, and the screw shaft 133 is screwed to the nut member 134 coupled to the second transfer rail 125.

When the screw shaft 133 is rotated by the operation of the slider drive source 129, the second conveying rail 125 is brought close to the first conveying rail 124 by the action of the screw shaft 133 and the nut member 134. 1 away from the transport rail 124. Thus, by adjusting the width of the conveyor 121, the transfer unit 103 can transfer the substrate of various widths. In the present invention, the gap adjusting unit 123 may be changed into various structures capable of moving the second transfer rail 125 in addition to the illustrated and described structure.

The two inversion units 104 provided to be spaced apart from each other in the substrate transfer path 101 are for inverting the upper and lower surfaces of the substrate, and are provided in the work area 102 disposed in the substrate transfer path 101. The substrate transferred to the work area 102 by the transfer unit 103 stays in the work area 102 until the resin application is completed while being held by the inversion unit 104. Each of the two working areas 102 is provided with a sensing device 108 for sensing a substrate, and the transfer unit 103 does not operate when the substrate is located in the working area 102.

As shown in FIGS. 3 and 4, the inversion unit 104 includes a holding unit 136 for holding both sides of the substrate transferred to the work area 102, and a holding unit 136 for inverting the upper and lower surfaces of the substrate. Holding unit rotating device 137 for rotating the holding unit, a transport unit 138 for discharging the substrate from the holding unit 136, and a gap adjusting unit 139 for adjusting the width of the holding unit 136. The reversing unit 104 holds the substrate transferred to the work area 102 so that one side thereof faces upward, and then flips the substrate so that the other side of the substrate faces upward, so that the head unit 105 is placed on both sides of the substrate. Allow the resin to be applied.

The holding unit 136 includes a first holder 141 for holding one side of the substrate and a second holder 142 spaced apart from the first holder 141 for holding the other side of the substrate. The first holder 141 is coupled to the first pillar member 143, and the second holder 142 is coupled to the second pillar member 144 spaced apart from the first pillar member 143. Each of the holders 141 and 142 includes a first support member 145 for supporting one surface of the substrate and a second support member disposed in parallel with the first support member 145 for supporting the other surface of the substrate. 146). One side of the substrate transferred to the work area 102 is inserted between the first and second support members 145 and 146 of the first holder 141, and the other side thereof is formed of the second holder 142. It is inserted between the first and second support members 145 and 146. The substrate held in the holding unit 136 is not easily separated from the holding unit 136 when the holding unit 136 rotates.

The holding unit rotating device 137 includes a first rotating shaft 147 coupled to the first holder 141, a second rotating shaft 148 coupled to the second holder 142, and first and second rotating shafts 147. One shaft drive source 149 for rotating the 148, and the driving force of the shaft drive source 149 is simultaneously transmitted to the first and second rotary shafts 147, 148 to the first and second rotary shafts 147 ( A first power transmission mechanism 152 and a second power transmission mechanism 153 for synchronously rotating the 148. The drive pulley 151 is coupled to the shaft drive source 149, the first rotation shaft 147 is connected to the drive pulley 151 through the first power transmission mechanism 152, and the second rotation shaft 148 is It is connected to the drive pulley 151 through the second power transmission mechanism 153.

As shown in FIG. 4, the first power transmission mechanism 152 includes a connecting belt 154 coupled to the driving pulley 151 and a first driven pulley 155 coupled to the first rotation shaft 147. Both ends of the first driving belt 156 coupled to the first driven pulley 155, the connecting shaft 157 connecting the connecting belt 154 and the first driving belt 156, and the connecting shaft 157. It includes a pair of connecting pulleys (158, 159) coupled to. The second power transmission mechanism 153 is a second driven pulley 162 coupled with a second drive belt 161, a second rotation shaft 148, and a second drive belt 161 coupled to the drive pulley 151. ). When the shaft drive source 149 is operated, the first and second rotation shafts 147 and 148 rotate through the first and second power transmission mechanisms 152 and 153 at the same rotational direction and at the same rotational speed. The rotation direction of the first and second rotary shafts 147 and 148 is 180 ° in which the vertical arrangement of the first and second support members 145 and 146 of the first and second holders 141 and 142 is changed. It is limited to.

The transport unit 138 includes a first transport belt 164 installed on the first holder 141, a second transport belt 165 installed on the second holder 142, and a first transport belt 164. A first belt drive source 166 for traveling and a second belt drive source 167 for traveling the second carrying belt 165 are included. The first transport belt 164 is disposed to be capable of traveling between the first and second support members 145 and 146 of the first holder 141, and the second transport belt 165 is the second holder 142. It is arrange | positioned so that a run is possible between the 1st and 2nd support members 145 and 146 of the.

The first transport belt 164 transfers one end of the substrate positioned between the first and second support members 145 and 146 of the first holder 141 along the substrate transfer path 101. The second transport belt 165 transfers the other end of the substrate positioned between the first and second support members 145 and 146 of the second holder 142 along the substrate transfer path 101. The first and second belt drive sources 166 and 167 drive each of the first and second conveyance belts 164 and 165 at the same travel direction and at the same travel speed. As shown in FIG. 4, the driving force of each of the first and second belt drive sources 166 and 167 is transmitted to each of the first and second conveyance belts 164 and 165 through coupling mechanisms such as belts and gears. do.

In the present invention, the transfer unit 138 for transferring the substrate in the work area 102 along the substrate transfer path 101 is not limited to the illustrated structure, but may be changed to various other structures.

The gap adjusting unit 139 has a structure similar to that of the gap adjusting unit 123 of the transfer unit 103, and varies the width of the holding unit 136 so that the holding unit 136 can hold a substrate having various widths. Let's do it. The gap adjusting unit 139 includes a pair of holder sliders 171 coupled to the second pillar member 144 and a slider drive source 172 for moving the holder sliders 171. Each of the pair of holder sliders 171 is slidably coupled to the pair of guide rails 174 that are coupled to the lifting frame 173.

The pair of guide rails 174 extend in a direction perpendicular to the substrate transfer path 101, so that the pair of holder sliders 171 are close to the first pillar member 143 along the two guide rails 174, or You can slide in a direction away from you. The screw shaft 175 is coupled to the slider drive source 172, and the screw shaft 175 is screwed to the second pillar member 144. When the screw shaft 175 is rotated by the operation of the slider drive source 172, the second pillar member 144 is moved by the screw movement between the screw shaft 175 and the second pillar member 144.

In the present invention, the structure of the gap adjusting unit 139 is not limited to that shown, various other structures capable of sliding the second pillar member 144 in a direction closer to or farther away from the first pillar member 143. Can be changed to

As shown in FIG. 5, the reversing unit 104 is configured to move the holding unit 136 in one direction when the resin coating operation on one surface of the substrate located in the holding unit 136 is completed by the operation of the head unit 105. The upper and lower surfaces of the substrate are reversed by rotating 180 degrees. If the head unit 105 is positioned above the holding unit 136 when the holding unit 136 rotates, the holding unit 136 may hit the head unit 105. In order to solve this problem, the inversion unit 104 is configured to be lowered to the lower direction of the main base 131 and then back to the original position. The lifting operation of the inversion unit 104 is performed by the inversion unit elevating device 109.

As shown in FIGS. 4 and 5, the inversion unit elevating device 109 includes a lifting frame 173 holding the inversion unit 104 and a frame driving source 181 for elevating the lifting frame 173. . The lifting frame 173 is liftably coupled to the plurality of support shafts 179 that are coupled to the sub base 178 disposed below the main base 131. The screw shaft 182 is coupled to the lower surface of the lifting frame 173. The screw shaft 182 penetrates through the sub base 178 and is screwed to the nut pulley 183 rotatably coupled to the sub base 178. The nut pulley 183 is connected to the frame drive source 181 through the drive belt 184 and the drive pulley 185. When the nut pulley 183 rotates by the operation of the frame driving source 181, the screw shaft 182 moves downward or upward of the nut pulley 183, and the lifting frame 173 is lowered or raised.

The inversion unit elevating device 109 having such a configuration lowers the inversion unit 104 before the holding unit 136 rotates, and then, after the holding unit 136 rotates, the inversion unit 104 again. Raise to. In the present invention, the inversion unit elevating device 109 may be changed to various other structures capable of elevating the inversion unit 104 in addition to the illustrated structure.

As shown in FIG. 6, the head unit 105 photographs the head frame 187 coupled to the head unit slider 115 and the substrate transferred to the work area 102 to photograph a portion on which the resin is to be applied onto the substrate. The vision device 188 for detection, the fixed head 189 and the moving head 190, and the fixed head 189 for applying the resin to the substrate transferred to the work area 102 are perpendicular to the X and Y directions. The first Z-axis moving device 194 for moving in the Z direction, the Y-axis moving device 195 for moving the moving head 190 in the Y direction, and the second for moving the moving head 190 in the Z direction. The Z-axis moving device 196 and the X-axis moving device 197 for moving the moving head 190 in the X direction.

The fixed head 189 has a first nozzle 191 for resin injection, and the moving head 190 has a second nozzle 192 for resin injection. In addition, these fixed heads 189 and moving heads 190 have a pump device 193 for pushing the resin to the respective nozzles 191 and 192. The pump device 193 is connected to a syringe (not shown), and supplies the resin stored in the syringe to each of the nozzles 191 and 192.

As shown in FIG. 7, the first Z-axis moving device 194 includes a fixed head slider 202 slidably coupled to the guide rail 201 disposed in the Z direction on the head frame 187. And a slider drive source 203 for moving the fixed head slider 202. A screw shaft 204 screwed to the fixed head slider 202 is coupled to the slider drive source 203. Therefore, when the screw shaft 204 rotates by the operation of the slider drive source 203, the fixed head slider 202 raises or lowers along Z direction.

As shown in FIGS. 7 and 8, the Y-axis moving device 195 includes a first moving head slider slidably coupled to the guide rail 205 disposed in the Y-direction on the head frame 187. 206 and a slider drive source 207 for moving the first moving head slider 206 in the Y direction. A second moving head slider 213 is coupled to the first moving head slider 206 so as to be movable in the Z direction, and a third moving head slider 217 is moved to the second moving head slider 213 in the X direction. Possibly combined. The first moving head slider 206 is screwed with the screw shaft 208, the screw shaft 208 is a slide drive source 207 through the driven pulley 209, drive belt 211, drive pulley 212 Connected with When the slider drive source 207 is operated to rotate the screw shaft 208, the first moving head slider 206 moves forward and backward along the guide rail 205, thereby causing the moving head 190 to move in the Y direction.

The second Z-axis moving device 196 is a second moving head slider 213 and a second moving head movably coupled to the guide rail 214 disposed in the Z direction on the first moving head slider 206. A slider drive source 215 for moving the slider 213 is included. The screw shaft 216 coupled to the slider drive source 215 is screwed into the second moving head slider 213. When the screw shaft 216 rotates by the operation of the slider drive source 215, the second moving head The slider 213 moves so that the moving head 190 moves up or down along the Z direction.

As shown in FIGS. 7 and 8, the X-axis moving device 197 is slidably coupled to the guide rail 218 disposed in the X direction on the second moving head slider 213. And a slider drive source 219 for operating the slider 217 and the third moving head slider 217. The third moving head slider 217 is coupled to the nut member 221, and a screw shaft 222 is screwed to the nut member 221. The screw shaft 222 is connected to the slide drive source 219 through the driven pulley 223, the drive belt 224, the drive pulley 225. When the slider drive source 219 is operated to rotate the screw shaft 222, the nut member 221 moves along the guide rail 218 along with the third moving head slider 217, and the moving head 190 moves in the X direction. I will move forward.

As described above, the head unit 105 has two heads 189 and 191 to which resin can be applied, and the substrates located in the work area 102 with these heads 189 and 191 moving independently. Resin can be applied simultaneously. Therefore, the resin application time can be shortened.

In the present invention, the first and second Z-axis moving devices 194 and 196, the Y-axis moving device 195, and the X-axis moving device 197 are not limited to the structure as shown and described. That is, these devices can be modified into various structures capable of advancing the fixed head 189 along the Z direction and advancing the moving head 190 along the Z, Y and X directions.

Hereinafter, the operation of the resin coating device 100 according to an embodiment of the present invention will be described. When the substrate is loaded in the first transfer unit 103, the transfer unit 103 transfers the substrate to the work area 102. When the substrate reaches the inversion unit 104 disposed in the work area 102, the sensing device 108 detects this and transmits the detection signal to the control device 107, and the control device 107 transfers the transfer unit. (103) is stopped. And the moving unit 106 is operated to move the head unit 105 to the upper portion of the substrate in the working area 102. At this time, the vision device 188 of the head unit 105 photographs the substrate to detect a portion of the resin to be applied on the substrate, and the fixed head 189 and the moving head 190 apply the resin to the substrate.

When the resin coating operation on one surface of the substrate is completed, the inversion unit elevating device 109 is operated to lower the inversion unit 104. This is to prevent the holding unit 136 from hitting the head unit 105 when the holding unit 136 holding the substrate rotates. When the inversion unit 104 is lowered, the holding unit rotating device 137 rotates the holding unit 136 by 180 degrees. As a result, one surface of the substrate on which the resin is applied is faced downward, and the other surface of the substrate on which the resin is not applied is directed upward. After the upper and lower surfaces of the substrate are reversed, the reversing unit elevating device 109 operates to raise the reversing unit 104 to its original position. When the substrate is raised together with the inversion unit 104, the vision device 188 of the head unit 105 operates to detect a portion of the resin to be coated on the substrate, and the fixed head 189 and the moving head 190 are operated. The resin is applied to the substrate.

 When the resin coating operation on one side and the other side of the substrate is completed, the transport unit 138 is operated to transfer the substrate held by the holding unit 136 along the substrate transfer path 101. Subsequently, the substrate outside the work area 102 is transferred to the unloading position by the transfer unit 103 and then separated from the substrate transfer path 101. When a new substrate is loaded into the first transfer unit 103 again, the transfer unit 103 transfers the new substrate to the work area 102 and a resin coating operation is performed on the new substrate.

Since the resin coating apparatus 100 according to the exemplary embodiment of the present invention may reverse the substrate located in the work area 102, the resin may be applied to both surfaces of the substrate. In addition, since the two heads 189 and 191 may apply the resin to the substrate located in the work area 102 at the same time, the resin coating operation on the substrate may be performed quickly. The resin coating apparatus 100 according to the present invention may be used in various semiconductor processes for applying resin to a substrate, including an underfill process.

The present invention described above is not limited to the configuration and operation as shown and described. That is, the present invention is capable of various changes and modifications within the spirit and scope of the appended claims.

1 is a plan view schematically showing a resin coating apparatus according to an embodiment of the present invention.

Figure 2 is a block diagram schematically showing the main configuration of the resin coating apparatus according to an embodiment of the present invention.

Figure 3 is a perspective view showing the transfer unit and the reversing unit and the peripheral configuration of the resin coating apparatus according to an embodiment of the present invention.

Figure 4 is a perspective view schematically showing a reversing unit of the resin coating apparatus according to an embodiment of the present invention.

5 is a side view for explaining the operation of the inversion unit of the resin coating apparatus according to an embodiment of the present invention.

6 to 8 are perspective views showing the head unit of the resin coating apparatus according to an embodiment of the present invention.

♣ Explanation of symbols for the main parts of the drawing ♣

100: resin coating device 101: substrate transfer path

102: working area 103: transfer unit

104: inversion unit 105: head unit

106: mobile unit 107: control device

108: detection device 109: inversion unit lifting device

111, 112: 1st, 2nd fixed beam 113: moving beam

121: conveyor 123, 139: gap adjusting unit

124, 125: 1st, 2nd transfer rail 126: transfer belt

131: main base 136: holding unit

137: holding unit rotation device 138: transport unit

141, 142: first and second holders 143, 144: first and second pillar members

145 and 146: first and second support members 147 and 148: first and second rotation shafts

152, 153: 1st, 2nd power transmission mechanism 164, 165: 1st, 2nd transport belt

166, 167: first and second belt drive source 173: lifting frame

178: sub base 179: support shaft

187: head frame 188: vision device

189: fixed head 191: moving head

192: nozzle 194, 196: first and second Z-axis moving device

195: Y-axis shifter 197: X-axis shifter

Claims (14)

A transfer unit for transferring the substrate to the work area; A head unit for applying resin to a substrate located in the work area; A moving unit for moving the head unit; An inversion unit disposed in the work area and having a holding unit for holding a substrate transferred to the work area and a holding unit rotating device for rotating the holding unit to invert the upper and lower surfaces of the substrate held by the holding unit; ; And a control device for controlling the operation of the transfer unit, the head unit, the moving unit, and the reversing unit. The method of claim 1, The holding unit may be disposed so as to face each other with the substrates transferred to the working area therebetween, the resin applying apparatus comprising a first holder and a second holder for holding respective opposite ends of the substrate. The method of claim 2, The holding unit rotating apparatus includes a first rotation shaft coupled to the first holder, a second rotation shaft coupled to the second holder, and an axis drive source for rotating the first rotation shaft and the second rotation shaft. Resin coating device characterized in that. The method of claim 3, wherein The shaft rotating device includes a drive source and a power transmission mechanism connecting the driving source, the first rotating shaft and the second rotating shaft to synchronously rotate the first rotating shaft and the second rotating shaft. Resin coating device characterized in that. The method of claim 2, And a conveying unit disposed in the work area for discharging the substrate transferred to the work area from the work area. The method of claim 5, Each of the first holder and the second holder includes a first support member and a second support member disposed to face each other to support both sides of the substrate, respectively. The conveying unit may include a first conveyance belt disposed between the first support member and the second support member of the first holder, and a first disposition disposed between the first support member and the second support member of the second holder. And a conveying belt, and a belt driving source for driving the conveying belt and the conveying belt. The method of claim 2, And a gap adjusting unit for moving at least one of the first holder and the second holder so as to vary the gap between the first holder and the second holder. The method of claim 7, wherein The gap adjusting unit includes a holder slider coupled to at least one of the first holder and the second holder, and a slider driving source for moving the holder slider. The method of claim 1, And a reversing unit elevating device for elevating the reversing unit. The method of claim 7, wherein The inversion unit elevating device includes a lifting frame for supporting the inversion unit and a frame driving source for elevating the lifting frame. The method of claim 1, The head unit includes a head frame coupled to the moving unit, a fixed head installed on the head frame having a first nozzle for resin application, and a moving head installed on the head frame having a second nozzle for resin application; And an X-axis moving device for moving the moving head in the X direction perpendicular to the transfer direction of the substrate with respect to the head frame, and moving the moving head in the Y direction parallel to the transfer direction of the substrate with respect to the head frame. Resin coating device comprising a Y-axis moving device for. The method of claim 11, The head unit includes a first Z axis moving device for moving the fixed head in the Z direction perpendicular to the Y direction and the X direction, and a second Z axis moving device for moving the moving head in the Z direction. Resin coating apparatus further comprises a. (a) transferring the substrate along the substrate transfer path to the work area; (b) applying resin to one surface of the substrate located in the work area; (c) inverting the upper and lower surfaces by flipping the substrate located in the work area; (d) applying resin to the other surface of the substrate located in the work area; and (e) discharging the substrate from the working area. The method of claim 13, Steps (b) and (d) apply resin to a substrate located in the work area while moving two resin-applicable heads together, wherein any one of the two heads Resin coating method characterized in that the resin is applied while moving to.
KR1020080138044A 2008-12-31 2008-12-31 Resin Coating Device and Resin Coating Method KR101052277B1 (en)

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