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KR20090010774A - Manufacturing method of diamond grinder and diamond grinder produced thereby - Google Patents

Manufacturing method of diamond grinder and diamond grinder produced thereby Download PDF

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Publication number
KR20090010774A
KR20090010774A KR1020070074141A KR20070074141A KR20090010774A KR 20090010774 A KR20090010774 A KR 20090010774A KR 1020070074141 A KR1020070074141 A KR 1020070074141A KR 20070074141 A KR20070074141 A KR 20070074141A KR 20090010774 A KR20090010774 A KR 20090010774A
Authority
KR
South Korea
Prior art keywords
diamond
polishing
diamond particles
plating layer
abrasive
Prior art date
Application number
KR1020070074141A
Other languages
Korean (ko)
Inventor
맹주호
Original Assignee
에이티티(주)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 에이티티(주) filed Critical 에이티티(주)
Priority to KR1020070074141A priority Critical patent/KR20090010774A/en
Publication of KR20090010774A publication Critical patent/KR20090010774A/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0072—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using adhesives for bonding abrasive particles or grinding elements to a support, e.g. by gluing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
    • B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
    • B24D3/10—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements for porous or cellular structure, e.g. for use with diamonds as abrasives

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Polishing Bodies And Polishing Tools (AREA)

Abstract

The present invention relates to a method for manufacturing a diamond polishing tool and a polishing tool, and more specifically, by pressing the diamond particles in the polishing sphere body and then fixed by plating, diamond particles are firmly fixed to the polishing sphere body, in addition to diamond particles It relates to a method for producing a diamond polishing tool using a new type of indentation method that does not worry that the diamond particles are detached because the fixed layer is fixed to the polishing fluid is not oxidized by the polishing fluid and the diamond polishing tool produced thereby.

According to the present invention, in the method of manufacturing a diamond polishing tool, in which the diamond particles 20 are attached to an upper surface of the polishing object body 10, the process of disposing the diamond particles 20 on the upper surface of the polishing object body 10; Pressurizing the diamond particles 20 such that a part of the diamond particles 20 is press-fitted into the abrasive body 10, and a fixed plating layer for fixing the diamond particles 20 to the top surface of the abrasive body 10. Provided is a method for producing a diamond abrasive tool, and a diamond abrasive tool produced thereby, comprising the step of forming (22).

Description

Manufacturing method of diamond abrasive tool using the indentation method and diamond abrasive tool produced by the same {Manufacturing method of diamond grinder and diamond grinder produced thereby}

The present invention relates to a method for manufacturing a diamond polishing tool and a polishing tool used in the planarization polishing process of a wafer, and more particularly, by injecting the diamond particles into the polishing tool body and fixing them by plating, the diamond particles are polished. The method of manufacturing a diamond polishing tool using a new type of indentation method in which a fixed layer fixed to the main body, and in addition, the fixed layer fixing the diamond particles is not oxidized by the polishing fluid, so that the diamond particles do not detach, and the diamond lead produced thereby It's about harnesses.

In general, as shown in FIG. 1 for planarization of the semiconductor wafer, polishing is performed using a polishing apparatus having a polishing pad 100, wherein a polishing fluid (slurry liquid) 200 is applied to the upper surface of the polishing pad 100. By supplying mechanical polishing and chemical polishing by the polishing fluid 200 to be performed at the same time. However, when the polishing pad 100 is repeatedly used, polishing fluid (slurry liquid) 200, abrasive particles, pad residues, etc. fill the pores of the polishing pad 100, and the surface of the polishing pad 100 is subjected to frictional heat. The polishing surface of the polishing pad 100 is mirrored to lose an appropriate level of roughness, thereby degrading the polishing function. According to this problem, the diamond polishing tool 400 is used to restore the surface flatness or surface roughness of the polishing pad 100 to a level suitable for polishing the wafer 300.

The diamond abrasive 400 is electroplated on the upper surface of the abrasive body, and the nickel plating layer adheres the abrasive particles, that is, diamond particles, or the nickel metal powder is melted on the upper surface of the abrasive sphere to melt the molten metal layer. It is produced using a melting method for attaching diamond particles. In the diamond polishing tool manufactured as described above, the diamond particles are attached to the upper surface of the polishing tool body 4 by the fixed layer 6, that is, the plating layer or the molten metal layer, as shown in FIG. 2.

On the other hand, the polishing fluid 200 as described above is mainly used having a strong base of about pH 10 ~ 12 and having a strong acidity of about pH 3 ~ 4 are mainly used. In the case where a strong acid is used as the polishing fluid 200, the fixed layer 6 for fixing the diamond particles 2 of the polishing tool is oxidized by the polishing fluid 200. As described above, the diamond particles 2 are oxidized. Since the fixed layer 6 is oxidized, the diamond grains 2 are detached from the polishing tool because the fixed layer 6 is attached to the upper surface of the polishing tool body 4. The detached diamond particles 2 cause fatal damage to the surface of the wafer 300. Particularly, in the process of crushing diamond to make diamond particles, the diamond is not completely crushed into particles of a predetermined size, and some of them are connected, so that particles of the same shape as two diamond particles are attached up and down may be generated. When (2) is attached to the polishing sphere body 4, the vulnerable portion of the diamond grains 2 is broken during the planarization of the wafer 300, so that a part of the diamond grains 2 is often broken off.

The present invention is to solve the above problems, an object of the present invention is to press the diamond particles in the polishing sphere body and then plated and fixed, so that the diamond particles are detached even if the fixed layer on which the diamond particles are fixed is oxidized by the polishing fluid. In addition, a protective plating layer is formed of a metal having excellent chemical resistance and corrosion resistance on the fixed layer so that the fixed layer is not oxidized. A method for producing a diamond abrasive tool and a diamond abrasive tool produced thereby.

According to the present invention, in the method of manufacturing a diamond polishing tool, in which the diamond particles 20 are attached to an upper surface of the polishing object body 10, the process of disposing the diamond particles 20 on the upper surface of the polishing object body 10; Pressurizing the diamond particles 20 such that a part of the diamond particles 20 is press-fitted into the abrasive body 10, and a fixed plating layer for fixing the diamond particles 20 to the top surface of the abrasive body 10. Provided is a method for producing a diamond abrasive tool, comprising the step of forming (22).

According to another feature of the present invention, after the process of forming the high plating layer 22 is a process of forming a protective plating layer 26 on the high plating layer 22 is added, the high plating layer 22 is made of nickel In addition, the protective plating layer 26 is provided with a method of manufacturing a diamond abrasive, characterized in that consisting of one of rhodium, palladium, chromium, gold, platinum, cobalt.

According to another feature of the present invention, before the diamond particles 20 are disposed on the polishing sphere body 10, the soft plating layer 24 is formed on the polishing sphere body 10, or the polishing sphere body 10 is formed. Provided is a method of manufacturing a diamond polishing tool, wherein the upper surface is attached with one of a soft metal plate and a conductive synthetic resin plate.

According to another feature of the present invention, in the diamond polishing tool formed by attaching the diamond particles 20 to the upper surface of the polishing sphere body 10, a part of the diamond particles 20 to the polishing sphere body 10 A diamond polishing tool is press-fitted, and the upper surface of the polishing tool body 10 is provided with a fixed plating layer 22 to fix the diamond particles 20.

According to the present invention as described above, by pressing the diamond particles 20 to press the diamond particles 20 on the upper surface of the polishing sphere body 10, the diamond particles 20 on the upper surface of the polishing sphere body 10, a high plating layer ( 22) there is provided a method of producing a diamond abrasive ball by fixing. In the polishing tool manufactured by this method, since the lower end portion of the diamond particles 20 is fixed by the high plating layer 22 while being pressed into the upper surface of the polishing tool body 10, the fixation state of the diamond particles 20 is considerably firm. Therefore, there is no fear that the diamond particles 20 may detach during the planarization of the wafer. In particular, in the process of crushing the diamond to make the diamond particles to make the diamond particles, the diamond is not completely broken into diamond particles of a predetermined size, but the part is connected to produce particles 20 as if two diamond particles are connected up and down. In the case where the diamond particles 20 are disposed on the upper surface of the polishing sphere body 10, when the vulnerable portion of the diamond particles 20 is pressed into the polishing sphere body 10, the diamond particles 20 are pressed during the planarization of the wafer. There is no fear that the fragile portion of 20 is broken and the diamond particles 20 are detached.

In addition, when the high plating layer 22 is formed by plating having excellent chemical resistance and corrosion resistance, there is no fear that the high plating layer 22 may be oxidized by the polishing fluid, and thus the possibility of the diamond particles 20 being detached is further reduced. Thus, not only the life of the polishing tool is extended, but also the wafer is prevented from being damaged during the planarization operation of the wafer.

Hereinafter, the polishing tool manufacturing method according to the present invention will be described in more detail. 3 is a view showing the indentation process according to the present invention, Figure 4 is an enlarged cross-sectional view of the polishing tool produced by the above process.

First, the diamond particles 20 are disposed on the upper surface of the polishing sphere body 10 made of stainless steel. At this time, the screen is placed on the upper surface of the polishing sphere body 10, the diamond particles 20 are sprayed and subjected to vibration so that the diamond particles 20 are accommodated in the mesh of the screen. And after removing the diamond particles 20 not accommodated in the mesh of the screen is also removed the screen. In this way, the diamond particles 20 are arranged in a predetermined shape on the upper surface of the polishing sphere body 10. If necessary, a conductive adhesive is applied to the top surface of the polishing body 10 before the diamond particles 20 are disposed on the top surface of the polishing body 10. When the conductive adhesive is applied in this way, the diamond particles 20 are temporarily bonded to the upper surface of the polishing sphere body 10 by the adhesive, thereby preventing the diamond particles 20 from flowing in the subsequent process. The use of the conductive adhesive is intended to prevent the plating from being disturbed by the adhesive in the plating process described later. In some cases, the metal powder may be melted on the upper surface of the polishing body 10 so that the diamond particles 20 are temporarily bonded to the upper surface of the polishing body 10 by the molten metal.

As such, the diamond particles 20 are disposed on the upper surface of the abrasive sphere 10, and then presses the diamond particles 20 by a press so that a portion of the diamond particles 20 is pressed into the upper surface of the abrasive sphere 10. 3 is a cross-sectional view showing a process of pressing the diamond particles 20 to the abrasive sphere body 10. As shown in the drawing, the diamond particles 20 are pressed against the polishing body 10 using a pair of upper and lower presses 2 and 4 having flat surfaces. In this way, the diamond particles 20 are press-fitted into the abrasive body 10 while the protrusion height is constantly aligned. Preferably, 60 to 70% of the diamond particles 20 are pressed into the upper surface of the polishing sphere body 10.

As described above, when 60 to 70% of the diamond particles 20 are press-fitted, in the process of crushing the diamond to make the diamond particles, the particles are not completely broken, and some parts are attached to each other, as if two diamond particles are attached up and down. Vulnerable portion of the diamond particles 20 of the form is completely pressed into the abrasive body (10).

After doing this, the high plating layer 22 for completely fixing the diamond particles 20 on the upper surface of the polishing sphere body 20 is formed. By the high plating layer 22, the diamond particles 20 are fixed to the upper surface of the polishing sphere body 10. The high plating layer 22 is made of nickel. Although nickel is inexpensive, chemical resistance and corrosion resistance are somewhat weak, thereby forming a protective plating layer 26 of rhodium, palladium, chromium, gold, platinum, and cobalt having excellent chemical resistance and corrosion resistance on the high plating layer 22. 5 is an enlarged cross-sectional view of the polishing tool in which the protective plating layer 26 is formed on the fixed plating layer 22. In this case, in the case where a strongly acidic polishing fluid is used, the fixed plating layer 22 made of nickel is protected by the protective plating layer 26.

If necessary, as shown in FIG. 6, the soft plating layer 24 may be formed on the upper surface of the polishing sphere body 10 and the diamond particles 20 may be press-fitted. In this case, the soft plating layer 24 has an advantage of pressing the diamond particles 20 to the same depth with a relatively small force. In some cases, instead of forming the flexible plating layer 24, a soft metal plate or a conductive plastic plate may be attached. Copper plates are used as the soft metal plates, and these metal plates and plastic plates are attached by a conductive adhesive.

1 is a block diagram of a general semiconductor wafer polishing mechanism

2 is an enlarged cross-sectional view of a conventional diamond polishing tool

3 is a cross-sectional view showing a process of pressing the diamond particles by the present invention.

Figure 4 is an enlarged cross-sectional view of the diamond abrasive sphere produced by the present invention

Figure 5 is an enlarged cross-sectional view showing another embodiment of the present invention

Figure 6 is an enlarged cross-sectional view showing another embodiment of the present invention

Claims (4)

In the method for manufacturing a diamond polishing tool, wherein the diamond particles 20 are attached to an upper surface of the polishing object body 10, a process of disposing the diamond particles 20 on the upper surface of the polishing object body 10, and the diamond particles 20. Pressurizing the diamond particles 20 so that a portion of the abrasive particles are press-fitted into the abrasive body 10, and forming a fixed plating layer 22 for fixing the diamond particles 20 to the top surface of the abrasive body 10. Method for producing a diamond polishing tool, characterized in that made, including the process. The method of claim 1, wherein after the forming of the fixed plating layer 22, a process of plating the protective plating layer 26 on the fixed plating layer 22 is added, and the fixed plating layer 22 is made of nickel. The protective plating layer 26 is a method for producing a diamond abrasive, characterized in that made of one of rhodium, palladium, chromium, gold, platinum, cobalt. The flexible plating layer 24 according to any one of claims 1 to 2, wherein before the diamond particles 20 are disposed on the polishing sphere body 10, the soft plating layer 24 is formed on or polished. Method for producing a diamond abrasive ball, characterized in that one of the flexible metal plate and the conductive synthetic resin plate attached to the upper surface of the harness body (10). In the diamond polishing tool formed by attaching the diamond particles 20 to the upper surface of the abrasive body 10, a part of the diamond particles 20 is pressed into the abrasive body 10, the abrasive body 10 The upper surface of the diamond abrasive, characterized in that the fixed plating layer 22 is fixed to the diamond particles 20 is formed.
KR1020070074141A 2007-07-24 2007-07-24 Manufacturing method of diamond grinder and diamond grinder produced thereby KR20090010774A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020070074141A KR20090010774A (en) 2007-07-24 2007-07-24 Manufacturing method of diamond grinder and diamond grinder produced thereby

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020070074141A KR20090010774A (en) 2007-07-24 2007-07-24 Manufacturing method of diamond grinder and diamond grinder produced thereby

Publications (1)

Publication Number Publication Date
KR20090010774A true KR20090010774A (en) 2009-01-30

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210205958A1 (en) * 2018-06-15 2021-07-08 Mirka Ltd Abrading with an abrading plate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210205958A1 (en) * 2018-06-15 2021-07-08 Mirka Ltd Abrading with an abrading plate

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