KR20080048053A - 전자결합 모듈 부가 물품 - Google Patents
전자결합 모듈 부가 물품 Download PDFInfo
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- KR20080048053A KR20080048053A KR1020087007773A KR20087007773A KR20080048053A KR 20080048053 A KR20080048053 A KR 20080048053A KR 1020087007773 A KR1020087007773 A KR 1020087007773A KR 20087007773 A KR20087007773 A KR 20087007773A KR 20080048053 A KR20080048053 A KR 20080048053A
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- chip
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- power supply
- supply circuit
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- H—ELECTRICITY
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- H05K1/00—Printed circuits
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Abstract
Description
Claims (21)
- 무선 IC칩과, 상기 무선 IC칩을 탑재하고, 소정의 공진 주파수를 가지는 공진회로를 포함하는 급전회로를 마련한 급전회로 기판으로 이루어지는 전자(電磁)결합 모듈이 물품에 장착되어 있고,상기 물품은 상기 전자결합 모듈의 상기 급전회로로부터 전자결합을 통하여 공급된 송신신호를 방사하는, 및/또는, 받은 수신신호를 전자결합을 통하여 상기 급전회로에 공급하는 방사판을 구비하고 있는 것을 특징으로 하는 전자결합 모듈 부가 물품.
- 제1항에 있어서, 상기 방사판은 물품 그 자체가 본래 가지고 있는 금속물인 것을 특징으로 하는 전자결합 모듈 부가 물품.
- 제1항에 있어서, 상기 방사판은 방사판용으로 물품에 부여된 금속 패턴인 것을 특징으로 하는 전자결합 모듈 부가 물품.
- 제1항에 있어서, 상기 방사판은 유전체인 것을 특징으로 하는 전자결합 모듈 부가 물품.
- 제1항 내지 제4항 중 어느 한 항에 있어서, 상기 공진회로는 커패시터 소자 와 인덕터 소자로 구성된 집중 상수형 공진회로인 것을 특징으로 하는 전자결합 모듈 부가 물품.
- 제5항에 있어서, 상기 집중 상수형 공진회로는 LC 직렬 공진회로 또는 LC 병렬 공진회로인 것을 특징으로 하는 전자결합 모듈 부가 물품.
- 제6항에 있어서, 상기 집중 상수형 공진회로는 복수의 LC 직렬 공진회로 또는 복수의 LC 병렬 공진회로를 포함하여 구성되어 있는 것을 특징으로 하는 전자결합 모듈 부가 물품.
- 제5항 내지 제7항 중 어느 한 항에 있어서, 상기 커패시터 소자는 상기 무선 IC칩의 후단이며, 상기 무선 IC칩과 상기 인덕터 소자 사이에 배치되어 있는 것을 특징으로 하는 전자결합 모듈 부가 물품.
- 제5항 내지 제8항 중 어느 한 항에 있어서, 상기 급전회로 기판은 복수의 유전체층 또는 자성체층을 적층하여 이루어지는 다층기판이며, 상기 커패시터 소자와 상기 인덕터 소자는 상기 다층기판의 표면 및/또는 내부에 형성되어 있는 것을 특징으로 하는 전자결합 모듈 부가 물품.
- 제5항 내지 제8항 중 어느 한 항에 있어서, 상기 급전회로 기판은 유전체 또 는 자성체의 단층 기판이며, 상기 커패시터 소자 및/또는 인덕터 소자는 상기 단층 기판의 표면에 형성되어 있는 것을 특징으로 하는 전자결합 모듈 부가 물품.
- 제1항 내지 제10항 중 어느 한 항에 있어서, 상기 급전회로 기판은 단단한(rigid) 수지제 또는 세라믹제의 기판인 것을 특징으로 하는 전자결합 모듈 부가 물품.
- 제1항 내지 제11항 중 어느 한 항에 있어서, 상기 방사판의 전기장은 상기 공진 주파수의 반파장의 정수(整數)배인 것을 특징으로 하는 전자결합 모듈 부가 물품.
- 제1항 내지 제12항 중 어느 한 항에 있어서, 상기 무선 IC칩에 칩측 전극 패턴이 마련되어져 있으면서, 상기 급전회로 기판에 제1기판측 전극 패턴이 마련되어져 있고, 상기 무선 IC칩과 상기 급전회로 기판은 상기 칩측 전극 패턴과 상기 제1기판측 전극 패턴에 의해 직접 전기적으로 접속되어 있는 것을 특징으로 하는 전자결합 모듈 부가 물품.
- 제1항 내지 제12항 중 어느 한 항에 있어서, 상기 무선 IC칩에 칩측 전극 패턴이 마련되어져 있으면서, 상기 급전회로 기판에 제1기판측 전극 패턴이 마련되어져 있고, 상기 무선 IC칩과 상기 급전회로 기판은 상기 칩측 전극 패턴과 상기 제1 기판측 전극 패턴 사이의 용량결합에 의해 접속되어 있는 것을 특징으로 하는 전자결합 모듈 부가 물품.
- 제14항에 있어서, 상기 칩측 전극 패턴 및 상기 제1기판측 전극 패턴은 각각 서로 평행한 평면전극 패턴이며, 상기 무선 IC칩과 상기 급전회로 기판은 유전성 접착층을 통하여 접합되어 있는 것을 특징으로 하는 전자결합 모듈 부가 물품.
- 제1항 내지 제12항 중 어느 한 항에 있어서, 상기 무선 IC칩에 칩측 전극 패턴이 마련되어져 있으면서, 상기 급전회로 기판에 제1기판측 전극 패턴이 마련되어져 있고, 상기 무선 IC칩과 상기 급전회로 기판은 상기 칩측 전극 패턴과 상기 제1기판측 전극 패턴 사이의 자기결합에 의해 접속되어 있는 것을 특징으로 하는 전자결합 모듈 부가 물품.
- 제16항에 있어서, 상기 칩측 전극 패턴 및 상기 제1기판측 전극 패턴은 각각 코일상 전극 패턴이며, 상기 무선 IC칩과 상기 급전회로 기판은 절연성 또는 자성 접착층을 통하여 접합되어 있는 것을 특징으로 하는 전자결합 모듈 부가 물품.
- 제1항 내지 제17항 중 어느 한 항에 있어서, 상기 급전회로 기판에 제2기판측 전극 패턴이 마련되어져 있고, 상기 급전회로 기판과 상기 방사판은 상기 제2기판측 전극 패턴과 상기 방사판 사이의 용량결합에 의해 접속되어 있는 것을 특징으 로 하는 전자결합 모듈 부가 물품.
- 제18항에 있어서, 상기 제2기판측 전극 패턴은 상기 방사판에 대하여 평행하게 배치된 평면전극 패턴이며, 상기 급전회로 기판과 상기 방사판은 유전성 접착층을 통하여 접합되어 있는 것을 특징으로 하는 전자결합 모듈 부가 물품.
- 제1항 내지 제17항 중 어느 한 항에 있어서, 상기 급전회로 기판에 제2기판측 전극 패턴이 마련되어져 있고, 상기 급전회로 기판과 상기 방사판은 상기 제2기판측 전극 패턴과 상기 방사판 사이의 자기결합에 의해 접속되어 있는 것을 특징으로 하는 전자결합 모듈 부가 물품.
- 제20항에 있어서, 상기 제2기판측 전극 패턴은 코일상 전극 패턴이며, 상기 급전회로 기판과 상기 방사판은 절연성 또는 자성 접착층을 통하여 접합되어 있는 것을 특징으로 하는 전자결합 모듈 부가 물품.
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101425460B1 (ko) * | 2011-09-30 | 2014-08-01 | 브로드콤 코포레이션 | 무선으로 동작가능한 기능 블록들을 갖는 장치 |
Families Citing this family (107)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7519328B2 (en) | 2006-01-19 | 2009-04-14 | Murata Manufacturing Co., Ltd. | Wireless IC device and component for wireless IC device |
US9064198B2 (en) | 2006-04-26 | 2015-06-23 | Murata Manufacturing Co., Ltd. | Electromagnetic-coupling-module-attached article |
WO2008001561A1 (fr) | 2006-06-30 | 2008-01-03 | Murata Manufacturing Co., Ltd. | Disque optique |
DE112007002024B4 (de) | 2006-09-26 | 2010-06-10 | Murata Mfg. Co., Ltd., Nagaokakyo-shi | Induktiv gekoppeltes Modul und Element mit induktiv gekoppeltem Modul |
EP2056488B1 (en) | 2006-10-27 | 2014-09-03 | Murata Manufacturing Co. Ltd. | Article with electromagnetically coupled module |
JP4844385B2 (ja) * | 2006-12-27 | 2011-12-28 | 株式会社村田製作所 | 無線通信システム |
WO2008096576A1 (ja) | 2007-02-06 | 2008-08-14 | Murata Manufacturing Co., Ltd. | 電磁結合モジュール付き包装材 |
ATE555453T1 (de) | 2007-04-06 | 2012-05-15 | Murata Manufacturing Co | Funk-ic-vorrichtung |
WO2008126649A1 (ja) | 2007-04-09 | 2008-10-23 | Murata Manufacturing Co., Ltd. | 無線icデバイス |
US8235299B2 (en) | 2007-07-04 | 2012-08-07 | Murata Manufacturing Co., Ltd. | Wireless IC device and component for wireless IC device |
CN101601055B (zh) | 2007-04-26 | 2012-11-14 | 株式会社村田制作所 | 无线ic器件 |
JP4666101B2 (ja) | 2007-04-27 | 2011-04-06 | 株式会社村田製作所 | 無線icデバイス |
EP2141636B1 (en) | 2007-04-27 | 2012-02-01 | Murata Manufacturing Co. Ltd. | Wireless ic device |
JP4525859B2 (ja) | 2007-05-10 | 2010-08-18 | 株式会社村田製作所 | 無線icデバイス |
EP2148449B1 (en) | 2007-05-11 | 2012-12-12 | Murata Manufacturing Co., Ltd. | Wireless ic device |
CN104078767B (zh) | 2007-07-09 | 2015-12-09 | 株式会社村田制作所 | 无线ic器件 |
KR101037035B1 (ko) | 2007-07-17 | 2011-05-25 | 가부시키가이샤 무라타 세이사쿠쇼 | 무선 ic 디바이스 및 전자기기 |
US20090021352A1 (en) | 2007-07-18 | 2009-01-22 | Murata Manufacturing Co., Ltd. | Radio frequency ic device and electronic apparatus |
WO2009011423A1 (ja) * | 2007-07-18 | 2009-01-22 | Murata Manufacturing Co., Ltd. | 無線icデバイス |
EP2169594B1 (en) | 2007-07-18 | 2018-03-07 | Murata Manufacturing Co., Ltd. | Wireless ic device and method for manufacturing the same |
EP2096709B1 (en) * | 2007-12-20 | 2012-04-25 | Murata Manufacturing Co., Ltd. | Radio ic device |
CN103401063B (zh) | 2007-12-26 | 2018-03-02 | 株式会社村田制作所 | 天线装置及无线ic器件 |
JP5200557B2 (ja) * | 2008-01-25 | 2013-06-05 | 株式会社村田製作所 | 無線icデバイスの製造方法 |
JP4518211B2 (ja) | 2008-03-03 | 2010-08-04 | 株式会社村田製作所 | 複合アンテナ |
EP2251934B1 (en) | 2008-03-03 | 2018-05-02 | Murata Manufacturing Co. Ltd. | Wireless ic device and wireless communication system |
EP2256861B1 (en) | 2008-03-26 | 2018-12-05 | Murata Manufacturing Co., Ltd. | Radio ic device |
CN101953025A (zh) | 2008-04-14 | 2011-01-19 | 株式会社村田制作所 | 无线ic器件、电子设备以及无线ic器件的谐振频率调整方法 |
WO2009142114A1 (ja) | 2008-05-21 | 2009-11-26 | 株式会社村田製作所 | 無線icデバイス |
WO2009142068A1 (ja) | 2008-05-22 | 2009-11-26 | 株式会社村田製作所 | 無線icデバイス及びその製造方法 |
CN102047271B (zh) | 2008-05-26 | 2014-12-17 | 株式会社村田制作所 | 无线ic器件系统及无线ic器件的真伪判定方法 |
JP4535210B2 (ja) | 2008-05-28 | 2010-09-01 | 株式会社村田製作所 | 無線icデバイス用部品および無線icデバイス |
JP4557186B2 (ja) | 2008-06-25 | 2010-10-06 | 株式会社村田製作所 | 無線icデバイスとその製造方法 |
EP2306586B1 (en) | 2008-07-04 | 2014-04-02 | Murata Manufacturing Co. Ltd. | Wireless ic device |
WO2010021217A1 (ja) | 2008-08-19 | 2010-02-25 | 株式会社村田製作所 | 無線icデバイス及びその製造方法 |
JP5429182B2 (ja) | 2008-10-24 | 2014-02-26 | 株式会社村田製作所 | 無線icデバイス |
DE112009002399B4 (de) | 2008-10-29 | 2022-08-18 | Murata Manufacturing Co., Ltd. | Funk-IC-Bauelement |
WO2010055945A1 (ja) | 2008-11-17 | 2010-05-20 | 株式会社村田製作所 | アンテナ及び無線icデバイス |
CN103500873B (zh) | 2009-01-09 | 2016-08-31 | 株式会社村田制作所 | 无线ic器件及无线ic模块 |
WO2010082413A1 (ja) | 2009-01-16 | 2010-07-22 | 株式会社村田製作所 | 高周波デバイス及び無線icデバイス |
CN102301528B (zh) | 2009-01-30 | 2015-01-28 | 株式会社村田制作所 | 天线及无线ic器件 |
WO2010119854A1 (ja) | 2009-04-14 | 2010-10-21 | 株式会社村田製作所 | 無線icデバイス用部品及び無線icデバイス |
EP2568417B1 (en) | 2009-04-21 | 2018-07-04 | Murata Manufacturing Co., Ltd. | Antenna device and method of setting resonant frequency of antenna device |
CN102449846B (zh) | 2009-06-03 | 2015-02-04 | 株式会社村田制作所 | 无线ic器件及其制造方法 |
WO2010146944A1 (ja) | 2009-06-19 | 2010-12-23 | 株式会社村田製作所 | 無線icデバイス及び給電回路と放射板との結合方法 |
JP4788850B2 (ja) | 2009-07-03 | 2011-10-05 | 株式会社村田製作所 | アンテナモジュール |
WO2011037234A1 (ja) | 2009-09-28 | 2011-03-31 | 株式会社村田製作所 | 無線icデバイスおよびそれを用いた環境状態検出方法 |
WO2011040393A1 (ja) | 2009-09-30 | 2011-04-07 | 株式会社村田製作所 | 回路基板及びその製造方法 |
JP5304580B2 (ja) * | 2009-10-02 | 2013-10-02 | 株式会社村田製作所 | 無線icデバイス |
JP5522177B2 (ja) | 2009-10-16 | 2014-06-18 | 株式会社村田製作所 | アンテナ及び無線icデバイス |
WO2011052310A1 (ja) | 2009-10-27 | 2011-05-05 | 株式会社村田製作所 | 送受信装置及び無線タグ読み取り装置 |
JP5333601B2 (ja) | 2009-11-04 | 2013-11-06 | 株式会社村田製作所 | 通信端末及び情報処理システム |
WO2011055703A1 (ja) | 2009-11-04 | 2011-05-12 | 株式会社村田製作所 | 通信端末及び情報処理システム |
EP2498207B1 (en) | 2009-11-04 | 2014-12-31 | Murata Manufacturing Co., Ltd. | Wireless ic tag, reader/writer, and information processing system |
JP4930658B2 (ja) | 2009-11-20 | 2012-05-16 | 株式会社村田製作所 | アンテナ装置及び移動体通信端末 |
CN102687338B (zh) | 2009-12-24 | 2015-05-27 | 株式会社村田制作所 | 天线及便携终端 |
WO2011093438A1 (ja) * | 2010-01-29 | 2011-08-04 | 株式会社村田製作所 | 電力受電装置及び電力送電装置 |
GB2490268A (en) | 2010-02-19 | 2012-10-24 | Murata Manufacturing Co | Composite printed wiring board and wireless communication system |
CN102792520B (zh) | 2010-03-03 | 2017-08-25 | 株式会社村田制作所 | 无线通信模块以及无线通信设备 |
WO2011108341A1 (ja) | 2010-03-03 | 2011-09-09 | 株式会社村田製作所 | 無線通信デバイス及び無線通信端末 |
JP5477459B2 (ja) | 2010-03-12 | 2014-04-23 | 株式会社村田製作所 | 無線通信デバイス及び金属製物品 |
JP5370581B2 (ja) | 2010-03-24 | 2013-12-18 | 株式会社村田製作所 | Rfidシステム |
WO2011122163A1 (ja) | 2010-03-31 | 2011-10-06 | 株式会社村田製作所 | アンテナ装置及び無線通信デバイス |
JP5170156B2 (ja) * | 2010-05-14 | 2013-03-27 | 株式会社村田製作所 | 無線icデバイス |
JP5299351B2 (ja) | 2010-05-14 | 2013-09-25 | 株式会社村田製作所 | 無線icデバイス |
WO2012005278A1 (ja) | 2010-07-08 | 2012-01-12 | 株式会社村田製作所 | アンテナ及びrfidデバイス |
WO2012014939A1 (ja) | 2010-07-28 | 2012-02-02 | 株式会社村田製作所 | アンテナ装置および通信端末機器 |
WO2012020748A1 (ja) | 2010-08-10 | 2012-02-16 | 株式会社村田製作所 | プリント配線板及び無線通信システム |
JP5234071B2 (ja) | 2010-09-03 | 2013-07-10 | 株式会社村田製作所 | Rficモジュール |
JP5672874B2 (ja) * | 2010-09-09 | 2015-02-18 | 株式会社村田製作所 | 無線icタグ及びrfidシステム |
JP5630166B2 (ja) * | 2010-09-09 | 2014-11-26 | 株式会社村田製作所 | 無線icタグ及びrfidシステム |
CN103038939B (zh) | 2010-09-30 | 2015-11-25 | 株式会社村田制作所 | 无线ic器件 |
CN105206919B (zh) | 2010-10-12 | 2018-11-02 | 株式会社村田制作所 | 天线装置及终端装置 |
JP5527422B2 (ja) | 2010-10-21 | 2014-06-18 | 株式会社村田製作所 | 通信端末装置 |
JP5450370B2 (ja) * | 2010-12-22 | 2014-03-26 | アルプス電気株式会社 | 電池パック真贋判定機能付き携帯端末 |
CN105048058B (zh) | 2011-01-05 | 2017-10-27 | 株式会社村田制作所 | 无线通信器件 |
JP5304956B2 (ja) | 2011-01-14 | 2013-10-02 | 株式会社村田製作所 | Rfidチップパッケージ及びrfidタグ |
US8901945B2 (en) | 2011-02-23 | 2014-12-02 | Broadcom Corporation | Test board for use with devices having wirelessly enabled functional blocks and method of using same |
CN104899639B (zh) | 2011-02-28 | 2018-08-07 | 株式会社村田制作所 | 无线通信器件 |
WO2012121185A1 (ja) | 2011-03-08 | 2012-09-13 | 株式会社村田製作所 | アンテナ装置及び通信端末機器 |
CN103081221B (zh) | 2011-04-05 | 2016-06-08 | 株式会社村田制作所 | 无线通信器件 |
WO2012141070A1 (ja) | 2011-04-13 | 2012-10-18 | 株式会社村田製作所 | 無線icデバイス及び無線通信端末 |
JP5569648B2 (ja) | 2011-05-16 | 2014-08-13 | 株式会社村田製作所 | 無線icデバイス |
RU2475841C1 (ru) * | 2011-07-01 | 2013-02-20 | Общество с ограниченной ответственностью "Зевс" | Считыватель радиочастотных меток и способ их считывания с его помощью |
CN103370834B (zh) | 2011-07-14 | 2016-04-13 | 株式会社村田制作所 | 无线通信器件 |
CN103370886B (zh) | 2011-07-15 | 2015-05-20 | 株式会社村田制作所 | 无线通信器件 |
CN203850432U (zh) | 2011-07-19 | 2014-09-24 | 株式会社村田制作所 | 天线装置以及通信终端装置 |
WO2013035821A1 (ja) | 2011-09-09 | 2013-03-14 | 株式会社村田製作所 | アンテナ装置および無線デバイス |
CN103380432B (zh) | 2011-12-01 | 2016-10-19 | 株式会社村田制作所 | 无线ic器件及其制造方法 |
CN103430382B (zh) | 2012-01-30 | 2015-07-15 | 株式会社村田制作所 | 无线ic器件 |
WO2013125610A1 (ja) | 2012-02-24 | 2013-08-29 | 株式会社村田製作所 | アンテナ装置および無線通信装置 |
WO2013153697A1 (ja) | 2012-04-13 | 2013-10-17 | 株式会社村田製作所 | Rfidタグの検査方法及び検査装置 |
CN102740596A (zh) * | 2012-06-19 | 2012-10-17 | 深圳市共进电子股份有限公司 | Pcb印刷微带电感 |
CN105975889B (zh) | 2012-06-28 | 2020-01-03 | 株式会社村田制作所 | 天线装置及通信终端装置 |
JP2014175586A (ja) * | 2013-03-12 | 2014-09-22 | Nippon Soken Inc | 磁界共鳴コイル装置 |
CN103617445A (zh) * | 2013-11-21 | 2014-03-05 | 高洪强 | 一种壳体uhf-rfid电子标签 |
DE112015000532T5 (de) * | 2014-01-28 | 2016-10-20 | Murata Manufacturing Co., Ltd. | Artikel mit Drahtloskommunikationskennung |
DE102014225389A1 (de) * | 2014-12-10 | 2016-06-16 | EnBW Energie Baden-Württemberg AG | Flächenantenne |
JP5983724B2 (ja) * | 2014-12-26 | 2016-09-06 | 株式会社村田製作所 | 無線icタグ及びrfidシステム |
CN106207383A (zh) * | 2015-05-06 | 2016-12-07 | 佳邦科技股份有限公司 | 通信模组 |
CN108293294A (zh) * | 2015-12-31 | 2018-07-17 | 英特尔公司 | 用于封装和pcb中针对具有盲孔和埋孔的组装件的电感补偿的微线圈装置 |
WO2017187862A1 (ja) * | 2016-04-28 | 2017-11-02 | 株式会社村田製作所 | アンテナ装置および電子機器 |
JP2016170808A (ja) * | 2016-06-03 | 2016-09-23 | 株式会社村田製作所 | 無線icタグ及びrfidシステム |
JP6493627B2 (ja) | 2016-07-14 | 2019-04-03 | 株式会社村田製作所 | 小売物品用アテンション及びこれを付した小売物品 |
CN111492376B (zh) * | 2017-10-16 | 2024-01-23 | Gcl国际有限公司 | 闭合构件 |
RU2693003C1 (ru) * | 2018-09-20 | 2019-06-28 | Общество с ограниченной ответственностью "Семаргл" | Кейс для инструментов с радиочастотными R-fid метками |
US11822998B2 (en) | 2019-01-17 | 2023-11-21 | Frisense Limited | Electronic tag |
JP2023509910A (ja) * | 2019-12-28 | 2023-03-10 | エイヴェリー デニソン リテール インフォメーション サービシズ リミテッド ライアビリティ カンパニー | 多層反応性ストラップを有するrfid装置及び関連システム並びに方法 |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AT393054B (de) * | 1989-07-27 | 1991-08-12 | Siemens Ag Oesterreich | Sende- und/oder empfangsanordnung fuer tragbare geraete |
JPH087059A (ja) * | 1994-06-21 | 1996-01-12 | Sony Chem Corp | 非接触情報カード |
AUPO055296A0 (en) † | 1996-06-19 | 1996-07-11 | Integrated Silicon Design Pty Ltd | Enhanced range transponder system |
EP0977145A3 (en) † | 1998-07-28 | 2002-11-06 | Kabushiki Kaisha Toshiba | Radio IC card |
JP4186149B2 (ja) † | 1999-12-06 | 2008-11-26 | 株式会社エフ・イー・シー | Icカード用の補助アンテナ |
JP4624536B2 (ja) † | 2000-04-04 | 2011-02-02 | 大日本印刷株式会社 | 非接触式データキャリア装置 |
JP4624537B2 (ja) † | 2000-04-04 | 2011-02-02 | 大日本印刷株式会社 | 非接触式データキャリア装置、収納体 |
JP4562892B2 (ja) † | 2000-10-02 | 2010-10-13 | 大日本印刷株式会社 | 非接触式データキャリア装置とブースターアンテナ部用配線部材 |
JP2002141731A (ja) * | 2000-10-30 | 2002-05-17 | Oji Paper Co Ltd | Ic実装体及び共振周波数調整方法 |
JP2002290131A (ja) * | 2000-12-18 | 2002-10-04 | Mitsubishi Materials Corp | トランスポンダ用アンテナ |
JP3896965B2 (ja) * | 2002-01-17 | 2007-03-22 | 三菱マテリアル株式会社 | リーダ/ライタ用アンテナ及び該アンテナを備えたリーダ/ライタ |
DE10258670A1 (de) † | 2002-12-13 | 2004-06-24 | Giesecke & Devrient Gmbh | Transponder zur berührungslosen Übertragung von Daten |
US20050054399A1 (en) * | 2003-09-10 | 2005-03-10 | Buris Nicholas E. | Method and apparatus for providing improved antenna bandwidth |
JP3570430B1 (ja) | 2003-10-29 | 2004-09-29 | オムロン株式会社 | ループコイルアンテナ |
JP4393228B2 (ja) | 2004-02-27 | 2010-01-06 | シャープ株式会社 | 小型アンテナ及びそれを備えた無線タグ |
KR100586342B1 (ko) * | 2004-04-30 | 2006-06-07 | 주식회사 손텍 | 금속부착용 무선인식태그 |
JP2005352858A (ja) * | 2004-06-11 | 2005-12-22 | Hitachi Maxell Ltd | 通信式記録担体 |
US7274297B2 (en) † | 2004-07-01 | 2007-09-25 | Intermec Ip Corp. | RFID tag and method of manufacture |
JP2006039902A (ja) * | 2004-07-27 | 2006-02-09 | Ntn Corp | Uhf帯無線icタグ |
JP4482403B2 (ja) * | 2004-08-30 | 2010-06-16 | 日本発條株式会社 | 非接触情報媒体 |
US20060044769A1 (en) † | 2004-09-01 | 2006-03-02 | Forster Ian J | RFID device with magnetic coupling |
US7158033B2 (en) * | 2004-09-01 | 2007-01-02 | Avery Dennison Corporation | RFID device with combined reactive coupler |
JP4125275B2 (ja) * | 2004-09-02 | 2008-07-30 | 日本電信電話株式会社 | 非接触ic媒体制御システム |
JP4600742B2 (ja) * | 2004-09-30 | 2010-12-15 | ブラザー工業株式会社 | 印字ヘッド及びタグラベル作成装置 |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101425460B1 (ko) * | 2011-09-30 | 2014-08-01 | 브로드콤 코포레이션 | 무선으로 동작가능한 기능 블록들을 갖는 장치 |
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RU2386169C2 (ru) | 2010-04-10 |
EP2012258B2 (en) | 2014-10-22 |
JPWO2007125683A1 (ja) | 2009-09-10 |
EP2012258A1 (en) | 2009-01-07 |
EP2830006A1 (en) | 2015-01-28 |
ATE526648T1 (de) | 2011-10-15 |
BRPI0702919B1 (pt) | 2019-05-07 |
CN101351817B (zh) | 2012-04-25 |
EP2410473A1 (en) | 2012-01-25 |
EP2012258A4 (en) | 2010-03-31 |
EP2410473B1 (en) | 2014-10-29 |
KR100963057B1 (ko) | 2010-06-14 |
JP4674638B2 (ja) | 2011-04-20 |
CN101351817A (zh) | 2009-01-21 |
RU2008112222A (ru) | 2009-10-10 |
EP2012258B1 (en) | 2011-09-28 |
EP3428852A1 (en) | 2019-01-16 |
WO2007125683A1 (ja) | 2007-11-08 |
BRPI0702919A2 (pt) | 2011-03-22 |
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