KR20080036983A - Alignment device for vacuum deposition - Google Patents

Abstract

An alignment device for vacuum deposition, having a mask holder (7) held below a substrate (5) that is held in a vacuum container (3), the mask holder (7) being held by a suspension member (11) inserted through a through-hole (1b) formed in a plate (1a) for installation that is an upper wall surface of the vacuum container; a plate (12) for connection, provided outside the vacuum container and connected to the suspension member; a position adjustment device (13) capable adjusting the position relative to the substrate (5) of a mask (8) in a deposition chamber (2) by moving the plate for connection; an extendable tubular shielding member (14) fitted over the suspension member and provided between the outer periphery of the through-hole (1b) in the plate for installation and the plate for connection to shield between the vacuum side and the atmosphere side; and an urging device (15) for generating urging force in the direction reverse to that of pressing force that is generated by the inside of the tubular member being vacuum and is applied to the plate for connection.

Description

Alignment device for vacuum deposition {ALIGNMENT DEVICE FOR VACUUM DEPOSITION}

The present invention relates to an alignment device for vacuum deposition.

Conventionally, when manufacturing a semiconductor substrate or the like, the semiconductor material is evaporated in a vacuum container and deposited on the surface of the substrate to form a predetermined conductor pattern.

When forming this conductor pattern, it is usually performed by arrange | positioning the mask in which the conductor pattern was formed in the surface of the board | substrate, and exposing the photoresist apply | coated to the surface (for example, refer Unexamined-Japanese-Patent No. 5-159997).

By the way, in a vacuum container, it is necessary to arrange | position a mask with respect to a board | substrate, and the alignment apparatus for this position alignment is provided.

Although the alignment device is disposed in the vacuum container, when the alignment device with high positioning accuracy is disposed in the vacuum container, it is necessary to use components and lubricants made of a special material with low gas emission, as well as measures for heat radiation. As a result, the device itself is very expensive.

On the other hand, in order to avoid such a situation, arrange | positioning the alignment apparatus outside of a vacuum container is considered.

When the alignment device is disposed outside the vacuum container, a vacuum holding mechanism at the insertion portion of the mask holding member of the alignment device into the vacuum container is required, and thus a special sealing mechanism or processing is required. The device becomes expensive.

In addition, the insertion portion of the mask holding member into the vacuum container was subjected to a large external force by atmospheric pressure, in other words, by the vacuum force.

Therefore, in order to solve the said subject, an object of this invention is to provide the alignment apparatus for vacuum deposition which can maintain the manufacturing cost of an apparatus itself, and can maintain a high precision positioning.

In order to solve the said subject, the vacuum deposition alignment apparatus of this invention is an alignment apparatus which positions the deposition mask with respect to the board | substrate hold | maintained in a vacuum container, Comprising: The said vacuum container below the board | substrate hold | maintained in the said vacuum container. A mask holder held through a suspension support member through which a through hole formed in the wall of the wall is inserted, a connection plate installed outside the vacuum container and connected to the suspension support member, and moving the connection plate to the mask holder. A position adjusting device capable of adjusting the position of the mask in the vacuum container with respect to the substrate, and fitted between the hanging support member from the outside and between the outer periphery of the through hole of the wall and the connecting plate, An elastic cylindrical blocking member for blocking the atmospheric side, and an inner side of the cylindrical blocking member A biasing device is provided which generates a biasing force in the reverse direction and a pressing force to the connecting plate generated by being in a vacuum state.

Further, the position adjusting device is configured to allow the mask held by the connecting plate and the mask holder to move in parallel with the substrate surface, and to move the connecting plate in the axial direction perpendicular to the substrate surface. It is also equipped with a function.

Moreover, the biasing force of the said biasing apparatus is comprised so that adjustment is possible.

In addition, the substrate is held by the holding plate body and provided with a holding device capable of holding and releasing the holding plate body.

Effect of the Invention

According to the above-described configuration, when positioning the mask with respect to the substrate under a predetermined vacuum, the position adjusting device for the substrate is disposed outside the vacuum container, so that it is not necessary to use a material in consideration of the vacuum state and the like. There is no need for a special seal mechanism or the like, and therefore the manufacturing cost of the device itself becomes low.

In addition, since a biasing device capable of providing a biasing force that can oppose the pressing force caused by atmospheric pressure under vacuum is provided, it is possible to prevent an extraneous force from acting on the positioning device and thus to the substrate. The alignment of the mask can be maintained with high precision.

1 is a cross-sectional view of a vacuum deposition apparatus provided with an alignment device according to Embodiment 1 of the present invention.

2 is a cross-sectional view taken along the line A-A of FIG.

3 is a cross-sectional view showing the configuration of the alignment device.

It is a perspective view which shows the principal part of the alignment apparatus.

Fig. 5 is a plan view of the in-plane moving device in the alignment device, in which (a) shows the configuration of the in-plane moving device, and (b) to (f) explain its operation.

It is a perspective view which shows the board | substrate holder and mask holder in the same vacuum vapor deposition apparatus.

7 is a plan view illustrating the alignment operation of the substrate and the mask by the alignment device.

Fig. 8 is a sectional view showing the main parts of the focusing mechanism in the alignment device.

9 is a sectional view showing the principal parts of a modification of the focus adjustment mechanism of the alignment device.

10 is a cross-sectional view of a vacuum vapor deposition apparatus in which an alignment device according to Embodiment 2 of the present invention is installed.

It is a top view of the holding plate body of the board | substrate in the same vacuum vapor deposition apparatus.

12 is a front view of the holding plate body.

It is a side view of the holding plate body.

Embodiment 1

The vacuum deposition alignment apparatus according to Embodiment 1 of the present invention will be described with reference to the drawings.

This vacuum deposition alignment apparatus is installed in, for example, a vacuum deposition apparatus for manufacturing a display portion of an organic EL display, and a conductor pattern is formed by depositing an organic material (which is a deposition material) on a surface of a glass substrate using a mask in a predetermined pattern. It is to maintain the mask when obtaining and to perform the alignment of the mask with respect to the glass substrate.

As shown in FIG. 1 and FIG. 2, this alignment apparatus 1 is installed in the upper wall 3a of the vacuum container 3 which has the vapor deposition chamber 2 for depositing organic material on the surface of a glass substrate under vacuum. (It is an example of a wall) It is provided through 1a. Moreover, you may make it stick directly to the upper wall provided over the whole upper surface of a vacuum container, without interposing a mounting plate.

An evaporation source 4 is disposed below the deposition chamber 2 of the vacuum vessel 3, and a glass substrate (hereinafter referred to as a substrate) is located above the deposition chamber 2 of the vacuum vessel 3 (5). ) Is held by the substrate holder 6, and below the substrate 5 a mask 8 for forming a predetermined conductor pattern through the alignment device 1 and the mask holder 7 is held. . The opening and exit opening 9 of the board | substrate 5 and the mask 8 is formed in the side wall 3b of the said vacuum container 3, The robot hand about carrying in / out of the board | substrate 5 and the mask 8 is carried out. (Not shown) is used. In addition, the board | substrate holder 6 is comprised by four holding | maintenance members 10 which have the claw 10a in the lower end, respectively.

As shown in FIGS. 1-3, the said alignment apparatus 1 has a lower end part connected to four front, back, left, and right sides of the mask holder 7 which hold | maintains the mask 8, and the upper end part was formed in the installation plate 1a. Four rod-shaped suspension support members 11 protruding through the through-hole 1b to protrude out of the vacuum vessel 3, and four suspension support members 11 provided outside the vacuum vessel 3, respectively. A vapor deposition chamber held in the mask holder 7 by moving the connecting plate 12 in a planar view, connected to the upper end of the rectangular plate, and disposed on the upper surface of the mounting plate 1a, and moving the connecting plate 12. The positioning device 13 which can adjust the position with respect to the board | substrate 5 of the mask 8 in 2) and each said suspension support member 11 are fitted from the outside, and the installation plate 1a Vacuum is installed between the outer periphery of the through hole 1b and the connecting plate 12. Flexible cylindrical blocking member (for example, vacuum bellows is used) 14 for blocking the outside and the atmosphere side, and a connecting plate generated by the inside of the cylindrical blocking member 14 being in a vacuum state. A biasing device 15 for generating (granting) a biasing force in the reverse direction of the pressing force to 12 is provided.

The cylindrical blocking member 14, the mounting plate 1a side, and the connecting plate 12 side are respectively connected through the lower annular attachment sheet 16 and the upper annular attachment sheet 17 having a predetermined inner diameter, Therefore, a vacuum force (pressing force due to atmospheric pressure) acts on the attachment part opening area (contact area) of the cylindrical blocking member 14 to the upper annular attachment sheet 17 provided on the mounting plate 1a side. Will be.

As shown in FIGS. 3 to 5, the position adjusting device 13 moves the connecting plate 12 in a plane parallel to the surface of the substrate 5 and rotates (center of the plate as the rotation center). One rotation) and an in-plane moving device 21 capable of turning (rotating about a position different from the center of the plate) and a vertical direction perpendicular to the substrate 5 (which is also the surface of the connecting plate). It is comprised by the vertical movement apparatus 22 which can move to an axial direction.

The in-plane moving device 21 faces in a planar view and has a rectangular support plate 31, a driving support mechanism 32 disposed at three of four corners on the support plate 31, and an eye disposed at the other one. It consists of the content support mechanism 33 and the movable plate 35 supported by the connector 34 provided in each of these support mechanisms 32 and 33, and also this movable plate 35 and the connection plate 12 ) Is configured to allow movement in the vertical direction through the elevating guide mechanism 36 so that movement in the horizontal plane is linked (following).

The driving support mechanism 32 is a well-known technique, and as shown in FIG. 5, the driving support mechanism 32 can move through the linear guide mechanism 37 in the horizontal plane, that is, in the XY axis direction, and to the servo motor 38. It is possible to forcibly move along one axial direction (X axis or Y axis direction) by this, and the guide support mechanism 33 can move freely in the XY axis direction through the linear guide mechanism 39 as described above. It is.

In addition, two of the three driving support mechanisms 32 are arranged to be forced to move in the same direction, and the other one is arranged to be forced to move in a direction orthogonal to the two forced moving directions. The moving plate 35 is moved in the X-axis direction (see FIG. 5B) by driving the servo motor 38 in the predetermined (one, two, or three) driving support mechanism 32 of these three. ), The Y-axis direction (see FIG. 5 (c)), the inclination direction (see FIG. 5 (d)) with respect to the X-axis and the Y-axis, and the rotational direction with the center of the moving plate 35 as the rotation axis (FIG. 5). (e)), and also in a turning direction for turning around the arbitrary support mechanism 32 side (see FIG. 5 (f)), the moving plate 35 in any direction and any rotational angle in the horizontal plane. Or it can be moved to a turning angle.

As shown in FIG. 3 and FIG. 4, the lifting guide mechanism 36 is viewed in a plane integrally provided on the upper surface of the movable plate 35 to form a rectangular mounting plate 41 and the mounting plate 41. Four linear guide shafts 42, which are installed so as to pass through each of the holes 12a of the connecting plate 12 at the front, rear, left and right positions of the connecting plate 12, and on each side of the hole 12a of the connecting plate 12. And four moving members 43 which are guided to the side of each linear guide shaft 42 from the outside to be movable in the vertical direction. In addition, in the figure, only the left and right guide shaft 42 and the moving member 43 which are arrange | positioned at the front (front part) are shown.

As the vertical movement device 22, an electric cylinder (driven by a servo motor) is used, and the withdrawal rod 22a of the electric cylinder is connected to the mounting plate 41, and the withdrawal rod By pulling out 22a, the mask holder 7 is lifted up and down through the connecting plate 12, and the space | interval of the mask 8 with respect to the board | substrate 5 is adjusted.

The biasing device 15 communicates with the deposition chamber 2 through the through hole 1b to remove the pressing force due to atmospheric pressure acting on the end surface side in the cylindrical blocking member 15 which is in a vacuum state (or, Alleviate).

That is, as shown in FIG. 3, this biasing apparatus 15 is arrange | positioned at the side of the installation plate 1a, and of the plurality (for example, arrange | positioned in two places left and right) which supports the connection plate 12 from below. An air supply pump 55 connected to a single rod type pneumatic cylinder 51 and an air supply port 53 to the cylinder chamber 52 in each of these pneumatic cylinders 51 through an air pipe 54; And a pressure regulator 56 arranged in the middle of the air pipe 54. In addition, in order to move the plate 12 at least in the horizontal direction, the cylinder body, which is the lower side of the pneumatic cylinder 51, is fixed to the mounting plate 1a side, and the ball for rolling movement at the tip of the rod portion, which is the upper side, is fixed. (Ball bearing) is arrange | positioned and only the support plate 12 is supported from the lower side. In addition, you may make it connect the upper and lower ends of the pneumatic cylinder 51, the installation plate 1a, and the connection plate 12 through a universal joint, respectively.

Here, the mask holder 7 will be described.

As shown in FIG. 6, the mask holder 7 includes a pair of side support plates 61 for supporting the mask 8 from both sides, and a pair of ends connecting the end portions of these side support plates 61. It is comprised by the connecting plate 62. These supporting plates 61 and connecting plates 62 are formed in a square shape (rectangular shape), and the central portion thereof is an opening so that organic materials (deposition materials) can pass therethrough.

In addition, about the mask 8, as shown to FIG. 3 and FIG. 6, it is comprised by the mask main body 8a and the holding frame 8b holding the circumferential edge of this mask main body 8a, and this holding | maintenance is carried out. In the frame 8b, the hole 8c which can guide the claw 10a of each holding member 10 in the board | substrate holder 6 is formed, respectively.

As shown in FIG. 3, the cylindrical support member is used as the suspension support member 11, and the connection plate 62 of the mask holder 7 is connected to the communication hole 11a in the suspension support member 11. A passage (hole part) 62a to be connected is formed so that the mask 8 can be cooled by supplying a cooling fluid such as water from the upper end opening of the suspension support member 11. On the mask holder 7 side, a temperature sensor (not shown in the figure, for example, a thermocouple or the like is used) is provided, and wiring to the temperature sensor is performed through the communication hole 11a.

In addition, as shown in FIG. 1, FIG. 3, and FIG. 7, in order to align the mask 8 with respect to the board | substrate 5 hold | maintained in the board | substrate holder 6, the corner part on the diagonal of the board | substrate 5 is diagonal. The CCD camera device 57 for guiding the point-shaped substrate-side mark M2 formed on the mask 8 side in the circular mask-side mark M1 formed on the mask 8 side has a focusing mechanism ( It is installed through 58). Of course, the observation window 59 is provided in the mounting plate 1a side.

As shown in FIG. 8, this focusing adjusting tool 58 is provided with the support plate 72 attached to the attachment plate 71 standing up at the edge of the connection plate 12, and is provided in the upper and lower sides of this support plate 72. As shown in FIG. A screw shaft (74) rotatably supported in the vertical direction on both flanges (73, 73), a nut member (75) spirally coupled to the screw shaft (74), and to which the camera device (57) is fixed; It is comprised by the motor 76 supported by the said upper flange 73 and which rotates the screw shaft 74. As shown in FIG.

That is, since the focus of the camera apparatus 57 can be matched by rotating this motor 76, the alignment of the board | substrate 5 and the mask 8 can be performed with high precision.

In the above configuration, the alignment operation of the mask 8 with respect to the substrate 5 in the vacuum container 3 will be described.

First, as shown in FIG. 1, the mask 8 which hold | maintained the board | substrate 5 by the mask holder 7 using the robot hand from the carrying-out opening 9 formed in the side wall 3b of the vacuum container 3 is shown. After holding the board | substrate 5 with the board | substrate holder 6, while inserting into the upper side of (), the robot hand is pulled out from the vacuum container 3, and the carrying-out opening 9 is closed.

Next, alignment of the mask 8 held by the mask holder 7 with respect to the substrate 5 held in the deposition chamber 2 by the substrate holder 6 is performed.

Two CCD camera apparatuses 57 disposed on a diagonal line are used to position the mask 8 with respect to the substrate 5.

That is, as shown in FIG. 7, the position adjustment apparatus 13 so that the dot-shaped board | substrate side mark M2 formed in the board | substrate 5 side may enter in the circular mask side mark M1 formed in the mask 8 side. After the in-plane moving device 21 is driven, the mask 8 is moved by the vertical moving device 22 to almost contact the surface of the substrate 5. In addition, the shape of each mark may be anything, such as a cross shape, as long as image recognition is easy.

When the alignment of the mask 8 with respect to the substrate 5 is completed, the deposition material is adhered to the surface of the substrate 5 by heating the evaporation source 4 in accordance with the pattern of the mask 8 to form a predetermined conductor pattern. Is formed.

When the predetermined conductor pattern is formed, the substrate 5 is taken out from the opening and closing opening 9 by the robot hand, and then a new substrate 5 is inserted into the vacuum container 3 to hold the substrate holder 6. Then, as described above, alignment may be performed to form a conductor pattern.

Thus, when positioning the mask 8 with respect to the board | substrate 5 under a predetermined vacuum, since the position adjusting apparatus 13 of the mask 8 was arrange | positioned outside the vacuum container 3, The configuration can be made inexpensive.

In addition, since the biasing device 15 which can oppose the pressing force by atmospheric pressure under vacuum is provided, it is possible to prevent the extraneous force from acting on the alignment device 1, so that the device does not cause distortion. Positioning of the mask with respect to the substrate can be performed with high accuracy.

In detail, the following effects are obtained.

1. A special vacuum is provided because the in-plane moving device 21 for moving the mask 8 in the horizontal plane and the vertical moving device 22 for moving in the vertical direction are disposed outside (at atmospheric pressure) of the vacuum container 3. Since there is no need for a mechanical element for cooling and a cooling device for a motor, an alignment device of low cost and high precision can be provided.

2. The biasing device which arrange | positions each moving apparatus 21 and 22 to the exterior (at atmospheric pressure) of the vacuum container 3, and can give the biasing force which opposes the pressing force which acts under a vacuum ( 15), it is possible to reduce the force acting on each of the moving devices 21 and 22 generated by the vacuum, and therefore a small capacity can be used as a driving device such as a motor in the moving device, which is more inexpensive. You can make it a configuration.

3. In addition, the buyer who can arrange | position each moving apparatus 21 and 22 to the exterior (at atmospheric pressure) of the vacuum container 3, and can give the biasing force which can oppose the pressing force which acts under vacuum. Since the sawing device 15 is provided, it is possible to suppress the occurrence of distortion in the device itself, and to prevent the field of view shift in the positioning camera device 57 of the mask 8, and thus high precision. Positioning of the figure can be performed.

4. Since the focusing knob 58 of the camera device 57 is further provided, when the position of the mask 8 with respect to the board | substrate 5 is performed through the marks M1 and M2, the position of both marks can be grasped correctly. Therefore, more accurate positioning can be performed.

By the way, although the in-plane moving apparatus 21 in the said embodiment was comprised by the drive support mechanism 32 arrange | positioned at three places and the guide support mechanism 33 arrange | positioned at one place, all are for a drive You may comprise with the support mechanism 32.

In addition, in the said embodiment, although the camera apparatus 57 and the focusing adjustment tool 58 were supported by the connection plate 12 side, as shown in FIG. 9, the camera apparatus 57 and the focusing adjustment tool 58 are provided for installation. You may make it support by the support bracket 81 at the board | plate 1a side.

Embodiment 2

Hereinafter, the vacuum deposition alignment apparatus which concerns on Embodiment 2 of this invention is demonstrated based on FIGS. 10-13.

In Embodiment 1 described above, the mask is positioned with respect to the glass substrate in the vapor deposition chamber. In Embodiment 2, the vacuum chamber for alignment is provided instead of the vacuum chamber for vapor deposition. The alignment of the mask with respect to the glass substrate is performed in the alignment chamber formed in the container.

In other words, after alignment of the mask with respect to the glass substrate in the alignment chamber, the glass substrate is loaded on the mask and conveyed, for example, using a robot hand or the like in a deposition chamber of a vacuum container installed in a separate place, and Vapor deposition was carried out.

Therefore, the vacuum vapor deposition apparatus provided with the alignment apparatus which concerns on the said Embodiment 2 is equipped with the vacuum container for vapor deposition and the vacuum chamber for alignment.

The other locations of the second embodiment and the first embodiment allow the glass substrates to be transported together after the masks are aligned with each other. Therefore, the present invention focuses on the holding mechanism of the glass substrate and explains the alignment. Since the structure of an apparatus is the same as that of Embodiment 1, the same member number as Embodiment 1 is attached | subjected and the description is abbreviate | omitted.

That is, as shown in FIGS. 10 to 13, the glass substrate (hereinafter referred to as a substrate) 5 is provided through four holding claws 92 on a holding plate 91 having a shape slightly larger than that of the substrate 5. The holding apparatus 93 which can hold | maintain and can hold | maintain and release this holding plate body 91 is provided in the installation plate 1a of the vacuum container 3. As shown in FIG.

The holding device 93 has a rotary drive body (also referred to as an actuator) 95 supported on the upper surface of the mounting plate 1a through a cylindrical support member 94, and an upper end of the holding device 94. An interlocking piece 96a that is inserted through and is connected to the rotary drive member 95 so as to be able to swing around a vertical shaft center and is detachable from an engaging recess 91a formed at an outer circumference of the holding plate body 91 at a lower end thereof. ) Is formed with a swing shaft (96) formed. In addition, a vacuum interruption O-ring 97 is disposed between the swing shaft 96 and the support member 94.

Of course, each of the swing shafts 96 is provided at a position that does not interfere with the suspension support member 11 of the alignment device 1. In addition, 98 in the figure is a positioning hole for the alignment formed in the holding plate 91.

In the above configuration, when the mask 8 is aligned with the substrate 5, the substrate 5 is held in the holding plate body 91 through the holding claw 92 in the alignment chamber 99 under vacuum. The alignment of the mask 8 with respect to the board | substrate 5 is performed by the alignment apparatus 1 in a state.

When the alignment is completed, the mask holder 7 is lifted by the position adjusting device 13 to load and hold the substrate 5 on the mask 8. At this time, of course, the retaining claw 92 is located in the hole 8c on the mask 8 side.

Then, as shown by arrow a in FIG. 11, the retaining claw 92 is swung 90 degrees in the horizontal direction to separate from the engaging recess 91a of the retaining plate body 91.

In this state, the substrate 5 held on the holding plate body 91 is supported on the mask holder 7 side, and in this state, the mask holder 7 is held by the robot hand, for example, in the deposition chamber of the adjacent vacuum container. It is good to carry out vapor deposition by moving inward.

Thus, by positioning the mask 8 with respect to the board | substrate 5 in the alignment chamber 99 where temperature is low and stable instead of a vapor deposition chamber, the alignment accuracy can be improved. In other words, when the mask is positioned with respect to the substrate in a vapor deposition chamber having a high temperature, distortion occurs in the mask 8 due to the influence of heat, or in a member such as the holding member 10, the suspension supporting member 11, or the like. Stretching occurs or the positioning accuracy is lowered, but these can be prevented.

According to the said structure, since the board | substrate 5, the holding plate 91 holding the said board | substrate 5, and the mask 8 are supported so that it may hang from above, the influence of backlash and elastic deformation in each drive part will become less. In addition, since the effect of stabilizing itself is obtained (it has self-alignment like a pendulum), it is possible to meet the demand for higher density positioning. Moreover, since this holding plate 91 is mounted on the board | substrate 5 after completion | finish of alignment, when carrying these to a vapor deposition chamber, it can prevent that they shift | deviate from each other.

In addition, in order not to generate a shift | offset | difference with each other at the time of the alignment of the board | substrate 5 and the mask 8, and the contact | adherence operation of the board | substrate 5 and the mask 8 after alignment, the board | substrate 5 and the mask 8 Although the parallelism of each other is required, the mounting plate 1a in which the entire support and / or alignment mechanism of the holding plate body 91 and the mask holder 7 holding the substrate 5 is the upper wall of the vacuum container 3 is used. Since it is provided on the side of side) and therefore a deformation | transformation by the internal and external pressure difference which arises in the vacuum container 3, etc. generate | occur | produce, it is not influenced, and high parallelism can be obtained easily. For example, if a part of the alignment mechanism is supported from another wall surface (lower surface or side surface) of the vacuum container 3, or from a support mechanism other than the vacuum container, the vacuum container is opened to the atmosphere by maintenance and the like, and then back to vacuum. When the vacuum vessel is depressurized, the vacuum vessel undergoes a change in internal and external pressure, so that the deformation is repeated, so that a relative deviation occurs between the mechanisms, and the adjusted parallelism before opening to the atmosphere cannot be reproduced. For this reason, confirmation and adjustment of parallelism are needed again, and it becomes not practical. In addition, maintenance is performed once a week, for example, and about 1-2 days are needed for adjustment of parallelism.

As described above, the effect of thermal expansion during the alignment can be avoided by depositing the substrate and the mask on which the alignment is performed in another vacuum chamber, and high precision (for example, about several microns) can be realized.

By the way, in each said embodiment, although demonstrated as an alignment apparatus in the vacuum vapor deposition apparatus which deposits organic electroluminescent material on a glass substrate, of course, vacuum vapor deposition is not limited to this organic electroluminescent material as an object, for example of a semiconductor device. In manufacturing, any apparatus for forming a conductor pattern on a substrate using a mask in a vacuum vessel can be applied to any vacuum deposition apparatus.

The present invention can perform alignment of the mask with respect to the glass substrate, which is a member to be deposited, placed in a vacuum container in an inexpensive configuration, and is therefore also optimal for forming display portions such as organic EL displays.

Claims (5)

An alignment device for aligning a deposition mask with respect to a substrate held in a vacuum container: A mask holder held below the substrate held in the vacuum container via a suspension support member through which a through hole formed in a wall of the vacuum container is inserted; A connection plate installed outside the vacuum vessel and connected to the suspension support member; A positioning device capable of adjusting the position of the mask with respect to the substrate in the vacuum container held by the mask holder by moving the connecting plate; An elastic tubular blocking member fitted between the hanging support member from the outside and installed between the outer circumference of the through hole of the wall and the connecting plate to block the vacuum side and the atmospheric side; And And a biasing device for generating a biasing force in the reverse direction of the pressing force to the connecting plate generated when the inside of the cylindrical blocking member is in a vacuum state. The alignment apparatus for vacuum deposition according to claim 1, wherein the position adjusting device is configured such that the mask held through the connecting plate and the mask holder can be moved in parallel with the substrate surface. 3. The alignment apparatus for vacuum deposition according to claim 2, wherein the position adjusting device is provided with a function capable of moving the connecting plate in an axial direction perpendicular to the mask surface. The alignment apparatus for vacuum deposition as claimed in claim 1, wherein the biasing force of the biasing device is configured to be adjustable. The alignment apparatus for vacuum deposition according to claim 1, wherein a holding device capable of holding the substrate on the holding plate body and holding and releasing the holding plate body is provided.

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