KR102700370B1 - Mask alignment method, film-forming method, mask alignment apparatus, and film-forming apparatus - Google Patents

Abstract

The mask alignment method of the present invention is a mask alignment method for adjusting the relative position of a mask mounting stand and a mask, comprising: a measuring step for measuring a relative positional misalignment of the mask on the mask mounting stand; a positioning step for relatively moving the mask with respect to the mask mounting stand by a movement instruction amount corresponding to the measured positional misalignment amount within a plane parallel to a mounting surface of the mask mounting stand while the mask is spaced apart from the mask mounting stand; and a mounting step for mounting the relatively moved mask on the mask mounting stand, characterized in that the movement instruction amount is corrected based on predetermined conditions and the positioning adjustment step is performed using the movement instruction amount after the correction.

Description

MASK ALIGNMENT METHOD, FILM-FORMING METHOD, MASK ALIGNMENT APPARATUS, AND FILM-FORMING APPARATUS

The present invention relates to mask alignment for positioning a mask relative to a mask holder.

Recently, organic EL displays have been gaining attention as flat panel displays. Organic EL displays are self-luminous displays, and their response speed, viewing angle, and thinness are superior to those of liquid crystal panel displays, so they are rapidly replacing existing liquid crystal panel displays in various portable terminals such as monitors, televisions, and smart phones. In addition, their application fields are expanding to include automobile displays.

The organic EL display device has a basic structure in which an organic layer that generates light is formed between two opposing electrodes (cathode electrode, anode electrode). The organic layer and the electrode metal layer of the organic EL display device are manufactured by depositing a deposition material on a substrate through a mask having a pixel pattern formed thereon within a deposition device. In order to improve the precision of this deposition process, the relative positions of the mask and the substrate must be aligned with high precision before deposition on the substrate is performed.

To this end, marks (called alignment marks) are formed on the substrate and the mask, and the relative misalignment between the substrate and the mask is measured by photographing these alignment marks with a camera installed in the deposition device.

Based on the measured relative positional misalignment between the substrate and the mask, the substrate holder on which the substrate is mounted is moved relatively to the mask holder on which the mask is mounted, thereby adjusting the relative position of the substrate with respect to the mask.

Meanwhile, if the mask itself is placed on the mask stand at a position or in a direction that is misaligned from the reference position before measuring and adjusting the relative position misalignment of the mask on the substrate, problems such as the alignment mark of the mask being out of the field of view of the camera, the alignment process time for the mask on the substrate being extended, or the precision of the substrate alignment process being reduced may occur. Therefore, before measuring and adjusting the relative position misalignment of the mask on the substrate, mask alignment is also performed to determine the position of the mask introduced into the film forming apparatus with respect to the mask stand.

However, depending on the mask, even if the position adjustment according to the mask alignment is repeated several times, a certain amount of positional misalignment may continue to occur. In such cases, the mask alignment is not completed normally, and the overall TACT time of the film forming device increases.

The present invention aims to provide an improved mask alignment method capable of quickly correcting mask position misalignment to within a specified value to complete mask alignment within a short period of time, thereby preventing a delay in the overall tact time of a film forming apparatus, a film forming method using the same, an alignment apparatus implementing the same, and a film forming apparatus.

A mask alignment method according to the present invention is a mask alignment method for adjusting the relative position of a mask mounting stand and a mask, comprising: a measuring step for measuring a relative positional misalignment of the mask on the mask mounting stand; a positioning step for relatively moving the mask with respect to the mask mounting stand by a movement instruction amount corresponding to the measured positional misalignment amount within a plane parallel to a mounting surface of the mask mounting stand while the mask is spaced apart from the mask mounting stand; and a mounting step for mounting the relatively moved mask on the mask mounting stand, characterized in that the movement instruction amount is corrected based on predetermined conditions and the positioning adjustment step is performed using the movement instruction amount after the correction.

A film forming method according to the present invention is characterized by including a first alignment step of using the mask alignment method to place a mask on a mask mounting table with its relative position with respect to the mask mounting table adjusted, a second alignment step of adjusting the relative position of a substrate with respect to the mask placed on the mask mounting table, and a step of contacting the adjusted substrate and the mask, and then forming a film with a deposition material from a deposition source onto the substrate via the mask.

The mask alignment device according to the present invention is an alignment device for adjusting the relative position of a mask mounting stand and a mask, comprising: a mask support unit for temporarily supporting the mask before and after mounting the mask on the mask mounting stand; a mask support unit elevating mechanism for elevating the mask support unit; a measuring means for measuring a relative positional misalignment of the mask on the mask mounting stand; a position adjustment mechanism for relatively moving the mask with respect to the mask mounting stand by a movement instruction amount corresponding to the measured positional misalignment amount within a plane parallel to a mounting surface of the mask mounting stand while the mask is spaced apart from the mask mounting stand; and a control unit for controlling the movement instruction amount during position adjustment by the position adjustment mechanism, wherein the control unit is characterized in that it controls the position adjustment mechanism to correct the movement instruction amount based on a predetermined condition and perform the position adjustment using the movement instruction amount after the correction.

A film forming apparatus according to the present invention is characterized by including the mask alignment device, a substrate support unit for holding and supporting a substrate, and a deposition source for receiving a deposition material.

According to the present invention, mask position misalignment can be quickly corrected to within a specified value, thereby completing mask alignment within a short period of time, thereby preventing a delay in the overall tact time of a film forming device.

Figure 1 is a schematic diagram of a part of a manufacturing device for an electronic device.
Figure 2 is a schematic diagram of a film forming device according to one embodiment of the present invention.
FIG. 3 is a schematic diagram of a mask mounting stand and a mask support unit according to one embodiment of the present invention.
Figure 4 is a conceptual diagram explaining the basic operation of mask alignment.
Figure 5 is a schematic diagram explaining a situation in which a certain amount of position misalignment continues to occur even when position adjustment is repeated during the basic operation of mask alignment.
FIG. 6 is a schematic diagram conceptually explaining an improved mask alignment operation according to the present invention.
FIG. 7a and FIG. 7b are flowcharts for explaining the timing of offset correction according to the first embodiment of the present invention.
FIG. 8a and FIG. 8b are flowcharts for explaining the timing of offset correction according to the second embodiment of the present invention.
Figure 9 is a schematic diagram showing an electronic device.

Hereinafter, preferred embodiments and examples of the present invention will be described with reference to the drawings. However, the following embodiments and examples are only illustrative of preferred configurations of the present invention, and the scope of the present invention is not limited to these configurations. In addition, in the following description, unless specifically stated otherwise, the hardware configuration and software configuration, processing flow, manufacturing conditions, size, material, shape, etc. of the device are not intended to limit the scope of the present invention.

The present invention can be preferably applied to a device for forming a thin film (material layer) of a desired pattern by vacuum deposition on the surface of a substrate. Any material such as glass, a film of a polymer material, or a metal can be selected as the material of the substrate, and further, any material such as an organic material, a metallic material (metal, metal oxide, etc.) can be selected as the deposition material. The technology of the present invention can be specifically applied to a manufacturing device for an organic electronic device (e.g., an organic EL display device, a thin film solar cell), an optical member, or the like. Among these, in a manufacturing device for an organic EL display device, an organic EL display element is formed by evaporating a deposition material and depositing it on a substrate through a mask, and therefore, the present invention is one of the preferable application examples.

<Electronic device manufacturing equipment>

Figure 1 is a plan view schematically illustrating the configuration of a part of a manufacturing device for an electronic device.

The manufacturing device of Fig. 1 is used, for example, for manufacturing a display panel of an organic EL display device for a smartphone. In the case of a display panel for a smartphone, for example, after a film is formed for forming an organic EL element on a 4.5 generation substrate (about 700 mm × about 900 mm) or a 6th generation full-size (about 1500 mm × about 1850 mm) or half-cut size (about 1500 mm × about 925 mm) substrate, the substrate is cut out to manufacture a plurality of panels of smaller sizes.

An electronic device manufacturing device generally includes a plurality of cluster devices (1) and a relay device connecting the cluster devices (1).

The cluster device (1) is equipped with a plurality of film forming devices (11) that perform processing (e.g., film forming) on a substrate (S), a plurality of mask stock devices (12) that store masks before and after use, and a return room (13) arranged in the center thereof.

In the return room (13), a return robot (14) is installed to return a substrate (S) between a plurality of film forming devices (11) and to return a mask between the film forming devices (11) and the mask stock device (12). The return robot (14) may be, for example, a robot having a structure in which a robot hand for holding and supporting a substrate (S) or a mask (M) is mounted on a multi-joint arm.

In the film forming device (11) (also called a deposition device), the deposition material stored in the deposition source is heated and evaporated by a heater, and deposited on a substrate through a mask. A series of film forming processes, such as exchanging the substrate (S) with a transfer robot (14), adjusting the relative positions of the substrate (S) and the mask (alignment), fixing the substrate (S) onto the mask, and film forming (deposition), are performed by the film forming device.

In the mask stock device (12), new masks and used masks to be used in the film forming process in the film forming device (11) are divided and stored in two cassettes. The return robot (14) returns the used masks from the film forming device (11) to the cassette of the mask stock device (12), and returns the new masks stored in the other cassette of the mask stock device (12) to the film forming device (11).

A cluster device (1) is connected to a pass room (15) for transferring a substrate (S) from the upstream side in the flow direction of the substrate (S) to the cluster device (1), and a buffer room (16) for transferring a substrate (S) on which film formation processing has been completed in the cluster device (1) to another cluster device on the downstream side. A return robot (14) of a return room (13) receives a substrate (S) from the pass room (15) on the upstream side and returns it to one of the film formation devices (11) in the cluster device (1) (e.g., the film formation device (11a)). In addition, the return robot (14) receives a substrate (S) on which film formation processing has been completed in the cluster device (1) from one of a plurality of film formation devices (11) (e.g., the film formation device (11b)) and returns it to a buffer room (16) connected to the downstream side. The buffer room (16) may be configured to temporarily store multiple substrates in cases where there is a difference in processing speed between the cluster devices on the upstream side and the cluster devices on the downstream side, or when substrates cannot be flowed normally due to the influence of trouble on the downstream side.

Between the buffer room (16) and the pass room (15), a turning room (17) is installed to change the direction of the substrate. A return robot (18) is installed in the turning room (17) to receive the substrate (S) from the buffer room (16), rotate the substrate (S) 180 degrees, and return it to the pass room (15). Through this, the direction of the substrate is made the same in the upstream cluster device and the downstream cluster device, making substrate processing easier.

The pass room (15), buffer room (16), and turning room (17) are so-called relay devices connecting between cluster devices, and the relay devices installed on the upstream and/or downstream sides of the cluster devices include at least one of the pass room, buffer room, and turning room.

The film forming device (11), mask stock device (12), return room (13), buffer room (16), and rotation room (17) are maintained in a high vacuum state during the manufacturing process of the organic EL display panel. The pass room (15) is usually maintained in a low vacuum state, but may be maintained in a high vacuum state as needed.

In this embodiment, the configuration of the electronic device manufacturing apparatus has been described with reference to FIG. 1, but the present invention is not limited thereto, and may have other types of apparatuses or chambers, and the arrangements between these apparatuses or chambers may be different. For example, in a relay device connected to a cluster device of some of the electronic device manufacturing apparatuses, a pass room may be installed on the upstream and downstream sides of the turning room (17) without installing a buffer room. In addition, a substrate rotating device for changing the direction of the substrate may be installed in the pass room (15) without installing the turning room (17).

Below, the specific configuration of the tabernacle device (11) is described.

<Tabernacle Device>

Figure 2 is a schematic diagram showing the configuration of a film forming device (11) according to one embodiment of the present invention.

In the following description, an XYZ orthogonal coordinate system is used in which the vertical direction is the Z direction. When the substrate (S) or mask (M) is fixed parallel to the horizontal plane (XY plane) during film formation, the short-side direction (the direction parallel to the short side) of the substrate (S) or mask (M) is referred to as the X direction (the first direction), and the long-side direction (the direction parallel to the long side) is referred to as the Y direction (the second direction). In addition, the rotation angle about the Z direction (the third direction) as the axis is expressed as θ (rotation direction).

The deposition device (11) includes a vacuum vessel (20) maintained in a vacuum atmosphere or an inert gas atmosphere such as nitrogen gas, a substrate support unit (21) installed in the vacuum vessel (20), a mask support unit (22), a mask holder (23), a cooling plate (24), a deposition source (25), etc.

The substrate support unit (21) is a means for receiving and supporting a substrate (S) returned by a return robot (14) installed in a return room (13), and is also called a substrate holder.

The mask support unit (22) is a means for receiving and supporting a mask (M) returned by a return robot (14) installed in a return room (13), and is also called a mask holder. The mask support unit (22) is installed so as to be able to support the mask (M) at the lower side in the vertical direction of a substrate (S) supported by the substrate support unit (21).

The mask support unit (22) includes a support member (221) that supports the long side peripheral portion of the mask (M). A plurality of support members (221) are installed along each of the long side peripheral portions of the mask (M) so as to stably support the mask (M).

The mask (M) has an aperture pattern corresponding to a thin film pattern to be formed on the substrate (S). In particular, the mask used for manufacturing an organic EL element for a smartphone is a metal mask having a fine aperture pattern formed therein, and is also called a fine metal mask (FMM).

A frame-shaped mask mounting stand (23) is installed on the lower vertical side of the support member (221). The mask (M) transferred to the mask supporting unit (22) is transferred from the mask supporting unit (22) to the mask mounting stand (23) by lowering the mask supporting unit (22) after the mask alignment process described below is completed, and is placed on the mask mounting stand (23).

A support receiving groove (231) is formed at a position corresponding to the support groove (221) of the mask support unit (22) on the long side peripheral portion of the mask mounting stand (23). When the mask support unit (22) descends and approaches the mask mounting stand (23), the support groove (221) of the mask support unit (22) enters the support groove receiving groove (231) through the opening of the support groove receiving groove (231) of the mask mounting stand (23), thereby transferring the mask (M) from the mask support unit (22) to the mask mounting stand (23) (Fig. 3). In the present embodiment, the support receiving groove (231) has been described as a groove having a predetermined depth, but the present invention is not limited thereto, and may have various shapes and structures as long as the support groove (221) of the mask support unit (22) does not interfere with the mask mounting stand (23). For example, it may have the form of a through hole penetrating the mask holder (23).

The cooling plate (24) is a cooling means that suppresses the temperature rise of the substrate (S), and suppresses the deterioration or alteration of the organic material formed on the substrate (S). To this end, the cooling plate (24) is installed so as to be able to move up and down on the vertical upper surface side of the substrate (S) supported by the substrate support unit (21). When the substrate (S) is fixed on the mask (M) mounted on the mask mounting stand (23), the cooling plate (24) presses the upper surface of the substrate (S) toward the mask (M) by its own weight, thereby bringing the substrate (S) and the mask (M) into close contact.

Although not shown in Fig. 2, the cooling plate (24) may also serve as a magnet plate. The magnet plate increases the adhesion between the substrate (S) and the mask (M) during film formation by attracting the mask (M) by magnetic force.

In addition, although not shown in Fig. 2, an electrostatic chuck (not shown) may be installed to fix the upper surface of the substrate (S) by electrostatic attraction at the vertical upper side of the support member (221) of the substrate support unit (22). As a result, the problem of the central portion of the substrate (S) sagging due to its own weight can be effectively solved.

The deposition source (25) includes a crucible (not shown) in which a deposition material to be deposited on a substrate is stored, a heater (not shown) for heating the crucible, a shutter (not shown) for preventing the deposition material from flying onto the substrate until the evaporation rate from the deposition source becomes constant, etc. The deposition source (25) may have various configurations depending on the application, such as a point deposition source or a linear deposition source. In particular, in the case of a deposition device for depositing an electrode metal layer, a revolver-type deposition source in which each of a plurality of crucibles arranged on a circumference rotates to an evaporation position is used.

Although not shown in Fig. 2, the film forming device (11) further includes a film thickness monitor (not shown) and a film thickness calculation unit (not shown) for measuring the film thickness deposited on the substrate.

On the outer side (atmosphere side) of the vertical upper surface of the vacuum container (20), a substrate support unit lifting mechanism (26), a mask support unit lifting mechanism (27), a cooling plate lifting mechanism (28), a position adjustment mechanism (29), etc. are installed.

The substrate support unit lifting mechanism (26) is a driving means for lifting (moving in the Z direction) the substrate support unit (21). The mask support unit lifting mechanism (27) is a driving means for lifting (moving in the Z direction) the mask support unit (22). The cooling plate lifting mechanism (28) is a driving means for lifting (moving in the Z direction) the cooling plate (24). These lifting mechanisms are composed of, for example, a motor and a ball screw, or a motor and a linear guide.

The position adjustment mechanism (29) is a driving means for alignment of the substrate (S), mask (M), cooling plate (24), etc., and includes a stage section on which the substrate support unit lifting mechanism (26), the mask support unit lifting mechanism (27), the cooling plate lifting mechanism (28), etc. are mounted, and a driving section for driving the stage section in the XYθ directions.

The driving unit of the position adjustment mechanism (29) may be configured with a plurality of servo motors including an X-direction servo motor capable of horizontally driving the stage unit in the X direction, and a Y-direction servo motor capable of horizontally driving the stage unit in the Y direction. For example, in one embodiment of the present invention, two X-direction servo motors and two Y-direction servo motors are provided, and through the combined operation of these servo motors, the stage unit can be horizontally driven in the X direction and the Y direction, or rotated in the θ direction. As a power transmission means for transmitting the driving force of the servo motor to the stage unit, a ball screw or a linear guide, for example, can be used.

By means of the position adjustment mechanism (29), the substrate support unit (21), the mask support unit (22), and the cooling plate (24) can be moved in the X direction, moved in the Y direction, and/or rotated θ relative to the mask mounting stand (23) fixed to the upper surface of the vacuum vessel (20), thereby enabling alignment of the substrate (S) with respect to the mask (M), alignment of the mask (M) with respect to the mask mounting stand (23), etc. to be performed. In particular, in the present embodiment, since the mask support unit elevating mechanism (27) connected to the mask support unit (22) is mounted on the stage portion of the position adjustment mechanism (29), by driving the stage portion in the XYθ directions by the driving portion of the position adjustment mechanism (29), the mask support unit (22), and therefore the mask (M) supported on the mask support unit (22), can be positionally adjusted relative to the mask mounting stand (23) fixed to the vacuum vessel (20) of the film forming apparatus (11).

On the outer side (atmosphere side) of the vertical upper surface of the vacuum vessel (20), in addition to the aforementioned lifting mechanism and position adjustment mechanism, an alignment camera (30) is installed to photograph an alignment mark formed on the substrate (S) and/or the mask (M) through a transparent window installed on the upper surface of the vacuum vessel (20). The alignment camera (30) functions as a position information acquisition means for acquiring position information of the substrate (S) and/or the mask (M) in the XYθ direction. In the present embodiment, the alignment camera (30) can be installed at a position corresponding to the center of a short side or four corners of the substrate (S) and the mask (M).

The position adjustment mechanism (29) performs mask alignment (first alignment) for adjusting the relative position of the mask (M) with respect to the mask mounting stand (23) and substrate alignment (second alignment) for adjusting the relative position between the substrate (S) and the mask (M) based on the position information of the substrate (S) and the mask (M) acquired by the alignment camera (30).

The film forming apparatus (11) has a control unit (not shown). The control unit has functions such as return of the substrate (S) and substrate alignment and mask alignment, control of the deposition source, and control of the film forming. The control unit can be configured by, for example, a computer having a processor, memory, storage, I/O, etc. In this case, the function of the control unit is realized by the processor executing a program stored in the memory or storage. As the computer, a general-purpose personal computer may be used, or an embedded computer or a PLC (programmable logic controller) may be used. Alternatively, part or all of the functions of the control unit may be configured by a circuit such as an ASIC or an FPGA. In addition, a control unit may be installed for each film forming apparatus, or a single control unit may be configured to control a plurality of film forming apparatuses.

<Basic operation of mask alignment (first alignment)>

Below, mask alignment for adjusting the relative position of the mask (M) with respect to the mask holder (23) is described.

Fig. 4 is a conceptual diagram explaining the basic operation of mask alignment. Mask alignment includes a process of measuring the positional misalignment of a mask (M) seated on a mask holder (23) on the mask holder (23) (Fig. 4(a)), a process of lifting the mask (M) from the mask holder (23) and then adjusting the position by relatively moving the mask (M) and the mask holder (23) enough to offset the measured positional misalignment (Fig. 4(b)), and a process of seating the adjusted mask (M) on the mask holder (23) to re-measure the positional misalignment and verifying whether the measured misalignment is within a specified value (Fig. 4(c)) (if the measured misalignment is not within a specified value, the above positional adjustment operation is repeated).

The film forming device (11) according to the present invention is equipped with the aforementioned alignment camera (30) as a position information acquisition means and a position adjustment mechanism (29) for adjusting the relative position of the mask support unit (22) with respect to the mask mounting stand (23) in order to measure the positional misalignment and adjust the position.

The alignment camera (30) photographs an alignment mark formed on the mask (M) placed on the mask mounting stand (23) to obtain information about the position of the mask (M). The control unit of the deposition device compares the obtained position of the mask (M) with a reference position on the mask mounting stand (23), measures the degree to which the mask (M) is relatively misaligned in the XYθ directions with respect to the reference position (relative positional misalignment amount, ΔX, ΔY, Δθ), and calculates a movement instruction amount by which the mask (M) should be relatively moved in a position adjustment process of the mask (M) with respect to the mask mounting stand (23) described later based on this positional misalignment amount. Here, the movement instruction amount is basically a value for adjusting the position of the mask (M) with respect to the mask mounting plate (23) in the horizontal plane (XY plane) in the opposite direction by an amount corresponding to the positional misalignment so as to offset the measured positional misalignment amount, and specifically, it can be a value of a drive amount for each of a plurality of X, Y-direction servo motors (in the present embodiment, a total of four-axis servo motors including two X-direction servo motors and two Y-direction servo motors) that drive the stage portion of the aforementioned positional adjustment mechanism (29), which is a positional adjustment mechanism of the mask support mechanism (22) in the horizontal plane (XY plane), in the X-axis and Y-axis directions, respectively.

The reference position, which serves as a criterion for measuring the misalignment, can be set as the position of the center point of the captured image of the alignment camera. That is, the relative misalignment between the mask (M) and the mask mounting stand (23) can be calculated based on the distance from the mask alignment mark to the center point of the captured image of the alignment camera. However, the present invention is not limited thereto, and the reference position may be set by another method. For example, a reference mark may be formed on a separate reference mark installation stand fixedly installed to the mask mounting stand (23) or the vacuum vessel (20), and this may be captured by the alignment camera, and the reference position may be determined from the captured image of the reference mark. In addition, instead of capturing a reference mark together with the mask alignment each time and calculating the reference position through image processing, the reference position may be calculated at the time of the initial setting of the film forming device or when replacing the mask, stored in the memory of the control unit, and then read out when the mask alignment process is performed.

When the calculation of the movement instruction amount based on the measured position misalignment amount is completed, the mask support unit (22) is raised by the mask support unit lifting mechanism (27) to separate the mask (M) from the mask stand (23), and then the mask support unit (22) is moved relatively to the mask mounting stand (23) within the horizontal plane (XY plane) by the calculated movement instruction amount by the position adjustment mechanism (29), thereby adjusting the position of the mask (M) with respect to the mask mounting stand (23).

That is, while the mask mounting plate (23) is fixedly installed on the upper surface of the vacuum vessel (20), the mask supporting unit lifting mechanism (27) to which the mask supporting unit (22) is connected is mounted on the stage portion of the positioning mechanism (29) and configured to be movable within a horizontal plane (XY plane) by a driving portion configured by a plurality of servo motors, and therefore, by driving and moving the stage portion of the positioning mechanism (29) by the calculated movement instruction amount, the mask (M) supported by the mask supporting unit (22) can be positioned (aligned) with respect to the mask mounting plate (23).

In addition, with regard to mask alignment, as with the alignment between the substrate and the mask described later, a configuration may be adopted in which rough alignment (e.g., specification value ΔSpec 200 ㎛) is followed by fine alignment (e.g., specification value ΔSpec 50 ㎛). In this case, the offset correction of the mask alignment described later is performed during the fine alignment.

<Offset correction of mask alignment>

Above, the basic operation of mask alignment has been explained, but depending on the mask, even if the position adjustment operation described above is continuously repeated, a certain amount of positional misalignment may continue to occur.

Figure 5 is a schematic diagram explaining this situation.

Fig. 5(a) shows the state after the mask (M) is moved by the calculated movement instruction amount based on the measured positional misalignment amount on the mask mounting stand (23) according to the basic operation of the mask alignment described above and the mask (M) is moved by the calculated movement instruction amount while being spaced from the mask mounting stand (23) to adjust the position. Next, the mask (M) whose position has been adjusted is seated on the mask mounting stand (23) and it is confirmed and verified that the positional misalignment amount is within the specified value, and then the next process is performed. However, as shown in Fig. 5(b), depending on the mask, the position of the mask (M) may misalign again along with the seating operation during such seating. This phenomenon may occur, for example, when a mask with poor processing precision, such as poor flatness of the mask surface supported by the mask holder, is used. That is, when such a mask is lifted by the mask holder, the mask may be inclined with respect to the mask holder, and due to this inclination, when the mask is re-seated on the mask holder, even if the mask is placed down vertically, the position may always be misaligned in one direction. The amount of this misalignment during seating may slightly change each time the mask is lifted and placed down, and this may be because the position of the support surface when the mask is lifted changes slightly. When the mask seating motion is repeated a predetermined number of times and the position of the support surface when the mask is lifted becomes almost constant, thereafter, an almost constant amount of misalignment continues to occur repeatedly each time the mask is seated. Fig. 5(c) shows this situation. That is, for a mask that has a certain amount (△) of misalignment when placed on the mask mounting stand, simply moving the mask by a movement instruction amount corresponding to the measured misalignment amount (△) as in the above-described normal alignment operation to adjust the position will cause the mask to continue to have the certain amount (△) of misalignment on the mask mounting stand even if the alignment operation is repeated several times.

The present invention provides an improved mask alignment method, a film forming method using the same, an alignment device implementing the same, and a film forming device capable of resolving problems such as an increase in the overall tact time of a film forming device (11) due to the mask position not being within a specified value and misalignment continuously occurring despite an alignment operation, and the like.

FIG. 6 is a schematic diagram conceptually explaining an improved mask alignment operation according to the present invention.

As described above in Fig. 5(c), if it is determined that a substantially constant amount of positional misalignment (△) continues to occur at each seating even when the mask is positioned with a movement instruction amount corresponding to the measured positional misalignment (△) (Fig. 6(a)), then at the next alignment operation, that is, when the mask (M) is lifted and spaced again from the mask holder (23) (Fig. 6(b)), the mask (M) is moved with a movement instruction amount corresponding to a total misalignment amount of 2△, which is the same amount (△) added to the above-mentioned misalignment amount (△), and the position adjustment is performed (Fig. 6(c)). In other words, an offset of the same amount (△) is added to the measured misalignment amount (△), and the movement instruction amount is corrected to a value corresponding to a total of 2△, and the mask (M) is further moved in the opposite direction to the misalignment by the amount of this offset correction.

Finally, when the mask (M) that has been moved further by the offset compensation in this way is placed on the mask holder (23), the constant misalignment amount (△) that occurs during the seating described above is added, so that it is placed in a position-adjusted state at the center position of the mask holder (23) (Fig. 6(d)). That is, for example, if the current position of the mask is misaligned by a predetermined misalignment amount of -△ from the center position (position 0), moving +△ will return it to position 0, and moving +△ again from there will return it to position +△. Since the mask is placed down from this position +△, it will be misaligned by -△ and will come to exactly position 0, the movement instruction amount becomes (+△)+(+△), and as a result, it becomes twice (2△) the predetermined misalignment amount △.

In this way, the present invention is characterized in that, when the positional misalignment of the mask on the mask mounting table occurs repeatedly at a substantially constant amount when adjusting the position of the mask with a movement instruction amount based on the measured positional misalignment amount, alignment (position adjustment of the mask) is performed with an offset-corrected movement instruction amount at the next alignment operation.

In short, if it is determined that a nearly constant amount of mask misalignment is repeated, it is considered that further position adjustment is not possible with normal alignment, and alignment operation is performed according to the offset-compensated movement instruction amount.

Below, a specific embodiment is described regarding the timing for entering into such offset correction, that is, the timing for determining that the conditions for performing offset correction are met.

FIG. 7a and FIG. 7b are flowcharts for explaining the timing of offset correction according to the first embodiment of the present invention.

When a mask (M) is transported into a vacuum vessel (20) of a film forming device (11) by a return robot (14) (S1), the mask support unit (22) receives the mask (M) and places it on a mask mounting stand (23) (S2).

Next, an alignment mark formed on a mask (M) is photographed using an alignment camera (30), and the positional misalignment Δ1 (ΔX, ΔY, Δθ) of the mask (M) in a horizontal plane (XY plane) with respect to the mask mounting stand (23) is measured from the photographed image information (S3).

The measured positional misalignment Δ1 is compared with the specified standard value Δspec (S4). If the positional misalignment Δ1 is less than the standard value Δspec, the mask alignment is completed, and the film formation process proceeds through alignment with the substrate described later. The standard value Δspec of the mask alignment is set to, for example, 50 μm in this embodiment, but is not limited thereto and may be appropriately set as needed.

When the measured position misalignment Δ1 deviates from the predetermined standard value Δspec, the mask support unit (22) is raised to separate the mask (M) from the mask mounting stand (23), and then the stage portion of the position adjustment mechanism (29) is moved within the horizontal plane (XY plane) by a movement instruction amount (d1) corresponding to the position misalignment Δ1, thereby adjusting the relative position of the mask (M) with respect to the mask mounting stand (23) (S5: 1st position adjustment (Move 1)). As described above, specifically, the movement instruction amount may be a value of a drive amount for each of a plurality of X, Y-direction servo motors (in the present embodiment, a total of four-axis servo motors including two X-direction servo motors and two Y-direction servo motors) that drive the stage portion of the position adjustment mechanism (29) in the X-axis and Y-axis directions, respectively.

Next, the position-adjusted mask (M) is re-seated on the mask holder (23), the positional misalignment Δ2 is measured (S6), and the measured positional misalignment Δ2 is compared with the specified value Δspec (S7). If the positional misalignment Δ2 is less than the specified value Δspec, the mask alignment is completed.

If the measured position misalignment Δ2 deviates from the specified value Δspec, the mask (M) is moved again from the mask mounting stand (23), and the stage section of the position adjustment mechanism (29) is moved within the horizontal plane (XY plane) by a movement instruction amount (d2) corresponding to the position misalignment Δ2, thereby adjusting the relative position of the mask (M) with respect to the mask mounting stand (23) (S8: 2nd position adjustment (Move 2)).

Next, the position-adjusted mask (M) is re-seated on the mask holder (23), the positional misalignment Δ3 is measured (S9), and the measured positional misalignment Δ3 is compared with the specified value Δspec (S10). If the positional misalignment Δ3 is less than the specified value Δspec, the mask alignment is completed.

If the positional misalignment Δ3 deviates from the specified value Δspec, the mask (M) is again separated from the mask mounting stand (23), and the stage section of the position adjustment mechanism (29) is moved within the horizontal plane (XY plane) by a movement instruction amount (d3) corresponding to the positional misalignment Δ3, thereby adjusting the relative position of the mask (M) with respect to the mask mounting stand (23) (S11: 3rd position adjustment (Move 3)).

Continuing, after the position-adjusted mask (M) is placed on the mask holder (23), the positional misalignment amount Δ4 is measured (S12), and the measured positional misalignment amount Δ4 is compared with the specified value Δspec (S13). If the positional misalignment amount Δ4 is less than the specified value Δspec, the mask alignment is completed.

If the measured position misalignment Δ4 still deviates from the specified value Δspec despite the above three position adjustment operations, it is determined whether the difference between the immediately preceding past movement instruction amounts is less than or equal to the reference value dref for two consecutive times (S14). That is, it is determined whether the difference (｜d1-d2｜) between the movement instruction amount (d1) in the first position adjustment (Move 1) and the movement instruction amount (d2) in the second position adjustment (Move 2) is less than or equal to the specified reference value dref, and at the same time, whether the difference (｜d2-d3｜) between the movement instruction amount (d2) in the second position adjustment (Move 2) and the movement instruction amount (d3) in the third position adjustment (Move 3) is also less than or equal to the specified reference value dref. Here, the comparison between the difference between the movement instruction amounts and the reference value is performed for each of the four-axis servo motors that drive the stage section described above. It is preferable that the reference value dref be set to a smaller value than the regulation value Δspec of the mask alignment. In this embodiment, as described above, the regulation value Δspec of the mask alignment is set to 50 μm, and the reference value dref is set to a smaller value, for example, 30 μm. However, the present invention is not limited thereto, and may be appropriately set as needed.

Until the difference between the previous past movement instructions is judged to be less than the reference value twice in a row, the normal position adjustment operation, similar to the 1st to 3rd position adjustments (Move 1 to 3) described above, is continued (S15-1).

In all four servo motors, if the difference between the immediately preceding past movement instructions becomes less than the reference value twice in a row, it is determined that the positional misalignment of the mask on the mask mounting table is repeated almost consistently. In other words, it is determined that further position adjustment is impossible with normal alignment, and therefore the conditions for performing offset correction are established. Based on such a determination, in the fourth position adjustment (Move 4) performed in a state where the mask (M) is separated from the mask mounting table (23) again, the stage section of the position adjustment mechanism (29) is moved within the horizontal plane (XY plane) by a movement instruction amount (2×d4) corresponding to twice the measured positional misalignment amount Δ4, thereby adjusting the relative position of the mask (M) with respect to the mask mounting table (23) (S15: fourth position adjustment (Move 4)). In other words, the first offset correction operation is performed. In most cases, the amount of misalignment measured subsequently is often within the specified value by this offset correction. However, if the amount of misalignment still exceeds the specified value even after one offset correction depending on the mask, the same procedure as above is repeated to attempt offset correction once more.

As described above, in the first embodiment of the present invention, when the positional misalignment of the mask is repeated almost constantly, alignment is performed according to the offset-corrected movement instruction amount, thereby quickly bringing the mask positional misalignment within a specified value and completing the alignment, and as a result, delay in the overall TACT time of the film forming device (11) can also be prevented. In addition, in the first embodiment of the present invention, when the difference between the immediately preceding past movement instructions becomes equal to or less than the reference value twice in a row, as the offset correction timing, it is determined that the condition for performing the offset correction is satisfied.

FIG. 8a and FIG. 8b are flowcharts for explaining the timing of offset correction according to the second embodiment of the present invention.

After performing the second position adjustment (Move 2), the steps up to the step (S1’ to S’10) of measuring the positional misalignment Δ3 and comparing it with the specified value Δspec are the same as in the first embodiment described above, so their description is omitted.

If the measured position misalignment Δ3 deviates from the specified value Δspec, it is determined whether to enter the offset compensation operation in the third position adjustment (Move 3) stage. That is, if the measured position misalignment Δ3 deviates from the specified value Δspec after two position adjustments (Move 1, Move 2), it is determined whether the difference between the immediately preceding two movement instruction amounts (i.e., the difference (｜d1-d2｜) between the movement instruction amounts (d1) in the first position adjustment (Move 1) and the movement instruction amounts (d2) in the second position adjustment (Move 2)) is equal to or less than the reference value dref (S’11). The comparison between the difference between the movement instruction amounts and the reference value is performed for each of the four-axis servo motors that drive the stage section, as in the first embodiment.

In all four servo motors, if the difference between the two previous movement instructions is less than or equal to the reference value, it is considered that the positional misalignment of the mask has become almost constant, and it is determined that the conditions for offset correction are met. Accordingly, in the third position adjustment (Move 3), the stage section of the position adjustment mechanism (29) is moved within the horizontal plane (XY plane) by a movement instruction amount (2×d3) corresponding to twice the measured positional misalignment Δ3, thereby adjusting the relative position of the mask (M) with respect to the mask mounting plate (23) (S’12: third position adjustment (Move 3)). In other words, the first offset correction operation is performed. On the other hand, if it is determined in step S’11 that the difference between the two previous movement instructions is not less than the reference value, the normal position adjustment operation similar to that in the first and second position adjustments (Move 1, 2) is continuously performed until the corresponding condition is met (S’12-1).

If the misalignment does not come within the specified value even after the first offset correction in step S’12 (S’13, S’14), a normal alignment is performed once for position adjustment according to the movement instruction amount corresponding to the measured misalignment (S’15: 4th position adjustment (Move 4)), and then whether the offset correction condition is met is determined immediately in the next position adjustment step. That is, if the measured misalignment Δ5 deviates from the specified value after the 4th position adjustment (Move 4) (S’16, S’17), whether the offset correction condition is met is determined in the following step S’18. At this time, whether the offset correction condition is met is determined based on whether the difference (｜d2-d4｜) between the movement instruction amount (d4) in the previous position adjustment (Move 4) and the movement instruction amount (d2) when the offset correction condition is met for the first time is less than or equal to the reference value dref. That is, the movement instruction amount when the offset correction condition is determined to be satisfied for the first time is used as the comparison target. In addition, here, the movement instruction amount d2 is used as the comparison target as the movement instruction amount when the offset correction condition is satisfied for the first time, that is, when it is determined to be ｜d1-d2｜ ≤dref or less, but the other movement instruction amount d1 may also be used as the comparison target.

Accordingly, if it is determined that the offset correction condition is satisfied, in the fifth position adjustment (Move 5), the second offset correction is attempted (S’19) by moving the mask (M) by a movement instruction amount (2×d5) corresponding to twice the measured position misalignment Δ5. If the misalignment amount still exceeds the specified value even after these two offset corrections, the operations of S’13 to S’19 are repeated to attempt additional offset correction.

As described above, according to the second embodiment of the present invention, as with the first embodiment, the mask position misalignment can be quickly brought within the specified value, and the alignment can be completed in a short time, thereby obtaining the same effect of preventing a delay in the overall TACT time of the film forming device (11). In addition, according to the second embodiment of the present invention, since the establishment of the first offset correction condition is determined based only on the difference between the movement instructions of the two previous times, the timing of the first offset correction can be brought forward compared to the first embodiment. In addition, in the offset corrections after the second time, since the movement instruction amount when the offset correction condition establishment was determined to be established for the first time is used as the comparison target, the timing can be brought forward compared to the first embodiment, and therefore, there is an advantage in that the number of times offset correction can be attempted within the limited number of operations can be increased compared to the first embodiment.

<Board alignment (2nd alignment)>

As described above, when the mask alignment is completed, alignment of the substrate (S) is performed with respect to the mask (M) placed on the mask mounting stand (23).

In a state where a substrate (S) supported by a substrate support unit (21) is moved to a predetermined position above a mask (M) by a substrate support unit lifting mechanism (26), alignment marks formed on each of the substrate (S) and the mask (M) are photographed by an alignment camera (30), and the relative positional misalignment of the substrate (S) and the mask (M) in a horizontal plane (XY plane) is adjusted based on the photographed images.

The alignment of the substrate (S) to the mask (M) may be performed in two stages: “rough alignment” for roughly adjusting the relative positions thereof, and “fine alignment” for highly accurately aligning the substrate (S) roughly aligned by the rough alignment to the mask (M). For this purpose, two types of cameras (30) may be installed as the alignment camera: a low-resolution but wide-angle camera used for rough alignment, and a narrow-angle but high-resolution camera used for fine alignment.

When the alignment of the substrate (S) to the mask (M) is completed, the substrate support unit (21) is lowered so that the entire substrate (S) is placed on the mask (M).

Through the above process, the placement processing of the substrate (S) on the mask (M) is completed, and the cooling plate (24) and/or the magnet plate are lowered to the upper surface of the substrate (S) to adhere/fix the substrate (S) and the mask (M), after which a film formation process (deposition process) is performed.

<Tabernacle Process>

As above, when the alignment is completed and the substrate (S) and the mask (M) are in close contact/fixed state, the shutter of the deposition source (25) is opened and the deposition material is deposited on the substrate (S) through the mask (M).

When the film is formed to the desired thickness on the substrate (S), the shutter of the deposition source (25) is closed.

Next, the cooling plate (24) and/or the magnet plate are raised, and then the substrate support unit (21) is raised to separate the substrate (S) and the mask (M).

The hand of the return robot (14) enters the vacuum vessel (20) of the deposition device (11) and removes the substrate on which deposition has been completed from the vacuum vessel (20).

After the film formation process is performed on a predetermined number of substrates (S), the used mask (M) is removed from the vacuum container (20) by a return robot (14) and returned to the mask stock device (12).

<Method for manufacturing electronic devices>

Next, an example of a method for manufacturing an electronic device using the film forming apparatus of the present embodiment is described. Hereinafter, as an example of an electronic device, the configuration and manufacturing method of an organic EL display device are exemplified.

First, the organic EL display device being manufactured will be described. Fig. 9(a) is an overall view of the organic EL display device (60), and Fig. 9(b) shows a cross-sectional structure of one pixel.

As illustrated in Fig. 9(a), in the display area (61) of the organic EL display device (60), a plurality of pixels (62) each having a plurality of light-emitting elements are arranged in a matrix form. As will be described in detail later, each of the light-emitting elements has a structure including an organic layer sandwiched between a pair of electrodes. In addition, the pixel referred to here refers to the minimum unit that enables a desired color display in the display area (61). In the case of the organic EL display device according to the present embodiment, the pixel (62) is configured by a combination of a first light-emitting element (62R), a second light-emitting element (62G), and a third light-emitting element (62B) that exhibit different light emission. The pixel (62) is often configured by a combination of a red light-emitting element, a green light-emitting element, and a blue light-emitting element, but may also be a combination of a yellow light-emitting element, a cyan light-emitting element, and a white light-emitting element, and there is no particular limitation as long as there is at least one color.

Fig. 9(b) is a partial cross-sectional schematic diagram taken along line A-B of Fig. 9(a). The pixel (62) has an organic EL element having an anode (64), a hole transport layer (65), light-emitting layers (66R, 66G, 66B), an electron transport layer (67), and a cathode (68) on a substrate (63). Of these, the hole transport layer (65), the light-emitting layers (66R, 66G, 66B), and the electron transport layer (67) correspond to organic layers. In addition, in the present embodiment, the light-emitting layer (66R) is an organic EL layer that emits red, the light-emitting layer (66G) is an organic EL layer that emits green, and the light-emitting layer (66B) is an organic EL layer that emits blue. The light-emitting layers (66R, 66G, 66B) are formed in patterns corresponding to light-emitting elements (sometimes called organic EL elements) that emit red, green, and blue, respectively. In addition, the anode (64) is formed separately for each light-emitting element. The hole transport layer (65), the electron transport layer (67), and the cathode (68) may be formed in common with a plurality of light-emitting elements (62R, 62G, 62B), or may be formed for each light-emitting element. In addition, in order to prevent the anode (64) and the cathode (68) from being short-circuited by a foreign substance, an insulating layer (69) is provided between the anode (64). In addition, since the organic EL layer is deteriorated by moisture or oxygen, a protective layer (70) is provided to protect the organic EL element from moisture or oxygen.

In Fig. 9(b), the hole transport layer (65) or the electron transport layer (67) is illustrated as a single layer, but depending on the structure of the organic EL display element, it may be formed as a plurality of layers including a hole block layer or an electron block layer. In addition, a hole injection layer having an energy band structure that allows for smooth injection of holes from the anode (64) to the hole transport layer (65) may be formed between the anode (64) and the hole transport layer (65). Similarly, an electron injection layer may also be formed between the cathode (68) and the electron transport layer (67).

Next, a specific example of a method for manufacturing an organic EL display device is described.

First, a circuit (not shown) for driving an organic EL display device and a substrate (63) on which an anode (64) is formed are prepared.

An acrylic resin is formed by spin coating on a substrate (63) on which an anode (64) is formed, and the acrylic resin is patterned by lithography so that an opening is formed in the portion where the anode (64) is formed, thereby forming an insulating layer (69). This opening corresponds to the light-emitting area where the light-emitting element actually emits light.

The substrate (63) on which the insulating layer (69) is patterned is introduced into the first organic material film forming device, the substrate is supported by the substrate supporting unit, and the hole transport layer (65) is formed as a common layer on the anode (64) of the display area. The hole transport layer (65) is formed by vacuum deposition. In reality, since the hole transport layer (65) is formed in a size larger than the display area (61), a high-precision mask is not required.

Next, the substrate (63) formed up to the hole transport layer (65) is introduced into the second organic material film forming device and supported by the substrate support unit. Alignment of the substrate and the mask is performed, the substrate is placed on the mask, and a red-emitting layer (66R) is formed on the portion of the substrate (63) where the red-emitting element is arranged.

As with the deposition of the light-emitting layer (66R), a light-emitting layer (66G) that emits green is deposited by a third organic material deposition device, and further, a light-emitting layer (66B) that emits blue is deposited by a fourth organic material deposition device. After the deposition of the light-emitting layers (66R, 66G, 66B) is completed, an electron-transport layer (67) is deposited over the entire display area (61) by a fifth organic material deposition device. The electron-transport layer (67) is formed as a common layer for the light-emitting layers (66R, 66G, 66B) of three colors.

The substrate formed up to the electron transport layer (67) is moved to a film forming device of a metallic deposition material to form a cathode (68).

Afterwards, it is moved to a plasma CVD device to form a protective layer (70), thereby completing the organic EL display device (60).

From the time the substrate (63) on which the insulating layer (69) is patterned is brought into the film forming apparatus until the film forming of the protective layer (70) is completed, there is a risk that the light-emitting layer made of the organic EL material may be deteriorated by moisture or oxygen if exposed to an atmosphere containing moisture or oxygen. Therefore, in this example, the bringing in and taking out of the substrate between film forming apparatuses is performed under a vacuum atmosphere or an inert gas atmosphere.

The above embodiment shows an example of the present invention, and the present invention is not limited to the configuration of the above embodiment, and may be appropriately modified within the scope of the technical idea thereof.

20: Vacuum container
21: Substrate support unit
22: Mask support unit
23: Mask wit stand
26: Substrate support unit lifting mechanism
27: Mask support unit lifting mechanism
29: Positioning mechanism
30: Camera for alignment
221: Support zone
231: Support area reception home

Claims (16)

A mask alignment method for adjusting the relative positions of a mask holder and a mask,
A measuring process for measuring the relative positional misalignment of the mask on the mask mounting stand,
A position adjustment process for moving the mask relative to the mask mounting stand by a movement instruction amount corresponding to the measured positional misalignment amount within a plane parallel to the mounting surface of the mask mounting stand while the mask is separated from the mask mounting stand,
Including a mounting process of mounting the mask, which has been moved relative to the mask, on the mask mounting table;
A mask alignment method characterized by correcting the movement instruction amount based on predetermined conditions and performing the position adjustment process using the corrected movement instruction amount. In the first paragraph,
A mask alignment method, characterized in that the correction of the above movement instruction amount is performed by correcting the movement instruction amount corresponding to twice the positional misalignment amount measured in the above measurement process. In the second paragraph,
A mask alignment method characterized in that when the above measurement process, the position adjustment process, and the mounting process are sequentially repeated, the positional misalignment of the mask on the mask mounting table is repeated as a misalignment amount that deviates from a predetermined standard value, and further, when the change in the positional misalignment amount becomes below a predetermined reference value, it is determined that the predetermined condition is met, and a corrected position adjustment is performed using the movement instruction amount after the correction in the next position adjustment process. In the third paragraph,
A mask alignment method characterized in that when the difference between the previous movement instruction amount and the movement instruction amount corresponding to the positional misalignment of the mask on the mask mounting stand becomes less than or equal to the predetermined reference value twice in a row, it is determined that the change in the positional misalignment amount is less than or equal to the predetermined reference value. In the third paragraph,
A mask alignment method characterized in that when the difference between the two previous movement instructions corresponding to the positional misalignment of the mask on the mask mounting stand becomes less than or equal to the predetermined reference value, the change in the positional misalignment is determined to be less than or equal to the predetermined reference value, and the first corrected position adjustment is performed using the movement instruction value after the correction in the next position adjustment process. In paragraph 5,
A mask alignment method characterized in that the second and subsequent corrected position adjustments are performed by comparing one of the movement instruction amounts that was the target of the difference comparison when the first corrected position adjustment was performed with the movement instruction amount immediately before the second and subsequent corrected position adjustments are performed when the difference becomes less than or equal to the predetermined reference value. In any one of the third to sixth paragraphs,
A mask alignment method, characterized in that the above-mentioned reference value is a value smaller than the above-mentioned regulation value. A first alignment process of placing a mask on a mask mounting stand with the relative position of the mask with respect to the mask mounting stand adjusted using the mask alignment method described in any one of claims 1 to 6,
A second alignment process for adjusting the relative position of the substrate with respect to the mask placed on the mask mounting plate,
A film forming method characterized by including a process of contacting the adjusted substrate and the mask, and then forming a film on the substrate via a deposition material from a deposition source through the mask. As a mask alignment device for adjusting the relative position of the mask holder and the mask,
A mask support unit that temporarily supports the mask before and after placing the mask on the mask holder;
A mask support unit lifting mechanism for lifting the above mask support unit,
A measuring means for measuring the relative positional misalignment of the mask on the mask mounting stand,
A position adjustment mechanism that moves the mask relative to the mask mounting stand by a movement instruction amount corresponding to the measured positional misalignment amount within a plane parallel to the mounting surface of the mask mounting stand while the mask is separated from the mask mounting stand,
Including a control unit that controls the movement instruction amount when adjusting the position by the above position adjustment mechanism,
A mask alignment device, characterized in that the control unit controls the position adjustment mechanism to correct the movement instruction amount based on predetermined conditions and perform the position adjustment using the corrected movement instruction amount. In Article 9,
A mask alignment device characterized in that the correction of the above movement instruction amount is performed by correcting the movement instruction amount to twice the positional misalignment amount measured by the above measuring means. In Article 10,
The above control unit,
A mask alignment device characterized in that, in sequentially repeating a step of measuring the positional misalignment by the measuring means, a step of adjusting the position by the position adjustment mechanism, and a step of lowering the mask support unit by the mask support unit elevating mechanism and re-mounting the position-adjusted mask on the mask mounting stand, when the positional misalignment of the mask on the mask mounting stand is repeated as a misalignment amount that deviates from a predetermined standard value, and further, when the change in the positional misalignment amount becomes equal to or lower than a predetermined reference value, it is determined that the predetermined condition is met, and the position adjustment mechanism is controlled to perform a corrected position adjustment using the movement instruction amount after the correction in the next position adjustment step. In Article 11,
The above control unit,
A mask alignment device characterized in that when the difference between the previous movement instruction amount and the movement instruction amount corresponding to the positional misalignment of the mask on the mask mounting stand becomes less than or equal to the predetermined reference value twice in a row, it is determined that the change in the positional misalignment amount is less than or equal to the predetermined reference value. In Article 11,
The above control unit,
A mask alignment device characterized in that when the difference between the two previous movement instructions corresponding to the positional misalignment of the mask on the mask mounting stand becomes less than or equal to the predetermined reference value, the change in the positional misalignment is determined to be less than or equal to the predetermined reference value, and the position adjustment mechanism is controlled to perform the first corrected position adjustment using the movement instruction value after the correction in the next position adjustment process. In Article 13,
The above control unit,
A mask alignment device characterized in that the position adjustment mechanism is controlled so that the second and subsequent corrected position adjustments are performed by comparing one of the movement instruction amounts that was the comparison target of the difference when the first corrected position adjustment was performed with the movement instruction amount immediately before the second and subsequent corrected position adjustments are performed when the difference becomes less than or equal to the predetermined reference value. In any one of Articles 11 to 14,
A mask alignment device, characterized in that the above-mentioned reference value is a value smaller than the above-mentioned regulation value. A mask alignment device as described in any one of claims 9 to 14,
A substrate support unit that holds and supports the substrate,
A deposition device comprising a deposition source that accommodates a deposition material.