KR20080005738A - Socket for testing semiconductor chip package testing any size of semiconductor chip package - Google Patents

Abstract

A socket for testing a semiconductor chip package with various sizes is provided to test electrical characteristics of the semiconductor chip package by using the prior socket without replacing the socket. A socket housing(310) has a loading part(380) for a semiconductor chip package to be placed, and comprises a contact pin(390) capable of being connected to the semiconductor chip package electrically. A cover housing is connected to the socket housing. The socket housing comprises a first fixing part(320) fixing one plane of the semiconductor chip package, a second fixing part(340) fixing another plane of the semiconductor chip package, and a supporting part(360) fixing the other plane except the fixed planes.

Description

Socket for testing semiconductor chip package that can inspect semiconductor chip packages of various sizes {Socket for testing semiconductor chip package testing any size of semiconductor chip package}

BRIEF DESCRIPTION OF THE DRAWINGS In order to better understand the drawings cited in the detailed description of the invention, a brief description of each drawing is provided.

1 is a perspective view showing a semiconductor chip package inspection socket according to the prior art.

FIG. 2 is a longitudinal cross-sectional view for explaining that a semiconductor chip package is mounted on a semiconductor chip package inspection socket having the configuration shown in FIG. 1. FIG.

3 is a plan view of a socket for inspecting a semiconductor chip package according to the present invention.

4 is a perspective view of a first fixing part of the socket for inspecting the semiconductor chip package of FIG. 3.

5 is a longitudinal cross-sectional view illustrating a case in which the socket for semiconductor chip package inspection of the present invention inspects a semiconductor chip package.

The present invention relates to a socket for inspecting a semiconductor chip package, and more particularly to a socket for inspecting a semiconductor chip package capable of inspecting electrical characteristics without replacing the socket for semiconductor chip packages of various sizes.

The semiconductor device is manufactured through a preliminary process, that is, a fabrication process and a postprocess, that is, an assembly process. The preprocessed semiconductor device integrated circuit is subjected to electrical die sorting (EDS) using probe equipment, and semiconductor devices that are judged to be good at this stage are subjected to a series of packaging processes in a later process. It is reprocessed into a semiconductor chip package. The semiconductor chip package is subjected to an electrical property inspection process before being provided to the user. In the electrical property inspection process, a socket is used to inspect electrical characteristics of a semiconductor chip package. The socket for inspecting a semiconductor chip package is a device that transmits an electrical signal by electrically connecting a semiconductor device integrated circuit to a tester, and its configuration and shape vary according to the type and type of the semiconductor chip package.

1 is a perspective view showing a semiconductor chip package inspection socket 100 according to the prior art.

Referring to FIG. 1, a socket for inspecting a semiconductor chip package according to the related art includes a socket housing 110 and a cover 130 which is hinged to the socket housing 110 so as to be opened and closed. The socket housing 110 includes an alignment plate on which a semiconductor chip package (not shown) is placed, and a contact plate on which a plurality of contact pins 118 are electrically connected to the semiconductor chip package. The semiconductor chip package is connected to the contact pins 118 of the contact plate through the loading part 120 formed at an approximately center portion of the alignment plate. The contact pins 118 are configured to have different electrical wiring positions depending on the type of semiconductor chip package.

A lead backer 140 is coupled to the inner side surface 132 of the cover 130. An elastic body such as a spring is interposed between the lead backer 140 and the cover 130. The elastic body is disposed at appropriate intervals to apply a constant pressure to the entire surface of the lead backer 140.

The lead backer 140 has a support plate 144 in the form of a plate having a through hole 142 formed at a center thereof, and the support plate 144 at a position corresponding to the loading part 120 in which the semiconductor chip package is placed. A protrusion 146 protruding upward. The through hole 142 formed in the support plate 144 is formed at a position corresponding to the through hole (not shown) formed in the center of the cover 130. Therefore, in the state where the cover 130 and the lead backer 140 are coupled to each other, the through holes communicate with each other.

FIG. 2 is a longitudinal cross-sectional view for explaining that the semiconductor chip package 170 is mounted on the semiconductor chip package inspection socket 100 having the configuration illustrated in FIG. 1.

In FIG. 2, the cover 130 and the lead backer 140 are coupled to each other by a joint bolt 160 including a female screw 162 and a male screw 164. The cover 130 and It is shown that the through holes 138 and 142 communicate with each other in a state in which the lead backers 140 are coupled to each other. Reference numeral 150 is a spring as an elastic body interposed between the lead backer 140 and the cover 130.

As shown in FIG. 2, when the semiconductor chip package 170 is mounted on a portion of the contact pin 118 inside the socket housing 110, the semiconductor chip package 170 is mounted on the contact pin 118 inside the socket housing 110. The protrusion 146 of the lead backer 140, which serves to press the semiconductor chip package 170, is in contact with an appropriate position of the semiconductor chip package 170, and thus, the semiconductor chip package 170 is formed in the socket 100. ) Can be mounted well.

As can be seen from Figures 1 and 2, the prior art is to test the test by matching the semiconductor chip package 170 and the socket 100 to 1: 1. In this case, when the size of the semiconductor chip package is changed, all sockets must be newly manufactured, thereby increasing the test cost, and there is a high possibility that product analysis will be interrupted due to the long time required for new manufacturing. In addition, according to the size of the semiconductor chip package it is necessary to constantly change the socket there is a problem that causes frequent failure of the test board (boaed).

SUMMARY OF THE INVENTION The present invention provides a semiconductor chip package socket capable of inspecting electrical characteristics of semiconductor chip packages of various sizes using existing sockets without replacing sockets when testing semiconductor chip packages of various sizes. .

According to an aspect of the present invention, there is provided a socket for inspecting a semiconductor chip package, the socket housing having a loading portion on which the semiconductor chip package is to be placed and having contact pins electrically connected to the semiconductor chip package under the loading portion. ; And a cover housing coupled to the socket housing to be openable and closeable, wherein the socket housing moves in one direction to fix the center of the semiconductor chip package to the center of the loading part, thereby fixing one surface of the semiconductor chip package. 1 fixing part; A second fixing part which moves in a direction not parallel to the one direction to fix the other surface connected to the one surface; And it has a support for fixing the remaining surface except the fixed surface.

The first fixing part may include a first plate in contact with one surface of the semiconductor chip package; And a first adjusting part coupled to the first plate to adjust the first plate to be moved, and the second fixing part being in contact with the other surface connected to one surface of the semiconductor chip package in contact with the first plate. plate; And a second adjusting part coupled to the second plate to adjust the second plate to move.

Preferably, the first adjusting portion or the second adjusting portion is a threaded structure, and the first plate or the second plate preferably has a groove into which the threaded structure is inserted.

Preferably, the first adjusting portion or the second adjusting portion includes a circular protrusion which contacts the inner wall surface of the socket housing and engages the end of the body portion of the threaded structure so as to rotate without moving.

Preferably, the support part is movable by an elastic body, preferably, the first fixing part and the second fixing part move in a direction perpendicular to each other, and the semiconductor chip package is preferably a board on chip (BOC) type package. .

DETAILED DESCRIPTION In order to fully understand the present invention, the operational advantages of the present invention, and the objects achieved by the practice of the present invention, reference should be made to the accompanying drawings which illustrate preferred embodiments of the present invention and the contents described in the drawings.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. Like reference numerals in the drawings denote like elements.

3 is a plan view 300 of a socket for inspecting a semiconductor chip package according to the present invention.

The semiconductor chip package inspection socket 300 according to the present invention includes a socket housing 310 and a cover housing (not shown) coupled to the socket housing 310 so as to be openable and closeable. 3 is a plan view of the socket housing 300 without the cover housing.

Referring to FIG. 3, the socket housing 310 has a loading part 380 on which a semiconductor chip package (not shown) is to be placed, and a contact pin 390 electrically connected to the semiconductor chip package under the loading part 380. Is provided.

The socket housing 310 includes a first fixing part 320, a second fixing part 340, and a support part 360. The first fixing part 320 and the second fixing part 340 move in directions not parallel to each other to fix the semiconductor chip package to the center of the loading part 380. The first fixing part 320 and the second fixing part 340 may move in a direction perpendicular to each other to fix the semiconductor chip package. The first fixing part 320 fixes the position of the right end surface of the semiconductor chip package, and the second fixing part 340 fixes the position of the other surface connected to the right end surface. When the right end surface and the other surface connected to the right end surface are fixed by the first fixing part 320 and the second fixing part 340, the support part 360 fixes the other end faces so that the semiconductor chip package does not move. Do not The support 360 is coupled to the inner wall surface of the socket housing 310 by an elastic body 365 such as a spring. The elastic body 365 may freely move the support 360 and fix the semiconductor chip package.

The first fixing part 320 and the second fixing part 340 are not necessarily positioned as shown in FIG. 3, and may be in any position as long as the connecting surface of the semiconductor chip package can be fixed.

The first fixing part 320 and the second fixing part 340 will be described in detail with reference to FIG. 4 below.

4 is a perspective view of the first fixing part 320 of the socket for inspecting the semiconductor chip package of FIG. 3.

Referring to FIG. 4, the first fixing part 320 is coupled to the first plate 322 and the first plate 322 in contact with the right end surface of the semiconductor chip package to adjust the first plate 322 to move. First adjustment parts 326, 328, and 329 are provided. The first adjustment is a threaded structure 326, 328, and the first plate 322 has a groove 324 inserted into the threaded structure. That is, the body portion 326 of the first adjusting part which is fixed by the socket housing 310 through the wall of the socket housing 310 and the groove 324 inserted into the screw structure of the first plate 322 are provided. Stitches with female and male threads. For example, when the knob portion 328 of the first adjustment part is rotated in the clockwise direction, the female screw and the male screw are bitten together so that the first plate 322 moves in the inner direction of the socket housing 310. 1 When the knob 328 of the adjusting part is rotated counterclockwise, the first plate 322 is moved outwardly of the socket housing 310.

The rotating part 328 of the first adjusting part is in contact with the outer wall surface of the socket housing 310, the circular protrusion 329 of the first adjusting part is in contact with the inner wall surface of the socket housing 310 and the body of the first adjusting part It is coupled to the end of the portion (329). That is, the trunk portion 329 of the first adjustment portion is fixed through the wall surface of the socket housing 310, the trunk portion 329 does not protrude out of the wall surface of the socket housing 310. The rotating part 328 of the first adjusting part contacts the outer wall surface of the socket housing 310 and the circular protrusion 329 is attached to the inner wall surface of the socket housing 310, thereby rotating the rotating part 328 of the first adjusting part. Even if the first adjustment portion is rotated without moving in the inner direction of the socket housing 310 or the outer direction of the socket housing 310. Therefore, since the first adjustment part is rotated without moving, the first plate 322, which is bitten by the first adjustment part, the female thread and the male thread, is in the inner direction of the socket housing 310 or the outside of the socket housing 310. Will be moved in the direction.

Since the second fixing part 340 also has the same structure as the first fixing part 320 and operates in the same manner, a detailed description thereof will be omitted. However, the second fixing part 340 should move not in parallel with the first fixing part 320. Since the first plate 322 and the second plate 342 only need to fix one surface of the semiconductor chip package and the other surface connected to the one surface, the first fixing part 320 and the second fixing part 340. Should not move in parallel. Preferably, the moving direction of the second fixing part 340 is orthogonal to the moving direction of the first fixing part 320.

The size of the semiconductor chip package may be displayed on the rotating part 328 of the first adjusting part and the rotating part 348 of the second adjusting part to adjust the position of the first plate 322 and the second plate 342 more easily. For example, the positions of 9 mm, 10 mm, and 11 mm mm are displayed on the rotating part 328 of the first adjusting part and the rotating part 348 of the second adjusting part. When the rotating part is turned, it is assumed that the center of the semiconductor chip package of the corresponding size is located at the center of the loading part 380. When the size of the semiconductor chip package to be inspected is 9 ㅧ 11 (unit is mm), the rotating part 328 of the first adjusting part 320 is rotated to 9 mm to fix the rotating part 348 of the second adjusting part 340. When rotated up to 11mm, the center of the 9 ㅧ 11 semiconductor chip package and the center of the loading part 380 coincide with each other. Therefore, the position of the first plate 322 and the second plate 342 according to the size of the semiconductor chip package can be easily fixed.

5 is a longitudinal cross-sectional view illustrating a case in which the socket for inspecting a semiconductor chip package of the present invention inspects the semiconductor chip package 520.

The semiconductor chip package 520 is placed on the loading unit 380. The center of the loading unit 380 and the center 520 of the semiconductor chip package are placed to coincide with each other. That is, the first plate 322 and the second plate 342 are fixed at a predetermined position according to the size of the semiconductor chip package 520 to be inspected. In addition, one surface of the semiconductor chip package 520 to be inspected and the other surface connected to the one surface are placed in contact with the first plate 322 and the second plate 342, and the semiconductor chip package using the support part 360. 520 is fixed so as not to move. Since the support part 360 is coupled to the elastic body 365, the support part 360 is free to move and fixes other surfaces not contacted with the first plate 322 and the second plate 342.

When the semiconductor chip package 520 is fixed so that the center of the semiconductor chip package 520 to be inspected coincides with the center of the loading unit 380, the cover housing 510 is coupled to the socket housing 310 so as to be openable and closeable. Press the semiconductor chip package 520 using. That is, when the semiconductor chip package 520 is mounted on a contact pin (not shown) inside the socket housing 310, the cover housing 510 is mounted on the contact pin inside the socket housing 310. By pressing the package 520, the semiconductor chip package 520 may be in contact with the contact pin at the center of the loading unit 380 so that the semiconductor chip package 520 may be easily mounted.

As described above, optimal embodiments have been disclosed in the drawings and the specification. Although specific terms have been used herein, they are used only for the purpose of describing the present invention and are not intended to limit the scope of the present invention as defined in the claims or the claims. Therefore, those skilled in the art will understand that various modifications and equivalent other embodiments are possible therefrom. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

As described above, the socket for inspecting a semiconductor chip package according to the present invention can inspect a semiconductor chip package of various sizes without replacing the socket, thereby reducing the cost of manufacturing a new socket, and a product of a new semiconductor chip package. This has the advantage of speeding up the analysis. In addition, it is possible to reduce the failure of the test board due to frequent replacement of the socket, and also to reduce the loss of the socket due to neglect of management.

Claims (9)

A socket housing having a loading portion on which the semiconductor chip package is to be placed and having contact pins electrically connected to the semiconductor chip package under the loading portion; And A cover housing coupled to the socket housing to be openable and closeable; The socket housing, A first fixing part configured to fix one surface of the semiconductor chip package by moving in one direction to fix the center of the semiconductor chip package to the center of the loading part; A second fixing part which moves in a direction not parallel to the one direction to fix the other surface connected to the one surface; And Socket for semiconductor chip package inspection, characterized in that it comprises a support for fixing the remaining surface other than the fixed surface. The method of claim 1, wherein the first fixing portion, A first plate in contact with one surface of the semiconductor chip package; And And a first adjusting part coupled to the first plate to adjust the first plate to move. The method of claim 2, wherein the second fixing portion, A second plate in contact with the other surface connected to one surface of the semiconductor chip package in contact with the first plate; And And a second adjuster coupled to the second plate to adjust the second plate to move. The method according to claim 2 or 3, wherein the first adjusting unit or the second adjusting unit, Socket for semiconductor chip package inspection, characterized in that the screw structure The method of claim 4, wherein the first plate or the second plate, Socket for semiconductor chip package inspection, characterized in that it has a groove into which the screw structure is inserted. The method of claim 4, wherein the first adjusting unit or the second adjusting unit, And a circular protrusion contacting the inner wall surface of the socket housing and engaging with the end of the body portion of the threaded structure so as to rotate without moving. The method of claim 1, wherein the support portion, Socket for semiconductor chip package, characterized in that the movable by the elastic body. The method of claim 1, wherein the first fixing portion and the second fixing portion, A socket for inspecting a semiconductor chip package, which moves in directions perpendicular to each other. The method of claim 1, wherein the semiconductor chip package, Socket for chip package inspection, characterized in that the BOC (Board On Chip) type package.

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