KR20170142610A - Insert assembly of receiving semiconductor device and test tray having the same - Google Patents

Abstract

The present invention relates to an insert assembly mounted on a test tray to store a semiconductor device in a semiconductor device test apparatus. According to the present invention, the insert assembly may comprise: an insert main frame which has a pocket to store the semiconductor device with a floor surface open; and a support member inserted into the pocket to close the opening of the floor surface of the pocket and to support the semiconductor device. Specifically, the support member may comprise: a socket plate placed under the semiconductor device stored in the pocket and placed on an opening to protrude towards the bottom side of the insert main frame and to electrically connect the semiconductor device to a test module; and a guide member combined with the socket plate to guide the position of the socket plate. In the present invention, the semiconductor device test apparatus does not need to have a conventional film-type support member to prevent the support member from being stuck, which otherwise, may occur in the case of the conventional support member.

Description

[0001] The present invention relates to an insert assembly for receiving a semiconductor device and a test tray having the insert assembly.

Embodiments of the present invention relate to an insert assembly and a test tray having the insert assembly. More particularly, the present invention relates to an insert assembly for accommodating a semiconductor device for performing an electrical inspection process on the semiconductor device and a semiconductor device test apparatus having the insert assembly.

In general, semiconductor devices may be formed on a silicon wafer used as a semiconductor substrate by repeatedly performing a series of manufacturing processes, and the semiconductor devices formed as described above may be formed into semiconductor packages through a dicing process, a bonding process, and a packaging process .

The semiconductor devices manufactured as described above can be judged as good or defective through electrical property inspection. A test handler for handling semiconductor devices and a tester for testing semiconductor devices may be used for the electrical characteristic inspection.

The inspection of the electrical characteristics can be performed by first inserting the semiconductor element into the insert assembly mounted on the test tray, electrically connecting the external connection terminals of the semiconductor element accommodated in the insert assembly to the tester, and then inspecting .

The insert assembly may have pockets in which the semiconductor devices are received and the tester may include test sockets with contact pins such as pogo pins or probe pins for contact with the terminals for external connection of the semiconductor device. The insert assembly may also include latches to prevent dislodgment of the semiconductor elements housed in the pockets.

As an example, Korean Patent Registration No. 10-1535245 discloses an insert assembly comprising an insert body having an opening into which a semiconductor device is inserted, and a film-like support member attached to a lower portion of the insert body, . In particular, the support member may have a plurality of guide holes into which connection terminals of semiconductor elements are inserted.

Such an insert assembly may have a problem that the connection terminals of the semiconductor element are caught in the guide holes of the support member. In particular, as the sizes and pitches of the connection terminals of semiconductor devices have become smaller, it is difficult to process the guide holes and it is difficult to insert the connection terminals of the semiconductor elements into the guide holes. Further, when the thickness of the support member is made thinner than the height of the connection terminals, an additional problem such as deformation of the support member in the process of attaching the support member to the insert body may occur.

Embodiments of the present invention provide an insert assembly capable of removing a test socket provided in a test module without using a supporting member in the form of a film, and a test tray having the insert assembly.

According to an aspect of the present invention, there is provided an insert assembly including: an insert body having a pocket for receiving a semiconductor device and having a bottom surface of the pocket opened; and an insert body inserted into the pocket, And a support member for closing the opening and supporting the semiconductor element. Here, the support member may include: a test module disposed below the semiconductor device housed in the pocket and provided in the opening, protruding to the lower side of the insert body and providing an inspection signal for inspecting the semiconductor device, A socket plate for electrically connecting the elements, and a guide member coupled to the socket plate and guiding the position of the socket plate.

According to embodiments of the present invention, the pocket is provided in the form of a funnel, and the guide member is disposed to face the side wall of the pocket and can be tilted equally to the side wall of the pocket and supported by the side wall of the pocket .

According to embodiments of the present invention, the socket plate has contact terminals that are in contact with connection terminals of the semiconductor device to electrically connect the semiconductor device with the test module, Can be exposed.

According to embodiments of the present invention, the socket plate and the semiconductor device may further include alignment pins for aligning the semiconductor device with the socket plate, and alignment holes into which the alignment pins are inserted. One of the socket plate and the semiconductor element may include the alignment holes and the other may include the alignment pins.

According to another aspect of the present invention, there is provided a test tray comprising: an insert body having a pocket for accommodating the semiconductor device and having a bottom portion of the pocket; an insert body inserted into the pocket, An insert assembly having a support member for closing and supporting the semiconductor element and a tray body having a recess on which the insert assembly is mounted and a bottom of the recess for exposing the insert assembly, . Here, the support member may include a test module disposed under the semiconductor device housed in the pocket and provided at an opening of the pocket to protrude downward from the insert body and to provide an inspection signal for inspecting the semiconductor device, And a guide member coupled to the socket plate and guiding the position of the socket plate. The socket plate may include a socket plate for contacting the test module and the semiconductor element, and a guide member for guiding the position of the socket plate. The insert assembly may be disposed in the opening of the tray body so that the socket plate protrudes to the lower side of the tray body.

According to the embodiments of the present invention as described above, the insert assembly mounted in the test tray for accommodating the semiconductor elements is equipped with a support member for supporting the semiconductor elements in the pockets for accommodating the semiconductor elements. The support member supports the semiconductor element and transmits an inspection signal from the test module to the semiconductor element. Accordingly, since the semiconductor device testing apparatus does not need to have a conventional film-like supporting member, it is possible to eliminate a defect in the fitting of the connecting terminals of the semiconductor element, which may be caused by the conventional supporting member. Further, the insert assembly can flexibly cope with the reduction in size and pitch of the semiconductor element, and the assemblability can be improved.

In addition, since the test module and the semiconductor device are electrically connected by the socket plate of the support member, a test socket provided on the interface board for electrical connection between the semiconductor device and the test module is unnecessary. Accordingly, the interface board can be manufactured easily, and the manufacturing cost of the interface board can be reduced. Further, since the alignment between the connection terminals and the contact terminals of the semiconductor element is easy, it is possible to stably provide the inspection signal to the semiconductor element.

1 is a schematic block diagram illustrating an insert assembly and a test tray having the insert assembly according to an embodiment of the present invention.
FIG. 2 is a schematic diagram for explaining a process of inspecting the semiconductor device shown in FIG. 1. FIG.
3 is a schematic enlarged cross-sectional view for explaining a connection relationship between the semiconductor device shown in FIG. 2, the socket plate, and the tester module.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention should not be construed as limited to the embodiments described below, but may be embodied in various other forms. The following examples are provided so that those skilled in the art can fully understand the scope of the present invention, rather than being provided so as to enable the present invention to be fully completed.

In the embodiments of the present invention, when one element is described as being placed on or connected to another element, the element may be disposed or connected directly to the other element, . Alternatively, if one element is described as being placed directly on another element or connected, there can be no other element between them. The terms first, second, third, etc. may be used to describe various items such as various elements, compositions, regions, layers and / or portions, but the items are not limited by these terms .

The terminology used in the embodiments of the present invention is used for the purpose of describing specific embodiments only, and is not intended to be limiting of the present invention. Furthermore, all terms including technical and scientific terms have the same meaning as will be understood by those skilled in the art having ordinary skill in the art, unless otherwise specified. These terms, such as those defined in conventional dictionaries, shall be construed to have meanings consistent with their meanings in the context of the related art and the description of the present invention, and are to be interpreted as being ideally or externally grossly intuitive It will not be interpreted.

Embodiments of the present invention are described with reference to schematic illustrations of ideal embodiments of the present invention. Thus, changes from the shapes of the illustrations, e.g., changes in manufacturing methods and / or tolerances, are those that can be reasonably expected. Accordingly, the embodiments of the present invention should not be construed as being limited to the specific shapes of the regions described in the drawings, but include deviations in the shapes, and the elements described in the drawings are entirely schematic and their shapes Is not intended to describe the exact shape of the elements and is not intended to limit the scope of the invention.

FIG. 1 is a schematic diagram for explaining an insert assembly and a test tray having the insert assembly according to an embodiment of the present invention. FIG. 2 is a schematic diagram for explaining an inspection process of the semiconductor device shown in FIG. 1 to be.

1 and 2, a test tray 100 according to an exemplary embodiment of the present invention includes a semiconductor device 10 for testing electrical characteristics of a semiconductor device 10, Lt; / RTI > Here, the semiconductor device testing apparatus 500 may provide an inspection signal to the semiconductor device 10 and analyze the output signal corresponding to the inspection signal from the semiconductor device 10, Check the performance.

The test tray 100 may be used to house the semiconductor device 10 and to electrically connect the semiconductor device 10 with a test module.

Specifically, the test tray 100 may include an insert assembly 200 for receiving the semiconductor device 10 and a tray body 110 for receiving the insert assembly 200.

The insert assembly 200 may include an insert body 210 having a pocket 212 for receiving the semiconductor device 10 and a support member 220 for supporting the semiconductor device 10 . The tray body 110 has a recess 112 in which the insert assembly 200 is mounted and the bottom of the recess 112 is open to expose the insert assembly 200.

The pockets 212 of the insert body 210 are open at the bottom and the semiconductor device 10 and the support member 220 can be received in the pockets 212. Although not shown in detail in the drawings, the insert body 210 may include a latch (not shown) for fixing the semiconductor device 10. The latch can press the top edge portion of the semiconductor element 10 housed in the pocket 112 to fix the position of the semiconductor element 10.

The support member 220 may be mounted in the pocket 212 to close the opening 214 of the pocket 212 and the semiconductor element 10 may be disposed in the support member 220. The support member 220 includes a socket plate 222 for electrically connecting the test module and the semiconductor device 10 and a guide member 224 for guiding the position of the socket plate 222 .

2, the socket plate 222 is provided in the opening 214 of the pocket 212 and protrudes to the lower side of the insert body 210, and is disposed under the semiconductor element 10 So as to support the semiconductor element 10. The insert assembly 200 is disposed in the opening 114 of the tray main body 110 so that the socket plate 222 protrudes to the lower side of the tray main body 110.

The socket plate 222 can be guided in position by the guide member 224. The guide member 224 may be coupled to an edge portion of the socket plate 222 and may be disposed opposite the side portion 216 of the pocket 212 as shown in Figure 2, (Not shown).

In an embodiment of the present invention, the pockets 212 may be provided in the form of a funnel. The guide member 224 may be tilted in the same manner as the side 216 of the pocket 212 and be supported by the side 216 of the pocket 212. Accordingly, the position of the support member 220 in the pocket 212 can be fixed.

The socket plate 222 may include contact terminals 226 for electrically connecting the semiconductor device 10 with the test module and the contact terminals 226 may be formed on the semiconductor device 10 And can be disposed corresponding to the connection terminals 12. The socket plate 222 protrudes to the lower side of the tray main body 110 through the opening 114 of the tray main body 110 so that the contact terminals 226 contact the test tray 100, As shown in FIG.

The interface board 300 of the test module may be disposed below the test tray 100. The interface board 300 may have connection terminals 302 for connection with the semiconductor device 10 to transmit an inspection signal to the semiconductor device 10.

3 is a schematic enlarged cross-sectional view for explaining a connection relationship between the semiconductor device shown in FIG. 2, the socket plate, and the tester module.

1 to 3, after the semiconductor element 10 is disposed in the support member 220 of the insert assembly 200, the test tray 100 is disposed on the interface board 300 . At this time, the contact terminals 226 of the socket plate 222 may be disposed corresponding to the connection terminals 302 of the interface board 300 as shown in FIG.

As shown in FIG. 2, a match plate 400 having a pusher 410 for pressing the semiconductor device 10 may be disposed on the test tray 100.

The pusher 410 presses the semiconductor device 10 toward the interface board 300 when the test tray 100 is disposed on the interface board 300. 3, the contact terminals 226 of the socket plate 222 are electrically connected to the connection terminals 12 of the semiconductor device 10 and the connection terminals (not shown) of the interface board 300 The connection terminals 12 of the semiconductor device 10 and the connection terminals 302 of the interface board 300 are contacted with each other. As a result, the connection terminals 12 of the semiconductor device 10 and the connection terminals 302 of the interface board 300 can be electrically connected to each other via the contact terminals 226.

3, the socket plate 222 further includes alignment holes 228 for aligning the contact terminals 226 and the connection terminals 12 of the semiconductor device 10 And the semiconductor device 10 may include the alignment pins 14 corresponding to the alignment holes 228. In addition, The alignment pins 14 are inserted into the alignment holes 228 so that the contact terminals 226 and the connection terminals 12 of the semiconductor device 10 can be aligned.

The alignment holes 228 are formed in the socket plate 222 and the alignment pins 14 are provided in the semiconductor device 10 but the alignment holes 228 May be formed in the semiconductor device 10 and the alignment pins 14 may be provided in the socket plate 222. [

The interface board 300 may include an alignment member 310 for alignment with the test tray 100. The match plate 400 and the alignment member 310 may be provided with alignment guides Pins may be provided. Although not shown in detail in the drawing, the insert assembly 200 and / or the tray body 110 may be provided with guide holes corresponding to the guide pins.

According to the embodiment of the present invention as described above, the insert assembly 200 includes the support member 220 (not shown) for supporting the semiconductor device 10 in the pocket 112 for accommodating the semiconductor device 10, Is mounted. Particularly, the socket plate 222 of the support member 220 supports the semiconductor device 10 and transmits the inspection signal to the semiconductor device 10. Accordingly, since the semiconductor device testing apparatus 500 does not need to include a conventional film-like supporting member, the semiconductor device testing apparatus 500 can be manufactured by using a conventional method, It is possible to eliminate the pincushion. In addition, the insert assembly 200 can flexibly cope with the reduction in size and pitch of the semiconductor device 10, and the assemblability can be improved.

In addition, since the test module and the semiconductor device 10 are electrically connected to each other by the socket plate 222 of the support member 220, A separate test socket provided on the interface board is unnecessary. Accordingly, the interface board 300 can be manufactured easily, and the manufacturing cost of the interface board 300 can be reduced. Since the alignment between the connection terminals 12 of the semiconductor device 10 and the contact terminals 226 is easy, the inspection signal can be stably provided to the semiconductor device 10.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention as defined in the following claims. It will be understood.

10: Semiconductor device 14: Alignment pin
100: Test tray 110:
200: insert assembly 210: insert body
212: pocket 220: support member
222: socket plate 224: guide member
226: Contact terminal 228: Align hole
300: interface board 302: connection terminal
400: match plate 410: pusher
500: Semiconductor device test apparatus

Claims (7)

An insert body having a pocket for accommodating semiconductor elements, the insert body having a bottom surface opened; And
And a support member inserted into the pocket to close the opening of the bottom surface of the pocket and support the semiconductor element,
The support member includes:
The semiconductor device being electrically connected to a test module which is disposed under the semiconductor device housed in the pocket and protrudes downward from the insert main body and is provided in the opening and provides an inspection signal for inspecting the semiconductor device, Lt; / RTI > And
And a guide member coupled to the socket plate for guiding the position of the socket plate. The method according to claim 1,
The pocket is provided in the form of a funnel,
Wherein the guide member is disposed opposite the side wall of the pocket and is tilted equally to the side wall of the pocket to be supported by the side wall of the pocket. 3. The method of claim 2,
The socket plate having contact terminals contacting the connection terminals of the semiconductor device for electrically connecting the semiconductor device with the test module,
And the contact terminals are exposed through the opening. The method of claim 3,
Wherein the socket plate and the semiconductor device further include alignment pins for aligning the socket plate and the semiconductor device, and alignment holes into which the alignment pins are inserted,
Wherein one of the socket plate and the semiconductor element has the alignment holes and the other has the alignment pins. An insert body having a pocket for receiving the semiconductor element and having an opening in the bottom of the pocket, and a support member inserted into the pocket to close the opening of the bottom of the pocket and support the semiconductor element; And
A tray body having a recess on which the insert assembly is mounted, the tray body having a bottom of the recess open to expose the insert assembly,
The support member
A test module disposed below the semiconductor device housed in the pocket and provided in an opening of the pocket to protrude downwardly of the insert body and provide an inspection signal for inspecting the semiconductor device, A socket plate electrically connecting the module and the semiconductor element; And
And a guide member coupled to the socket plate and guiding the position of the socket plate,
Wherein the insert assembly is disposed at an opening of the tray body so that the socket plate protrudes to a lower side of the tray body. 6. The method of claim 5,
The pocket is provided in the form of a funnel,
Wherein the guide member is disposed opposite the side wall of the pocket and is tilted equally to the side wall of the pocket to be supported by the side wall of the pocket. The method according to claim 6,
Wherein the socket plate has contact terminals that are in contact with connection terminals of the semiconductor device and connection terminals of the test module to electrically connect the semiconductor device to the test module.

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