KR20070090436A - Three demensional surface illumination measuring apparatus for micro optical element array - Google Patents

Abstract

A three dimensional surface illumination measuring apparatus of a micro optical device array is provided to measure with high precision by eliminating the laser beam diffused by a measuring object. A three dimensional surface illumination measuring apparatus of a micro optical device array includes a laser(1), an optical detecting apparatus (3), and an A/D converter. The laser is installed to have determined angle to the side direction of a measuring object, and examines the board-band wavelength laser beam. The optical detecting device detects the direct reflecting beam which is directly reflected from the measuring object, the diffracting beam and the interfering beam which diffracts and interferes, and the diffusing beam which is diffused. The A/D converter converts the laser beam which is detected from the optical detecting device to the electrical signal.

Description

Three demensional surface illumination measuring apparatus for micro optical element array

1 is a view showing the structure of a three-dimensional surface roughness measuring apparatus of a micro-optical device array according to the present invention.

2A is a view showing results measured by atomic force microscopy of a micro-optical device array as a measurement example;

2B is a schematic diagram of the expected shape of the one-dimensional array to explain the measuring principle.

FIG. 2C is a schematic diagram illustrating a theoretical explanation for a phenomenon in which the intensity of a spot of a diffracted beam changes with a change in blaze angle. FIG.

FIG. 3 is a photograph of spots of diffracted interference beams observed in a reflected region when a laser beam having a wavelength of 633 nm is irradiated onto a substrate on which an array is processed to a microoptical device as shown in FIG. 2A.

4 is a flow chart of the operation of the optical propeller operating system according to the present invention.

5 is an exemplary view of the result of measuring the ratio of the beam intensity of the direct reflection and the first diffracted laser spot for various samples.

** Description of the symbols for the main parts of the drawings **

1: laser 2: laser beam focusing device

3: photodetector 4: CCD camera

5: stage 6: microcomputer

7: Sample handler 8: A / D converter

9: display

The present invention relates to a three-dimensional surface roughness measuring apparatus of a micro-optical element array, and more particularly to a surface roughness measuring apparatus for measuring the three-dimensional surface roughness of the micro-optical element array using a broadband laser.

In various related industries such as various displays, the uniformity and three-dimensional shape of a regularly processed micro-optics array on a substrate that needs to be rapidly increased is required.

In particular, micro-optics processed on the surface of the panel to increase the light emission efficiency emitted from LEDs and large display devices are known to depend on the uniformity and shape accuracy of the final product performance. The technology for high-speed full inspection is very important. That is, it is obvious that an inspection and measurement technique that can reduce the subsequent expensive process cost in the subsequent process by the degree of defects in the substrate and the degree of performance due to the uniformity is obvious.

It is a first step to develop a technology that overcomes the limitations and maintains the accuracy of measurement while being free from the fundamental problems that occur in the existing well-known contact measurement techniques, such as low measurement speed and additional mechanical damage. Development of new measurement concepts and related technologies that dramatically increase speed is essential.

Until now, there is no known technique for measuring a commercially available or published micro-optical device array at high speed on a large-area processed substrate while maintaining high precision. On the other hand, by using an electron microscope or the like to measure the nanostructures formed on the substrate very precisely, it is possible to apply a technique that can be three-dimensional analysis of the shape of the structure in this measurement. However, as is well known, most of the materials used as optical elements are made of insulators, and thus, the above electron microscope technology cannot be directly applied. To do this, the metallic material must be applied to the surface of the optical element in the form of a thin film to make it conductive. Therefore, not only the destructive disadvantages but also the measurement characteristics cannot perform the full inspection necessary for the quality control of the product. Only inspection through) is possible.

Surface Profilers, which are published and used as instruments for measuring the surface of other materials, are also applicable to measuring the shape of micro-optic arrays. They can be divided into contact and non-contact type. Among them, non-contact type is the atomic profile or optical profiler based on the optical interference phenomenon, and the stylus method is the most commonly used method as the contact type. .

Among the above techniques, the stylus method is to measure the three-dimensional shape of the surface by measuring the vertical movement of the stylus according to the curvature of the material surface through the LVDT (Linear Variable Differential Transformers) sensor. This measurement method has been reported to have a very good measurement accuracy of about 1 nm, but due to the limitations of the contact measurement technology, the speed cannot be sufficiently achieved. In addition, the microoptic array having a very small radius of curvature due to the size and strength of the tip may not only damage the tip but also directly damage the surface of the object to be measured. We believe that there are many limitations in applying directly.

Among the non-contact surface measurement techniques are atomic force microscopy. The technique is based on the principle of measuring the shape of the surface of an object by using the attraction between the probe and the atoms on the surface of the object as a very small nano-probe approaches the object. On the other hand, the measurement technique is very good enough to measure the position of each atom in principle in terms of precision, but there are many technical constraints to measure a large area at high speed.

In particular, the contact / contactless measurement method using a micro probe, which is well known as Atomic Force Microscopy (AFM) technology, has a very high measurement resolution in principle but has a low measurement speed. In order to expand this measuring technique to a large area, there is a technology-economical difficulty in overcoming an expensive scanning stage applicable to a large area with sufficient flatness. Therefore, it is known that the application of the atomic force microscopy technique is very difficult to measure and evaluate the micro-optics array fixed to the next-generation display panel, which should be expanded in high speed and large area in principle. In addition, the conventional technique for measuring very thin thicknesses such as interferometry is well suited for measuring uniform thin films in relatively large areas, but it is also suitable for micro-optics arrays that are very changeable within several micrometers. It is known that it is not applicable.

Another known non-contact surface shape measurement technique uses optical coherence to inject light onto the surface of a sample and read the difference in the phases of the reflected light in an interferometry manner. It is an optical profiler method to shape the surface in three dimensions. This technique is a technique for measuring a very thin film or a microstructure of a conventional thin film, which is very suitable for measuring a relatively uniform thin film in a relatively large area, but the micro-optical device array having a very large change within μm is also applicable. This is known to be very difficult. In particular, the size of the peak portion of the micro-optical device array processed on the surface of the advanced display device is almost impossible to apply it because the grain radius of less than the optical diffraction limit is 100nm or less.

On the other hand, the surface roughness measuring apparatus using a laser that is conventionally used mostly short wavelength laser. Accordingly, in order to measure the surface roughness of the optical element array, a laser having a wavelength corresponding to that of the optical element array should be used. Accordingly, in the case of an optical element array having a material capable of surface measurement by different wavelengths, the optical element array needs to be replaced with a laser having a corresponding wavelength. Therefore, the replacement and installation time is required, and a laser having a different wavelength needs to be purchased. There was a lot of trouble.

In order to solve the above problems, an object of the present invention is to solve the problems of the precision measurement technology, which is intended to be applied to conventional micro-optical devices, that is, to overcome the problems that occur in the destructive or very low measurement speed of the measurement object It utilizes known optical diffraction and interference phenomena, and maintains the spatial measurement accuracy of the optical diffraction limit, while rapidly increasing the three-dimensional shape of each micro-optical device in large area to high speed as well as the three-dimensional shape in the market. It is to provide a three-dimensional surface roughness measuring device of the micro-optical device array to enable the measurement.

In addition, another object of the present invention is to provide a three-dimensional surface roughness measuring apparatus of the micro-optical device array capable of measuring the surface roughness of the micro-optical device array of a variety of materials by a laser of a wide-band wavelength.

In addition, another object of the present invention is to provide a three-dimensional surface roughness measuring apparatus of a micro-optical device array that can be measured with high precision by removing the laser beam scattered by the measurement object.

In addition, another object of the present invention is to provide a three-dimensional surface roughness measuring apparatus of the micro-optical device array to enable the three-dimensional surface roughness measurement in real time.

The three-dimensional surface roughness measuring apparatus of the micro-optical device array according to the present invention for achieving the above object, the laser is provided to make a predetermined angle in the lateral direction of the measurement object to irradiate a laser beam of a broadband wavelength; A photodetector for detecting the irradiated laser beam, a direct reflection beam directly reflected from the measurement object, diffraction and interference diffraction and interference beams, and scattered scattering beams, respectively; An A / D converter for converting the laser beam detected from the photodetector into an electrical signal; A microcomputer that calculates three-dimensional surface roughness by a programmed program using the electrical signal converted by the A / D converter; Characterized in that comprises a.

The present invention may further include a display configured to output a 3D surface roughness value calculated by the microcomputer on a screen.

In addition, the present invention is characterized by applying a value calculated by the following equation to the surface roughness calculation by the microcomputer so that the scattered laser beam is excluded.

R = (B-C) / (A-C)

(A: the intensity of the directly reflected laser beam,

B: first order diffracted laser beam intensity,

C: the intensity of the scattered laser beam by the scattering source of the measurement object)

In addition, the measurement object of the present invention is characterized in that the three-dimensional surface roughness is measured while being transported by the stage.

In addition, the present invention is characterized in that the CCD camera for monitoring in real time the surface of the measurement object is installed on top of the measurement object.

Measuring method using the three-dimensional surface roughness measuring apparatus of the micro-optical device array according to the present invention having the configuration as described above a) irradiating a laser beam of a broadband wavelength to the measurement object by a laser installed to achieve a predetermined angle with the measurement object Doing; b) detecting, by a photodetector, the irradiated laser beam, the direct reflection beam directly reflected from the measurement object, the diffraction and interference diffraction and interference beams, and the scattering scattering beam, respectively; c) converting the laser beams detected from the photodetectors into electrical signals by an A / D converter; d) calculating a three-dimensional surface roughness by a microcomputer programmed using the electrical signal converted by the A / D converter; Characterized in that comprises a.

In addition, the present invention is characterized in that it further comprises e) outputting the three-dimensional surface roughness value calculated in the three-dimensional surface roughness calculation step on the screen.

In addition, the present invention is characterized by calibrating the calculation step by the microcomputer using a standard material.

In addition, the present invention is characterized in that the measurement object is conveyed by the stage and at the same time the three-dimensional surface roughness is measured.

In addition, the present invention is installed on top of the measurement object is characterized in that the measured surface of the measurement object is monitored in real time by a CCD camera.

In the present invention, the diffracted laser beam spot generated by the first-order diffraction and the higher-order diffraction based on the zeroth order (direct reflection) of the incident laser beam during the above diffraction phenomenon. By detecting the intensity of, the uniformity of the shape of micro-optics can be measured and evaluated in large area at high speed. The apparatus of the present invention is a laser beam direct optical system that determines its spatial resolution by limiting a laser system measurement range as a light source, and an optical photodetector capable of measuring the light intensity of a spot of a diffracted beam and an automatic sample. ), A stage capable of precisely positioning the measurement object, and a programmed microcomputer that calculates data from operations and measurement values of the photodetector.

Accordingly, the present invention extends the X-ray principle, which has been applied for a very long time in the field of ultra-precise measurement of atomic magnification, to electromagnetic waves in the visible region and diffracted lasers in a regularly arranged micro-optics array. By recognizing and inverting the diffracted laser beam pattern detected by measuring the points of the beam, the micro-optics can measure the shape of each micro-optics at high speed as well as the uniformity in the processed large area pannel. It was. The technique of the present invention, which allows the intensity of light diffracted directly from the substrate, to overcome the phenomenon of efficiency deterioration, which is generated inside a light emitting device such as an LED and constrained in the medium in a wave-guide form, and then disappears. The application of micro-optics on a substrate designed to improve luminous efficiency is more important because it has direct information on the amount of externally emitted light.

Hereinafter, a three-dimensional surface roughness measuring apparatus of a micro-optical device array according to the present invention having the configuration as described above will be described in detail with reference to the accompanying drawings.

1 is a view showing the structure of the three-dimensional surface roughness measuring apparatus of the micro-optical device array according to the present invention, Figure 2a is a view showing the results measured by atomic force microscopy of the micro-optical device array as a measurement example, Figure 2b Figure 2 is a schematic diagram of the expected shape of the one-dimensional array in order to explain the measurement principle, Figure 2c is a schematic diagram showing a theoretical explanation for the phenomenon that the intensity of the spot (spot) of the diffracted beam changes with the change of the blaze angle, 3 is a photograph of a spot of a diffracted interfering beam observed in a reflected area when a laser beam having a wavelength of 633 nm is irradiated onto a substrate on which an array is processed to a micro-optical device as shown in FIG. 2A. 5 is a flowchart illustrating the operation of an optical propeller operating system according to the present invention, and FIG. 5 is a ratio of beam intensities of direct reflection and first-order diffracted laser spots to various samples. An exemplary view of a measurement result.

As shown, the three-dimensional surface roughness measuring apparatus of the micro-optical device array according to the present invention includes a laser (1) for irradiating a laser beam of a broadband wavelength to the measurement object; A photodetector (3) for detecting a direct reflection beam, a diffraction and an interference beam, and a scattering beam, respectively, from the measurement object; An A / D converter 8 for converting the detected laser beam into an electrical signal; A microcomputer 6 for calculating three-dimensional surface roughness by a programmed program using the converted electric signal; It consists of.

The laser 1 is installed to form a predetermined angle in the lateral direction of the measurement object to emit a laser beam and the laser beam is focused by the laser beam focusing apparatus 2 to be irradiated. At this time, the laser (1) to irradiate a laser beam of a broadband wavelength.

As such, when the laser 1 is irradiated with a laser beam having a broadband wavelength, surface roughness of the micro-optical device arrays of various materials can be measured. That is, the surface roughness of the micro-optical device arrays of various materials in which diffraction and interference are generated by various wavelengths as well as the micro-optical device array of specific materials in which diffraction and interference are caused by short wavelengths can be measured.

Preferably, the upper portion of the measurement object is further provided with a CCD camera 4 for monitoring in real time the surface to be measured of the measurement object.

The principle of diffraction-interference used in the present invention is described as follows.

Laser beams of various wavelengths are focused on the surface of the object to be measured and reflected by the diffraction-interference phenomenon by the micro-optical device array of the type as shown in FIG. 2A present on the surface of the sample, for example, as shown in FIG. 3. Patterns of laser beam spots are made in various forms. At this time, the spatial position of each spot is determined by the pattern of regular microscopic optical elements present on the surface of the object placed at the measurement position. Therefore, by inverting and analyzing the image, it is possible to obtain physical information about the position of each device. On the other hand, the intensity at each spot for such diffracted light is determined by the degree of diffraction by the angle γ of FIG. 2C, in which the laser light is tilted perpendicularly to the surface of the object constituting each optical element. do. This angle is commonly referred to as the blazed angle in gratings for spectroscopic applications. On the other hand, a more quantitative expression is as follows.

a sin (-2γ) = mλ --- [Equation 1]

In this case, a is a constant determined by the refractive index determined by the characteristics of the substrate, γ is a blazed angle described above, and m denotes the order of the spot of the beam to be diffracted. Λ is the wavelength of light of the incident laser.

Based on this equation, since the same type of array processed on the same substrate, that is, the substrate having the same optical characteristics, is a diffraction phenomenon by the laser having the same wavelength irradiating the laser onto the micro-optical device, the intensity of the diffracted spot and the intensity reflected directly The measured and calculated ratio has a direct correlation with the angle γ tilted from the substrate. On the other hand, based on this theoretical discussion is shown in Figure 2b an example applied to the micro-optical device array processed in the substantially sapphire substrate shown in Figure 2a. Assuming that the measurement of the change in height according to the processing depth is made when the array is composed of equally spaced arrays (equal pitches) on one sheet, the change in height is inclined from the substrate. ] Is calculated.

γ = tan-1 (2h / a) --- [Equation 2]

Where a is the pitch of the array and h is the height of the array of interest. This discussion is shown in Figure 2 (b) the case where the typical values used in the process of the substrate commonly commercialized in the LED light emitting device such as LED. That is, when the micro-optical device array has a pitch of 4 m and a height of 0.7 1.0 and 1.3 m, respectively, the angles at which the side surfaces of the respective elements are inclined from the substrate are 19, 27, and 33 degrees, respectively. This discussion suggests a great deal about the accuracy of measurement in practical measurements. In other words, when the ratio of the diffracted light intensity is precisely measured, it has very high measurement accuracy from the measured value, and it is possible to measure and evaluate the optical characteristics of the micro-optical array having a variation of less than 100 nm. It is possible to drastically improve the process precision.

The photodetector 3 detects the direct reflection beam, the diffracted and interfered diffraction and interference beams, and the scattered scattering beam, respectively, to which the irradiated laser beam is directly reflected from the measurement object.

The A / D converter 8 serves to convert the laser beam detected from the photodetector 3 into an electrical signal.

The microcomputer 6 calculates three-dimensional surface roughness by a programmed program using the electric signal converted by the A / D converter 8.

At this time, the program calculated by the microcomputer 6 is preferably set to be calibrated using a standard material. In addition, the present invention preferably further comprises a display 9 for outputting a three-dimensional surface roughness value calculated by the microcomputer 6 to the screen.

In the present invention, by making the optical diffraction profiler shown in Figure 1 and directly measuring the optical characteristics of the array of micro-optical devices fabricated on the sapphire substrate as follows directly to the physical shape measurement results measured by atomic force microscopy A comparison study was conducted. First, the spot intensity (A) of the directly reflected laser beam, the intensity (B) of the first diffracted laser beam spot, and the scattered laser light intensity (C) generated by the micro scratches and scattering sources that are always generated on the process substrate, respectively Measure at high speed using three different photodetectors. The exact ratio of the light intensity of the first diffracted beam spot and the directly reflected beam spot among them is the following arithmetic expression to eliminate the effect of the amount of scattered light that is considered equally included in each light intensity. can do.

R = (B-C) / (A -C) --- [Equation 3]

In order to maximize the measurement accuracy and measurement speed of the examples exemplified in the present invention, a method of directly calculating analog serials without digitizing each of the measured quantities A, B, and C measured from the photodetector was adopted. After that, it was digitized and stored on a computer.

The above measurement process is understood not to be a phenomenon caused by a single microoptical device, but to be an average phenomenon based on the sum of them so that all diffraction phenomena are performed only on the area to which the laser on the microoptic device array is connected. Therefore, even if the size of the microelements is not much smaller than the optical diffraction limit, the diffraction phenomenon by the total of them occurs continuously, so even devices of the size of 100 nm can be measured. In addition, the irradiation area of the laser beam can also be reduced to the optical diffraction limit, so that spatial measurement accuracy can also be maintained at several hundred nm.

It is necessary to automatically change the position of the sample and load the sample in order to proceed at a high speed on a wide substrate as well as a method capable of measuring the very high precision and spatial resolution and the rate of change of the height of the micro array at one point. For this purpose, an ultra-precision stage 5 and a handler as shown in FIG. 1 were employed in conjunction with the present optical diffraction profiler system.

In order to store the position control of the sample and the measurement at each position and analyze it, a flow chart of the form as shown in FIG. 4 was completed and measured. Looking more closely at this, the measurement system is largely composed of an optical diffraction measurement system and a control board for controlling it. Optical detectors, optical devices for delivering and focusing lasers and beams, stages and drives for transporting samples to be measured, and sample handlers (7) for automatically converting samples, computing devices for computing signals, etc. The hardware for changing the sample position and type together with the hardware is composed of software that can calculate and display the calculated values calculated from the control and optical signals on a computer. By operating systematically and sequentially, they can achieve a high enough number and number of measuring points at high speed.

In order to obtain a practical application using the optical diffraction measuring instrument as described above, as shown in FIG. 5, a measurement experiment was performed on a 2 inch diameter substrate in which micro-optical devices were processed in an array form. The first column of FIG. 5 shows the results of atomic force microscopy measurements attempted on the surface near the center of six different samples. As a result of analyzing the height near the center obtained on the basis of these measurement results, the height of the microelements labeled at the center of the sample showed that the average was 1.49, 1.53, 1.34, 1.70, 2.06, and 2.12 µm, respectively. It can be seen that is distributed relatively equally. Using the optical diffraction profiler proposed in the present invention, the sample was used to measure the beam intensity of the direct reflection and the first diffracted laser spot, measured in two lines with a spacing of 10 mm of the surface area of the 2-inch diameter sample. The result of measuring the ratio is shown in the third column of FIG. At this time, the ratio value is expressed as LOG function for the purpose of clarifying the change in the figure. Each measurement point was measured at 5mm intervals and marked with filled circles and squares. The results clearly show a significant difference due to the change in height generated in the process for each part of the sample surface. This clearly shows the variation of the distribution for each site of the plasma etching process used in the stationary phase. Even in view of such a variation, it can be seen that the result measured in the present invention changes almost consistent with the variation of the height measured by nuclear microscope technology. That is, the diffraction optical profiler measurement for the 1.34 μm sample, that is, the third sample, which was able to identify the microscopic device of the lowest height, showed the smallest value, while the measurements for the fifth and sixth samples with the highest height were It shows large values on the surface of the whole substrate. That is, the optical diffraction profiler measurement technique proposed in the present invention, as described in the above-mentioned theoretical considerations, is a technique capable of measuring the change in height very precisely when the microscopic optical elements have almost the same shape and are in the same spatial position. Is showing.

On the other hand, the measurement technique is compared with other measurement methods, such as the contact method such as a stylus or the conventional optical phase change measurement using interference phenomena or based on the atomic force It can be seen that the measuring method and the measuring device can be designed very simply, so that the measuring speed can be very high while maintaining the high precision of the optical diffraction limit. This improvement in measurement speed can be achieved by expensive post-processing using substrates with poor quality and non-uniformity of quality that can be caused by measuring and inspecting only a few samples by selection of existing products. It is valuable as a new measurement technology that can solve problems such as rising costs. In addition, it is expected that the simplicity of the present technology can be directly applied to a fixed line for fabricating a micro-optical device array, thereby significantly improving the overall fixed speed and the fixed precision of the product. This advantage is possible because the present technology is a non-contact and non-destructive method unlike other contact or electron microscopy techniques.

In addition, the present technology can be applied to the case of managing the change and degree of optical properties of the processed surface along with the three-dimensional physical structure of the micro-optical device as follows. That is, as mentioned above, the optical diffraction-interference phenomenon occurring in the microoptic array includes not only the regularity of each microelement and the degree of deviation from the regularity, but also all information on the three-dimensional optical characteristics, in particular, the change of the refractive index. have.

This phenomenon coincides completely with the x-ray diffraction observed in the x-ray region according to the regularly arranged spatial distribution of atoms. Since the theoretical analysis method for diffraction in the x-ray region is already well established, on the basis of this analysis theory, two-dimensional image of the intensity of each higher-order diffraction beam diffracted by the laser beam is limited. In general, by inverting and inverting the measurement, the measurement can be performed under a precision that greatly increases the variation of the regularity, position, and optical properties of each microelement. This measurement technique means that not only the embossed microoptics but also the engraved optics and the refractive index inside the optical material can be applied to the microoptic array of all cases fabricated.

In conclusion, the present invention relates to a technique for overcoming a problem of precision measurement technology, which is intended to be applied to a conventional micro-optical device, that is, a problem caused by destructive or very low measurement speed of a measurement object. The fundamental problem that arises from the contact measurement technique, namely, low measurement speed and additional mechanical damage, is relatively free from measurement damage, and the development of technology that overcomes the limitations first develops a technology that increases the speed. It must be preceded. In order to overcome such technical difficulties, the present invention has developed a new measurement technique using the diffraction coherence properties of the micro-optical device array that has not been applied in the past. This technique is designed to maintain the simplicity of measurement while maintaining the measurement accuracy up to the optical diffraction limit, and to increase the speed of measurement dramatically. It is designed to have non-destructive characteristics by maintaining the non-contact measurement. The diffraction optical system profiler is designed so that the optical characteristics and spatial three-dimensional shape of various types of micro-optic device arrays having different optical characteristics by converting the embossed and the negative or the refractive index in the future can be measured before and after the high precision and high speed measurement. The application is possible even in the liver.

As described above, the three-dimensional surface roughness measuring apparatus of the micro-optical device array according to the present invention is a three-dimensional shape of each micro-optical device at a high speed in a large area while maintaining the spatial measurement accuracy of the optical diffraction limit degree It is possible to measure not only the dimensional shape but also the uniformity on the market at high speed, and it is possible to measure the surface roughness of the micro-optical device array of various materials by using the wide-wavelength laser to reduce the purchase and installation time of the separate laser. By eliminating the laser beam scattered by the object, it is possible to measure with high precision, and by controlling the process through measurement and analysis in real time, it is possible to improve the product quality and to control the quality of the substrate before expensive future product processing. There is a significant effect on the cost savings that are caused by.

Claims (11)

A laser installed to form a predetermined angle in a lateral direction of the measurement object to irradiate a laser beam having a broadband wavelength; A photodetector for detecting the irradiated laser beam, a direct reflection beam directly reflected from the measurement object, diffraction and interference diffraction and interference beams, and scattered scattering beams, respectively; 3D surface roughness measuring apparatus of the micro-optical device array, characterized in that comprises a. The method of claim 1, 3D surface roughness measuring apparatus of a micro-optical device array, characterized in that the value calculated by the following equation is applied to exclude the scattered laser beam to the surface roughness calculation by the microcomputer. R = (B-C) / (A-C) (A: the intensity of the directly reflected laser beam, B: first order diffracted laser beam intensity, C: the intensity of the scattered laser beam by the scattering source of the measurement object) The method of claim 2, 3D surface roughness measuring apparatus of the micro-optical device array, characterized in that the measuring object is conveyed by the stage and the three-dimensional surface roughness is measured. The method according to any one of claims 1 to 3, An A / D converter for converting the laser beam detected from the photodetector into an electrical signal; A microcomputer that calculates three-dimensional surface roughness by a programmed program using the electrical signal converted by the A / D converter; 3D surface roughness measuring apparatus of the micro-optical device array, characterized in that further comprises. The method of claim 4, wherein And a display for outputting a three-dimensional surface roughness value calculated by the microcomputer to a screen. The method of claim 4, wherein 3D surface roughness measuring apparatus of the micro-optical device array, characterized in that the CCD camera for installing in the upper part of the measurement object to monitor the measured surface of the measurement object in real time. a) irradiating a laser beam having a broadband wavelength to the measurement object by a laser installed to form a predetermined angle with the measurement object; b) detecting, by a photodetector, the irradiated laser beam, the direct reflection beam directly reflected from the measurement object, the diffraction and interference diffraction and interference beams, and the scattering scattering beam, respectively; c) converting the laser beams detected from the photodetectors into electrical signals by an A / D converter; d) calculating a three-dimensional surface roughness by a microcomputer programmed using the electrical signal converted by the A / D converter; Three-dimensional surface roughness measuring method of a micro-optical device array comprising a. The method of claim 7, wherein e) outputting a three-dimensional surface roughness value calculated in the three-dimensional surface roughness calculation step on a screen. The method according to claim 7 or 8, 3D surface roughness measuring method of the micro-optical device array, characterized in that the calibration step by the microcomputer using a standard material. The method of claim 9, The measurement object is a three-dimensional surface roughness measuring method of the micro-optical device array, characterized in that the three-dimensional surface roughness is measured at the same time as being transported by the stage. The method of claim 10, 3D surface roughness measuring method of the micro-optical device array, characterized in that installed on top of the measurement object to monitor the surface to be measured by the CCD camera in real time.

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