KR20060072815A - Plasma display apparatus - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plasma display device, and more particularly, to a plasma display device capable of suppressing heat generated when a plasma display device is driven and lowering a manufacturing cost.

According to the present invention, a plasma display device includes: a frame supporting a driving device of a plasma display panel; A film type element formed on the frame and connected to the driving device; And a main heat sink formed in a plate structure having a predetermined thickness on the film-like element.

Description

Plasma Display Apparatus {Plasma Display Apparatus}

1 is a structure schematically showing the structure of a conventional plasma display device.

2 is a diagram schematically illustrating a frame of a conventional plasma display device.

3 illustrates a plasma display apparatus with a conventional heat sink.

Figure 4 is a schematic view showing the structure of the heat dissipation device of the lower portion of the conventional frame.

5 is a view for explaining the structure of the lower end of the frame of the plasma display device according to an embodiment of the present invention.

6 is a graph showing a comparison of the temperature values according to the structure of the main heat sink of the conventional and the present invention of Table 1.

7 is a diagram for describing a main heat sink according to a modified embodiment of the present invention.

***** Explanation of symbols for main parts of drawing *****

500; Frame 510; Film type element

520; Upper adhesive 530; Bottom adhesive

540; Small heatsink 550; Main heatsink

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plasma display device, and more particularly, to a plasma display device capable of suppressing heat generated when a plasma display device is driven and lowering a manufacturing cost.

In general, a plasma display panel (Plasma Display Panel) is a partition wall formed between the front substrate and the rear substrate to form a unit cell, each of the neon (Ne), helium (He) or a mixture of neon and helium ( The main discharge gas such as Ne + He) and an inert gas containing a small amount of xenon are filled. When discharged by a high frequency voltage, the inert gas generates vacuum ultraviolet rays and emits phosphors formed between the partition walls to realize an image. Such a plasma display panel has a spotlight as a next generation display device because of its thin and light configuration.

1 is a structure schematically showing the structure of a conventional plasma display device. As shown in the drawing, the plasma display device excites the phosphors by a case 110 including a front cabinet 111 and a back cover 112 that determine an appearance, and vacuum ultraviolet rays caused by gas discharge inside the case. A plasma display panel 120 that implements an image, a driving device 130 including a PCB for driving and controlling the plasma display panel, and connected to the driving device to emit heat generated when the plasma display device is driven, And a frame 140 for supporting the plasma display panel.

In addition, while supporting the filter 150 and the filter 150 formed by attaching a film to a transparent glass substrate (not shown) with a predetermined distance to the front surface of the plasma display panel, and electrically connected to the metal back cover. Finger spring gasket (Finger Spring Gasket) 160 and Filter Supporter (Filter Supporter, 170) for connecting, and a module supporter (Module Supporter, 180) for supporting the PDP including the drive device.

In the fabrication process of the conventional plasma display device having such a structure, first, a plasma display panel that implements the image is manufactured, and then a frame and a driving device, etc., which are installed on the rear surface of the plasma display panel are assembled to form a module of the plasma display panel. To make. Subsequently, a case 110 for determining the appearance of the plasma display panel module is formed to manufacture a plasma display device as a finished product.

2 is a diagram schematically illustrating a frame of a conventional plasma display device. As shown in FIG. 2, the Y driving board 210, the Z sustainer board 220, the data driver board 230, the control board 240, and the power board (not shown) are disposed on the frame 200 of the plasma display device. Not formed.) Is formed.

The Y driving board 210 drives the scan electrode lines Y1 to Ym of the plasma display panel 250 including the front substrate 251 and the rear substrate 252.

The Y driving board 210 includes a scan driver board 211 and a Y sustainer board 212. The scan driver board 211 supplies a scan pulse and a reset pulse to the scan electrode lines Y1 to Ym of the plasma display panel 250 via a flexible printed circuit (FPC) 213. The Y sustainer board 212 supplies the Y sustain pulses to the scan electrode lines Y1 to Ym via the scan driver board 211 and the FPC 213.

The Z sustainer board 220 drives the sustain electrode lines Z1 to Zm.

The Z sustainer board 220 generates a bias pulse and a Z sustain pulse and supplies them to the sustain electrode lines Z1 to Zm of the plasma display panel 250 via the FPC 221.

The data driver board 230 drives the data electrode lines X1 to Xm.

The data driver board 230 generates data pulses and supplies the data pulses to the data electrode lines X1 to Xn of the plasma display panel 250 via the film type device 231. Here, the film element 231 is made of a Chip on Film (COF) or a Tape Carrier Package (TCP) having wiring for connection.

The control board 240 controls the Y driving board 210, the Z sustainer board 220, and the data driver board 230.

The control board 240 generates each of the X, Y, and Z timing control signals. The control board 240 transmits the Y timing control signal to the Y driving board 210 via the FPC 241, the Z timing control signal to the Z sustainer board 220 via the FPC 242, and the FPC. The X timing control signal is supplied to the data driver board 230 via 243.

The power board supplies power to each of the boards 210, 220, 230, and 240.

The Y driving board 210, the Z sustainer board 220, the data driver board 230, the control board 240, and the power board are fastened to the frame 200 using a plurality of bosses (not shown). .

3 illustrates a plasma display apparatus with a conventional heat sink. Each of the boards 210, 220, 230, and 240 shown in FIG. 2 includes elements that switch at high speeds, which generates a lot of heat. Thus, heat sinks 310, 320, 330, and 340 are attached to the respective boards to dissipate this heat to the outside.

As described above, the heat sinks 310, 320, 330, and 340 attached to the boards 210, 220, 230, and 240 each have a heat dissipation fin that protrudes to increase the contact surface with air. That is, heat generated by each of the boards 210, 220, 230, and 240 is transferred to the heat dissipation fins through the body of the heat sink attached to the boards, and heat is discharged to the outside through the heat dissipation fins of the large area.

In particular, a lot of heat is generated in the lower end of the frame in which the film-like element 231 including the integrated element IC that applies the signal output from the data board 240 to the data electrode line (not shown). The structure of the lower end of the frame on which the heat sink 331 for dissipating heat generated by the film type device 231 is described in more detail as shown in FIG. 4.

Figure 4 is a schematic view showing the structure of the heat dissipation device of the lower portion of the conventional frame. As shown in FIG. 4, the lower portion of the frame 400 is provided with a film element 410, an upper adhesive 420, a lower adhesive 430, a small heat sink 440, and a main heat sink 450. .

The frame 400 emits heat generated when the driving device of the plasma display panel is driven, and supports the plasma display panel 460 including the front substrate 461 and the back substrate 462.

The film type device 410 applies a signal output from the data board to the data electrode line. The film type device 410 generates a lot of heat in the integrated device (IC) when driving the driving device.

The upper pressure sensitive adhesive 420 or the lower pressure sensitive adhesive 430 is formed on the upper or lower portion of the film element 410, and conducts heat generated from the film element 410 to the upper or lower part.

The small heat sink 440 is formed on the film type element 410, and conducts heat generated from the film type element 410 to the main heat sink 450.

The main heat sink 450 transfers the heat conducted from the small heat sink 440 to the heat dissipation fin through the body of the heat sink, and discharges heat to the outside through the heat dissipation fin of the large area.

Here, the main heat sink 450 of FIG. 4 has a horizontal heat dissipation fin having a structure of a heat dissipation fin extending in the longitudinal direction of the main heat sink, and a heat dissipation fin extending in the width direction W of the main heat sink. It may be provided with a vertical heat radiation fin having a structure of.

On the other hand, the convection method of the conventional plasma display device uses the natural convection method. In natural convection, unlike forced convection by external flows such as fans and blowers, the flow is caused by the change of buoyancy due to the temperature difference of the fluid.

Therefore, in the convection direction of the plasma display device, the air treated by the heat generated in the film-like element moves in the direction A of the upper end of the frame, and the air whose temperature is lowered again moves in the direction of the lower end of the frame.

However, since the heat dissipation fin of the conventional main heat sink is formed at right angles to the flow of air, and the heat dissipation direction (B) of the heat dissipation fin is perpendicular to the flow of air, the heat dissipation fin does not play a role in using convection of heat. There is this.

Also, in the related art, the heat radiation fins of the main heat sink occupy a large part of the total thickness of the main heat sink. For this reason, there is a problem that the thickness of the body of the main heat sink is relatively thin and the heat capacity of the main heat sink is small.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to provide a plasma display device capable of improving the structure of the main heat sink to improve heat dissipation efficiency.

In addition, another object of the present invention is to provide a plasma display device which can reduce the manufacturing cost by improving the structure of the main heat sink.

In order to achieve the above object, the plasma display device of the present invention comprises a frame for supporting the driving device of the plasma display panel; A film type element formed on the frame and connected to the driving device; And a main heat sink formed in a plate structure having a predetermined thickness on the film-like element.

The predetermined thickness of the main heat sink of the present invention is characterized by being 2 mm or more and 15 mm or less.

The width of the main heat sink of the present invention is 20 mm or more and 40 mm or less.

The length of the main heat sink of the present invention is 800 mm or more and 1000 mm or less.

The main heat sink of the present invention is characterized in that it is blackened.

The film-like element of the present invention is characterized by at least one or more.

It further comprises a small heat sink formed on the film-like element of the present invention.

The film device of the present invention is characterized in that either COF or TCP.

The film-like device of the present invention is characterized in that the pressure-sensitive adhesive is formed on at least one portion of the top or bottom.

The pressure-sensitive adhesive of the present invention is characterized in that either silicone or thermally conductive double-sided tape.

According to a feature of the present invention, unlike the structure of the main heat sink having the conventional heat sink fins, the structure of the main heat sink of the present invention is formed in a plate structure having a predetermined thickness. As a result, heat is directly emitted from the plate structure, thereby improving heat dissipation efficiency. In addition, the manufacturing cost can be lowered by having a shape in which a conventional heat radiation fin is removed.

Hereinafter, with reference to the accompanying drawings, a specific embodiment according to the present invention will be described.

5 is a view for explaining the structure of the lower end of the frame of the plasma display device according to an embodiment of the present invention. As shown in FIG. 5, the lower portion of the frame 500 according to the exemplary embodiment of the present invention has a film element 510, an upper adhesive 520, a lower adhesive 530, a small heat sink 540, and a main heat. A sink 550 is provided.

The plasma display panel 560 includes a front substrate 561 in which a plurality of sustain electrode pairs formed by pairing a scan electrode and a sustain electrode is arranged, and a rear substrate 562 in which a plurality of address electrodes are arranged so as to cross the plurality of sustain electrode pairs. Is made by coalescence.

The heat dissipation sheet 570 is formed between the plasma display panel 560 and the frame 500 to attach the plasma display panel 560 and the frame 500 to dissipate heat generated when the plasma display device is driven. The heat dissipation sheet 570 may use a thermally conductive double-sided tape or silicon.

The frame 500 supports the plasma display panel 560 attached to the front surface by the heat dissipation sheet 570, and the driving device 590 is fastened to the rear surface by using the bosses 580. In addition, heat generated when driving the driving device 590 of the plasma display panel is released.

The film type element 510 is formed on the frame 500, one end of which is connected to the data board of the driving device 590 through the connector 511, and the other end of the electrode pad 512 having the data electrode exposed to the outside. Is connected to. As a result, the signal output from the data board is applied to the data electrode line. The film type device 510 generates a lot of heat in the integrated device IC when the driving device 590 is driven.

The film type device 510 according to an exemplary embodiment of the present invention is made of any one of a Chip on Film (COF) or a Tape Carrier Package (TCP) having wiring for connection.

In addition, in an embodiment of the present invention, at least one film type device 510 is included to apply a signal to the data electrode line.

The upper pressure sensitive adhesive 520 or the lower pressure sensitive adhesive 530 is formed on the upper or lower portion of the film type element 510 to surround the film type element 510. In this case, the upper adhesive 520 or the lower adhesive 530 conducts heat generated from the film type device 510 to the top or bottom, and protects the film type device 510 from external impact. The adhesives 520 and 530 are made of one of a thermally conductive double-sided tape or silicone.

The small heat sink 540 is formed on the film element 510 and conducts heat generated from the film element 510 to the main heat sink 550. Here, at least one small heat sink 540 is formed on each film-like element 510.

The main heat sink 550 is formed on the small heat sink 540 and discharges heat conducted from the small heat sink 540 to the outside.

The main heat sink 550 according to the embodiment of the present invention has a plate structure having a predetermined thickness. Preferably, the thickness of the main heat sink 550 is formed to be 2 mm or more and 15 mm or less. A more detailed description thereof will be described later.

Table 1 compares the result of measuring the temperature value according to the position of the film type element when driving the plasma display device according to the exemplary embodiment of the present invention.

6 is a graph showing a comparison of the temperature values according to the structure of the main heat sink of the conventional and the present invention of Table 1.

Data division values of Table 1 and values of the x-axis of Figure 6, 1 to 14 refers to the position of each film-like element formed in the lower end of the frame. That is, when seven film-like elements are formed from the left side to the right side at the lower end of the frame, four integrated elements IC are formed in each film-like element. In this case, the positions of odd-numbered integrated devices among the 28 integrated devices are shown.

The data value of Table 1 and the value of the y-axis of FIG. 6 are the values which measured the temperature of a film type element. The film type element generates a lot of heat when the plasma display device is driven. It is the value which measured the temperature at this time.

In addition, as shown in Table 1 and Figure 6, when provided with the conventional main heat sink and the main heat sink of the present invention, the temperature according to each main heat sink can be seen. Conventional cases can be roughly classified into a case in which a main heat sink is not used, a case in which a horizontal main heat sink is applied, and a case in which a vertical main heat sink is applied. When the plate structure of the present invention is applied, it can be roughly classified into the case where 2 mm, 5 mm and 10 mm are applied depending on the thickness of the main heat sink.

When using the main heat sink according to an embodiment of the present invention compared to the conventional main heat sink, it can be seen that the temperature of the film element is equal or lower, and the standard deviation is small. In addition, as the thickness of the main heat sink according to the embodiment of the present invention increases in thickness, the temperature of the film element is lowered. As described above, the main heat sink of the present invention has the shape of a plate structure, and as the thickness thereof increases, the heat capacity increases, thereby improving heat dissipation efficiency.

In one embodiment of the present invention by providing a main heat sink having a plate structure, the space is secured as much as the portion of the heat dissipation fin of the main heat sink having the conventional heat dissipation fins described above is smoothly convection occurs.

In addition, a space is secured and the thickness of the main heat sink of the plate structure can be increased. The thicker the thickness, the greater the heat capacity of the main heat sink.

In addition, since the heat dissipation fin is removed, the manufacturing cost can be reduced, and the manufacturing process can be simplified.

At this time, the thickness of the main heat sink according to an embodiment of the present invention is preferably formed to 2 mm or more and 15 mm or less.

In addition, the width of the main heat sink is formed to be 20 mm or more and 40 mm or less, and the length of the main heat sink is formed to be 800 mm or more and 1000 mm or less.

7 is a diagram for describing a main heat sink according to a modified embodiment of the present invention. As shown in FIG. 7, the modified embodiment of the present invention allows the main heat sink of the plate structure to be blackened.

The blackening process is for utilizing radiation of heat. If the surface of the object is black, the radiation absorption rate is 95%, so it is easy to receive heat by radiation. In addition, the object that absorbs radiation better, the stronger the effect of emitting radiation itself. Therefore, when the main heat sink 600 is blackened, the effect of emitting radiation is strong, and thus the heat dissipation efficiency is improved.

As such, the technical configuration of the present invention described above can be understood by those skilled in the art that the present invention can be implemented in other specific forms without changing the technical spirit or essential features of the present invention.

Therefore, the above-described embodiments are to be understood as illustrative and not restrictive in all respects, and the scope of the present invention is indicated by the appended claims rather than the detailed description, and the meaning and scope of the claims and All changes or modifications derived from the equivalent concept should be interpreted as being included in the scope of the present invention.

As described above, the present invention has the effect of improving the heat dissipation efficiency by improving the structure of the plasma display device.

In addition, the manufacturing cost can be reduced by improving the structure of the plasma display device, and the manufacturing process can be simplified.

Claims (10)

A frame supporting a driving device of the plasma display panel; A film type element formed on the frame and connected to the driving device; And And a main heat sink formed in a plate structure having a predetermined thickness on the film type element. The method of claim 1, And said predetermined thickness is 2 mm or more and 15 mm or less. The method of claim 1, And a width of the main heat sink is 20 mm or more and 40 mm or less. The method of claim 1, And a length of the main heat sink is 800 mm or more and 1000 mm or less. The method of claim 1, And the main heat sink is blackened. The method of claim 1, And at least one film-type element. The method of claim 6, And a small heat sink formed on the film type element. The method according to any one of claims 1 to 6, The film type device may be any one of a chip on film (COF) or a tape carrier package (TCP). The method of claim 1, And the adhesive is formed on at least one of an upper portion and a lower portion of the film type device. The method of claim 9, The pressure-sensitive adhesive is a plasma display device, characterized in that any one of silicon or a thermally conductive double-sided tape.

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