KR200449331Y1 - Chip LED Lighting Fixture with Heat Dissipation - Google Patents
Chip LED Lighting Fixture with Heat Dissipation Download PDFInfo
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- KR200449331Y1 KR200449331Y1 KR2020070005028U KR20070005028U KR200449331Y1 KR 200449331 Y1 KR200449331 Y1 KR 200449331Y1 KR 2020070005028 U KR2020070005028 U KR 2020070005028U KR 20070005028 U KR20070005028 U KR 20070005028U KR 200449331 Y1 KR200449331 Y1 KR 200449331Y1
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- chip led
- substrate
- aluminum case
- filled
- chip
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- 230000017525 heat dissipation Effects 0.000 title abstract description 10
- 239000000758 substrate Substances 0.000 claims abstract description 35
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 30
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 30
- 239000003822 epoxy resin Substances 0.000 claims abstract description 15
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 15
- 230000002093 peripheral effect Effects 0.000 claims abstract description 12
- 239000004593 Epoxy Substances 0.000 abstract description 11
- 239000000463 material Substances 0.000 abstract description 3
- 238000005476 soldering Methods 0.000 abstract description 3
- 230000015572 biosynthetic process Effects 0.000 abstract description 2
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000013021 overheating Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 150000002118 epoxides Chemical class 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000004078 waterproofing Methods 0.000 description 1
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- Illuminated Signs And Luminous Advertising (AREA)
Abstract
본 고안은 방열기능을 갖는 칩LED 조명기구에 관한 것으로서, 특히 기판의 상면에 발광용 칩LED와 주변부품을 장착하고, 그 칩LED와 주변부품의 단자를 기판의 상부면에서 납땜하여 고정하며, 알루미늄 재질의 판재를 프레싱 성형하여 중앙부에 기판이 수납될 수 있도록 오목홈이 형성된 알루미늄 케이스에 상기 기판을 내장하고, 상기 기판 상측으로 에폭시수지를 충진하되, 상기 에폭시수지가 칩LED의 상부면을 덮지 않도록 충진하여 구성하므로서, 칩LED가 장착된 기판에 알루미늄케이스의 바닥면에 완전히 밀착된 상태로 에폭시가 충진됨에 따라 전체적인 칩LED 조명기구의 형성높이를 낮춰줄 수 있음은 물론 칩LED의 작동시 발생되는 열이 알루미늄 케이스의 전체 면적을 통해 방열됨에 따라 칩LED의 수명을 연장시킬 수 있으면서 칩LED의 과열에 의한 조도감소현상을 줄여줄 수 있으며, 알루미늄 케이스에 충진된 에폭시에 의해 칩LED 조명기구의 완전방수기능을 부여할 수 있으므로 칩LED 조명기구를 옥외 광고용으로도 사용할 수 있도록 한 방열기능을 갖는 칩LED 조명기구에 관한 것이다.The present invention relates to a chip LED luminaire having a heat dissipation function, in particular, the light emitting chip LED and the peripheral parts are mounted on the upper surface of the substrate, and the terminals of the chip LED and the peripheral parts are fixed by soldering on the upper surface of the substrate, The substrate is embedded in an aluminum case in which a recess is formed so that the substrate can be stored in the center by pressing a sheet of aluminum material, and the epoxy resin is filled into the upper side of the substrate, and the epoxy resin does not cover the upper surface of the chip LED. Since the epoxy is filled in the state where the chip LED is mounted in close contact with the bottom of the aluminum case, the formation height of the overall chip LED luminaire can be lowered as well as the occurrence of chip LED operation. As heat is radiated through the entire area of the aluminum case, the life of the chip LED can be extended and Chip LED luminaires with heat dissipation function can be used to reduce the phenomenon of phenomena and to provide the perfect waterproof function of chip LED luminaires by epoxy filled in aluminum case. It is about.
기판, 칩LED, 알루미늄 케이스, 에폭시수지, 방열, 방수, Board, Chip LED, Aluminum Case, Epoxy Resin, Heat Resistant, Waterproof,
Description
도 1 은 본 고안의 방열기능을 갖는 칩LED 조명기구를 보인 단면도.1 is a cross-sectional view showing a chip LED lighting device having a heat dissipation function of the present invention.
도 2 는 본 고안의 칩LED 조명기구를 보인 사시도.Figure 2 is a perspective view showing a chip LED lighting fixture of the present invention.
도 3 은 본 고안의 칩LED 조명기구를 옥외용 문자채널간판에 적용한 실시예를 보인 도면.3 is a view showing an embodiment in which the chip LED lighting device of the present invention is applied to an outdoor character channel sign.
도 4 는 본 고안의 칩LED 조명기구의 실제 생산제품을 보인 사진.Figure 4 is a photograph showing the actual production of the chip LED lighting fixture of the present invention.
도면의 주요부분에 대한 부호의 설명Explanation of symbols for main parts of the drawings
1: 기판, 2: 칩LED,1: substrate, 2: chip LED,
3: 주변부품, 4: 납땜,3: peripheral parts, 4: soldering,
5: 전선, 6: 알루미늄 케이스,5: wire, 6: aluminum case,
7:에폭시수지,7: epoxy resin,
본 고안은 방열기능을 갖는 칩LED 조명기구에 관한 것으로서, 특히 칩LED가 장착된 기판에 알루미늄케이스의 바닥면에 완전히 밀착된 상태로 에폭시가 충진됨 에 따라 전체적인 칩LED 조명기구의 형성높이를 낮춰줄 수 있음은 물론 칩LED의 작동시 발생되는 열이 알루미늄 케이스의 전체 면적을 통해 방열됨에 따라 칩LED의 수명을 연장시킬 수 있으면서 칩LED의 과열에 의한 조도감소현상을 줄여줄 수 있으며, 알루미늄 케이스에 충진된 에폭시에 의해 칩LED 조명기구의 완전방수기능을 부여할 수 있으므로 칩LED 조명기구를 옥외 광고용으로도 사용할 수 있도록 한 방열기능을 갖는 칩LED 조명기구에 관한 것이다.The present invention relates to a chip LED luminaire having a heat dissipation function. In particular, as the epoxy is filled in a state where the chip LED is mounted on the bottom of the aluminum case, the height of the overall chip LED luminaire is reduced. As the heat generated during the operation of the chip LED is radiated through the entire area of the aluminum case, the life of the chip LED can be extended and the illuminance reduction caused by the overheating of the chip LED can be reduced. The present invention relates to a chip LED luminaire having a heat dissipation function that enables the chip LED luminaire to be used for outdoor advertising because it can impart a perfect waterproof function of the chip LED luminaire by an epoxy filled in.
현재 조명기구로서 전력소모가 적고, 밝기는 기존의 형광등이나 할로겐램프등에 비견될 정도로 밝아지고 있는 LED의 사용량이 점차 증가하고 있다. Currently, the use of LEDs, which consume less power as a luminaire and become brighter than conventional fluorescent lamps or halogen lamps, is increasing.
이중에서 칩LED(Chip LED)는 절전효과가 뛰어나고 크기가 작으면서도 높은 휘도를 출력할 수 있어서 그 사용량이 점차 증가하고 있다.Among these, chip LEDs are excellent in power saving effect and can be outputted with small size and high luminance, and their usage is gradually increasing.
하지만 칩LED는 열에 약한 단점이 있어서 장시간 점등되어야만 하는 옥외 광고판에는 사용되지 못하는 문제점이 있었고, 또한 칩LED를 이용한 조명기구는 방수기능을 구현할 수 없어서 옥외용 광고판에는 더더욱 사용하지 못하는 문제점이 발생하고 있었다.However, there is a problem that the chip LED has a weak disadvantage in heat, which can not be used in outdoor billboards that need to be turned on for a long time, and also lighting fixtures using chip LEDs can not be used in outdoor billboards because they can not implement a waterproof function.
그리고, 방수를 위하여 칩LED가 설치된 케이스에 칩LED가 잠기도록 에폭시를 충진하게 되면, 칩LED에서 발생된 빛이 에폭시층을 통과하면서 밝기가 감소하게 되어 조명기구로서 목적하는 밝기를 낼 수 없게되는 문제점이 발생하고 있었다.When the epoxy is filled in the case in which the chip LED is installed for waterproofing, the light generated from the chip LED passes through the epoxy layer and the brightness decreases, thereby preventing the target brightness from being produced as a luminaire. There was a problem.
따라서, 상기 문제점을 해결하기 위한 본 고안은 기판의 상면에 발광용 칩 LED와 주변부품을 장착하고, 그 칩LED와 주변부품의 단자를 기판의 상부면에서 납땜하여 고정하며, 알루미늄 재질의 판재를 프레싱 성형하여 중앙부에 기판이 수납될 수 있도록 오목홈이 형성된 알루미늄 케이스에 상기 기판을 내장하고, 상기 기판 상측으로 에폭시수지를 충진하되, 상기 에폭시수지가 칩LED의 상부면을 덮지 않도록 충진하여 구성하므로서, 칩LED가 장착된 기판에 알루미늄케이스의 바닥면에 완전히 밀착된 상태로 에폭시가 충진됨에 따라 전체적인 칩LED 조명기구의 형성높이를 낮춰줄 수 있음은 물론 칩LED의 작동시 발생되는 열이 알루미늄 케이스의 전체 면적을 통해 방열됨에 따라 칩LED의 수명을 연장시킬 수 있으면서 칩LED의 과열에 의한 조도감소현상을 줄여줄 수 있으며, 알루미늄 케이스에 충진된 에폭시에 의해 칩LED 조명기구의 완전방수기능을 부여할 수 있으므로 칩LED 조명기구를 옥외 광고용으로도 사용할 수 있도록 한 방열기능을 갖는 칩LED 조명기구를 제공함을 목적으로 한다.Therefore, the present invention for solving the above problems is to mount the chip LED and the peripheral parts for light emitting on the upper surface of the substrate, the terminal of the chip LED and the peripheral parts are fixed by soldering on the upper surface of the substrate, the aluminum plate The substrate is embedded in an aluminum case in which a recess is formed so that the substrate can be accommodated by pressing molding, and the epoxy resin is filled above the substrate, but the epoxy resin is filled so as not to cover the upper surface of the chip LED. As the epoxy is filled in the state where the chip LED is mounted on the bottom of the aluminum case, the height of formation of the chip LED luminaire can be lowered and the heat generated during the operation of the chip LED can be reduced. As the heat is radiated through the entire area of the chip, it can extend the life of the chip LED and reduce the illuminance caused by the overheat of the chip LED. It is possible to provide chip LED lighting fixtures with heat dissipation function that can be used for outdoor advertising because it can give the perfect waterproof function of chip LED lighting fixtures by epoxy filled in aluminum case. It is done.
이하, 첨부된 도면 도 1 내지도 4 를 참조하여 본 고안의 바람직한 실시예를 설명하면 다음과 같다.Hereinafter, a preferred embodiment of the present invention with reference to the accompanying drawings, Figures 1 to 4 as follows.
상기 도면에 의하면, 본 고안의 가장 큰 특징은 기판(1) 상부에 복수개의 칩LED(2)와 주변부품(3)을 장착하고, 상기 기판(1)을 알루미늄재질로서 형성된 알루미늄케이스(6)의 바닥부에 장착한 후 상기 기판(1) 상부면에 에폭시수지(7)를 충진하여 방열기능과 방수기능이 이루어지도록 한 것이다.According to the drawings, the biggest feature of the present invention is a plurality of chip LED (2) and the peripheral component (3) is mounted on the
상기 기판(1)은 좁고 길게 형성된 것을 사용하는 것이 바람직하며, 상기 기판(1)의 상면에는 복수의 칩LED(2)와 이 칩LED(2)의 점등에 필요한 저항, 다이오드와 같은 주변부품을 상기 칩LED(2)의 주변에 위치하도록 기판(1)의 상면에 장착한다.Preferably, the
이때, 상기 기판(1)의 상면에서 칩LED(2)와 주변부품(3)의 단자(2a)(3a)를 납땜(4) 처리하므로서, 기판(1)의 저면부에 단자 또는 납땜이 전혀 존재하지 않도록 한다.At this time, the
이는, 상기 기판(1)을 알루미늄재질의 알루미늄케이스(6) 바닥면에 장착하였을때 단자 또는 납땜이 알루미늄 케이스에 접촉되면서 발생하는 전기적 오류를 방지하기 위함이다.This is to prevent an electrical error that occurs when the
그리고, 상기 기판(1)의 양측에는 전원의 공급을 위한 전선(5)을 연결 형성한다.In addition, the wires 5 for supplying power are connected to both sides of the
한편, 상기 알루미늄 케이스(6)는 알루미늄 판넬을 프레싱성형하여 기판(1)이 장착될 수 있도록 오목하게 형성한 것으로서, On the other hand, the
상기 알루미늄 케이스(6)의 바닥부에 기판(1)이 장착되며, 상기 기판(1)의 상측으로 방수를 위한 에폭시수지(7)를 충진한다.The
이때, 상기 에폭시수지(7)가 도 1 에 도시된 바와같이 칩LED(2)의 상부면을 덮지 않도록 에폭시수지(7)의 충진량을 조절하는 것이 바람직하다.At this time, it is preferable to adjust the filling amount of the
상기 설명과 같이 칩LED(2)가 장착된 기판(1)을 알루미늄케이스(6)에 내장시키고, 그 알루미늄 케이스(6)에 에폭시수지(7)를 충진하게되면, 칩LED(2)가 에폭 시수지(7)에 의해 완전방수기능을 갖게되면서도 에폭시수지(7)가 칩LED(2)의 상부면을 덮지 않게되므로 칩LED(2)의 밝기를 그대로 유지할 수 있게된다.As described above, when the
또한, 전체적인 칩LED 조명기구의 높이(두께)를 매우 작게 형성할 수 있으므로, 칩LED 조명기구가 적용되는 문자채널의 크기를 줄여줄 수 있게된다.In addition, since the height (thickness) of the overall chip LED luminaire can be formed very small, it is possible to reduce the size of the character channel to which the chip LED luminaire is applied.
그리고, 상기와같이 구성된 본 고안의 칩LED 조명기구의 사용은 도 3 에 도시된 바와같이 옥외광고용 문자채널의 내부에 내장되어 사용되는 것인데,And, the use of the chip LED lighting device of the present invention configured as described above is to be used in the interior of the character channel for outdoor advertising, as shown in FIG.
본 고안의 칩LED 조명기구를 문자채널과 같이 밀폐된 공간에서 사용하더라도 상기 알루미늄케이스(6)가 전체적으로 방열판의 기능을 수행하게 되므로 칩LED(2)에서 발생되는 열을 효과적으로 방열시킴에 따라 열에 약한 칩LED(2)를 옥외광고용으로도 활용할 수 있게되는 것이다.Even when the chip LED luminaire of the present invention is used in an enclosed space such as a character channel, the
이상에서 설명한 바와같이 본 고안은 기판의 상면에 발광용 칩LED와 주변부품을 장착하고, 그 칩LED와 주변부품의 단자를 기판의 상부면에서 납땜하여 고정하며, 알루미늄 재질의 판재를 프레싱 성형하여 중앙부에 기판이 수납될 수 있도록 오목홈이 형성된 알루미늄 케이스에 상기 기판을 내장하고, 상기 기판 상측으로 에폭시수지를 충진하되, 상기 에폭시수지가 칩LED의 상부면을 덮지 않도록 충진하여 구성하므로서, 칩LED가 장착된 기판에 알루미늄케이스의 바닥면에 완전히 밀착된 상태로 에폭시가 충진됨에 따라 전체적인 칩LED 조명기구의 형성높이를 낮춰줄 수 있음은 물론 칩LED의 작동시 발생되는 열이 알루미늄 케이스의 전체 면적을 통해 방열됨에 따라 칩LED의 수명을 연장시킬 수 있으면서 칩LED의 과열에 의한 조도감소현상을 줄여줄 수 있으며, 알루미늄 케이스에 충진된 에폭시에 의해 칩LED 조명기구의 완전방수기능을 부여할 수 있으므로 칩LED 조명기구를 옥외 광고용으로도 사용할 수 있도록 한 방열기능을 갖는 칩LED 조명기구를 제공하는 효과를 기대할 수 있다.As described above, the present invention mounts a light emitting chip LED and a peripheral component on the upper surface of the substrate, solders the terminal of the chip LED and the peripheral component to the upper surface of the substrate, and press-forms an aluminum plate. The substrate is embedded in an aluminum case in which a recess is formed so that the substrate can be accommodated in a central portion thereof, and the epoxy resin is filled in the upper side of the substrate, and the epoxy resin is filled so as not to cover the upper surface of the chip LED. As the epoxy is filled in the state where the substrate is mounted on the bottom of the aluminum case, the overall height of the chip LED luminaire can be lowered, and the heat generated during the operation of the chip LED can be reduced. The heat dissipation can reduce the illuminance caused by overheating of the chip LED while extending the life of the chip LED. In addition, the epoxy filled in the aluminum case can impart the perfect waterproof function of the chip LED luminaire, so it is expected to provide a chip LED luminaire with a heat dissipation function that can be used for outdoor advertising. Can be.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2020070005028U KR200449331Y1 (en) | 2007-03-28 | 2007-03-28 | Chip LED Lighting Fixture with Heat Dissipation |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2020070005028U KR200449331Y1 (en) | 2007-03-28 | 2007-03-28 | Chip LED Lighting Fixture with Heat Dissipation |
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| Publication Number | Publication Date |
|---|---|
| KR20080004277U KR20080004277U (en) | 2008-10-02 |
| KR200449331Y1 true KR200449331Y1 (en) | 2010-07-06 |
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| Application Number | Title | Priority Date | Filing Date |
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| KR2020070005028U KR200449331Y1 (en) | 2007-03-28 | 2007-03-28 | Chip LED Lighting Fixture with Heat Dissipation |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103672479A (en) * | 2012-09-21 | 2014-03-26 | 简毓臣 | Lighting apparatus |
| KR101576878B1 (en) * | 2013-12-19 | 2015-12-11 | 주식회사 아이티앤티 | Cap type flood control LED-bar and that's manufacture method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100898933B1 (en) * | 2008-12-31 | 2009-05-21 | 주식회사 누리플랜 | Line type LED light |
| KR100898935B1 (en) * | 2008-12-31 | 2009-05-21 | 주식회사 누리플랜 | Line type LED light |
| KR100898931B1 (en) * | 2008-12-31 | 2009-05-21 | 주식회사 누리플랜 | Line type LED light |
| KR101016240B1 (en) * | 2009-12-15 | 2011-02-25 | 이영민 | Confidential method of LED lighting apparatus and LED lighting apparatus produced thereby |
| KR101407712B1 (en) * | 2012-11-28 | 2014-06-17 | 구본도 | LED lighting panel for crucifix |
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| KR200315451Y1 (en) * | 2003-03-14 | 2003-06-02 | 삼익전자공업 주식회사 | LED Signal Lamp with Compatibility |
| KR100516123B1 (en) * | 2005-08-30 | 2005-09-21 | 주식회사 누리플랜 | A line type led illumination lamp |
| KR200418900Y1 (en) * | 2006-03-30 | 2006-06-15 | 최규연 | Belt type LED lighting device |
| KR100661404B1 (en) * | 2006-06-30 | 2006-12-27 | 주식회사 누리플랜 | Line type LED light |
| KR100664349B1 (en) * | 2005-09-30 | 2007-01-02 | 자화전자(주) | Led board for illumination and illumination unit including the board |
| KR20070044101A (en) * | 2005-10-24 | 2007-04-27 | 안종찬 | Flexible lighting |
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| KR200315451Y1 (en) * | 2003-03-14 | 2003-06-02 | 삼익전자공업 주식회사 | LED Signal Lamp with Compatibility |
| KR100516123B1 (en) * | 2005-08-30 | 2005-09-21 | 주식회사 누리플랜 | A line type led illumination lamp |
| KR100664349B1 (en) * | 2005-09-30 | 2007-01-02 | 자화전자(주) | Led board for illumination and illumination unit including the board |
| KR20070044101A (en) * | 2005-10-24 | 2007-04-27 | 안종찬 | Flexible lighting |
| KR200418900Y1 (en) * | 2006-03-30 | 2006-06-15 | 최규연 | Belt type LED lighting device |
| KR100661404B1 (en) * | 2006-06-30 | 2006-12-27 | 주식회사 누리플랜 | Line type LED light |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103672479A (en) * | 2012-09-21 | 2014-03-26 | 简毓臣 | Lighting apparatus |
| KR101576878B1 (en) * | 2013-12-19 | 2015-12-11 | 주식회사 아이티앤티 | Cap type flood control LED-bar and that's manufacture method |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20080004277U (en) | 2008-10-02 |
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