KR20040040149A - the method of manufacturing mesh panel - Google Patents
the method of manufacturing mesh panel Download PDFInfo
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- KR20040040149A KR20040040149A KR1020020068493A KR20020068493A KR20040040149A KR 20040040149 A KR20040040149 A KR 20040040149A KR 1020020068493 A KR1020020068493 A KR 1020020068493A KR 20020068493 A KR20020068493 A KR 20020068493A KR 20040040149 A KR20040040149 A KR 20040040149A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0448—Details of the electrode shape, e.g. for enhancing the detection of touches, for generating specific electric field shapes, for enhancing display quality
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04112—Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material
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Abstract
Description
본 발명은 메시 패널 제조방법에 관한 것으로서, 보다 상세하게는 코스트를 절감할 수 있으며, 전극을 매우 가늘게 제작할 수 있는 새로운 개념의 메시 패널 제조방법에 관한 것이다.The present invention relates to a method for manufacturing a mesh panel, and more particularly, to a cost reduction and a method for manufacturing a mesh panel of a new concept capable of manufacturing an electrode very thinly.
일반적으로, 절연재질로 구성된 패널에 양면을 관통하도록 다수개의 미세전극을 삽입하여 구성된 메시 패널은 터치패드나 반도체 패키지, 반도체 커넥터, 반도체 테스트 장비 등에 사용되고 있다.In general, a mesh panel formed by inserting a plurality of micro electrodes to penetrate both sides of a panel made of an insulating material is used in a touch pad, a semiconductor package, a semiconductor connector, semiconductor test equipment, and the like.
도 1은 반도체 테스트 장비에 적용된 메시 패널의 일예를 도시한 것으로, 메시 패널로 구성된 테스트어댑터의 상하면에 테스트용 PCB와, IC를 밀착시키면, 이 메시 패널을 통해 IC가 PCB에 전기적으로 연결되어, IC의 이상유무를 테스트할 수 있도록 구성된다.1 illustrates an example of a mesh panel applied to semiconductor test equipment. When the test PCB and the IC are closely attached to upper and lower surfaces of a test adapter composed of a mesh panel, the IC is electrically connected to the PCB through the mesh panel. It is configured to test the abnormality of IC.
그러나, 이러한 메시 패널은 일반적으로 실리콘과 같은 연질의 패널에 미세한 관통공을 다수개 형성하고, 이 관통공에 미세한 전극을 일일이 삽입하여야 한다. 따라서, 제작시간이 길고, 공정수가 매우 많아, 생산성이 떨어지고 코스트가 상승될 뿐 아니라, 불량발생률이 높은 문제점이 있었다.However, such a mesh panel generally forms a plurality of fine through holes in a soft panel such as silicon, and fine electrodes must be inserted into the through holes. Therefore, the production time is long, the number of processes is very large, the productivity is lowered and the cost is increased, there is a problem that the failure rate is high.
특히, 이와같은 방법으로 메시 패널을 제작하기 위해서는 절연패드에 전극을 관통결합하여야 하는데, 이 전극이 매우 가늘어 절연패드에 삽입하는 것이 매우 어려울 뿐 아니라, 그 수가 매우 많으므로, 완성된 메시 패널의 가격이 매우 고가인 문제점이 있었다. 또한, 관통공의 형성위치나 전극의 삽입위치에 오차가 발생될 경우, 이 메시 패널을 이용하여 제작된 제품에 불량이 발생되는 문제점이 있었다. 특히, 이러한 메시패널은 전극의 두께가 가늘수록 우수한 전기적 특성을 갖게 되지만, 종래의 메시패널은 전극이 너무 가늘 경우, 절연패드에 전극을 관통결합할 수 없으므로, 전극의 두께가 일정 수준 이상을 유지하여야 하는 단점이 있다.In particular, in order to fabricate a mesh panel in this way, an electrode must be penetrated to an insulating pad. This electrode is so thin that it is very difficult to insert it into an insulating pad. There was this very expensive issue. In addition, when an error occurs in the formation position of the through hole or the insertion position of the electrode, there is a problem that a defect occurs in the product manufactured by using the mesh panel. In particular, such a mesh panel has excellent electrical properties as the thickness of the electrode is thin, but the conventional mesh panel can not penetrate the electrode to the insulating pad when the electrode is too thin, the thickness of the electrode to maintain a certain level or more There are disadvantages that must be made.
본 발명자는 이러한 문제점을 해결하기 위하여, 복수개의 전소성소재와 부전도성소재를 번갈아 적층하고, 이와 같이 적층된 적층체를 잘라 다시 적층하는 방법으로 메시패널을 제조할 수 있는 새로운 공법을 개발하여 특허출원한 바 있다.(출원번호 10-2002-0024076)In order to solve this problem, the present inventors have developed a new method for producing a mesh panel by alternately stacking a plurality of pre-plastic materials and a non-conductive material, and then cutting and stacking the stacked laminates. (Application No. 10-2002-0024076)
이러한 방법을 이용하면, 매우 정밀한 메시패널을 제작할 수 있으나, 공정이 비교적 복잡하여, 코스트가 높은 단점이 있었다. 특히, 단순한 PCB테스트용 메시패널의 경우, 전극의 삽입위치가 일정하지 않아도 사용 가능하므로, 이러한 조건을 만족시키면서도 코스트가 낮은 새로운 메시패널 제조방법이 필요하게 되었다.Using this method, a very precise mesh panel can be manufactured, but the process is relatively complicated, and the cost is high. In particular, in the case of a simple PCB test mesh panel can be used even if the insertion position of the electrode is not constant, there is a need for a new mesh panel manufacturing method while satisfying these conditions and low cost.
본 발명은 상기의 문제점을 해결하기 위한 것으로서, 본 발명의 목적은 코스트를 절감할 수 있으며, 전극을 매우 가늘게 제작할 수 있는 메시패널 제조방법을 제공하는 것이다.The present invention is to solve the above problems, an object of the present invention is to provide a mesh panel manufacturing method that can reduce the cost, and can be produced very thin electrode.
도 1은 일반적인 메시 패널의 구조를 도시한 측단면도1 is a side cross-sectional view showing the structure of a typical mesh panel
도 2는 본 발명에 따른 메시 패널의 제조방법을 도시한 공정도2 is a process chart showing a method for manufacturing a mesh panel according to the present invention.
도 3은 본 발명에 따른 다른 실시예를 도시한 공정도Figure 3 is a process diagram showing another embodiment according to the present invention
<도면의 주요부분에 대한 부호의 설명><Description of the symbols for the main parts of the drawings>
둘레면이 부전도체(2)로 피복된 전극선(4)을 소정길이로 잘라내는 절단단계와, 절단된 전극선(4)을 대략 평행하게 배치하는 배치단계와, 평행하게 배치된 전극선(4)을 상호 접착하는 접착단계와, 상호 접착된 전극선(4)을 길이방향과 대략 직각되는 방향으로 소정두께씩 잘라내는 절단단계를 포함하는 것을 특징으로 하는 메시패널 제조방법이 제공된다.The cutting step of cutting the electrode wire 4 covered with the non-conductive conductor 2 to a predetermined length, the arrangement step of placing the cut electrode wire 4 in substantially parallel, and the electrode wire 4 arranged in parallel A method of manufacturing a mesh panel is provided, including a step of bonding each other and a step of cutting the electrode lines 4 bonded to each other by a predetermined thickness in a direction substantially perpendicular to the longitudinal direction.
본 발명의 다른 특징에 따르면, 둘레면이 부전도체(2)로 피복된 전극선(4)을금형(6)의 둘레면에 감는 권취단계와, 금형(6)에 권취된 전극선(4)을 상호 접착하는 접착단계와, 권취된 전극선(4)을 전극선(4)이 감긴 방향의 대략 직각방향으로 잘라내는 절단단계를 포함하는 것을 특징으로 하는 메시패널 제조방법이 제공된다.According to another feature of the present invention, the winding step of winding the electrode wire 4 whose peripheral surface is covered with the non-conductor 2 on the peripheral surface of the mold 6 and the electrode wire 4 wound on the mold 6 A method of manufacturing a mesh panel is provided, including a step of adhering and a step of cutting the wound electrode wire 4 in a direction substantially perpendicular to the direction in which the electrode wire 4 is wound.
본 발명의 또다른 특징에 따르면, 상기 전극선(4)에 피복된 부전도체(2)는 열가소성재질로 구성되어, 평행하게 배치된 전극선(4)에 열을 가하여, 용융된 부전도체(2)가 상호 융착되어 전극선(4)을 상호 접착할 수 있도록 된 것을 특징으로 하는 메시패널 제조방법이 제공된다.According to another feature of the invention, the non-conductor 2 coated on the electrode line 4 is made of a thermoplastic material, by applying heat to the electrode line 4 arranged in parallel, the molten non-conductor 2 is Provided is a method for manufacturing a mesh panel, which is fused to each other so that the electrode wires 4 can be bonded to each other.
본 발명의 또다른 특징에 따르면, 상호 평행하게 배치된 전극선(4)의 사이에 접착제를 충진하여 전극선(4)을 상호 접착하는 것을 특징으로 하는 메시패널 제조방법이 제공된다.According to another feature of the present invention, there is provided a mesh panel manufacturing method characterized in that the electrode wires 4 are bonded to each other by filling an adhesive between the electrode wires 4 arranged in parallel with each other.
이하, 본 발명의 바람직한 실시예를 첨부한 도면에 의거하여 설명하면 다음과 같다.Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.
도 2는 본 발명에 따른 메시 패널 제조방법을 도시한 것으로, 이 메시패널 제조방법은 둘레면이 부전도체(2)로 피복된 전극선(4)을 소정길이로 잘라내는 절단단계(a단계)와, 절단된 전극선(4)을 대략 평행하게 배치하는 배치단계(b단계)와, 전극선(4)을 상호 접착하는 접착단계(c,d단계)와, 상호 접착된 전극선(4)을 소정 두께로 잘라내는 절단단계(e단계)로 구성된다.2 shows a method for manufacturing a mesh panel according to the present invention. The method for manufacturing a mesh panel includes a cutting step (step a) of cutting an electrode wire 4 having a circumferential surface covered with a non-conductor 2 to a predetermined length; The arrangement step (step b) of arranging the cut electrode wires 4 in parallel with each other, the adhesion steps (c and d steps) of adhering the electrode wires 4 to each other, and the electrode wires 4 bonded to each other to a predetermined thickness It consists of a cutting step (step e).
상기 전극선(4)은 메시패널의 상하면을 통전시키는 전극의 기능을 하는 것으로, 지름은 작을수록 유리하다. 이 전극선(4)에 피복된 부도체는 용융시 상호 접착력이 뛰어난 합성수지 재질이나 기타 다른 접착체를 이용하여 접착시키기 용이한 합성수지재질을 이용할 수 있다. 또한, 코팅에 사용되는 도료와 같이, 상호 밀착배치되는 전극선(4)을 상호 절연할 수 있는 것은 어떠한 것도 사용가능하다.The electrode line 4 functions as an electrode for energizing the upper and lower surfaces of the mesh panel, and the smaller the diameter is, the more advantageous it is. The non-conductor coated on the electrode wire 4 may use a synthetic resin material which is excellent in mutual adhesion when melted, or a synthetic resin material which is easy to adhere using other adhesives. In addition, as the coating material used for coating, any thing which can mutually insulate the electrode wire 4 mutually arrange | positioned can be used.
상기 배치단계는 상기 절단단계를 거쳐 일정한 길이로 잘라진 전극선(4)을 평행하게 겹쳐, 제작할 메시패널의 면적만큼 단면적을 갖는 기둥형상의 적층체(5)를 형성하는 것으로, 제작할 메시패널의 단면형상과 유사한 형태의 금형(6) 내부에 전극선(4)을 쌓아 일정한 형상을 형성하도록 하는 것이 바람직하다. 이때, 각각의 전극선(4)은 반드시 완전한 평행상태를 유지할 필요는 없다. 상기 접착단계는 금형(6)내부에 배치된 각각의 전극선(4)을 상호 접착시켜 소정 형상의 적층체(5)를 제작하는 것으로, 접착방법은 전극선(4)에 피복된 부전도체(2)의 종류에 따라 달라진다. 즉, 부전도체(2)가 열에 의해 용융되는 열가소성수지로 구성될 경우, 금형(6)에 히터를 장착하여 이 히터로 열을 가해 부전도체(2)를 용융, 접착시킬 수 있다. 또한, 다른 방법으로, 전극선(4)의 사이에 접착제를 주입하여, 각 전극선(4)을 상호 접착하는 것도 가능하다.The arranging step is to overlap the electrode wires 4 cut to a certain length through the cutting step in parallel to form a columnar laminate 5 having a cross-sectional area equal to the area of the mesh panel to be manufactured, and the cross-sectional shape of the mesh panel to be manufactured. It is preferable to stack the electrode wires 4 inside the mold 6 having a shape similar to that of forming a predetermined shape. At this time, each of the electrode lines 4 does not necessarily have to maintain a completely parallel state. The bonding step is to bond each of the electrode wires 4 disposed in the mold 6 to each other to produce a laminate 5 of a predetermined shape, and the bonding method is the non-conductor 2 coated on the electrode wires 4. Depends on the type. That is, when the non-conductor 2 is made of a thermoplastic resin that is melted by heat, the heater can be attached to the mold 6 to apply heat to the heater to melt and adhere the non-conductor 2. In addition, it is also possible to inject an adhesive agent between the electrode wires 4, and to adhere | attach each electrode wire 4 mutually.
상기 절단단계는 전극선(4)을 접착하여 제작된 적층체(5)를 커팅수단(8)을 이용하여, 일정 두께로 절단하여 메시패널을 제작하는 단계로서, 평행하게 배치된 전극선(4)의 길이방향과 직각되는 방향으로 절단한다. 이때, 적층체(5)를 절단하는 커팅수단(8)으로는 반도체 와이퍼를 잘라내는 와이퍼 절단기나, 물을 고압으로 분사하여 피가공물을 잘라내는 워터젯 등을 이용할 수 있다. 이와같이 적층체(5)를 잘라내면, 전극선(4)의 둘레면에 피복된 부전도체(2)가 탄성 시트의 역할을 하며, 잘라진 전극선(4)의 양단이 메시패널의 양면으로 노출되어, 전극의 역할을 하게 된다.The cutting step is a step of cutting the laminate 5 produced by adhering the electrode wires 4 to a predetermined thickness by using the cutting means 8 to produce a mesh panel. Cut in the direction perpendicular to the longitudinal direction. At this time, the cutting means 8 for cutting the laminated body 5 may be a wiper cutter for cutting a semiconductor wiper, or a waterjet for cutting a workpiece by spraying water at high pressure. When the laminate 5 is cut out in this manner, the non-conductor 2 coated on the circumferential surface of the electrode wire 4 serves as an elastic sheet, and both ends of the cut electrode wire 4 are exposed to both sides of the mesh panel, thereby It will play the role of.
또한, 필요에 따라, 완성된 메시패널의 양면을 연마하는 공정을 추가할 수 잇다.In addition, if necessary, a step of polishing both sides of the finished mesh panel can be added.
이와같은 메시패널 제작방법은 여러개의 전극선(4)을 평행하게 배치하고, 각 전극선(4)을 상호 접착한 후, 일정 두께로 잘라내어 제작하므로, 절연패드에 전극을 삽입하여 제작하는 종래의 방법에 비해, 공정이 간단하고, 코스트를 절감할 수 있는 장점이 있다. 특히, 전극을 일정 두께 이하로 제작할 수 없는 종래의 방법과 달리, 전극의 두께를 매우 가늘게 제작할 수 있는 장점이 있다.Such a method for manufacturing a mesh panel is arranged in parallel with each other, and the electrode lines 4 are bonded to each other, and then cut to a predetermined thickness, so that the electrode panel is inserted into an insulating pad. In contrast, the process is simple, there is an advantage that can reduce the cost. In particular, unlike the conventional method in which the electrode cannot be manufactured to a predetermined thickness or less, there is an advantage in that the thickness of the electrode can be made very thin.
도 3은 본 발명에 따른 다른 실시예를 도시한 것으로, 전극선(4)을 일정한 길이로 잘라낸 후, 상호 평행하게 배치하는 제1 실시예와 달리, 봉형상으로 구성된 금형(6)의 둘레부에 전극선(4)을 감으므로써, 전극선(4)을 평행하게 배치하는 효과를 낼 수 있도록 구성된다. 그리고, 금형(6)의 둘레부에 전극선(4)을 감은 후, 전술한 바와 같은 접착단계와 절단단계를 거치므로써, 메시패널을 제작할 수 있다.3 shows another embodiment according to the present invention, unlike the first embodiment in which the electrode wires 4 are cut to a certain length and arranged in parallel to each other, the periphery of the mold 6 having a rod shape is shown. It is comprised so that the effect which arrange | positions the electrode line 4 in parallel can be produced by winding the electrode line 4. Then, after winding the electrode wire 4 in the periphery of the mold (6), a mesh panel can be produced by going through the bonding step and the cutting step as described above.
이와같은 방법을 이용하면, 전극선(4)을 잘라낸 후, 평행하게 배치하는 공정을 생략할 수 있으므로, 생산성을 높일 수 있는 장점이 있다.By using such a method, since the process of cutting out the electrode wire 4 and arrange | positioning in parallel can be skipped, there exists an advantage that productivity can be improved.
이상에서와 같이 본 발명에 의하면, 둘레면이 부전도체(2)로 피복된 전극선(4)을 상호 평행하게 배치한 후, 일정두께로 잘라내므로써, 코스트를 절감할 수 있으며, 전극을 매우 가늘게 제작할 수 있는 새로운 개념의 메시 패널 제조방법를 제공할 수 있다.As described above, according to the present invention, by arranging the electrode wires 4 whose peripheral surfaces are covered with the non-conductor 2 in parallel with each other, and cutting them to a certain thickness, the cost can be reduced and the electrode can be made very thin. It is possible to provide a new concept of mesh panel manufacturing method.
Claims (4)
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| KR10-2002-0068493A KR100451701B1 (en) | 2002-11-06 | 2002-11-06 | the method of manufacturing mesh panel |
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| KR101006028B1 (en) * | 2009-05-15 | 2011-01-06 | 이성희 | Packing for airtight container and manufacturing method thereof |
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| JP2849609B2 (en) * | 1991-12-20 | 1999-01-20 | 信越ポリマー株式会社 | Manufacturing method of elastic connector |
| JPH09274983A (en) * | 1996-04-03 | 1997-10-21 | Shin Etsu Polymer Co Ltd | Manufacture of elastomer connector |
| JPH10125433A (en) * | 1996-10-25 | 1998-05-15 | Shin Etsu Polymer Co Ltd | Low-resistance connector and manufacture thereof |
| JP2002026202A (en) * | 2000-06-29 | 2002-01-25 | Three M Innovative Properties Co | Heat conducting sheet and its manufacturing method |
| JP2002123182A (en) * | 2000-08-10 | 2002-04-26 | Nisshinbo Ind Inc | Front plate for plasma display panel and its manufacturing method |
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| KR101006028B1 (en) * | 2009-05-15 | 2011-01-06 | 이성희 | Packing for airtight container and manufacturing method thereof |
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