KR200334395Y1 - The mechanism of ic socket with thermo-electric device - Google Patents

Abstract

The present invention mainly relates to a socket that can be applied to the test of the IC for memory, and in the test of the IC, a thermoelectric element (direct current) inside the socket can be adjusted to set the temperature of the IC under test at an arbitrary temperature. One side generates heat through electricity, and the other side is designed to receive heat) and to supply power to the thermoelectric element, and to operate the thermoelectric element in an up-down direction. To facilitate loading / unloading of the target IC into the socket, and more importantly, the heat generating surface of the thermoelectric element adheres to a constant pressure on the bottom of the IC while the IC is loaded into the socket, thereby transferring heat and It relates to the structure of the socket designed to make the most effective in maintaining.

Description

Structure of socket for semiconductor inspection with built-in thermoelectric element. {THE MECHANISM OF IC SOCKET WITH THERMO-ELECTRIC DEVICE}

The present invention relates to a socket of a memory IC, and in particular, to the structure of a socket with a thermoelectric element, and designed to maintain or maintain the temperature of the IC under test in an arbitrary temperature range.

Generally, a device required for testing a memory IC includes an IC socket or a burn-in (B / I) socket (hereinafter referred to as a socket), a burn-in board provided to mount and solder a plurality of sockets, A series of IC test systems are provided with a single-in chamber or peripherals and measuring devices to input and output the required power and signals through the I / O terminals formed on the burn-in board.

The types of sockets are classified into socket types such as thin small outline package (TSOP), quad flat package (QFP), small outline j-lead (SOJ), and ball grid array (BGA) according to the package shape of the IC.

The function of the socket during the test process of the memory IC is an intermediate medium between the IC and the burn-in board. The IC is housed in the socket, and the input / output LEADs formed in the IC are electrically contacted with the contacts of the socket and the pins of the contact are burned. The main function of the socket is to insert and solder on the board to ensure that the electrical signals between the burn-in board and the IC's I / O terminals are seamless.The IC's productivity, test temperature, socket life and reliability, and The structure / performance of the socket is required in consideration of preventing the IC deterioration due to the socket.

The socket may have various structures such as the above-described TSOP, QFP, SOJ, BGA, but the related art will be described with reference to the TSOP type in connection with the present invention. First, as shown in FIG. 1, the TSOP type (1) IC Has a shape in which a plurality of IC LEADs 2 are arranged on a side opposite to one side of the IC. If a plurality of IC LEADs are formed on the remaining two surfaces of the TSOP type without the LEAD, the IC is called the QFP 5 type and has a shape as shown in FIG. 2.

Referring to the structure of the conventional socket 11 of the TSOP type IC, as shown in FIGS. 3 to 5, the external shape of the TSOP IC is largely represented by the body 15 of the socket, the plurality of contacts 14, the IC adapter 13, and the cover. 12) and two cover springs 16 for pushing up the cover, and in the case of the pitch (0.8) shown in FIG. 4, the number of LEADs of the IC is 54 and is called a socket for TSOP-54. If the lead pitch is 0.65, the number of LEAD is 66 and it is called TSOP-66 socket. If the lead pitch is 0.5, the number of LEAD is 86, which is the socket for TSOP-86. According to the formation of the lower terminal in the contact (14) of Figure 5 is called Contact A (14A), B (14B), C (14C), Contact A and B are alternately shown in Figure 6 in TSOP-54,66 It is to be inserted and fixed in the receiving fixing holes (21A, 21B) formed in the body 12, and in TSOP-86 is inserted and fixed in the receiving fixing holes (21A, 21B, 21C) formed in the body in order to contact A, B, C It is common to have

Looking at the conventional socket component structure in more detail, shown in Figure 6 is a body as a material is molded into engineering plastics, the main function of the receiving fixing holes (21A, B) to accommodate the holding contact A, B or C C, 54, 66, 86 at the intervals of pitch (0.8, 0.65, 0.5) above and below the center as shown in the plan and bottom view by TSOP-54,66, Use for 86. The spring fitting protrusion 22 shown in the front view is a protrusion for fitting the cover spring 16, and the IC adapter fixing protrusion 23 is formed to receive and fix the fixing hook 32 shown in FIG. Denoted at 24 is a cover release prevention hook 42 of FIG.

Figure 7 shows the shape of the contact A, B, C, the material of the contact is usually a gold plating on the copper alloy, the structure of the head 25, the contact portion 30, as shown in FIG. In inserting and fixing the elastic part 26, the pin 14A, and the fixing hole 21A of the body, the stop part 28 of the contact functions to prevent the contact from being inserted into the body more than a predetermined depth. The caulking portion 29 is a pressing portion for forcibly fitting the contact to the fixing groove of the body by using a jig, etc., and the anti-separation protrusion 27 serves to prevent the contact after being forcibly pressed into the fixing groove of the body. do.

The material of the IC adapter 13 shown in FIG. 9 uses engineering plastics, and accommodates the IC 1 so as to be accommodated in left, right, front, and top and bottom positions, and holds the front, rear, left, and right positions of the IC package 3. The main body is composed of a guide 31, an IC LEAD seating surface 34, a contact guide slot 33, a fixed hook 32, and the like.

The material of the cover 12 shown in FIG. 10 uses engineering plastics, and is configured to operate up and down to change the position of the head 25 of the contact by the cam 44 shown in the side view to load / unload the IC. It serves to lift the contact portion 30 of the contact to the upper side outward from the mounting surface, the cover hook 42 to be prevented from being detached by being accommodated in the contact guide slot 43, the cover fixing projection 24 of the body, And a cover spring receiving protrusion 41 or the like.

11 is a view illustrating a conventional assembling procedure of the socket. First, the contact A, B, or C may be inserted in the contact hole 14 fixed hole formed in the body 15 to be press-fitted according to a predetermined standard. After press-fitting to the proper depth using the manufactured jig, the socket is completed by assembling the cover and the IC adapter so that the hooks 42 and 32 are completely caught by the fixing protrusions 23 and 24 of the body.

12 is an example of TSOP-54 showing a pattern for soldering a socket to a burn-in PCB. Column 50A is a row into which pin 14A of Contact A is inserted, column 50B is a row into which pin 14B of Contact B is inserted, and in the case of TSOP-86, another row 50C is additionally formed. .

13 and 14 illustrate the operation of the conventional socket and the loading / unloading of the IC step by step. 1. In the preparatory stage, the cover of the socket is not pressed at all. 2. In the depressing stage, the IC waits on the upper side of the socket. The situation is usually performed by automatic equipment. This step moves the contact head 25 by the curved cam 44 formed on the cover to the outside of the socket by pressing the cover of the socket just before loading the IC to move the contact portion 30 of the contact to the seating surface of the IC adapter. At 34, it is lifted outwards, thus the socket is ready to accept the IC. D is the distance the cover is pressed and is called Cover Stroke.

3. The IC LOADING step of FIG. 14 shows a state in which the IC is seated inside the IC adapter of the socket. 4. The cover return step is a state in which the cover is returned to its original state, while the contact is returned by the elastic energy of the elastic part 26. The contact part 30 makes an electrical contact while pressing the upper side of the IC LEAD 2 with an appropriate force. In this case, if the socket is mounted on the burn-in board, the IC can be tested by applying an electrical signal. After the test, the IC is unloaded in the reverse order of LOADING and the IC is sent to the next process.

The above-mentioned conventional sockets are required for testing or burning in ICs, but do not have a function of heating or cooling in the sockets themselves.

Therefore, the above socket has no function of heating or cooling in itself, and semiconductor manufacturers first check the quality by testing the overall test items at room temperature and burn-in test as a measure of harshness test. Test the IC for a long time in the chamber.

But isn't it possible to test the IC while keeping the temperature of the IC at the desired high or low temperature in the indoor environment, not in the chamber? In this case, the actual IC will be mounted on the PCB, making the environment more similar to the environment used by the consumer, resulting in higher IC test efficiency. By reducing the use, purpose and usage time of in-chambers and test equipment, the investment cost and IC test time can be drastically reduced, thus reducing the cost of IC production and thus increasing the competitiveness.

In summary, the present invention embodies and embodies a socket that can measure and test the function / performance of IC in the temperature range while keeping the IC in the desired temperature range by heating or cooling the IC to the desired temperature range. The purpose is to.

1 illustrates a TSOP-54 IC.

2 shows a QFP-144 IC.

3 and 4 illustrate a plan view and a front view of a conventional TSOP-54 socket.

Figure 5 is a partial cross-sectional view of the side of the conventional TSOP-54 socket.

Figure 6 is a view showing the body of the conventional TSOP-54 socket.

7 and 8 illustrate a contact of a conventional TSOP-54 socket.

9 illustrates an IC adapter of a conventional TSOP-54 socket.

10 shows a cover of a conventional TSOP-54 socket.

11 is a view showing an assembling procedure of a conventional TSOP-54 socket.

12 illustrates a PCB pattern of a conventional TSOP-54 socket.

13 and 14 illustrate an IC loading process of a conventional TSOP-54 socket.

15 and 16 are a plan view and a side view of the inventive socket.

17 is a view showing the body of the subject innovation socket.

18 is a view showing a thermoelectric element of the socket of the present invention.

19 is a view showing a thermoelectric housing of the inventive socket.

20 is a view showing a state of assembling the thermoelectric element and the housing of the socket of the present invention.

21 is a view showing a contact of the inventive socket.

22 is a view showing a power contact of the inventive socket.

23 is a view showing an IC adapter of the socket of the present invention.

24 is a view showing a cover of the inventive socket.

25, 26 is a view showing a sequence of assembling the socket of the present invention.

27 is a view showing a PCB pattern to which the inventive socket is applied.

28 and 29 are views showing the IC LOADING operation of the socket of the present invention.

30 is an auxiliary view for explaining the operation of the socket of the present invention.

<Description of Symbols for Main Parts of Drawings>

1,5: IC (TSOP-54 Type, QFP-144 Type)

G1, G2: Distance from IC LEAD to bottom of IC package

26,93,102,86: Elastic part 14,90,100: Contact

30,92,101: Contact portion 14A, 90A, 106: Pin

31,111,115: Guide 33,43,113,123: Slot

21A, 66A, 62: fixing hole 34,112: Seating surface

71: top plate of the thermoelectric element 83: fixed hook

25, 85, 91: head 114, stopper

124,121: Cam S: Seating surface height

D: Distance pressed Cover H: Height of thermoelectric top plate

Hereinafter, a detailed description of a preferred embodiment of the present invention will be described with reference to the accompanying drawings. In the following description of the reference numerals to the components of the drawings, it should be noted that the same reference numerals as much as possible even if displayed on different drawings. In addition, in describing the present invention, if it is determined that the detailed description of the related known function or configuration may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted. In addition, the terms to be described below are terms defined in consideration of functions in the present invention, which may vary according to intentions or customs of users or semiconductor development or production related persons, and the definitions should be made based on the contents throughout the present specification.

First, when the configuration of the finished product of the present invention will be described with reference to FIGS. 15 to 16, the configuration of the socket body 60, Contact 90, IC adapter 110, cover 120 in the configuration of the product of the present invention Products may use the same material as the components of the conventional socket, the main function of the components are also the same as before. In Fig. 15, the thermoelectric element 70 is accommodated in a rectangular shape in the center of the IC adapter, so that the IC bottom surface 4 of Fig. 1 can be heated or cooled.

In the present invention, the thermoelectric element is called a thermoelectric heat pump or a thermoelectric device. The thermoelectric element is designed and manufactured by using a semiconductor element called bismuth telluride having a large thermoelectric effect. The shape and shape shown in 19 are applied and manufactured, and more detailed information about the principle of the thermoelectric element can be found in the manufacturer's catalog or reference 1.

In Fig. 16, there is a housing 80 in which a thermoelectric element is tightly received into an inner side of the IC adapter 110, and an upper plate 71 that is a hot plate, a thermoelectric material particle 73, and a lower plate 72 that is a cold plate are disposed therein. In addition, there is a thermoelectric element composed of power terminals 74 and 75, and a spring 52 for pushing the thermoelectric housing 80 and a power contact 100 for supplying power to the thermoelectric element and the contact portion 101 are constructed. It is.

17 to 24 illustrate the components of the present invention, and FIG. 17 shows the body 60. Looking at the additional designed features compared to the conventional case, by forming a guide hole 64 in the center of the body to accommodate the guide cylinder 88 of the thermoelectric housing 80 shown in Figure 19 to move up and down the thermoelectric housing Serves as a guide. Four spring guide holes 61 are configured so that four springs 52 shown in FIG. 16 are accommodated, and the springs 52 are caught by the spring receiving protrusions 87 shown in FIG. The two power terminal fixing holes 62 are configured to receive and fix the power terminal 100 shown in FIG. In the present invention, for convenience, the receiving fixing holes 66A and B are formed in the body only for the contact A and the B, but the socket is configured to accommodate the contact C so that it is easily applicable to the thermoelectric socket of the TSOP-86 type. To mention.

The thermoelectric element 70 shown in FIG. 18 uses the ceramic upper plate 71 as a hot plate and the ceramic lower plate 72 as a cold plate, but the width of the lower plate is somewhat smaller than the width of the upper plate as shown in the side and bottom views. In a small configuration, the width of the upper plate and the width of the upper plate were relatively maximized in the state in which the lower plate was fixed to the fixing hook of the housing shown in the side view of FIG. 20. A plurality of thermoelectric material particles 73 are connected in series in the middle of the two plates, and the power terminals are connected to both ends thereof in the present invention. Here, the power terminal uses a coated wire in a conventional thermoelectric element, but in the present invention, as shown in the side view, a power terminal shaped as a “c” shaped terminal is formed on the bottom plate and metalized and attached to the bottom plate to maintain the power supply even when the housing is operated up and down. The feed was facilitated. When 1.5 volts of DC power is applied to the +/- power terminal, the current flows through the thermoelectric particles, the upper plate goes up in temperature, the lower plate goes down, and when the temperature control system is configured, it contacts the target top temperature or top plate. The temperature of the integrated IC can be controlled within a certain range (eg, 77 degrees to 83 degrees). When the polarity of the power is reversed in the thermoelectric state, the temperature of the upper plate is lowered and the temperature of the lower plate is increased. In this case, if the temperature of the lower plate is properly controlled at a low temperature, the upper plate is brought to subzero temperature. In this case, the IC can be used as a low temperature testable socket.

FIG. 19 is a housing 80 designed to operate the thermoelectric element up and down after tightly accommodating and integrating the thermoelectric element 70. The material is made of engineering plastic, and four fixing hooks 83 are illustrated in FIG. 20. As shown, the lower plate 72 of the thermoelectric element serves to fix the side wall. The thermoelectric element is received and fixed in the accommodation space 82 of the housing, and the two escape grooves 81 and the evacuation holes 89 formed on the left and right sides of the housing are formed for the power terminals 74 and 75 of the thermoelectric element. In addition, the contact part 101 of the power contact 100 shown in FIG. 22 passes through the escape hole 89 to electrically contact the power terminal of the thermoelectric element to supply power.

Four spring receiving protrusions 87 and guide cylinders 88 are formed on the bottom of the housing. On the left and right sides of the housing, two levers having a shape similar to the letter “L” are formed. ), The head 85, the stop projection 84 is formed for the purpose of operating the thermoelectric element up and down.

FIG. 21 shows the structure of the contact 90 of the present invention, and in the present invention, only two pins 90A and 90B are formed to form the contacts A and B, and are applicable to TSOP-54 and 66. The shape, material and function are similar to the prior art.

FIG. 22 illustrates a power contact, and the material may be used by gold-plating a copper alloy. The configuration may include a pin 106, a fall prevention protrusion 103, a fitting protrusion 105, a caulking portion 104, an elastic portion 102, and a thermoelectric material. The contact portion 101 is configured to be in contact with the power supply terminals 74 and 75 of the device.

FIG. 23 illustrates a rectangular accommodating hole 119 capable of accommodating a thermoelectric element in the center thereof as a conventional IC adapter, and configured to enable the thermoelectric element to be operated up and down within the thermoelectric element and the housing 80. ), The stopper 114 and two inclined surfaces 115 are formed on each side for the purpose of controlling its position in the vertical operation. The stopper has a head 85 of the housing integrated with the thermoelectric element in the upward direction. It serves to prevent the further rise by stopping, the inclined surface is a surface which is in contact with the stop projection 84 of the housing lever is designed for the purpose of restraining the position in the upper direction of the housing.

FIG. 24 is a cover 120 of the present invention, in addition to the conventional function, a cam 121 for operating the thermoelectric element housing up and down is installed on the left and right sides thereof, and the position and size thereof are operated by the upper plate 71 of the thermoelectric element. The distance, range, and timing are determined, and the stop surface 122 prevents the head of the housing lever from moving upward while the cover is pressed downwards so that the housing of the thermoelectric element is connected to the force of the spring 52 or the power contact. The thermoelectric element and the housing integrated by the elastic force of the elastic portion 102 are designed to restrain the upward movement of the housing.

25 to 26 are shown to explain the order in which the components of the present invention are assembled, FIG. 25 is a side view, and FIG. 26 is a front view. Note that some components are not shown in the drawings to avoid complexity in the drawings. Inserting and caulking the contact A and B to the body 60 of the socket in a predetermined position and order in Figures 25 to 26 is the same as the conventional case. Next, the two power contacts 100 are inserted into the fixing groove 62 of the body, and then pressed using the appropriate jig so that the falling prevention protrusion 103 can be caught by the falling prevention jaw formed inside the fixing groove. Then, after assembling each of the springs 51 and 52 into the spring fitting protrusion 65 and the spring guide hole 61 of the body, the guide cylinder 88 of the housing integrated with the thermoelectric element is introduced into the guide hole 64 of the body. When it is inserted, the spring receiving projections 87 of the housing is fitted to the top center of the four springs 52 that serve to push the housing upward.

Next, in assembling the IC adapter to the body, the same as in the conventional case, but the upper plate of the thermoelectric element is accommodated in the thermoelectric element receiving hole 119 formed therein, and the head 85 of the four levers of the thermoelectric element is the IC adapter. A stop surface 114 of the contact protrusion 84 is in contact with the inclined surface 115 of the IC adapter.

Assembly of the cover 120 may be assembled while pressing the four fixing hooks 124 to the fixing protrusions 63 of the body in the direct direction as in the prior art.

When the socket of the present invention described so far is assembled, it is possible to test the IC TSOP-54 by inserting and soldering to the PCB pattern shown in FIG. In FIG. 27, power sources 131A and 131B to be supplied to the thermoelectric element are added to the conventional pattern.

The operation of the present invention will be described in FIGS. 28 to 29. The configuration of the drawings, but the front view and the side view can be seen that it was drawn to the cut surface for ease of explanation.

And a partial enlarged view is shown to make it easier to understand the operation of the thermoelectric element corresponding to the subject matter of the present invention. 28 shows a natural state of the socket of the present invention, that is, a state in which the cover 120 is not pressed at all. The thermoelectric element accommodated in the IC adapter is integrated in the housing and the lower surfaces of the power terminals 74 and 75 are shown. Since the contact portion of the power contact is pushed up by the elastic force, it is always in electrical contact, and when the power is supplied, the temperature of the top plate of the thermoelectric element increases. In the thermoelectric housing 80, four springs 52 are always pushed upwards, and as shown in the enlarged view, the head 85 of the housing is in close contact with the stop face 114 of the IC adapter.

In this preparatory step, the top plate 71 of the thermoelectric element is in the state of being raised to the top, and its height H0 is the height of the seating plane S, ie, the seating part 112, on which the bottom of the IC lead 2 is seated. As can be seen in the IC structure, the distance from the bottom of the IC LEAD to the bottom face 4 of the IC package (0.1 mm in G1: TSOP-54 / 66/86) is greater than the height of the thermoelectric element. The top plate comes into close contact with the bottom surface 4 of the IC at a constant pressure during the loading of the IC, so that heat transfer can be effectively performed. In the present invention, H0 is 0.2 mm or more higher than S. When the present invention is applied to an IC other than a TSOP type, that is, a QFP shown in FIG. 2 or an IC of another type, the amount of (H 0 -S) in the preparation step is equal to G 2 + α of FIG. 2 or the IC. It may be applied to suit the form.

In the first step, the cover cam 124 pushes the head 91 of the contact out of both sides of the socket as shown in the side view while pressing the cover by D1, so that the contact portion 92 of the contact is seated 112 of the IC adapter. In the state of being in close contact with the upper side to rise. The cover is pressed so that the ascending distance is equal to the thickness of the IC LEAD 2 (0.15mm for TSOP-54 / 66/86). In this state, the cam 121 of the cover is pushed downward 45 degrees by pressing the head 85 of the housing lever, so that the stop projection 84 of the housing lever is 45 degrees downward along the guide surface 115 of the IC adapter. Going down. At this time, the height H1 of the top plate of the thermoelectric element was configured to be lower than the distance of the IC seating surface S plus the distance G1 from the bottom of the IC LEAD to the bottom of the IC, that is, (S + G1). By doing so, it is possible to prevent the IC from popping up during IC unloading in step 4 of FIG. 29.

In the second stage, the cover is fully pressed and the contacts 92 of the contact are fully raised, ready to load the IC. In this case, as shown in the enlarged view, the cam 121 of the cover passes through the lever head 85 of the housing, and the stop surface 122 is pushing the lever head, and the stop protrusion 84 of the housing lever is connected to the IC adapter. The lowered state along the guide surface 115 is at this time, the elastic portion 86 of the lever is latent elastic force, the force is the force that the head of the lever continues to push the stop surface of the cover. At this time, the height H2 of the upper plate of the thermoelectric element was designed to be the same as or smaller than the IC seating surface S. However, even at this stage, as long as H2 is smaller than S + G1, it is okay to load / unload IC.

The third step is to load the IC. If the IC is dropped into the IC adapter while the cover press amount D3 = D2, the four sides connected to the bottom surface of the IC package are left and right by the guide 111 of the IC adapter. The position is positioned and the bottom face of the IC LEAD 2 is positioned above the seating face 112. At this time, the position H3 of the upper plate of the thermoelectric element is kept the same as H2.

Step 4 is a step in which the operation, which is the purpose of the present invention, is made and the cover is returned to the D4 position while the IC is placed on the seating surface of the adapter. In this position of the cover, the position of the contact portion 92 of the contact is at the moment when it touches the upper surface of the IC LEAD, and at this time, the height of the upper plate 71 of the thermoelectric element does not touch the bottom surface 4 of the IC. It is important. In the present invention, in consideration of the margin, H4 was designed to be lower than or equal to S. In summary, it is important that the contact portion 92 of the contact at the time of IC loading presses the IC LEAD first, and then the top plate 71 of the thermoelectric element contacts the IC bottom surface 4. If the top plate of the thermoelectric element first touches the IC bottom surface and pushes the IC up, as shown in FIG. 31, the contact portion 92 of the contact collides with the end surface of the IC LEAD 2, and thus fails to load. .

Step 5 is the final step of loading, while the contact of the contact presses the IC LEAD and the cover continues to come up by the force of the spring 51, so that D5 becomes zero, and as shown in the enlarged view, the cam of the cover Since the 121 is separated from the head 85 of the housing lever and rises upward, the head of the lever can enter the space formed under the cam of the cover by the elastic energy latent in the elastic portion 86 of the lever. Therefore, the housing and the thermoelectric element are continuously raised upward by the force of the spring 52 so that the upper plate 71 of the thermoelectric element comes into contact with the bottom surface 4 of the IC and adheres to the bottom surface of the IC with a constant force. Done. Therefore, it can be seen that H5 = S + G1. At this time, the head of the lever does not reach the stop surface of the IC adapter. In other words, it can be seen that the position of the upper surface of the thermoelectric element after IC loading is configured to be lower than that of the preparation stage. In addition, the force that the top of the thermoelectric element adheres to the bottom surface of the IC should be smaller than the force of all contacts (54 in the TSOP-54) to press the IC LEADs. The contact portion 101 of the power contact has been in electrical contact with the power terminals 74 and 75 of the thermoelectric element all the time by the elastic force of the elastic portion 102 during the IC loading process.

In the test of the IC's functional performance after step 5, when the power is connected to the thermoelectric element, the thermoelectric element is heated at the top plate, and the temperature of the IC is increased by heating the bottom of the IC. By utilizing the system, the temperature of the IC can be controlled, and the test can be performed while inputting / outputting signals to the IC. When the test of the IC is completed, UNLOADING is performed. In the reverse order of LOADING (5, 4, 3, 2, 1 steps), in this case, the contact part of the contact in the case that the height of the cover goes down from D4 to D3 in step 4 also. The reason why the top of the thermoelectric element should be removed from the bottom of the IC first while pressing the LEAD of the IC is the opposite. In the opposite case, the contact of the contact is momentarily in the IC LEAD while the top of the thermoelectric element is pushing the bottom of the IC. If removed, the IC will bounce off the seat and it will be unclear where it will fall and in what state. In this situation, automatic loading will not be possible.

As described above, the present invention is designed to be the same as the conventional socket that does not have a thermoelectric element in loading / unloading the IC in the socket in the thermoelectric element in the socket TSOP type. After loading the IC, the top of the thermoelectric element is designed to be in close contact with the bottom of the IC so that the heat transfer to the IC is most effective.In the test of the IC, the temperature of the IC can be set even in an indoor environment, not in a chamber. Being able to control and test the system is a big effect of the present invention, which has the effect of devising a socket that can be applied to the mass production of IC, that is, to the LOADING / UNLOADING equipment of the IC. .

Although the present invention is designed for TSOP-54, 66, 86, it is easy to apply and apply to QFP, BLP type and other IC types.

Claims (7)

The housing for accommodating and fixing the thermoelectric element 70 in a thermoelectric element for the purpose of testing while maintaining the temperature of the IC within a predetermined temperature range by heating or cooling the IC therein in the structure of the socket for testing the IC. Operate (80) up and down so that the IC can be loaded / unloaded smoothly. During the operation of loading / unloading the IC into the socket, the top of the thermoelectric element should be separated from the bottom of the IC package. A socket for forming a top plate of a thermoelectric element in close contact with an IC bottom surface for the purpose of facilitating heat transfer and temperature control to an IC during loading and testing. The width of the lower plate is narrower than that of the upper plate in the thermoelectric element. The method of claim 1, wherein in the construction of the thermoelectric element, a terminal having a Korean “c” shape is attached to the power supply terminal on the lower plate. 2. The structure of a housing according to claim 1, wherein in the structure of the housing constituted as a means for operating the housing, a plurality of English letter “L” shaped levers are formed on the side surfaces, and the heads 85 and the stop projections 84 of the levers are elastic. Characterized in that configured to move elastically by the portion (86). The cam 121 and the stop surface 122 are formed on the side wall of the cover 120 as a means for operating the housing for accommodating and fixing the thermoelectric element. Actuate the head 85 of the housing lever to lower the housing, and once the cam has passed past the head of the lever, the stop surface connected to the cam of the cover constrains the head 85 of the housing lever to operate upward. Characterized by. The stopper 114 and the guide surface 115 are formed on both outer sides of the IC adapter 110 as a means for operating the housing for accommodating and fixing the thermoelectric element according to claim 1, so that the stopper is not pressed in the cover. Stop the head of the housing lever to stop the housing from rising upwards, press the cover and the cam moves the lever's head 45 degrees downward, and the stopper 84 of the lever slides 45 degrees downward along the guide surface. After the cam of the cover passes through the head of the lever, the head and the stopping protrusion of the lever are constrained between the stop surface 122 of the cover and the guide surface of the IC adapter to prevent the upward movement. To do. The method of claim 1, wherein the elastic force of the plurality of springs 52 or the power contact 100 is used to bring the top plate of the thermoelectric element into close contact with the IC bottom surface for the purpose of facilitating heat transfer and temperature control to the IC. Characterized.