KR20010057047A - Manufacturing method for buried capacitor pcb - Google Patents

Abstract

PURPOSE: A method for fabricating PCB having built-in capacitor is provided to achieve an improved reliability and packaging density of PCB by integrating the capacitor into the PCB, while allowing the capacitance value required by a user to be easily obtained. CONSTITUTION: A method comprises the steps of forming a board where a dielectric layer is stacked onto a CCL(copper-clad laminate)(120) having one or more copper sheet layers(110) formed beneath and on the CCL, and allowing the board to have the first capacitance value when the CCL is fed with a ground power and power(VCC); allowing the board to have the second capacitance value by depositing a paste to a portion of the copper sheet layer and forming an electrode layer(140) onto at least a portion of the paste; forming an insulation layer(100) by depositing an insulation material onto the paste; forming an opening by penetrating the insulation layer so as to open at least portions of the copper sheet layer and electrode layer; and depositing a conductive material to the opening so as to eclectically connect the electrode layer and the copper sheet layer.

Description

Capacitor embedded printed circuit board manufacturing method {MANUFACTURING METHOD FOR BURIED CAPACITOR PCB}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a printed circuit board having a built-in capacitor in which a function of a capacitor (CAPACITOR), which is a passive component used in various electronic products, is integrated in a board to increase reliability and product density. More specifically, it is characterized in that a capacitor layer having a separate capacitance value is printed on a part or the whole of the capacitance value, so as to obtain capacitances of various capacities.

In general, in the known package substrate, it is important to stably supply the power supply with the energy source to each component in order to operate the electronic circuit normally. Cause of variation is caused.

At this time, when the cause of the voltage fluctuation occurs, in order to prevent the voltage fluctuation to pass through other components other than the desired components to provide a stable power supply by installing a capacitor in the vicinity of the IC to accumulate the charge and to prepare for a sudden change in charge By supplying the accumulated voltage in the case of charge fluctuations, it is possible to prevent the voltage fluctuations in advance and prevent the occurrence of load on each part.

If such a capacitor is not applied, power efficiency decreases and an IC or a transistor is overloaded, which may cause a malfunction. Therefore, one or two capacitors per IC are necessary when designing a circuit.

As shown in Fig. 1, the capacitor CAPACITOR is a dielectric layer made of lattice-shaped fiber and resin between the insulating layer 1 and the two conductive plates 3 composed of the upper and lower copper foil layers 2, respectively. After inserting (4), when the ground power supply GND and the power supply VCC are supplied to the two conductive plates 3, a capacitor having a capacitance that is capable of accumulating charge in response to a voltage is formed. The copper foil layer 2 is laminated | stacked on the uppermost side and the lowermost side of (4), and the mounting pad 7 is attached to the uppermost copper foil layer 2, and it consists of the structure which MLCC8 is connected.

In the package substrate as described above, a dielectric layer 4 made of lattice-shaped fiber and resin is inserted between the insulating layer 1 and the two conductive plates 3 composed of the upper and lower copper foil layers 2, At this time, when the power is supplied through the power supply (VCC) and the ground power supply (GND) formed in the conductor plate (3), charge is accumulated therebetween, and at this time, the MLCC (8) bonded to the upper side of the copper foil layer (4) If the contact voltage fluctuates, supply the voltage stored in the capacitor.

However, the package substrate as described above, only one type of capacitance value can be implemented, so that a user needs to form a separate substrate in order to implement the required capacitance value, and a mounting pad required for mounting the component. There is a problem, such as, the mounting density of the PCB is lowered accordingly, the reliability from the external environment for the additional component is lowered.

The present invention is to improve the conventional problems as described above, the purpose is that the implementation of the capacitance value can be easily implemented by the user can be implemented a variety of capacitance value, and requires a mounting pad for mounting the parts As a result, the mounting density of the PCB is improved, and there is no need for a separate component for mounting, thereby improving reliability from the external environment, and allowing a mixture with a low dielectric constant material to improve the freedom of material selection. It is to provide a substrate manufacturing method.

1 is a schematic diagram showing a capacitor formation state of a conventional package substrate

Figure 2 is a process diagram showing a capacitor formation state of the substrate according to the present invention

Figure 3 is a schematic diagram showing a capacitor formation state according to the present invention

4 is a main structural diagram showing a capacitor formation state of the substrate according to the present invention;

Explanation of symbols on the main parts of the drawings

100 ... insulation layer 110 ... copper foil layer

120 ... CCL 140 ... electrode layer

160 ... opening department

As a technical configuration for achieving the above object, the present invention, the dielectric layer is laminated on one or more CCL, each of which at least one copper foil layer is stacked on the upper and lower sides, the ground power and the power is supplied to the CCL, the first capacitance value Forming a substrate to have;

Applying a face to at least a portion of the upper side of the copper foil layer having the first capacitance value and applying a conductive paste to at least a portion of the upper side to form a capacitance to have a second capacitance value;

Forming an insulating layer by applying an insulating material on the paste;

Processing the insulating layer with a laser or a mechanical drill to form openings for opening electrodes and conductive pastes;

The present invention provides a method for manufacturing a cavity-embedded printed circuit board comprising a step of applying a conductive material to the opening to connect an external circuit.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

2 is a process diagram showing a capacitor formation state of the substrate according to the invention, Figure 3 is a schematic diagram showing a capacitor formation state according to the present invention, Figure 4 is a main portion showing a capacitor formation state of the substrate according to the present invention As a structural diagram, the present invention provides a power source for the CCL 120 via a dielectric layer 130 composed of fiber and resin in a plurality of CCLs 120 having copper foil layers 110 formed on upper and lower sides of the insulating layer 100. VCC) and ground power supply (GND) provide capacitance.

After the paste P is applied to at least a portion of the upper side of the CCL 120, the capacitance is formed by printing the electrode layer 140 made of a conductive paste on at least one side of the upper side.

The insulating layer 150 is formed by applying an insulating material made of resin, RCC, PREPREG, or the like to the outside of the electrode layer 140 and the paste P.

The insulating layer 150 is penetrated by a laser or a mechanical drill to form an opening 160 to open the copper foil layer 110 and the over electrode layer 140.

The electrode layer 140 and the copper foil layer 110 are electrically connected to each other by applying a conductive material to the opening 160 to electrically connect the circuits.

Referring to the operation of the present invention made of such a configuration as follows.

2 to 4, when the CCL 120 formed by laminating the copper foil layer 110 on the upper and lower sides of the insulating layer 100 is laminated by the dielectric layer 130 made of fiber and resin, respectively. When the ground power supply GND and the input power supply VCC are connected and supplied to the CCL 120, a capacitance is formed.

At this time, the paste (P) is applied to form a separate capacitance on the upper side of the copper foil layer 110, the electrode layer 140 made of a conductive paste is printed on at least a portion of the upper side of the copper foil layer 110 between the capacitor The capacitance value is arbitrarily adjusted by adjusting the electrode layer 140.

Subsequently, an insulating layer 150 is formed by applying an insulating material made of resin, RCC, or PREPREG to the upper side of the capacitance formed on the electrode layer 140.

Opening portions 160 penetrating the insulating layer 150 to reach the copper foil layer 110 and the electrode layer 140 by a laser or mechanical drill are formed to open the copper foil layer 110 and the over electrode layer 140. do.

In addition, an electrically conductive material is applied to the open part 160 to electrically connect the electrode layer 140 and the copper foil layer 110 to be electrically connected to each other, thereby enabling connection between other circuits, and an open part to which the conductive material is applied. The parts can be immediately mounted on 160 so that a separate mounting pad is unnecessary.

In addition, a capacitance is formed by the CCL 120 and the dielectric layer 130 made of a high dielectric constant material, and is formed by the paste P and the electrode layer 140 made of a low dielectric constant material on the copper foil layer 110. It will form another capacitance.

As described above, according to the method of manufacturing a capacitor-embedded printed circuit board, it is possible to implement a variety of capacitance values, so that the user can easily implement the required capacitance value, and requires a mounting pad for mounting parts. As a result, the mounting density of the PCB is improved, and there is no need for a separate component for mounting, so the reliability from the external environment is improved, and it is possible to mix and use the material with low dielectric constant to improve the freedom of material selection. have.

While the invention has been shown and described with respect to specific embodiments thereof, it will be apparent to those skilled in the art that various changes and modifications can be made without departing from the spirit or scope of the invention as provided by the following claims. I would like to clarify that those who have knowledge of this can easily know.

Claims (4)

In the capacitor embedded substrate, Forming a substrate having a dielectric layer laminated on at least one CCL in which copper foil layers are stacked on upper and lower sides, and having a first capacitance value when ground power and power are supplied to the CCL; Applying a face to at least a portion of the copper foil layer of the substrate and forming an electrode layer on at least a portion of the copper foil layer to form a capacitance to have a second capacitance value; Forming an insulating layer by applying an insulating material on the paste; Processing the insulating layer to form an opening such that at least a portion of the copper foil layer and the electrode layer are opened; Method of manufacturing a capacitor-embedded printed circuit board comprising the step of applying a conductive material to the open portion and connecting with an external circuit. The method of manufacturing a capacitor-embedded printed circuit board according to claim 1, wherein the insulating material is made of resin. The method of manufacturing a capacitor-embedded printed circuit board according to claim 1, wherein the electrode layer stacked on the paste is formed of a conductive paste. The method of claim 1, wherein the forming of the opening comprises processing an insulating layer by etching.