KR19990063089A - 얇은 원반 모양의 물건을 위한 운반 장치 - Google Patents
얇은 원반 모양의 물건을 위한 운반 장치 Download PDFInfo
- Publication number
- KR19990063089A KR19990063089A KR1019980055221A KR19980055221A KR19990063089A KR 19990063089 A KR19990063089 A KR 19990063089A KR 1019980055221 A KR1019980055221 A KR 1019980055221A KR 19980055221 A KR19980055221 A KR 19980055221A KR 19990063089 A KR19990063089 A KR 19990063089A
- Authority
- KR
- South Korea
- Prior art keywords
- conveying system
- thin disc
- disc shaped
- bracing
- shaped article
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
- B65G47/911—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers with air blasts producing partial vacuum
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
Landscapes
- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
Abstract
Description
Claims (15)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19755694.9 | 1997-12-16 | ||
DE19755694A DE19755694C2 (de) | 1997-12-16 | 1997-12-16 | Handhabungsvorrichtung für dünne, scheibenförmige Gegenstände |
Publications (2)
Publication Number | Publication Date |
---|---|
KR19990063089A true KR19990063089A (ko) | 1999-07-26 |
KR100567496B1 KR100567496B1 (ko) | 2006-08-18 |
Family
ID=7851971
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019980055221A KR100567496B1 (ko) | 1997-12-16 | 1998-12-16 | 얇은 원반 모양의 물건을 위한 운반 장치 |
Country Status (7)
Country | Link |
---|---|
US (1) | US6152507A (ko) |
EP (1) | EP0924148B1 (ko) |
JP (1) | JPH11265926A (ko) |
KR (1) | KR100567496B1 (ko) |
AT (1) | ATE198585T1 (ko) |
DE (2) | DE19755694C2 (ko) |
TW (1) | TW415912B (ko) |
Families Citing this family (54)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19755694C2 (de) * | 1997-12-16 | 2000-05-31 | Sez Semiconduct Equip Zubehoer | Handhabungsvorrichtung für dünne, scheibenförmige Gegenstände |
US6217034B1 (en) * | 1998-09-24 | 2001-04-17 | Kla-Tencor Corporation | Edge handling wafer chuck |
JP4249869B2 (ja) * | 1999-12-22 | 2009-04-08 | 株式会社オーク製作所 | 基板搬送装置 |
DE10056544A1 (de) * | 2000-11-15 | 2002-06-06 | Infineon Technologies Ag | Verfahren und Vorrichtung zum Be- und Entladen von Halbleiterwafern |
US6689418B2 (en) | 2001-08-03 | 2004-02-10 | Applied Materials Inc. | Apparatus for wafer rinse and clean and edge etching |
DE10144409B4 (de) * | 2001-09-10 | 2004-11-18 | Infineon Technologies Ag | Vorrichtung mit einem Greifer zur Handhabung von Platten |
DE10145049C2 (de) | 2001-09-13 | 2003-10-16 | Infineon Technologies Ag | Vorrichtung zum Handhaben von Platten |
US6708701B2 (en) | 2001-10-16 | 2004-03-23 | Applied Materials Inc. | Capillary ring |
US6786996B2 (en) | 2001-10-16 | 2004-09-07 | Applied Materials Inc. | Apparatus and method for edge bead removal |
AU2003283248A1 (en) * | 2002-10-07 | 2004-05-04 | Schott Ag | Extremely thin substrate support |
DE10304425B3 (de) * | 2003-02-04 | 2004-08-05 | Infineon Technologies Ag | Vorrichtung zum Handhaben von Platten |
US20050112279A1 (en) * | 2003-11-24 | 2005-05-26 | International Business Machines Corporation | Dynamic release wafer grip and method of use |
US7938942B2 (en) * | 2004-03-12 | 2011-05-10 | Applied Materials, Inc. | Single side workpiece processing |
US8082932B2 (en) * | 2004-03-12 | 2011-12-27 | Applied Materials, Inc. | Single side workpiece processing |
US20070110895A1 (en) * | 2005-03-08 | 2007-05-17 | Jason Rye | Single side workpiece processing |
DE102004019231A1 (de) * | 2004-04-16 | 2005-11-17 | PROTEC Gesellschaft für Werkstoff- und Oberflächentechnik mbH | Übergabe- und Ladestation für mobile, elektrostatische Substrathalter |
JP4526316B2 (ja) * | 2004-07-16 | 2010-08-18 | 株式会社ディスコ | 被加工物搬送装置 |
US20060040111A1 (en) * | 2004-08-20 | 2006-02-23 | Dolechek Kert L | Process chamber and system for thinning a semiconductor workpiece |
US20060046499A1 (en) * | 2004-08-20 | 2006-03-02 | Dolechek Kert L | Apparatus for use in thinning a semiconductor workpiece |
US7354649B2 (en) | 2004-08-20 | 2008-04-08 | Semitool, Inc. | Semiconductor workpiece |
US7193295B2 (en) * | 2004-08-20 | 2007-03-20 | Semitool, Inc. | Process and apparatus for thinning a semiconductor workpiece |
US7288489B2 (en) * | 2004-08-20 | 2007-10-30 | Semitool, Inc. | Process for thinning a semiconductor workpiece |
DE102004045957A1 (de) * | 2004-09-22 | 2006-04-06 | Singulus Technologies Ag | Vorrichtung zum Halten und Transportieren eines Werkstücks mit einer ebenen Oberfläche |
DE102005023828A1 (de) * | 2005-05-24 | 2006-12-07 | A U E Automations- Und Einstelltechnik Kassel Gmbh | Vorrichtung zum automatisierten Transport einer luftdurchlässigen und nicht magnetischen Filtermatte und/oder Zwischenlage für Dieselrußfilter und Verfahren hierfür |
JP2007157996A (ja) * | 2005-12-05 | 2007-06-21 | Tokyo Seimitsu Co Ltd | ワーク搬送装置及びワーク搬送方法 |
US8104488B2 (en) * | 2006-02-22 | 2012-01-31 | Applied Materials, Inc. | Single side workpiece processing |
JP4853239B2 (ja) * | 2006-11-07 | 2012-01-11 | 三菱電機株式会社 | ウェハ保持装置 |
DE102007009321A1 (de) | 2007-02-22 | 2008-08-28 | Ass Luippold Automation Systems & Services E.K. | Vorrichtung zur Stapelung und/oder Entstapelung dünnflächiger Stapelgüter |
FR2918358B1 (fr) * | 2007-07-06 | 2010-03-05 | Nbs Technologies | Systeme de prehension par le vide |
JP5478604B2 (ja) | 2008-03-31 | 2014-04-23 | エムイーエムシー・エレクトロニック・マテリアルズ・インコーポレイテッド | シリコンウェハの端部をエッチングするための方法 |
CN101590649A (zh) * | 2008-05-26 | 2009-12-02 | 鸿富锦精密工业(深圳)有限公司 | 吸取装置 |
DE102008045255A1 (de) | 2008-09-01 | 2010-03-04 | Rena Gmbh | Vorrichtung und Verfahren zum Transportieren von Substraten |
EP2359390A1 (en) | 2008-11-19 | 2011-08-24 | MEMC Electronic Materials, Inc. | Method and system for stripping the edge of a semiconductor wafer |
JP5370664B2 (ja) * | 2009-09-07 | 2013-12-18 | 村田機械株式会社 | 基板の移載装置、およびその方法 |
DE102009051565A1 (de) * | 2009-10-22 | 2011-04-28 | Alexander Borowski | Ansaug-Greifervorrichtung für flache Substrate |
JP5488037B2 (ja) | 2010-02-23 | 2014-05-14 | 村田機械株式会社 | 移載装置及びワーク載置装置 |
KR101187684B1 (ko) * | 2010-10-25 | 2012-10-04 | 서울과학기술대학교 산학협력단 | 래디얼 플로우를 이용한 비접촉식 기판 척킹용 에어 패드 |
JP5756642B2 (ja) * | 2011-01-31 | 2015-07-29 | オイレス工業株式会社 | 離間距離調整装置およびこれを用いた搬送装置 |
CN102935942B (zh) * | 2011-08-16 | 2015-03-04 | 中芯国际集成电路制造(北京)有限公司 | 电控操作器 |
US8853054B2 (en) | 2012-03-06 | 2014-10-07 | Sunedison Semiconductor Limited | Method of manufacturing silicon-on-insulator wafers |
CN104179781B (zh) * | 2013-05-22 | 2016-03-16 | 由田新技股份有限公司 | 吸附装置及可吸附软性对象的真空吸附设备 |
EP2843695B9 (de) * | 2013-08-28 | 2021-04-14 | Mechatronic Systemtechnik GmbH | Vorrichtung, insbesondere Endeffektor |
JP2015076469A (ja) * | 2013-10-08 | 2015-04-20 | 株式会社ディスコ | ウェーハ搬送装置 |
CN104108605B (zh) * | 2014-07-08 | 2016-08-17 | 深圳市华星光电技术有限公司 | 一种玻璃基板的取放装置 |
US9911640B2 (en) * | 2015-09-01 | 2018-03-06 | Boris Kesil | Universal gripping and suction chuck |
US10373858B2 (en) | 2016-04-06 | 2019-08-06 | Lam Research Corporation | Chuck for edge bevel removal and method for centering a wafer prior to edge bevel removal |
JP7064785B2 (ja) * | 2017-06-20 | 2022-05-11 | 株式会社コスメック | 把持装置 |
US11254014B2 (en) | 2017-07-21 | 2022-02-22 | Electro Scientific Industries, Inc. | Non-contact handler and method of handling workpieces using the same |
CN107512582B (zh) * | 2017-09-25 | 2019-07-26 | 浙江工贸职业技术学院 | 一种磁体成型设备的取料装置 |
US11037809B2 (en) * | 2019-07-17 | 2021-06-15 | Taiwan Semiconductor Manufacturing Co., Ltd. | Transfer device and method for transferring substrate without unexpected rotation |
US11524392B2 (en) | 2020-11-24 | 2022-12-13 | Applied Materials, Inc. | Minimal contact gripping of thin optical devices |
CN114454075B (zh) * | 2021-03-03 | 2022-12-16 | 华中科技大学 | 凸轮驱动的晶圆定位及托起装置 |
GB202215215D0 (en) | 2022-10-14 | 2022-11-30 | Lam Res Ag | Device for conveying a wafer-shaped article |
WO2024168282A1 (en) * | 2023-02-10 | 2024-08-15 | Applied Materials, Inc. | Universal pedestal to support waveguide on optical metrology |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB748138A (en) * | 1953-04-14 | 1956-04-25 | Kodak Ltd | Improved device for handling articles by suction |
US3438668A (en) * | 1965-08-26 | 1969-04-15 | Gen Electric | Contactless lifter |
US3523706A (en) * | 1967-10-27 | 1970-08-11 | Ibm | Apparatus for supporting articles without structural contact and for positioning the supported articles |
DE2609754A1 (de) * | 1976-03-09 | 1977-09-22 | Wacker Chemitronic | Halterung fuer das beidseitig beruehrungslose aufnehmen von scheiben |
JPS5790956A (en) * | 1980-11-28 | 1982-06-05 | Hitachi Ltd | Gripper for wafer |
IT1214033B (it) * | 1987-02-03 | 1990-01-05 | Carlomagno Giovanni Maria | Procedimento e dispositivo per esercitare forze su lastre di vetro, in particolare ad elevata temperatura |
JP2747518B2 (ja) * | 1988-12-09 | 1998-05-06 | 住友シチックス株式会社 | ウエーハのハンドリング装置 |
JPH02312256A (ja) * | 1989-05-26 | 1990-12-27 | Sumitomo Metal Ind Ltd | ウエハ保持装置 |
US5106138A (en) * | 1989-06-05 | 1992-04-21 | Hewlett-Packard Company | Linear tweezers |
DE3919611A1 (de) * | 1989-06-15 | 1990-12-20 | Wacker Chemitronic | Haltevorrichtung zur aufnahme von scheibenfoermigen gegenstaenden, insbesondere halbleiterscheiben, und verfahren zu deren behandlung |
US4969676A (en) * | 1989-06-23 | 1990-11-13 | At&T Bell Laboratories | Air pressure pick-up tool |
JPH03238245A (ja) * | 1990-02-14 | 1991-10-24 | Sumitomo Metal Ind Ltd | 試料保持装置 |
DE4039313A1 (de) * | 1990-12-04 | 1992-08-20 | Hamatech Halbleiter Maschinenb | Transportvorrichtung fuer substrate |
JPH081922B2 (ja) * | 1991-01-25 | 1996-01-10 | 株式会社東芝 | ウェハ−保持装置 |
JPH0640560A (ja) * | 1992-03-03 | 1994-02-15 | Hiroshi Akashi | 無接触保持装置 |
JP2633798B2 (ja) * | 1993-08-26 | 1997-07-23 | シーケーディ株式会社 | 板状部材把持装置 |
AT640U1 (de) * | 1993-10-22 | 1996-02-26 | Sez Semiconduct Equip Zubehoer | Greifer für halbleiterwafer und andere scheibenförmige gegenstände |
DE19529537A1 (de) * | 1995-08-11 | 1997-02-13 | Leybold Ag | Vorrichtung zum Greifen und Halten eines flachen Substrats |
DE19755694C2 (de) * | 1997-12-16 | 2000-05-31 | Sez Semiconduct Equip Zubehoer | Handhabungsvorrichtung für dünne, scheibenförmige Gegenstände |
-
1997
- 1997-12-16 DE DE19755694A patent/DE19755694C2/de not_active Expired - Fee Related
-
1998
- 1998-11-20 AT AT98122050T patent/ATE198585T1/de active
- 1998-11-20 EP EP98122050A patent/EP0924148B1/de not_active Expired - Lifetime
- 1998-11-20 DE DE59800429T patent/DE59800429D1/de not_active Expired - Lifetime
- 1998-12-10 TW TW087120526A patent/TW415912B/zh not_active IP Right Cessation
- 1998-12-14 JP JP10377811A patent/JPH11265926A/ja active Pending
- 1998-12-15 US US09/211,414 patent/US6152507A/en not_active Expired - Lifetime
- 1998-12-16 KR KR1019980055221A patent/KR100567496B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
ATE198585T1 (de) | 2001-01-15 |
EP0924148A1 (de) | 1999-06-23 |
DE19755694A1 (de) | 1999-06-24 |
TW415912B (en) | 2000-12-21 |
DE19755694C2 (de) | 2000-05-31 |
DE59800429D1 (de) | 2001-02-15 |
US6152507A (en) | 2000-11-28 |
EP0924148B1 (de) | 2001-01-10 |
JPH11265926A (ja) | 1999-09-28 |
KR100567496B1 (ko) | 2006-08-18 |
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