KR19990037268A - 이방도전성 접착제 및 접착용 막 - Google Patents
이방도전성 접착제 및 접착용 막 Download PDFInfo
- Publication number
- KR19990037268A KR19990037268A KR1019980044116A KR19980044116A KR19990037268A KR 19990037268 A KR19990037268 A KR 19990037268A KR 1019980044116 A KR1019980044116 A KR 1019980044116A KR 19980044116 A KR19980044116 A KR 19980044116A KR 19990037268 A KR19990037268 A KR 19990037268A
- Authority
- KR
- South Korea
- Prior art keywords
- particles
- conductive particles
- average particle
- anisotropic conductive
- particle diameter
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/291—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/29101—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of less than 400°C
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29298—Fillers
- H01L2224/29399—Coating material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29298—Fillers
- H01L2224/29499—Shape or distribution of the fillers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01049—Indium [In]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0105—Tin [Sn]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/0665—Epoxy resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0221—Insulating particles having an electrically conductive coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0224—Conductive particles having an insulating coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0233—Deformable particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0263—Details about a collection of particles
- H05K2201/0266—Size distribution
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
- Y10T428/2991—Coated
- Y10T428/2998—Coated including synthetic resin or polymer
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
- Wire Bonding (AREA)
Abstract
Description
Claims (13)
- 절연성 접착제 중에 도전입자가 분산된 이방(異方)도전성 접착제로서,상기 도전입자는 평균 입경(粒徑)이 상이한 2종 이상의 도전입자이고, 또한 이들 도전입자는 절연성 접착제에 불용(不溶)인 절연성 수지로 피복된 절연피복도전입자인 것을 특징으로 하는 이방도전성 접작제.
- 제1항에 있어서, 평균 입경이 상이한 2종 이상의 도전입자가 가압에 의해 변형되는 입자인 것을 특징으로 하는 이방도전성 접착제.
- 제1항 또는 제2항에 있어서, 평균 입경이 작은 도전입자의 경도(硬度)가, 평균 입경이 큰 도전입자와 동등하거나, 그 이상의 경도를 가지는 것을 특징으로 하는 이방도전성 접착제.
- 제1항 내지 제3항 중 어느 한 항에 있어서, 평균 입경이 작은 도전입자의 K값이 350㎏/㎟ 이상, 평균 입경이 큰 도전입자의 K값이 450㎏/㎟ 이하이고, 평균 입경이 작은 도전입자의 K값이 평균 입경이 큰 도전입자의 K값보다 상대적으로 큰 것을 특징으로 하는 이방도전성 접착제.
- 제1항 내지 제4항 중 어느 한 항에 있어서, 평균 입자경이 작은 도전입자의 함유 개수가 평균 입경이 큰 도전입자의 함유 개수보다 많은 것을 특징으로 하는 이방도전성 접착제.
- 제1항 내지 제5항 중 어느 한 항에 있어서, 평균 입경이 3±0.5㎛와 5±0.5㎛의 2종류의 도전입자가 분산되어 이루어지는 것을 특징으로 하는 이방도전성 접착제.
- 제1항 내지 제6항 중 어느 한 항에 있어서, IC칩과 회로기판과를 접속하는 IC칩 접속용인 것을 특징으로 하는 이방도전성 접착제.
- 제1항 내지 제7항 중 어느 한 항에 있어서, IC칩에 형성된 4000㎛2이하의 미소(微小)범프와 회로기판과를 접속하는 IC칩 접속용인 것을 특징으로 하는 이방도전성 접착제.
- 제1항 내지 제8항 중 어느 한 항에 기재된 이방도전성 접착제로 이루어지는 것을 특징으로 하는 이방도전성 접착용 막(膜).
- 제9항에 있어서, IC칩과 회로기판과를 접속하는 IC칩 접속용인 것을 특징으로 하는 이방도전성 접착용 막.
- 제9항에 있어서, IC칩에 형성된 4000㎛2이하의 미소범프와 회로기판과를 접속하는 IC칩 접속용인 것을 특징으로 하는 이방도전성 접착용 막.
- 제9항 내지 제11항 중 어느 한 항에 있어서, 단위 면적당의 막 중에 함유되는 평균 입경이 작은 도전입자의 함유량이 30000∼80000개/㎟의 범위이고, 평균 입경이 큰 도전입자의 함유량이 10000∼30000개/㎟의 범위인 것을 특징으로 하는 이방도전성 접착용 막.
- 제9항 내지 제12항 중 어느 한 항에 있어서, 막의 두께가 접속을 행하는 IC칩의 범프 높이와 회로기판 상의 배선패턴의 높이와를 합친 막에 대하여 1∼3배인 것을 특징으로 하는 이방도전성 접착용 막.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP97-296005 | 1997-10-28 | ||
JP29600597 | 1997-10-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR19990037268A true KR19990037268A (ko) | 1999-05-25 |
KR100539060B1 KR100539060B1 (ko) | 2007-04-25 |
Family
ID=17827907
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019980044116A KR100539060B1 (ko) | 1997-10-28 | 1998-10-21 | 이방도전성접착제및접착용막 |
Country Status (2)
Country | Link |
---|---|
US (1) | US5965064A (ko) |
KR (1) | KR100539060B1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20170091686A (ko) * | 2015-01-13 | 2017-08-09 | 데쿠세리아루즈 가부시키가이샤 | 다층 기판 |
Families Citing this family (57)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100574215B1 (ko) * | 1997-04-17 | 2006-04-27 | 세키스이가가쿠 고교가부시키가이샤 | 도전성 미립자 |
US6495069B1 (en) * | 1998-01-30 | 2002-12-17 | Peratech Limited Of A Company Of Great Britain And Northern Ireland | Polymer composition |
US6137164A (en) * | 1998-03-16 | 2000-10-24 | Texas Instruments Incorporated | Thin stacked integrated circuit device |
JP2000113919A (ja) * | 1998-08-03 | 2000-04-21 | Sony Corp | 電気的接続装置と電気的接続方法 |
WO2000036886A1 (fr) | 1998-12-16 | 2000-06-22 | Ibiden Co., Ltd. | Tige de connexion conductrice et plaquette de boitier |
JP2000214804A (ja) * | 1999-01-20 | 2000-08-04 | Fuji Photo Film Co Ltd | 光変調素子及び露光装置並びに平面表示装置 |
JP2001031929A (ja) * | 1999-07-21 | 2001-02-06 | Sony Chem Corp | 接続構造体 |
JP2001049228A (ja) * | 1999-08-12 | 2001-02-20 | Sony Chem Corp | 低温硬化型接着剤及びこれを用いた異方導電性接着フィルム |
CN101906274B (zh) * | 1999-08-25 | 2012-05-30 | 日立化成工业株式会社 | 粘合剂,配线端子的连接方法和配线结构体 |
JP3738655B2 (ja) * | 2000-03-31 | 2006-01-25 | ソニーケミカル株式会社 | 異方性導電接着材料及び接続方法 |
US6703566B1 (en) * | 2000-10-25 | 2004-03-09 | Sae Magnetics (H.K.), Ltd. | Bonding structure for a hard disk drive suspension using anisotropic conductive film |
TW554191B (en) * | 2000-12-16 | 2003-09-21 | Au Optronics Corp | Laminating structure and its forming method |
US6436345B1 (en) * | 2001-03-23 | 2002-08-20 | Chemtreat, Inc. | Method for generating chlorine dioxide |
US6923882B2 (en) * | 2001-03-26 | 2005-08-02 | Honeywell International Inc. | Compliant pre-form interconnect |
GB0113905D0 (en) | 2001-06-07 | 2001-08-01 | Peratech Ltd | Analytical device |
TW531868B (en) * | 2001-08-21 | 2003-05-11 | Au Optronics Corp | Soldering type anisotropic conductive film |
US7170062B2 (en) * | 2002-03-29 | 2007-01-30 | Oy Ajat Ltd. | Conductive adhesive bonded semiconductor substrates for radiation imaging devices |
US6777071B2 (en) * | 2002-04-25 | 2004-08-17 | Micron Technology, Inc. | Electrical interconnect using locally conductive adhesive |
US6838022B2 (en) * | 2002-07-25 | 2005-01-04 | Nexaura Systems, Llc | Anisotropic conductive compound |
US6733613B2 (en) * | 2002-07-25 | 2004-05-11 | S. Kumar Khanna | Method for curing an anisotropic conductive compound |
US6909100B2 (en) | 2002-07-25 | 2005-06-21 | Ii-Vi Incorporated | Radiation detector assembly |
TWI270835B (en) * | 2002-10-29 | 2007-01-11 | Matsushita Electric Ind Co Ltd | Display device and generation method of image display particle |
JP4539813B2 (ja) * | 2003-08-19 | 2010-09-08 | ソニーケミカル&インフォメーションデバイス株式会社 | 絶縁被覆導電粒子 |
EP1542272B1 (en) * | 2003-10-06 | 2016-07-20 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
JP2005194393A (ja) * | 2004-01-07 | 2005-07-21 | Hitachi Chem Co Ltd | 回路接続用接着フィルム及び回路接続構造体 |
KR20050079399A (ko) * | 2004-02-05 | 2005-08-10 | 삼성전자주식회사 | 이방성도전필름 및 범프와, 이를 갖는 반도체 칩의 실장구조체 |
JP5099284B2 (ja) * | 2005-02-24 | 2012-12-19 | ソニーケミカル&インフォメーションデバイス株式会社 | 異方性接続シート材料 |
US20070023901A1 (en) * | 2005-07-29 | 2007-02-01 | Gerard Mahoney | Microelectronic bond pad |
JP4428355B2 (ja) * | 2006-03-30 | 2010-03-10 | Tdk株式会社 | 電子部品の評価方法 |
JP4830744B2 (ja) * | 2006-09-15 | 2011-12-07 | パナソニック株式会社 | 電子部品実装用接着剤及び電子部品実装構造体 |
JP4737177B2 (ja) * | 2006-10-31 | 2011-07-27 | 日立化成工業株式会社 | 回路接続構造体 |
JP4922800B2 (ja) * | 2007-03-19 | 2012-04-25 | 株式会社東芝 | 電子機器の製造方法 |
EP2148393A4 (en) * | 2007-05-15 | 2012-03-28 | Hitachi Chemical Co Ltd | CIRCUIT CONNECTING MATERIAL AND CONNECTING STRUCTURE FOR A CIRCUIT ELEMENT |
JP5363989B2 (ja) * | 2007-10-22 | 2013-12-11 | 日本化学工業株式会社 | 被覆導電性粉体およびそれを用いた導電性接着剤。 |
JPWO2009063827A1 (ja) * | 2007-11-12 | 2011-03-31 | 日立化成工業株式会社 | 回路接続材料、及び回路部材の接続構造 |
TWI334746B (en) * | 2008-03-31 | 2010-12-11 | Raydium Semiconductor Corp | Assembly structure |
US20090278213A1 (en) | 2008-05-08 | 2009-11-12 | International Business Machines Corporation | Electrode arrays and methods of fabricating the same using printing plates to arrange particles in an array |
JP4877535B2 (ja) * | 2009-06-15 | 2012-02-15 | 住友電気工業株式会社 | プリント配線板における電極の接続構造、これに用いる導電性接着剤及び電子機器 |
KR101025620B1 (ko) * | 2009-07-13 | 2011-03-30 | 한국과학기술원 | 초음파 접합용 이방성 전도성 접착제 및 이를 이용한 전자부품 간 접속방법 |
US9469790B2 (en) | 2009-09-29 | 2016-10-18 | The Boeing Company | Adhesive compositions comprising electrically insulating-coated carbon-based particles and methods for their use and preparation |
CN102859797B (zh) * | 2010-04-22 | 2015-05-20 | 积水化学工业株式会社 | 各向异性导电材料及连接结构体 |
JP5540916B2 (ja) * | 2010-06-15 | 2014-07-02 | デクセリアルズ株式会社 | 接続構造体の製造方法 |
JP5650611B2 (ja) * | 2011-08-23 | 2015-01-07 | デクセリアルズ株式会社 | 異方性導電フィルム、異方性導電フィルムの製造方法、接続方法、及び接合体 |
KR101447125B1 (ko) | 2011-12-22 | 2014-10-06 | 제일모직 주식회사 | 이방성 도전 필름 |
GB201212489D0 (en) | 2012-07-13 | 2012-08-29 | Conpart As | Improvements in conductive adhesives |
JP2014065766A (ja) * | 2012-09-24 | 2014-04-17 | Dexerials Corp | 異方性導電接着剤 |
CN103000779B (zh) * | 2012-09-24 | 2015-01-07 | 安徽三安光电有限公司 | 具有电流阻挡功能的垂直发光二极管及其制作方法 |
JP6358535B2 (ja) * | 2013-04-26 | 2018-07-18 | パナソニックIpマネジメント株式会社 | 配線板間接続構造、および配線板間接続方法 |
US9777197B2 (en) | 2013-10-23 | 2017-10-03 | Sunray Scientific, Llc | UV-curable anisotropic conductive adhesive |
US9365749B2 (en) | 2013-05-31 | 2016-06-14 | Sunray Scientific, Llc | Anisotropic conductive adhesive with reduced migration |
DE102013219688B3 (de) * | 2013-09-30 | 2015-02-05 | Robert Bosch Gmbh | Wärmeleitfähiges Verbindungsmittel, Verbindungsanordnung und Verfahren zum Herstellen einer wärmeleitenden Verbindung |
JP6106148B2 (ja) | 2013-11-27 | 2017-03-29 | 日東電工株式会社 | 導電性粘着テープ、電子部材及び粘着剤 |
FR3038446B1 (fr) | 2015-07-01 | 2017-07-21 | Hydromecanique & Frottement | Materiau composite conducteur elabore a partir de poudres revetues |
FR3042305B1 (fr) | 2015-10-13 | 2019-07-26 | Arkema France | Procede de fabrication d'un materiau composite conducteur et materiau composite ainsi obtenu |
US10177265B2 (en) * | 2016-01-04 | 2019-01-08 | The Boeing Company | Bonding using conductive particles in conducting adhesives |
JP6945276B2 (ja) * | 2016-03-31 | 2021-10-06 | デクセリアルズ株式会社 | 異方性導電接続構造体 |
US10411218B2 (en) * | 2017-10-30 | 2019-09-10 | Wuhun China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Quasi crystalline conductive particles between a substrate and IC chip |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5001542A (en) * | 1988-12-05 | 1991-03-19 | Hitachi Chemical Company | Composition for circuit connection, method for connection using the same, and connected structure of semiconductor chips |
JP2954241B2 (ja) * | 1989-09-13 | 1999-09-27 | 住友ベークライト株式会社 | 異方導電フィルム |
US5225966A (en) * | 1991-07-24 | 1993-07-06 | At&T Bell Laboratories | Conductive adhesive film techniques |
-
1998
- 1998-10-21 KR KR1019980044116A patent/KR100539060B1/ko not_active IP Right Cessation
- 1998-10-21 US US09/176,167 patent/US5965064A/en not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20170091686A (ko) * | 2015-01-13 | 2017-08-09 | 데쿠세리아루즈 가부시키가이샤 | 다층 기판 |
US11901325B2 (en) | 2015-01-13 | 2024-02-13 | Dexerials Corporation | Multilayer substrate |
Also Published As
Publication number | Publication date |
---|---|
KR100539060B1 (ko) | 2007-04-25 |
US5965064A (en) | 1999-10-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100539060B1 (ko) | 이방도전성접착제및접착용막 | |
JP3296306B2 (ja) | 異方導電性接着剤および接着用膜 | |
KR101042869B1 (ko) | 이방도전성 접착 필름 및 접속체의 제조 방법 | |
KR100861757B1 (ko) | 이방성 도전 접속 재료 | |
KR100388770B1 (ko) | 회로 부재 접속용 접착제 및 회로판 및 그의 제조 방법 | |
JP3624818B2 (ja) | 異方性導電接続材料、接続体、およびその製造方法 | |
CN104106182B (zh) | 各向异性导电连接材料、连接结构体、连接结构体的制造方法和连接方法 | |
KR20100009591A (ko) | 접합체, 이 접합체의 제조 방법, 및 이 접합체에 이용되는 이방성 도전막 | |
EP1138737B1 (en) | Anisotropically electroconductive adhesive material and connecting method | |
KR100694529B1 (ko) | 전기전도성 입자 및 접착제 | |
KR102517498B1 (ko) | 도전 재료, 및 접속체의 제조 방법 | |
KR100594340B1 (ko) | 접속 재료 | |
KR101464807B1 (ko) | 접착 필름 | |
KR101163436B1 (ko) | 절연 피복 도전 입자 | |
JP3581618B2 (ja) | 導電性微粒子、異方性導電接着剤及び導電接続構造体 | |
KR102573777B1 (ko) | 접착제 조성물 및 접속체의 제조 방법 | |
EP0996321B1 (en) | Anisotropically electroconductive adhesive and adhesive film | |
JPH08167328A (ja) | 異方導電フィルム | |
JP2001155540A (ja) | 導電性微粒子、異方性導電接着剤及び導電接続構造体 | |
JP4055583B2 (ja) | 回路接続用接着剤組成物、これを用いた回路端子の接続方法及び回路端子の接続構造 | |
JPS63110506A (ja) | 異方性導電シ−ト | |
JPH09153516A (ja) | 半導体装置及びicチップの検査方法 | |
KR100593848B1 (ko) | 절연 전도성 미립자 및 이를 이용한 이방 전도성 필름 | |
KR0178129B1 (ko) | 이방 도전성 필름 | |
KR20060041090A (ko) | 이방성 도전 접속용 도전입자 및 이방성 도전필름 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20121130 Year of fee payment: 8 |
|
FPAY | Annual fee payment |
Payment date: 20131210 Year of fee payment: 9 |
|
FPAY | Annual fee payment |
Payment date: 20141205 Year of fee payment: 10 |
|
FPAY | Annual fee payment |
Payment date: 20151118 Year of fee payment: 11 |
|
FPAY | Annual fee payment |
Payment date: 20161123 Year of fee payment: 12 |
|
FPAY | Annual fee payment |
Payment date: 20171117 Year of fee payment: 13 |
|
EXPY | Expiration of term |