KR19980058412A - Multilayer Multi-chip Module Semiconductor Device and Manufacturing Method Thereof - Google Patents

Abstract

The present invention discloses a multilayered multi-chip module semiconductor device in which a plurality of semiconductor chips are formed into one multi-chip module using a tap tape, and the heat generated from the semiconductor chip can be smoothly discharged to the outside. In the disclosed multi-chip module semiconductor device, a tab tape having circuits formed on both surfaces thereof, and a pair of semiconductor chips each of which a conductive pad is electrically connected to circuits formed on each of the both sides of the tap tape, are sequentially attached. A first heat dissipation member interposed between the plurality of stacked semiconductor chips, the pair of semiconductor chips and another pair of semiconductor chips adjacent to each other, and radiating heat generated from the semiconductor chips; A second heat dissipation member attached to an upper portion of the pair of semiconductor chips and dissipating heat generated from the semiconductor chips, and both ends of the tab tape are electrically connected to terminals of the printed circuit board for mounting the multi-chip module semiconductor device. It is characterized in that connected to.

Description

Multilayer Multi-chip Module Semiconductor Device and Manufacturing Method Thereof

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multi-chip module, and more particularly, to a stacked multi-chip module semiconductor device and a manufacturing method thereof.

Generally, in order to arrange and connect unit cells designed in a chip manufacturing process of a semiconductor device, selective introduction of impurities into predetermined portions of a semiconductor substrate, a lamination process of laminating an insulating layer and a conductive layer, and a pattern mask process are sequentially performed. An integrated circuit is formed on the chip of.

The integrated circuit chip thus formed is sent to an assembly process and packaged in a single chip or module form.

1 is a cross-sectional view of a multi-chip module semiconductor device according to the prior art.

Referring to FIG. 1, an individual semiconductor chip 3 having an integrated circuit formed thereon is attached by a double-sided adhesive 2 on a printed circuit board 1 having the circuit printed thereon, and a pad of the semiconductor chip 3. Is bonded by conductive terminals and wires 4 printed on the printed circuit board 1. In order to protect the bonded wire 4 and the semiconductor chip 3, the plurality of semiconductor chips 3, the wires 4 and the exposed printed circuit board 1 are molded by the molding compound 5.

However, such a conventional multi-chip module semiconductor device requires a large area on the printed circuit board 1 to achieve multi-chip. In addition, since the molding compound 5 is made of a material of plastic, there is a disadvantage that the heat generated during operation of the semiconductor device is not smoothly made.

In order to solve the above-mentioned second problem, a technique of forming a semiconductor chip into a multilayer using ceramic materials and then connecting the semiconductor chips has been proposed, but this has a disadvantage in that the manufacturing cost is high and economic efficiency is low.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and connects a plurality of semiconductor chips using a tab formed tape (TAB) tape and an anisotropic conductive film (ACF) adhesive. By stacking these and mounting the lowermost semiconductor chip and both ends of the tab tape on the printed circuit board, the multilayer chip module semiconductor device which can realize multi-chip modularization with small size and low manufacturing cost, and small area and low manufacturing cost. And its manufacturing method.

1 is a cross-sectional view of a multi-chip module semiconductor device according to the prior art.

2 to 4 are views showing a process for manufacturing a multi-chip module semiconductor device according to an embodiment of the present invention.

5 is a cross-sectional view illustrating a state in which a multi-chip module semiconductor device completed through the process illustrated in FIGS. 2 to 4 is mounted on a printed circuit board.

* Explanation of symbols for the main parts of the drawings

11 printed circuit board, 12 first heat dissipation member, 13 heat conductive adhesive, 14A F, 15 tab tape, 16 semiconductor chip, 17 second heat dissipation member

According to the present invention, a stacked multi-chip module semiconductor device sequentially includes a tab tape having circuits formed on both surfaces thereof, and a pair of semiconductor chips each of which a conductive pad is electrically connected to circuits formed on each of both sides of the tape tape. A first heat dissipation member interposed between the plurality of semiconductor chips stacked with each other, the pair of semiconductor chips and another pair of semiconductor chips adjacent to each other, and dissipating heat generated from the semiconductor chips; A second heat dissipation member attached to an upper portion of the pair of semiconductor chips formed to dissipate heat generated from the semiconductor chips, and both ends of the tab tape are electrically connected to a terminal of a printed circuit board for mounting the chip module semiconductor device. It is characterized in that connected to.

According to another aspect of the present invention, a method of manufacturing a stacked multi-chip module semiconductor device includes a pair of tab tapes electrically connected to each side of a tab tape having circuits formed on both sides at predetermined intervals, and then at the predetermined intervals. Stacking the semiconductor chips one by one such that the portions are bent; Inserting and fixing a first heat dissipation member that radiates heat generated from the semiconductor chip between the pair of semiconductor chips and another pair of adjacent semiconductor chips; Attaching a second heat dissipation member on top of the pair of semiconductor chips formed on top of the plurality of semiconductor chips, the second heat dissipation member dissipating heat generated from the semiconductor chip, wherein both ends of the tab tape are mounted on the printed circuit board. It is characterized in that it is electrically connected to the terminal.

EXAMPLE

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

2 to 4 are views showing a process for manufacturing a multi-chip module semiconductor device according to an embodiment of the present invention, Figure 5 is a multi-chip module semiconductor device completed through the process shown in Figures 2 to 4 This is a cross-sectional view showing a state mounted on a printed circuit board.

Referring to FIG. 2, after the semiconductor integrated circuit is formed thereon, gold (Au) is deposited on a pad of each chip of the fab-out wafer to a predetermined thickness, and gold is removed by etching the portions except the top of the pad. Thus, bumpers (not shown) are formed on the pads. Thereafter, the wafer is separated into individual flip chips 16 through a chip cutting process.

A plurality of flip chips 16 prepared as described above are electrically connected to each other by the ACF 14 one by one on the upper and lower surfaces of a predetermined region of the long tab tape 15 having circuits formed on both surfaces thereof. The pair of semiconductor chips 16 are electrically connected and fixed by the AC 14 at a predetermined distance from the pair connected to the predetermined region of the tab tape 15. Thus, the number of the pair of semiconductor chips 16 connected in pairs is appropriately selected in consideration of the load and height at the time of lamination.

Referring to FIG. 4, the semiconductor chips 16 connected in pairs are zigzag stacked in a state in which the tab tape 15 is connected, and a pair of stacked semiconductor chips 16 and another pair of adjacent semiconductor chips 16 illustrated in FIG. As described above, the pad of the adjacent semiconductor chip 16 is attached to the surface where the fork-shaped first heat dissipation member 12 is inserted. Since heat is always generated from the semiconductor chip 16 during the operation of the semiconductor chip 16, the adhesive used for the attachment between the first heat dissipation member 12 and the semiconductor chip 16 is a thermally conductive adhesive 13 having good heat dissipation. ). The first heat dissipation member 12 is inserted into the fork-shaped blade portion to the heat dissipation function, the handle portion is a heat transfer function, so as to zigzag position in the order in which the blade portion is laminated in order to maximize the heat dissipation effect.

On the other hand, the tab tape 15 used for electrical connection between the pair of semiconductor chips 16 and the pair of semiconductor chips 16 has a long end drawn out from the semiconductor chip in consideration of the stacking height of one end thereof connected to the upper side. And the other side connected to the lower side is drawn out relatively short.

FIG. 5 is a view illustrating a state in which the multi-chip module semiconductor device formed through the above process is completed and mounted on the printed circuit board 11.

Referring to FIG. 5, when the manufacturing process up to FIG. 4 is completed, prior to mounting, the surface disposed at the top of the stacked semiconductor chip 16 has a second heat dissipation having irregularities on the top to dissipate heat generated therein. The member 17 is adhere | attached using the thermally conductive adhesive 13 which heat-releases well. Thereafter, the long side and the short side of the tab tape 15 are electrically connected to the terminals of the printed circuit board 11, thereby completing the mounting of the multi-module chip semiconductor device.

As described above, the multi-chip module semiconductor device of the present invention enables the mounting of a plurality of semiconductor chips in a narrow space, whereby the device on which the semiconductor chip is mounted can be made light and short.

In addition, by using a flip chip, it is possible to reduce the height of the module by minimizing the height between each layer when stacked in multiple layers.

In addition, since a plurality of flip chips are mounted and heat generated during their operation can be quickly released to the outside, reliability of the semiconductor chip with respect to heat can be improved.

In addition, by using the tab tape as an outlead, the mounting is free at any site, and by bonding the semiconductor chip and the chip to AC E, the signal processing speed can be shortened as compared with the bonding by the bonding wire.

Moreover, since the manufacturing can be performed by a simple process, the manufacturing cost can be reduced.

Although specific embodiments of the present invention have been described and illustrated herein, modifications and variations can be made by those skilled in the art. Accordingly, the following claims are to be understood as including all modifications and variations as long as they fall within the true spirit and scope of the present invention.

Claims (8)

A plurality of semiconductor chips in which a tab tape having circuits formed on both surfaces thereof, and a pair of semiconductor chips each of which a conductive pad is electrically connected to a circuit formed on each of both surfaces of the tab tape, and are attached to each other, are sequentially stacked; A first heat dissipation member inserted between the semiconductor chip and another pair of adjacent semiconductor chips to dissipate heat generated from the semiconductor chip, and attached to an upper portion of the pair of semiconductor chips formed on top of the plurality of semiconductor chips, And a second heat dissipation member for dissipating heat generated from a chip, wherein both ends of the tab tape are electrically connected to terminals of a printed circuit board for mounting the multi-chip module semiconductor device. Device. The multilayer multi-chip module semiconductor device according to claim 1, wherein the first heat dissipation member has a fork shape, and a blade portion thereof is inserted outside the semiconductor chip, and a handle portion is inserted between the pair of semiconductor chips. The multilayer multi-chip module semiconductor device according to claim 2, wherein the first heat dissipation member is inserted in a zigzag manner in the order in which the fork-shaped blade portions are stacked. The multilayer chip module of claim 1, wherein the second heat dissipation member has a flat bottom surface coupled with a semiconductor chip, and a top surface thereof has an uneven structure. The multilayer multi-chip module semiconductor device of claim 1, wherein the semiconductor chip is a flip chip. Electrically connecting a pair of pairs of circuit chips on both sides of the tab tape at predetermined intervals, and stacking the semiconductor chips one by one so as to bend the tape portions at the predetermined intervals; Inserting and fixing a first heat dissipation member that radiates heat generated from the semiconductor chip between the pair of semiconductor chips and another pair of adjacent semiconductor chips; Attaching a second heat dissipation member on top of the pair of semiconductor chips formed on top of the plurality of semiconductor chips, the second heat dissipation member dissipating heat generated from the semiconductor chip, wherein both ends of the tab tape are mounted on the printed circuit board. A method of manufacturing a stacked multi-chip module semiconductor device, characterized in that it is electrically connected to the terminal of. The method of claim 6, wherein the semiconductor chip and the tab tape are fixed by an AFC. 7. The method of claim 6, wherein a thermally conductive adhesive is used to fix the first heat dissipation member and the second heat dissipation member to the semiconductor chip.