KR102722823B1 - Heat sink for test socket - Google Patents

Abstract

The present invention relates to a heat dissipation device for a test socket. The heat dissipation device is applied to a test socket including a socket portion into which a semiconductor package is inserted and tested, and a cover portion arranged around the socket portion. The heat dissipation device may include a heat dissipation cover portion that contacts an upper surface of a semiconductor package inserted into the socket portion to fix the semiconductor package and dissipate heat generated from the semiconductor package, and a cover shell that conducts heat from the socket portion to an outer surface of the cover portion to dissipate heat.

Description

Heat sink for test socket

The present invention relates to a heat dissipation device for a test socket, and more specifically, to a heat dissipation device applied to a test socket for testing a semiconductor package.

Typically, surface mount semiconductor devices (SMT), such as IC devices or IC packages, are made up of types such as LGA (Land Grid Array), BGA (Ball Grid Array), and CSP (Chip Sized Package), and they undergo burn-in tests to confirm reliability before being shipped to customers.

In other words, a burn-in test is a test performed on the performance of a semiconductor device before it is applied to an electronic device, and can be performed under conditions of higher temperature and voltage than normal operating conditions. This burn-in test can be performed while the semiconductor device is mounted in a burn-in test socket (or referred to as a “burn-in socket”).

Patent No. 10-2219529 (registered on February 18, 2021, semiconductor burn-in test device having a heat dissipation structure) includes a structure for dissipating heat generated during a semiconductor burn-in test process.

More specifically, the above registered patent proposes a structure for adding a number of heat-conducting bars and bonding the heat-conducting bars to a socket and a board to perform heat dissipation.

However, the heat dissipation structure has a multi-layer structure and is placed between the socket and the test board, making the structure complex, and there is a disadvantage in that the test device must be redesigned to apply the heat dissipation structure.

In other words, the existing test device cannot be used as is, and a new device with a new structure, such as a heat dissipation induction hole and an air-cooling air induction groove, must be manufactured to apply the heat dissipation structure.

In addition, the above registered patent has a structure in which heat dissipation of the socket unit is impossible, which means that it is a structure that cannot directly dissipate the heat generated from the semiconductor package during the testing process, and therefore, there was a problem in that the heat dissipation efficiency was relatively low.

The technical problem that the present invention seeks to solve in consideration of the above problems is to provide a heat dissipation device for a test socket capable of directly dissipating heat from a semiconductor package that generates heat during a test process.

In addition, the semiconductor package of the present invention proposes a heat dissipation structure that can be easily applied to an existing socket, thereby providing a heat dissipation device for a test socket that can improve heat dissipation performance while utilizing an existing test socket as is without replacing the socket.

In order to solve the above-described problem, the heat dissipation device of the test socket of the present invention is a heat dissipation device applied to a test socket including a socket portion in which a semiconductor package is inserted and tested, and a cover portion arranged around the socket portion, and may include a heat dissipation cover portion that contacts the upper surface of a semiconductor package inserted into the socket portion to fix the semiconductor package and dissipate heat generated from the semiconductor package.

In an embodiment of the present invention, a cover shell may be further included to conduct heat from the socket portion to the outer surface of the cover portion for heat dissipation.

In one embodiment of the present invention, the heat dissipation cover part may have a plurality of heat dissipation fins protruding upward on the upper surface and may have a hinge part formed at one end to be rotatable.

In one embodiment of the present invention, each of the socket portion and the cover portion has a low-stepped portion on two sides facing each other, and the heat dissipation fins can be arranged so that the grooves are exposed between the stepped portions.

In one embodiment of the present invention, the cover shell may include a heat sink arranged to come into contact with an outer periphery of the cover portion, and a catch portion for fixing the heat sink to the cover portion.

In one embodiment of the present invention, the catch portion may include a first member extending from an upper portion of the heat sink toward the socket portion, and a second member bent downward from an end of the first member and in contact with an outer portion of a side surface of the socket portion.

The present invention provides a technical means for each individual test socket to directly contact a semiconductor package and release heat generated from the semiconductor package, thereby directly dissipating heat from the semiconductor package, which is the main source of heat generation, thereby improving the heat dissipation effect.

In addition, the present invention provides a heat dissipation means that can be easily applied to test sockets of various shapes, thereby providing heat dissipation properties to existing test sockets, thereby having the effect of preventing an increase in cost.

Figure 1 is a perspective view of a test socket to which a heat dissipation device according to a preferred embodiment of the present invention is applied.
Figure 2 is a perspective view of Figure 1 with the cover shell separated.
Figure 3 is a plan view of one embodiment of a test socket to which the present invention is applied.

Hereinafter, the heat dissipation device of the test socket of the present invention will be described in detail with reference to the attached drawings.

The embodiments of the present invention are provided so that those skilled in the art will more fully understand the present invention, and the embodiments described below may be modified in various other forms, and the scope of the present invention is not limited to the embodiments described below. Rather, these embodiments are provided so that the present invention may be more faithfully and completely understood and so that the spirit of the present invention may be fully conveyed to those skilled in the art.

The terminology used herein is used to describe particular embodiments and is not intended to be limiting of the present invention. As used herein, the singular forms "a" and "an" include plural forms unless the context clearly dictates otherwise. Also, when used herein, the words "comprise" and/or "comprising" specify the presence of stated features, numbers, steps, operations, elements, elements and/or groups thereof, but do not preclude the presence or addition of one or more other features, numbers, operations, elements, elements and/or groups thereof. As used herein, the term "and/or" includes any and all combinations of one or more of the listed items.

Although the terms first, second, etc. are used herein to describe various elements, regions, and/or portions, it is to be understood that these elements, components, regions, layers, and/or portions are not limited by these terms. These terms do not imply a specific order, hierarchy, or order, and are only used to distinguish one element, region, or portion from another element, region, or portion. Accordingly, a first element, region, or portion described below may also refer to a second element, region, or portion without departing from the teachings of the present invention.

Hereinafter, embodiments of the present invention will be described with reference to drawings schematically illustrating embodiments of the present invention. In the drawings, for example, variations in the shapes depicted may be expected depending on manufacturing techniques and/or tolerances. Accordingly, embodiments of the present invention should not be construed as being limited to the specific shapes of the regions depicted in this specification, but should include, for example, changes in shapes resulting from manufacturing.

FIG. 1 is a perspective view of a test socket to which a heat dissipation device according to a preferred embodiment of the present invention is applied, and FIG. 2 is a perspective view with the cover shell separated.

Referring to FIGS. 1 and 2, the heat dissipation device of the test socket of the present invention is applied to a test socket including a socket part (10) into which a semiconductor package (not shown in the drawing) as a test object is inserted and fixed, a pin plate (20) arranged on the lower side of the socket part (10) and providing a plurality of test pins (22) on the inner bottom side of the socket part (10), a base (30) that supports the pin plate (20) and the socket part (10) and exposes the other side of the test pins (22) downward, and a cover part (50) arranged on the periphery of the socket part (10).

It is composed of a heat dissipation cover part (40) that is hinge-joined and rotatable and comes into contact with the upper surface of a semiconductor package inserted into a socket part (10), and a cover shell (60) that comes into contact with a part of the outer surface of the socket part (10) and is exposed at the outer periphery of the cover part (50) to release heat.

Hereinafter, the configuration and operation of the heat dissipation device of the test socket of the present invention configured as described above will be described in more detail.

First, the present invention is applied to a test socket for electrically testing a semiconductor package, and is independent of the type of the semiconductor package to be tested.

In the description of the present invention below, the test socket is illustrated and described as having a configuration including a socket portion (10), a pin plate (20), a base (30), and a cover portion (50), but the present invention can be applied to all test sockets that include at least a socket portion (10) and enable electrical testing of a semiconductor package using test pins (22).

The shape of the socket part (10) is a hexahedral structure with an open upper surface, and a space into which a semiconductor package can be inserted is provided on the inside.

The bottom surface of the socket portion (10) may have holes formed through which the test pins (22) of the pin plate (20) can be inserted and protrude upward.

As another example, the socket portion (10) may have an open bottom surface, and may be configured such that part or all of a pin plate (20) on which a plurality of test pins (22) are arranged in an up-down direction are coupled to the open bottom surface.

In this way, the shape of the socket part (10) can be implemented by changing it in various ways, but it is only required to include a step part (11) in which the upper center of at least two facing sides of the side is lower than the periphery.

The step portion (11) is arranged on two sides facing each other among the sides of the socket portion (10), so as to ensure smooth air flow.

Figure 3 is a plan view of a test socket to which the present invention is applied.

Referring to Fig. 3, the heat dissipation cover part (40) has a number of heat dissipation fins (41) protruding upward on the upper surface. In Fig. 3, the heat dissipation fins (41) are illustrated as protruding upward from the upper surface of the heat dissipation cover part (40), but may protrude from at least one surface of the heat dissipation cover part (40) if necessary.

The heat dissipation fins (41) have a flat bar shape that is elongated on one side, and at this time, the heat dissipation fins (41) are arranged in a direction in which the grooves between the heat dissipation fins (41) are exposed between the two stepped portions (11) of the socket portion (10) so that air can flow smoothly through the stepped portion (11).

That is, by allowing the air flow through the two facing steps (11) to flow through the gap between the heat dissipation fins (41), the heat dissipation performance can be further improved.

The heat dissipation cover part (40) is made of aluminum material with excellent heat dissipation properties, and has a hinge part (42) formed at one end to have a rotatable structure.

At this time, the hinge part (42) may be hinge-coupled to the socket part (10) or to the lower pin plate (20) or base (30), and this may be changed and coupled according to the specific design of the test socket.

The above heat dissipation cover part (40) is rotated upward, and the semiconductor package is placed in the socket part (10) and electrically contacts the test pin (22), and then rotates downward to contact the upper surface of the semiconductor package.

During the test process, the semiconductor package generates heat, which is dissipated through the heat dissipation cover part (40) that comes into contact with it.

In addition, the cover shell (60), which is another component of the present invention, has a structure that conducts heat from the socket part (10) to the outside of the cover part (50) and exchanges heat with the outside air.

The above cover shell (60) may be fitted into the cover part (50) or may be formed integrally during the production of the cover part (50).

Referring again to FIGS. 1 and 2, the cover portion (50) is positioned to surround the perimeter of the socket portion (10). The cover portion (50) can be fixed by being joined to the base (30).

The above cover part (50) may be a hollow hexahedron with the upper and lower parts open. That is, it may have the shape of a window frame on a plane.

The center of the two facing sides of the cover portion (50) can be formed with a low step surface, and by forming the step surface, an exposed portion (51) is formed in which the step portion (11) is exposed to the outside.

Therefore, air can flow to the step portion (11) and the heat dissipation cover portion (40) through the exposed portion (51) of the cover portion (50).

The above cover shells (60) are combined in pairs symmetrically based on the exposed portions (51) formed on opposite sides of the cover portion (50).

The cover shell (60) dissipates heat from the socket part (10) to the outside. The socket part (10) conducts heat generated from the semiconductor package, etc., and contacts a part of the outer surface of the socket part (10), and heat is dissipated by the cover shell (60) that partially surrounds the outer surface of the cover part (50).

The cover shell (60) is configured to include a heat sink (62) arranged around the outer surface of the cover portion (50), and a catch portion (61) that extends from an upper portion of the heat sink (62) to secure the heat sink (62) to the cover portion (50) and also comes into contact with a portion of the outer surface of the socket portion (10).

The shape of the above-mentioned catch (61) is configured to include a first member (61a) extending from the upper part of the heat sink (62) toward the socket part (10), and a second member (61b) extending downward from the end of the first member (61a).

The first member (61a) has a bottom surface that contacts the upper side of the cover part (50), and the second member (61b) has one surface that contacts a part of the outer surface of the socket part (10). The heat sink (62) can be easily installed and stably fixed to the test socket using the catch (61), and the heat of the socket part (10) can be conducted to the heat sink (62).

The heat sink (62) is exposed on the outer surface of the cover part (50) and performs heat dissipation by exchanging heat with the outside air.

In this way, the present invention can smoothly dissipate heat generated from a semiconductor package during a test by adding a cover shell (60) to an existing test socket, and can further improve heat dissipation efficiency by applying a heat dissipation cover part (40) that directly contacts the semiconductor package.

It will be apparent to those skilled in the art that the present invention is not limited to the above-described embodiments and that various modifications and variations can be made without departing from the technical spirit of the present invention.

10:Socket part 20:Pin plate
30:base 40:radiation cover
50:Cover part 60:Cover shell

Claims (6)

A heat dissipation device applied to a test socket including a socket portion into which a semiconductor package is inserted and tested, and a cover portion arranged around the socket portion,
A heat dissipation cover part that contacts the upper surface of the semiconductor package inserted into the socket part, fixes the semiconductor package, and dissipates heat generated from the semiconductor package; and
A heat dissipation device for a test socket including a cover shell that conducts heat from the socket portion to the outer surface of the cover portion to dissipate heat. delete In the first paragraph,
The above heat dissipation cover part,
At least one side has multiple heat sink fins protruding,
A heat dissipation device for a test socket, characterized in that a hinge part is formed at one end and is rotatable. In the third paragraph,
Each of the above socket part and the above cover part,
The upper center of the two facing sides has a lower step than the surrounding area,
A heat dissipation device of a test socket, characterized in that the heat dissipation fins are arranged so that the grooves are exposed between the step portions. In the first paragraph,
The above cover shell,
A heat sink arranged to contact the outer periphery of the cover portion; and
A heat sink device for a test socket including a catch for fixing the heat sink to the cover part. In paragraph 5,
The above-mentioned catch is,
A first member extending from the upper part of the heat sink toward the socket portion; and
A heat dissipation device for a test socket, comprising a second member that is bent downward from an end of the first member and contacts a portion of an outer side surface of the socket portion.

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