JP7219601B2 - Socket and connection structure - Google Patents

Description

The present invention relates to a socket to which a semiconductor package can be attached, and more particularly to a heat dissipation mechanism for the socket.

2. Description of the Related Art A semiconductor package, in which a semiconductor chip having an integrated circuit formed thereon is sealed with resin or the like, undergoes an electrical characteristic test and a burn-in test before shipment in order to determine whether it is a good product or a defective product. In this case, the semiconductor package is connected to the circuit board through the socket. Patent Literature 1 discloses a socket to which a BGA semiconductor package can be attached.

Japanese Patent No. 3257994

A socket, which provides an interface between the semiconductor package and the circuit board, has a plurality of contacts for connecting with terminals of the semiconductor package. The number, shape, arrangement, material, etc. of the contacts are designed according to the type of semiconductor package, for example, terminals such as BGA, TSOP, and QFP. FIG. 1 shows a schematic cross section of the socket disclosed in Patent Document 1. As shown in FIG. A socket 1A shown in the figure is for mounting a BGA semiconductor package, and includes a base member 2, a cover member 3 attached via a spring member in a direction toward or away from the base member 2, and a cover. A contact 6 that opens and closes the contact at the tip according to the movement of the member 3 is provided.

A stopper member is attached to the opening at the bottom of the base member to prevent the contact 6 from falling out of the base member 2 . A contact 6 protruding from the bottom of the base member 2 is inserted into a through hole of the circuit board and electrically connected there by soldering or the like.

When testing a semiconductor package in a socket as described above, if the semiconductor package generates a large amount of heat, for example, it is necessary to separately attach a heat sink near the surface of the semiconductor package in the cover member. Attaching the heat sink to the socket complicates the structure of the socket, enlarges the outer shape of the socket, and complicates handling. In addition, unlike the pop-up type that reciprocates the cover member, in the case of the clamshell type socket that rotates the cover member, the structure becomes more complicated when the heat sink is attached, resulting in a significant increase in the cost of the socket.

SUMMARY OF THE INVENTION An object of the present invention is to provide a socket and connection structure having a heat dissipation function that can be made smaller and lower in cost.

A socket according to the present invention is formed with a plurality of contacts having one end portion, an intermediate portion and the other end portion, and a plurality of through holes for inserting the plurality of contacts. A base member that enables electrical connection between one end of each contact and each terminal of the semiconductor package, and a stopper member attached to the substrate side of the base member, wherein each contact is inserted into the stopper member. and a holding portion having a plurality of through-holes for holding an intermediate portion of each contact; and a heat radiating portion extending laterally from the holding portion. When the other end of the protruding contact is inserted into the through-hole of the circuit board, the heat radiating portion comes into contact with the circuit board.

In one embodiment, the stopper member has a plurality of heat radiating portions extending like fins from the holding portion. In one embodiment, the stopper member is made of a material having higher thermal conductivity than the base member. In one embodiment, the bottom of the holding part is provided with at least one heat-dissipating protrusion, and the heat-dissipating protrusions contact the circuit board at the same time when the heat-dissipating part contacts the circuit board. In one embodiment, the socket further includes a guide member attached to the substrate side of the stopper member and formed with a plurality of through holes for guiding the other end of each contact, the guide member exposing the heat radiating part; In one aspect, the guide member is formed with a notch so as not to interfere with the heat radiation projection. In one aspect, the guide member is formed with a heat dissipation opening for dissipating the heat of the stopper member. In one embodiment, the socket further comprises: a cover member movable in a direction toward or away from the base member; an adapter member mounted on the base member for mounting the semiconductor package thereon; a switching mechanism for opening and closing a pair of contacts at one end of the contacts in response.

A connection structure according to the present invention includes the socket described above and a circuit board for connecting the socket, wherein the circuit board includes a plurality of contacts for inserting the other ends of the contacts protruding from the socket. and a conductive region is formed on the surface of the circuit board to contact the heat sink.

In one embodiment, the conductive region is a GND region. In one embodiment, the surface of the GND area is plated with gold. In one embodiment, the surface of the circuit board is further formed with a GND area that contacts the heat radiation protrusion. In one embodiment, a GND region is further formed on the surface of the circuit board at a position facing the heat radiation opening. In one embodiment, the circuit board is a multilayer wiring board.

According to the present invention, since the heat radiating portion of the stopper member is brought into contact with the circuit board, the heat of the semiconductor package can be radiated to the circuit board through the contacts and the stopper member. As a result, the trouble of attaching a heat sink to the socket can be saved, and the size and cost of the socket can be reduced.

and FIG. 10 is a cross-sectional view showing one configuration example of a conventional socket. 2(A) is a plan view of the socket, and FIGS. 2(B) and 2(C) are views in the X direction of FIG. 2(A). FIG. and a side view in the Y direction, and FIG. 2(D) is a sectional view taken along line Z1-Z1. FIG. 3(A) shows an example of a contact according to an embodiment of the present invention, and FIG. 3(B) shows a state of being connected to a terminal of a semiconductor package. 4(A) is a plan view of the base member, and FIGS. 4(B) and 4(C) are views in the X direction and the Y direction. FIG. A side view, FIG. 4(D), is a sectional view taken along line Z2-Z2. 5(A) is a plan view of the stopper member, and FIGS. 5(B) and 5(C) are views in the X direction and the Y direction. FIG. A side view, FIG. 5(D), is a sectional view taken along line Z3-Z3. 6(A) is a plan view of the guide member, and FIGS. 6(B) and 6(C) are views of the guide member in the X and Y directions. A side view, FIG. 6(D), is a sectional view taken along line Z4-Z4. 1 is a plan view of a circuit board according to an embodiment of the present invention; FIG. FIG. 4 is a diagram showing how a socket according to an embodiment of the present invention is mounted on a circuit board; It is a figure explaining the heat dissipation of the socket by the Example of this invention. FIG. 4 is a diagram showing how the heat radiating part of the socket according to the embodiment of the present invention radiates heat to the atmosphere;

Next, embodiments of the present invention will be described in detail with reference to the drawings. The socket of the present invention provides an interface between a semiconductor package and a circuit board. The socket of the present invention includes a plurality of contacts and a base member holding the plurality of contacts, one end of each contact being electrically connected to a terminal of a semiconductor package and the other end being formed on a circuit board. are electrically connected to the electrode regions (through-holes of the circuit board in this example). The socket of the present invention may be either a socket in which the cover member moves toward or away from the base member or a socket in which the cover member is rotatably attached to the base member. The cover member can be interlocked with, for example, a contact opening/closing mechanism of the contact, or can be interlocked with a latch member for pressing the semiconductor package against the contact. The socket of the present invention can be used for burn-in testing or electrical property testing. In the following examples, a socket for mounting a semiconductor package having a BGA terminal structure is illustrated, and this socket is assumed to have a cover member capable of reciprocating in a direction toward or away from a base member. do.

2A and 2B are diagrams showing a schematic configuration of a socket according to an embodiment of the present invention. FIG. 2A is a plan view of the socket, FIGS. 2B and 2C are side views, and FIG. D) is a cross-sectional view taken along line Z1-Z1.

The socket 100 according to this embodiment has a substantially rectangular shape, and includes a base member 110, a cover member 120 movable in a direction toward or away from the base member 110, a plurality of contacts 130, and a substrate-side contact 130. , a guide member 150 for aligning the contacts 130 on the substrate side, a slider member 160 for opening and closing the contact points at the tips of the contacts 130 by moving up and down, and a latch for pressing the upper surface of the semiconductor package. A member 170, an adapter member 180 for positioning the semiconductor package so that the contact portion at the tip of the contact contacts the terminal of the semiconductor package, and a link member for vertically moving the slider member 160 in conjunction with the movement of the cover member 120. and The slider member 160, the latch member 170, the adapter member 180, and the link member have arbitrary configurations and are well known as disclosed in the socket of Patent Document 1, so detailed description thereof is omitted here. do.

The cover member 120 is reciprocally attached to the base member 110 via a spring member 122 that biases the cover member 120 away from the base member 110 . The cover member 120 is formed with a groove portion 124 that slides on the guide member 112 projecting from the base member 110 and engages with the guide member 112 . It is held at the farthest position.

The cover member 120 is made of a resin material such as plastic and has a generally rectangular shape. A rectangular opening 126 for mounting a semiconductor package is formed in the center of the cover member 120 . The semiconductor package is attached to or removed from the socket through the opening 126 of the cover member 120 .

When mounting the semiconductor package in the socket 100 , the cover member 120 is moved downward against the elastic force of the spring member 122 in a direction approaching the base member 110 . When the cover member 120 moves downward, the link mechanism rotates the latch member 170 from the central pressing position to the peripheral retracted position in response to the movement of the cover member 120, and moves the slider member 160 (FIG. 3(B)). ) is pushed upward to open the contact opening/closing mechanism of the contact 130, which will be described later.

An adapter member 180 for mounting a semiconductor package is fixed to the base member 110 above the slider member 160 . At the four corners of the adapter member 180, positioning guides (for example, concave shapes corresponding to the shapes of solder balls) for positioning the semiconductor package are formed.

When the pressing force on cover member 120 is released, cover member 120 moves away from base member 110 by the elastic force of spring member 122 , that is, moves upward. When the cover member 120 moves upward, the link mechanism rotates the latch member 170 from the retracted position to the pressing position, enabling the latch member 170 to press the upper surface of the semiconductor package. In addition, the upward movement of the cover member 120 also causes the slider member 160 to move downward, thereby closing the contact opening/closing mechanism of the contact 130, so that the contact of the contact 130 can sandwich the ball terminal with a constant contact pressure. .

FIG. 3(A) is a plan view of the contact, and FIG. 3(B) is a diagram showing a state in which the contact clamps the ball terminal of the semiconductor package. The contact 130 is made of, for example, a metal material such as beryllium copper, and is formed, for example, by punching such a metal plate. The contact 130 has a pair of arm portions 132 a and 132 b formed at one end portion, an intermediate portion 134 connected to the pair of arm portions, and a substrate side connection portion 136 extending from the intermediate portion 134 .

A pair of arm portions 132 a and 132 b has a contact opening/closing mechanism for sandwiching ball terminals 210 of the semiconductor package 200 . As shown in FIG. 3B, a slider member 160 is arranged between the pair of arm portions 132a and 132b, and when the slider member 160 rises, the contacts 133 at the tips of the pair of arm portions 132a and 132b open. Thus, when the pair of arm portions 132a and 132b are elastically deformed and the slider member 160 descends, the contact point 133 is closed by the elastic force of the pair of arm portions 132a and 132b. The distance between the contacts 133 when the pair of arms 132 a and 132 b are closed is designed to be slightly smaller than the diameter of the ball terminals 210 of the semiconductor package 200 .

4A is a plan view of the base member according to this embodiment, FIGS. 4B and 4C are side views, and FIG. 4D is a sectional view taken along the line Z2-Z2. The base member 110 has a substantially rectangular shape and is made of a resin material such as plastic. A plurality of through holes 114 for inserting a plurality of contacts 130 are formed in a matrix in the center of the base member 110 . A guide member 112 that slides with the opening of the cover member 120 is formed on the side of the base member 110, and four projections 113 for positioning and fixing the adapter member 180 are formed on the periphery of the base member 112. formed. The positioning guides of the slider member 160 and the adapter member 180 mounted on the base member 110 are aligned with the through holes 114 of the base member 110 respectively.

A plurality of standoffs 116 are integrally formed on the substrate side of the base member 110 . The standoffs 116 are, for example, cylindrical protrusions, which are inserted into openings formed in the circuit board and serve to position and fix the socket 100 to the circuit board.

5 shows the structure of the stopper member of this embodiment, FIG. 5(A) is a plan view of the stopper member, FIGS. 5(B) and 5(C) are side views in the X direction and the Y direction, FIG. 5D is a cross-sectional view along line Z3-Z3.

A stopper member 140 is attached to the substrate side of the base member 110 . The stopper member 140 is made of, for example, a resin material (such as PPS) having higher thermal conductivity than the base member 110 . The stopper member 140 is generally formed of a plate-like member as a whole, and has a rectangular holding portion 142 and a heat radiating portion 144 connected to four corner portions of the holding portion 142 .

A plurality of through-holes 146 for inserting and holding the contacts 130 are formed in the central holding portion 142 . Eight positioning portions 148 (for example, arc-shaped protrusions) are formed. Four U-shaped portions 147 are formed on the opposing surfaces of the holding portion 142, and the stopper member 140 is fixed to the base member 110 by using a shaft (not shown) of a link mechanism to the U-shaped portions 147. be. Furthermore, a plurality of hooks 149 for attaching a guide member 150 (to be described later) are formed on the outer circumference of the holding portion 142 . This hook 149 is inserted into an opening in the base member 110 and locks there. When the stopper member 140 is positioned and fixed to the base member 110 , the plurality of through holes 146 are aligned with the plurality of through holes 114 of the base member 110 .

When the contact 130 is inserted through the through-hole 114 of the base member 110 , the stepped portion (see FIGS. 3A and 3B ) formed in the intermediate portion 134 of the contact 130 becomes the stepped portion of the through-hole 146 of the stopper member 140 . , and the contact 130 is fixed to the stopper member 140 in a state in which the board-side connecting portion 136 protrudes from the bottom surface of the stopper member 140 .

The heat radiating part 144 has, for example, a rectangular shape and provides a fin shape extending to the side of the holding part 142 to increase the contact area with the circuit board 300 or the contact area with the outside air. and improve heat dissipation characteristics. Further, the heat dissipation portion 144 is formed with a plurality of openings 144 a through which the plurality of standoffs 116 of the base member 110 are passed when the stopper member 140 is attached to the base member 110 . Further, the heat dissipation portion 144 is formed with an opening 144b for screwing the socket 100 to the circuit board 300. As shown in FIG. The socket 100 and the circuit board 300 are screwed using the opening 144 b before the contacts 130 are soldered into the through holes of the circuit board 300 . The shape and number of the heat radiating portions 144 are arbitrary. For example, the heat radiating portions 144 may be circular, elliptical, or triangular, and may have unevenness on the surface to increase the surface area. Also, for example, two heat radiating portions 144 may be formed on opposite sides of the holding portion 142, or the number of heat radiating portions 144 may be different.

In one embodiment, for example, four wall-shaped heat dissipation projections 143 are formed on the outer edge of the bottom of the rectangular holding portion 142 . The heat radiation protrusion 143 has the same height as the bottom surface of the heat radiation portion 144 , in other words, when the heat radiation portion 144 contacts the circuit board 300 , the heat radiation protrusion 143 also contacts the circuit board 300 at the same time.

6 shows the configuration of the guide member of this embodiment, FIG. 6(A) is a plan view of the guide member, FIGS. 6(B) and 6(C) are side views in the X direction and the Y direction, FIG. 6D is a cross-sectional view along line Z4-Z4.

The guide member 150 is attached to the substrate side of the stopper member 150 and fixes the stopper member 140 to the base member 110 . The guide member 150 is made of, for example, a resin material such as plastic. The guide member 150 has a rectangular shape with approximately the same size as the holding portion 142 of the stopper member 140, and when the guide member 150 is attached to the bottom surface side of the stopper member 140, the heat radiating portion 144 is shielded by the guide member 150. It should be noted that it is exposed without

A plurality of through holes 152 are formed in the guide member 150 , and when the guide member 150 is fixed to the base member 110 , the plurality of through holes 152 correspond to the plurality of through holes 146 of the stopper member 140 and the plurality of base members 110 . is aligned with the through hole 114 of the . Four protruding hooks 154 are formed around the guide member 150 at positions corresponding to the positioning portions 148 of the stopper member 140 . Hook 154 is inserted into the opening of base member 110 together with positioning portion 148 to fix stopper member 140 and guide member 150 to base member 110 . The through hole 152 of the guide member 150 has a circular shape to guide the columnar board-side contact portion 136 of the contact 130 .

In one embodiment, four notches 156 are formed on the peripheral edge of the guide member 150 at positions corresponding to the heat radiation protrusions 143 of the stopper member 140 . The four heat radiation protrusions 143 are not shielded by the guide member 150 and are exposed to the circuit board through the notch 156 in the same manner as the heat radiation section 144 .

In another embodiment, one or more heat radiation openings 158 are formed in an arbitrary space within the region of the guide member 150 in which the plurality of through holes 152 are formed. In the illustrated example, four rectangular heat radiation openings 158 are formed between the outer peripheral through hole 152 and the inner rectangular through hole 152 . The four heat radiation openings 158 do not shield the stopper member 140 and allow the discharge to the substrate side.

FIG. 7 is a plan view of a circuit board for connecting the sockets of this embodiment. The circuit board 300 is, for example, a multilayer board or a laminated board, and each board includes power wiring, GND wiring, and signal wiring. Through holes 310 are formed in the circuit board 300 corresponding to the positions of the contacts 130 of the socket 100, and the contacts 130 are electrically connected to the through holes 310 via solder or the like. Further, the circuit board 300 is formed with a plurality of openings 350a at positions corresponding to the standoffs 116 projecting from the bottom of the base member 110, and openings 350b at positions corresponding to the screwing openings 144b. The socket 100 is positioned on the circuit board 300 by inserting the standoffs 116 into the openings 350a, and the bottom surface of the heat radiating section 144 is brought into tighter contact with the surface of the circuit board 300 by fastening the screws to the openings 144b and 350b. be.

A plurality of GND regions 320-1, 320-2, 320-3, 320-4 electrically connected to the GND wiring are formed on the surface of the circuit board 300. FIG. The GND regions 320-1 to 320-4 are preferably plated with gold (Au) on their surfaces. When the socket 100 is mounted on the circuit board 300, the GND areas 320-1 to 320-4 are in contact with the four heat dissipation parts 144 exposed by the guide member 150 and are thermally coupled with the heat dissipation parts 144. FIG. Since the surface of a normal circuit board is treated with a resist, thermal coupling with the circuit board is reduced. Thus, the heat generated in the semiconductor package 200 is conducted into the circuit board through the GND region 320 which is well thermally coupled with the heat dissipation portion 144 . The GND wiring is thicker than the signal wiring in order to allow a larger current to flow than the signal wiring. Therefore, the GND wiring has higher thermal conductivity and better heat radiation characteristics than the signal wiring.

In one embodiment, when the stopper member 140 is formed with heat radiation projections 143, GND regions 330-1, 330-2, 330-3, and 330-4 are formed at positions corresponding to the heat radiation projections 143, The heat of the semiconductor package is radiated to the circuit board 300 through the heat radiation protrusions 143 .

Further, in one embodiment, when heat radiation openings 158 are formed in the guide member 150, GND regions 340-1, 340-2, 340-3, and 340-4 are formed at positions corresponding to the heat radiation openings 158. The stopper member 140 is thermally coupled to the GND region 340 through the gap of the heat radiation opening 158 to radiate heat.

Next, the operation of the socket of this embodiment will be described. First, using the standoffs 116 (location pins) of the base member 110 as guides, the socket 100 is positioned and fixed to the circuit board 300 (see FIG. 8). Also, the socket 100 and the circuit board 300 are screwed through the opening 144a. As a result, the heat radiating portion 144 and the circuit board 300 are brought into closer contact with each other. Next, the board-side contact portions 136 of the contacts 130 inserted into the through holes 310 of the circuit board 300 are soldered to electrically connect the contacts 130 to the circuit board 300 . After mounting the socket 100 on the circuit board 300, the operation is the same as usual. A semiconductor package is set in the socket 100, and then a burn-in test or a performance test is performed.

When the test is performed, the heat generated by the semiconductor package 200 is conducted to the contacts 130 in contact with the terminals (solder balls) 210 as indicated by arrows in FIG. 136 is soldered to the through hole 310 of the circuit board 300, the heat H1 is radiated to the circuit board 300. FIG.

Further, as shown in FIG. 9B, the contacts 130 are held in contact with the respective through holes 146 of the holding portion 142 of the stopper member 140, so that the heat H2 transferred from the terminals 210 to the contacts 130 is The heat is transferred from the heat dissipation portion 144 to the GND area 320 of the circuit board 300 and radiated to the circuit board 300 through the relatively thick GND wiring. Furthermore, as shown in FIG. 9C, the side portion 144a of the heat radiating portion 144 of the stopper member 140 is not shielded by the guide member 150 and is exposed to the outside air. Heat is conducted (convection) from the side portion 144a into the air. FIG. 10 shows this situation.

In this embodiment, the material of the contact 130 is a copper alloy with a high thermal conductivity, and the material of the stopper member 140 is also a material with a high thermal conductivity. A conventional socket has only a heat transfer path of semiconductor package 200→contacts 130→circuit board 300, but the socket 100 of the present embodiment has the semiconductor package 200→contacts 130 in addition to such a normal heat transfer path. →Stopper member 140→Circuit board 300 and heat transfer path by convection from stopper member 140 to the outside air are newly provided, so much heat generated from the semiconductor package can be released to circuit board 300 and the outside air. can be done. In addition, the area of the circuit board 300 that contacts the socket 100 is not a resist-treated area but a GND area plated with Au, so that heat from the socket can be more efficiently transferred to the circuit board. can.

Thus, according to this embodiment, it is possible to eliminate the heat sink from a socket that requires a conventional heat sink. As a result, the socket can be made smaller than the socket with the heat sink. In addition, by eliminating the need for a heat sink, the structure of the socket is simplified, and the cost of the socket can be reduced.

In the above embodiments, a BGA is used as a semiconductor package, but the present invention can be applied to semiconductor packages having terminals that can be surface-mounted (for example, TSOP, QFP).

Although the preferred embodiments of the present invention have been described in detail above, the present invention is not limited to specific embodiments, and various modifications, Change is possible.

100: Socket 110: Base member 120: Cover member 130: Contacts 132a, 132b: Arm member 140: Stopper member 142: Holding portion 143: Heat radiation projection 144: Heat radiation portion 146: Through hole 150: Guide member 152: Through hole 156 : Notch 158: Heat dissipation opening 160: Slider member 200: Semiconductor package 210: Terminal 300: Circuit board 310: Through holes 320-1 to 320-4: GND regions 330-1 to 330-4: GND region 340- 1 to 340-4: GND area

Claims (14)

a plurality of contacts having one end, a middle portion and the other end;
a base member having a plurality of through-holes for inserting the plurality of contacts, respectively, and enabling electrical connection between one end of each contact inserted into each through-hole and each terminal of the semiconductor package; ,
A stopper member attached to a substrate side of a base member, the stopper member comprising a holding portion having a plurality of through holes for inserting each contact and holding an intermediate portion of each contact; the stopper member comprising a heat radiating portion extending in the direction of
When the other end of the contact protruding from the stopper member is inserted into the through hole of the circuit board, the heat radiation part contacts the circuit board ,
The heat radiating portion is made of a material having higher thermal conductivity than the base member,
The holding part has a cross-sectional area smaller than that of the base member,
The heat radiating portion extends to the side of the holding portion such that a side portion of the heat radiating portion is exposed to the outside air.
socket. a plurality of contacts having one end, a middle portion and the other end;
a base member having a plurality of through-holes for inserting the plurality of contacts, respectively, and enabling electrical connection between one end of each contact inserted into each through-hole and each terminal of the semiconductor package; ,
A stopper member attached to a substrate side of a base member, the stopper member comprising a holding portion having a plurality of through holes for inserting each contact and holding an intermediate portion of each contact; the stopper member comprising a heat radiating portion extending in the direction of
When the other end of the contact protruding from the stopper member is inserted into the through hole of the circuit board, the heat radiation part contacts the circuit board,
The socket, wherein the stopper member has a plurality of heat radiating portions extending like fins from the holding portion. 3. The socket according to claim 1, wherein said stopper member is made of a material having higher thermal conductivity than said base member. 4. The apparatus according to any one of claims 1 to 3, wherein at least one heat radiation projection is provided on the bottom of said holding part, and said heat radiation projection contacts said heat radiation part simultaneously with said circuit board. socket. The socket further includes a guide member attached to the substrate side of the stopper member and formed with a plurality of through holes for guiding the other end of each contact, and the guide member exposes the heat radiating portion. 5. A socket as claimed in any one of claims 1 to 4, allowing. 5. The socket according to claim 4, wherein the guide member is formed with a notch so as not to interfere with the heat radiation projection. 6. The socket according to claim 5, wherein said guide member is formed with a heat radiation opening for radiating heat of said stopper member. The socket further includes a cover member movable toward or away from the base member, an adapter member mounted on the base member for mounting the semiconductor package thereon, and the contacts in response to the movement of the cover member. 8. The socket according to any one of claims 1 to 7, comprising an opening and closing mechanism for opening and closing a pair of contacts at one end of the socket. A connection structure comprising the socket according to any one of claims 1 to 8 and a circuit board for connecting the socket,
The connection structure, wherein the circuit board includes a plurality of through holes for inserting the other ends of the contacts protruding from the sockets, and a conductive region is formed on the surface of the circuit board to contact the heat dissipation part. . 10. The connection structure according to claim 9, wherein said conductive region is a GND region. 11. The connection structure according to claim 10, wherein the surface of said GND region is plated with gold. 11. The connection structure according to claim 10, wherein a GND area is further formed on the surface of the circuit board to contact the heat radiation projection. 11. The connection structure according to claim 10, wherein a GND region is further formed on the surface of said circuit board at a position facing said opening for heat dissipation. 10. The connection structure according to claim 9 , wherein said circuit board is a multilayer wiring board.

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