JP6393802B1 - Substrate placing apparatus, substrate placing method, film forming apparatus, film forming method, alignment apparatus, alignment method, and electronic device manufacturing method - Google Patents

Abstract

Distortion is reduced when a substrate is mounted on a mounting body in the manufacture of an organic EL display.
A substrate mounting apparatus including a clamping unit having a plurality of clamping tools for clamping a peripheral edge of a substrate, and a mounting unit for mounting the substrate on a mounting body, The clamping means has a clamping force varying means that varies the clamping force of the plurality of clamping tools, and the clamping force varying means uses the clamping force of a part of the plurality of clamping tools as compared with the other clamping tools. Uses a substrate mounting apparatus characterized by being independently variable.
[Selection] Figure 5

Description

  The present invention relates to a substrate mounting apparatus, a substrate mounting method, a film forming apparatus, a film forming method, an alignment apparatus, an alignment method, and an electronic device manufacturing method.

  In manufacturing an electronic device such as an organic EL display, there is a step of depositing an organic material on a substrate. In the vapor deposition process, the vapor deposition apparatus supports the substrate by a substrate holding unit that supports or sandwiches the peripheral edge (four sides) of the substrate. In addition, the substrate holding unit contacts and places the substrate on a mounting body such as a mask while supporting the substrate. Here, of the outer periphery of the substrate, the substrate is sandwiched between one opposing side portion (for example, the long side portion) and supported only without being sandwiched between the other opposing side portion (for example, the short side portion). Patent Document 1 describes an example of an apparatus for manufacturing an organic EL display by vapor deposition.

JP 2009-277655 A

  In the sandwiching step when vapor-depositing an organic material or the like, the substrate can be sandwiched only at the peripheral portion of the substrate because the film formation region is provided at the center of the substrate. Therefore, the center part may bend due to the weight of the substrate itself. In particular, in recent years, the substrate is becoming larger and thinner, and the influence of bending due to its own weight when placing the substrate is increasing. When the substrate is placed on the mounting body in a state where the bending has occurred, the substrate is distorted, and it may take time to correct the distortion by alignment, and the production quality may be deteriorated.

  This invention is made | formed in view of the said subject, and it aims at reducing the distortion at the time of mounting a board | substrate on a mounting body in manufacture of an organic electroluminescent display.

For the above purpose, the present invention adopts the following configuration. That is,
Clamping means having a plurality of clamping tools for clamping the peripheral edge of the substrate;
A substrate mounting device having mounting means for mounting the substrate on the mounting body,
The clamping means further includes clamping force varying means for varying the clamping force of the plurality of clamping tools,
The clamping force varying means is a substrate mounting apparatus characterized in that the clamping force of a part of the plurality of clamping tools is varied independently of the other clamping tools.
The present invention also employs the following configuration. That is,
Clamping means having a plurality of clamping tools for clamping the peripheral edge of the substrate;
A substrate mounting device having mounting means for mounting the substrate on the mounting body,
The clamping means further includes clamping force varying means for varying the clamping force of the plurality of clamping tools,
The clamping force varying means is a clamping force varying means that varies the clamping force of the plurality of clamping tools independently for each clamping tool.
The present invention also employs the following configuration. That is,
A clamping step of clamping the peripheral edge of the substrate with a plurality of clamping tools;
A substrate mounting method including a mounting step of mounting the sandwiched substrate on a mounting body,
The clamping step is a substrate mounting method characterized in that the clamping force of some clamping tools and the clamping force of other clamping tools among the plurality of clamping tools are different from each other to clamp the substrate. .
The present invention also employs the following configuration. That is,
A clamping step of clamping the periphery of the substrate with a clamping tool;
A substrate mounting method including a mounting step of mounting the sandwiched substrate on a mounting body,
The clamping step is a substrate mounting method characterized in that one of the peripheral edges of the substrate is clamped by the clamping tool.

  ADVANTAGE OF THE INVENTION According to this invention, the distortion at the time of mounting a board | substrate on a mounting body in manufacture of an organic electroluminescent display can be reduced.

Top view schematically showing a part of the configuration of an electronic device manufacturing apparatus Sectional drawing which shows the structure of a film-forming apparatus typically Perspective view of substrate holding unit The figure which shows the structure of an organic electroluminescence display The figure which shows the flow of the clamping of the board | substrate in Example 1, and a mounting process The top view which shows the pinching force applied to a board | substrate in Example 1. The figure which shows the structure of the board | substrate holding unit in Example 2, and a clamping mechanism. The figure which shows the flow of the clamping and mounting process of the board | substrate concerning Example 3. The figure which shows the flow of the clamping and mounting process of the board | substrate concerning Example 4. FIG.

  Hereinafter, preferred embodiments and examples of the present invention will be described with reference to the drawings. However, the following embodiments and examples are merely illustrative of preferred configurations of the present invention, and the scope of the present invention is not limited to these configurations. In the following description, the hardware configuration and software configuration of the apparatus, processing flow, manufacturing conditions, dimensions, materials, shapes, and the like limit the scope of the present invention only to those unless otherwise specified. It is not intended.

  The present invention relates to a film forming apparatus for forming a thin film on a substrate and a control method thereof, and more particularly, to a technique for highly accurate conveyance and position adjustment of a substrate. The present invention can be preferably applied to an apparatus for forming a thin film (material layer) having a desired pattern by vacuum deposition on the surface of a parallel plate substrate. Arbitrary materials such as glass, resin, and metal can be selected as the material of the substrate, and any material such as organic material and inorganic material (metal, metal oxide, etc.) can be selected as the vapor deposition material. Further, not only an organic film but also a metal film can be formed. Specifically, the technology of the present invention can be applied to manufacturing apparatuses such as organic electronic devices (for example, organic EL display devices, thin film solar cells), optical members, and the like. In particular, the organic EL display device manufacturing apparatus is required to further improve the substrate transport accuracy and the substrate / mask alignment accuracy by increasing the size of the substrate or increasing the definition of the display panel. This is one example.

<Manufacturing equipment and manufacturing process>
FIG. 1 is a top view schematically showing a part of the configuration of an electronic device manufacturing apparatus. The manufacturing apparatus of FIG. 1 is used, for example, for manufacturing a display panel of an organic EL display device for a smartphone. In the case of a display panel for a smartphone, for example, after forming an organic EL film on a substrate having a size of about 1800 mm × about 1500 mm and a thickness of about 0.5 mm, the substrate is diced to produce a plurality of small size panels. The

An electronic device manufacturing apparatus generally has a plurality of film forming chambers 111 and 112 and a transfer chamber 110 as shown in FIG. In the transfer chamber 110, a transfer robot 119 for holding and transferring the substrate 10 is provided. The transfer robot 119 is, for example, a robot having a structure in which a robot hand that holds a substrate is attached to an articulated arm, and carries the substrate 10 into and out of each film forming chamber.

  Each of the film formation chambers 111 and 112 is provided with a film formation apparatus (also referred to as a vapor deposition apparatus). A series of film formation processes such as delivery of the substrate 10 to the transfer robot 119, adjustment of the relative position between the substrate 10 and the mask (alignment), fixation of the substrate 10 on the mask, film formation (evaporation) are performed by the film formation apparatus. It is done automatically. The film forming apparatus in each film forming chamber has almost the same basic structure (particularly, the structure related to substrate transport and alignment), although there are differences in details such as the difference in vapor deposition source and mask. . Hereinafter, a common configuration of the film forming apparatuses in the respective film forming chambers will be described.

<Deposition system>
FIG. 2 is a cross-sectional view schematically showing the configuration of the film forming apparatus. In the following description, an XYZ orthogonal coordinate system in which the vertical direction is the Z direction is used. At the time of film formation, the substrate is fixed so as to be parallel to the horizontal plane (XY plane), and the short direction (direction parallel to the short side) of the substrate at this time is the X direction, and the long direction (direction parallel to the long side). ) In the Y direction. The rotation angle around the Z axis is represented by θ.

  The film forming apparatus has a vacuum chamber 200. The inside of the vacuum chamber 200 is maintained in a vacuum atmosphere or an inert gas atmosphere such as nitrogen gas. In the vacuum chamber 200, a substrate holding unit 210, a mask 220, a mask base 221, a cooling plate 230, and a vapor deposition source 240 are generally provided. The substrate holding unit 210 is means for holding and transporting the substrate 10 received from the transport robot 119, and is also called a substrate holder. The mask 220 is a metal mask having an opening pattern corresponding to a predetermined thin film pattern formed on the substrate 10, and is fixed on a frame-shaped mask base 221. The substrate 10 is placed on the mask 220 during film formation. Therefore, the mask 220 also serves as a mounting body on which the substrate 10 is mounted. The cooling plate 230 is a member that is in close contact with the substrate 10 (the surface opposite to the mask 220) during film formation and suppresses an increase in temperature of the substrate 10, thereby suppressing deterioration and deterioration of the organic material. The cooling plate 230 may also serve as a magnet plate. The magnet plate is a member that enhances the adhesion between the substrate 10 and the mask 220 during film formation by attracting the mask 220 with a magnetic force. The evaporation source 240 includes an evaporation material, a heater, a shutter, an evaporation source drive mechanism, an evaporation rate monitor, and the like (all not shown).

  A substrate Z actuator 250, a clamp Z actuator 251, a cooling plate Z actuator 252, an X actuator (not shown), a Y actuator (not shown), and a θ actuator (not shown) are provided above (outside) the vacuum chamber 200. ing. These actuators include, for example, a motor and a ball screw, a motor and a linear guide, and the like. The substrate Z actuator 250 is a driving means for moving the entire substrate holding unit 210 up and down (moving in the Z direction). The clamp Z actuator 251 is a driving unit for opening and closing a clamping mechanism (described later) of the substrate holding unit 210. The cooling plate Z actuator 252 is driving means for moving the cooling plate 230 up and down. The X actuator, Y actuator, and θ actuator (hereinafter collectively referred to as “XYθ actuator”) are drive means for alignment of the substrate 10. The XYθ actuator rotates the entire substrate holding unit 210 and the cooling plate 230 in the X direction, the Y direction, and θ rotation. In this embodiment, the X, Y, and θ of the substrate 10 are adjusted with the mask 220 fixed. However, the position of the mask 220 is adjusted, or the positions of both the substrate 10 and the mask 220 are adjusted. By adjusting, the substrate 10 and the mask 220 may be aligned.

Cameras 260 and 261 for measuring the positions of the substrate 10 and the mask 220 are provided above (outside) the vacuum chamber 200 in order to align the substrate 10 and the mask 220. The cameras 260 and 261 photograph the substrate 10 and the mask 220 through a window provided in the vacuum chamber 200. By recognizing the alignment mark on the substrate 10 and the alignment mark on the mask 220 from the image, each XY position and relative displacement in the XY plane can be measured. In order to achieve high-precision alignment in a short time, a first alignment that roughly aligns (also referred to as “rough alignment”) and a second alignment that aligns with high accuracy (also referred to as “fine alignment”). It is preferable to perform the two-stage alignment. In that case, it is preferable to use two types of cameras, a low-resolution but wide-field first alignment camera 260 and a narrow-field but high-resolution second alignment camera 261. In the present embodiment, for each of the substrate 10 and the mask 220, alignment marks attached to two locations on a pair of opposing sides are measured by two first alignment cameras 260, and the four corners of the substrate 10 and the mask 220 are measured. The alignment marks attached to are measured with four second alignment cameras 261.

  The film forming apparatus includes a control unit 270. The control unit 270 controls the substrate Z actuator 250, the clamp Z actuator 251, the cooling plate Z actuator 252, the XYθ actuator, and the cameras 260 and 261, as well as transport and alignment of the substrate 10, deposition source control, and film formation control. It has functions such as. The control unit 270 can be configured by a computer having a processor, memory, storage, I / O, and the like, for example. In this case, the function of the control unit 270 is realized by the processor executing a program stored in the memory or storage. As the computer, a general-purpose personal computer may be used, or an embedded computer or a PLC (programmable logic controller) may be used. Alternatively, some or all of the functions of the control unit 270 may be configured by a circuit such as an ASIC or FPGA. Note that a control unit 270 may be provided for each film forming apparatus, or one control unit 270 may control a plurality of film forming apparatuses.

  Note that the components related to holding, transporting, and alignment of the substrate 10 (substrate holding unit 210, substrate Z actuator 250, clamp Z actuator 251, XYθ actuator, cameras 260, 261, control unit 270, etc.) "," Substrate clamping device "," substrate transfer device "and the like.

<Board holding unit>
The configuration of the substrate holding unit 210 will be described with reference to FIG. FIG. 3 is a perspective view of the substrate holding unit 210.
The substrate holding unit 210 is means for holding and transporting the substrate 10 by clamping the peripheral edge portion of the substrate 10 by a clamping mechanism (also called a clamping tool). Specifically, the substrate holding unit 210 includes a plurality of support frames 301 provided with a plurality of support tools 300 that support each of the four sides of the substrate 10 from below, and a plurality of the substrate 10 sandwiched between the support tools 300. And a clamp member 303 provided with the pressing tool 302. The pair of support tools 300 and the pressing tool 302 constitute one clamping mechanism. In the example of FIG. 3, three support tools 300 are arranged along the short side of the substrate 10, and six clamping mechanisms (a pair of the support tool 300 and the pressing tool 302) are arranged along the long side. It is configured to sandwich two sides. However, the configuration of the clamping mechanism is not limited to the example of FIG. 3, and the number and arrangement of the clamping mechanisms may be changed as appropriate in accordance with the size and shape of the substrate to be processed or the film formation conditions. The support tool 300 is also called a “receiving claw” or “finger”, and the pressing tool 302 is also called a “clamp”.

For example, the transfer of the substrate 10 from the transfer robot 119 to the substrate holding unit 210 is performed as follows. First, the clamp member 303 is raised by the clamp Z actuator 251, and the pressing tool 302 is separated from the support tool 300, so that the clamping mechanism is released. After the substrate 10 is introduced between the support tool 300 and the pressing tool 302 by the transfer robot 119, the clamp member 303 is lowered by the clamp Z actuator 251, and the pressing tool 30.
2 is pressed against the support 300 with a predetermined pressing force. As a result, the substrate 10 is sandwiched between the pressing tool 302 and the support tool 300. In this state, by driving the substrate holding unit 210 by the substrate Z actuator 250, the substrate 10 can be moved up and down (moved in the Z direction). Since the clamp Z actuator 251 is raised / lowered together with the substrate holding unit 210, the state of the clamping mechanism does not change even when the substrate holding unit 210 is raised / lowered. Such a configuration is also referred to as substrate lifting / lowering means. The substrate lifting / lowering means may be considered to be included in mounting means including a control unit and an actuator. Note that the mask 220 and the substrate 10 can also be brought into contact with each other by providing a mounting body elevating means for elevating the mask 220. Furthermore, a mounting body lifting / lowering means may be provided together with the substrate lifting / lowering means.

  3 indicates a second alignment alignment mark attached to the four corners of the substrate 10, and reference numeral 102 indicates a first alignment alignment mark attached to the center of the short side of the substrate 10. Show.

<Example of Manufacturing Method of Electronic Device>
Next, an example of an electronic device manufacturing method using the film forming apparatus of the present embodiment will be described. Hereinafter, as an example of an electronic device, a configuration and a manufacturing method of an organic EL display device will be exemplified.
First, an organic EL display device to be manufactured will be described. 4A shows an overall view of the organic EL display device 60, and FIG. 4B shows a cross-sectional structure of one pixel.

  As shown in FIG. 4A, in the display area 61 of the organic EL display device 60, a plurality of pixels 62 each including a plurality of light emitting elements are arranged in a matrix. Although details will be described later, each of the light-emitting elements has a structure including an organic layer sandwiched between a pair of electrodes. Here, the pixel refers to a minimum unit that enables display of a desired color in the display area 61. In the case of the organic EL display device according to this example, the pixel 62 is configured by a combination of the first light emitting element 62R, the second light emitting element 62G, and the third light emitting element 62B that emit different light. The pixel 62 is often composed of a combination of a red light emitting element, a green light emitting element, and a blue light emitting element, but may be a combination of a yellow light emitting element, a cyan light emitting element, and a white light emitting element. It is not limited.

  FIG. 4B is a schematic partial cross-sectional view taken along the line AB of FIG. The pixel 62 includes a first electrode (anode) 64, a hole transport layer 65, one of the light emitting layers 66 </ b> R, 66 </ b> G, and 66 </ b> B, an electron transport layer 67, and a second electrode (cathode) 68 on a substrate 63. And an organic EL element. Among these, the hole transport layer 65, the light emitting layers 66R, 66G, and 66B, and the electron transport layer 67 correspond to the organic layer. In the present embodiment, the light emitting layer 66R is an organic EL layer that emits red, the light emitting layer 66G is an organic EL layer that emits green, and the light emitting layer 66B is an organic EL layer that emits blue. The light emitting layers 66R, 66G, and 66B are formed in patterns corresponding to light emitting elements that emit red, green, and blue (sometimes referred to as organic EL elements). The first electrode 64 is formed separately for each light emitting element. The hole transport layer 65, the electron transport layer 67, and the second electrode 68 may be formed in common with the plurality of light emitting elements 62R, 62G, and 62B, or may be formed for each light emitting element. Note that an insulating layer 69 is provided between the first electrodes 64 in order to prevent the first electrode 64 and the second electrode 68 from being short-circuited by foreign matter. Furthermore, since the organic EL layer is deteriorated by moisture and oxygen, a protective layer 70 for protecting the organic EL element from moisture and oxygen is provided.

In order to form the organic EL layer in units of light emitting elements, a method of forming a film through a mask is used. In recent years, display devices have been improved in definition, and a mask having an opening width of several tens of μm is used for forming an organic EL layer. In the case of film formation using such a mask, if the mask receives heat from the evaporation source during film formation and is thermally deformed, the position of the mask and the substrate is shifted, and the pattern of the thin film formed on the substrate is desired. It will be formed out of position. Therefore, a film forming apparatus (vacuum evaporation apparatus) according to the present invention is suitably used for forming these organic EL layers.

Next, an example of a method for manufacturing an organic EL display device will be specifically described.
First, a circuit (not shown) for driving the organic EL display device and a substrate 63 on which the first electrode 64 is formed are prepared.

  An acrylic resin is formed by spin coating on the substrate 63 on which the first electrode 64 is formed, and the acrylic resin is patterned by a lithography method so that an opening is formed in a portion where the first electrode 64 is formed. 69 is formed. This opening corresponds to a light emitting region where the light emitting element actually emits light.

  The substrate 63 patterned with the insulating layer 69 is carried into the first film formation apparatus, the substrate is held by the substrate holding unit, and the hole transport layer 65 is a common layer on the first electrode 64 in the display region. As a film formation. The hole transport layer 65 is formed by vacuum deposition. Actually, since the hole transport layer 65 is formed in a size larger than the display region 61, a high-definition mask is not necessary.

  Next, the substrate 63 on which the hole transport layer 65 is formed is carried into the second film forming apparatus and held by the substrate holding unit. The substrate and the mask are aligned, the substrate is placed on the mask, and the light emitting layer 66R that emits red is formed on the portion of the substrate 63 where the element that emits red is disposed. According to this example, the mask and the substrate can be satisfactorily overlapped, and highly accurate film formation can be performed.

  Similarly to the formation of the light emitting layer 66R, the light emitting layer 66G that emits green is formed by the third film forming apparatus, and the light emitting layer 66B that emits blue is formed by the fourth film forming apparatus. After the formation of the light emitting layers 66R, 66G, and 66B is completed, the electron transport layer 67 is formed on the entire display region 61 by the fifth film formation apparatus. The electron transport layer 65 is formed as a layer common to the three-color light emitting layers 66R, 66G, and 66B.

  The substrate on which the electron transport layer 65 is formed is moved to the sputtering apparatus, the second electrode 68 is formed, and then the protective layer 70 is formed by moving to the plasma CVD apparatus, and the organic EL display device 60 is completed. To do.

  From when the substrate 63 with the insulating layer 69 patterned is carried into the film formation apparatus until the film formation of the protective layer 70 is completed, if the light emitting layer made of an organic EL material is exposed to an atmosphere containing moisture or oxygen, There is a risk of deterioration due to moisture and oxygen. Therefore, in this example, the carrying-in / out of the substrate between the film forming apparatuses is performed in a vacuum atmosphere or an inert gas atmosphere.

  In the organic EL display device thus obtained, a light emitting layer is accurately formed for each light emitting element. Therefore, if the manufacturing method is used, it is possible to suppress the occurrence of defects in the organic EL display device due to the displacement of the light emitting layer.

<Example 1>
FIGS. 5A to 5E are diagrams showing the flow of the substrate clamping and placing processes according to the first embodiment of the present invention. Each drawing sequentially shows a state in which the sandwiched substrate 10 is placed on the placement body by the substrate holding unit shown in FIG. 3, and the sectional view of the substrate holding unit and the substrate 10 taken along the XZ plane of FIG. It is. If necessary, the pressing tool disposed on one long side (left side in FIG. 5) of the four sides of the clamping mechanism is disposed on the long side (right side in FIG. 5) opposite to the reference numeral 302a. The pressing tool is distinguished by being denoted by reference numeral 302b.

FIG. 5A shows a state in which the substrate 10 is introduced between the support tool 300 and the pressing tool 302 by the transfer robot 119 and the peripheral edge 10 a of the substrate 10 is supported by the support tool 300. Since the substrate 10 is not fixed in the state of FIG. 5A, the center of the substrate 10 is bent.

In FIG. 5B, the clamp Z actuator 251 lowers the clamp member 303 in accordance with the control of the control unit 270, so that the pressing tools 302a and 302b are lowered, and the substrate 10 is sandwiched between the support tool 300. To do. Here, the control unit 270 generates a normal pinching force between the pressing tool 302a within one side (one long side) and the support tool 300 (the downward arrow indicated as “normal” in the drawing). ), Or a pinching force that is weaker than usual is generated between the pressing tool 302b on the other long side facing the support tool 300, or no pinching force is generated ("weak" in the figure).
or Free Arrow "). Such control can be carried out, for example, by changing the pressing force by the clamp Z actuator 251 on the left and right. Thus, the control of the present invention is possible because the pinching force is variable. A control unit or each actuator that enables control to vary the clamping force may be referred to as clamping force varying means.

  The clamping force between the pressing tool 302a and the support tool 300 is preferably a force that does not easily shift the substrate 10. On the other hand, the clamping force between the pressing tool 302b and the support tool 300 is such that when a certain amount of force is applied to the substrate 10, the substrate 10 between the pressing tool 302b and the support tool 300 is displaced to change the clamping position. Is preferred. In addition, since the friction force between the board | substrate 10 and the clamping mechanism contributes to the clamping force which a clamping mechanism hold | maintains the board | substrate 10 besides the force applied to the pressing tools 302a and 302b, the force applied to the pressing tool 302b is applied. When controlling, it is preferable to also consider a frictional force.

  FIG. 5C shows a state in which the clamping force on one side is weak or zero as shown in FIG. 5B, the substrate Z actuator 250 lowers the substrate 10, and the substrate 10 contacts the mask 220 which is a mounting body. Shows the state.

FIG. 5D shows a state in which the substrate Z actuator 250 further lowers the substrate 10 from the state of FIG. 5C and the contact area between the substrate 10 and the mask 220 is increased. At this time, it can be seen that the shape of the substrate 10 is changed due to the stress from the mask 220 and the bending that has occurred in the center of the substrate, causing distortion. In the conventional clamping method and mounting method, this shape change has caused time for alignment of the substrate 10.
However, in the present invention, the clamping force between the pressing tool 302b and the support tool 300 is weaker or zero than the clamping force between the pressing tool 302a and the support tool 300. Therefore, as shown in FIG. 5D, a stress in the direction indicated by the arrow 501 is generated on the substrate 10 between the pressing tool 302 b and the support tool 300 due to the stress from the mask 220. As a result, the bending and distortion of the substrate 10 are eliminated as shown in FIG. 5E, and the contact state between the substrate 10 and the mask 220 is improved.

  FIG. 6A shows a state in which the substrate 10 is normally held by the holding mechanism, and is a plan view of the substrate holding unit of FIG. As described in the explanation of FIG. 3, on the short side, the peripheral edge portion 10 a of the substrate is merely placed on the support 300 and is not clamped. On the long side, the peripheral edge portion 10 a of the substrate is sandwiched between the support tool 300 and the pressing tool 302.

  FIG. 6B shows a state of clamping described with reference to FIG. In the left long side in the figure, the peripheral edge portion 10a of the substrate is held between the support tool 300 and the pressing tool 302a by a normal holding force. On the other hand, in the long feature on the right side in the figure, the peripheral edge portion 10a of the substrate is clamped with a clamping force weaker than that of the left side or is not clamped. Thereby, after the substrate 10 comes into contact with the mask 220, a displacement force is generated in the direction indicated by the arrow 501.

According to the clamping method using the clamping mechanism (clamping device) of the present embodiment and the substrate mounting method using the substrate mounting device including the clamping mechanism, the substrate 10 is placed on the mask 220 which is a placement body. The distortion at the time is reduced or eliminated by shifting the substrate 10 to the side where the pinching force is weak (or the side where the pinching force is zero). In other words, the direction in which the substrate 10 is displaced at the time of mounting becomes constant, and reproducibility is exhibited in the direction of displacement (the amount and direction of displacement). As a result, alignment between the mask 220 and the substrate 10 can be carried out satisfactorily, and the effects of shortening the alignment time and improving the alignment accuracy can be obtained. The holding device, the camera used for alignment, and the position adjusting means (such as an actuator) for adjusting the relative position can be combined to be considered as an alignment mechanism.
Note that the clamping force control of this embodiment can be applied to any scene before the first alignment, between the first alignment and the second alignment, and after the second alignment.

<Example 2>
If the control is such that a normal clamping force is applied to one of the long sides of the substrate 10 and a weaker clamping force than the normal is applied to the other (or the clamping force is zero) as described in the first embodiment, This can be realized by a clamping mechanism provided in the substrate holding unit shown in FIG. In this embodiment, a configuration for reducing distortion of the substrate 10 by performing more precise pinching force control will be described.

  FIG. 7A is a schematic diagram showing the main part of the substrate holding unit according to the present embodiment. The substrate holding unit includes a plurality of clamping mechanisms that are independent of each other. In FIG. 7A, a plurality of clamping mechanisms are arranged on both long sides of the substrate 10, and the configuration on both short sides is omitted. However, a clamping mechanism may be provided on the short side, or only the support 300 may be provided on the short side as in FIG.

  FIG. 7B shows one clamping mechanism according to this embodiment. Each clamping mechanism includes a pressing tool 302 and a supporting tool 300 supported by a support body 305. For example, the clamping force between the pressing tool 302 and the support tool 300 is changed by an individual Z actuator (not shown) incorporated in the support body 305 moving the pressing tool 302 up and down in the Z direction according to the control of the control unit 270. To do.

  For example, the pressing tool 302 and the support tool 400 are in a state where a normal clamping force is applied so that the substrate 10 is not displaced, or a weak clamping force is applied such that the substrate 10 is displaced when a certain amount of force is applied. And a state where no pinching force is applied (the pinching force is zero). That is, as shown in FIG. 7C, when the substrate 10 is placed by weakening or reducing the pinching force between the pressing tool 302 and the support tool 300 to the direction indicated by the arrow 501. Will occur.

  An example of individual control of the clamping mechanism will be described. FIG. 7 (a) shows eight clamping mechanisms on each long side. In one of these, the central four are normal clamping forces and the four ends are weak clamping forces. In addition, on the side opposite to it, the clamping force is weakened or made zero. As a result, the distortion generated by the placement can easily escape not only in the long side direction on the side where the clamping force is weak (or zero) but also in the short side direction.

As described above, according to the configuration of the present embodiment, the amount and direction of displacement when the substrate 10 is placed on the mask 220 which is a placement body by controlling the clamping force for each of the plurality of clamping mechanisms provided. Can be controlled precisely.
Note that the clamping force control using the clamping mechanism of the present embodiment can be applied to any scene before the first alignment, between the first alignment and the second alignment, and after the second alignment.

<Example 3>
FIGS. 8A to 8E are diagrams illustrating the flow of the substrate clamping and placing processes according to the third embodiment of the present invention. Each drawing sequentially shows a state in which the sandwiched substrate 10 is placed on the placement body by the substrate holding unit shown in FIG. 3, and the sectional view of the substrate holding unit and the substrate 10 taken along the XZ plane of FIG. It is. Members common to those in FIG.

  FIG. 8A shows a state in which the substrate 10 is introduced between the support tool 300 and the pressing tool 302 by the robot hand of the transfer robot 119. Further, the peripheral edge portion on the short side of the substrate 10 is supported by a support 300 for the short side.

  In FIG. 8B, when the robot hand moves backward, the peripheral edge of the long side of the substrate 10 is supported by the support 300, and the clamp Z actuator 251 is clamped by the clamp member 303 according to the control of the control unit 270. Is lowered, and the pressing tools 302 a and 302 b are lowered to sandwich the substrate 10 with the support tool 300. At this time, in the region not supported by the support tool 300, the substrate 10 is bent. 8B, as in FIG. 5B, a strong pinching force is generated on the pressing tool 302a side, and a weak pinching force is generated on the pressing tool 302b side (or no pinching force is generated). Control. The preferable relationship between the pressing force on the pressing tool 302a side and the pressing force on the pressing tool 302b side is the same as that described with reference to FIG. That is, on the side of the pressing tool 302 b, a force that can move the substrate 10 between the pressing tool 302 b and the support tool 300 by the force applied to the substrate 10 is preferable.

  Note that the substrate holding unit of this embodiment includes a central support 306 that supports the central portion of the substrate 10. The central support 306 moves up and down in the Z direction under the control of the control unit 270, so that the bending of the substrate 10 can be reduced to some extent. In FIG. 8C, the center support 306 is raised while the pinching force on one long side is weak or zero, and a displacement force is generated in the direction of the arrow 501. Here, since the clamping force applied to the substrate 10 is after the substrate 10 can move, the substrate 10 is shifted to the right side. Thereby, a part of bending of the board | substrate 10 is eliminated.

  In FIG. 8D, the substrate Z actuator 250 lowers the substrate 10 and the substrate 10 is placed on the mask 220. At this time, due to the stress from the mask 220, a displacement force in the direction indicated by the arrow 501 is generated again on the substrate 10 between the pressing tool 302b and the support tool 300. As a result, the bending and distortion of the substrate 10 are eliminated as shown in FIG. 8E, and the contact state between the substrate 10 and the mask 220 is improved.

  In FIG. 8E, it is also preferable to perform the second alignment based on the imaging result of the alignment marks by the cameras 260 and 261 and further adjust the relative position between the substrate 10 and the mask 220. At that time, the clamping force on the pressing tool 302b side may be set to a normal value. Thereby, alignment can be performed in a state where the substrate 10 is stable.

As described above, according to the clamping method using the clamping mechanism (clamping device) of the present embodiment and the substrate mounting method using the substrate mounting apparatus including the clamping mechanism, the substrate by the movement of the central support 306 is used. The distortion of the substrate 10 can be satisfactorily reduced through a plurality of stages of displacement of 10 and displacement of the substrate 10 due to placement on the mask 220. As a result, the effects of shortening the alignment time and improving the alignment accuracy can be obtained.
Note that the clamping force control of this embodiment can be applied to any scene before the first alignment, between the first alignment and the second alignment, and after the second alignment.

<Example 4>
FIGS. 9A to 9F are diagrams illustrating the flow of the substrate clamping and placing processes according to the fourth embodiment of the present invention. Each drawing sequentially shows a state in which the sandwiched substrate 10 is placed on the placement body by the substrate holding unit shown in FIG. 3, and the sectional view of the substrate holding unit and the substrate 10 taken along the XZ plane of FIG. It is. Members common to FIGS. 5 and 8 are denoted by the same reference numerals.

  FIG. 9A shows a state in which the substrate 10 is introduced between the support tool 300 and the pressing tool 302 by the robot hand, as in FIG. 8A.

  In FIG. 9B, the peripheral edge on the long side of the substrate 10 is supported by the support tool 300 by the robot hand moving backward.

  In FIG. 9C, the clamp Z actuator 251 lowers the clamp member 303 according to the control of the control unit 270, so that the pressing tools 302 a and 302 b are lowered and the substrate 10 is sandwiched between the support tool 300. To do. Also in FIG. 9C, control is performed such that a strong pinching force is generated on the pressing tool 302a side and a weak pinching force is generated on the pressing tool 302b side (or no pinching force is generated). Further, in FIG. 9C, when the central support 306 is raised in the Z direction and comes into contact with the substrate 10, a displacement force is generated in the direction of the arrow 501 so that the substrate 10 is displaced to the right on the paper surface. . Thereby, a part of bending of the board | substrate 10 is eliminated.

  FIG. 9D shows an operation unique to the present embodiment. Before placing the substrate 10 on the mask 220, the relative position between the substrate 10 and the mask 220 is determined based on the result of imaging the alignment mark by the camera 260. The first alignment to be adjusted is performed. Thus, by performing the first alignment before the substrate 10 contacts the mask 220, the accuracy of the second alignment performed after the contact with the mask 220 is improved thereafter.

  In FIG. 9E, the substrate 10 is placed on the mask 220 by the operation of the substrate Z actuator 250. At this time, due to the stress from the mask 220, a displacement force in the direction indicated by the arrow 501 is generated again on the substrate 10 between the pressing tool 302b and the support tool 300. As a result, the bending and distortion of the substrate 10 are eliminated as shown in FIG. 9F, and the contact state between the substrate 10 and the mask 220 is improved. In FIG. 9F, it is also preferable to perform the second alignment based on the imaging result of the alignment mark by the camera 261 and further adjust the relative position between the substrate 10 and the mask 220. At that time, the clamping force on the pressing tool 302b side may be set to a normal value. As a result, the holding position of the substrate 10 can be fixed, and the holding forces on the opposite sides are the same, so that the alignment can be stably performed.

As described above, according to the clamping method using the clamping mechanism (clamping device) of the present embodiment and the substrate mounting method using the substrate mounting apparatus including the clamping mechanism, the substrate by the movement of the central support 306 is used. The positional deviation and distortion of the substrate 10 can be satisfactorily reduced through a plurality of stages of deviation of 10, first alignment, and deviation of the substrate 10 due to placement on the mask 220. As a result, the effects of shortening the alignment time and improving the alignment accuracy can be obtained.
Note that the clamping force control of this embodiment can be applied to any scene before the first alignment, between the first alignment and the second alignment, and after the second alignment.

  10: Substrate, 210: Substrate holding unit, 220: Mask, 251: Substrate Z actuator, 270: Control unit, 300: Support tool, 302: Pressing tool

Claims (31)

Clamping means having a plurality of clamping tools for clamping the peripheral edge of the substrate;
A substrate mounting device having mounting means for mounting the substrate on a mounting body,
The clamping means has clamping force variable means for varying the clamping force of the plurality of clamping tools,
The substrate mounting apparatus, wherein the clamping force varying means varies the clamping force of a part of the plurality of clamping tools independently of the other clamping tools.   The part of the sandwiching tool is a sandwiching tool that sandwiches one side of the peripheral portion of the substrate, and the other sandwiching tool sandwiches the inside of the peripheral portion of the substrate that faces the one side. The substrate mounting apparatus according to claim 1, wherein the substrate mounting apparatus is a holding tool.   3. The substrate mounting apparatus according to claim 1, wherein each of the part of the clamping tools and the other clamping tool includes a plurality of clamping tools. 4. Clamping means having a plurality of clamping tools for clamping the peripheral edge of the substrate;
A substrate mounting device having mounting means for mounting the substrate on a mounting body,
The clamping means has clamping force variable means for varying the clamping force of the plurality of clamping tools,
The substrate mounting apparatus, wherein the clamping force varying means is a clamping force varying means that varies the clamping force of the plurality of clamping tools independently for each clamping tool.   A part of the plurality of holding tools is a holding tool that holds the inside of one side of the peripheral portion of the substrate, and the other holding tools are the one side of the peripheral portion of the substrate. The substrate mounting apparatus according to claim 4, wherein the substrate mounting apparatus is a holding tool that holds the opposite sides.   The substrate mounting apparatus according to claim 5, wherein each of the part of the holding tools and the other holding tool includes a plurality of holding tools.   The clamping tool of the clamping means includes a support tool for supporting the substrate and a pressing tool for pressing the substrate against the support tool. The substrate mounting apparatus according to the above.   The substrate mounting apparatus according to claim 1, wherein the placing unit includes a substrate lifting unit for moving the substrate up and down.   The substrate placing apparatus according to claim 1, wherein the placing means includes placing body lifting / lowering means for lifting and lowering the placing body. The substrate mounting apparatus according to any one of claims 1 to 9,
An alignment apparatus comprising: a position adjusting means for adjusting a relative position between the substrate and the mounting body.   The alignment apparatus according to claim 10, wherein the mounting body is a mask having the predetermined pattern, which is used to form a predetermined pattern on the substrate.   A film forming apparatus comprising the alignment apparatus according to claim 11, wherein the predetermined pattern is formed on the substrate. A clamping step of clamping the peripheral edge of the substrate with a plurality of clamping tools;
A substrate mounting method including a mounting step of mounting the sandwiched substrate on a mounting body,
In the clamping step, the substrate is clamped by differentiating the clamping force of some clamping tools and the clamping force of other clamping tools among the plurality of clamping tools.   In the clamping step, the inside of one side of the peripheral part of the substrate is clamped by the part of the clamping tool, and the inside of the side facing the one side of the peripheral part of the substrate is clamped by the other clamping tool. The substrate mounting method according to claim 13.   The clamping step is characterized in that one of the clamping devices and the other clamping device clamps the substrate with a clamping force that can move the clamping position of the substrate being clamped. The substrate mounting method according to claim 13 or 14.   16. The substrate according to claim 15, wherein the clamping force that allows the clamping position to move is a clamping force that allows the clamping position to be moved by a force applied to the substrate from the placement body in the placement step. Placement method.   2. The mounting step according to claim 1, wherein after the substrate is placed on the mounting body, the partial clamping tool and the other clamping tool clamp the substrate with the same clamping force. The substrate mounting method according to any one of 13 to 16.   In the placing step, after the substrate is placed on the placing body, the part of the sandwiching tool and the other sandwiching tool sandwich the substrate with a sandwiching force capable of fixing the sandwiching position of the substrate. The substrate mounting method according to claim 13, wherein the substrate mounting method is performed. A clamping step of clamping the peripheral edge of the substrate with a clamping tool;
A substrate mounting method including a mounting step of mounting the sandwiched substrate on a mounting body,
In the clamping step, the inside of one side of the peripheral portion of the substrate is clamped by the clamping tool.   20. The substrate mounting method according to claim 19, wherein in the clamping step, a plurality of the clamping tools are clamped within one side of the peripheral edge of the substrate.   In the placing step, after placing the substrate on a placing body, the holding tool sandwiches one side of the peripheral portion of the substrate, and the other holding device holds the one of the peripheral portions of the substrate. 21. The substrate mounting method according to claim 19, wherein the inside of the side facing one side is sandwiched.   The substrate holding method according to claim 21, wherein the holding device and the other holding device hold the substrate with the same holding force after the substrate is placed on the mounting body.   The holding device and the other holding device hold the substrate with a holding force capable of fixing a holding position of the substrate after the substrate is placed on the mounting body. 22. The substrate mounting method according to 21.   The substrate mounting according to any one of claims 13 to 23, further comprising a first position adjusting step of adjusting a relative position between the substrate and the mounting body before the placing step. Placement method.   25. A second method of adjusting a relative position between the substrate and the mounting body after mounting the substrate on the mounting body by the substrate mounting method according to any one of claims 13 to 24. An alignment method comprising the step of adjusting the position.   The substrate mounting method according to any one of claims 13 to 24, wherein after placing the substrate on the mounting body, the substrate is separated from the mounting body, and the substrate and the front An alignment method comprising: a second position adjustment step of adjusting a relative position with the placing object.   27. The alignment method according to claim 25 or 26, wherein the mounting body is a mask having the predetermined pattern used to form a predetermined pattern on the substrate.   28. A film forming method for forming a predetermined pattern on the substrate, wherein after the relative position of the substrate and the mask is adjusted by the alignment method according to claim 27, the substrate is formed on the substrate. A film forming method, wherein a film having a predetermined pattern is formed. A method of manufacturing an electronic device having an organic film formed on a substrate,
29. A method of manufacturing an electronic device, wherein the organic film is formed by the film forming method according to claim 28. A method of manufacturing an electronic device having a metal film formed on a substrate,
29. A method of manufacturing an electronic device, wherein the metal film is formed by the film forming method according to claim 28.   The method of manufacturing an electronic device according to claim 29 or 30, wherein the electronic device is a display panel of an organic EL display device.

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