KR102669903B1 - 기판 처리 장치 - Google Patents
기판 처리 장치 Download PDFInfo
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- KR102669903B1 KR102669903B1 KR1020160110879A KR20160110879A KR102669903B1 KR 102669903 B1 KR102669903 B1 KR 102669903B1 KR 1020160110879 A KR1020160110879 A KR 1020160110879A KR 20160110879 A KR20160110879 A KR 20160110879A KR 102669903 B1 KR102669903 B1 KR 102669903B1
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- 239000000758 substrate Substances 0.000 title claims abstract description 52
- 230000005415 magnetization Effects 0.000 claims description 10
- 230000002093 peripheral effect Effects 0.000 claims description 5
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 235000012489 doughnuts Nutrition 0.000 claims 1
- 238000000034 method Methods 0.000 description 19
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 238000000151 deposition Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009429 electrical wiring Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
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- Condensed Matter Physics & Semiconductors (AREA)
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- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Drying Of Semiconductors (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
Description
도 2는 도 1의 기판 처리 장치의 자기 기어를 설명하는 평면 개념도이다.
도 3a는 도 1의 정전척을 설명하는 평면도이다.
도 3b는 도 3a의 정전척을 설명하는 단면도이다.
도 4a는 본 발명의 다른 실시예에 따른 정전척을 설명하는 평면도이다.
도 4b는 도 4a의 정전척을 설명하는 단면도이다.
도 5a는 본 발명의 또 다른 실시예에 따른 정전척을 설명하는 평면도이다.
도 5b는 도 5a의 정전척을 설명하는 단면도이다.
102: 챔버
124: 제1 디스크(124)
130: 제2 자기 기어
140: 제1 자기 기어
150: 제1 회전형 커넥터 구조체
162: 제2 디스크
Claims (8)
- 중심축에서 일정한 반경 상에 주기적으로 배치되는 복수의 안착홀을 포함하고 챔버 내에 배치되어 회전하는 제1 디스크;
상기 안착홀에 각각 배치되고 상기 제1 디스크의 회전에 따라 같이 공전하면서 자전하는 복수의 제2 디스크;
상기 제2 디스크와 상기 안착홀 사이에 배치되어 상기 제2 디스크에 자전운동을 제공하면서 전기적 연결을 제공하는 제1 회전형 커넥터 구조체;
상기 제1 회전형 커넥터 구조체를 통하여 전력을 공급받아 기판을 고정하고 상기 제2 디스크에 장착된 정전척; 및
상기 제2 디스크에 고정되어 상기 제2 디스크에 회전력을 제공하는 제1 자기 기어; 및
상기 챔버 내에 배치되고 상기 제1 자기 기어와 자기적으로 상호 작용하고 회전하지 않는 제2 자기 기어를 포함하는 것을 특징으로 하는 기판 처리 장치. - 제1 항에 있어서,
상기 제1 자기 기어는,
상기 제2 디스크와 고정 결합하는 원판 형태의 회전 자석 지지판; 및
서로 교번하는 자화 방향을 가지고 상기 회전 자석 지지판의 원주 상에 일정한 간격으로 배치된 복수의 제1 영구 자석을 포함하고,
상기 제2 자기 기어는,
상기 챔버의 하부면과 상기 제1 디스크 사이에 배치되고 와셔 또는 도넛 형태의 고정 자석 지지판; 및
상기 고정 자석 지지판의 원주 상에 배치되고 서로 교번하는 자화 방향을 가지는 복수의 제2 영구 자석을 포함하고,
상기 제1 영구 자석과 상기 제2 영구 자석은 상기 제2 디스크의 회전 상태에 따라 인력 또는 척력을 제공하여 상기 제2 디스크를 회전시키는 것을 특징으로 하는 기판 처리 장치. - 제1 항에 있어서,
상기 정전척은,
정전척 몸체;
상기 정전척 몸체의 상부면에서 함몰된 전극 안착부;
상기 전극 안착부를 채우는 절연부재; 및
상기 절연 부재에 매몰된 한 쌍의 정전 전극을 포함하는 것을 특징으로 하는 기판 처리 장치. - 제3 항에 있어서,
상기 한 쌍의 전극 각각은 반원 형태 또는 동심원(concentric) 구조의 와셔 형태인 것을 특징으로 하는 기판 처리 장치. - 제1 항에 있어서,
상기 제1 디스크의 중심축에서 수직으로 연장되는 제1 디스크 중심축;
상기 제1 디스크 중심축을 감싸도록 배치되어 상기 제1 디스크 중심축을 진공 밀봉하고 상기 챔버의 하부면에서 상기 챔버의 외부로 연장되는 주름관 구조체;
상기 주름관 구조체를 관통하는 상기 제1 디스크 중심축의 일단과 축결합하고 회전 운동을 제공하면서 전기적 연결을 제공하는 제2 회전형 커넥터 구조체; 및
상기 제1 디스크 중심축을 회전시키는 회전 구동부 중에서 적어도 하나를 포함하는 것을 특징으로 하는 기판 처리 장치. - 제1 항에 있어서,
상기 제2 자기 기어를 연직 방향으로 이동시키어 상기 제1 자기 기어의 배치 평면과 상기 제2 자기 기어의 배치 평면을 서로 일치시키는 자기 기어 수직 이동부를 포함하고,
상기 자기 기어 수직 이동부는,
상기 챔버의 외부에 배치된 선형 운동을 제공하는 자기 기어 수직 구동부; 및
상기 자기 기어 수직 구동부와 상기 제2 자기 기어를 연결하는 연결봉을 포함하는 것을 특징으로 하는 기판 처리 장치. - 제1 항에 있어서,
상기 제1 회전형 커넥터 구조체는,
서로 수직으로 이격되어 배치된 상부 베어링 및 하부 베어링;
상기 상부 베어링과 상기 하부 베어링 사이에 배치된 슬립링 몸체;
상기 슬립링 몸체의 외주면에 배치된 복수의 슬립링; 및
상기 슬립링에 전기적으로 연결되는 브러쉬를 포함하는 것을 특징으로 하는 기판 처리 장치. - 제1 항에 있어서,
상기 정전척은:
정전척 몸체;
상기 정전척 몸체의 상부면에서 배치된 워셔 또는 도넛 형상의 절연부재; 및
상기 절연 부재의 상부면에 패터닝된 정전 전극을 포함하는 것을 특징으로 하는 기판 처리 장치.
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020160110879A KR102669903B1 (ko) | 2016-08-30 | 2016-08-30 | 기판 처리 장치 |
CN201780052825.XA CN109643641B (zh) | 2016-08-30 | 2017-08-22 | 基板处理装置 |
US16/328,273 US11361984B2 (en) | 2016-08-30 | 2017-08-22 | Substrate processing apparatus |
JP2019532906A JP7055806B2 (ja) | 2016-08-30 | 2017-08-22 | 基板処理装置 |
PCT/KR2017/009107 WO2018043976A1 (en) | 2016-08-30 | 2017-08-22 | Substrate processing apparatus |
TW106129475A TWI716632B (zh) | 2016-08-30 | 2017-08-30 | 基板處理裝置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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KR1020160110879A KR102669903B1 (ko) | 2016-08-30 | 2016-08-30 | 기판 처리 장치 |
Publications (2)
Publication Number | Publication Date |
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KR20180024520A KR20180024520A (ko) | 2018-03-08 |
KR102669903B1 true KR102669903B1 (ko) | 2024-05-28 |
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KR1020160110879A Active KR102669903B1 (ko) | 2016-08-30 | 2016-08-30 | 기판 처리 장치 |
Country Status (6)
Country | Link |
---|---|
US (1) | US11361984B2 (ko) |
JP (1) | JP7055806B2 (ko) |
KR (1) | KR102669903B1 (ko) |
CN (1) | CN109643641B (ko) |
TW (1) | TWI716632B (ko) |
WO (1) | WO2018043976A1 (ko) |
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KR102408889B1 (ko) * | 2017-06-16 | 2022-06-14 | 주성엔지니어링(주) | 기판 처리 장치 |
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JP2019528581A (ja) | 2019-10-10 |
JP7055806B2 (ja) | 2022-04-18 |
TW201807740A (zh) | 2018-03-01 |
CN109643641B (zh) | 2023-06-23 |
TWI716632B (zh) | 2021-01-21 |
KR20180024520A (ko) | 2018-03-08 |
US20200335387A1 (en) | 2020-10-22 |
CN109643641A (zh) | 2019-04-16 |
US11361984B2 (en) | 2022-06-14 |
WO2018043976A1 (en) | 2018-03-08 |
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