KR102647501B1 - Semiconductor Device Test Chamber - Google Patents

Abstract

The semiconductor device test chamber 100 of this invention includes a housing 110 that forms an exterior with a portion of the front open, a blower fan 120 disposed inside one lower side of the housing 110, and a blower fan 120. ) a circulation duct 130 that circulates the air discharged from the circulation duct 130, a distribution duct 140 disposed long in the vertical direction along one inner side of the housing 110 in communication with the circulation duct 130, and a distribution duct Part of the side space of (140) is divided into multiple layers in the vertical direction, and a plurality of air buckets (150) each receive air individually from the distribution duct (140) and blow out in the lower direction, and a plurality of air buckets (150) ) is located at the rear of the connection board 160, which is connected to a test device that performs actual testing of semiconductor elements and is connected to a plurality of modules each loaded with a plurality of semiconductor elements for testing, and the rear of the blower fan 120. An evaporator (which is disposed in a plurality of air buckets 150 and is each ejected from a plurality of air buckets 150 to flow along a plurality of semiconductor elements arranged below the evaporator and then cooled by passing the air flowing toward the lower blower fan 120 of the housing 110). 170), and a heater 175 capable of heating the air that has passed through the evaporator 170.

Description

Semiconductor Device Test Chamber}

This invention relates to a semiconductor device test chamber. More specifically, it is possible to test all semiconductor devices arranged in multiple divided layers at a uniform temperature distribution, and also allows modules loaded with semiconductor devices to be smoothly mounted using a robot, etc. and a removable semiconductor device test chamber.

Typically, semiconductor devices that have completed a certain semiconductor manufacturing process are inspected through a test chamber (test equipment) to determine whether they are performing properly.

An example of the test equipment is a Monitoring Burn-in Tester. Typical monitoring burn-in test equipment is a type of reliability test to find early defective devices before supplying semiconductor devices to consumers or installing them in a system. It is common.

To briefly explain the monitoring burn-in test equipment, semiconductor devices are placed under stress in a specific environment and devices that have defects, abnormalities, or are likely to fail immediately are removed. For this purpose, the monitoring burn-in test equipment applies thermal stress to the semiconductor device at a high temperature of approximately 80 to 125 degrees Celsius. During the burn-in test, the semiconductor device operates at a high temperature and a high electric field, so the defect mechanism is accelerated. do.

Therefore, initially defective devices that do not have a long lifespan cannot withstand the harsh conditions during the burn-in test and generate defects. Good quality semiconductor devices that pass this burn-in test can guarantee a long lifespan and thus improve system reliability.

Meanwhile, a semiconductor device includes a solid state drive (SSD). Since the SSD is used as an auxiliary storage device in various computer products, it is tested for defects through repeated writing and reading operations multiple times. At this time, the defect is checked with the SSD installed in each slot of a test board with multiple slots.

In this way, when testing whether a semiconductor device (SSD, etc.) is defective using test equipment, the semiconductor device is inspected for defects while each semiconductor device is mounted on a slot of a test board or test tray with multiple slots.

However, when inspecting a semiconductor device as described above for defects, depending on the type of device and/or usage environment, the heat generated by the device itself may be used during the inspection, or heat (heating) or cold air (cooling) may be supplied from the outside. needs to be inspected. Additionally, multiple semiconductor devices must be inspected under uniform temperature conditions.

For example, in the case of SSDs, since multiple repetitive writing and reading operations are performed during testing, significant heat is generated from the test circuit and the SSD under test during testing, so stable temperature control is essential. In addition, more accurate and reliable test results can be obtained only when the test is performed with repeated writing and reading operations while all SSDs under test are maintained under the same temperature conditions.

Korean Patent Registration No. 10-1796013 discloses an “auxiliary memory test chamber” applied for and registered by the present applicant. This technology sprays air circulating through a duct and blower fan with a circulation structure evenly onto a plurality of auxiliary memory devices mounted on the test board through a plurality of air purge plates, each with a plurality of purge holes. It is designed to minimize the temperature difference between the teeth.

However, in the above technology, a plurality of auxiliary memory devices are arranged in a row in the depth direction of the test chamber, for example, forming 4 rows in the width direction, and air circulating along a duct placed on one side is auxiliary. It is configured to be sprayed through the purge hole of the air purge plate located at the top of the storage device, blown to the auxiliary memory device located below, and then circulated by the blower fan located on the other side. That is, the air blown from the top of the auxiliary memory devices in the outermost row on one side is configured to sequentially circulate through the auxiliary memory devices in the next row on the other side. Therefore, multiple auxiliary memory devices are inevitably affected by heat generated from auxiliary memory devices in the adjacent row depending on the position of the rows in which they are arranged, and as a result, there is a limit to minimizing the temperature difference between auxiliary memory devices.

Meanwhile, when loading semiconductor elements into slots of a test board or test tray mounted on a rack of test equipment, or mounting a test board or test tray on which a plurality of semiconductor elements are respectively loaded, a robot, etc. is used. It is necessary to automate it. However, Patent Registration No. 10-1796013 has structural limitations in automation due to the arrangement of multiple auxiliary memory devices in the depth direction of the test chamber and the structure of the test board on which they are mounted.

Korean Patent Registration No. 10-1796013

Therefore, this invention was developed to solve the problems of the prior art as described above, and the air blowing out from the corresponding air bucket of the plurality of split layers flows to have an even and stable temperature distribution of the semiconductor elements arranged below. Afterwards, it is structured to flow and circulate toward the blower fan at the bottom of the housing using the suction force of the blower fan located at the bottom of the housing without affecting the semiconductor elements arranged in other split layers, so that all of the semiconductor elements arranged in the multiple split layers are structured to circulate. The purpose is to provide a semiconductor device test chamber that can test semiconductor devices at a uniform temperature distribution.

In addition, in this invention, as the connection part of the connection board connected to the test device is directed toward the front, the module and/or cassette can be smoothly mounted and detached by guiding the module and/or cassette along the rack with a robot or the like from the front to the back in the horizontal direction. This is possible, and as both corners of the multiple semiconductor devices loaded in the module are arranged in the left and right directions in the vertical direction, the air blowing out from the air bucket located on the top of the multiple semiconductor devices Another purpose is to provide a semiconductor device test chamber with an ideal flow structure that flows between devices toward the blower fan at the bottom of the housing.

A semiconductor device test chamber of this invention for achieving the above object includes a housing having an appearance in which a portion of the front part is open; a blower fan disposed inside one lower side of the housing; a circulation duct that circulates air discharged from the blower fan; a distribution duct that is in communication with the circulation duct and is arranged vertically along one inner side of the housing, and has an internal passage that gradually narrows toward the top; A portion of the side space formed on the side of the distribution duct is divided into multiple layers in the vertical direction, and a plurality of air buckets each individually receive air from the distribution duct and each blow out in a downward direction; A state in which a plurality of modules, each loaded with a plurality of semiconductor elements for testing, are located behind the plurality of air buckets and connected to a test device that performs actual testing of semiconductor devices, respectively, in a partition layer between the air buckets. a connection board having a connection part on the front side that can be connected to; It is disposed at the rear of the blower fan, is ejected from each of the plurality of air buckets, flows along a plurality of semiconductor elements arranged below the air bucket, and then flows toward the blower fan at the bottom of the housing by the suction force of the blower fan. An evaporator capable of being cooled by passing it through; and a heater capable of heating the air that has passed through the evaporator.

In addition, according to this invention, the air bucket has a flat hollow box shape with one side open to communicate with the distribution duct, and the lower surface of the air bucket has multiple rows of air blowing lines that blow air in the downward direction. It is located in the direction of the distance from the distribution duct, and the plurality of rows of air blowing lines are formed by forming a row of air blowing holes having the same size, and are located at a distance from the distribution duct to adjust the temperature distribution between them. It is desirable to have the same or different number of columns for each column.

Additionally, according to this invention, it is more preferable that the lower surface of the air bucket has a certain thickness so that the air blown out along the air blowing line can flow straight downward.

In addition, according to this invention, the air bucket preferably has a two-stage air flow line communicating with the distribution duct, and the air supplied to the upper line passes to the opposite side of the distribution duct and is discharged.

In addition, according to this invention, a cassette capable of storing a plurality of semiconductor devices for testing, and a cassette configured to enable attachment and detachment of the cassette and connected to the connection board to enable testing of a plurality of semiconductor devices It further includes a module and a rack that guides the module so that the module can be smoothly connected to or separated from the connection board, and the cassette and the module are installed in a plurality on each division layer as a set, and the module is loaded into the module. It is preferable that the plurality of semiconductor devices are mounted with both corners erected vertically and arranged in the left and right directions.

In addition, according to this invention, the module has an internal structure in which the cassette is mounted or detached in a manner in which the cassette is stored by sliding along the inside, and an external structure in which the cassette is mounted or detached on the connection board by sliding along the rack, and has a lower part. An open case, a plurality of semiconductor elements fixed to the open lower part of the case and stored in the cassette are connected for testing, and a plurality of connection parts and circuits for connecting them to the connection board are provided on the upper and lower surfaces, respectively. It is provided with a mounting portion, wherein the mounting portion further has a plurality of LEDs on a lower surface for checking the status of the tested semiconductor device, and the case displays the status of each of the plurality of LEDs so that the status of each of the plurality of LEDs can be checked from the outside. It is more desirable to further provide a plurality of LED pipes each connected to the LEDs.

In this invention, the air blowing out from the corresponding air bucket of a plurality of split layers flows to have an even and stable temperature distribution of the semiconductor elements arranged at the bottom, and then flows into the housing without affecting the semiconductor elements arranged in other split layers. Since it has a structure that flows and circulates toward the blower fan at the bottom of the housing due to the suction force of the blower fan located at the bottom, it is possible to test all semiconductor devices arranged in multiple divided layers with uniform temperature distribution.

In addition, in this invention, as the connection part of the connection board connected to the test device is directed toward the front, the module and/or cassette can be smoothly mounted and detached by guiding the module and/or cassette along the rack with a robot or the like from the front to the back in the horizontal direction. This is possible, and as both corners of the multiple semiconductor devices loaded in the module are arranged in the left and right directions in the vertical direction, the air blowing out from the air bucket located on the top of the multiple semiconductor devices It has an ideal flow structure that flows between the elements toward the blower fan at the bottom of the housing.

In addition, in this invention, test information for multiple semiconductor devices is displayed next to the serial number of each LED on the connection bar through the corresponding LED pipe, so the operator can easily check the PASS/FAIL of the corresponding semiconductor device. there is.

1 and 2 are model diagrams showing the structural relationship of a semiconductor device test chamber according to an embodiment of the present invention from different angles;
FIG. 3 is a detailed and enlarged view showing excerpts of important parts of the semiconductor device test chamber shown in FIG. 1;
Figures 4 and 5 are detailed views showing the structural relationship of the air bucket shown in Figure 3,
Figures 6 and 7 are detailed and enlarged views showing the structural relationship of the module equipped with the cassette shown in Figure 3;
FIG. 8 is a detailed view of the SSD loaded into various modules applicable to the semiconductor device test chamber shown in FIG. 1.

Hereinafter, a preferred embodiment of a semiconductor device test chamber according to this invention will be described in detail with reference to the attached drawings. This invention is not limited to the embodiments disclosed below and may be implemented in various different forms, but these embodiments only serve to make the disclosure of this invention complete and to fully convey the scope of the invention to those skilled in the art. It is provided for information purposes only.

Figures 1 and 2 are model diagrams showing the structural relationship of a semiconductor device test chamber according to an embodiment of the present invention from different angles, and Figure 3 shows an excerpt of important parts of the semiconductor device test chamber shown in Figure 1. This is a detailed and enlarged view.

As shown in FIGS. 1 to 3, the semiconductor device test chamber 100 of this embodiment includes a housing 110 that forms an appearance in which a portion of the front is open, and a housing 110 disposed inside one lower side of the housing 110. The blower fan 120, the circulation duct 130 for circulating the air discharged from the blower fan 120, and a long vertical pipe along one inner side of the housing 110 in communication with the circulation duct 130. The distributed distribution duct 140 and a portion of the side space of the distribution duct 140 are divided into multiple layers in the vertical direction, and a plurality of air buckets are individually supplied with air from the distribution duct 140 and each blows out in the lower direction. (150) and a connection board (150) located behind the plurality of air buckets 150, connected to a test device that performs actual testing of semiconductor devices, and capable of connecting a plurality of modules each loaded with a plurality of semiconductor elements for testing ( 160), which is disposed at the rear of the blower fan 120, is ejected from each of the plurality of air buckets 150, flows along the plurality of semiconductor elements arranged at the bottom, and then flows to the lower blower fan 120 of the housing 110. It is configured to include an evaporator 170 capable of cooling the air flowing toward it by passing it, and a heater 175 capable of heating the air passing through the evaporator 170.

In the semiconductor device test chamber 100 of this embodiment as described above, air formed by the blower fan 120 is supplied to a plurality of air buckets 150 through the circulation duct 130 and the distribution duct 140, and the air buckets In (150), air is blown directly and evenly onto the semiconductor elements arranged between the split layers to ensure and maintain an even and stable temperature distribution of the semiconductor elements being tested, and the air flowing along the semiconductor elements of the split layer is Each flows toward the lower blower fan 120 of the housing 110, but is cooled and/or heated again while passing through the evaporator 170 and heater 175 located at the rear of the blower fan 120, thereby maintaining an appropriate air temperature at all times. It is configured to actively control and test semiconductor devices.

That is, in the semiconductor device test chamber 100 of this embodiment, the air emitted from the air bucket 150 of the plurality of split layers flows to have an even and stable temperature distribution of the semiconductor devices arranged below, and then flows to the other split layers. It is configured to flow toward the blower fan 120 at the bottom of the housing 110 and circulate due to the suction force of the blower fan 120 located at the bottom of the housing 110 without affecting the semiconductor elements arranged in .

Below, SSD (Solid State Drive) among semiconductor devices is explained as an example.

The housing 110 forms the exterior of the test chamber and has a structure in which the front is open and the remaining portion is closed to enable automated processes by robots.

The blower fan 120 is disposed inside one lower side of the housing 110, and the blower motor 121, which provides rotational force to the blower fan 120, is installed on the outside of the housing 110, so that the blower motor ( By preventing the heat generated from 121) from affecting the temperature control inside the housing 110, the temperature within the test chamber can be controlled more easily.

The circulation duct 130 circulates the air discharged from the blower fan 120, and one side is connected to the blower fan 120, and the other side is connected to the distribution duct 140. That is, the circulation duct 130 includes a blower fan 120 disposed inside one lower side (almost the center) of the housing 110 and a distribution duct 140 disposed long in the vertical direction along one inner side of the housing 110. ), so it has an “L” shape pointing upward toward the distribution duct 140.

The distribution duct 140 is arranged in a vertical direction along one inner side of the housing 110 in communication with the circulation duct 130, and has a shape in which the internal passage gradually narrows as it extends upward. have That is, the distribution duct 140 ensures that the air delivered from the blower fan 120 through the circulation duct 130 can be supplied at sufficient pressure to the air bucket 150 disposed relatively above, ultimately It is configured so that air can be supplied to all air buckets 150 arranged above and below at the same level of pressure.

This distribution duct 140 has a square shape in its internal cross-section, with the internal passage at the lower part communicating with the circulation duct 130 having the widest square shape, and the width of both sides gradually becoming smaller towards the top. As a result, the internal passage has a rectangular shape that gradually becomes smaller. Accordingly, the distribution duct 140 is divided into multiple layers in the vertical direction, and the gap between the distribution duct 140 and the air buckets 150 that communicate with each other widens toward the upper part of the distribution duct 140. A connection duct connecting the distribution duct 140 and the corresponding air bucket 150 is installed in each of these intervals.

Figures 4 and 5 are detailed views showing the structural relationship of the air bucket shown in Figure 3. As shown in FIGS. 3 to 5, the air bucket 150 divides a portion of the side space formed on the side of the distribution duct 140 into multiple layers in the vertical direction and each is individually discharged from the distribution duct 140. A flat hollow box that receives air and blows out the air to a plurality of SSDs placed at the bottom, and one side of which is connected to the distribution duct 140 or the connection duct is opened to communicate with the distribution duct 140 or the connection duct. It can have a shape. On the other hand, the air bucket 150 has a wide width (or depth) of the part connected to the distribution duct 140 or the connection duct, and is divided into multiple layers in the vertical direction and blows out air to a plurality of SSDs disposed below. Since the width (or depth) of the part is narrow, it has a structure that guides the air flow in parts where there is a difference between each other.

This air bucket 150 has a plurality of rows of air blowing lines 151 that blow out air in a downward direction on its lower surface in the direction of the distance from the distribution duct 140 (left and right directions based on the drawing). Meanwhile, the lower surface of the air bucket 150 preferably has a certain thickness so that the air blown out along the air blowing line 151 can flow straight downward.

The plurality of air blowing lines 151 are formed by forming a row of air blowing holes having the same size, and the number of rows is the same or different for each position away from the distribution duct 140 in order to adjust the temperature distribution between each other. It is configured to have. For example, the air blowout line 151 can be formed from the 1st to the 7th row depending on the location, which is based on the results of multiple research experiments. In other words, the air blowout line 151 for each location is configured by taking into account the overall air flow flowing along the inside of the air bucket 150, including the distance from the distribution duct 140 or the connection duct. Meanwhile, the multiple rows of air blowing lines 151 can be used by selectively closing some of the air blowing lines 151 with a sealing tape or the like, if necessary.

Therefore, the air bucket 150 of this embodiment configures the air blowout lines 151 in the same or different rows for each location, and selectively closes some air blowout lines 151 as necessary, so that a plurality of people can be tested in the same divided layer. You can test by blowing air under the same conditions on two SSDs.

In the semiconductor device test chamber 100 of this embodiment, the air emitted from the air bucket 150 of the plurality of split layers flows along the SSDs arranged at the bottom and then flows toward the blower fan 120 at the bottom of the housing 110. It is configured so that it does not affect the SSDs arranged in other partition layers by floating. However, the air emitted from the air bucket 150 has no choice but to hit the top of the air bucket 150 disposed at the bottom. As a result, the air flowing along the inside of the lower air bucket 150 may be affected.

Therefore, the air bucket 150 of this embodiment is configured to have a two-stage air flow line in communication with the distribution duct 140, but the air supplied to the upper line passes to the opposite side of the distribution duct 140 and is just discharged. It is desirable to configure it to have. Due to the two-stage air flow line structure of the air bucket 150, the SSDs are heated or heated only by the air supplied to the air bucket 150 without being affected by the air blown out from the upper air bucket 150. Because it is cooled, all SSDs tested in the upper and lower split layers can be tested under the same conditions.

As shown in FIG. 3, the connection board 160 is fixed to the inside of the housing 110 located behind the plurality of air buckets 150, and is a connection part through which a plurality of modules 190 can be connected toward the front. has Here, the connection unit is connected to a test device that performs actual testing of semiconductor devices, and a plurality of SSDs for testing are loaded into the plurality of modules 190 through a cassette 180, which will be described later. As the connection part of the connection board 160 faces the front, the module 190 can be smoothly mounted and detached from the front using a robot or the like.

The evaporator 170 and heater 175 each blow out air from a plurality of air buckets 150, flow along a plurality of SSDs arranged below the air buckets, and then flow toward the blower fan 120 at the bottom of the housing 110. It functions to cool and heat by passing through it, and its description is generally omitted.

Figures 6 and 7 are detailed and enlarged views showing the structural relationship of the module on which the cassette shown in Figure 3 is mounted. As shown in FIGS. 3, 6, and 7, the semiconductor device test chamber 100 of this embodiment includes a cassette 180 (aka, test tray) capable of storing a plurality of SSDs for testing, and a cassette ( The module 190 (aka test board) is configured to be attachable to and detachable from the connection board 160 and is connected to the connection board 160 to enable testing of multiple SSDs, and the module 190 is connected to the connection board 160. ) may be configured to further include a rack that guides the module 190 so that it can be smoothly connected to or separated from. Here, the cassette 180 and the module 190 are configured to be mounted as a set in multiple pieces (e.g., three) on a divided layer, and the rack is configured to fit the set of the cassette 180 and the module 190. It is configured to have.

The cassette 180 has a base plate 181 that has a certain width and length and has a plurality of slots of a size where the SSD connector protrudes downward, and extends a certain length on both sides of the base plate 181. It consists of two side plates 182 that are coupled together, and a holder 183 that is fixed to the base plate 181 to be located on top of the base plate 181 and is formed in a shape corresponding to a plurality of slots to hold a plurality of SSDs. do. Meanwhile, the both side plates 182 are parts that are extended and coupled to both sides of the base plate 181 at a certain height and have a structure to be attached and detached to the module 190. At the top is a cassette locking part of a manual jig (not shown). A locking hole that can be locked or unlocked is formed.

The module 190 has an internal structure in which the cassette 180 is mounted or detached by sliding along its interior, and an external structure in which the cassette 180 is mounted or detached by sliding along the rack and mounted on or detached from the connection board 160. A case 191 with an open bottom, a plurality of SSDs fixed to the open lower part of the case 191 and stored in a cassette 180 are connected for testing, and a plurality of SSDs are connected to the connection board 160. It is configured to have a mounting portion 192 having a connection portion and a circuit on the upper and lower surfaces, respectively. Meanwhile, the mounting unit 192 has a plurality of LEDs 193 on its lower surface that allow the state of the tested SSD to be checked. Here, the reason that the LED 193 is formed on the lower surface of the mounting part 192 is to prevent the LED 193 from being damaged at high temperatures as the SSD is tested in a high temperature environment.

The case 191 extends to a certain length on both sides of the mounting part 192 and includes both side plates 191a having coupling holes at the top for mounting and detaching the module 190 using a robot, etc., and both side plates 191a ), a pair of connection bars (191b) that connect each other, and a connection bar that connects a plurality of LEDs (193) and the connection bar (191b) so that the status of each of the plurality of LEDs (193) can be displayed and checked from the outside. It is configured to have a plurality of LED pipes 194 that display the status of each of the plurality of LEDs 193 through the upper part of (191b). Here, the LED pipe 194 serves to guide the light of the LED 193 and display it at the top of the connection bar 191b. Meanwhile, the pair of connecting bars 191b are assigned numbers that allow each LED 193 fixed to the lower surface of the mounting unit 192 to be distinguished by a serial number, so that workers can easily determine whether the SSD is good or defective. It is desirable to be able to check (PASS/FAIL).

FIG. 8 is a detailed view of the SSD loaded into various modules applicable to the semiconductor device test chamber shown in FIG. 1. The SSDs illustrated in Figure 8 are form factor types, including U.2, M.2, E1-SE, E1-S, and E1-L, and various cassettes and modules for testing these various SSDs. In this case, it can also be applied to the semiconductor device test chamber 100 of this embodiment.

Below, the operational relationship of the semiconductor device test chamber of this embodiment configured as described above will be described.

First, a plurality of SSDs for testing are stored inside the cassette 180. Then, the cassette 180 is mounted on the module 190 using a manual jig, etc., and a plurality of SSDs are connected to the corresponding connection portions of the module 190 to complete loading. The module 190 in this state is mounted while being guided along the rack by a robot or the like from front to back in the horizontal direction, and the connection portion formed on the lower surface of the module 190 is connected to the connection board 160. As a result, the plurality of SSDs loaded into the module 190 are arranged in the left and right directions with both corners standing up and down.

When preparations for this test are completed, the air formed by the blower fan 120 is supplied to the plurality of air buckets 150 through the circulation duct 130 and the distribution duct 140. Then, the plurality of air buckets 150 ejects direct air along the plurality of air ejection lines 151 formed on the lower surface, and directly and evenly ejects the air to the plurality of SSDs arranged in the corresponding partition layer, thereby dispersing the SSDs. Ensure that the test is conducted under uniform temperature distribution. Meanwhile, the air flowing along the SSDs of the corresponding split layer does not affect the SSDs arranged in other split layers, but is blown by the blower at the bottom of the housing 110 by the suction force of the blower fan 120 located at the bottom of the housing 110. It flows toward the fan 120 and repeatedly circulates through the evaporator 170 and the heater 175, spewing air to the relevant SSDs so that they can be tested with uniform temperature distribution.

Meanwhile, when the test for SSDs is completed, the test information for multiple SSDs is displayed next to the serial number of each LED of the connection bar 191b through the corresponding LED pipe 194, so that the operator can easily determine whether the SSD is good or bad. /You can check defective products (PASS/FAIL).

Once the testing of these SSDs is completed through the above process, separate the module 190 (including the cassette 180 and multiple SSDs) using a robot, etc., or remove the cassettes 180 (including multiple SSDs) using a manual jig, etc. After disconnecting the SSD (including the SSD), you can perform tests on other SSDs through the same process as above.

In the semiconductor device test chamber 100 of this embodiment, the air blown out from the corresponding air bucket 150 of a plurality of split layers flows to have an even and stable temperature distribution of the semiconductor devices arranged below, and then is arranged in another split layer. It is configured to flow and circulate toward the blower fan 120 at the bottom of the housing 110 using the suction force of the blower fan 120 located at the bottom of the housing 110 without affecting the semiconductor elements, thereby forming a plurality of divided layers. All semiconductor elements arranged can be tested under uniform temperature distribution.

Additionally, in the semiconductor device test chamber 100 of this embodiment, the connection portion of the connection board 160 connected to the test device is directed toward the front, so that the module 190 and/or the cassette 180 are horizontally positioned from the front. It can be mounted and detached smoothly while being guided along the rack by a robot, etc., toward the rear, and both corners of the multiple semiconductor elements loaded in the module 190 are arranged in the left and right directions in a vertical direction. Accordingly, it has an ideal flow structure in which the air emitted from the air bucket 150 located on top of the plurality of semiconductor devices flows along the space between the erected semiconductor devices toward the blower fan 120 at the bottom of the housing 110.

In addition, in the semiconductor device test chamber 100 of this embodiment, test information for a plurality of semiconductor devices is displayed next to the serial number of each LED of the connection bar 191b through the corresponding LED pipe 194, so that the operator can easily You can check the PASS/FAIL status of semiconductor devices.

In the above, the technical details of the semiconductor device test chamber of this invention are described together with the accompanying drawings, but this is an exemplary explanation of the best embodiment of this invention. Therefore, this invention is not limited to the embodiments described above, and it is obvious to those skilled in the art that various modifications and variations can be made without departing from the spirit and scope of the invention, and such modifications Examples or modifications may also fall within the scope of the claims of this invention.

100: test chamber 110: housing
120: blower fan 130: circulation duct
140: Distribution duct 150: Air bucket
160: Connection board 170: Evaporator
175: heater 180: cassette
190: module

Claims (6)

delete a housing forming an appearance in which a portion of the front part is open;
a blower fan disposed inside one lower side of the housing;
a circulation duct that circulates air discharged from the blower fan;
a distribution duct that is in communication with the circulation duct and is arranged vertically along one inner side of the housing, and has an internal passage that gradually narrows toward the top;
A portion of the side space formed on the side of the distribution duct is divided into multiple layers in the vertical direction, and a plurality of air buckets each individually receive air from the distribution duct and each blow out in a downward direction;
It is located behind the plurality of air buckets and connected to a test device that performs testing of semiconductor elements, and a plurality of modules each loaded with a plurality of semiconductor elements for testing are located in the partition layer between the air buckets. a connection board having a connectable connection portion on the front side;
It is disposed at the rear of the blower fan, is ejected from each of the plurality of air buckets, flows along a plurality of semiconductor elements arranged below the air bucket, and then flows toward the blower fan at the bottom of the housing by the suction force of the blower fan. An evaporator capable of being cooled by passing it through; and
It includes a heater capable of heating the air that has passed through the evaporator,
The air bucket has a flat hollow box shape with one side open to communicate with the distribution duct,
The lower surface of the air bucket has multiple rows of air blowing lines that blow out air in a downward direction in the direction of the separation distance from the distribution duct,
The multiple rows of air blowing lines are formed by forming a row of air blowing holes having the same size, and the number of rows is the same or different for each position spaced apart from the distribution duct in order to adjust the temperature distribution among each other. A semiconductor device test chamber. In claim 2,
A semiconductor device test chamber, wherein the lower surface of the air bucket has a certain thickness so that the air blown out along the air blowing line travels straight downward. In claim 2 or claim 3,
The air bucket has a two-stage air flow line communicating with the distribution duct, and the air supplied to the upper line passes to the opposite side of the distribution duct and is discharged. In claim 2,
A cassette capable of storing a plurality of semiconductor devices for testing, a module configured to be removable from the cassette and connected to the connection board to enable testing of a plurality of semiconductor devices, and the module It further includes a rack that guides the module so that it can be smoothly connected to or separated from the connection board,
The cassette and the module are installed as a set, and each of the plurality of semiconductor elements loaded in the module is mounted in a manner in which both edges of the plurality of semiconductor elements loaded in the module are erected in the vertical direction and arranged in the left and right directions. A semiconductor device test chamber. In claim 5,
The module has an internal structure in which the cassette is mounted or detached by sliding along the inside, and an external structure in which the cassette is mounted or detached in the connection board by sliding along the rack, and a case with an open bottom, It is fixed to the open lower part of the case and has a mounting part having a plurality of connection parts and circuits on the upper and lower surfaces, respectively, for connecting a plurality of semiconductor elements stored in the cassette for testing and connecting them to the connection board,
The mounting unit further has a plurality of LEDs on its lower surface to check the status of the tested semiconductor device,
The case is a semiconductor device test chamber characterized in that the case further includes a plurality of LED pipes respectively connected to the plurality of LEDs so that the status of each of the plurality of LEDs can be displayed and confirmed from the outside.

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