JP7413647B2 - transport unit - Google Patents

Description

The present invention relates to a prober that inspects the electrical characteristics of a plurality of semiconductor elements (chips) formed on a semiconductor wafer, and in particular, the present invention relates to a prober that inspects the electrical characteristics of a plurality of semiconductor elements (chips) formed on a semiconductor wafer. The present invention relates to a transport unit that transports objects to a transport storage section or each measuring section, and a prober that includes the transport unit.

Conventionally, there has been movement between an object storage section that stores multiple objects to be transported (cassette stock section that stores multiple wafers), multiple measurement sections (wafer inspection section), and between the object storage section and each measurement section. A prober (wafer inspection device) has been proposed that includes a transport unit (self-propelled vehicle) that transports the transported object to a transported object storage section or each measurement section (for example, see Patent Document 1). According to the prober described in Patent Document 1, for example, when N measurement units are used, the inspection time can be reduced to 1/N compared to the case where one measurement unit is used.

Furthermore, conventionally, in a prober, the electrical characteristics of a wafer are tested (high temperature test or low temperature test) at high temperature (or low temperature). In this inspection, the wafer is usually transferred from the cassette to the wafer chuck by a transfer arm, the wafer is heated (or cooled) to the inspection temperature on the wafer chuck, and the electrical characteristics are inspected. The wafer is cooled (or heated) at the top, and after the temperature reaches room temperature, the wafer is returned to the cassette by the transfer arm.

Japanese Patent Application Publication No. 5-343497

However, in the prober described in Patent Document 1, when a high-temperature test or a low-temperature test is performed in each measuring section, the environment of the conveyed object storage section (usually a normal temperature environment) and the environment of each measuring section (high-temperature environment or low-temperature environment) The following problems arise due to the difference between

For example, when performing high-temperature testing, a waiting period (for preheating) is required to bring the room-temperature wafer or probe card close to the test temperature in each measurement section before the test starts, which reduces the throughput of each measurement section. There is a problem that (processing capacity per unit time) decreases. In particular, when performing a high-temperature test again after replacing a wafer or probe card, it takes time for the wafer chuck to reach a high temperature again, which lengthens the waiting time until the next high-temperature test can be performed. The throughput in the measurement section is further reduced. In addition, when performing high-temperature inspections and replacing wafers or probe cards after the inspection is completed, waiting time is required to bring the high-temperature wafers or probe cards to room temperature in each measurement section, which also causes each measurement There is a problem that the throughput in the section decreases.

Similarly, when performing low-temperature testing, each measurement section requires waiting time to bring room-temperature wafers and probe cards close to the inspection temperature before testing begins, which reduces throughput at each measurement section. There is. In particular, when performing low-temperature inspection again after replacing a wafer or probe card, it takes time for the wafer chuck to cool down again, which lengthens the waiting time until the next low-temperature inspection can be performed. The throughput in the measurement section is further reduced. In addition, when performing low-temperature testing, after the test is completed, a waiting period is required for each measurement section to bring the low-temperature wafers and probe cards close to the temperature at which condensation does not occur (usually room temperature). There is a problem that the throughput in the section decreases.

As described above, in the prober described in Patent Document 1, when a high-temperature test or a low-temperature test is performed in each measurement section, the environment of the conveyed object storage section (usually a normal temperature environment) and the environment of each measurement section (usually a high-temperature environment or The problem is that the waiting time for bringing the conveyed object close to a predetermined temperature (e.g., inspection temperature or room temperature) in each measurement section increases due to differences in the temperature (low-temperature environment), and the throughput in each measurement section decreases. There is a need to improve this and increase the throughput in each measurement section.

The present invention has been made in view of the above circumstances, and it is possible to store the transported object (for example, at least one of a wafer and a probe card) by moving between the transported object storage section and a plurality of measurement sections. It is an object of the present invention to provide a prober and a transport unit that can improve the throughput in each measurement part in a prober equipped with a transport unit that transports the data to a measurement part or each measurement part.

In order to achieve the above object, the prober of the present invention includes a conveyance object storage section that stores a plurality of conveyance objects, a plurality of measurement sections, a casing that stores the conveyance objects, and an environment inside the casing that controls the environment. a transport unit that moves between the transport object storage section and each measurement section to transport the transport object into the transport object storage section or each measurement section; A moving device is provided to move the object between the storage section and each measuring section, and the environment control means controls the environment within the housing so that the environment corresponds to the environment of the destination of the conveyed object.

The transport unit of one aspect of the prober of the present invention further includes a sensor that detects an environment inside the housing, and the environment control means controls the inside of the housing to a target environment based on the detection result of the sensor. .

In one aspect of the prober of the present invention, when the transport destination of the transport unit is a measurement section, the environment control means controls the environment within the housing so that the environment corresponds to the test performed in the measurement section of the transport destination. Control your environment.

In one aspect of the prober of the present invention, when the conveyance destination of the conveyance unit is a measurement section where a high temperature test is performed, the environment control means controls such that the conveyed object stored in the housing is heated. The environment within the housing is controlled.

In one aspect of the prober of the present invention, the transport destination of the transport unit is the transport object storage section, and the transport unit transports the transport object, which has reached a high temperature state due to a high temperature inspection, into the transport object storage section. In this case, the environment control means controls the environment inside the housing so that the conveyed object stored in the housing is cooled.

In one aspect of the prober of the present invention, when the transport destination of the transport unit is a measurement section where a low-temperature test is performed, the environment control means controls such that the transport object stored in the housing is cooled. The environment within the housing is controlled.

One aspect of the prober of the present invention is that the transport destination of the transport unit is the transport object storage section, and the transport unit transports the transport object that has been brought into a low temperature state by a low temperature inspection into the transport object storage section. In this case, the environment control means controls the environment inside the housing so that the conveyed object stored in the housing is heated.

In one aspect of the prober of the present invention, when the transport destination of the transport unit is a measurement section where an inspection is performed under a predetermined gas atmosphere, the environment control means is configured to control the environment so that the inside of the housing is in the predetermined gas atmosphere. The environment inside the housing is controlled.

One aspect of the prober of the present invention is a conveyed object holding arm that is provided in the conveyance unit and holds the conveyed object, the arm that goes in and out through an opening formed in the casing, and that holds the conveyed object. A conveyance object holding arm is provided which is housed in the housing together with the conveyance object in a held state.

In one aspect of the prober of the present invention, the conveyance object storage section and each measurement section are arranged at regular intervals with surfaces accessed by the conveyance unit facing each other, and the conveyance unit includes: It is arranged between the conveyed object storage section and each measurement section.

One aspect of the prober of the present invention includes a transport unit rotation mechanism that rotates the transport unit so that the opening through which the transport object holding arm enters and exits faces the transport object storage section or each measuring section.

Each measuring section of one embodiment of the prober of the present invention is two-dimensionally arranged in the horizontal and vertical directions.

In one aspect of the prober of the present invention, the moving device includes a first movable body that moves in a horizontal direction, which is an arrangement direction of each measuring section, between the conveyed object storage section and each measuring section; a first movable body moving mechanism that moves the body in the horizontal direction; and a first movable body moving mechanism that is attached to the first movable body so as to be movable in the vertical direction, which is the arrangement direction of each measuring section, and the transport unit is rotated about a vertical axis. a second movable body that rotatably supports the second movable body; a second movable body moving mechanism that vertically moves the second movable body; and a transport unit rotation mechanism for rotating the transport unit.

In one aspect of the prober of the present invention, the conveyance object is at least one of a wafer and a probe card, and the conveyance object holding arm includes a wafer arm that holds the wafer and a probe card arm that holds the probe card. At least one of these.

Each of the plurality of measurement units of one aspect of the prober of the present invention includes a wafer chuck that is adjusted to a target temperature, and a probe card holding unit to which a probe card is detachably attached.

The environment control means of one aspect of the prober of the present invention is provided on the upper surface inside the casing.

The environment control means of one aspect of the prober of the present invention is provided approximately at the center of the upper surface.

A transport unit according to another aspect of the present invention moves between a transport object storing section that stores a plurality of transport objects and a plurality of measuring sections to transport the transport objects into the transport object storing section or into each measuring section. A transport unit comprising: a casing for storing an object to be transported; and an environment control means for controlling an environment within the casing so that the environment within the casing corresponds to an environment at a destination of the transport object. , is provided.

According to the present invention, the transport unit moves between the transport object storage section and the plurality of measurement sections and transports the transport object (for example, at least one of a wafer and a probe card) to the transport object storage section or each measurement section. In the prober equipped with the above, it is possible to provide a prober and a transport unit that can improve the throughput in each measurement section.

A perspective view showing a schematic configuration of a prober of this embodiment Front view of each measuring part Perspective view of transport unit Vertical cross-sectional view showing the schematic configuration of the transport unit Perspective view of moving device Partially enlarged perspective view of the moving device Vertical cross-sectional view showing the schematic configuration of the transport unit and measurement section Vertical cross-sectional view showing the schematic configuration of the transport unit

Preferred embodiments of the present invention will be described below with reference to the accompanying drawings.

FIG. 1 is a perspective view showing a schematic configuration of a prober 10 of this embodiment.

As shown in FIG. 1, the prober 10 of this embodiment moves between a conveyed object storage section 12, a plurality of measurement sections 14, and between the conveyed object storage section 12 and each measurement section 14, In the embodiment, there is a transport unit 16 that transports at least one of a wafer and a probe card into the transport object storage section 12 or each measurement section 14, and a transport unit 16 between the transport object storage section 12 and each measurement section 14. A moving device (transport unit moving device) 22 is provided.

The conveyance object storage section 12 and each measurement section 14 are arranged at regular intervals in the Y direction with the surfaces accessed by the conveyance unit 16 facing each other (that is, facing each other).

The transport unit 16 is arranged between the transport object storage section 12 and each measuring section 14 .

The conveyance object storage section 12 includes a wafer storage section 12a that stores a plurality of wafers and a probe card storage section 12b that stores a plurality of probe cards. There are no particular limitations on the number or arrangement of the transport object storage sections 12, and in this embodiment, four transport object storage sections 12 including the wafer storage section 12a and the probe card storage section 12b are located on the side accessed by the transport unit 16. They are arranged in the horizontal direction (X-axis direction) with their surfaces (right side surfaces in FIG. 1) facing the same direction. Note that the side opposite to the side accessed by the transport unit 16 (the left side in FIG. 1) is accessed by an operator when collecting wafers or probe cards.

As shown in FIG. 1, each of the plurality of measuring units 14 is a rectangular parallelepiped formed by combining a plurality of frames extending in the X-axis direction, a plurality of frames extending in the Y-axis direction, and a plurality of frames extending in the Z-axis direction. As shown in FIG. 7, this is a shape measurement chamber (also referred to as a prober chamber), and inside thereof, as shown in FIG. A head (not shown) and a first probe card holding mechanism 36 that holds the probe card PC are arranged.

FIG. 2 is a front view of each measuring section 14.

The number and arrangement form of the measuring sections 14 are not particularly limited, and in this embodiment, as shown in FIGS. 1 and 2, a measuring section group consisting of four measuring sections 14 arranged in the horizontal direction (X-axis direction) is used. are stacked in three stages in the vertical direction (Z-axis direction), and are two-dimensionally arranged with the surface accessed by the transport unit 16 (the left surface in FIG. 1) facing the same direction.

A wafer holding arm (wafer arm: conveyed object holding arm) 16b and a probe card holding arm (probe card arm) 16c of the transfer unit 16 are attached to each measuring section 14 (the surface accessed by the transfer unit 16). An opening 14a for going in and out is formed. The surface of each measuring section 14 other than the surface on which the opening 14a is formed may be closed or may have an opening formed therein.

The wafer chuck 18 is adjusted to a high or low target temperature (inspection temperature) by a well-known temperature control device (for example, a heat plate or a chiller device built into the wafer chuck 18).

The environment inside each measuring section 14 is controlled as follows. For example, the temperature inside each measuring section 14 is controlled to a target temperature (inspection temperature) by the temperature of the wafer chuck 18 disposed inside each measuring section 14. Further, the humidity within each measurement section 14 is controlled to the target humidity by purging dry air into each measurement section 14 using a well-known mechanism. Further, the environment within each measuring section 14 is controlled by purging a predetermined gas (for example, nitrogen gas) into each measuring section 14 by a well-known mechanism. In each measuring section 14, a plurality of types of tests are performed, such as a high temperature test, a low temperature test, and a test under a predetermined gas (for example, nitrogen gas) atmosphere, which will be described later. The environment inside each measuring section 14 is controlled so that the environment in each measuring section 14 corresponds to the test performed in each measuring section 14. Note that the tests performed by each measuring section 14 may be the same between the measuring sections, or may be different from each other.

The first probe card holding mechanism 36 is a means for detachably holding the probe card PC, and is provided above the wafer chuck 18, for example, on the head stage 20 side. The first probe card holding mechanism 36 removably holds the probe card PC transported to the first probe card holding mechanism 36 by a probe card transport mechanism described later. Since the first probe card holding mechanism 36 is well known (see, for example, Japanese Patent Laid-Open No. 2000-150596), further explanation will be omitted.

Each measurement unit group includes an alignment device 38 that performs relative alignment between the probe card PC held by the first probe card holding mechanism 36 and the wafer held by the wafer chuck 18, and an alignment device 38 for four measurements. A moving device (not shown) is arranged for mutually moving between the sections 14. The alignment device 38 is mutually moved between the four measurement sections 14 included in the measurement section group in which it is arranged, and is shared among the four measurement sections 14. As for the moving device that mutually moves the alignment device 38 between the four measurement units 14, for example, the one described in Japanese Patent Application Laid-open No. 2014-150168 can be applied.

The alignment device 38 is a means for performing relative alignment between the probe card PC held by the first probe card holding mechanism 36 and the wafer held by the wafer chuck 18, and is a means for relative alignment of the probe card PC held by the first probe card holding mechanism 36 and the wafer held by the wafer chuck 18. It is composed of a moving/rotating mechanism that moves the wafer chuck 18 in the XYZ-θ directions, such as the axis movable part 38a, the Z-axis fixed part 38b, and the XY movable part 38c. The alignment device 38 mainly moves the wafer W held by the wafer chuck 18 in the X-Y-Z-θ direction with respect to the probe of the probe card PC held above the wafer chuck 18 using a well-known method. It is used to align, bring the wafer W into electrical contact with the probe, and test the electrical characteristics of the wafer W via the test head.

The alignment device 38 holds the wafer chuck 18 in the measuring section 14, and moves the probe card receiving position P1 near the opening 14a (see FIG. 7(a)) and the preheating position P2 below the first probe card holding mechanism 36. (see FIG. 7(b)). This movement is accomplished by a well-known alignment device movement device (not shown).

When receiving the probe card PC, the alignment device moving device moves the alignment device 38 holding the wafer chuck 18 heated to the target temperature to the probe card receiving position P1, and moves the alignment device 38 holding the wafer chuck 18 heated to the target temperature to the probe card receiving position P1, and moves the alignment device 38 to the first probe card holding mechanism 36 of the probe card PC. When transporting the wafer to the preheat position P2, the alignment device 38 holding the probe card PC and the wafer chuck 18 heated to the target temperature is moved to the preheat position P2.

The alignment device 38 includes a second probe card holding mechanism 40 (also referred to as a card lifter).

The second probe card holding mechanism 40 is a means for receiving and holding the probe card PC from the probe card holding arm 16c. The holding portion 40a (for example, a ring-shaped member or a plurality of pins) and an elevating mechanism (not shown) that raises and lowers the holding portion 40a in the Z-axis direction relative to the Z-axis movable portion 38a.

To receive and hold the probe card PC, with the alignment device 38 moved to the probe card receiving position P1, the holding part 40a is raised in the Z-axis direction relative to the Z-axis movable part 38a, and the probe card PC (lower outer periphery ) and lifts the probe card PC from the probe card holding arm 16c with the holding portion 40a rising in the Z-axis direction. The probe card PC is held directly above the wafer chuck 18.

The probe card transport mechanism is a means for transporting the probe card PC held by the second probe card holding mechanism 40 to the first probe card holding mechanism 36, and is, for example, a means provided in the alignment device 38 in the Z-axis direction. It is composed of a Z-axis movable part 38a that is raised and lowered.

Transfer of the probe card PC to the first probe card holding mechanism 36 is achieved by raising the Z-axis movable portion 38a in the Z-axis direction while the alignment device 38 is moved to the preheat position P2.

3 is a perspective view of the transport unit 16, and FIG. 4 is a longitudinal sectional view showing a schematic configuration of the transport unit 16.

The transport unit 16 moves in the X-axis direction and the Z-axis direction between the transport object storage section 12 and each measurement section 14 to transfer the wafer W or probe card PC into the transport object storage section 12 or each measurement section 14. As shown in FIGS. 3 and 4, it is a means for transporting a wafer W and a probe card PC (a wafer holding arm 16b and a probe card holding arm 16c). The housing 16a is provided with an opening 16f through which a person enters and exits. The housing 16a has a rectangular parallelepiped shape, and includes a wafer holding arm 16b, a probe card holding arm 16c, an arm moving mechanism (not shown) for individually moving each arm 16b, 16c, and the housing 16a. An environment control means 16d for controlling the environment inside the housing 16a and a sensor 16e for detecting the environment inside the housing 16a are arranged. The number of transport units 16 is not particularly limited, and in this embodiment, one transport unit 16 is used. Although two transport units 16 are depicted in FIG. 1, this is a state in which one transport unit 16 is accessing the transported object storage section 12 (probe card storage section 12b) (lower right in FIG. 1). (See the illustrated transport unit 16) and the state of accessing the measurement unit 14 (See the transport unit 16 depicted at the upper left in FIG. 1).

The wafer holding arm 16b is a means for holding the wafer W, and is disposed within the housing 16a so as to be movable in the horizontal direction, for example, along a guide rail (not shown) provided within the housing 16a. There is. The wafer holding arm 16b is housed in the housing 16a together with the wafer W while holding the wafer W therein.

The probe card holding arm 16c is a means for holding the probe card PC, and is disposed within the housing 16a so as to be movable in the horizontal direction, for example, along a guide rail (not shown) provided within the housing 16a. has been done. The probe card holding arm 16c is housed in the housing 16a together with the probe card PC while holding the probe card PC. The probe card PC includes a card holder CH. A seal ring may be included instead of the card holder CH.

The number and arrangement form of each arm 16b, 16c are not particularly limited, and in this embodiment, as shown in FIG. There is.

The arm moving mechanism is constituted by a known mechanism, for example, a drive motor (not shown) provided in the housing 16a. By rotating this drive motor forward and backward, each arm 16b, 16c moves back and forth individually in the horizontal direction and enters and exits through an opening 16f formed in the housing 16a.

The transport unit 16 includes an air curtain forming means 42.

The air curtain forming means 42 is a means for forming an air curtain that closes the opening 16f formed in the casing 16a to make the inside of the casing 16a a sealed or nearly sealed space. It is configured.

The number, shape, and arrangement form of the air injection ports are not particularly limited, and in this embodiment, as shown in FIG. They are arranged along the edge (in the direction perpendicular to the plane of the paper in FIG. 4). Note that an arrow 44 in FIG. 4 shows an example of the flow of dry air injected from the environment control means 16d, and the wafer chuck 18 is shown.

The environment inside the housing 16a is controlled as follows. For example, the temperature and humidity inside the housing 16a can be adjusted to the target temperature and humidity under a predetermined gas atmosphere by purging dry air (high temperature or low temperature dry air) or predetermined gas (nitrogen gas) into each measuring section 14. controlled. This includes well-known environmental control means 16d, such as a temperature-controlled gas supply source including a heater and a cooler, a blower, and a pipe line (not shown) connecting the blower (none of which is shown) and the housing 16a. (not shown). The environmental control means 16d may include a dehumidifier. Gas (high-temperature or low-temperature dry air) whose temperature (and humidity) has been adjusted by the temperature-controlled gas supply source is supplied into the housing 16a via a pipe by a blower, and is injected from the air injection port into the housing. An air curtain is formed that closes the opening 16f formed in the opening 16a. Thereby, the inside of the casing 16a becomes a sealed or substantially sealed space. The source of the gas supplied into the housing 16a and the source of the gas injected from the air injection port may be the same or different. The surface of the casing 16a other than the surface on which the opening 16f is formed may be closed or may have an opening formed therein. The environment control means 16d may be attached to the housing 16a, or may be attached to the arms 16b, 16c.

The sensor 16e is a sensor that detects the environment inside the housing 16a, and is, for example, a temperature sensor or a humidity sensor. The sensor 16e may be included in the environmental control means 16d.

The environment control means 16d controls the environment inside the casing 16a so that the environment corresponds to the environment of the destination of the transported object. Specifically, the environment control means 16d controls the inside of the housing 16a to a target environment based on the detection result of the sensor 16e. For example, the environment control means 16d controls the temperature control gas supply source so that the temperature and humidity inside the housing 16a become the target temperature and humidity based on the detection result of the sensor 16e. The function of the environment control means 16d is realized, for example, by feedback control by a controller (not shown) to which the sensor 16e and the temperature control gas supply source (heater and cooler) are electrically connected. Note that the environment control means 16d and the air curtain forming means 42 may be integrated. That is, in one device, an air injection port may be provided downward so as to close the opening 16f, and an air injection port for dry air may be provided for controlling the environment within the housing 16a. Here, the air injection port for dry air for controlling the environment within the housing 16a is preferably provided in a direction such that the dry air to be injected is well circulated within the housing 16a. By integrating the environment control means 16d and the air curtain formation means 42, the space for providing the environment control means 16d and the air curtain formation means 42 is reduced, and the space of the housing 16a can be used effectively. . Furthermore, by integrating the environment control means 16d and the air curtain formation means 42, a temperature control gas supply source including a heater and a cooler can be connected between the environment control means 16d and the air curtain formation means 42. Air blowers, etc. can be shared.

FIG. 5 is a perspective view of the moving device 22, and FIG. 6 is a partially enlarged perspective view of the moving device 22.

The moving device 22 is a means for moving the transport unit 16 between the transported object storage section 12 and each measurement section 14 in the X-axis direction and the Z-axis direction, and for example, as shown in FIGS. 5 and 6, The first movable body 24 moves in the horizontal direction (X-axis direction), which is the arrangement direction of each measurement unit 14, between the conveyed object storage unit 12 and each measurement unit 14, and the first movable body 24 moves in the horizontal direction (X-axis direction) a first movable body moving mechanism (not shown) that is movable in the vertical direction (Z-axis direction), which is the arrangement direction of each measuring section 14, and a transport unit; 16 rotatably about a vertical axis (Z-axis), and a second movable body moving mechanism (not shown) that moves the second movable body 26 in the vertical direction (Z-axis direction). , a transport unit rotation mechanism 28 that is attached to the second movable body 26 and rotates the transport unit 16 around a vertical axis (Z axis).

The first movable body 24 is, for example, a frame body configured by connecting the four corners of each of a pair of upper and lower rectangular frames 24a with four frames 24b extending in the Z-axis direction, and the lower part thereof is connected to the conveyance object storage section 12. It is movably connected to two guide rails 30 that extend in the X-axis direction and are arranged parallel to each other on a base 34 between the measurement units 14 .

The first movable body moving mechanism includes a known moving mechanism, such as a ball screw connected to the first movable body 24 and a drive motor (none of which are shown) that rotates the ball screw. By rotating this drive motor forward and backward, the first movable body 24 (transport unit 16) moves in the X-axis direction along the guide rail 30. Of course, the first movable body moving mechanism is not limited to this, and may be a mechanism for making the first movable body 24 move by itself, for example, a wheel provided on the first movable body 24 and a drive motor that rotates the wheel. Good too.

The second movable body 26 is movably connected to two guide rails 32 that extend in the Z-axis direction and are arranged parallel to each other on the first movable body 24 .

The second movable body moving mechanism includes a known moving mechanism, such as a ball screw connected to the second movable body 26 and a drive motor (none of which are shown) that rotates the second movable body 26 . By rotating this drive motor forward and backward, the second movable body 26 (transport unit 16) moves in the Z-axis direction along the guide rail 32. Of course, the second movable body moving mechanism is not limited to this, and may be a mechanism for making the second movable body 26 move by itself, for example, a wheel provided on the second movable body 26 and a drive motor that rotates the wheel. Good too.

The transport unit rotation mechanism 28 includes a known rotation mechanism, for example, a rotation shaft (vertical shaft) provided on the second movable body 26, a drive motor 28a that rotates the rotation shaft, and the like. The upper surface of the transport unit 16 is fixed to a rotating shaft (vertical shaft). By rotating the drive motor 28a in forward and reverse directions, the transport unit 16 rotates 180 degrees around the vertical axis (Z-axis), and the opening 16f formed in the transport unit 16 through which each arm 16b, 16c enters and exits. It will be in a state facing the conveyed object storage section 12 or each measurement section 14.

Note that each device and mechanism, such as the alignment device 38, arm moving mechanism, environment control means 16d, and moving device 22 (first movable body moving mechanism, second movable body moving mechanism, and transport unit rotation mechanism 28), is not shown. It is driven by control by a control means (controller, etc.).

Next, an example of the operation of the transport unit 16 in the prober 10 of this embodiment will be described.

<Wafer transfer operation example 1>
First, an operation example will be described in which the transfer unit 16 transfers the wafer W from the wafer storage section 12a (for example, room temperature 23.degree. C.) to the measurement section 14 where a high temperature test (for example, inspection temperature 80.degree. C.) is performed.

First, the transport unit 16 is moved to a position where the wafer storage section 12a can be accessed (a position where the wafer W can be taken out), and the transport unit 16 is rotated 180 degrees so that each arm 16b, 16c moves in and out of the transport unit 16. The opening 16f formed in the opening 16f is opposed to the wafer storage section 12a.

Next, the wafer holding arm 16b is advanced into the wafer storage section 12a, and one wafer W is taken out from the wafer storage section 12a and stored in the housing 16a. At the same time, the environment inside the casing 16a is controlled to be an environment corresponding to the environment of the measuring section 14 at the destination (here, a high temperature test of 80° C. carried out inside the measuring section 14). Specifically, gas (for example, dry air or nitrogen whose temperature is adjusted to 60° C.) whose temperature is adjusted by a temperature-controlled gas supply source is supplied into the housing 16a, and is injected from an air injection port into the housing. An air curtain is formed that closes the opening 16f formed in the body 16a. Thereby, the inside of the casing 16a is made into a sealed or substantially sealed space. Note that the target temperature that the temperature control gas supply source adjusts is not limited to 60°C, but also depends on the distance and time that the wafer W is transported from the wafer storage section 12a to the measurement section 14 at the destination, and the temperature at which the wafer W is transported from the wafer storage section 12a to the measurement section 14 at the destination. An appropriate temperature can be set in consideration of the test temperature and the like.

Next, the transport unit 16 is moved to a position where the measurement unit 14 at the transport destination can be accessed (a position where the wafer W can be delivered), and the transport unit 16 is rotated 180 degrees so that each arm 16b, 16c moves in and out. An opening 16f formed in the transport unit 16 is made to face the measuring section 14 at the transport destination. During this time, the wafer W stored in the transport unit 16 continues to be heated by the gas supplied into the housing 16a (in a closed or substantially closed space).

Next, the wafer holding arm 16b is advanced into the measuring section 14 through the opening 16f on the transport unit 16 side in which the air curtain is formed and the opening 14a on the measuring section 14 side, and the wafer W is loaded onto the wafer chuck 18. The wafer holding arm 16b, while holding the wafer W, passes through the opening 16f, which is closed by an air curtain, and advances into the measuring section 14. At this time, the wafer W is further heated by the air curtain.

In this way, the following effects can be achieved by closing the opening 16f with an air curtain instead of using a physical door or shutter as in the prior art.

First, similar to the case where the opening 16f is closed with a physical door or shutter, the inside of the housing 16a can be made into a sealed or nearly sealed space, and the temperature inside the sealed housing 16a can be adjusted. By supplying the gas, the environment inside the casing 16a becomes an environment corresponding to the environment of the measurement section 14 at the destination (in this case, a high temperature test of 80° C. carried out inside the measurement section 14). be able to.

Second, the probe card holding arm 16c can be advanced into the measuring section 14 while keeping the inside of the casing 16a in a sealed state.

Third, compared to the case where the opening 16f is closed with a physical door or shutter, there is no need to open and close the physical door or shutter, so the probe card holding arm 16c can be quickly advanced into the measurement section 14. can be done.

Fourthly, when the probe card PC is delivered, the probe card PC can be heated by the action of an air curtain blown onto the probe card PC.

Fifth, when closing the opening 16f with a physical door or shutter, the gas supplied inside the casing 16a comes into contact with the physical door or shutter and enters the external environment through the physical door or shutter. Heat is radiated, and as a result, the temperature of the gas supplied to the inside of the casing 16a decreases. However, when the opening 16f is closed with an air curtain as in this example, the temperature of the gas supplied to the inside of the casing 16a decreases. Since the gas coming into contact with the air curtain having the same temperature as this, it is possible to suppress a decrease in the temperature of the gas supplied to the inside of the housing 16a.

The loaded wafer W is held on the wafer chuck 18 by vacuum suction. Then, the wafer W is heated by the wafer chuck 18 and waits until it reaches the inspection temperature (here, 80° C.), and when the inspection temperature is reached, the alignment device 38 moves in the X-Y-Z-θ direction and chucks the wafer. The wafer W held by the wafer chuck 18 is aligned with the probe of the probe card PC held above the wafer chuck 18 by a well-known method, and then the wafer chuck 18 is moved in the Z-axis direction by the action of the alignment device 38. By bringing the wafer W into electrical contact with the probe, the electrical characteristics of the wafer W are tested via the test head.

In this way, the environment within the transfer unit 16 is controlled (by heating the wafer) by utilizing the time required to transfer the wafer from the wafer storage section 12a to the measurement section 14 at the transfer destination. By reducing the difference from the inspection temperature at 14, the waiting time for bringing the wafer close to the inspection temperature within the measurement section 14 at the transfer destination can be shortened (or eliminated) compared to the conventional technology. Thereby, the throughput in the measuring section 14 can be improved.

<Wafer transfer operation example 2>
Next, an operation example will be described in which the transfer unit 16 transfers the wafer W, which has reached a high temperature state (e.g., 80° C.) due to a high temperature inspection, from the measuring section 14 to the wafer storage section 12a (e.g., room temperature: 23° C.). .

First, the wafer W immediately after the high-temperature test is taken out from the measuring section 14 by the wafer holding arm 16b and stored in the housing 16a. This is carried out in the reverse order of the wafer transfer operation example 1 described above. At the same time, the environment inside the casing 16a is controlled so that the environment corresponds to the environment of the wafer storage section 12a (in this case, the room temperature is 23° C.). Specifically, gas whose temperature is adjusted by a temperature-controlled gas supply source (for example, dry air or nitrogen whose temperature is adjusted to 40° C.) is supplied into the housing 16a, and is injected from an air injection port into the housing. An air curtain is formed that closes the opening 16f formed in the body 16a. Thereby, the inside of the casing 16a is made into a sealed or substantially sealed space. Note that the target temperature adjusted by the temperature control gas supply source is not limited to 40° C., and may vary depending on the distance and time during which the wafer W is transported from the measuring section 14 to the destination wafer storage section 12a, and the destination wafer storage section 12a. An appropriate temperature can be set in consideration of the temperature etc. Immediately after the high-temperature test has been completed, the wafer W, while being held by the wafer holding arm 16b, passes through the opening 16f, which is closed by an air curtain, is taken out from the measuring section 14, and is stored in the housing 16a. Ru. At this time, the wafer W is cooled by the air curtain blown onto it, and further cooled by the gas supplied into the housing 16a.

Next, the transport unit 16 is moved to a position where the wafer storage section 12a of the transport destination can be accessed (a position where the wafer W can be delivered), and the transport unit 16 is rotated 180 degrees so that each arm 16b, 16c can move in and out. An opening 16f formed in the transfer unit 16 is opposed to the wafer storage section 12a to which the wafer is transferred. During this time, the wafer W stored in the transport unit 16 continues to be cooled by the gas supplied into the housing 16a (in a sealed or substantially sealed space).

In this way, by closing the opening 16f with an air curtain instead of using a physical door or shutter as in the prior art, the same effect as in the wafer transfer operation example 1 can be achieved.

Next, the wafer holding arm 16b is advanced into the wafer storage section 12a to return the wafer W into the wafer storage section 12a.

In this way, the environment within the transfer unit 16 is controlled (by cooling the wafer) by utilizing the time required to transfer the wafer from the measuring section 14 to the destination wafer storage section 12a, and the wafer is stored at the destination. By reducing the difference between the temperature of the section 12a and the temperature of the section 12a, it is possible to eliminate (or shorten) the waiting time for bringing the wafer to room temperature in the measurement section 14 compared to the conventional technology, and the wafer after high temperature inspection can be The wafer can be immediately taken out from the measurement section 14 and returned to the wafer storage section 12a. Thereby, the throughput in the measuring section 14 can be improved. Furthermore, it is possible to eliminate (or shorten) the waiting time for an operator to retrieve the wafer after the wafer is stored.

<Wafer transfer operation example 3>
Next, an example of operation will be described in which the transfer unit 16 transfers the wafer W from the wafer storage section 12a (for example, room temperature 23 degrees Celsius) into the measurement section 14 where a low-temperature test (for example, inspection temperature -10 degrees Celsius) is performed. do.

First, the transport unit 16 is moved to a position where the wafer storage section 12a can be accessed (a position where the wafer W can be taken out), and the transport unit 16 is rotated 180 degrees so that each arm 16b, 16c moves in and out of the transport unit 16. The opening 16f formed in the opening 16f is opposed to the wafer storage section 12a.

Next, the wafer holding arm 16b is advanced into the wafer storage section 12a, and one wafer W is taken out from the wafer storage section 12a and stored in the housing 16a. At the same time, the environment inside the casing 16a is controlled so that the environment corresponds to the environment of the measuring section 14 at the destination (here, a -10° C. low-temperature test carried out inside the measuring section 14). Specifically, a temperature-controlled or humidity-controlled gas (for example, dry air or nitrogen whose temperature is adjusted to -15°C) is supplied into the housing 16a from a temperature-controlled gas supply source, and at the same time, air is supplied from an air injection port. An air curtain is formed that closes the opening 16f formed in the housing 16a. Thereby, the inside of the casing 16a is made into a sealed or substantially sealed space. Note that the target temperature that the temperature control gas supply source adjusts is not limited to -15°C, but also depends on the distance and time that the wafer W is transported from the wafer storage section 12a to the measurement section 14 at the destination, and the measurement section 14 at the destination. An appropriate temperature can be set in consideration of the test temperature and the like.

Next, the transport unit 16 is moved to a position where the measurement unit 14 at the transport destination can be accessed (a position where the wafer W can be delivered), and the transport unit 16 is rotated 180 degrees so that each arm 16b, 16c moves in and out. An opening 16f formed in the transport unit 16 is made to face the measuring section 14 at the transport destination. During this time, the wafer W stored in the transport unit 16 continues to be temperature-controlled (for example, cooled) and dried by the gas supplied into the housing 16a (in a sealed or substantially sealed space). Thereby, it is possible to prevent dew condensation from occurring on the wafer W while the wafer W is being transported to the measurement section 14 as the transport destination.

Next, the wafer holding arm 16b is advanced into the measuring section 14 through the opening 16f on the transport unit 16 side in which the air curtain is formed and the opening 14a on the measuring section 14 side, and the wafer W is loaded onto the wafer chuck 18. The wafer holding arm 16b, while holding the wafer W, passes through the opening 16f, which is closed by an air curtain, and advances into the measuring section 14. At that time, the wafer W is further cooled and dried by the air curtain. This can prevent dew condensation from forming on the wafer W when the wafer W is transferred.

In this way, by closing the opening 16f with an air curtain instead of using a physical door or shutter as in the prior art, the same effect as in the wafer transfer operation example 1 can be achieved.

The loaded wafer W is held on the wafer chuck 18 by vacuum suction. Then, the wafer W is cooled by the wafer chuck 18 and waits until it reaches the inspection temperature (-10° C. in this case), and when the inspection temperature is reached, the alignment device 38 moves in the X-Y-Z-θ direction and moves the wafer The wafer W held by the chuck 18 is aligned with the probe of the probe card PC held above the wafer chuck 18 by a well-known method, and then the wafer chuck 18 is moved in the Z-axis direction by the action of the alignment device 38. By bringing the wafer W into electrical contact with the probe, the electrical characteristics of the wafer W are tested via the test head. In addition, in order to prevent dew condensation from occurring on the wafers and probe cards during low-temperature testing, gas with a dew point that does not condense at the cooling temperature of the wafers and probe cards (for example, 20°C) is placed inside the measurement unit 14 at the transfer destination. (dry air) is supplied, and the low temperature inspection is performed in an environment where this gas is supplied.

In this way, the environment within the transfer unit 16 is controlled (by cooling the wafer) by utilizing the time required to transfer the wafer from the wafer storage section 12a to the measurement section 14 at the transfer destination. By reducing the difference from the inspection temperature of 14, it is possible to shorten (or eliminate) the waiting time for bringing the wafer close to the inspection temperature within the measurement section 14 at the transfer destination, compared to the conventional technology. Thereby, the throughput in the measuring section 14 can be improved.

<Example 4 of wafer transfer operation>
Next, an operation example will be described in which the transfer unit 16 transfers the wafer W, which has been brought into a low temperature state (for example, -40°C) by a low-temperature inspection, from the measurement section 14 into the wafer storage section 12a (for example, at a room temperature of 23°C). do.

First, the wafer W immediately after the low-temperature test is taken out from the measuring section 14 by the wafer holding arm 16b and stored in the housing 16a. This is carried out in the reverse order of the wafer transfer operation example 3 described above. At the same time, the environment inside the casing 16a is controlled so that the environment corresponds to the environment of the wafer storage section 12a (in this case, the room temperature is 23° C.). Specifically, a temperature-controlled or humidity-controlled gas (for example, dry air or nitrogen whose temperature is adjusted to 15° C.) is supplied into the housing 16a by a temperature-controlled gas supply source, and is also injected from an air injection port. As a result, an air curtain is formed that closes the opening 16f formed in the housing 16a. Thereby, the inside of the casing 16a is made into a sealed or substantially sealed space. Note that the target temperature that the temperature control gas supply source adjusts is not limited to 15° C., but also depends on the distance and time that the wafer W is transported from the measuring section 14 to the destination wafer storage section 12a, and the destination wafer storage section 12a. An appropriate temperature can be set in consideration of the temperature etc. Immediately after the low-temperature inspection is completed, the wafer W, while being held by the wafer holding arm 16b, passes through the opening 16f that is closed with an air curtain, is taken out from the measurement unit 14, and is stored in the housing 16a. Ru. At this time, the wafer W is heated by the air curtain blown onto it, and further heated by the gas supplied into the housing 16a. This can prevent dew condensation from forming on the wafer W when the wafer W is transferred.

Next, the transport unit 16 is moved to a position where the wafer storage section 12a of the transport destination can be accessed (a position where the wafer W can be delivered), and the transport unit 16 is rotated 180 degrees so that each arm 16b, 16c can move in and out. An opening 16f formed in the transfer unit 16 is opposed to the wafer storage section 12a to which the wafer is transferred. During this time, the wafer W stored in the transport unit 16 continues to be heated by the gas supplied into the housing 16a (in a closed or substantially closed space). Thereby, it is possible to prevent dew condensation from forming on the wafer W while the wafer W is being transported to the wafer storage section 12a.

In this way, by closing the opening 16f with an air curtain instead of using a physical door or shutter as in the prior art, the same effect as in the wafer transfer operation example 1 can be achieved.

Next, the wafer holding arm 16b is advanced into the wafer storage section 12a to return the wafer W into the wafer storage section 12a.

In this way, the environment within the transfer unit 16 is controlled (by heating the wafer) by utilizing the time required to transfer the wafer from the measuring section 14 to the destination wafer storage section 12a, and the wafer is stored at the destination. By reducing the difference between the temperature of the section 12a and the temperature of the section 12a, it is possible to eliminate (or shorten) the waiting time for bringing the wafer to room temperature in the measurement section 14 compared to the conventional technology, and the wafer that has undergone low temperature inspection can be The wafer can be immediately taken out from the measurement section 14 and returned to the wafer storage section 12a. Thereby, the throughput in the measuring section 14 can be improved. Further, it is possible to create a temperature environment that prevents dew condensation from forming on the wafer before the wafer is transferred into the wafer storage section 12a.

<Wafer transfer operation example 5>
Next, an operation example in which the transport unit 16 transports the wafer W from the wafer storage section 12a (e.g., room temperature 23° C.) into the measurement section 14 where an inspection is performed under a predetermined gas (e.g., nitrogen gas) atmosphere I will explain about it.

First, the transport unit 16 is moved to a position where the wafer storage section 12a can be accessed (a position where the wafer can be taken out), and the transport unit 16 is rotated 180 degrees to move the transport unit 16 into which each arm 16b, 16c enters and exits. The formed opening 16f is made to face the wafer storage section 12a.

Next, the wafer holding arm 16b is advanced into the wafer storage section 12a, and one wafer W is taken out from the wafer storage section 12a and stored in the housing 16a. At the same time, the environment inside the housing 16a is controlled to be an environment corresponding to the environment of the measurement unit 14 at the destination (in this case, testing under a predetermined gas (for example, nitrogen gas) atmosphere). Specifically, a gas (for example, nitrogen gas) for preventing oxidation of the wiring (especially copper wiring) exposed on the wafer surface and the probes of the probe card is supplied into the housing 16a, and an air injection port is also supplied to the housing 16a. An air curtain is formed that closes the opening 16f formed in the housing 16a. Thereby, the inside of the casing 16a is made into a sealed or substantially sealed space.

Next, the transport unit 16 is moved to a position where the measurement unit 14 at the transport destination can be accessed (a position where the wafer W can be delivered), and the transport unit 16 is rotated 180 degrees so that each arm 16b, 16c moves in and out. An opening 16f formed in the transport unit 16 is made to face the measuring section 14 at the transport destination. During this time, the anti-oxidation gas continues to be supplied into the transport unit 16 (in a closed or substantially closed space). Thereby, it is possible to prevent the wafer W from being oxidized while the wafer W is being transported to the measurement section 14 as the transport destination. Note that an anti-oxidation gas is also supplied into the measurement section 14 at the destination by well-known means.

Next, the wafer holding arm 16b is advanced into the measuring section 14 through the opening 16f on the transport unit 16 side in which the air curtain is formed and the opening 14a on the measuring section 14 side, and the wafer W is loaded onto the wafer chuck 18. The wafer holding arm 16b, while holding the wafer W, passes through the opening 16f, which is closed by an air curtain, and advances into the measuring section 14. At this time, the wafer W is prevented from being oxidized by the action of the air curtain.

In this way, by closing the opening 16f with an air curtain instead of using a physical door or shutter as in the prior art, the same effect as in the wafer transfer operation example 1 can be achieved.

The loaded wafer W is held on the wafer chuck 18 by vacuum suction. Then, the alignment device 38 aligns the wafer W held by the wafer chuck 18 with the probe of the probe card PC held above the wafer chuck 18 by a well-known method while moving in the X-Y-Z-θ direction. Next, the wafer chuck 18 is moved in the Z-axis direction by the action of the alignment device 38 to bring the wafer W into electrical contact with the probe, thereby testing the electrical characteristics of the wafer W via the test head. . Note that the test is conducted in an environment where an anti-oxidation gas is supplied.

In this way, even before the wafer is transferred from the wafer storage section 12a to the destination measurement section 14, the wafer is inspected in the same manner as in the measurement section 14 where the inspection is carried out under a predetermined gas (for example, nitrogen gas) atmosphere. Because the wafer is placed in an environment of

Note that this operation example 5 can also be implemented in combination with the wafer transfer operation examples 1 to 4 above.

<Example 1 of probe card transport operation>
Next, an operation example will be described in which the transport unit 16 transports the probe card PC from the probe card storage section 12b (e.g., room temperature 23° C.) into the measuring section 14 where a high temperature test (e.g., test temperature 80° C.) is performed. explain.

First, the transport unit 16 is moved to a position where the probe card storage section 12b can be accessed (a position where the probe card PC can be taken out), and the transport unit 16 is rotated 180 degrees to transport the arms 16b and 16c in and out. An opening 16f formed in the unit 16 is made to face the probe card storage section 12b.

Next, the probe card holding arm 16c is advanced into the probe card storage section 12b, and one probe card PC is taken out from the probe card storage section 12b and stored in the housing 16a. At the same time, the environment inside the casing 16a is controlled to be an environment corresponding to the environment of the measuring section 14 at the destination (here, a high temperature test of 80° C. carried out inside the measuring section 14). Specifically, gas (for example, dry air or nitrogen whose temperature is adjusted to 60° C.) whose temperature is adjusted by a temperature-controlled gas supply source is supplied into the housing 16a, and is injected from an air injection port into the housing. An air curtain is formed that closes the opening 16f formed in the body 16a. Thereby, the inside of the casing 16a is made into a sealed or substantially sealed space. Note that the target temperature that the temperature control gas supply source adjusts is not limited to 60°C, but also depends on the distance and time that the probe card PC is transported from the probe card storage section 12b to the destination measurement section 14, and the destination measurement section. The temperature can be set to an appropriate temperature taking into consideration the inspection temperature in step 14 and the like.

Next, the transport unit 16 is moved to a position where the measurement unit 14 at the transport destination can be accessed (a position where the probe card PC can be handed over), and the transport unit 16 is rotated 180 degrees so that each arm 16b, 16c moves in and out. An opening 16f formed in the transport unit 16 facing the measuring section 14 at the transport destination. During this time, the probe card PC housed in the transport unit 16 continues to be heated by the gas supplied into the housing 16a (closed or substantially closed space).

Next, the probe card holding arm 16c is advanced into the measuring section 14 through the opening 16f on the transport unit 16 side where the air curtain is formed and the opening 14a on the measuring section 14 side (see FIG. 7(a)). The probe card holding arm 16c advances into the measuring section 14 through the opening 16f, which is closed by an air curtain, while holding the probe card PC. At this time, the probe card PC is further heated by the air curtain blown onto it.

In this way, by closing the opening 16f with an air curtain instead of using a physical door or shutter as in the prior art, the same effect as in the wafer transfer operation example 1 can be achieved.

Next, the holding portion 40a of the second probe card holding mechanism 40 receives the probe card PC from the probe card holding arm 16c and holds it. Specifically, with the alignment device 38 holding the wafer chuck 18 heated to a target temperature (in this case, an inspection temperature of 80° C.) moved to the probe card receiving position P1, the holding portion 40a is moved along the Z axis. The probe card PC is raised in the Z-axis direction with respect to the section 38a and brought into contact with the probe card PC (the outer peripheral edge of the lower surface), and the probe card PC is lifted from the probe card holding arm 16c by the holding section 40a that rises in the Z-axis direction. Thereby, the probe card PC is transferred to the holding section 40a, and is held directly above the wafer chuck 18 by the holding section 40a. During this time, the probe card PC is heated by the radiant heat of the wafer chuck 18 below it.

Next, the alignment device 38 holding the probe card PC and the wafer chuck 18 heated to the target temperature (in this case, the inspection temperature 80° C.) is moved to the preheat position P2 (see FIG. 7(b)). During this time as well, the probe card PC is heated by the radiant heat of the wafer chuck 18 below.

Next, the probe card PC is transported to the first probe card holding mechanism 36 (see FIG. 7(b)). Specifically, with the alignment device 38 holding the wafer chuck 18 heated to the target temperature (in this case, an inspection temperature of 80° C.) moved to the preheat position P2, the Z-axis movable portion 38a (second probe By raising the card holding mechanism 40) in the Z-axis direction, the probe card PC held by the second probe card holding mechanism 40 is transported to the first probe card holding mechanism 36. The probe card PC transported to the first probe card holding mechanism 36 is detachably held by the first probe card holding mechanism 36. During this time as well, the probe card PC is heated by the radiant heat of the wafer chuck 18 below.

As described above, the probe card PC is not only heated in the transport unit 16, but also heated on the wafer chuck 18 until it is transferred from the probe card holding arm 16c and held in the first probe card holding mechanism 36. continues to be seamlessly heated (preheated) by radiant heat.

As a result, even if it takes about 10 to several tens of seconds for the probe card PC heated in the transport unit 16 to be transferred from the probe card holding arm 16c and held in the first probe card holding mechanism 36, The preheated probe card PC can be held in the first probe card holding mechanism 36 without the temperature of the probe card PC decreasing.

In this way, the environment within the transport unit 16 is controlled (by heating the probe card) by utilizing the time required to transport the probe card from the probe card storage section 12b to the measurement section 14 at the transport destination. By reducing the difference between the probe card and the test temperature in the measurement unit 14 of (or eliminate). Thereby, the throughput in the measuring section 14 can be improved.

<Example 2 of probe card transport operation>
Next, an example of operation will be described in which the transport unit 16 transports the probe card PC which has reached a high temperature state (for example, 80°C) due to a high temperature test from the measuring section 14 into the probe card storage section 12b (for example, the room temperature is 23°C). explain.

First, the probe card PC immediately after the high temperature test is taken out from the measuring section 14 by the probe card holding arm 16c and stored in the housing 16a. This is carried out in the reverse order of the probe card transport operation example 1 described above. At the same time, the environment inside the casing 16a is controlled so that the environment corresponds to the environment of the probe card storage section 12b (in this case, the room temperature is 23° C.) at the destination. Specifically, gas whose temperature is adjusted by a temperature-controlled gas supply source (for example, dry air or nitrogen whose temperature is adjusted to 40° C.) is supplied into the housing 16a, and is injected from an air injection port into the housing. An air curtain is formed that closes the opening 16f formed in the body 16a. Thereby, the inside of the casing 16a is made into a sealed or substantially sealed space. Note that the target temperature that the temperature control gas supply source adjusts is not limited to 40°C, but also depends on the distance and time that the probe card PC is transported from the measuring section 14 to the destination probe card storage section 12b, and the destination probe card. An appropriate temperature can be set in consideration of the temperature in the storage section 12b, etc. Immediately after the high-temperature test has been completed, the probe card PC is held by the probe card holding arm 16c, passes through the opening 16f closed by an air curtain, is taken out from the measurement section 14, and is placed inside the housing 16a. It will be stored. At this time, the probe card PC is cooled by the air curtain blown onto it, and further cooled by the gas supplied into the housing 16a.

Next, the transport unit 16 is moved to a position where the probe card storage section 12b of the transport destination can be accessed (a position where the probe card PC can be handed over), and the transport unit 16 is rotated 180 degrees to each arm 16b, 16c. An opening 16f formed in the transport unit 16 through which the probe card enters and exits is opposed to the probe card storage section 12b, which is the transport destination. During this time, the probe card PC housed in the transport unit 16 continues to be cooled by the gas supplied into the housing 16a (closed or substantially closed space).

In this way, by closing the opening 16f with an air curtain instead of using a physical door or shutter as in the prior art, the same effect as in the wafer transfer operation example 1 can be achieved.

Next, the probe card holding arm 16c is advanced into the probe card storage section 12b, and the probe card PC is returned to the probe card storage section 12b.

In this way, the environment within the transport unit 16 is controlled (by cooling the probe card) by utilizing the time required to transport the probe card from the measuring section 14 to the probe card storage section 12b at the transport destination. By reducing the difference between the temperature of the probe card storage section 12b and the temperature of the probe card storage section 12b, compared to the conventional technology, it is possible to eliminate (or shorten) the waiting time for bringing the probe card close to room temperature in the measurement section 14, making it possible to perform high-temperature inspections. After the measurement is completed, the probe card can be immediately taken out from the measurement section 14 and returned to the probe card storage section 12b. Thereby, the throughput in the measuring section 14 can be improved. Furthermore, it is possible to eliminate (or shorten) the waiting time until the operator collects the probe card after storing the probe card.

<Example 3 of probe card transport operation>
Next, an operation example in which the transport unit 16 transports the probe card PC from the probe card storage section 12b (e.g., room temperature 23° C.) into the measuring section 14 where a low-temperature test (e.g., test temperature -10° C.) is performed I will explain about it.

First, the transport unit 16 is moved to a position where the probe card storage section 12b can be accessed (a position where the probe card can be taken out), and the transport unit 16 is rotated 180 degrees to move the arms 16b and 16c in and out of the transport unit. An opening 16f formed in the probe card storage section 16 is made to face the probe card storage section 12b.

Next, the probe card holding arm 16c is advanced into the probe card storage section 12b, and one probe card PC is taken out from the probe card storage section 12b and stored in the housing 16a. At the same time, the environment inside the casing 16a is controlled so that the environment corresponds to the environment of the measuring section 14 at the destination (here, a -10° C. low-temperature test carried out inside the measuring section 14). Specifically, a temperature-controlled or humidity-controlled gas (for example, dry air or nitrogen whose temperature is adjusted to -15°C) is supplied into the housing 16a from a temperature-controlled gas supply source, and at the same time, air is supplied from an air injection port. An air curtain is formed that closes the opening 16f formed in the housing 16a. Thereby, the inside of the casing 16a is made into a sealed or substantially sealed space. Note that the target temperature that the temperature control gas supply source adjusts is not limited to -15°C, but also depends on the distance and time that the probe card PC is transported from the probe card storage section 12b to the measurement section 14 at the transport destination, and the measurement of the transport destination. An appropriate temperature can be set in consideration of the inspection temperature in the section 14, etc.

Next, the transport unit 16 is moved to a position where the measurement unit 14 at the transport destination can be accessed (a position where the probe card PC can be handed over), and the transport unit 16 is rotated 180 degrees so that each arm 16b, 16c moves in and out. An opening 16f formed in the transport unit 16 facing the measuring section 14 at the transport destination. During this time, the probe card PC housed in the transport unit 16 continues to be cooled and dried by the gas supplied into the housing 16a (in a sealed or substantially sealed space). Thereby, it is possible to prevent dew condensation from forming on the probe card PC while the probe card PC is being transported to the destination measuring section 14.

Next, the probe card holding arm 16c is advanced into the measuring section 14 through the opening 16f on the transport unit 16 side where the air curtain is formed and the opening 14a on the measuring section 14 side (see FIG. 7(a)). The probe card holding arm 16c advances into the measuring section 14 through the opening 16f, which is closed by an air curtain, while holding the probe card PC. At this time, the probe card PC is further cooled and dried by the air curtain blown onto it. This can prevent dew condensation from forming on the probe card PC when the probe card PC is delivered.

In this way, by closing the opening 16f with an air curtain instead of using a physical door or shutter as in the prior art, the same effect as in the wafer transfer operation example 1 can be achieved.

Next, the holding portion 40a of the second probe card holding mechanism 40 receives the probe card PC from the probe card holding arm 16c and holds it. Specifically, while the alignment device 38 holding the wafer chuck 18 cooled to the target temperature (in this case, the inspection temperature -10° C.) moves to the probe card receiving position P1, the holding part 40a is moved along the Z axis. The movable part 38a is raised in the Z-axis direction to abut against the probe card PC (the outer peripheral edge of the lower surface), and the probe card PC is lifted from the probe card holding arm 16c by the holding part 40a that rises in the Z-axis direction. Thereby, the probe card PC is transferred to the holding section 40a, and is held directly above the wafer chuck 18 by the holding section 40a. During this time, the probe card PC is cooled by the wafer chuck 18 below it.

Next, the alignment device 38 holding the probe card PC and the wafer chuck 18 cooled to the target temperature (in this case, the inspection temperature -10° C.) is moved to position P2 (see FIG. 7(b)). During this time as well, the probe card PC is cooled by the wafer chuck 18 below it.

Next, the probe card PC is transported to the first probe card holding mechanism 36 (see FIG. 7(b)). Specifically, with the alignment device 38 holding the wafer chuck 18 cooled to the target temperature (in this case, the inspection temperature -10° C.) moved to position P2, the Z-axis movable portion 38a (second probe By raising the card holding mechanism 40) in the Z-axis direction, the probe card PC held by the second probe card holding mechanism 40 is transported to the first probe card holding mechanism 36. The probe card PC transported to the first probe card holding mechanism 36 is detachably held by the first probe card holding mechanism 36. During this time as well, the probe card PC is cooled by the wafer chuck 18 below it.

As described above, the probe card PC is not only cooled in the transport unit 16, but also cooled on the wafer chuck 18 until it is transferred from the probe card holding arm 16c and held in the first probe card holding mechanism 36. continues to cool seamlessly.

As a result, even if it takes about 10 to several tens of seconds for the probe card PC cooled in the transport unit 16 to be transferred from the probe card holding arm 16c and held in the first probe card holding mechanism 36, The cooled probe card PC can be held in the first probe card holding mechanism 36 without the temperature of the probe card PC increasing. Note that gas (for example, dry air at 20° C.) having a dew point that does not condense at the cooling temperature of the wafer or probe card is supplied into the measurement unit 14 at the destination by a well-known means.

In this way, the environment within the transport unit 16 is controlled (by cooling the wafer) by utilizing the time required to transport the probe card from the probe card storage section 12b to the measurement section 14 at the transport destination. By reducing the difference from the test temperature of the measurement unit 14, the waiting time for bringing the probe card close to the test temperature within the measurement unit 14 at the destination can be shortened (or eliminated) compared to the conventional technology. Thereby, the throughput in the measuring section 14 can be improved.

<Example 4 of probe card transport operation>
Next, an operation example in which the transport unit 16 transports the probe card PC, which has been brought into a low temperature state (for example, -40°C) by the low temperature inspection, from the measuring section 14 into the probe card storage section 12b (for example, the room temperature is 23°C) I will explain about it.

First, the probe card PC immediately after the low temperature test is taken out from the measuring section 14 by the probe card holding arm 16c and stored in the housing 16a. This is performed in the reverse order of the probe card transport operation example 3 described above. At the same time, the environment inside the casing 16a is controlled so that the environment corresponds to the environment of the probe card storage section 12b (in this case, the room temperature is 23° C.) at the destination. Specifically, a temperature-controlled or humidity-controlled gas (for example, dry air or nitrogen whose temperature is adjusted to 15° C.) is supplied into the housing 16a by a temperature-controlled gas supply source, and is also injected from an air injection port. As a result, an air curtain is formed that closes the opening 16f formed in the housing 16a. Thereby, the inside of the casing 16a is made into a sealed or substantially sealed space. Note that the target temperature that the temperature control gas supply source adjusts is not limited to 15°C, but also depends on the distance and time that the probe card PC is transported from the measuring section 14 to the destination probe card storage section 12b, and the destination probe card. An appropriate temperature can be set in consideration of the temperature in the storage section 12b, etc. Immediately after the low-temperature test has been completed, the probe card PC, while being held by the probe card holding arm 16c, passes through the opening 16f that is closed with an air curtain, is taken out from the measurement unit 14, and is placed inside the housing 16a. It will be stored. At this time, the probe card PC is heated by the air curtain blown onto it, and further heated by the gas supplied into the housing 16a. This can prevent dew condensation from forming on the probe card PC when the probe card PC is delivered.

Next, the transport unit 16 is moved to a position where the probe card storage section 12b of the transport destination can be accessed (a position where the probe card PC can be handed over), and the transport unit 16 is rotated 180 degrees to each arm 16b, 16c. An opening 16f formed in the transport unit 16 through which the probe card enters and exits is opposed to the probe card storage section 12b, which is the transport destination. During this time, the probe card PC housed in the transport unit 16 continues to be heated by the gas supplied into the housing 16a (closed or substantially closed space). Thereby, it is possible to prevent dew condensation from forming on the probe card PC while the probe card PC is being transported to the probe card storage section 12b.

In this way, by closing the opening 16f with an air curtain instead of using a physical door or shutter as in the prior art, the same effect as in the wafer transfer operation example 1 can be achieved.

Next, the probe card holding arm 16c is advanced into the probe card storage section 12b, and the probe card PC is returned to the probe card storage section 12b.

In this way, the environment within the transport unit 16 is controlled (by heating the probe card) by utilizing the time required to transport the probe card from the measuring section 14 to the probe card storage section 12b at the transport destination. By reducing the difference between the temperature of the probe card storage section 12b and the temperature of the probe card storage section 12b, it is possible to eliminate (or shorten) the waiting time for bringing the probe card close to room temperature in the measurement section 14 compared to the conventional technology, thereby making it possible to perform low-temperature inspection. After the measurement is completed, the probe card can be immediately taken out from the measurement section 14 and returned to the probe card storage section 12b. Thereby, the throughput in the measuring section 14 can be improved. Furthermore, it is possible to create a temperature environment that prevents dew condensation from forming on the probe card before the probe card is transported into the probe card storage section 12b.

<Example 5 of probe card transport operation>
Next, when the transport unit 16 transports the probe card PC from the probe card storage part 12b (e.g., room temperature 23°C) into the measurement part 14 where the test is performed under a predetermined gas (e.g., nitrogen gas) atmosphere, An example of operation will be explained.

First, the transport unit 16 is moved to a position where the probe card storage section 12b can be accessed (a position where the probe card can be taken out), and the transport unit 16 is rotated 180 degrees to move the arms 16b and 16c in and out of the transport unit. An opening 16f formed in the probe card storage section 16 is made to face the probe card storage section 12b.

Next, the probe card holding arm 16c is advanced into the probe card storage section 12b, and one probe card PC is taken out from the probe card storage section 12b and stored in the housing 16a. At the same time, the environment inside the housing 16a is controlled to be an environment corresponding to the environment of the measurement unit 14 at the destination (in this case, testing under a predetermined gas (for example, nitrogen gas) atmosphere). Specifically, a gas (for example, nitrogen gas) for preventing oxidation of the wiring (especially copper wiring) exposed on the wafer surface and the probes of the probe card is supplied into the housing 16a, and an air injection port is also supplied to the housing 16a. An air curtain is formed that closes the opening 16f formed in the housing 16a. Thereby, the inside of the casing 16a is made into a sealed or substantially sealed space.

Next, the transport unit 16 is moved to a position where the measurement unit 14 at the transport destination can be accessed (a position where the probe card PC can be handed over), and the transport unit 16 is rotated 180 degrees so that each arm 16b, 16c moves in and out. An opening 16f formed in the transport unit 16 facing the measuring section 14 at the transport destination. During this time, the anti-oxidation gas continues to be supplied into the transport unit 16 (in a closed or substantially closed space). Thereby, it is possible to prevent the probe card PC from being oxidized while the probe card PC is being transported to the destination measuring section 14. Note that an anti-oxidation gas is also supplied into the measurement section 14 at the destination by well-known means.

Next, the probe card holding arm 16c is advanced into the measuring section 14 through the opening 16f on the transport unit 16 side where the air curtain is formed and the opening 14a on the measuring section 14 side. The probe card holding arm 16c advances into the measuring section 14 through the opening 16f, which is closed by an air curtain, while holding the probe card PC. At this time, the probe card PC is prevented from being oxidized by the action of the air curtain.

In this way, by closing the opening 16f with an air curtain instead of using a physical door or shutter as in the prior art, the same effect as in the wafer transfer operation example 1 can be achieved.

Thereafter, the probe card PC is transported to the first probe card holding mechanism 36 in the same procedure as in the probe card transporting operation examples 1 and 3 above, and is detachably held by the first probe card holding mechanism 36.

In this way, even before the probe card is transported from the probe card storage section 12b into the destination measurement section 14, the probe card is kept in the measurement section where the test is performed under a predetermined gas (for example, nitrogen gas) atmosphere. 14, the probes of the probe card are prevented from being oxidized during transportation and delivery.

Note that this operation example 5 can also be implemented in combination with the probe card transport operation examples 1 to 4 above.

As described above, according to the present embodiment, the object to be transported (for example, at least one of a wafer and a probe card) is moved between the object storage section 12 and the plurality of measurement sections 14 and transferred to the object storage section 12 and the plurality of measuring sections 14. In the prober 10 equipped with the transport unit 16 for transporting the probe to the measuring part 12 or each measuring part 14, it is possible to provide a prober that can improve the throughput in each measuring part 14.

This is because the environment (e.g., temperature and humidity) inside the transport unit 16 (casing 16a) is controlled by using the time until the object is transported to the transport destination (measuring section 14 or object storage section 12). This is because, compared to the conventional technology, it is possible to shorten (or eliminate) the waiting time for bringing the conveyed object close to a predetermined temperature (for example, inspection temperature or room temperature) in each measurement section. be.

Furthermore, according to the present embodiment, the environment within the casing 16a, which is smaller in size than the entire prober 10, is controlled instead of controlling the environment of the entire prober 10. In other words, the environment within the casing 16a is Since the environment is controlled locally, energy savings can be achieved compared to the case where the entire environment of the prober 10 is controlled. Furthermore, the amount of gas (dry air or nitrogen gas) supplied into the housing 16a can be reduced.

Furthermore, according to this embodiment, the installation area of the prober 10 can be minimized. Furthermore, the time required for the transport unit 16 to access the transport object storage section 12 or each measurement section 14 can be minimized.

This means that the conveyed object storage section 12 and each measurement section 14 are arranged at regular intervals in the Y direction with the surfaces accessed by the conveying unit 16 facing each other (that is, facing each other). This is because the transport unit 16 is arranged between the transport object storage section 12 and each measurement section 14.

Next, other embodiments of the transport unit 16 will be described.

FIG. 8 is a vertical cross-sectional view showing a schematic configuration of a transport unit 16 according to another embodiment. Note that the same reference numerals are given to the parts already described in FIG. 4, and the description thereof will be omitted.

In the transport unit 16 shown in FIG. 8, an environment control means 16d and an air curtain forming means 42 are provided separately. In this way, by providing the environment control means 16d and the air curtain formation means 42 separately (independently), the environment control means 16d and the air curtain formation means 42 can be operated independently. For example, the environment control means 16d and the air curtain formation means 42 are independently operated so that the environment control means 16d controls the environment inside the housing 16a with hot air, and the air curtain formation means 42 closes the opening 16f with cold air. be able to. Further, when the environment control means 16d and the air curtain forming means 42 are provided separately, the environment control means 16d is provided on the upper surface inside the casing 16a, so that the environment control means 16d can be efficiently integrated into the casing. The environment within 16a can be controlled. Further, when the environment control means 16d and the air curtain forming means 42 are provided separately, by providing the environment control means 16d approximately at the center of the upper surface of the casing 16a, the environment control means 16d can be more efficiently integrated into the casing. The environment within 16a can be controlled. Here, "approximately the center" means that it does not have to be at the exact center, but may just be near the center or near the center.

Next, a modification will be explained.

In the present embodiment, the configuration in which each arm 16b, 16c of the transport unit 16 enters and exits through the opening 16f formed in the housing 16a is exemplified, but the present invention is not limited to this. A similar opening (not shown) is formed on the side opposite to the side where the opening 16f is formed, and each arm 16b, 16c individually reciprocates in the horizontal direction to open the opening 16f and the opposite side. It may be configured to enter and exit through an opening. In this way, the transport unit rotation mechanism 28 can be omitted. Even though the transport unit rotation mechanism 28 is omitted, that is, without rotating the transport unit 16, access to the transport object storage section 12 or each measurement section 14 by each arm 16b, 16c can be realized. In this case, in addition to the air curtain forming means 42 that forms an air curtain that closes an opening 16f formed in the casing 16a of the transport unit 16, an air curtain that closes an opening formed on the opposite side of the opening 16f is provided. By providing the same air curtain forming means in the transport unit 16, the inside of the casing 16a can be made into a sealed or substantially sealed space, and the same effects as in the above embodiment can be achieved.

Further, in the present embodiment, the configuration in which each measuring section 14 is two-dimensionally arranged in the horizontal direction (X-axis direction) and the vertical direction (Z-axis direction) is illustrated, but the present invention is not limited to this. may be arranged only in one row in the horizontal direction (X-axis direction), or may be arranged only in one row in the vertical direction (Z-axis direction). By arranging each measuring section 14 only in one row in the horizontal direction (X-axis direction), the second movable body moving mechanism can be omitted. Further, by arranging each measuring section 14 only in one row in the vertical direction (Z-axis direction), the first movable body moving mechanism can be omitted.

Further, in this embodiment, a configuration using one transport unit 16 and one moving device 22 is illustrated, but the present invention is not limited to this, and a plurality of transport units 16 and a plurality of moving devices 22 may be used. In this way, the throughput in each measuring section 14 can be further improved.

Further, in this embodiment, a configuration using the wafer holding arm 16b and the probe card holding arm 16c is illustrated, but the configuration is not limited to this, and only the wafer holding arm 16b may be used, or only the probe card holding arm 16c may be used. May be used.

Further, in this embodiment, the configuration in which the arms 16b and 16c are provided in the transport unit 16 is illustrated, but the present invention is not limited to this, and each arm 16b and 16c (or A corresponding arm) may also be provided. With this structure as well, each arm can take out the transported object from the transported object storage section 12 or the measurement section 14 and store it in the transport unit 16, and can also take out the transported object from the transport unit 16 and store it in the transported object storage section 12 or It can be delivered to the measuring section 14.

Further, in this embodiment, the configuration in which the opening 16f formed in the casing 16a is closed with an air curtain is illustrated, but the invention is not limited to this. The transport unit 16 may be provided with an opening/closing means such as a shutter or a door that is closed during transport, and the opening 16f may be opened/closed by this opening/closing means. Furthermore, the openings 14a formed in each measuring section 14 may be closed with a similar air curtain, or the openings 14a may be opened and closed using similar opening/closing means.

As explained above, the transport unit (case ) The concept of controlling the environment within the prober is applicable not only to the prober of the above embodiment, but also to the prober that moves between the object storage section and the plurality of measurement sections to transport the object into the object storage section or into the plurality of measurement sections. The present invention can be applied to probers equipped with all kinds of transport units (for example, the self-propelled chassis described in Japanese Patent Application Laid-Open No. 5-343497).

Although the prober of the present invention has been described in detail above, the present invention is not limited to the above examples, and it goes without saying that various improvements and modifications may be made without departing from the gist of the present invention. be.

DESCRIPTION OF SYMBOLS 10... Prober, 12... Transport object storage part, 12a... Wafer storage part, 12b... Probe card storage part, 14... Measurement part, 14a... Opening, 16... Transport unit, 16a... Housing, 16b... Wafer holding arm, 16c ...Probe card holding arm, 16d...Environment control means, 16e...Sensor, 16f...Opening, 18...Wafer chuck, 20...Head stage, 22...Movement device, 24...First movable body, 26...Second movable body, 28 ...transport unit rotation mechanism, 28a...drive motor, 30, 32...guide rail, 34...base, CH...card holder, PC...probe card, W...wafer

Claims (1)

a conveyance object storage section for storing conveyance objects;
a plurality of measuring units having an environment different from the environment of the transported object storage section and arranged facing each other at a predetermined distance from the transported object storage section;
a transport unit that transports the transported object between the transported object storage section and the measurement section,
The transport unit has an environment control means for controlling the transport environment of the transported object,
The environment control means controls the transport environment of the transport object so that the transport environment of the transport object approaches the environment of the measurement unit when the transport object is transported from the transport object storage section to the measurement section.
Prober.

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