KR102531652B1 - Transpatent substrate having multilayer thin film coating - Google Patents

Abstract

According to one embodiment of the present invention, a transparent substrate provided with a multilayer thin film coating having low emission characteristics is provided. According to one embodiment of the present invention, the multilayer thin film coating may include a lower anti-reflection layer, a metal-based functional layer having infrared reflective characteristics, and an upper anti-reflection layer in a direction away from the transparent substrate. According to an embodiment of the present invention, each of the lower anti-reflection layer and the upper anti-reflection layer may include one or more dielectric layers, and the upper anti-reflection layer may include one or more stress relieving layers to offset stress formed by the dielectric layer.

Description

Transparent substrate with multi-layer thin film coating {TRANSPATENT SUBSTRATE HAVING MULTILAYER THIN FILM COATING}

The present invention relates to a transparent substrate provided with a multilayer thin film coating, and more particularly, to a transparent substrate configured to provide improved durability and optical properties by controlling the laminated structure and thickness of the coating layer.

The transparent substrate with low emission characteristics is a product in which a metal-based thin film layer having infrared reflective properties is formed on the transparent substrate, and can reflect solar radiation coming from the outside in summer and preserve heating radiation heat generated indoors in winter. It is widely used as architectural glass.

Since the transparent substrate having such a low emissivity property (so-called low-emissivity glass or low-E glass) is placed in a state exposed to the outdoor environment when used as glass for exterior walls for construction, metal There is a high risk that the functional layer of the base is corroded and damaged by moisture or oxygen, and accordingly, it is required to secure high durability along with excellent optical properties.

On the other hand, low-emissivity glass used as outer wall glass of buildings is widely used as a multi-layered structure (so-called double-glazed glass) in which a plurality of glass panes are spaced apart by spacers, and such double-glazed glass is used as a sealant between glass and spacers. It is formed through an edge stripping process that removes the coating layer of the portion where the sealant contacts so that the bond can be maintained firmly.

However, if such an edge stripping process is performed when forming double-glazed glass, productivity of double-glazed glass may decrease due to an increase in manufacturing time and cost due to the additional process.

As a way to solve this problem, a non-edge stripping technology for forming double-glazed glass without edge stripping has recently been proposed. Since higher durability (chemical resistance, moisture resistance, durability, etc.) should be secured compared to the case of forming, a new coating technology for this should be prepared.

The present invention is to solve the above-mentioned conventional problems, to provide a transparent substrate configured to secure effective productivity while improving durability and optical properties by controlling the laminated structure and thickness of the coating layer deposited on the transparent substrate. The purpose.

Representative configurations of the present invention for achieving the above object are as follows.

According to one embodiment of the present invention, a transparent substrate provided with a multilayer thin film coating having low emission characteristics is provided. According to one embodiment of the present invention, the multilayer thin film coating may include a lower anti-reflection layer, a metal-based functional layer having infrared reflective characteristics, and an upper anti-reflection layer in a direction away from the transparent substrate. According to an embodiment of the present invention, each of the lower anti-reflection layer and the upper anti-reflection layer may include one or more dielectric layers, and the upper anti-reflection layer may include one or more stress relieving layers to offset stress formed by the dielectric layer.

According to an embodiment of the present invention, the upper antireflection layer may include at least one dielectric layer that forms compressive stress, and the stress relieving layer may form tensile stress to offset the compressive stress formed by the dielectric layer.

According to one embodiment of the present invention, the upper antireflection layer may include a plurality of dielectric layers spaced apart from each other to form compressive stress, and the stress relieving layer may be positioned between the dielectric layers spaced apart from each other.

According to one embodiment of the present invention, the dielectric layer may include silicon nitride, and the stress relieving layer may include tin zinc oxide.

According to one embodiment of the present invention, the physical thickness of the stress relieving layer may be 3 nm to 8 nm.

According to one embodiment of the present invention, the physical thickness of each dielectric layer may be 16 nm to 25 nm.

According to one embodiment of the present invention, the dielectric layer may be configured not to include porous silicon nitride.

According to one embodiment of the present invention, the multilayer thin film coating includes a lower protective layer and an upper protective layer, and the lower protective layer and the upper protective layer directly contact the lower and upper surfaces of the functional layer to prevent oxidation of the functional layer. The sum of the physical thicknesses of the lower protective layer and the upper protective layer is 0.6 nm to 2.25 nm, and the physical thickness of the lower protective layer may be greater than that of the upper protective layer.

According to one embodiment of the present invention, the physical thickness of the lower protective layer may be 0.5 nm to 1.3 nm.

According to one embodiment of the present invention, the physical thickness of the upper passivation layer may be 0.2 nm to 0.6 nm.

According to one embodiment of the present invention, the lower protective layer and the upper protective layer may each include one or more types of metals or alloys of titanium, nickel, chromium, and niobium.

According to one embodiment of the present invention, the lower protective layer and the upper protective layer may each include a nickel-chromium alloy.

According to one embodiment of the present invention, the physical thickness of the functional layer may be 12 nm to 18 nm.

According to one embodiment of the present invention, the functional layer may include silver.

According to one embodiment of the present invention, the vertical emissivity of the transparent substrate provided with the multilayer thin film coating may be 0.03 to 0.05.

According to one embodiment of the present invention, the visible light transmittance of the transparent substrate provided with the multilayer thin film coating may be 70% or more.

According to one embodiment of the present invention, the visible light reflectance of the coating surface of the transparent substrate provided with the multilayer thin film coating may be 10% or less.

In addition to this, the transparent substrate provided with the multilayer thin film coating according to the present invention may further include other additional configurations within a range that does not impair the technical spirit of the present invention.

In the transparent substrate provided with a multi-layer thin film coating according to an embodiment of the present invention, a stress relieving layer is formed in the anti-reflection layer (preferably, an upper anti-reflection layer located on top of the functional layer) provided in the multi-layer thin film coating, so that the anti-reflection layer Since it is configured to offset the compressive stress generated when depositing the dielectric layer, stress balance is achieved so that the durability of the multilayer thin film coating can be improved and the dielectric layer of the antireflection layer can be efficiently formed at a relatively low pressure.

In addition, since the dielectric layer of the antireflection layer can be deposited in a relatively low pressure state due to the stress relieving layer in the transparent substrate having a multilayer thin film coating according to an embodiment of the present invention, unlike the dielectric layer deposited in a high pressure environment, Formation of a porous structure in the dielectric layer can be prevented, and due to this non-porous structure, permeation of sodium (Na) is prevented, resulting in higher resistance to sweat or fingerprints.

In addition, the transparent substrate having a multilayer thin film coating according to an embodiment of the present invention is configured to control the thickness of the antireflection layer, the protective layer, the functional layer, and the stress relaxation layer included in the antireflection layer within a predetermined range, Physical and optical properties of the transparent substrate provided with the multilayer thin film coating can be further improved.

1 exemplarily shows a cross-section laminated structure of a transparent substrate provided with a multi-layer thin film coating according to an embodiment of the present invention.
FIG. 2 illustratively shows results obtained by testing changes in scratch resistance according to the thickness of a stress relieving layer in a transparent substrate on which a multilayer thin film coating is formed according to the laminated structure shown in FIG. 1 .
FIG. 3 illustratively illustrates test results for confirming how much fingerprints on the surface of a transparent substrate on which a dielectric layer of an upper antireflection layer is formed after heat treatment remain after heat treatment in a high pressure environment according to an embodiment of the present invention. [Fig. 3(a) shows the surface state before heat treatment, and Fig. 3(b) shows the surface state after heat treatment]
FIG. 4 illustratively illustrates test results of confirming how much fingerprints on the surface of a transparent substrate configured such that a stress relieving layer is provided on an upper antireflection layer according to an embodiment of the present invention remain after heat treatment before heat treatment. [Fig. 4(a) shows the surface state before heat treatment, and Fig. 4(b) shows the surface state after heat treatment]

The embodiments described below are exemplified for the purpose of explaining the technical idea of the present invention, and the scope of the present invention is not limited to the embodiments or specific description thereof presented below.

All technical terms and scientific terms used in this specification have meanings commonly understood by those of ordinary skill in the art to which the present invention belongs, unless defined otherwise, and all terms used in this specification represent the present invention. It is selected for the purpose of more clearly explaining, and is not selected to limit the scope of the present invention.

For example, terms such as solar heat gain coefficient, emissivity, reflectance and transmittance, color coordinate index, and color neutrality used herein have the following meanings.

- Solar Heat Gain Coefficient (SHGC): An index representing the rate at which solar heat flows into the room through the transparent substrate, and is absorbed by the solar heat transmitted directly into the room through the transparent substrate and then returned to the room after being absorbed by the transparent substrate. Calculated as the sum of re-radiated energy

- Emissivity: Emissivity is an index that relatively indicates the degree to which an object emits heat due to radiation. It means the ratio of absorbed energy to energy [since the infrared energy absorbed by an object is the same as the infrared energy that is radiated again, the absorptivity represents the same value as the emissivity, and the emissivity in the infrared wavelength band is the relationship of "emissivity = 1 - reflectance" satisfies], unless otherwise specified, the emissivity described herein refers to the vertical emissivity.

- Corrected emissivity: The corrected emissivity is a value calculated by multiplying the vertical emissivity by the correction factor. In this specification, the corrected emissivity means the corrected emissivity value calculated by applying the correction factor specified in the KS L 2525 standard.

- Reflectance and transmittance: The reflectance represents the ratio of light reflected among the light incident on the transparent substrate, and the transmittance represents the ratio of light transmitted through the transparent substrate among the light incident on the transparent substrate. The reflectance and transmittance in , unless otherwise defined in the text, means the reflectance and transmittance for visible light.

Expressions such as "comprising," "including," "having," and the like used herein are open-ended terms that imply the possibility of including other embodiments unless otherwise stated in the phrase or sentence in which the expression is included. -ended terms).

Singular expressions described in this specification may include plural meanings unless otherwise stated, and this applies equally to singular expressions written in the claims.

In this specification, when a component is referred to as being "located" or "formed" on one side of another component, this means that a component is positioned or formed in direct contact with one side of another component, Or it should be understood that it can be positioned or formed with other new components interposed therebetween.

As used herein, direction indicators such as "downward" and "lower" mean a direction toward the transparent substrate in the accompanying drawings, and direction indicators such as "upper" and "upper" indicate the opposite direction (ie, the transparent substrate). direction away from ).

Hereinafter, with reference to the accompanying drawings, a preferred embodiment of the present invention will be described in detail so that those skilled in the art can easily practice it. In the accompanying drawings, the same or corresponding components are indicated by the same reference numerals, and duplicate description of the same or corresponding components in the description of the following embodiments may be omitted. However, even if a description of a specific component is omitted in the description below, this does not mean that the component is not included in the embodiment.

Referring to FIG. 1 , a single-sided laminated structure of a transparent substrate provided with a multi-layer thin film coating according to an embodiment of the present invention is illustrated as an example. For example, as shown in the drawing, a transparent substrate having a multilayer thin film coating according to an embodiment of the present invention includes a functional layer having an infrared reflective characteristic in the multilayer thin film coating to realize low-emission characteristics. E Glass).

According to one embodiment of the present invention, the transparent substrate 100 may be formed of a hard inorganic material or polymer organic material, for example, it may be formed of a normal glass substrate such as soda lime glass.

According to one embodiment of the present invention, the multi-layer thin film coating 200 is formed in a structure in which a plurality of thin film layers are laminated on the transparent substrate 100 to provide various optical, physical and chemical properties required for the transparent substrate. can be done

According to one embodiment of the present invention, the multilayer thin film coating 200 may be deposited and formed on the transparent substrate 100 using a physical vapor deposition (PVD) process such as a sputtering process.

According to one embodiment of the present invention, the thin film multilayer coating 200 is formed in a direction away from the transparent substrate 100, including a lower anti-reflection layer 210, a lower protective layer 220, a functional layer 230, and an upper protective layer 240. ) and an upper antireflection layer 250.

According to one embodiment of the present invention, the anti-reflection layer (in the case of the embodiment shown in the drawing, the lower anti-reflection layer 210 and the upper anti-reflection layer 250) prevents reflection of light having a wavelength in the visible ray region, thereby preventing the reflected light. It can perform the function of removing interference or scattering by and protecting the coating layer from external moisture or foreign substances.

According to one embodiment of the present invention, the anti-reflection layer (in the case of the embodiment shown in the drawing, the lower anti-reflection layer 210 and the upper anti-reflection layer 250) may be configured to include one or more dielectric layers.

According to an embodiment of the present invention, the dielectric layer constituting the antireflection layer may be formed of metal oxide, metal nitride, or metal oxynitride, and the metal included in the dielectric layer includes titanium (Ti), hafnium (Hf), and zirconium. One of (Zr), aluminum (Al), chromium (Cr), niobium (Nb), zinc (Zn), bismuth (Bi), lead (Pb), indium (In), tin (Sn), silicon (Si) It can be one or more metals or alloys thereof.

According to a preferred embodiment of the present invention, the dielectric layer constituting the antireflection layer may be formed of silicon nitride (eg, Si ₃ N ₄ ), and the dielectric layer may be doped with aluminum (Al) to improve sputtering deposition efficiency, In order to adjust the refractive index, a zirconium (Zr) doped metal target (eg, a silicon target) may be used.

For example, according to one embodiment of the present invention, aluminum may be doped in the range of 5 to 15 at% based on the metal target (if aluminum is less than 5 at%, the deposition rate may decrease, which may limit productivity, and aluminum If it exceeds 15 at%, the refractive index may be lowered), zirconium may be doped in the range of 10 to 40 at% based on the metal target (if zirconium is less than 10 at%, the refractive index may decrease and surface roughness may deteriorate, and zirconium If it exceeds 40at%, the emissivity characteristics may deteriorate due to the increase in light absorption).

However, the antireflection layer does not have to be limited to the dielectric layer having the above-described structure, and may be formed of a dielectric layer having a different structure, or may be configured to further include a metal layer instead of the dielectric layer or together with the dielectric layer.

According to one embodiment of the present invention, except for the optionally included overcoat (the outermost protective layer located farthest from the transparent substrate), the upper anti-reflection layer 250 located at the outermost part of the thin film multi-layer coating (ie, non- In double-glazed glass to which edge stripping technology is applied, the coating layer located close to the sealant) can have a significant effect on the durability of the thin film multilayer coating.

Therefore, in a transparent substrate having a multi-layer thin film coating according to an embodiment of the present invention, it may be preferable to ensure durability of the upper antireflection layer 250 having a sufficient physical thickness.

According to one embodiment of the present invention, the total physical thickness of the upper anti-reflection layer 250 may be formed to be 30 nm or more, more preferably 35 nm to 60 nm, and the upper anti-reflection layer 250 is a lower anti-reflection layer ( 210) may be preferably formed to have a thicker physical thickness.

For example, according to an embodiment of the present invention, the upper anti-reflection layer 250 may be formed to have a physical thickness 1.1 to 2.0 times that of the lower anti-reflection layer 210 . In this way, when the thickness ratio of the upper anti-reflection layer 250 and the lower anti-reflection layer 210 is adjusted, optical properties such as transmittance, reflectance, and reflective color of the multilayer thin film coating can be adjusted.

On the other hand, as described above, when the physical thickness of the upper anti-reflection layer 250 is formed thick, stress imbalance in the process of forming the upper anti-reflection layer 250 (in particular, occurs when the dielectric layer of the upper anti-reflection layer 250 is deposited) compressive stress] may occur and the durability of the coating layer may deteriorate, so countermeasures may be required.

As a way to prevent such a stress imbalance problem, a transparent substrate having a multi-layer thin film coating according to an embodiment of the present invention is subject to process conditions (eg, reactive gas, power, etc.) for depositing the dielectric layer of the upper anti-reflection layer 250 may be configured to form the dielectric layer into a porous structure (eg, porous silicon nitride) by adjusting the .

According to this method, the compressive stress generated during the deposition of the dielectric layer of the upper anti-reflection layer 250 is offset by the porous structure, making it possible to stably form the thick upper anti-reflection layer 250 .

On the other hand, as another way to solve the stress imbalance problem occurring in the upper anti-reflection layer 250, a transparent substrate having a multilayer thin film coating according to an embodiment of the present invention is a stress relieving layer in the upper anti-reflection layer 250. It can be configured to provide.

Specifically, according to one embodiment of the present invention, the upper antireflection layer 250 located on top of the functional layer 230 includes one or more dielectric layers forming compressive stress, and cancels the compressive stress formed by the dielectric layer. It may be configured to include one or more stress relieving layers for

For example, as shown in FIG. 1 , the upper antireflection layer 250 may be formed in a structure in which dielectric layers forming compressive stress are spaced apart in the vertical direction, and a stress relieving layer is interposed between the spaced apart dielectric layers. .

According to an embodiment of the present invention, the dielectric layer provided on the upper anti-reflection layer 250 may include silicon nitride (Si ₃ N ₄ ), and the stress relaxation layer may include tin zinc oxide (SnZnOx). And, the dielectric layer may preferably be configured not to include porous silicon nitride.

As such, when the antireflection layer (specifically, the upper antireflection layer 250) provided in the multilayer thin film coating is provided with a stress relieving layer, the compressive stress generated in the dielectric layer of the antireflection layer is offset by the stress relieving layer to balance the stress. This can be achieved, and thereby the overall durability of the coating layer can be improved.

According to one embodiment of the present invention, it may be preferable that the physical thickness of the stress relieving layer is formed to be 3 nm to 8 nm, and the physical thickness of the dielectric layer is formed to be 16 nm to 25 nm, respectively.

If the thickness of the stress relieving layer is formed too thin or too thick, it may not sufficiently offset the compressive stress generated during the deposition of the dielectric layer, which may cause a problem in that sufficient durability of the coating layer may not be secured. In the transparent substrate provided with the coating, it may be desirable to control the physical thickness of the stress relieving layer within the aforementioned range.

In this regard, referring to FIG. 2 , the result of testing the durability (scratch resistance) change of the coating layer according to the physical thickness of the stress relieving layer is shown as an example. Specifically, in the durability test shown in FIG. 2, a multi-layer thin film coating was formed on a transparent substrate with the laminated structure shown in FIG. As a result of confirming the degree of occurrence, FIG. 2 (a) to (e) show the test results for the transparent substrate on which the stress relieving layer is deposited with a physical thickness of 10 nm, 8 nm, 5 nm, 3 nm, and 0 nm, respectively.

As a result of performing this durability test, it was confirmed that damage started to occur in the upper antireflection layer 250 as the physical thickness of the stress relieving layer became less than 3 nm or exceeded 8 nm. When the upper anti-reflection layer 250 is not provided with a stress relieving layer having a sufficient thickness as shown in FIG. It can be confirmed that the functional layer 230 located below the upper antireflection layer 250 is damaged, indicating inappropriate quality for use.

In addition, the transparent substrate having a multilayer thin film coating according to an embodiment of the present invention does not deposit the dielectric layer of the upper anti-reflection layer 250 in a high-pressure environment due to the compressive stress offset by the stress relieving layer, but in a relatively low-pressure environment. Even if deposited in the thin film layer can be stably formed, and the material consumption rate of the sputter target is reduced when forming the dielectric layer of the upper antireflection layer 250 by the deposition process performed in a relatively low pressure environment, thereby reducing the production cost. This is reduced, and the dielectric layer of the upper antireflection layer 250 is formed in a non-porous structure, so that resistance to sweat or fingerprints can be improved.

For example, referring to FIGS. 3 and 4, the stress relieving layer is formed in the upper antireflection layer 250 and the transparent substrate (FIG. 3) of the embodiment formed by sputtering the upper antireflection layer in a high-pressure environment without the stress relieving layer, so that the relative relative In a low-pressure environment, a test result of how much a fingerprint on the surface of a transparent substrate (FIG. 4) on which the dielectric layer of the upper antireflection layer 250 is deposited is shown as an example after heat treatment.

As shown in FIG. 3, in the case of the embodiment in which the dielectric layer of the upper antireflection layer 250 is deposited in a high-pressure environment, since a porous structure is formed on the surface of the dielectric layer by a high-pressure sputtering process, FIG. 3 (b) ), it can be confirmed that the handprints on the surface remain to some extent even after heat treatment, as shown in the circled portion.

On the other hand, in the transparent substrate of the embodiment in which the stress relieving layer is formed in the upper anti-reflection layer 250, the dielectric layer of the upper anti-reflection layer 250 can be deposited in a relatively low pressure environment due to the stress relieving layer. The dielectric layer of the prevention layer 250 can be formed in a non-porous structure, and as a result, as shown in FIG. 4(b), it can be seen that most of the fingerprints on the surface do not remain after heat treatment.

Next, according to one embodiment of the present invention, the functional layer is a metal-based thin film layer having high reflection characteristics for wavelengths in the infrared region, and a wavelength range in the infrared region (eg, about 5 μm to about 50 μm in the far infrared region). It can perform the function of lowering the emissivity by reflecting the .

According to an embodiment of the present invention, the functional layer 230 is one of gold (Au), copper (Cu), palladium (Pd), aluminum (Al), and silver (Ag) having high reflectivity for infrared rays. It may be configured to include one or more metals or alloys thereof.

For example, according to a preferred embodiment of the present invention, the functional layer 230 may be configured to include silver (Ag), which exhibits good reflection characteristics for wavelengths in the infrared region and is relatively inexpensive.

According to an embodiment of the present invention, the functional layer 230 may be formed to have a physical thickness of 12 nm to 18 nm so that excellent optical characteristics can be secured while sufficiently implementing low-emission characteristics.

If the functional layer 230 is formed too thin, a solar heat gain coefficient (SHGC) problem may occur, and if the thickness of the functional layer 230 is formed too thick, the transmission color is biased toward blue. may occur, it may be desirable to control the physical thickness of the functional layer 230 within the above range in the transparent substrate provided with the multilayer thin film coating according to an embodiment of the present invention.

According to one embodiment of the present invention, the protective layer may be disposed above and below the functional layer to prevent the functional layer from being corroded or oxidized due to exposure to moisture or oxygen. For example, the protective layer may perform a function of preventing damage to the functional layer due to oxygen inflow into the functional layer during a deposition process or a heat treatment process.

According to one embodiment of the present invention, the protective layer may be configured to be formed in direct contact with the upper and/or lower surfaces of the functional layer. Specifically, in the transparent substrate provided with a multilayer thin film coating according to an embodiment of the present invention, the lower protective layer 220 and the upper protective layer 240 are directly formed on the lower and/or upper surfaces of the functional layer 230, respectively. It can be configured to be formed in contact.

According to one embodiment of the present invention, the protective layer (in the case of the embodiment shown in the drawing, the lower protective layer 220 and the upper protective layer 240) is titanium (Ti), nickel (Ni), chromium (Cr) , niobium (Nb), one or more metals or alloys thereof, preferably a nickel-chromium (NiCr) alloy.

According to an embodiment of the present invention, the physical thickness of the lower protective layer 220 and the upper protective layer 240 is predetermined to prevent deterioration of optical characteristics while faithfully performing the protective function for the functional layer 230. It may be desirable to be controlled within the range of.

According to one embodiment of the present invention, the physical thickness of the lower protective layer 220 is formed to be thicker than the physical thickness of the upper protective layer 240 in order to faithfully protect the lower portion where peeling of the coating layer can occur more easily. It may be desirable to be configured so that.

According to one embodiment of the present invention, it may be preferable that the physical thickness of the lower protective layer 220 is formed to 0.5 nm to 1.3 nm, and the physical thickness of the upper protective layer 240 is formed to be 0.2 nm to 0.6 nm. there is.

Referring to [Table 1] below, test data for confirming the characteristics of the transparent substrate according to the physical thickness of the protective layer in the transparent substrate equipped with a multilayer thin film coating according to an embodiment of the present invention are exemplarily disclosed. .

Comparative Example 1 Comparative Example 2 Example 1 Example 2 Physical thickness of upper protective layer (nm) 0.2 0.6 0.2 0.4 Physical thickness of lower protective layer (nm) 0.2 0.2 0.6 One Transmittance (%) 82 78 78 74 Crystalized emissivity (%) 8 10 10 12 immersion test 1 day 2 days more than 7 days more than 7 days high temperature and humidity test 5 days 7 days more than 28 days more than 28 days

※ The immersion test is the result of measuring the time for corrosion after immersing the product in a mixture of 0.01N H ₂ SO ₄ and 10wt% NaCl at room temperature.

※ The high-temperature and high-humidity test is the result of measuring the time for corrosion to occur after leaving the product in an environment of 40℃ and 100% relative humidity.

※ In [Table 1], 'more than 7 days' and 'more than 28 days' means that the experiment was terminated because corrosion did not occur even after leaving it for 7 days and 28 days.

As summarized in [Table 1], when the physical thickness of the protective layer located above and below the functional layer 230 is controlled within a predetermined range according to an embodiment of the present invention, a higher crystal emissivity is secured while transparent It can be confirmed that the corrosion resistance of the substrate can be further improved.

According to the laminated structure of the transparent substrate provided with a multi-layer thin film coating according to an embodiment of the present invention described above, the transparent substrate provided with a multi-layer thin film coating according to an embodiment of the present invention has improved optical, physical, and chemical properties can be displayed.

For example, a transparent substrate provided with a multilayer thin film coating according to an embodiment of the present invention can provide a vertical emissivity of 3.0% to 5.0%, a visible light transmittance of 70% or more, and a visible light reflectance of 10% or less.

Although the present invention has been described with specific details and limited examples, such as specific components, these examples are provided only to help a more general understanding of the present invention, and the present invention is not limited thereto, and the present invention is not limited thereto. Those skilled in the art can make various modifications and variations from these descriptions.

Therefore, the spirit of the present invention should not be limited to the above-described embodiments and should not be determined, and all things equivalent or equivalently modified in the claims as well as the claims described below belong to the scope of the spirit of the present invention. something to do.

100: transparent substrate
200: multi-layer thin film coating
210: lower antireflection layer
220: lower protective layer
230: functional layer
240: upper protective layer
250: upper antireflection layer

Claims (17)

It is a transparent substrate 100 equipped with a multilayer thin film coating 200 having low-emission characteristics,
The multilayer thin film coating 200 includes a lower anti-reflection layer 210, a metal-based functional layer 230 having infrared reflective properties, and an upper anti-reflection layer 250 in a direction away from the transparent substrate 100,
The lower anti-reflection layer 210 and the upper anti-reflection layer 250 each include one or more dielectric layers,
The upper antireflection layer 250 is provided with one or more stress relieving layers to offset stress formed by the dielectric layer,
The upper anti-reflection layer 250 has a physical thickness greater than that of the lower anti-reflection layer 210,
The upper antireflection layer 250 includes a plurality of dielectric layers forming compressive stress spaced apart from each other,
The stress relieving layer is located between dielectric layers spaced apart from each other,
The physical thickness of each of the dielectric layers is 16 nm to 25 nm,
The physical thickness of the stress relieving layer is 3 nm to 8 nm,
transparent substrate. delete delete According to claim 1,
The dielectric layer includes silicon nitride,
The stress relieving layer comprises tin zinc oxide,
transparent substrate. delete delete According to claim 4,
The dielectric layer does not contain porous silicon nitride,
transparent substrate. According to claim 1,
The multilayer thin film coating 200 includes a lower protective layer 220 and an upper protective layer 240,
The lower protective layer 220 and the upper protective layer 240 are formed in direct contact with the lower and upper surfaces of the functional layer 230 to prevent oxidation of the functional layer 230,
The sum of the physical thicknesses of the lower protective layer 220 and the upper protective layer 240 is 0.6 nm to 2.25 nm,
The physical thickness of the lower protective layer 220 is greater than the physical thickness of the upper protective layer 240,
transparent substrate. According to claim 8,
The physical thickness of the lower protective layer 220 is 0.5 nm to 1.3 nm,
transparent substrate. According to claim 8,
The physical thickness of the upper protective layer 240 is 0.2 nm to 0.6 nm,
transparent substrate. According to claim 8,
The lower protective layer 220 and the upper protective layer 240 each contain one or more metals or alloys of titanium (Ti), nickel (Ni), chromium (Cr), and niobium (Nb),
transparent substrate. According to claim 11,
The lower protective layer 220 and the upper protective layer 240 each include a nickel-chromium (NiCr) alloy,
transparent substrate. According to claim 1,
The physical thickness of the functional layer 230 is 12 nm to 18 nm,
transparent substrate. According to claim 13,
The functional layer 230 includes silver (Ag)
transparent substrate. The method of any one of claims 1, 4 and 7 to 14,
The vertical emissivity of the transparent substrate provided with the multilayer thin film coating is 0.03 to 0.05,
transparent substrate. The method of any one of claims 1, 4 and 7 to 14,
The visible light transmittance of the transparent substrate provided with the multilayer thin film coating is 70% or more,
transparent substrate. The method of any one of claims 1, 4 and 7 to 14,
The visible light reflectance of the coated surface of the transparent substrate provided with the multilayer thin film coating is 10% or less,
transparent substrate.

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