KR102491834B1 - 반도체용 접착제, 반도체 장치의 제조 방법 및 반도체 장치 - Google Patents
반도체용 접착제, 반도체 장치의 제조 방법 및 반도체 장치 Download PDFInfo
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- KR102491834B1 KR102491834B1 KR1020197032068A KR20197032068A KR102491834B1 KR 102491834 B1 KR102491834 B1 KR 102491834B1 KR 1020197032068 A KR1020197032068 A KR 1020197032068A KR 20197032068 A KR20197032068 A KR 20197032068A KR 102491834 B1 KR102491834 B1 KR 102491834B1
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- South Korea
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- adhesive
- semiconductors
- semiconductor
- connection
- semiconductor device
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
- C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10D89/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/18—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of the types provided for in two or more different main groups of the same subclass of H10B, H10D, H10F, H10H, H10K or H10N
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Wire Bonding (AREA)
- Adhesive Tapes (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Die Bonding (AREA)
- Bipolar Transistors (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2017-121512 | 2017-06-21 | ||
JP2017121512 | 2017-06-21 | ||
PCT/JP2018/023422 WO2018235854A1 (ja) | 2017-06-21 | 2018-06-20 | 半導体用接着剤、半導体装置の製造方法及び半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20200020666A KR20200020666A (ko) | 2020-02-26 |
KR102491834B1 true KR102491834B1 (ko) | 2023-01-25 |
Family
ID=64737158
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020197032068A Active KR102491834B1 (ko) | 2017-06-21 | 2018-06-20 | 반도체용 접착제, 반도체 장치의 제조 방법 및 반도체 장치 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7196841B2 (zh) |
KR (1) | KR102491834B1 (zh) |
TW (1) | TWI818911B (zh) |
WO (1) | WO2018235854A1 (zh) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112513142B (zh) * | 2018-07-18 | 2023-08-18 | 琳得科株式会社 | 树脂片及层叠体 |
JP2020150202A (ja) * | 2019-03-15 | 2020-09-17 | キオクシア株式会社 | 半導体装置の製造方法 |
JP2021011512A (ja) * | 2019-07-03 | 2021-02-04 | 昭和電工マテリアルズ株式会社 | 接着剤組成物、フィルム状接着剤、接着シート、ダイシング・ダイボンディング一体型接着シート、並びに半導体装置及びその製造方法 |
JP7567802B2 (ja) * | 2019-09-30 | 2024-10-16 | 株式会社レゾナック | 半導体用接着剤及びその製造方法、並びに、半導体装置及びその製造方法 |
WO2022059095A1 (ja) * | 2020-09-16 | 2022-03-24 | 昭和電工マテリアルズ株式会社 | 半導体用接着剤、並びに、半導体装置及びその製造方法 |
JP7647092B2 (ja) | 2020-09-16 | 2025-03-18 | 株式会社レゾナック | 半導体用接着剤、並びに、半導体装置及びその製造方法 |
WO2022059639A1 (ja) * | 2020-09-16 | 2022-03-24 | 昭和電工マテリアルズ株式会社 | 半導体用接着剤、並びに、半導体装置及びその製造方法 |
KR20240154289A (ko) * | 2023-04-18 | 2024-10-25 | 주식회사 엘지화학 | 비전도성 필름, 반도체 장치 및 이의 제조 방법 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008054012A1 (fr) | 2006-10-31 | 2008-05-08 | Sumitomo Bakelite Co., Ltd. | Ruban adhésif et dispositif à semi-conducteur l'utilisant |
JP2013112730A (ja) * | 2011-11-28 | 2013-06-10 | Nitto Denko Corp | シート状封止組成物及び半導体装置の製造方法 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2007125650A1 (ja) | 2006-04-27 | 2009-09-10 | 住友ベークライト株式会社 | 接着テープ、半導体パッケージおよび電子機器 |
WO2008023452A1 (fr) | 2006-08-25 | 2008-02-28 | Sumitomo Bakelite Co., Ltd. | Bande adhésive, structure de jonction, et ensemble semi-conducteur |
JP5217260B2 (ja) * | 2007-04-27 | 2013-06-19 | 住友ベークライト株式会社 | 半導体ウエハーの接合方法および半導体装置の製造方法 |
JP5266696B2 (ja) * | 2007-09-19 | 2013-08-21 | 東レ株式会社 | 電子機器用接着剤組成物およびそれを用いた電子機器用接着剤シート |
JP4976531B2 (ja) * | 2010-09-06 | 2012-07-18 | 日東電工株式会社 | 半導体装置用フィルム |
KR101728203B1 (ko) | 2010-09-30 | 2017-04-18 | 히타치가세이가부시끼가이샤 | 접착제 조성물, 반도체 장치의 제조 방법 및 반도체 장치 |
JP2012184288A (ja) | 2011-03-03 | 2012-09-27 | Hitachi Chemical Co Ltd | 回路接続用接着剤、回路接続用接着シート及び半導体装置の製造方法 |
JP5834606B2 (ja) * | 2011-08-05 | 2015-12-24 | Dic株式会社 | 紫外線硬化型粘着剤用樹脂組成物、粘着剤及び積層体 |
US9085685B2 (en) * | 2011-11-28 | 2015-07-21 | Nitto Denko Corporation | Under-fill material and method for producing semiconductor device |
JP5820714B2 (ja) | 2011-12-13 | 2015-11-24 | 花王株式会社 | カラーフィルター用顔料分散体 |
JP6098289B2 (ja) * | 2013-03-28 | 2017-03-22 | デクセリアルズ株式会社 | 熱伝導性シート |
JP6572043B2 (ja) | 2015-07-24 | 2019-09-04 | 積水化学工業株式会社 | 半導体ウェハ保護用フィルム |
CN108283002A (zh) | 2015-11-24 | 2018-07-13 | 琳得科株式会社 | 电路构件连接用树脂片 |
WO2017090440A1 (ja) | 2015-11-24 | 2017-06-01 | リンテック株式会社 | 回路部材接続用樹脂シート |
-
2018
- 2018-06-20 KR KR1020197032068A patent/KR102491834B1/ko active Active
- 2018-06-20 JP JP2019525654A patent/JP7196841B2/ja active Active
- 2018-06-20 TW TW107121179A patent/TWI818911B/zh active
- 2018-06-20 WO PCT/JP2018/023422 patent/WO2018235854A1/ja active Application Filing
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008054012A1 (fr) | 2006-10-31 | 2008-05-08 | Sumitomo Bakelite Co., Ltd. | Ruban adhésif et dispositif à semi-conducteur l'utilisant |
JP2013112730A (ja) * | 2011-11-28 | 2013-06-10 | Nitto Denko Corp | シート状封止組成物及び半導体装置の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
KR20200020666A (ko) | 2020-02-26 |
WO2018235854A1 (ja) | 2018-12-27 |
TW201906956A (zh) | 2019-02-16 |
TWI818911B (zh) | 2023-10-21 |
JPWO2018235854A1 (ja) | 2020-04-23 |
JP7196841B2 (ja) | 2022-12-27 |
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