KR102433759B1 - 웨이퍼 식각장치 - Google Patents
웨이퍼 식각장치 Download PDFInfo
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- KR102433759B1 KR102433759B1 KR1020200159800A KR20200159800A KR102433759B1 KR 102433759 B1 KR102433759 B1 KR 102433759B1 KR 1020200159800 A KR1020200159800 A KR 1020200159800A KR 20200159800 A KR20200159800 A KR 20200159800A KR 102433759 B1 KR102433759 B1 KR 102433759B1
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- 238000005530 etching Methods 0.000 title claims abstract description 54
- 239000000758 substrate Substances 0.000 title 1
- 230000007246 mechanism Effects 0.000 claims abstract description 56
- 239000012530 fluid Substances 0.000 claims abstract description 44
- 238000007654 immersion Methods 0.000 claims abstract description 28
- 238000002347 injection Methods 0.000 claims abstract description 13
- 239000007924 injection Substances 0.000 claims abstract description 13
- 238000004140 cleaning Methods 0.000 claims description 20
- 230000003028 elevating effect Effects 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 9
- 238000007789 sealing Methods 0.000 claims description 8
- 238000005507 spraying Methods 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 description 99
- 239000000243 solution Substances 0.000 description 6
- 238000011109 contamination Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Weting (AREA)
Abstract
Description
도 3 내지 도 4는 본 발명의 제1 실시예에 따른 웨이퍼 식각장치의 사용 상태 설명도이다.
도 5 및 도 6은 본 발명의 제1 실시예에 따른 웨이퍼 식각장치의 변형 실시에 대한 설명도다.
도 7 및 도 8은 본 발명의 제2 실시예에 따른 웨이퍼 식각장치의 설명도다.
도 9 내지 도 10은 본 발명의 제2 실시예에 따른 웨이퍼 식각장치의 사용 상태 설명도이다.
도 11 내지 도 13은 본 발명의 제2 실시예에 따른 웨이퍼 식각장치의 변형 실시에 대한 설명도이다.
100 : 침지기구 101 : 밑판
102 : 음압 관로 110 : 캐리어
111 : 척 112 : 배수면
120 : 링형벽 121 : 장부
122 : 링형 홈 130 : 스토퍼 모듈
131 : 밀폐링 132 : 가스 분출구
200 : 회전모터 210 : 회전축
300 : 개폐기구 310 : 제1 승강모듈
311 : 신축바 320 : 제2 승강모듈
321 : 신축바 400 : 주입 노즐
500 : 외부 배수조 501 : 배수로
510 : 분기용 링형 캡 520 : 승강기구
600 : 청소 모듈 601 : 청소 노즐
Claims (13)
- 작업용 유체로 웨이퍼를 식각하기 위한 웨이퍼 식각장치에 있어서,
상기 웨이퍼를 탑재하기 위한 캐리어 및 작업용 유체를 담기 위해 상기 웨이퍼 둘레에 끼워지기 위한 링형벽을 구비하는 침지기구와,
상기 캐리어에 연동되어 상기 캐리어를 회전하도록 구동할 수 있는 회전모터와,
상기 침지기구에 연동되어 상기 캐리어 및 상기 링형벽이 상대적으로 이동하게 구동함으로써 상기 웨이퍼가 상기 링형벽에서 출입할 수 있게 하는 개폐기구, 및
상기 침지기구의 일측에 구비되고 또한 상기 링형벽 안쪽을 향하게 배치되는, 상기 작업용 유체를 공급하기 위한 주입 노즐을 포함하고,
상기 링형벽에는 스토퍼 모듈을 구비하여 상기 웨이퍼 표면을 오버플로우하는 작업용 유체를 저지하고,
상기 스토퍼 모듈은 상기 링형벽에 구비되는 밀폐링을 포함하고, 상기 캐리어는 밑판을 포함하고, 상기 밀폐링은 상기 밑판의 가장자리에 맞닿아 압력을 가하고,
상기 밑판의 상단면에는 돌출된 원추형 모양의 배수면이 형성되는 것을 특징으로 하는 웨이퍼 식각장치. - 제1항에 있어서,
내부에 상기 침지기구를 안치하는 외부 배수조를 더 포함하는 것을 특징으로 하는 웨이퍼 식각장치. - 제2항에 있어서,
상기 외부 배수조는 감싸는 방식으로 상호 겹쳐지는 다수 개의 분기용 링형 캡을 포함하고, 각각의 상기 분기용 링형 캡은 각각 상기 침지기구를 둘러싸고 또한 독자적으로 승강할 수 있는 것을 특징으로 하는 웨이퍼 식각장치. - 제1항에 있어서,
상기 개폐기구는 상기 캐리어에 연결되는 제1 승강모듈을 포함하는 것을 특징으로 하는 웨이퍼 식각장치. - 제1항에 있어서,
상기 개폐기구는 상기 링형벽에 연결되는 제2 승강모듈을 포함하는 것을 특징으로 하는 웨이퍼 식각장치. - 제1항에 있어서,
상기 스토퍼 모듈은 상기 링형벽의 내벽면에 연통되게 다수 개의 가스 분출구를 구비하여 가스를 상기 링형벽과 상기 웨이퍼 사이의 틈새에 주입하는 것을 특징으로 하는 웨이퍼 식각장치. - 제1항에 있어서,
상기 캐리어는 상기 밑판의 상단면에 세로로 구비되는 다수 개의 척을 구비하고 상기 웨이퍼는 상술한 척에 탑재되는 것을 특징으로 하는 웨이퍼 식각장치. - 제1항에 있어서,
상기 회전모터는 상기 링형벽에 연동되어 상기 링형벽과 상기 캐리어가 동시에 회전하도록 구동할 수 있는 것을 특징으로 하는 웨이퍼 식각장치. - 제1항에 있어서,
상기 캐리어 옆에는 상기 캐리어를 에워 싸는 다수 개의 청소 노즐을 구비하고 상술한 청소 노즐은 위로 벌어지게 배치되는 것을 특징으로 하는 웨이퍼 식각장치. - 제9항에 있어서,
상술한 청소 노즐의 분사 방향은 밖을 향해 발산하는 것을 특징으로 하는 웨이퍼 식각장치.
- 삭제
- 삭제
- 삭제
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW109137455A TWI747580B (zh) | 2020-10-28 | 2020-10-28 | 晶圓蝕刻裝置 |
TW109137455 | 2020-10-28 |
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KR20220056763A KR20220056763A (ko) | 2022-05-06 |
KR102433759B1 true KR102433759B1 (ko) | 2022-08-18 |
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TW (1) | TWI747580B (ko) |
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CN118231300B (zh) * | 2024-05-24 | 2024-08-23 | 北京翼华云网科技有限公司 | 一种半导体器件及应用 |
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KR100618868B1 (ko) * | 2004-10-19 | 2006-08-31 | 삼성전자주식회사 | 스핀 장치 |
JP2008251806A (ja) * | 2007-03-30 | 2008-10-16 | Sumco Corp | ウェーハの枚葉式エッチング方法及びそのエッチング装置 |
JP2011103361A (ja) | 2009-11-10 | 2011-05-26 | Sofu Engineering:Kk | リフトオフ装置およびリフトオフ処理方法 |
JP2015220369A (ja) * | 2014-05-19 | 2015-12-07 | 東京エレクトロン株式会社 | 基板液処理装置、基板液処理方法及び記憶媒体 |
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JP6982432B2 (ja) | 2017-08-24 | 2021-12-17 | 株式会社Screenホールディングス | 基板処理装置 |
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JP2520833B2 (ja) * | 1992-12-21 | 1996-07-31 | 東京エレクトロン株式会社 | 浸漬式の液処理装置 |
JP5276420B2 (ja) * | 2008-01-31 | 2013-08-28 | 大日本スクリーン製造株式会社 | 基板処理装置および基板処理方法 |
JP5301505B2 (ja) * | 2009-08-27 | 2013-09-25 | 東京エレクトロン株式会社 | 液処理装置および液処理方法 |
JP5844681B2 (ja) * | 2011-07-06 | 2016-01-20 | 東京エレクトロン株式会社 | 基板液処理装置及び基板液処理方法 |
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JP6770886B2 (ja) * | 2016-12-28 | 2020-10-21 | 株式会社Screenホールディングス | 基板処理装置及び基板処理方法 |
JP7029251B2 (ja) * | 2017-08-28 | 2022-03-03 | 株式会社Screenホールディングス | 基板処理方法および基板処理装置 |
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2020
- 2020-10-28 TW TW109137455A patent/TWI747580B/zh active
- 2020-11-25 KR KR1020200159800A patent/KR102433759B1/ko active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2001192845A (ja) * | 2000-01-13 | 2001-07-17 | Tokyo Electron Ltd | 無電解メッキ装置及び無電解メッキ方法 |
KR100618868B1 (ko) * | 2004-10-19 | 2006-08-31 | 삼성전자주식회사 | 스핀 장치 |
JP2008251806A (ja) * | 2007-03-30 | 2008-10-16 | Sumco Corp | ウェーハの枚葉式エッチング方法及びそのエッチング装置 |
JP2011103361A (ja) | 2009-11-10 | 2011-05-26 | Sofu Engineering:Kk | リフトオフ装置およびリフトオフ処理方法 |
KR101678269B1 (ko) | 2011-10-24 | 2016-11-21 | 도쿄엘렉트론가부시키가이샤 | 기판 처리 장치 및 기판 처리 방법 |
JP2015220369A (ja) * | 2014-05-19 | 2015-12-07 | 東京エレクトロン株式会社 | 基板液処理装置、基板液処理方法及び記憶媒体 |
JP6982432B2 (ja) | 2017-08-24 | 2021-12-17 | 株式会社Screenホールディングス | 基板処理装置 |
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TW202218003A (zh) | 2022-05-01 |
TWI747580B (zh) | 2021-11-21 |
KR20220056763A (ko) | 2022-05-06 |
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