KR102424362B1 - A lens moving unit, and camera module and optical instrument including the same - Google Patents

Abstract

The embodiment provides a housing, a bobbin disposed within the housing, a first coil disposed on the bobbin, a magnet disposed on the housing, an elastic part coupled to the bobbin and the housing, a circuit board disposed under the housing and including a pad part, the circuit board under the circuit board a first pad disposed under the circuit board, a first pad disposed under the circuit board, comprising: a base disposed on the base; a terminal disposed on the base; and a support part having one end coupled to the elastic part and the other end coupled to the terminal; a second pad configured to be formed, and a third pad connecting the first pad and the second pad.

Description

A lens driving device and a camera module and optical device including the same

The embodiment relates to a lens driving device, a camera module and an optical device including the same.

Since it is difficult to apply the technology of a voice coil motor (VCM) used in an existing general camera module to a camera module for ultra-small size and low power consumption, research related thereto has been actively conducted.

In the case of a camera module mounted on a small electronic product such as a smartphone, the camera module may be frequently impacted during use, and the camera module may be slightly shaken according to a user's hand shake while shooting. In consideration of such a point, a technology for additionally installing an anti-shake means to a camera module has been recently developed. For information related to a general camera module, see Korean Patent Application Laid-Open No. 10-2015-0008662 (January 23, 2015) can refer to

The embodiment provides a lens driving device capable of improving solderability between a circuit board and a terminal and preventing electrical disconnection between the terminal and the circuit board, and a camera module and an optical device including the same.

A lens driving device according to an embodiment includes a housing; a bobbin disposed within the housing; a first coil disposed on the bobbin; a magnet disposed on the housing; an elastic part coupled to the bobbin and the housing; a circuit board disposed under the housing and including a pad part; a base disposed under the circuit board; and a terminal disposed on the base. and a support part having one end coupled to the elastic part and the other end coupled to the terminal, wherein the pad part includes a first pad disposed below the circuit board, a second pad disposed above the circuit board, and and a third pad connecting the first pad and the second pad.

The terminal may include a first coupling part coupled to the other end of the support part and a second coupling part coupled to the pad part of the circuit board.

The circuit board may include a groove disposed at a position corresponding to the second coupling portion of the terminal, and a portion of the third pad may be disposed in the groove.

The circuit board may include a through via disposed at a position corresponding to the second coupling portion of the terminal, and a portion of the third pad may be disposed in the through via.

The circuit board may include a first insulating layer, a first conductive layer disposed on an upper surface of the first insulating layer, a second insulating layer disposed on an upper surface of the first conductive layer, and a first insulating layer disposed on a lower surface of the first insulating layer. a second conductive layer, and a third insulating layer disposed on a lower surface of the second conductive layer, wherein the first pad is disposed on the lower surface of the second conductive layer, and the second pad is the first conductive layer It may be disposed on the upper surface of the layer.

A lower surface of the first pad may be disposed higher than a lower surface of the third insulating layer of the circuit board.

An area of the first pad may be larger than an area of the second pad.

It may include a solder disposed between the first pad and the second coupling portion.

The solder may be disposed on the second pad and the third pad.

The first pad may face the terminal in an optical axis direction.

The elastic part includes a first elastic part disposed on the upper surface of the bobbin; and a second elastic part disposed on a lower surface of the bobbin, and the support part may be coupled to the first elastic part.

The first elastic part may be an upper elastic body, and the second elastic part may be a lower elastic body.

The third pad may be disposed on a side surface of the circuit board.

The embodiment may improve solderability between the circuit board and the terminal, and prevent electrical disconnection between the terminal and the circuit board.

1 is an exploded view of a lens driving device according to an embodiment.
2 is a view showing the coupling of the lens driving device excluding the cover member.
3 is a perspective view of a bobbin;
4 is a perspective view of the housing;
5 is a perspective view of a first elastic part, a second elastic part, a support part, a second coil, a circuit board, and a base.
6 is a perspective view of a second coil, a circuit board, and supports;
7 is an exploded perspective view of a circuit board disposed on a base and a second coil;
FIG. 8 is a partially enlarged view of the base and the circuit board shown in FIG. 7 .
9 is a bottom view of a circuit member including a second coil.
10A shows an exploded perspective view of a base, a position sensor, and a terminal;
10B shows a bottom view of the base.
10C is a perspective view of a combination of a base and a terminal;
11 is a perspective view of a first terminal and a first support.
12 is a part of a perspective view in which a base, a first terminal, and a circuit board are coupled to each other.
13 shows a bottom view of the circuit board.
14 shows a solder for showing a connection between a terminal and a support.
15 is a cross-sectional view of a pad portion of the circuit board.
FIG. 16 is a cross-sectional view taken in the AB direction of the lens driving device shown in FIG. 2 .
17A shows the connection between the circuit board and the terminal by soldering.
17B illustrates a coupling between a pad part and a terminal of a circuit board according to an embodiment.
18 is an exploded perspective view of a camera module according to an embodiment.
19 is a perspective view of a portable terminal according to an embodiment.
FIG. 20 is a block diagram of the portable terminal shown in FIG. 19 .

Hereinafter, embodiments of the present invention that can specifically realize the above object will be described with reference to the accompanying drawings.

In the description of the embodiment, in the case where it is described as being formed on "on or under" of each element, the upper (upper) or lower (on or under) The two elements are in direct contact with each other or one or more other elements are disposed between the two elements indirectly. In addition, when expressed as "up (up) or down (on or under)", it may include the meaning of not only an upward direction but also a downward direction based on one element.

Also, as used hereinafter, relational terms such as “first” and “second”, “upper/upper/above” and “lower/lower/below” refer to any physical or logical relationship or order between such entities or elements. may be used only to distinguish one entity or element from another, without necessarily requiring or implying that Also, like reference numerals refer to like elements throughout the description of the drawings.

In addition, terms such as "include", "compose", or "have" described above mean that the corresponding component may be embedded unless otherwise stated, so other components are excluded. Rather, it should be construed as being able to include other components further. Also, terms such as “corresponding” described above may include at least one of “opposite” or “overlapping” meanings.

For convenience of description, the lens driving apparatus according to the embodiment is described using a Cartesian coordinate system (x, y, z), but may be described using other coordinate systems, and the embodiment is not limited thereto. In each drawing, the x-axis and the y-axis mean a direction perpendicular to the z-axis, which is the optical axis direction, the optical axis or the z-axis direction parallel to the optical axis is called the 'first direction', and the x-axis direction is the 'second direction' ', and the y-axis direction may be referred to as a 'third direction'.

A 'shake correction device' applied to a small camera module of a mobile device such as a smartphone or tablet PC is a device that prevents the outline of the captured image from being clearly formed due to the vibration caused by the user's hand shake when shooting a still image. It may mean a device configured to be able to

In addition, the 'auto-focusing device' is a device for automatically focusing an image of a subject onto an image sensor surface. Such an image stabilization device and auto-focusing device may be configured in various ways. In the lens driving device according to an embodiment, the optical module composed of at least one lens moves in a first direction parallel to the optical axis, or in the first direction A handshake correction operation and/or an auto-focusing operation may be performed by moving with respect to a surface formed by the second and third directions perpendicular to the .

1 is an exploded view of the lens driving apparatus 100 according to the embodiment, and FIG. 2 is a coupling view of the lens driving apparatus 100 except for the cover member 300 .

1 and 2 , the lens driving device 100 includes a bobbin 110 , a first coil 120 , a magnet 130 , a housing 140 , a first elastic part 150 , and a second elastic part. It may include a unit 160 .

Also, the lens driving device 100 may further include a support 220 and a base 210 .

In addition, the lens driving apparatus 100 may further include a second coil 230 for driving an Optical Image Stabilizer (OIS), and may further include a position sensor 240 for driving an OIS feedback.

Also, the lens driving device 100 may further include a cover member 300 .

The cover member 300 will be described.

The cover member 300 accommodates the other components 110 , 120 , 130 , 140 , 150 , 160 , 220 , 230 , and 250 in an accommodating space formed together with the base 210 .

The cover member 300 has an open lower portion and may be in the form of a box including an upper plate and side plates, and the lower portion of the cover member 300 may be coupled to the base 210 . The shape of the upper plate of the cover member 300 may be a polygon, for example, a square or an octagon.

The cover member 300 may have an opening in the upper plate for exposing a lens (not shown) coupled to the bobbin 110 to external light. The material of the cover member 300 may be a non-magnetic material such as SUS to prevent sticking to the magnet 130 , but it is formed of a magnetic material and electromagnetic force due to the interaction between the first coil 120 and the magnet 130 . It can also function as a yoke to increase the

Next, the bobbin 110 will be described.

The bobbin 110 may be equipped with a lens or a lens barrel, and is disposed in the housing 140 . The bobbin 110 may have a structure having an opening for mounting a lens or a lens barrel. The shape of the opening may be a circle, an ellipse, or a polygon, but is not limited thereto.

3 is a perspective view of the bobbin 110 .

Referring to FIG. 3 , the bobbin 110 may include a plurality of side portions (eg, 110b-1 and 110b-2).

For example, the bobbin 110 may include first side portions 110b - 1 corresponding to or opposite to the magnet and second side portions 110b - 2 disposed between the first sides.

For example, the length in the transverse direction of the side surface of the first side part 110b-2 of the bobbin 110 may be longer than the length in the transverse direction of the side surface of the second side part 110b-2, but is not limited thereto. may be the same.

The bobbin 110 may include a first stopper 114 protruding from the upper surface in the first direction. When the first stopper 114 of the bobbin 110 moves in the first direction for the auto-focusing function, even if the bobbin 110 moves beyond a prescribed range due to an external impact, etc., the bobbin 110 The upper surface of the cover member 300 may serve to prevent a direct collision with the inner side of the upper plate.

The bobbin 110 may include at least one protrusion 25 protruding from a side surface (or an outer surface) of the second side portion 110b - 2 . For example, the bobbin 110 may have four protrusions 25 provided on the four second side portions 110b - 2 , but is not limited thereto. In another embodiment, the bobbin 110 may include two protrusions disposed on the two second side portions 110b - 2 facing each other.

The protrusion 25 of the bobbin 110 corresponds to the groove portion 145 of the housing 140 , and may be inserted or disposed in the groove portion 145 of the housing 140 , and the bobbin 110 is constant about the optical axis. Rotation beyond the range can be suppressed or prevented.

The bobbin 110 may include a second stopper (not shown) protruding from a lower surface thereof, and the second stopper may cause the bobbin 110 due to an external impact or the like when the bobbin 110 moves in the first direction for the auto-focusing function. ) may serve to prevent the lower surface of the bobbin 110 from directly colliding with the base 210 , the second coil 230 , or the circuit board 250 , even if it moves beyond the prescribed range.

The bobbin 110 may have at least one seating groove 16 on its side surface for disposing or installing the first coil 120 . For example, the seating groove 16 may be provided in the first side portions 110b-1 and the second side portions 110b-2 of the bobbin 110, but is not limited thereto.

The shape and number of the seating grooves 16 of the bobbin 110 may correspond to the shape and number of the first coils 120 disposed on the sides of the bobbin 110 .

In addition, the bobbin 110 may be provided on at least one of the first and second side portions 110b-1 and 110b-2, and may include a first groove 12a and a second groove 12b that are spaced apart from each other. have.

For example, the first groove 12a may be provided in any one of the two first side portions 110b-1 of the bobbin 110 facing each other, and the second groove 12b may be provided in the bobbin 110 facing each other. ) may be provided on the other of the two first side portions 110b-1.

The first groove 12a and the second groove 12b of the bobbin 110 may be located above or above the first coil 120 disposed on the bobbin 110 , and may be connected to the mounting groove 16 . .

A first portion extending from one end of the first coil 120 disposed on the side of the bobbin 110 may be disposed in the first groove 12a, and the first coil 120 disposed on the side of the bobbin 110 . ), a second portion extending from the other end may be disposed in the second groove 12b.

In this case, the first portion of the first coil 120 may extend to the upper surface of the bobbin 110 in order to be connected to the first outer frame 151 of the first upper spring 150-1, and the first coil 120 ) may extend to the upper surface of the bobbin 110 in order to be connected to the second outer frame 151 of the second upper spring 150-2.

In the embodiment, the first coil 120 extends to the upper surface of the bobbin 110 for electrical connection with the two upper springs, but is not limited thereto. In another embodiment, the first and second grooves described above may be located under the coil 120 , and the first and second portions of the coil may extend to the lower surface of the bobbin 110 , and the two lower portions It may be electrically connected to the springs.

In another embodiment, the bobbin 110 may not include the mounting groove 16 , and the first coil 120 may be directly wound and fixed to the sides of the bobbin 110 .

In addition, a first upper protrusion 113 coupled to the hole 151a of the first inner frame 151 of the first elastic part 150 may be provided on the upper surface of the bobbin 110 .

The bobbin 110 may have a first lower protrusion (not shown) coupled to and fixed to the hole 161a of the second elastic part 160 on its lower surface.

A screw thread for coupling with a lens or a lens barrel may be provided on the inner surface of the bobbin 110 . A thread may be formed on the inner surface of the bobbin 110 in a state in which the bobbin 110 is fixed by a jig or the like, and a groove 15 for fixing the jig may be provided on the upper surface of the bobbin 110. have. For example, the groove 15 for fixing the jig may be provided on the upper surface of the two protrusions 25 facing each other, but is not limited thereto.

Next, the first coil 120 will be described.

The first coil 120 may be a driving coil disposed on the outer surface of the bobbin 110 and electromagnetically interacting with the magnet 130 disposed on the housing 140 .

A driving signal (eg, a driving current or voltage) may be applied to the first coil 120 to generate an electromagnetic force by interaction with the magnet 130 .

The driving signal applied to the first coil 120 may be a DC signal. For example, the driving signal may be in the form of current or voltage.

Alternatively, the driving signal applied to the first coil 120 may include a DC signal and/or an AC signal. For example, the AC signal may be a sine wave signal or a pulse signal (eg, a pulse width modulation (PWM) signal).

The AF movable part may move in a first direction, for example, in an upward direction (+Z-axis direction) or a downward direction (-Z-axis direction) by electromagnetic force due to the interaction between the first coil 120 and the magnet 130 . The intensity and/or polarity of the driving signal applied to the first coil 120 (eg, the direction in which current flows) is controlled to the intensity and/or the electromagnetic force due to the interaction between the first coil 120 and the magnet 130 . By adjusting the direction, it is possible to control the movement of the AF movable unit in the first direction, thereby performing the auto-focusing function.

The AF movable part may include a bobbin 110 elastically supported by the first elastic part 150 and the second elastic part 160 , and components mounted on the bobbin 110 to move together with the bobbin 110 . . For example, the AF movable unit may include a bobbin 110 and a first coil 120 . Also, for example, the AF movable unit may further include a lens (not shown) mounted on the bobbin 110 .

The first coil 120 may be disposed on the bobbin 110 to have a closed loop shape. For example, the first coil 120 may be wound around the optical axis in a clockwise or counterclockwise direction on the side of the bobbin 110 . It may be wound or disposed on the outer surface of the (110b-1, 110b-2).

In another embodiment, the first coil 120 may be implemented in the form of a coil ring wound or disposed in a clockwise or counterclockwise direction about an axis perpendicular to the optical axis OA, and the number of coil rings is the magnet 130 . may be the same as the number of , but is not limited thereto.

The first coil 120 may be electrically connected to at least one of the first elastic part 150 and the second elastic part 160 , the first elastic part 150 or the second elastic part 160 , and the support part. It may be electrically connected to the circuit board 250 through 220 .

For example, the first coil 120 may be connected to the first inner frame 151 of the second and fourth upper springs 150-2 and 150-4 by a conductive adhesive member such as solder, and the second and fourth The fourth supporting parts 220 - 2 and 220 - 4 may be electrically connected to the circuit board 250 .

Next, the housing 140 will be described.

The housing 140 accommodates the bobbin 110 on which the first coil 120 is mounted or disposed therein.

4 is a perspective view of the housing 140 , and FIG. 5 is a first elastic part 150 , a second elastic part 150 , a support part 220 , a second coil 230 , a circuit board 250 , and a base. A perspective view of 250 is shown.

4 and 5 , the housing 140 may have an opening pillar shape as a whole, and may include a plurality of side portions forming an opening.

For example, the housing 140 may include side portions 141-1 to 141-4 that are spaced apart from each other and corner portions 142-1 to 142-4 that are spaced apart from each other.

For example, the housing 140 may include a first side 141-1, a second side 141-2, a third side 141-3, a fourth side 141-4, and a first side 141-1. ) and a first corner portion 142-1 located between the second side portion 141-2, a second corner portion located between the second side portion 141-2 and the third side portion 141-3 ( 142-2), the third corner portion 142-3 positioned between the third side portion 141-3 and the fourth side portion 141-4, the fourth side portion 141-4 and the first side portion 141 -1) may include a fourth corner portion 142-4 positioned between.

The side portions 141-1 to 141-4 of the housing 140 may correspond to the first side portions 110b-1 of the bobbin 110 , and the corner portions 142-1 to 142- of the housing 140 . 4) may correspond to the second side portions 110b - 2 of the bobbin 110 , but is not limited thereto.

A magnet 130 (130-1 to 130-4) may be disposed or installed on at least one of the side parts 141-1 to 141-4 of the housing 140, and the corner parts 142- of the housing 140 1 to 142-4), the support parts 220 (220-1 to 220-4) may be disposed.

The housing 140 may include a seating portion 141a provided on inner surfaces of the side portions 141-1 to 141-4 to support or receive the magnets 130-1 to 130-4.

In the side portions 141-1 to 141-4 of the housing 140, a groove for injecting an adhesive for attaching the magnets 130-1 to 130-4 to the seating portion 141a of the housing 140, or A hole 63 may be provided. For example, the hole 63 may be a through hole.

The side portions 141-1 to 141-4 of the housing 140 may be disposed parallel to the side plates of the cover member 300 . A hole 147a through which the support 220 passes may be provided in the corner portions 142-1 to 142-4 of the housing 140 .

For example, in order to easily apply the damper, the diameter of the hole 147a may be gradually increased from the lower surface to the upper surface of the housing 140, but is not limited thereto. In another embodiment, the hole 147a has a diameter This may be constant.

In addition, in order to prevent direct collision with the inner surface of the cover member 300 , a stopper 144 may be provided on the upper surface of the housing 140 . For example, the stopper 144 may have a structure protruding upward from the top surface of at least one of the side portions 141-1 to 141-4 of the housing 140, but is not limited thereto. In another embodiment, the stopper of the housing 140 may be disposed on at least one of the corner portions.

In addition, when the first elastic part 150 is disposed on the upper surface of the housing 140 , it guides the installation position of the first outer frame 152 of the first elastic part 150 , and directly on the inner surface of the cover member 300 . In order to prevent collision, the housing 140 may include a second guide part 146 on its upper surface.

The housing 140 is provided on the upper surface of at least one of the corner parts 142-1 to 142-4 for coupling with the holes 152a and 152b of the first outer frame 152 of the first elastic part 150. At least one second upper protrusion 143 may be provided.

The second upper protrusion 143 may be disposed on at least one of one side and the other side of the second guide part 146 of the housing 140 .

In addition, the housing 140 has side parts 141-1 to 142-4 and/or corner parts 142 for coupling and fixing with the hole 162a of the second outer frame 162 of the second elastic part 160 . -1 to 142-4)) may include at least one second lower protrusion (not shown) provided on the lower surface.

The housing 140 is provided under the corner parts 142-1 to 142-4 not only to secure a path through which the support 220 passes, but also to secure a space for filling silicon that can serve as a damping unit. It may be provided with a groove (142a) that is. For example, damping silicon may be filled in the recess 142a of the housing 140 .

The housing 140 may include a stopper 149 provided on an outer surface of at least one of the side portions 141-1 to 141-4. The stopper 149 is a side plate of the cover member 300 when the housing 140 moves in the second direction and/or the third direction, the outer surfaces of the side portions 141-1 to 141-4 of the housing 140 are This is to prevent direct collision with the inner surface of

In order to prevent the bottom surface of the housing 140 from colliding with the base 210 , the second coil 230 , and/or the circuit board 250 to be described later, the housing 140 has a stopper (not shown) protruding from the bottom surface. ) may be further provided.

The housing 140 may include a groove portion 145 provided on inner surfaces of the corner portions 142-1 to 142-4 corresponding to the protrusion 25 of the bobbin 110 .

Next, the magnet 130 will be described.

In the initial position of the bobbin 110 , the magnet 130 is disposed on the sides of the housing 140 so that at least a portion overlaps with the first coil 120 in a direction perpendicular to the optical axis OA or in a second direction or a third direction. (141-1 to 141-4). For example, the magnet 130 may be inserted or disposed in the seating portion 141a of the housing 140 .

Here, the initial position of the bobbin 110 is the initial position of the AF movable part (eg, bobbin) in a state where no power or driving signal is applied to the first coil 120 , and the first elastic part 150 and the second elastic part As the part 160 is elastically deformed only by the weight of the AF movable part, it may be a position where the AF movable part is placed.

In addition, the initial position of the bobbin 110 is a position where the AF movable part is placed when gravity acts in the direction from the bobbin 110 to the base 210 or, conversely, when gravity acts in the direction from the base 210 to the bobbin 110 . can be

In another embodiment, the magnet 130 may be disposed on the outer surface of the side portions 141-1 to 141-4 of the housing 140 . Alternatively, in another embodiment, the magnet 130 may be disposed on the inner surface or the outer surface of the corner portions 142-1 to 142-4 of the housing 140 .

The shape of the magnet 130 may be a rectangular parallelepiped shape corresponding to the side portions 141-1 to 141-4 of the housing 140, but is not limited thereto, and the surface facing the first coil 120 may be formed to correspond to or coincide with the curvature of the corresponding surface of the first coil 120 .

The magnet 130 may be a single-pole magnetizing magnet disposed so that a first surface facing the first coil 120 is an N pole, and a second surface opposite to the first surface is an S pole. However, the present invention is not limited thereto, and it is also possible to configure the polarities to be reversed. Alternatively, in another embodiment, each of the first and second surfaces of the magnet 130 may be divided into an N pole and an S pole.

Alternatively, in another embodiment, the magnet 130 may be a bipolar magnetizing magnet divided into two in a direction perpendicular to the optical axis. In this case, the magnet 130 may be implemented with ferrite, alnico, a rare earth magnet, or the like.

For example, the magnet 130 may include a first magnet part, a second magnet part, and a non-magnetic barrier rib. The first magnet part and the second magnet part may be spaced apart from each other, and the non-magnetic partition wall may be positioned between the first magnet part and the second magnet part.

The non-magnetic barrier rib may include a section having little polarity as a portion having substantially no magnetism, and may be filled with air or made of a non-magnetic material.

In the embodiment, the number of magnets 130 is four, but is not limited thereto, and the number of magnets 130 may be at least two or more, and the first surface of the magnet 130 facing the first coil 120 . may be a flat surface, but is not limited thereto, and may be a curved surface.

At least two or more magnets 130 may be disposed on sides of the housing 140 facing each other, and may be disposed to face each other.

A plane of each of the magnets 130-1 to 130-4 may have a substantially rectangular shape, or, alternatively, a triangular shape or a rhombus shape.

In another embodiment, the housing 140 may be omitted, and the magnets 130 - 1 to 130 - 4 may be disposed on the cover member 300 . In another embodiment, the housing 140 is not omitted, and the magnets 130 - 1 to 130 - 4 may be disposed on the cover member 300 .

Alternatively, in another embodiment, the magnets 130 - 1 to 130 - 4 may be disposed on inner surfaces of the side plates of the cover member 300 .

Next, the first elastic part 150 , the second elastic part 160 , and the support part 220 will be described.

The first elastic part 150 and the second elastic part 160 are coupled to the bobbin 110 and the housing 140 , and support the bobbin 110 .

The first elastic part 150 is disposed on or on the upper surface of the bobbin 110 and may be an upper elastic body.

The second elastic part 160 is disposed on the lower or lower surface of the bobbin 110 and may be a lower elastic body.

For example, the first elastic part 150 may be combined with the upper part, the upper surface, or the upper end of the bobbin 110 and the upper part, the upper surface, or the upper part of the housing 140 , and the second elastic part 160 may be the bobbin 110 . ) may be combined with the lower, lower, or lower end and the lower, lower, or lower end of the housing 140 .

The support part 220 may support the housing 140 with respect to the base 210 , and may electrically connect at least one of the first elastic part 150 or the second elastic part 160 to the circuit board 250 . have.

At least one of the first elastic part 150 and the second elastic part 160 may be divided or separated into two or more.

For example, the first elastic part 150 may include first to fourth upper springs 150-1 to 150-4 spaced apart or separated from each other.

The first elastic part 150 and the second elastic part 160 may be implemented as a leaf spring, but is not limited thereto, and may be implemented as a coil spring, a suspension wire, or the like.

Each of the first to fourth upper springs 150-1 to 150-4 is a first inner frame 151 coupled to an upper portion, an upper surface, or an upper end of the bobbin 110, an upper portion, an upper surface of the housing 140, Alternatively, it may include a first outer frame 152 coupled to the upper end, and a first frame connecting portion 153 connecting the first inner frame 151 and the first outer frame 152 .

The first inner frame 151 may be provided with a hole 151a through which the first upper protrusion 113 of the bobbin 110 is coupled, and the hole 151a is formed of at least one hole through which an adhesive member or a damper permeates. It may have an incision.

The first outer frame 152 of each of the first to fourth upper springs 150-1 to 150-4 includes a first coupling part 510 coupled to the support parts 220-1 to 220-6, a housing ( A second coupling portion 520 coupled to at least one of the corner portions 141-1 to 141-4 and/or adjacent sides thereof of 140, and a first coupling portion 510 and a second coupling portion ( It may include a connector 530 for connecting the 520 .

The second coupling part 520 may include at least one coupling area coupled to the corner parts 142-1 to 142-4 (eg, the second upper protrusion 143 ) of the housing 140 . For example, the at least one coupling region may include a hole 152a.

For example, the second coupling part 520 may include a first coupling area positioned on one side of the second guide part 146 of the housing 140 and a second coupling area positioned on the other side of the second guide part 146 . may include, but is not limited thereto.

Each of the coupling regions of the second coupling portion 520 of the first to fourth upper springs 150-1 to 150-4 is implemented to include a hole, but is not limited thereto, and in another embodiment, the coupling region They may be implemented in various forms sufficient to couple with the housing 140 , for example, in the form of a groove.

For example, the hole 152a of the second coupling part 520 may have at least one cutout between the second upper protrusion 143 and the hole 152a through which an adhesive member or a damper may permeate.

The first coupling part 510 may have a hole through which the supporting parts 220-1 to 220-4 pass. One end of the supporting parts 220-1 to 220-5 passing through the hole of the first coupling part 510 may be coupled to the first coupling part 510 by a conductive adhesive member or solder 910, and the first The coupling part 510 and the supporting parts 220-1 to 220-4 may be electrically connected.

The first coupling part 510 is a region where the solder 910 is disposed, and may include a hole and a region around the hole.

The connection part 530 may connect the coupling region of the second coupling part 520 disposed in the corner parts 142-1 to 142-4 and the first coupling part 510 .

For example, the connection part 530 is a first coupling part connecting the first coupling area and the first coupling part 510 of the second coupling part 520 of each of the first to fourth upper springs 150-1 to 150-4. It may include a first connection part 530-1, and a second connection part 530-2 connecting the second coupling region of the second coupling part 520 and the first coupling part 510.

The connecting part 530 may include a bent part bent at least once or a curved part bent at least once, but is not limited thereto, and may have a straight shape in another embodiment.

The width of the connection part 530 may be narrower than the width of the second coupling part 520 , so that the connection part 530 may be easily moved in the first direction, thereby applying to the first elastic part 150 . The applied stress and the stress applied to the support unit 220 may be dispersed.

In addition, in order to support the housing 140 in a balanced manner so as not to be biased toward either side, the connection part 530 may be symmetrical with respect to the reference line, but is not limited thereto, and may not be symmetrical in other embodiments.

For example, one end of the first coil 120 is coupled to the first inner frame 151 of the second upper spring 151-2 by soldering, and the first inner frame ( The other end of the first coil 120 may be coupled to 151 .

The second elastic part 160 includes a second inner frame 161 coupled to the lower, lower, or lower end of the bobbin 110 , and a second outer frame 162 coupled to the lower, lower, or lower end of the housing 140 . ), and a second frame connection part 163 connecting the second inner frame 161 and the second outer frame 162 .

In addition, the second elastic part 160 is disposed on the second inner frame 161, a hole 161a coupled to the first lower protrusion of the bobbin 110 by solder or a conductive adhesive member, and a second outer frame 162 . ) and may have a hole 162a coupled to the second lower protrusion of the housing 140 .

Each of the first and second frame connection parts 153 and 163 of the upper and second elastic parts 150 and 160 may be bent or curved (or curved) at least once to form a pattern of a predetermined shape. . The bobbin 110 may be elastically (or elastically) supported by the rising and/or lowering operation in the first direction through a change in the position of the first and second frame connection parts 153 and 163 and micro-deformation.

In order to absorb and buffer the vibration of the bobbin 110 , the lens driving device 100 includes a first damper (not shown) disposed between each of the upper springs 150 - 1 to 150 - 4 and the housing 140 . more can be provided.

For example, the lens driving device 100 includes a first damper (not shown) disposed in a space between the first frame connection part 153 of each of the upper springs 150 - 1 to 150 - 4 and the housing 140 . can do.

Also, for example, the lens driving device 100 may further include a second damper (not shown) disposed between the second frame connection part 163 of the second elastic part 160 and the housing 140 .

Also, for example, the lens driving device 100 may further include a third damper (not shown) disposed between the support 220 and the hole 147a of the housing 140 .

Also, for example, the lens driving device 100 may further include a fourth damper (not shown) disposed at one end of the first coupling part 510 and the support part 220 .

Also, for example, a damper (not shown) may be further disposed between the inner surface of the housing 140 and the outer peripheral surface of the bobbin 110 .

Next, the support 220 will be described.

One end of the support part 220 may be coupled to the first outer frame 151 of the first elastic part 150 by solder or a conductive adhesive member.

There may be a plurality of support parts 220 , and each of the plurality of support parts 220 - 1 to 220 - 6 is formed of a corresponding one of the upper springs 150 - 1 to 150 - 4 through solder 901 . It may be coupled to the first coupling part 510 , and may be electrically connected to the first coupling part 510 . For example, each of the plurality of support parts 220-1 to 220-4 may be disposed on a corresponding one of the four corner parts 142-1 to 142-4.

The plurality of support parts 220-1 to 220-4 may support the bobbin 110 and the housing 140 so that the bobbin 110 and the housing 140 are movable in a direction perpendicular to the first direction. In FIG. 5 , one support part is disposed at each of the corner parts 142-1 to 142-4 of the housing 140 , but the present invention is not limited thereto.

In another embodiment, two or more supporting parts may be disposed at any one corner of the housing 140 .

Each of the plurality of support parts 220-1 to 220-4 may be spaced apart from the housing 140, and is not fixed to the housing 140, but is a first of each of the upper springs 150-1 to 150-4. It may be directly connected to the first coupling part 510 of the first outer frame 152 .

In another embodiment, the support 220 may be disposed in the form of a leaf spring on the side portions 141-1 to 141-4 of the housing 140 .

A driving signal may be transmitted from the circuit board 250 to the first coil 120 through the plurality of supports 220 - 1 to 220 - 4 and upper springs 150 - 1 to 150 - 4 .

For example, the first coil 120 from the circuit board 250 through the second and fourth upper springs 150 - 2 and 150 - 4 and the second and fourth supports 220 - 2 and 220 - 4 . A driving signal may be provided.

The plurality of support parts 220-1 to 220-4 may be formed as a member separate from the first elastic part 150, and may be supported by an elastic member, for example, a leaf spring or a coil. It may be implemented as a spring (coil spring), suspension wire, or the like. Also, in another embodiment, the support parts 220 - 1 to 220 - 4 may be integrally formed with the first elastic part 150 .

Next, the base 210 , the circuit board 250 , the second coil 230 , and the position sensor 240 will be described.

The base 210 may have an opening corresponding to an opening of the bobbin 110 and/or an opening of the housing 140 , and may have a shape that coincides with or corresponds to the cover member 300 , for example, a rectangular shape. .

6 is a perspective view of the second coil 230 , the circuit board 250 , and the supports 220 - 1 to 220 - 4 , and FIG. 7 is the circuit board 250 and the second circuit board 250 disposed on the base 210 . An exploded perspective view of the coil 230 , FIG. 8 is a partially enlarged view of the base 210 and the circuit board 250 shown in FIG. 7 , and FIG. 9 is a circuit member 231 including the second coil 230 . 10A is an exploded perspective view of the base 210, the position sensor 240, and the terminals 81a to 81d, FIG. 10B is a bottom view of the base 210, and FIG. 10C is the base It is a combined perspective view of 210 and the terminals 81a to 81d.

6 to 10C , the base 210 may include a step 211 to which an adhesive may be applied when the cover member 300 is adhesively fixed. In this case, the step 211 may guide the cover member 300 coupled to the upper side, and may face the lower end of the side plate of the cover member 300 .

The base 210 may be disposed under the bobbin 110 and the housing 140 , and a support groove or support part 255 is provided on the side facing the portion where the terminal 251 is formed of the circuit board 250 (see FIG. 10A ). ) can be formed. The support part 255 of the base 210 may support the terminal surface 253 of the circuit board 250 .

Seating grooves 215 - 1 and 215 - 2 in which the position sensor 240 mounted on the circuit board 250 may be disposed or seated may be provided on the upper surface of the base 210 . According to an embodiment, the base 210 may be provided with two seating grooves 215-1 and 215-2.

Based on the circuit board 250 , the second coil 230 may be disposed on the upper portion and the base 210 may be disposed on the lower portion of the circuit board 250 .

For example, the position sensor 240 may be mounted on the lower surface of the circuit board 250 , and the lower surface of the circuit board 250 may be a surface facing the upper surface of the base 210 .

The circuit board 250 is located under the housing 140 , and may be disposed on the upper surface of the base 210 , the opening of the bobbin 110 , the opening of the housing 140 , or/and the opening of the base 210 . It may be provided with an opening corresponding to the.

The shape of the outer peripheral surface of the circuit board 250 may match or correspond to the upper surface of the base 210 , for example, a rectangular shape.

The circuit board 250 may be bent from an upper surface and include at least one terminal surface 253 provided with a plurality of terminals 251 or pins for electrical connection to the outside.

A plurality of terminals 251 may be installed on the terminal surface 253 of the circuit board 250 . For example, a driving signal for driving the first coil 120 , the second coil 230 , and the position sensor 240 through the plurality of terminals 251 installed on the terminal surface 253 of the circuit board 250 . can receive

According to an embodiment, the circuit board 250 may be provided as an FPCB, but is not limited thereto.

The circuit board 250 may include a hole 250a through which the supports 220 - 1 to 220 - 4 pass. The hole 250a may be disposed adjacent to corners of the circuit board 250 .

The position and number of the holes 250a may correspond to or coincide with the position and number of the supporting parts 220 - 1 to 220 - 4 .

Each of the supports 220 - 1 to 220 - 4 passes through a corresponding one of the holes 250a of the circuit board 250 , and may be disposed to be spaced apart from the inner surface of the corresponding hole 250a. In FIG. 7 , the hole 250a is exemplified as for the support parts 220-1 to 220-4 to pass through, but the present invention is not limited thereto. In another embodiment, the circuit board 250 includes the support parts 220-1 to 220- 4) may be provided with an opening of a sufficient shape to pass through, or an escape groove, and the like.

The second coil 230 may be disposed under the housing 140 and disposed on the circuit board 250 to correspond to the magnet 130 disposed on the housing 140 .

For example, the second coil 230 may include four OIS coils 230-1 to 230-4 disposed to correspond to each of the four sides of the circuit board 250, but is not limited thereto. , one for the second direction, one for the third direction, etc. It is also possible to install only two, or four or more may be installed.

In FIG. 7 , the second coil 230 is implemented in a form provided in a circuit member 231 separate from the circuit board 250 , but is not limited thereto. In another embodiment, the second coil 230 is a circuit board It may be implemented in the form of a circuit pattern formed at 250 .

Alternatively, in another embodiment, the circuit member 231 may be omitted, and the second coil 230 may be implemented in the form of a ring-shaped coil block separately from the circuit board 250 , or may be implemented in the form of an FP coil. .

The circuit board 250 and the circuit member 231 are represented as separate components, but are not limited thereto, and in another embodiment, the circuit board 250 , the circuit member 231 , and the second coil 230 . ) may be expressed as a "circuit member" for a configuration including at least one of.

An escape groove 230a may be provided at an edge of the circuit member 231 in which the second coil 230 is provided, and the escape groove 230a may have a shape in which an edge portion of the circuit member 231 is chamfered. Also, in another embodiment, a hole through which the support unit 220 can pass may be provided at a corner portion of the circuit member 231 .

As described above, the housing 140 may move in the second and/or third direction due to the interaction between the corresponding magnets 130 and the second coil 230, and thus handshake correction may be performed. .

The position sensor 240 may detect the strength of the magnetic field of the magnet 130 disposed in the housing 140 as the housing 140 moves in a direction perpendicular to the optical axis, and an output signal (eg, , output voltage) can be output.

Based on the output signal of the position sensor 240 , the displacement of the housing 140 with respect to the base 210 in a direction (eg, X-axis or Y-axis) perpendicular to the optical axis (eg, Z-axis) may be detected. .

The position sensor 240 is for two OIS in order to detect the displacement of the housing 140 in a second direction (eg, X-axis) perpendicular to the optical axis, and in a third direction (eg, Y-axis) perpendicular to the optical axis. It may include position sensors 240a and 240b.

For example, the OIS position sensor 240a may detect the strength of the magnetic field of the magnet 130 according to the movement of the housing 140 and output a first output signal according to the sensed result, and the OIS position sensor ( 240b) may sense the strength of the magnetic field of the magnet 130 according to the movement of the housing 140 and output a second output signal according to the sensed result. The controller 830 of the camera module or the controller 780 of the portable terminal 200A may detect the displacement of the housing 140 based on the first output signal and the second output signal, and the detected displacement of the housing 140 may be OIS feedback driving may be performed based on the displacement.

Each of the position sensors 240a and 240b for OIS may be provided as a Hall sensor, and any sensor capable of detecting a magnetic field strength may be used. For example, each of the position sensors 240 for OIS may be implemented in the form of a driver including a Hall sensor, or may be implemented as a single position detection sensor such as a Hall sensor.

Each of the position sensors 240a and 240b for OIS is mounted on the circuit board 250 , and the circuit board 250 may include terminals electrically connected to the position sensors 240a and 240b for OIS.

A protrusion 29 may be provided on an upper surface around the opening of the base 210 , into which the opening of the circuit board 250 and the opening of the circuit member 231 may be inserted.

In addition, a protrusion 29a (refer to FIG. 12 ) protruding in a direction perpendicular to the optical axis may be provided on the side surface of the protrusion 29 of the base 210 , and the opening of the circuit board 250 corresponds to the protrusion 29a. A groove 250b (refer to FIG. 13 ) may be provided. The protrusion 29a of the base 210 may be inserted into the groove 250b of the circuit board 250 , and the protrusion 29a of the base 210 and the groove 250b of the circuit board 250 are coupled to each other. Rotation or movement of the circuit board 250 on the upper surface of the base 210 may be suppressed.

Referring to FIG. 7 , the circuit board 250 may include a plurality of pad parts 41 to 44 disposed on the upper surface. Here, in the pad parts 41 to 44 of the circuit board 250 , the term "pad part" may be used instead of "bonding part, electrode part, lead part, or terminal part".

For example, each of the plurality of pad parts 41 to 44 may be positioned adjacent to a corresponding one of the holes 250a of the circuit board 250 .

Each of the plurality of pad parts 41 to 44 may be positioned lower than the top surface of the circuit board 250 . For example, a step d1 may exist in the optical axis direction between the top surface of the plurality of pad parts 41 to 44 and the top surface of the circuit board 250 . For example, the step d1 may be 35 mm to 40 mm. For example, the step d1 may be 37.5 mm.

The circuit board 250 may include an exposed region 14a exposing the plurality of pad parts 41 to 44 . The upper surface of the exposed area 14a may be positioned on the same plane as the upper surface of the pad part (eg, 41 ) exposed by the exposed area 14a.

For example, the upper surface of the exposed region 14a may be positioned lower than the upper surface of the circuit board 250 , and a step may exist in the optical axis direction between the upper surface of the exposed region 14a and the upper surface of the circuit board 250 .

The exposed region 14a of the circuit board 250 may be in contact with the grooves 71a to 71d of the circuit board 250, and may be exposed or opened to the side of the circuit board 250 or the grooves 71a to 71d. have. Since the exposed area 14a can be exposed or opened to the side of the circuit board 250 , the solder can easily permeate into the pad parts 41 to 44 of the circuit board 250 through the exposed area 14a during soldering. This can improve ductility.

The circuit board 250 may include a plurality of grooves 71a to 71d provided in side surfaces. The grooves 71a to 71d of the circuit board 250 are part of the terminals 81a to 81d mounted on the base 210, for example, a part (or exposed area) of the second coupling part 320 ( FIG. 11 ) ( 321) may be exposed.

The grooves 71a to 71d are in the form of via holes or concave grooves in which the side surface of the circuit board 250 is opened, but are not limited thereto. In another embodiment, the grooves 71a to 71d may be in the form of a through hole or a through via. In this case, the through hole or the through via may be spaced apart from the side surface of the circuit board 250 .

Referring to FIG. 9 , the circuit member 231 may include a plurality of pad parts 35a to 35d disposed on a lower surface corresponding to the plurality of pad parts 41 to 44 of the circuit board 250 . In the pad parts 35a to 35 of the circuit member 231 , the term "pad part" may be used instead of "bonding part, electrode part, lead part, or terminal part".

Each of the pad parts 35a to 35d of the circuit member 231 may be in contact with or adjacent to a corresponding one of the escape grooves 230a of the circuit member 231 .

Each of the pad parts 35a to 35d of the circuit member 231 may be positioned higher than the lower surface of the circuit member 231 . For example, a step d2 may exist between the lower surfaces of the plurality of pad parts 35a to 35d and the lower surface of the circuit member 231 in the optical axis direction. For example, the step d2 may be 35 mm to 40 mm. For example, the step d2 may be 37.5 mm.

A portion of each of the pad parts 35a to 35d of the circuit member may overlap a corresponding one of the plurality of pad parts 41 to 44 in the optical axis direction. The other part of the pad parts 41 to 44 of the circuit board 250 that does not overlap with the pad parts 35a to 35d of the circuit member 231 in the optical axis direction is formed by the escape groove 230a of the circuit member 231. can be exposed from This is to couple the pad parts 41 to 44 and the pad parts 35a to 35d through soldering.

The step d1 between the top surfaces of the pad parts 41 to 44 of the circuit board 250 and the top surface of the circuit board 250 and the pad parts 35a to 35d of the circuit member 231 and the circuit member 231 The spacing between the pad parts 41 to 44 of the circuit board 250 and the pad parts 35a to 35d of the circuit member 231 may increase due to the step d2 between the lower surfaces.

Accordingly, when soldering the pad parts 41 to 44 of the circuit board 250 and the pad parts 35a to 35d of the circuit member 231 , the pad parts 41 to 44 and the circuit member 231 of the circuit board 250 are soldered. ), solder can penetrate well between the pad parts 35a to 35d, and solderability can be improved.

Referring to FIG. 10A , the base 210 may include side portions 90a to 90d and corner portions 91a to 91d.

For example, the base 210 may be formed between the first side 90a, the second side 90b, the third side 90c, the fourth side 90d, and the first side 90a and the second side 90b. The first corner portion 91a, the second corner portion 91b between the second side portion 90b and the third side portion 90c, and the third corner portion between the third side portion 90c and the fourth side portion 90d 91c, and a fourth corner portion 91d between the fourth side portion 90d and the first side portion 90a.

The side portions 90a to 90d of the base 210 may correspond to or overlap the side portions 141-1 to 141-4 of the housing 140 in the optical axis direction, and the corner portions 91a to 141-4 of the base 210 . 91d) may correspond to or overlap the corner portions 142-1 to 142-4 of the housing 140 in the optical axis direction.

The corner portions 91a to 91d of the base 210 may be provided with holes 210a through which the support portions 220-1 to 220-1 pass.

For example, a hole 210a through which a corresponding one of the support parts 220-1 to 220-4 passes may be provided in each of the corner parts 91a to 91d of the base 210 . For example, the hole 210a may be a through hole passing through the corner portions 91a to 91d.

A stepped portion 26 for mounting or inserting the terminals 81a to 81d may be provided at each of the corner portions 91a to 91d of the base 210 . The stepped portion 26 may be in a shape recessed from the lower surface of the base 210 , and may be expressed as a “groove”.

The step portion 26 of the base 210 may be provided in the lower, lower, or lower surfaces of the corner portions 91a to each of the base 210 , and in the lower surface 21a of the base 210 , of the base 210 . It may have at least one step difference from the lower surface of the base 210 in the direction of the upper surface 21b.

The stepped portion 26 of the base 210 has a hole 210a for the support to pass through, and a hole 22a for exposing a portion of the terminals 81a to 81d to the upper surface 21b of the base 210 . can do.

For example, the stepped portion 26 of the base 210 may include a first surface 26a, a second surface 26b, a first side surface 27a, and a second side surface 27b.

For example, the first surface 26a of the step portion 26 has a lower surface and a first step T1 of the base 210 in the direction from the lower surface 21a of the base 210 to the upper surface 21b, and the base 210 ) may be parallel to the lower surface 26a.

For example, the second surface 26b of the step portion 26 has a lower surface and a second step T2 of the base 210 in a direction from the lower surface 21a of the base 210 to the upper surface 21b, and the base 210 ) may be parallel to the lower surface 26a.

For example, the second step T2 may be smaller than the first step T1 (T2<T1), and the second surface 26b of the stepped portion 26 is between the first surface 26a and the base 210 . It may be located between the lower surface 26a.

The first side surface 27a of the stepped portion 26 may connect the first surface 26a and the second surface 26b of the stepped portion 26, and a predetermined angle (eg, a right angle) with the first surface 26a. ) may be inclined as much as

The second side surface 27b of the stepped portion 26 connects the lower surface 26a of the base 210 and the second surface 26b of the stepped portion 26 and is at a constant angle with the second surface 26b (eg, It may be an inclined surface inclined as much as a right angle).

For example, the second surface 26b and the second side surface 27b of the stepped portion 26 may form a single groove, and the first surface 26a and the first side surface 27a of the stepped portion 26 may be formed. may form another groove shape.

The hole 210a of the base 210 may be disposed or located on the first surface 26a of the step 26 .

In addition, a protrusion 28 for coupling with the hole 311 of the terminals 81a to 81d may be provided on the first surface 26a of the base 210 . The protrusion 28 may protrude from the first surface 26a of the base 210 in a direction from the upper surface 21b to the lower surface 21a of the base 210 .

The coupling force between the terminals 81a to 81d and the base 210 may be improved by coupling the protrusions 28 of the base 210 and the holes 311 of the terminals 81a to 81d.

The base 210 may have a hole 22a disposed or positioned on the second surface 26b of the step portion 26 . The hole 22a may pass through the upper surface 21b of the base 210 and the second surface 26b of the stepped portion 26, and a portion of the terminals 81a to 81d passes through the hole 22a. It may be exposed or open from the upper surface 21b of the 210 .

Next, the terminals 81a to 81d) will be described.

The terminals 81a to 81d are disposed or mounted on a lower portion, a lower end, or a lower surface of the base 210 . The number of terminals may coincide with the number of supports, but is not limited thereto. The terminal terminals 81a to 81d may be expressed as a terminal member or a terminal unit.

For example, the embodiment may include first to fourth terminals 81a to 81d corresponding to the first to fourth support parts 220-1 to 220-4.

For example, the first to fourth terminals 81a to 81d may be disposed at four corners or four corners of the base 210 .

11 is a perspective view of the first terminal 81a and the first support portion 220-1.

The description of the first terminal 81a described in FIG. 11 may be equally applied to the remaining second to third terminals.

Referring to FIG. 11 , the first terminal 81a may include a first coupling part 310 and a second coupling part 320 . The first coupling part 310 may be expressed as a “first connector” or “a first part”, and the second coupling part 320 may be expressed as a “second connector” or a “second part”. may be

The second coupling part 320 may be disposed between the base 210 and the circuit board 250 , and the first coupling part 310 may be disposed lower than the second coupling part 320 .

For example, the second coupling part 320 may be located at a lower or the same height than the upper surface of the base 210 .

An upper surface of the second coupling part 320 may be exposed as an upper surface of the base 210 , and a lower surface of the first coupling part 310 may be exposed as a lower surface of the base 210 .

An area (eg, an area of an upper surface) of the first coupling part 310 may be larger than an area (eg, an area of an upper surface) of the second coupling part 320 .

For example, the length of the first coupling part 310 in the direction from the first corner part 91a to the second corner part 91b of the base 210 is from the first corner part 91a to the second corner part 91b. It may be longer than the length of the second coupling portion in the direction.

The first coupling part 310 may be located below the lower surface of the base 210 , and may be located above the first holder 600 and the second holder 800 of the camera module 200 (see FIG. 18 ). have.

The first terminal 81a may include a connection part 315 connecting the first coupling part 310 and the second coupling part 320 . The connection part 315 may be expressed as a “third connector” or a “third part”.

The connection part 315 may be bent or bent from the first coupling part 310 in a bent shape. The connection part 315 may be integrally formed with the first coupling part 310 and the second coupling part 320 , but is not limited thereto. In another embodiment, the connection part may be assembled to the base 210 in a configuration separate from the first coupling part 310 and the second coupling part 320 , and may be disposed on a side surface of the base 210 .

The first coupling portion 310 may include a hole 305 through which the support portion (eg, 220-1) passes and a hole 311 coupled to the protrusion 28 of the step portion 26 of the base 210 . have.

The hole 305 of the first coupling part 310 may be a through hole. The hole 305 of the first coupling part 310 may correspond to the hole 210a of the base 210, and the base 210 in the optical axis direction or in the direction from the lower surface 21a to the upper surface 21b of the base 210. ) may overlap the hole 210a.

One end of the support part (eg, 220-1) may be coupled to the first coupling part 510 of the first outer frame 151 of the upper spring (eg, 150-1).

In addition, the other end of the support part (eg, 220-1) passes through the hole 305 of the terminal (eg, 81a) and may be coupled to the lower surface of the first coupling part 310 by solder 902 (refer to FIG. 14 ). .

For example, the lens driving device 100 may further include a solder 902 for coupling the other end of the support part (eg, 220-1) passing through the hole 305 and the lower surface of the first coupling part 310 to each other. .

The hole 311 of the first coupling part 310 is coupled with the protrusion 28 of the base 210 to improve coupling force between the base 210 and the terminals 81a to 81d as well as the first coupling part 310 . It is possible to improve the solderability between the and the support.

The larger the area of the first coupling part 310 is, the better the heat is conducted to the periphery of the first coupling part 310 during soldering, so the support part (eg, 220-1) and the hole 305 of the first coupling part 310 Soldering between them may not be good. The hole 311 of the first coupling part 310 may improve solderability between the support part (eg, 220-1) and the hole 305 of the first coupling part 310 by suppressing the conduction of heat during such soldering. have.

The first coupling portion 310 may be disposed or located under the first surface 26a of the step portion 26 of the base 210 .

The second coupling part 320 may be connected to one end of the first coupling part 310 , and may be disposed or located under the second surface of the stepped part 26 of the base 210 .

A portion 321 of the second coupling portion 320 may be exposed to the upper surface 21b of the base 210 through the hole 22a of the step portion 26 . Hereinafter, a portion 321 of the second coupling part 320 is referred to as an exposed area 321 of the second coupling part 320 .

Also, the first terminal 81a may further include an extension part 330 extending from the other end of the first coupling part 310 .

The extension part 330 may be parallel to the first coupling part 310 , may be located on the same plane, and may be inserted into the base 210 .

The extension 330 may improve coupling force between the first terminal 81a and the base 210 .

For example, the first coupling part 310 , the second coupling part 320 , and the extension part 330 may be integrally formed. For example, the terminals 81a to 81d may have a structure inserted into the base 210 using an insert injection method.

For example, the terminals 81a to 81d may be insert-injected into the base 210 , and at least a portion of each of the first coupling part 310 and the second coupling part 320 may be inserted or disposed in the base 210 . have.

Also, for example, the terminals 81a to 81d may be insert-injected into the base 210 , and the connection part 315 may be disposed in the base.

In another embodiment, the terminal may be attached to or coupled to the lower surface or upper surface of the base 210 , rather than by insert injection with the base.

12 is a part of a perspective view in which the base 210, the first terminal 81a, and the circuit board 250 are coupled to each other, FIG. 13 is a bottom view of the circuit board 250, and FIG. 14 is the terminal 81a. to 81d) shows the solder 902 for showing the coupling of the support parts 220-1 to 220-4, FIG. 15 shows a cross-sectional view of the pad part 257 of the circuit board 250, FIG. 16 shows FIG. 2 is a cross-sectional view in the AB direction of the lens driving device 100 .

12 to 16 , the circuit board 250 may be disposed on the upper surface of the base 210 , and each of the grooves 71a to 71d of the circuit board 250 is formed on the upper surface 21b of the base 210 . ) may expose a corresponding one of the second coupling portions 320 of the terminals 81a to 81d exposed from the .

Also, as shown in FIGS. 6 and 7 , each of the grooves 230a of the circuit member 231 is one of the second coupling parts 320 of the terminals 81a to 81d exposed to the upper surface of the base 210 . Any one of the corresponding upper surfaces may be exposed.

The circuit board 250 may include upper, lower, and pad portions 257 disposed on side surfaces between the upper and lower portions.

The number of pad parts 257 may be plural, and may be disposed corresponding to the terminals 81a to 81d or disposed at positions corresponding to the terminals 81a to 81d. For example, the four pad portions 247 corresponding to the terminals 81a to 81d may be disposed at four corners or corner portions of the circuit board 250 , but the present invention is not limited thereto.

In another embodiment, the pad portion may be disposed only at two corners or corner portions of the circuit board 250 , and the two terminals 251 of the circuit board 250 and the two terminals 251 of the circuit board 250 are electrically connected to provide a driving signal to the first coil. can be connected to For example, the two corners at which the pad part is disposed may be diagonal corners of the circuit board or two corners in contact with one side.

In another embodiment, four pad parts may be disposed at four corners or corner parts of the circuit board 250 , and the pad parts disposed at two corners may be soldered to terminals (eg, 81a and 81b). and may be electrically connected to the two terminals 251 of the circuit board 250, but the pad parts disposed at the remaining two corners are soldered to the terminals (eg, 81a and 81b), but the circuit It may not be electrically connected to the terminals 251 of the substrate 250 . This is to prevent problems such as mechanical tilt of the lens driving device by soldering to the terminals of the four pad parts.

The pad part 257 may be an Au plating layer or a copper plating layer including Au.

For example, the pad part 257 may be provided in each of the grooves 71a to 71d of the circuit board 250 . Although only the pad part 257 provided in the groove 71a is illustrated in FIG. 12 , the description of the pad part 257 of FIG. 12 may be equally applied to the pad parts provided in the other grooves 71b to 71d.

The pad part 257 of the circuit board 257 may be disposed on an upper surface of the circuit board 250 , a lower surface of the circuit board 250 , and a side surface connecting the upper and lower surfaces of the circuit board 250 .

For example, the pad part 257 may include a side surface of the groove (eg, 71a), an upper surface of the circuit board 250 in contact with a side surface of the groove (eg 71a), and a circuit board 250 in contact with a side surface of the groove (eg, 71a). ) may be disposed on the lower surface of the

For example, the pad part 257 of the circuit board 250 includes a first pad 259b disposed under the circuit board 250 in contact with the side surface of the groove 71a and the circuit board ( It may include a second pad 259b disposed on the upper portion of the 250 , and a third pad 605 disposed on a side surface of the groove 71a and connecting the first pad 259b and the second pad 259a. have.

The third pad 605 may be disposed on a side surface of the circuit board 250 .

A via or groove may be provided on a side surface of the grooves 71a to 71d of the circuit board 250 , and a part of the pad part 257 (eg, the third pad 605 ) is disposed in the via or groove. can be

The third pad 605 of the pad part 257 of the circuit board 250 may have a curved shape recessed from the side surface of the groove 71a, for example, a semicircular via shape.

For example, the radius of the via may be 0.1 mm to 0.5 mm, but is not limited thereto. For example, the radius of the via may be 0.2 mm to 0.3 mm. For example, the radius of the via may be 0.2 mm.

When the radius of the via is less than 0.1 mm, the improvement in adhesion and solderability between the pad part 257 of the circuit board 250 and the terminal may be insignificant. When the radius of the via is more than 0.5 mm, the terminals 81a to 81d Since the pad part 257 is formed larger than necessary for soldering compared to the second coupling part 320 , the cost may increase and the degree of freedom of the pattern of the circuit board 250 may be reduced.

The first rod 259b of the pad part 257 of the circuit board 250 may face the terminal (eg, 81a) in the optical axis direction.

The first pad 259b of the pad part 257 of the circuit board 250 may contact the exposed area 321 of the second coupling part 320 of the first terminal 81a.

Referring to FIG. 15 , the circuit board 250 is formed on the first insulating layer 601 , the first conductive layer 602a disposed on the top surface of the first insulating layer 601 , and the top surface of the first conductive layer 602a . a second insulating layer 603a disposed on the lower surface of the first insulating layer 601 , a second conductive layer 602b disposed on a lower surface of the first insulating layer 601 , and a third insulating layer 603a disposed on a lower surface of the second conductive layer 602b; may include

Also, for example, a first adhesive layer may be disposed between the first insulating layer 601 and the first conductive layer 602a , and a second adhesive layer may be disposed between the third insulating layer 603a and the second conductive layer 602b . can be placed.

The first conductive layer 602a may be a patterned metal layer, for example, a Cu plating layer.

The second conductive layer 602b may be a metal layer (eg, a Cu layer) or a patterned metal layer.

For example, the first conductive layer 602a may be patterned to include wires and pads electrically connected to the supports 220 - 1 to 220 - 4 , the second coil 230 , and the second position sensor 240 . It may be in an oxidized form.

The first to third insulating layers 601 , 603a , and 603b may be made of a resin, for example, polyimide, but are not limited thereto.

The first pad 259b may be disposed on the lower surface of the second conductive layer 602b , and the second pad 259a may be disposed on the upper surface of the first conductive layer 602a .

For example, the lower surface of the first pad 259b may be positioned higher than the lower surface of the third insulating layer 603b of the circuit board 250 .

For example, the second pad 259a of the pad part 257 may be electrically connected to a corresponding one of the terminals 251 of the circuit board 250 by the patterned first conductive layer 602a.

The upper surface of the first conductive layer 602a may include a region 59a exposed from the second insulating layer 603a for contact with the second pad 259a, and the lower surface of the second conductive layer 602b is A region 59b exposed from the third insulating layer 603b may be included in order to contact the first pad 259b.

For example, the first pad 259b may be disposed in the exposed region 59b of the lower surface of the second conductive layer 602b, and the second pad 259a may be disposed in the exposed region 59b of the upper surface of the first conductive layer 602a. It may be disposed in the region 59a.

For example, the area of the first pad 259b in contact with the exposed region 59b of the lower surface of the second conductive layer 602b is the first pad 259b in contact with the exposed region 59a of the upper surface of the first conductive layer 602a. The area of the second pad 259a may be larger than that of the pad 259a.

The exposed region 14a of the circuit board 250 may be a portion of the patterned first conductive layer 602a exposed by the second insulating layer 603a, and the top surface of the exposed region 14a is patterned. It may be a top surface of the first conductive layer 602a.

The pad parts 41 to 44 and the pad part 257 of the circuit board 250 may be spaced apart from each other, may be electrically separated from each other, and may be located in the exposed area 14a.

For example, between the lower surface of the first pad 259b of the circuit board 250 and the lower surface of the third insulating layer 603b or the lower surface of the first pad 259b and the exposed area 321 of the second coupling part 320 . There may be a step between the lower surface of the circuit board 250 in the direction of the upper surface, and the step may be 25.5 mm to 27.5 mm.

The third pad 605 of the pad part 257 may be disposed on the side surface of the first insulating layer 601 , and connect the second pad 259a and the first pad 259b of the pad part 257 to each other. and may be a plating layer. For example, each of the first pad 259b , the second pad 259a , and the third pad 605 of the pad part 257 may have a thickness of 10 mm to 12 mm.

For example, the third pad 605 of the pad part 257 may be a gold (Au) plating layer, but is not limited thereto.

The exposed area 321 of the second coupling part 320 of the terminals 81a to 81d may be coupled to the pad part 257 of the circuit board 257 by a conductive adhesive member or solder, and both are to be electrically connected. can

The area of the first pad 259b of the pad part 257 of the circuit board 250 may be larger than the area of the second pad 259a, but is not limited thereto.

Referring to FIG. 16 , the ratio H3/H1 of the first distance H3 to the second distance H1 may be 1.18 to 1.2, and the ratio of the first distance H3 to the third distance H ( H3/H) may be 1.16 to 1.17. For example, the ratio (H3/H) may be 1.1667, and the ratio (H3/H1) may be 1.188.

The first distance H3 may be a distance from the lower surface of the upper springs 150-1 to 150-4 to the lower surface of the first coupling part 310 of the terminals 81a to 81d. The second distance H1 may be a distance from the lower surface of the upper springs 150 - 1 to 150 - 4 to the lower surface of the circuit member 231 . The third distance H may be a distance from the lower surface of the upper springs 150 - 1 to 150 - 4 to the lower surface of the circuit board 250 .

As the thickness of the mobile phone decreases, the height of the camera module decreases, and as the height of the camera module decreases, the length of the OIS wire of the lens driving device (eg, the above-described supports 220-1 to 220-4) is shortened and , The reduction in the length of the OIS wire may increase the consumption current.If the diameter of the OIS wire is reduced to prevent the increase in consumption current and deterioration of reliability, there is a risk of disconnection of the OIS wire and OIS driving reliability may be reduced.

The embodiment increases the length of the support parts 220-1 to 220-4 by coupling the support parts 220-1 to 220-4 to the lower surfaces of the terminals 81a to 81d positioned below the circuit board 250. It is possible to reduce the power consumption by reducing the intensity of the current flowing through the support parts 220-1 to 220-4, thereby driving the OIS due to the reduction in the diameter of the support parts 220-1 to 220-4. to prevent deterioration of reliability.

When the ratio (H3/H1) is less than 1.18, or the ratio (H3/H) is less than 1.16, the increase in the length of the support parts 220-1 to 220-4 is insignificant, so the power consumption reduction effect cannot be obtained, and the support part ( 220-1 to 220-4) cannot be prevented from reducing the reliability of OIS driving due to the reduction in diameter.

Also, when the ratio H3/H1 is greater than 1.2 or the ratio H3/H is greater than 1.17, the thickness of the lens driving device may increase.

For example, the distance H2 from the lower surface of the upper springs 150-1 to 150-4 to the upper surface of the circuit member 231 may be 1.86 mm.

For example, the height (or thickness in the optical axis direction) of the housing 140 may be 1.3 mm to 2 mm. For example, the height (or thickness in the optical axis direction) of the housing 140 may be 1.4 mm to 1.6 mm. For example, the height (or the thickness in the optical axis direction) of the housing 140 may be 1.51 mm.

17A shows the coupling between the circuit board 25a and the terminal 8a by solder 86, and FIG. 17B shows the coupling between the pad part 257 and the terminal 81a of the circuit board 250 according to the embodiment. indicates.

Referring to FIG. 17A , the circuit board 25a may include the pad part 58 disposed only on the lower surface. When the pad portion 58 is disposed only on the lower surface of the circuit board 25a, the space between the lower surface of the circuit board 25a and the terminal 8a is narrow, so that when soldering, solder is applied to the circuit board 25a and the terminal 8a. Since it does not penetrate well, solderability is deteriorated, which may cause an electrical disconnection between the terminal 8a and the circuit board 250 .

Referring to FIG. 17B , the lens driving device 100 according to the embodiment may include a conductive adhesive member or solder 410 for coupling the terminals 81a to 81d and the pad part 257 of the circuit board 250 . have.

The solder 410 may be disposed between the second coupling part 320 (eg, the exposed region 321 ) and the first pad 259b of the pad part 257 of the circuit board 250 . Also, the solder 410 may be further disposed on the second pad 259a and the third pad 605 .

For example, the solder 410 may be disposed between the first to third pads 259b , 259a , and 605 of the circuit board 250 and the second coupling portion 320 (eg, the exposed region 321 ).

The pad part 257 according to the embodiment includes a first pad 259b disposed under the circuit board 250 and a third pad 605 provided on side surfaces of the grooves 71a to 71d of the circuit board 250 . , and the second pad 259a disposed on the circuit board 250 , so that solder can be bonded to the third pad 605 and the second pad 259a of the circuit board 250 during soldering. As a result, the surface tension of the solder is increased, so that the penetration of the solder between the first pad 259b of the circuit board 250 and the exposed area 231 of the terminals 81a to 81d may increase. As a result, solderability between the pad portion 257 of the circuit board 250 and the terminals 81a to 81d can be improved, and bonding strength can be improved, thereby preventing electrical disconnection between the terminal and the circuit board.

In addition, since the third pad 605 of the circuit board 250 has a curved shape, the contact area may increase, thereby improving solderability between the pad part 257 of the circuit board 250 and the terminals 81a to 81d. and can improve bonding strength.

1 to 17 do not include an AF position sensor for AF feedback driving, but is not limited thereto. In another embodiment, an AF position sensor for AF feedback driving may be further included. In this case, the AF position sensor may be located on the bobbin 110 .

In addition, in another embodiment, the AF position sensor and the sensing magnet may be further provided. In this case, the AF position sensor may be disposed on any one of the housing and the bobbin, and the sensing magnet may be disposed on the other one of the housing and the bobbin.

When the lens driving apparatus according to the embodiment includes the AF position sensor, the embodiment may include a sufficient number of upper springs and supports to electrically connect the AF position sensor and the circuit board. Alternatively, the second elastic part may include a plurality of lower springs, and the AF position sensor and the circuit board may be electrically connected through the upper springs and the lower springs.

Meanwhile, the lens driving apparatus according to the above-described embodiment may be used in various fields, for example, a camera module or an optical device.

For example, the lens driving device 100 according to the embodiment forms an image of an object in space using reflection, refraction, absorption, interference, diffraction, etc., which are characteristics of light, and aims to increase the visual power of the eye, It may be included in an optical instrument for the purpose of recording and reproducing an image by a lens, or for optical measurement, propagation or transmission of an image, and the like. For example, the optical device according to the embodiment may include a smart phone and a portable terminal equipped with a camera.

18 is an exploded perspective view of the camera module 200 according to the embodiment.

Referring to FIG. 18 , the camera module 200 includes a lens or a lens barrel 400 , a lens driving device 100 , an adhesive member 612 , a filter 610 , a first holder 600 , and a second holder 800 . ), an image sensor 810 , a motion sensor 820 , a controller 830 , and a connector 840 .

The lens or lens barrel 400 may be mounted on the bobbin 110 of the lens driving device 100 .

The first holder 600 may be disposed under the base 210 of the lens driving device 100 . The filter 610 is mounted on the first holder 600 , and the first holder 600 may include a protrusion 500 on which the filter 610 is seated.

The adhesive member 612 may couple or attach the base 210 of the lens driving device 100 to the first holder 600 . The adhesive member 612 may serve to prevent foreign substances from being introduced into the lens driving device 100 in addition to the above-described bonding role.

For example, the adhesive member 612 may be an epoxy, a thermosetting adhesive, or an ultraviolet curable adhesive.

The filter 610 may serve to block light of a specific frequency band in light passing through the lens barrel 400 from being incident on the image sensor 810 . The filter 610 may be an infrared cut filter, but is not limited thereto. In this case, the filter 610 may be disposed to be parallel to the x-y plane.

An opening may be formed in a portion of the first holder 600 on which the filter 610 is mounted so that light passing through the filter 610 may be incident on the image sensor 810 .

The second holder 800 may be disposed under the first holder 600 , and the image sensor 810 may be mounted on the second holder 600 . The image sensor 810 is a portion on which the light passing through the filter 610 is incident to form an image included in the light.

The second holder 800 may include various circuits, elements, control units, etc. to convert an image formed on the image sensor 810 into an electrical signal and transmit it to an external device.

The second holder 800 may be implemented as a circuit board on which an image sensor may be mounted, a circuit pattern may be formed, and various elements may be coupled thereto.

The image sensor 810 may receive an image included in light incident through the lens driving device 100 and convert the received image into an electrical signal.

The filter 610 and the image sensor 810 may be spaced apart to face each other in the first direction.

The motion sensor 820 may be mounted on the second holder 800 and may be electrically connected to the controller 830 through a circuit pattern provided on the second holder 800 .

The motion sensor 820 outputs rotational angular velocity information due to the movement of the camera module 200 . The motion sensor 820 may be implemented as a 2-axis or 3-axis gyro sensor, or an angular velocity sensor.

The control unit 830 is mounted on the second holder 800 . The second holder 800 may be electrically connected to the lens driving device 100 . For example, the second holder 800 may be electrically connected to the first coil 120 , the second coil 230 , and the position sensor 240 of the lens driving device 100 .

For example, a driving signal may be provided to each of the first coil 120 , the second coil 230 , and the position sensor 240 through the second holder 800 .

The connector 840 is electrically connected to the second holder 800 and may include a port for electrically connecting to an external device.

19 is a perspective view of a portable terminal 200A according to an embodiment, and FIG. 20 is a configuration diagram of the portable terminal 200A shown in FIG. 19 .

19 and 20 , the portable terminal 200A (hereinafter referred to as "terminal") has a body 850, a wireless communication unit 710, an A/V input unit 720, a sensing unit 740, an input/ It may include an output unit 750 , a memory unit 760 , an interface unit 770 , a control unit 780 , and a power supply unit 790 .

The body 850 shown in FIG. 19 is in the form of a bar, but is not limited thereto, and a slide type, a folder type, and a swing type in which two or more sub-bodies are coupled to be movable relative to each other. , and may have various structures such as a swivel type.

The body 850 may include a case (casing, housing, cover, etc.) forming an exterior. For example, the body 850 may be divided into a front case 851 and a rear case 852 . Various electronic components of the terminal may be embedded in a space formed between the front case 851 and the rear case 852 .

The wireless communication unit 710 may include one or more modules that enable wireless communication between the terminal 200A and the wireless communication system or between the terminal 200A and the network in which the terminal 200A is located. For example, the wireless communication unit 710 may include a broadcast reception module 711 , a mobile communication module 712 , a wireless Internet module 713 , a short-range communication module 714 , and a location information module 715 . have.

The A/V (Audio/Video) input unit 720 is for inputting an audio signal or a video signal, and may include a camera 721 , a microphone 722 , and the like.

The camera 721 may include the camera module 200 according to the embodiment shown in FIG. 18 .

The sensing unit 740 detects the current state of the terminal 200A, such as the opening/closing state of the terminal 200A, the position of the terminal 200A, the presence or absence of user contact, the orientation of the terminal 200A, acceleration/deceleration of the terminal 200A, etc. It is possible to generate a sensing signal for controlling the operation of the terminal 200A by sensing. For example, when the terminal 200A is in the form of a slide phone, it is possible to sense whether the slide phone is opened or closed. In addition, it is responsible for sensing functions related to whether the power supply unit 790 is supplied with power, whether the interface unit 770 is coupled to an external device, and the like.

The input/output unit 750 is for generating input or output related to sight, hearing, or touch. The input/output unit 750 may generate input data for operation control of the terminal 200A, and may also display information processed by the terminal 200A.

The input/output unit 750 may include a keypad unit 730 , a display module 751 , a sound output module 752 , and a touch screen panel 753 . The keypad unit 730 may generate input data in response to a keypad input.

The display module 751 may include a plurality of pixels whose color changes according to an electrical signal. For example, the display module 751 may include a liquid crystal display, a thin film transistor-liquid crystal display, an organic light-emitting diode, a flexible display, or a three-dimensional (3D) display module. It may include at least one of a display (3D display).

The sound output module 752 outputs audio data received from the wireless communication unit 710 in a call signal reception, a call mode, a recording mode, a voice recognition mode, or a broadcast reception mode, or stored in the memory unit 760 . Audio data can be output.

The touch screen panel 753 may convert a change in capacitance generated due to a user's touch on a specific area of the touch screen into an electrical input signal.

The memory unit 760 may store a program for processing and control of the controller 780, and stores input/output data (eg, phone book, message, audio, still image, photo, video, etc.) Can be temporarily stored. For example, the memory unit 760 may store an image captured by the camera 721 , for example, a photo or a moving picture.

The interface unit 770 serves as a passage for connecting to an external device connected to the terminal 200A. The interface unit 770 receives data from an external device, receives power and transmits it to each component inside the terminal 200A, or transmits data inside the terminal 200A to an external device. For example, the interface unit 770 may include a wired/wireless headset port, an external charger port, a wired/wireless data port, a memory card port, a port for connecting a device equipped with an identification module, and an audio I/O (Input/O) Output) port, video I/O (Input/Output) port, and may include an earphone port, and the like.

The controller 780 may control the overall operation of the terminal 200A. For example, the controller 780 may perform related control and processing for voice call, data communication, video call, and the like.

The controller 780 may include a multimedia module 781 for playing multimedia. The multimedia module 781 may be implemented within the controller 180 or may be implemented separately from the controller 780 .

The controller 780 may perform a pattern recognition process capable of recognizing a handwriting input or a drawing input performed on the touch screen as characters and images, respectively.

The power supply unit 790 may receive external power or internal power under the control of the control unit 780 to supply power required for operation of each component.

Features, structures, effects, etc. described in the above embodiments are included in at least one embodiment of the present invention, and are not necessarily limited to only one embodiment. Furthermore, features, structures, effects, etc. illustrated in each embodiment can be combined or modified for other embodiments by a person skilled in the art to which the embodiments belong. Accordingly, the contents related to such combinations and modifications should be interpreted as being included in the scope of the present invention.

Claims (13)

housing;
a bobbin disposed within the housing;
a first coil disposed on the bobbin;
a magnet disposed on the housing;
an elastic part coupled to the bobbin and the housing;
a circuit board disposed under the housing and including a pad part;
a base disposed under the circuit board; and
a terminal coupled to the base and including a hole; and
and a support part having one end coupled to the elastic part and the other end coupled to the hole of the terminal,
The terminal is a lens driving device coupled to the pad part. According to claim 1,
The terminal is
a first coupling part including the hole to which the other end of the support part is coupled; and
and a second coupling part coupled to the pad part of the circuit board. 3. The method of claim 2,
and a connection part connecting a part of the first coupling part and a part of the second coupling part. 3. The method of claim 2,
A lower surface of the second coupling unit is positioned higher than an upper surface of the first coupling unit based on a lower surface of the base. 3. The method of claim 2,
The second coupling part is disposed between the base and the circuit board. 3. The method of claim 2,
An area of the first coupling part is larger than an area of the second coupling part. 3. The method of claim 2,
and a solder coupled to a portion of the support part passing through the hole of the first coupling part and a lower surface of the first coupling part. 3. The method of claim 2,
The pad part faces the second coupling part of the terminal in an optical axis direction. According to claim 1,
and a second coil disposed on the circuit board and configured to move the housing by interaction with the magnet. According to claim 1,
and the terminal is disposed under the circuit board. According to claim 1, wherein the elastic portion,
a first elastic part disposed on the upper surface of the bobbin; and
and a second elastic part disposed on a lower surface of the bobbin,
The support part is a lens driving device coupled to the first elastic part. 12. The method of claim 11,
The first elastic part is an upper elastic body, the second elastic part is a lower elastic body,
The support is a wire lens driving device. lens;
The lens driving device according to any one of claims 1 to 12; and
A camera module containing an image sensor.

Images