KR20240056468A - A lens moving unit, and camera module and optical instrument including the same - Google Patents

Abstract

The embodiment includes a base, a housing disposed on the base, a bobbin disposed in the housing, a first coil and magnet for moving the bobbin in the optical axis direction, an elastic member coupled to the bobbin and the housing, a circuit board disposed on the base, and a base. A terminal coupled to the terminal, and a support member connecting the elastic member and the terminal, the terminal is coupled to the base, a first coupling portion coupled to one end of the support member by solder, and bent toward the circuit board from the first coupling portion. It includes a connecting portion extending through the connection portion, and a second coupling portion connected to the connecting portion and coupled to the circuit board.

Description

Lens driving device and camera module and optical device including the same {A LENS MOVING UNIT, AND CAMERA MODULE AND OPTICAL INSTRUMENT INCLUDING THE SAME}

Embodiments relate to a lens driving device and a camera module and optical device including the same.

Since it is difficult to apply the voice coil motor (VCM) technology used in existing general camera modules to camera modules for ultra-small size and low power consumption, related research has been actively conducted.

In the case of camera modules mounted on small electronic products such as smartphones, the camera module may frequently receive shock during use, and the camera module may slightly shake due to the user's hand tremors during filming. In consideration of this, recently, a technology for additionally installing a means to prevent camera shake in a camera module has been developed.

Embodiments provide a lens driving device that can improve solderability between a circuit board and a terminal and prevent electrical disconnection between a terminal and a circuit board, and a camera module and optical device including the same.

A lens driving device according to an embodiment includes a base; a housing disposed above the base; a bobbin disposed within the housing; a first coil and magnet for moving the bobbin in the optical axis direction; an elastic member coupled to the bobbin and the housing; a circuit board disposed on the base; A terminal coupled to the base; and a support member connecting the elastic member and the terminal, wherein the terminal is coupled to the base and a first coupling portion coupled to one end of the support member by solder. The circuit board is connected to the first coupling portion from the first coupling portion. It includes a connection part bent and extended toward the connection part, and a second coupling part connected to the connection part and coupled to the circuit board.

The first coupling portion may be located below the circuit board and may include a through hole through which the one end of the support member passes.

Based on the lower surface of the base, the lower surface of the second coupling part may be positioned higher than the upper surface of the first coupling part. The second coupling portion may be disposed between the base and the circuit board, and the first coupling portion may be disposed lower than the second coupling portion.

The first coupling portion may include a hole, and the base may include a protrusion for engaging the hole of the first coupling portion.

The circuit board may include a pad disposed under the circuit board and coupled to the second coupling portion by solder.

The area of the top surface of the connection part may be smaller than the area of the top surface of the second coupling part.

The connection part connects a part of the first side of the first coupling part and a part of the first side of the second coupling part, and the length of the first coupling part in the first direction is the length of the second coupling part in the first direction. and the first direction may be parallel to the first side of the second coupling portion.

The connecting portion connects a portion of the first side of the first coupling portion and a portion of the first side of the second coupling portion, and the length of the connecting portion in the first direction is the length of the first coupling portion in the first direction. is smaller, and the first direction may be parallel to the first side of the second coupling portion.

The magnet is disposed in the housing, and the first coil is disposed in the bobbin and may move the bobbin by interacting with the magnet.

It may include a second coil that faces the magnet in the optical axis direction and moves the housing by interacting with the magnet.

The first coupling portion may be disposed at a corner of the base. The support member may be a suspension wire.

The elastic member includes an upper elastic member disposed on an upper portion of the bobbin; and a lower elastic member disposed at a lower portion of the bobbin, and the other end of the support member may be coupled to the upper elastic member.

The upper elastic member includes a first elastic member and a second elastic member, and the support member includes a first support member coupled to the first elastic member and a second support member coupled to the second elastic member. , the second coil may be electrically connected to the first and second elastic members.

The upper elastic member includes an inner frame coupled to the bobbin, an outer frame coupled to the housing, and a frame connection portion connecting the inner frame and the outer frame, and the other end of the support member is coupled to the outer frame. can do.

The distance from the lower surface of the upper elastic member to the lower surface of the first coupling portion may be greater than the distance from the lower surface of the upper elastic member to the lower surface of the circuit board.

A lens driving device according to another embodiment includes a base; a housing disposed above the base; a bobbin disposed within the housing; A magnet disposed in the housing; a first coil disposed on the bobbin; an elastic member coupled to the bobbin and the housing; a circuit board disposed on the base; A terminal coupled to the base; and a support member including one end coupled to the elastic member and the other end coupled to the terminal, wherein the terminal is coupled to the base and a first coupling portion coupled to the other end of the support member by solder. a second coupling portion coupled to the circuit board; and a connecting portion connecting a portion of the first side of the first coupling portion and a portion of the first side of the second coupling portion, wherein the first length in the first direction of the first coupling portion is the first length of the second coupling portion. It is greater than the second length in the first direction, and the first direction is parallel to the first side of the second coupling portion. A third length of the connection part in the first direction may be smaller than the first length.

The embodiment can improve solderability between the circuit board and the terminal and prevent electrical disconnection between the terminal and the circuit board.

1 is an exploded view of a lens driving device according to an embodiment.
Figure 2 shows a coupling diagram of the lens driving device excluding the cover member.
Figure 3 is a perspective view of the bobbin.
Figure 4 is a perspective view of the housing.
Figure 5 shows a perspective view of the first elastic part, the second elastic part, the support part, the second coil, the circuit board, and the base.
Figure 6 is a perspective view of the second coil, circuit board, and support.
Figure 7 is an exploded perspective view of the circuit board and the second coil disposed on the base.
FIG. 8 is a partially enlarged view of the base and circuit board shown in FIG. 7.
Figure 9 shows a bottom view of a circuit member including a second coil.
Figure 10A shows an exploded perspective view of the base, position sensor, and terminal.
Figure 10b shows a bottom view of the base.
Figure 10c is a perspective view of the base and terminal combined.
Figure 11a is a perspective view of a first terminal and a first support portion according to an embodiment.
Figure 11b shows a perspective view of the first terminal of Figure 11a.
Figure 11c shows a perspective view of the first terminal and the first support portion according to another embodiment.
12A to 12E show connection portions of the first terminal according to other embodiments.
Figure 13a is a portion of a perspective view in which the base, the first terminal, and the circuit board are coupled to each other.
Figure 13b shows a bottom view of the circuit board.
Figure 14 shows solder to indicate the connection between the terminal and the support.
Figure 15 shows a cross-sectional view of the pad portion of the circuit board.
FIG. 16 is a cross-sectional view in the AB direction of the lens driving device shown in FIG. 2.
Figure 17a shows the bonding between a circuit board and a terminal by solder.
Figure 17b shows the coupling between the pad portion of the circuit board and the terminal according to the embodiment.
Figure 18 shows an exploded perspective view of a camera module according to an embodiment.
Figure 19 shows a perspective view of a portable terminal according to an embodiment.
FIG. 20 shows a configuration diagram of the portable terminal shown in FIG. 19.

Hereinafter, embodiments of the present invention that can specifically realize the above object will be described with reference to the attached drawings.

In the description of the embodiment, in the case where each element is described as being formed “on or under”, “on or under” means This includes both elements that are in direct contact with each other or one or more other elements that are formed (indirectly) between the two elements. Additionally, when expressed as "on or under", it can include not only the upward direction but also the downward direction based on one element.

In addition, relational terms such as “first” and “second”, “top/top/top” and “bottom/bottom/bottom” used below refer to any physical or logical relationship or order between such entities or elements. It does not necessarily require or imply, and may be used only to distinguish one entity or element from another entity or element. Additionally, the same reference numerals indicate the same elements throughout the description of the drawings.

In addition, terms such as “include,” “comprise,” or “have” as used above mean that the corresponding component may be included, unless specifically stated to the contrary, and thus exclude other components. It should be interpreted as being able to include other components. Additionally, terms such as “corresponding” described above may include at least one of the meanings of “opposite” or “overlapping.”

For convenience of explanation, the lens driving device according to the embodiment is described using a Cartesian coordinate system (x, y, z), but it can also be described using another coordinate system, and the embodiment is not limited to this. In each drawing, the x-axis and y-axis refer to directions perpendicular to the z-axis, which is the direction of the optical axis. The z-axis direction, which is the optical axis or a direction parallel to the optical axis, is called the 'first direction', and the x-axis direction is called the 'second direction'. ', and the y-axis direction can be referred to as the 'third direction'.

An 'image stabilization device' applied to small camera modules of mobile devices such as smartphones or tablet PCs is a device that prevents the outline of the captured image from being clearly formed due to vibration caused by the user's hand shaking when shooting still images. It may refer to a device configured to do so.

Additionally, an 'autofocusing device' is a device that automatically focuses an image of a subject onto the image sensor surface. Such image stabilization devices and auto-focusing devices can be configured in various ways. The lens driving device according to the embodiment moves the optical module composed of at least one lens in a first direction parallel to the optical axis, or moves the optical module in the first direction parallel to the optical axis. An image stabilization operation and/or an auto-focusing operation may be performed by moving about a surface formed by the second and third directions perpendicular to the .

FIG. 1 is an exploded view of the lens driving device 100 according to an embodiment, and FIG. 2 shows a combined view of the lens driving device 100 excluding the cover member 300.

Referring to Figures 1 and 2, the lens driving device 100 includes a bobbin 110, a first coil 120, a magnet 130, a housing 140, a first elastic part 150, and a second elastic part. It may include unit 160.

Additionally, the lens driving device 100 may further include a support portion 220 and a base 210.

Additionally, the lens driving device 100 may further include a second coil 230 for OIS (Optical Image Stabilizer) driving, and may further include a position sensor 240 for OIS feedback driving.

Additionally, the lens driving device 100 may further include a cover member 300.

The cover member 300 will be described.

The cover member 300 accommodates other components 110, 120, 130, 140, 150, 160, 220, 230, and 250 in a receiving space formed together with the base 210.

The cover member 300 may have a box shape with an open lower part including a top plate and side plates, and the lower part of the cover member 300 may be coupled to the base 210 . The shape of the upper plate of the cover member 300 may be polygonal, for example, square or octagonal.

The cover member 300 may have an opening in the upper plate that exposes a lens (not shown) coupled to the bobbin 110 to external light. The material of the cover member 300 may be a non-magnetic material such as SUS to prevent sticking to the magnet 130, but it is made of a magnetic material to generate electromagnetic force due to the interaction between the first coil 120 and the magnet 130. It may also function as a yoke to increase .

Next, the bobbin 110 will be described.

The bobbin 110 may be equipped with a lens or lens barrel and is disposed within the housing 140. The bobbin 110 may have an opening for mounting a lens or lens barrel. The shape of the opening may be circular, oval, or polygonal, but is not limited thereto.

Figure 3 is a perspective view of the bobbin 110.

Referring to FIG. 3, the bobbin 110 may include a plurality of side portions (eg, 110b-1 and 110b-2).

For example, the bobbin 110 may include first sides 110b-1 corresponding to or opposing the magnet and second sides 110b-2 disposed between the first sides.

For example, the horizontal length of the side of the first side 110b-2 of the bobbin 110 may be longer than the horizontal length of the side of the second side 110b-2, but is not limited thereto. may be the same.

The bobbin 110 may include a first stopper 114 protruding from the upper surface in a first direction. When the bobbin 110 moves in the first direction for the auto focusing function, the first stopper 114 of the bobbin 110 stops the bobbin 110 even if the bobbin 110 moves beyond a specified range due to an external impact, etc. It may serve to prevent the upper surface of the from directly colliding with the inside of the upper plate of the cover member 300.

The bobbin 110 may include at least one protrusion 25 protruding from the side (or outer side) of the second side 110b-2. For example, the bobbin 110 may have four protrusions 25 provided on the four second side portions 110b-2, but is not limited thereto. In another embodiment, the bobbin 110 may include two protrusions disposed on two second sides 110b-2 facing each other.

The protrusion 25 of the bobbin 110 corresponds to the groove 145 of the housing 140, and may be inserted or placed within the groove 145 of the housing 140, and the bobbin 110 may be fixed at a constant position around the optical axis. Rotation beyond the range can be suppressed or prevented.

The bobbin 110 may be provided with a second stopper (not shown) protruding from the lower surface. When the bobbin 110 moves in the first direction for the auto-focusing function, the bobbin 110 is stopped by an external shock or the like. ) Even if it moves beyond the specified range, it can prevent the lower surface of the bobbin 110 from directly colliding with the base 210, the second coil 230, or the circuit board 250.

The bobbin 110 may be provided with at least one seating groove 16 on the side for placing or installing the first coil 120. For example, the seating groove 16 may be provided on the first sides 110b-1 and the second sides 110b-2 of the bobbin 110, but is not limited thereto.

The shape and number of the seating grooves 16 of the bobbin 110 may correspond to the shape and number of the first coils 120 disposed on the sides of the bobbin 110.

Additionally, the bobbin 110 may be provided on at least one of the first and second side portions 110b-1 and 110b-2 and may include a first groove 12a and a second groove 12b that are spaced apart from each other. there is.

For example, the first groove 12a may be provided on one of the two first sides 110b-1 of the bobbin 110 facing each other, and the second groove 12b may be provided on the bobbin 110 facing each other. ) may be provided on the other of the two first sides 110b-1.

The first groove 12a and the second groove 12b of the bobbin 110 may be located on or above the first coil 120 disposed in the bobbin 110 and may be connected to the mounting groove 16. .

The first part extending from one end of the first coil 120 disposed on the side of the bobbin 110 may be disposed in the first groove 12a, and the first coil 120 disposed on the side of the bobbin 110 ) The second part extending from the other end may be disposed in the second groove 12b.

At this time, the first part of the first coil 120 may extend to the upper surface of the bobbin 110 to be connected to the first inner frame 151 of the first upper spring 150-1, and the first coil 120 ) may extend to the upper surface of the bobbin 110 to be connected to the second inner frame 151 of the second upper spring 150-2.

In the embodiment, the first coil 120 extends to the upper surface of the bobbin 110 for electrical connection with the two upper springs, but the present invention is not limited thereto. In another embodiment, the above-described first groove and second groove may be located below the coil 120, the first part and the second part of the coil may extend to the lower surface of the bobbin 110, and the two lower parts It may also be electrically connected to springs.

In another embodiment, the bobbin 110 may not have the mounting groove 16, and the first coil 120 may be wound and fixed directly to the sides of the bobbin 110.

Additionally, a first upper protrusion 113 that engages the hole 151a of the first inner frame 151 of the first elastic portion 150 may be provided on the upper surface of the bobbin 110.

The bobbin 110 may be provided with a first lower protrusion (not shown) on its lower surface that is coupled to and fixed to the hole 161a of the second elastic portion 160.

A thread for coupling to a lens or lens barrel may be provided on the inner surface of the bobbin 110. A thread can be formed on the inner surface of the bobbin 110 while the bobbin 110 is fixed by a jig, etc., and a groove 15 for fixing the jig may be provided on the upper surface of the bobbin 110. there is. For example, the jig fixing groove 15 may be provided on the upper surface of the two protrusions 25 facing each other, but is not limited to this.

Next, the first coil 120 will be described.

The first coil 120 is disposed on the outer surface of the bobbin 110 and may be a driving coil that electromagnetically interacts with the magnet 130 disposed in the housing 140.

A driving signal (eg, driving current or voltage) may be applied to the first coil 120 to generate electromagnetic force by interaction with the magnet 130.

The driving signal applied to the first coil 120 may be a direct current signal. For example, the driving signal may be in the form of current or voltage.

Alternatively, the driving signal applied to the first coil 120 may include a direct current signal and/or an alternating current signal. For example, the alternating current signal may be a sinusoidal signal or a pulse signal (eg, a pulse width modulation (PWM) signal).

The AF movable unit may move in a first direction, for example, upward (+Z-axis direction) or downward (-Z-axis direction), by electromagnetic force resulting from the interaction between the first coil 120 and the magnet 130. By controlling the strength or/and polarity (e.g., direction in which the current flows) of the driving signal applied to the first coil 120, the strength of electromagnetic force due to the interaction between the first coil 120 and the magnet 130 and/and By adjusting the direction, the movement of the AF movable unit in the first direction can be controlled, thereby performing an auto-focusing function.

The AF movable unit may include a bobbin 110 elastically supported by the first elastic part 150 and the second elastic part 160, and components mounted on the bobbin 110 and moving with the bobbin 110. . For example, the AF movable unit may include a bobbin 110 and a first coil 120. Also, for example, the AF movable unit may further include a lens (not shown) mounted on the bobbin 110.

The first coil 120 may be disposed on the bobbin 110 to have a closed loop shape. For example, the first coil 120 is wound on the side of the bobbin 110 in a clockwise or counterclockwise direction about the optical axis. It may be wound or disposed on the outer surface of the fields 110b-1 and 110b-2.

In another embodiment, the first coil 120 may be implemented in the form of a coil ring wound or arranged in a clockwise or counterclockwise direction about an axis perpendicular to the optical axis (OA), and the number of coil rings is determined by the magnet 130. It may be the same as the number of, but is not limited to this.

The first coil 120 may be electrically connected to at least one of the first elastic portion 150 or the second elastic portion 160, the first elastic portion 150 or the second elastic portion 160, and the support portion. It can be electrically connected to the circuit board 250 through 220.

For example, the first coil 120 may be connected to the first inner frame 151 of the second and fourth upper springs 150-2 and 150-4 by a conductive adhesive member such as solder, and the second and fourth upper springs 150-2 and 150-4. It may be electrically connected to the circuit board 250 by the fourth support portions 220-2 and 220-4.

Next, the housing 140 will be described.

The housing 140 accommodates the bobbin 110 on which the first coil 120 is mounted or disposed inside.

Figure 4 is a perspective view of the housing 140, and Figure 5 shows the first elastic part 150, the second elastic part 150, the support part 220, the second coil 230, the circuit board 250, and the base. It represents a perspective view of (250).

Referring to FIGS. 4 and 5 , the housing 140 may have an overall open pillar shape and may include a plurality of side portions forming the opening.

For example, the housing 140 may include side portions 141-1 to 141-4 spaced apart from each other and corner portions 142-1 to 142-4 spaced apart from each other.

For example, the housing 140 includes a first side 141-1, a second side 141-2, a third side 141-3, a fourth side 141-4, and a first side 141-1. ) and the first corner portion (142-1) located between the second side portion (141-2), the second corner portion (142-1) located between the second side portion (141-2) and the third side portion (141-3) 142-2), a third corner portion 142-3 located between the third side portion 141-3 and the fourth side portion 141-4, the fourth side portion 141-4 and the first side portion 141 It may include a fourth corner portion 142-4 located between -1).

The side portions 141-1 to 141-4 of the housing 140 may correspond to the first sides 110b-1 of the bobbin 110, and the corner portions 142-1 to 142- of the housing 140. 4) may correspond to the second sides 110b-2 of the bobbin 110, but is not limited thereto.

A magnet 130 (130-1 to 130-4) may be disposed or installed on at least one of the side portions 141-1 to 141-4 of the housing 140, and the corner portions 142- of the housing 140. 1 to 142-4), support portions 220 (220-1 to 220-4) may be disposed.

The housing 140 may include a seating portion 141a provided on the inner surfaces of the side portions 141-1 to 141-4 to support or accommodate the magnets 130-1 to 130-4.

The side portions 141-1 to 141-4 of the housing 140 have grooves or grooves for injecting adhesive for attaching the magnets 130-1 to 130-4 to the seating portion 141a of the housing 140. A hole 63 may be provided. For example, the hole 63 may be a through hole.

The side portions 141 - 1 to 141 - 4 of the housing 140 may be arranged parallel to the side plates of the cover member 300 . Holes 147a through which the support portion 220 passes may be provided in the corner portions 142-1 to 142-4 of the housing 140.

For example, in order to easily apply the damper, the diameter of the hole 147a may gradually increase from the bottom to the top of the housing 140, but it is not limited thereto. In another embodiment, the hole 147a has a diameter of This may be constant.

Additionally, in order to prevent direct collision with the inner surface of the cover member 300, a stopper 144 may be provided on the upper surface of the housing 140. For example, the stopper 144 may have a structure that protrudes upward from the upper surface of at least one of the side portions 141-1 to 141-4 of the housing 140, but is not limited thereto. In another embodiment, the stopper of the housing 140 may be disposed on at least one of the corner portions.

In addition, when the first elastic part 150 is disposed on the upper surface of the housing 140, it guides the installation position of the first outer frame 152 of the first elastic part 150 and is directly installed on the inner surface of the cover member 300. To prevent collision, the housing 140 may be provided with a second guide portion 146 on its upper surface.

The housing 140 is provided on the upper surface of at least one of the corner portions 142-1 to 142-4 for coupling to the holes 152a and 152b of the first outer frame 152 of the first elastic portion 150. It may be provided with at least one second upper protrusion 143.

The second upper protrusion 143 may be disposed on at least one of one side and the other side of the second guide portion 146 of the housing 140.

In addition, the housing 140 has side portions 141-1 to 142-4 or/and corner portions 142 for coupling and fixing the hole 162a of the second outer frame 162 of the second elastic portion 160. -1 to 142-4)) may be provided with at least one second lower protrusion (not shown) provided on the lower surface.

The housing 140 is provided at the lower part of the corner portions 142-1 to 142-4 not only to secure the path through which the support portion 220 passes, but also to secure space for filling silicon that can act as a damping. It may be provided with a groove (142a). For example, the groove 142a of the housing 140 may be filled with damping silicon.

The housing 140 may be provided with a stopper 149 provided on the outer surface of at least one of the side portions 141-1 to 141-4. The stopper 149 is such that when the housing 140 moves in the second direction and/or the third direction, the outer surface of the sides 141-1 to 141-4 of the housing 140 is the side plate of the cover member 300. This is to prevent direct conflict with the inner surface of the body.

In order to prevent the bottom surface of the housing 140 from colliding with the base 210, the second coil 230, and/or the circuit board 250, which will be described later, the housing 140 is provided with a stopper (not shown) protruding from the bottom. ) may be further provided.

The housing 140 may include a groove 145 provided on the inner surface of the corner portions 142-1 to 142-4 corresponding to the protrusion 25 of the bobbin 110.

Next, the magnet 130 will be described.

In the initial position of the bobbin 110, the magnet 130 is positioned on the sides of the housing 140 such that at least a portion overlaps the first coil 120 in a direction perpendicular to the optical axis OA or in a second or third direction. It can be placed at (141-1 to 141-4). For example, the magnet 130 may be inserted or placed within the seating portion 141a of the housing 140.

Here, the initial position of the bobbin 110 is the initial position of the AF movable part (e.g., bobbin) without applying power or a driving signal to the first coil 120, and the first elastic part 150 and the second elastic part As the unit 160 is elastically deformed only by the weight of the AF movable unit, it may be a position where the AF movable unit is placed.

In addition, the initial position of the bobbin 110 is the position at which the AF movable part is placed when gravity acts in the direction from the bobbin 110 to the base 210, or, conversely, when gravity acts in the direction from the base 210 to the bobbin 110. It can be.

In another embodiment, the magnet 130 may be disposed on the outer surface of the side portions 141-1 to 141-4 of the housing 140. Alternatively, in another embodiment, the magnet 130 may be disposed on the inner or outer surface of the corner portions 142-1 to 142-4 of the housing 140.

The shape of the magnet 130 may be a rectangular parallelepiped shape corresponding to the side portions 141-1 to 141-4 of the housing 140, but is not limited thereto. The surface facing the first coil 120 may be formed to correspond to or match the curvature of the corresponding surface of the first coil 120.

The magnet 130 may be a unipolar magnetized magnet arranged so that the first side facing the first coil 120 is the N pole, and the second side opposite the first side is the S pole. However, this is not limited, and it is also possible to configure the polarity to be reversed. Alternatively, in another embodiment, each of the first and second surfaces of the magnet 130 may be divided into an N pole and an S pole.

Alternatively, in another embodiment, the magnet 130 may be a bipolar magnetized magnet divided into two in a direction perpendicular to the optical axis. At this time, the magnet 130 may be implemented as a ferrite, alnico, or rare earth magnet.

For example, the magnet 130 may include a first magnet portion, a second magnet portion, and a non-magnetic partition. The first magnet portion and the second magnet portion may be spaced apart from each other, and the non-magnetic partition wall may be located between the first magnet portion and the second magnet portion.

The non-magnetic barrier rib is a portion that is substantially non-magnetic and may include a section with little polarity, and may be filled with air or made of a non-magnetic material.

In the embodiment, the number of magnets 130 is four, but the number is not limited thereto, and the number of magnets 130 may be at least two, and the first surface of the magnet 130 facing the first coil 120 may be a flat surface, but this is not limited and may also be a curved surface.

At least two magnets 130 may be placed on sides of the housing 140 facing each other, and may be placed to face each other.

The plane of each of the magnets 130-1 to 130-4 may have a substantially square shape, or alternatively, it may have a triangular or diamond shape.

In another embodiment, the housing 140 may be omitted, and the magnets 130-1 to 130-4 may be disposed on the cover member 300. In another embodiment, the housing 140 is not omitted, and the magnets 130-1 to 130-4 may be disposed on the cover member 300.

Alternatively, in another embodiment, the magnets 130-1 to 130-4 may be disposed on the inner surfaces of the side plates of the cover member 300.

Next, the first elastic part 150, the second elastic part 160, and the support part 220 will be described.

The first elastic part 150 and the second elastic part 160 are coupled to the bobbin 110 and the housing 140 and support the bobbin 110.

The first elastic part 150 is disposed on the top or upper surface of the bobbin 110 and may be an upper elastic body.

The second elastic part 160 is disposed on the lower or lower surface of the bobbin 110 and may be a lower elastic body.

For example, the first elastic part 150 may be coupled to the top, top surface, or top of the bobbin 110 and the top, top surface, or top of the housing 140, and the second elastic part 160 may be coupled to the bobbin 110. ) can be combined with the lower part, lower surface, or lower end of the housing 140.

The support portion 220 may support the housing 140 with respect to the base 210 and electrically connect at least one of the first elastic portion 150 or the second elastic portion 160 to the circuit board 250. there is.

At least one of the first elastic part 150 or the second elastic part 160 may be divided or separated into two or more parts.

For example, the first elastic portion 150 may include first to fourth upper springs 150-1 to 150-4 that are spaced apart or separated from each other.

The first elastic part 150 and the second elastic part 160 may be implemented as leaf springs, but are not limited thereto, and may also be implemented as coil springs, suspension wires, etc.

Each of the first to fourth upper springs 150-1 to 150-4 is connected to the top, upper surface, or top of the bobbin 110, the first inner frame 151, the upper surface of the housing 140, Alternatively, it may include a first outer frame 152 coupled to the top, and a first frame connection portion 153 connecting the first inner frame 151 and the first outer frame 152.

The first inner frame 151 may be provided with a hole 151a for coupling the first upper protrusion 113 of the bobbin 110, and the hole 151a may be provided with at least one adhesive member or damper for penetration. It may have an incision.

The first outer frame 152 of each of the first to fourth upper springs 150-1 to 150-4 includes a first coupling portion 510 coupled to the support portions 220-1 to 220-6, and a housing ( A second coupling portion 520 coupled to at least one of the corner portions 141-1 to 141-4 and/or adjacent sides of 140, and the first coupling portion 510 and the second coupling portion ( It may include a connection portion 530 connecting the 520).

The second coupling portion 520 may include at least one coupling area coupled to the corner portions 142-1 to 142-4 (eg, the second upper protrusion 143) of the housing 140. For example, at least one coupling region may include a hole 152a.

For example, the second coupling portion 520 includes a first coupling region located on one side of the second guide portion 146 of the housing 140 and a second coupling region located on the other side of the second guide portion 146. It may include, but is not limited to this.

Each of the coupling areas of the second coupling portion 520 of the first to fourth upper springs 150-1 to 150-4 is implemented to include a hole, but is not limited thereto, and in another embodiment, the coupling region They may be implemented in various shapes sufficient to be combined with the housing 140, for example, in the form of a groove.

For example, the hole 152a of the second coupling portion 520 may have at least one cut portion for allowing an adhesive member or damper to penetrate between the second upper protrusion 143 and the hole 152a.

The first coupling portion 510 may have a hole through which the support portions 220-1 to 220-4 pass. One end of the support portions 220-1 to 220-5 that pass through the hole of the first coupling portion 510 may be coupled to the first coupling portion 510 by a conductive adhesive member or solder 910, and the first The coupling portion 510 and the support portions 220-1 to 220-4 may be electrically connected.

The first coupling portion 510 is an area where the solder 910 is disposed and may include a hole and an area around the hole.

The connection part 530 may connect the first coupling part 510 with the coupling area of the second coupling part 520 disposed in the corner portions 142-1 to 142-4.

For example, the connection portion 530 connects the first coupling region and the first coupling portion 510 of the second coupling portion 520 of each of the first to fourth upper springs 150-1 to 150-4. It may include one connection part 530-1 and a second connection part 530-2 connecting the second coupling area of the second coupling part 520 and the first coupling part 510.

The connection portion 530 may include a bent portion that is bent at least once or a curved portion that is bent at least once, but is not limited thereto, and may have a straight shape in another embodiment.

The width of the connection portion 530 may be narrower than the width of the second coupling portion 520, and because of this, the connection portion 530 may be easily moved in the first direction, and as a result, the connection portion 530 may be applied to the first elastic portion 150. The stress and the stress applied to the support portion 220 can be distributed.

Additionally, in order to support the housing 140 in a balanced manner so that it is not biased to one side, the connection portion 530 may be left and right symmetrical with respect to the reference line, but the connection portion 530 is not limited thereto, and may not be left and right symmetrical in other embodiments.

For example, one end of the first coil 120 is coupled to the first inner frame 151 of the second upper spring 151-2 by soldering, and the first inner frame of the fourth upper spring 151-4 ( The other end of the first coil 120 may be coupled to 151).

The second elastic portion 160 includes a second inner frame 161 coupled to the lower, lower, or lower end of the bobbin 110, and a second outer frame 162 coupled to the lower, lower, or lower end of the housing 140. ), and a second frame connection portion 163 connecting the second inner frame 161 and the second outer frame 162.

In addition, the second elastic portion 160 is disposed on the second inner frame 161, and has a hole 161a coupled to the first lower protrusion of the bobbin 110 by solder or a conductive adhesive member, and the second outer frame 162. ) and may be provided with a hole 162a coupled to the second lower protrusion of the housing 140.

Each of the first and second frame connection parts 153 and 163 of the upper and second elastic parts 150 and 160 may be bent or curved at least once to form a pattern of a certain shape. . The bobbin 110 may be elastically (or elastically) supported in an upward and/or downward motion in the first direction through a change in position and slight deformation of the first and second frame connectors 153 and 163.

In order to absorb and buffer the vibration of the bobbin 110, the lens driving device 100 uses a first damper (not shown) disposed between each of the upper springs 150-1 to 150-4 and the housing 140. More can be provided.

For example, the lens driving device 100 includes a first damper (not shown) disposed in the space between the first frame connection portion 153 of each of the upper springs 150-1 to 150-4 and the housing 140. can do.

Also, for example, the lens driving device 100 may further include a second damper (not shown) disposed between the second frame connection portion 163 of the second elastic portion 160 and the housing 140.

Also, for example, the lens driving device 100 may further include a third damper (not shown) disposed between the support part 220 and the hole 147a of the housing 140.

Also, for example, the lens driving device 100 may further include a fourth damper (not shown) disposed at one end of the first coupling portion 510 and the support portion 220.

Additionally, for example, a damper (not shown) may be further disposed between the inner surface of the housing 140 and the outer peripheral surface of the bobbin 110.

Next, the support portion 220 will be described.

One end of the support part 220 may be connected to the elastic part 150, and the other end may be connected to the terminal (1081a, 1081b, 1081c, or 1081d).

One end of the support part 220 may be coupled to the first outer frame 152 of the first elastic part 150 by solder or a conductive adhesive member.

There may be a plurality of support parts 220, and each of the plurality of support parts 220-1 to 220-6 is connected to the corresponding one of the upper springs 150-1 to 150-4 through the solder 901. 1 may be coupled to the coupling portion 510 and may be electrically connected to the first coupling portion 510. For example, each of the plurality of support parts 220-1 to 220-4 may be disposed on a corresponding one of the four corner parts 142-1 to 142-4.

The plurality of support parts 220-1 to 220-4 may support the bobbin 110 and the housing 140 so that the bobbin 110 and the housing 140 can move in a direction perpendicular to the first direction. In FIG. 5, one support portion is disposed at each of the corner portions 142-1 to 142-4 of the housing 140, but the present invention is not limited thereto.

In another embodiment, two or more support parts may be disposed at one corner of the housing 140.

Each of the plurality of supports (220-1 to 220-4) may be spaced apart from the housing 140, and is not fixed to the housing 140, but is attached to each of the upper springs (150-1 to 150-4). 1 It can be directly connected to the first coupling portion 510 of the outer frame 152.

In another embodiment, the support portion 220 may be disposed in the form of a leaf spring on the side portions 141-1 to 141-4 of the housing 140.

A driving signal may be transmitted from the circuit board 250 to the first coil 120 through a plurality of supports 220-1 to 220-4 and upper springs 150-1 to 150-4.

For example, the first coil 120 is connected from the circuit board 250 through the second and fourth upper springs 150-2 and 150-4 and the second and fourth supports 220-2 and 220-4. A driving signal may be provided.

The plurality of support parts 220-1 to 220-4 may be formed as a separate member from the first elastic part 150, and may be supported by elasticity, such as a leaf spring or coil. It can be implemented with springs (coil springs), suspension wires, etc. Additionally, in another embodiment, the support portions 220-1 to 220-4 may be formed integrally with the first elastic portion 150.

Next, the base 210, circuit board 250, second coil 230, and position sensor 240 will be described.

The base 210 may have an opening corresponding to the opening of the bobbin 110 and/or the opening of the housing 140, and may have a shape that matches or corresponds to the cover member 300, for example, a square shape. .

FIG. 6 is a perspective view of the second coil 230, the circuit board 250, and the supports 220-1 to 220-4, and FIG. 7 shows the circuit board 250 disposed on the base 210 and the second coil 250. It is an exploded perspective view of the coil 230, FIG. 8 is a partial enlarged view of the base 210 and the circuit board 250 shown in FIG. 7, and FIG. 9 is a circuit member 231 including the second coil 230. 10A shows an exploded perspective view of the base 210, the position sensor 240, and the terminals 1081a to 1081d, FIG. 10B shows a bottom view of the base 210, and FIG. 10C shows the base 210. This is a perspective view of the combination of (210) and terminals (1081a to 1081d).

Referring to FIGS. 6 to 10C , the base 210 may be provided with a step 211 on which adhesive can be applied when fixing the cover member 300 by adhesive. At this time, the step 211 may guide the cover member 300 coupled to the upper side and face the lower end of the side plate of the cover member 300.

The base 210 may be disposed below the bobbin 110 and the housing 140, and has a support groove or support portion 255 on the side opposite to the portion of the circuit board 250 where the terminal 251 is formed, see FIG. 10A. ) can be formed. The support portion 255 of the base 210 may support the terminal surface 253 of the circuit board 250.

The upper surface of the base 210 may be provided with seating grooves 215-1 and 215-2 in which the position sensor 240 mounted on the circuit board 250 can be placed or seated. According to the embodiment, the base 210 may be provided with two seating grooves 215-1 and 215-2.

The second coil 230 may be placed at the top and the base 210 may be placed at the bottom of the circuit board 250.

For example, the position sensor 240 may be mounted on the lower surface of the circuit board 250, and the lower surface of the circuit board 250 may face the upper surface of the base 210.

The circuit board 250 is located below the housing 140 and may be disposed on the top surface of the base 210 and may be located at an opening in the bobbin 110, an opening in the housing 140, or/and an opening in the base 210. It may be provided with an opening corresponding to .

The shape of the outer peripheral surface of the circuit board 250 may be consistent with or correspond to the upper surface of the base 210, for example, a square shape.

The circuit board 250 may be bent from the upper surface and may have at least one terminal surface 253 provided with a plurality of terminals 251 or pins for electrical connection to the outside.

A plurality of terminals 251 may be installed on the terminal surface 253 of the circuit board 250. For example, a driving signal for driving the first coil 120, the second coil 230, and the position sensor 240 through a plurality of terminals 251 installed on the terminal surface 253 of the circuit board 250. can receive.

According to the embodiment, the circuit board 250 may be provided as an FPCB, but this is not limited.

The circuit board 250 may include a hole 250a through which the supports 220-1 to 220-4 pass. The hole 250a may be placed adjacent to the corners of the circuit board 250.

The positions and numbers of the holes 250a may correspond to or coincide with the positions and numbers of the supports 220-1 to 220-4.

Each of the supports 220-1 to 220-4 passes through a corresponding one of the holes 250a of the circuit board 250 and may be arranged to be spaced apart from the inner surface of the corresponding hole 250a. In FIG. 7, the hole 250a is exemplified for the support parts 220-1 to 220-4 to pass through, but the hole 250a is not limited thereto. In another embodiment, the circuit board 250 has the support parts 220-1 to 220-4. 4) It may be provided with an opening or escape groove of a shape sufficient to allow the material to pass through.

The second coil 230 may be located below the housing 140 and disposed on the upper part of the circuit board 250 to correspond to the magnet 130 disposed in the housing 140.

For example, the second coil 230 may include four OIS coils 230-1 to 230-4 disposed corresponding to each of the four sides of the circuit board 250, but is not limited thereto. , only two, such as one for the second direction and one for the third direction, may be installed, or four or more may be installed.

In FIG. 7, the second coil 230 is implemented in a form provided on a circuit member 231 separate from the circuit board 250, but is not limited thereto. In another embodiment, the second coil 230 is provided on a circuit board. It may also be implemented in the form of a circuit pattern formed at 250.

Alternatively, in another embodiment, the circuit member 231 may be omitted, and the second coil 230 may be implemented in the form of a ring-shaped coil block separately from the circuit board 250, or in the form of an FP coil. .

The circuit board 250 and the circuit member 231 are represented as separate components, but are not limited thereto, and in another embodiment, the circuit board 250, the circuit member 231, and the second coil 230 ) may be expressed as a “circuit member”.

An escape groove 230a may be provided at a corner of the circuit member 231 where the second coil 230 is provided, and the escape groove 230a may be in the form of a chamfered corner of the circuit member 231. Additionally, in another embodiment, a hole through which the support portion 220 can pass may be provided at a corner of the circuit member 231.

As described above, the housing 140 may be moved in the second and/or third directions due to the interaction between the corresponding magnets 130 and the second coil 230, and as a result, hand shake correction may be performed. .

The position sensor 240 can detect the strength of the magnetic field of the magnet 130 disposed in the housing 140 as the housing 140 moves in a direction perpendicular to the optical axis, and generates an output signal (e.g. , output voltage) can be output.

Based on the output signal of the position sensor 240, the displacement of the housing 140 with respect to the base 210 may be detected in a direction perpendicular to the optical axis (e.g., Z-axis) (e.g., X-axis or Y-axis). .

The position sensor 240 is configured to detect the displacement of the housing 140 in a second direction perpendicular to the optical axis (e.g., X-axis) and a third direction perpendicular to the optical axis (e.g., Y-axis). It may include position sensors 240a and 240b.

For example, the position sensor 240a for OIS may detect the strength of the magnetic field of the magnet 130 as the housing 140 moves, and output a first output signal according to the detected result, and the position sensor for OIS ( 240b) may detect the strength of the magnetic field of the magnet 130 as the housing 140 moves and output a second output signal according to the detected result. The control unit 830 of the camera module or the control unit 780 of the portable terminal 200A may detect the displacement of the housing 140 based on the first output signal and the second output signal, and the detected displacement of the housing 140 OIS feedback driving can be performed based on displacement.

Each of the position sensors 240a and 240b for OIS can be provided as a Hall sensor, and any sensor that can detect the magnetic field strength can be used. For example, each of the position sensors 240 for OIS may be implemented in the form of a driver including a Hall sensor, or may be implemented solely as a position detection sensor such as a Hall sensor.

Each of the OIS position sensors 240a and 240b is mounted on the circuit board 250, and the circuit board 250 may be provided with terminals electrically connected to the OIS position sensors 240a and 240b.

A protrusion 29 may be provided on the upper surface around the opening of the base 210, and the protrusion 29 may be inserted into the opening of the circuit board 250 and the opening of the circuit member 231.

Additionally, a protrusion 29a (see FIG. 13A) protruding in a direction perpendicular to the optical axis may be provided on the side of the protrusion 29 of the base 210, and a protrusion corresponding to the protrusion 29a may be provided in the opening of the circuit board 250. A groove 250b (see FIG. 13B) may be provided. The protrusion 29a of the base 210 may be inserted into the groove 250b of the circuit board 250, by combining the protrusion 29a of the base 210 and the groove 250b of the circuit board 250. The circuit board 250 may be prevented from rotating or moving on the upper surface of the base 210.

Referring to FIG. 7 , the circuit board 250 may include a plurality of pad portions 41 to 44 disposed on the top surface. Here, in the pad portions 41 to 44 of the circuit board 250, the term pad portion may be replaced with the term “bonding portion, electrode portion, lead portion, or terminal portion.”

For example, each of the plurality of pad parts 41 to 44 may be located adjacent to a corresponding one of the holes 250a of the circuit board 250.

Each of the plurality of pad parts 41 to 44 may be positioned lower than the top surface of the circuit board 250. For example, a step d1 may exist in the optical axis direction between the upper surface of the plurality of pad portions 41 to 44 and the upper surface of the circuit board 250. For example, the step d1 may be 35 mm to 40 mm. For example, the step d1 may be 37.5 mm.

The circuit board 250 may include an exposed area 14a exposing a plurality of pad portions 41 to 44. The upper surface of the exposed area 14a may be located on the same plane as the upper surface of the pad portion (eg, 41) exposed by the exposed area 14a.

For example, the top surface of the exposed area 14a may be located lower than the top surface of the circuit board 250, and a step may exist in the optical axis direction between the top surface of the exposed area 14a and the top surface of the circuit board 250.

The exposed area 14a of the circuit board 250 may be in contact with the grooves 71a to 71d of the circuit board 250, and may be exposed or open to the side of the circuit board 250 or the grooves 71a to 71d. there is. Since the exposed area 14a may be exposed or opened to the side of the circuit board 250, the solder can easily penetrate into the pad portions 41 to 44 of the circuit board 250 through the exposed area 14a during soldering. Solderability can be improved.

The circuit board 250 may include a plurality of grooves 71a to 71d provided on a side surface. The grooves 71a to 71d of the circuit board 250 are part of the terminals 1081a to 1081d mounted on the base 210, for example, a part (or exposed area) of the second coupling portion 320 (FIG. 11a) ( 321) may be intended to expose it.

The grooves 71a to 71d are in the form of via holes or grooves with open sides of the circuit board 250, but are not limited thereto, and may be in the form of through holes or through vias in other embodiments. At this time, the through hole or through via may be spaced apart from the side of the circuit board 250.

Referring to FIG. 9 , the circuit member 231 may include a plurality of pad parts 35a to 35d disposed on the lower surface corresponding to the plurality of pad parts 41 to 44 of the circuit board 250. In the pad portions 35a to 35 of the circuit member 231, the term pad portion may be replaced with the term “bonding portion, electrode portion, lead portion, or terminal portion.”

Each of the pad portions 35a to 35d of the circuit member 231 may be in contact with or adjacent to one of the corresponding escape grooves 230a of the circuit member 231.

Each of the pad portions 35a to 35d of the circuit member 231 may be positioned higher than the lower surface of the circuit member 231. For example, a step d2 may exist in the optical axis direction between the lower surfaces of the plurality of pad portions 35a to 35d and the lower surfaces of the circuit member 231. For example, the step d2 may be 35 mm to 40 mm. For example, the step d2 may be 37.5 mm.

A portion of each of the pad portions 35a to 35d of the circuit member may overlap with a corresponding one of the plurality of pad portions 41 to 44 in the optical axis direction. The other portion of the pad portions 41 to 44 of the circuit board 250 that do not overlap with the pad portions 35a to 35d of the circuit member 231 in the optical axis direction is connected to the circuit member 231 by the escape groove 230a. can be exposed from This is to couple the pad portions 41 to 44 and the pad portions 35a to 35d through soldering.

The step d1 between the upper surface of the pad portions 41 to 44 of the circuit board 250 and the upper surface of the circuit board 250 and the pad portions 35a to 35d of the circuit member 231 and the circuit member 231 The separation distance or the size of the space between the pad portions 41 to 44 of the circuit board 250 and the pad portions 35a to 35d of the circuit member 231 may increase due to the step d2 between the lower surfaces.

Due to this, when soldering the pad portions 41 to 44 of the circuit board 250 and the pad portions 35a to 35d of the circuit member 231, the pad portions 41 to 44 of the circuit board 250 and the circuit member 231 ), solder can easily penetrate between the pad portions 35a to 35d, and solderability can be improved.

Referring to FIG. 10A, the base 210 may include side portions 90a to 90d and corner portions 91a to 91d.

For example, the base 210 includes a first side 90a, a second side 90b, a third side 90c, a fourth side 90d, and a space between the first side 90a and the second side 90b. The first corner portion 91a, the second corner portion 91b between the second side portion 90b and the third side portion 90c, and the third corner portion between the third side portion 90c and the fourth side portion 90d. (91c), and a fourth corner portion (91d) between the fourth side portion (90d) and the first side portion (90a).

The side portions 90a to 90d of the base 210 may correspond to or overlap the side portions 141-1 to 141-4 of the housing 140 in the optical axis direction, and the corner portions 91a to 90d of the base 210. 91d) may correspond to or overlap the corner portions 142-1 to 142-4 of the housing 140 in the optical axis direction.

Holes 210a may be provided in the corner portions 91a to 91d of the base 210 for the support portions 220-1 to 220-1 to pass through.

For example, a hole 210a may be provided in each of the corner portions 91a to 91d of the base 210 through which a corresponding one of the support portions 220-1 to 220-4 passes. For example, the hole 210a may be a through hole penetrating the corner portions 91a to 91d.

A step portion 26 for mounting or inserting the terminals 1081a to 1081d may be provided at each of the corner portions 91a to 91d of the base 210. The step portion 26 may be recessed in the lower surface of the base 210 and may be expressed as a “groove portion.”

The stepped portion 26 of the base 210 may be provided on the lower, lower, or lower surface of each of the corner portions 91a of the base 210, and may be provided on the lower surface 21a of the base 210. The upper surface 21b may have at least one step from the lower surface of the base 210 in the direction.

The stepped portion 26 of the base 210 is provided with a hole 210a for the support portion to pass through, and a hole 22a for exposing a portion of the terminals 1081a to 1081d to the upper surface 21b of the base 210. can do.

For example, the stepped portion 26 of the base 210 may include a first side 26a, a second side 26b, a first side 27a, and a second side 27b.

For example, the first surface 26a of the step portion 26 has a first step T1 with the lower surface of the base 210 in the direction from the lower surface 21a of the base 210 to the upper surface 21b, and the base 210 ) may be parallel to the lower surface (26a).

For example, the second surface 26b of the step portion 26 has a second step T2 with the lower surface of the base 210 in the direction from the lower surface 21a of the base 210 to the upper surface 21b, and the base 210 ) may be parallel to the lower surface (26a).

For example, the second step T2 may be smaller than the first step T1 (T2<T1), and the second surface 26b of the step portion 26 is between the first surface 26a and the base 210. It may be located between the lower surfaces (26a).

The first side 27a of the step portion 26 may connect the first side 26a and the second side 26b of the step portion 26, and may connect the first side 26a and the first side 26a at a certain angle (for example, a right angle). It may be a slope inclined as much as ).

The second side 27b of the step portion 26 connects the lower surface 26a of the base 210 and the second side 26b of the step portion 26 and has a predetermined angle with the second side 26b (e.g., It may be a slope inclined at a right angle.

For example, the second surface 26b and the second side 27b of the stepped portion 26 may form one groove shape, and the first surface 26a and the first side 27a of the stepped portion 26 may form one groove. can form another groove shape.

The hole 210a of the base 210 may be disposed or located on the first surface 26a of the step portion 26.

Additionally, a protrusion 28 may be provided on the first surface 26a of the base 210 to be coupled to the hole 311 of the terminals 1081a to 1081d. The protrusion 28 may protrude from the first surface 26a of the base 210 in the direction from the upper surface 21b to the lower surface 21a of the base 210.

The coupling force between the terminals 1081a to 1081d and the base 210 can be improved by combining the protrusion 28 of the base 210 and the hole 311 of the terminals 1081a to 1081d.

The base 210 may have a hole 22a disposed or located on the second surface 26b of the step portion 26. The hole 22a may penetrate the upper surface 21b of the base 210 and the second surface 26b of the step 26, and a portion of the terminals 1081a to 1081d may pass through the hole 22a to the base ( It may be exposed or opened from the upper surface 21b of 210).

Next, the terminals 1081a to 1081d will be described.

Terminals 1081a to 1081d are disposed or mounted on the lower, lower, or lower surface of the base 210. The number of terminals may correspond to the number of supports, but is not limited thereto. Terminals 1081a to 1081d may be expressed as terminal members or terminal units.

For example, the embodiment may include first to fourth terminals 1081a to 1081d corresponding to the first to fourth support portions 220-1 to 220-4.

For example, the first to fourth terminals 1081a to 1081d may be disposed at four corners or four corner portions of the base 210.

FIG. 11A is a perspective view of the first terminal 1081a and the first support part 220-1 according to an embodiment, and FIG. 11B is a perspective view of the first terminal of FIG. 11A.

The description of the first terminal 1081a shown in FIGS. 11A and 11B may be equally applied to the remaining second to fourth terminals 1081b to 1081d.

Referring to FIGS. 11A and 11B , the first terminal 1081a may include a first coupling portion 310, a second coupling portion 320, and a connecting portion 315. The first coupling portion 310 may be expressed as a “first connector” or a “first portion,” and the second coupling portion 320 may be expressed as a “second connector” or a “second portion.” Alternatively, the connection portion 315 may be expressed as a “third connector” or a “third portion.”

For example, the connection portion 315 is a portion of one side of the first coupling portion 310 (hereinafter referred to as “first side 20a”) and one side of the second coupling portion 320 (hereinafter referred to as “first side (20a)”. Part of “20b)” can be connected.

The connection portion 315 may include a curved portion, a bent portion, and/or a bending portion.

For example, the connection portion 315 may include a bent shape or a curved shape from the first coupling portion 310, but is not limited thereto. In other embodiments, the connection portion may be in the form of a straight plate or a flat plate.

By having the connection portion 315 have a curved or bending portion, the length of the connection portion 315 can be increased, thereby improving the effect of suppressing heat transfer by the connection portion 315.

The connection part 315 may protrude or extend from the first side 20a of the first coupling part 310, and may protrude or extend from the first side 20b of the second coupling part 320.

For example, one end of the connecting portion 315 may protrude or extend from a portion of the first side 20a of the first coupling portion 310, and the other end of the connecting portion 315 may be connected to the second coupling portion 320. 1 It may protrude or extend in some areas of the side 20b.

For example, the ratio of the cross-sectional area (eg, 0.01 [mm2]) of the connecting portion 315 in the optical axis direction and the area of the first side 20a of the first coupling portion 310 may be 1:5 to 1:8.

Also, for example, the ratio of the cross-sectional area of the connecting portion 315 and the area of the first side 20b of the second coupling portion 320 in the optical axis direction may be 1:4 to 1:6.

The connection portion 315 may be formed integrally with the first coupling portion 310 and the second coupling portion 320, but is not limited thereto. In another embodiment, the connection part may be assembled to the base 210 in a separate configuration from the first coupling part 310 and the second coupling part 320, and may be placed on the side of the base 210.

The second coupling portion 320 may be disposed between the base 210 and the circuit board 250, the first coupling portion 310 may be disposed lower than the second coupling portion 320, and the connecting portion 315 ) may connect the first coupling portion 310 and the second coupling portion 320 in a diagonal direction from the first coupling portion 310 to the second coupling portion 320.

The upper surface of the second coupling part 320 may be exposed to the upper surface of the base 210, and the lower surface of the first coupling part 310 may be exposed to the lower surface of the base 210.

In FIG. 11B, the second coupling portion 320 may have a hexahedral flat shape, but is not limited thereto. For example, the shape of the upper surface of the second coupling portion 320 may be a polygon such as a square, a circular shape, an oval shape, a semi-circle shape, a semi-elliptical shape, or a fan shape, but is not limited thereto.

A groove may be provided on the first side 20a of the first coupling portion 310 for engaging with the protrusion provided on the first side 27a of the step portion 26 of the base 210, thereby causing the first coupling. The coupling force between the part 310 and the base 210 can be improved.

Also, for example, the shape of the upper surface of the second coupling portion 320 may include a shape that extends from the connecting portion 315 and whose area gradually increases as the distance from the connecting portion 315 increases.

The area of the first coupling part 310 (eg, the area of the upper surface) may be larger than the area of the second coupling part 320 (eg, the area of the upper surface).

For example, the area of the upper surface of the second coupling part 320 may be larger than the area of the upper surface of the connecting part 315.

The length (M4, see FIG. 11B) of the first coupling part 310 in the first horizontal direction may be greater than the length (M2) of the second coupling part 320 in the first horizontal direction (M4>M2).

For example, the first horizontal direction may be a direction parallel to the first side of the first coupling part 310, or a direction parallel to the first side of the second coupling part 320.

Alternatively, the first horizontal direction may be the vertical direction of the upper surface of the first coupling part 310 or the vertical direction of the upper surface of the second coupling part 320.

Alternatively, the first horizontal direction may be a direction from the first corner 91a of the base 210 to the fourth corner 91d.

Also, for example, the length (M3, see FIG. 11B) of the first coupling portion 310 in the second horizontal direction may be greater than the length (M1) of the second coupling portion 320 in the second horizontal direction (M3). >M1).

For example, the second horizontal direction may be perpendicular to the first horizontal direction, or may be a direction from the first corner 91a of the base 210 to the second corner 91b.

Or, the second horizontal direction is a direction from a virtual first plane that is the same plane as the first side of the first coupling portion 310 to a virtual second plane that is the same plane as the first side of the second coupling portion 320. This may be a direction perpendicular to the first and second planes.

The first coupling portion 310 may be located below the lower surface of the base 210 and may be located above the first holder 600 and the second holder 800 of the camera module 200 (see FIG. 18). there is.

The width K2 of the connection part 315 is the length M5 in the first horizontal direction of the first side 20a of the first coupling part 310 and the first side 20b of the second coupling part 320. may be smaller than the length (M2) in the first horizontal direction (K2<M5, M2).

The horizontal distance K1 between the first coupling part 310 and the second coupling part 320 in the second horizontal direction may be smaller than the length M1 of the second coupling part 320 in the second horizontal direction. (K1<M1).

For example, the horizontal distance K1 is between a virtual first plane that is the same plane as the first side of the first coupling portion 310 and a virtual second plane that is the same plane as the first side of the second coupling portion 320. It may be the shortest distance.

The length of the connecting portion 315 may be smaller than the length M1 of the second coupling portion 320 in the second horizontal direction.

For example, the length of the connection part 315 may be the shortest distance from the first side of the first coupling part 310 to the first side of the second coupling part 320.

Or, for example, the length of the connecting portion 315 is connected to the first coupling area 315a of the connecting portion 315 connected to the first side of the first coupling portion 310 and the first side of the second coupling portion 310. It may be the shortest distance between the second coupling regions 315b of the connecting portion 315.

Or, for example, the length of the connection part 315 may be a length extending from the first coupling part 310 to the second coupling part 320.

The area of the connection part 315 (eg, the area of the top surface) may be smaller than the area of the second coupling part 320 (eg, the area of the top surface).

For soldering between the second coupling portion 320 and the pad portion 257 of the circuit board 250, heat is applied to the second coupling portion 320 by a hot air gun, and the heat applied to the second coupling portion 320 is It may be conducted to the first coupling part 310 through the connecting part 315.

However, since the area of the first coupling portion 310 is larger than the area of the second coupling portion 320, the heat conducted to the first coupling portion 310 may increase, and as a result, the solder does not melt well, causing the circuit Solder is not well transferred to the space (or gap) between the pad portion 257 and the second coupling portion 320 of the substrate 250, resulting in poor soldering between the second coupling portion 320 and the pad portion 257, for example. , cold soldering may occur.

In the embodiment, in order to maximize the melting point of lead or solder, the width K2 of the connecting portion 315, which is a path connecting the first coupling portion 310 and the second coupling portion 320, is narrowed, Heat transfer from the coupling portion 320 to the first coupling portion 310 can be suppressed, and the solder can be easily melted within a short period of time during soldering, thereby allowing the second coupling portion 320 and the pad to Soldering defects between the parts 257, such as cold soldering, can be prevented, and soldering reliability can be secured.

The length M3 of the first coupling portion 310 may be 1 [mm] to 2 [mm].

For example, the length M3 of the first coupling portion 310 may be 1.12 [mm].

The length M4 of the first coupling portion 310 may be 1 [mm] to 2 [mm].

For example, the length M4 of the first coupling portion 310 may be 1.17 [mm].

The length M1 of the second coupling portion 320 may be 0.3 [mm] to 0.5 [mm].

For example, the length M1 of the second coupling portion 320 may be 0.39 [mm].

The length (M2) of the second coupling portion 320 may be 0.3 [mm] to 0.5 [mm].

For example, the length M2 of the second coupling portion 320 may be 0.45 [mm].

For example, the length M2 of the second coupling portion 320 may be greater than the length M1 of the second coupling portion 310, but is not limited thereto. In another embodiment, the length M2 of the second coupling portion 320 may be equal to or smaller than the length M1 of the second coupling portion 310.

The horizontal distance K1 between the first coupling portion 310 and the second coupling portion 320 may be 0.15 [mm] to 0.25 [mm]. For example, the horizontal distance K1 may be 0.22 [mm].

Also, for example, the vertical distance (VL) between the first coupling part 310 and the second coupling part 320 may be 0.03 [mm] to 0.07 [mm]. For example, the vertical distance (VL) may be the shortest distance between a virtual third plane that is the same plane as the upper surface of the first coupling portion 310 and a virtual fourth plane that is the same plane as the lower surface of the second coupling portion 310. there is.

The vertical distance (VL) may be smaller than the width (K2) of the connection portion 315 (VL<K2). In another embodiment, the vertical distance (VL) may be equal to the width (K2) of the connection portion 315.

For example, if the horizontal distance (K1) is less than 0.15 [mm], the length of the connection portion 315 is shortened, so the heat transfer inhibition effect is reduced, and cold soldering cannot be prevented, and if the vertical distance (K1) is more than 0.25 [mm], the heat transfer inhibition effect is reduced. In this case, the length of the connection portion 315 is increased, which weakens durability and may cause the connection portion 315 to break.

Also, for example, if the vertical distance (VL) is less than 0.03 [mm], the effect of extending the length of the connection portion by the bending portion may be minimal, and as a result, the heat transfer inhibition effect is reduced, making it impossible to prevent cold soldering.

For example, if the vertical distance (VL) exceeds 0.07 [mm], the length of the connection part 315 increases, durability weakens, and the connection part 315 may break.

The width K2 of the connection portion 315 may be 0.05 [mm] to 0.2 [mm].

For example, the width K2 of the connection portion 315 may be 0.1 [mm].

If the width K2 of the connection portion 315 is less than 0.05 [mm], the durability of the connection portion 315 may decrease and the connection portion 315 may be broken, which may cause an electrical disconnection. If the width K2 of the connection portion 315 exceeds 0.2 [mm], the heat transfer suppression effect is reduced and cold soldering cannot be prevented.

The thickness T11 of the first coupling portion 310 may be 0.08 [mm].

The thickness of the second coupling portion 320 may be the same as the thickness T11 of the first coupling portion 310.

The thickness T12 of the connection portion 315 may be 0.08 [mm].

For example, the thickness T12 of the connecting portion 315 may be the same as the thickness T11 of the first coupling portion 310, but is not limited thereto. In another embodiment, the thickness of the connecting portion 315 may be smaller than the thickness of the first coupling portion 310.

Also, for example, the ratio (A1:A2) of the upper surface area (A1) of the second coupling portion 310 and the upper surface area (A2) of the first coupling portion 310 may be 1:4 to 1:40. .

Also, for example, the ratio (A3:A1) of the upper surface area (A3) of the connecting portion 315 and the upper surface area (A1) of the second coupling portion 320 (A3:A1) may be 1:9 to 1:30.

If the value (A1/A3) divided by the area (A1) of the upper surface of the second coupling portion (320) by the area (A3) of the upper surface of the connecting portion (315) is less than 9, the heat transfer inhibition effect is reduced to prevent cold soldering. Can not.

On the other hand, when the area (A1) of the upper surface of the second coupling portion 320 divided by the area (A3) of the upper surface of the connecting portion 315 (A1/A3) is greater than 30, the durability of the connecting portion 315 is The connection part 315 may be broken and electrical disconnection may occur.

Additionally, the ratio (K2:M2) of the width K2 of the connecting portion 315 and the length M2 of the second coupling portion 320 (K2:M2) may be 1:1.5 to 1:10.

When the length M2 of the second coupling portion 320 divided by the width K2 of the connecting portion 315 (M2/K2) is less than 1.5, the heat transfer inhibition effect is reduced and cold soldering cannot be prevented.

When the length (M2) of the second coupling portion 320 divided by the width (K2) of the connecting portion 315 (M2/K2) is greater than 10, the durability of the connecting portion 315 decreases and the connecting portion 315 breaks. may occur, and electrical disconnection may occur.

The first coupling portion 310 may have a hole 305 through which a support portion (eg, 220-1) passes.

For example, the hole 305 of the first coupling portion 310 may be a through hole.

For example, the diameter R1 of the hole 305 may be 0.2 [mm] to 0.4 [mm]. For example, the diameter R1 of the hole 305 may be 0.3 [mm].

The diameter R1 of the hole 305 may be larger than the width K2 of the connection portion 315. Alternatively, in another embodiment, the diameter R1 of the hole 305 may be equal to the width K2 of the connection portion 315.

The diameter or thickness of each of the support parts 220-1 to 220-4 may be smaller than the width of the connection part 315.

For example, the diameter or thickness of each of the supports 220-1 to 220-4 may be 30 [㎛] to 70 [㎛]. For example, the diameter or thickness of each of the supports 220-1 to 220-6 may be 36 [μm] to 50 [μm].

The hole 305 of the first coupling portion 310 may correspond to the hole 210a of the base 210, and the base 210 may be formed in the direction of the optical axis or from the lower surface 21a of the base 210 to the upper surface 21b. ) may overlap with the hole 210a.

One end of the support part (eg, 220-1) may be coupled to the first coupling part 510 of the first outer frame 152 of the upper spring (eg, 150-1).

Additionally, the other end of the support portion (e.g., 220-1) passes through the hole 305 of the terminal (e.g., 1081a) and can be coupled to the lower surface of the first coupling portion 310 by solder 902 (see FIG. 14). .

For example, the lens driving device 100 may further include solder 902 that couples the other end of the support portion (e.g., 220-1) that passes through the hole 305 and the lower surface of the first coupling portion 310. .

The first coupling portion 310 may be disposed or located below the first surface 26a of the stepped portion 26 of the base 210.

The second coupling portion 320 is connected to one end of the first coupling portion 310 and may be disposed or positioned below the second surface of the stepped portion 26 of the base 210.

A portion 321 of the second coupling portion 320 may be exposed to the upper surface 21b of the base 210 through the hole 22a of the step portion 26. Hereinafter, a portion 321 of the second coupling portion 320 is referred to as an exposed area 321 of the second coupling portion 320.

Additionally, the first terminal 1081a may further include an extension portion 330 extending from the other end of the first coupling portion 310.

The extension portion 330 may be parallel to the first coupling portion 310, may be located on the same plane, and may be inserted into the interior of the base 210.

The extension portion 330 may improve the coupling force between the first terminal 1081a and the base 210.

for example. The length Q1 of the extension portion 330 in the second horizontal direction may be 0.2 [mm] to 0.8 [mm]. For example, the length Q1 of the extension portion 330 may be 0.5 [mm].

For example, the first coupling portion 310, the second coupling portion 320, and the extension portion 330 may be formed integrally. For example, the terminals 1081a to 1081d may be inserted into the base 210 using an insert injection method.

For example, the terminals 1081a to 1081d may be insert-molded with the base 210, and at least a portion of each of the first coupling portion 310 and the second coupling portion 320 may be inserted or disposed in the base 210. there is.

Also, for example, the terminals 1081a to 1081d may be insert-molded with the base 210, and the connection portion 315 may be disposed within the base.

In another embodiment, the terminal may be attached or coupled to the lower or upper surface of the base 210, rather than being insert-molded with the base.

Figure 11c shows a perspective view of the first terminal 1081a-1 and the first support portion 220-1 according to another embodiment. The description of the first terminal 1081a-1 described in FIG. 11C can be equally applied to the remaining second to fourth terminals.

Referring to FIG. 11C, the first coupling portion 310 may further include a hole 311 coupled to the protrusion 28 of the stepped portion 26 of the base 210. The hole 311 of the first coupling portion 310 is coupled to the protrusion 28 of the base 210 to improve the coupling force between the base 210 and the terminals 1081a to 1081d, as well as the first coupling portion 310. Solderability between the and support parts can be improved.

The larger the area of the first coupling portion 310, the better the heat is conducted to the surroundings of the first coupling portion 310 during soldering, so the support portion (e.g., 220-1) and the hole 305 of the first coupling portion 310 Soldering between joints may not work well. The hole 311 of the first coupling portion 310 suppresses conduction of heat during soldering, thereby improving solderability between the support portion (e.g., 220-1) and the hole 305 of the first coupling portion 310. there is.

Additionally, the coupling force between the base 210 and the first terminal 1081a can be improved by coupling between the hole 311 of the first coupling portion 310 and the protrusion 28 of the base 210.

12A to 12E show connection portions 315-1 to 315-5 of the first terminal 1081a-1 according to other embodiments. 12A to 12E show examples of connection parts having different types of widths.

Referring to Figure 12a, the width K21 of the connection portion 315-1 is connected to the second coupling portion 320 in the first coupling area of the connector 315-1 connected to the first coupling portion 310. It may increase in the direction of the second coupling area of the connection portion 315-1.

For example, the width of the first coupling area of the connection part 315-1 may be smaller than the width of the second coupling area of the connection part 315-1.

Referring to Figure 12b, the width K22 of the connection portion 315-2 is connected to the second coupling portion 320 in the first coupling area of the connector 315-1 connected to the first coupling portion 310. It may decrease in the direction of the second coupling area of the connection portion 315-1.

For example, the width of the first coupling area of the connection part 315-1 may be larger than the width of the second coupling area of the connection part 315-1.

Referring to FIG. 12C, the width of the connection portion 315-3 may decrease from the first coupling region to the second coupling region and then increase again.

For example, the widths of both ends of the connection portion 315-3 may be larger than the width of the center of the connection portion 315-3.

Referring to FIG. 12D, the first coupling area (or one end) of the connecting portion 315-4 may be connected to a portion of the first side of the first coupling portion 310, and the second coupling portion of the connecting portion 315-4 The region (or other end) may be connected to the entire first side of the second coupling portion 320.

For example, the width K24 of the connection part 315-4 may increase in the direction from the first coupling area to the second coupling area of the connection part 315-4.

Referring to FIG. 12E, the first coupling area (or one end) of the connecting portion 315-5 may be connected to the entire first side of the first coupling portion 310, and the second coupling portion of the connecting portion 315-5 may be connected to the entire first side of the connecting portion 315-5. The region (or the other end) may be connected to the entire first side of the second coupling portion 320.

For example, the width K25 of the connection portion 315-5 may decrease in the direction from the first coupling region to the second coupling region of the connection portion 315-5.

12A to 12E, the shape in which the width of the connection portions 315-1 to 315-5 increases may be a straight line that increases linearly or a curve that increases non-linearly.

For example, each of both sides of the connecting portions 315-1 to 315-5 may be a flat surface or a curved surface (eg, a concave curved surface or a convex curved surface).

FIG. 13A is a portion of a perspective view of the base 210, the first terminal 1081a, and the circuit board 250 coupled to each other, FIG. 13B is a bottom view of the circuit board 250, and FIG. 14 shows the terminal 1081a. to 1081d) and a solder 902 for coupling the support portions 220-1 to 220-4, FIG. 15 is a cross-sectional view of the pad portion 257 of the circuit board 250, and FIG. 16 is a FIG. This is a cross-sectional view in the AB direction of the lens driving device 100 shown in Figure 2.

13A to 16, the circuit board 250 may be disposed on the upper surface of the base 210, and each of the grooves 71a to 71d of the circuit board 250 is the upper surface 21b of the base 210. ) can expose one of the second coupling portions 320 of the terminals 1081a to 1081d exposed from the corresponding terminals 1081a to 1081d.

Also, as shown in FIGS. 6 and 7, each of the grooves 230a of the circuit member 231 is one of the second coupling portions 320 of the terminals 1081a to 1081d exposed to the upper surface of the base 210. Any corresponding upper surface can be exposed.

The circuit board 250 may include an upper portion, a lower portion, and a pad portion 257 disposed on a side surface between the upper portion and the lower portion.

The number of pad portions 257 may be plural, and may be disposed to correspond to the terminals 1081a to 1081d or may be disposed in positions corresponding to the terminals 1081a to 1081d. For example, the four pad portions 247 corresponding to the terminals 1081a to 1081d may be disposed at four corners or corner portions of the circuit board 250, but the present invention is not limited thereto.

In another embodiment, the pad portion may be disposed only on two corners or corner portions of the circuit board 250, and may be electrically connected to the two terminals 251 of the circuit board 250 to provide a driving signal to the first coil. It can be connected to . For example, the two corners where the pad portion is disposed may be diagonal corners of the circuit board or may be two corners adjacent to one side.

In another embodiment, four pad portions may be disposed at four corners or corner portions of the circuit board 250, and the pad portions disposed at the two corners may be soldered to terminals (e.g., 1081a, 1081b). may be electrically connected to the two terminals 251 of the circuit board 250, but the pad portions disposed at the remaining two corners are soldered to the terminals (e.g., 1081a, 1081b), but the circuit It may not be electrically connected to the terminals 251 of the board 250. This is to prevent problems such as mechanical tilt of the lens driving device from occurring by soldering all four pad terminals.

The pad portion 257 may be an Au plating layer or a copper plating layer containing Au.

For example, the pad portion 257 may be provided in each of the grooves 71a to 71d of the circuit board 250. Although FIG. 13A shows only the pad portion 257 provided in the groove 71a, the description of the pad portion 257 in FIG. 13A can be equally applied to pad portions provided in other grooves 71b to 71d.

The pad portion 257 of the circuit board 257 may be disposed on the top surface of the circuit board 250, the bottom surface of the circuit board 250, and the side connecting the top surface and bottom surface of the circuit board 250.

For example, the pad portion 257 is connected to the side of the groove (e.g., 71a), the upper surface of the circuit board 250 in contact with the side of the groove (e.g., 71a), and the circuit board 250 in contact with the side of the groove (e.g., 71a). ) can be placed on the bottom of the.

For example, the pad portion 257 of the circuit board 250 includes a first pad 259b disposed on the lower part of the circuit board 250 in contact with the side of the groove 71a, and a circuit board in contact with the side of the groove 71a ( It may include a second pad 259b disposed on the top of the groove 71a, and a third pad 605 disposed on the side of the groove 71a and connecting the first pad 259b and the second pad 259a. there is.

The third pad 605 may be disposed on the side of the circuit board 250.

Vias or grooves may be provided on the sides of the grooves 71a to 71d of the circuit board 250, and a portion of the pad portion 257 (e.g., the third pad 605) is disposed in the via or groove. It can be.

The third pad 605 of the pad portion 257 of the circuit board 250 may have a curved shape depressed from the side of the groove 71a, for example, a semicircular via shape.

For example, the radius of the via may be 0.1 mm to 0.5 mm, but is not limited thereto. For example, the radius of the via may be 0.2 mm to 0.3 mm. For example, the radius of the via may be 0.2 mm.

If the radius of the via is less than 0.1 mm, the improvement in adhesion and solderability between the pad portion 257 of the circuit board 250 and the terminal may be minimal, and if the radius of the via is more than 0.5 mm, the improvement of the terminals 1081a to 1081d may be minimal. Since the pad portion 257 is formed to be larger than necessary for soldering compared to the second coupling portion 320, the cost may increase and the freedom of the pattern of the circuit board 250 may be reduced.

The first red 259b of the pad portion 257 of the circuit board 250 may face the terminal (eg, 1081a) in the optical axis direction.

The first pad 259b of the pad portion 257 of the circuit board 250 may contact the exposed area 321 of the second coupling portion 320 of the first terminal 1081a.

Referring to FIG. 15, the circuit board 250 includes a first insulating layer 601, a first conductive layer 602a disposed on the first insulating layer 601, and a top surface of the first conductive layer 602a. The second insulating layer 603a disposed on the lower surface of the first insulating layer 601, the second conductive layer 602b disposed on the lower surface of the second conductive layer 602b, and the third insulating layer 603a disposed on the lower surface of the second conductive layer 602b. It can be included.

Also, for example, a first adhesive layer may be disposed between the first insulating layer 601 and the first conductive layer 602a, and a second adhesive layer may be disposed between the third insulating layer 603a and the second conductive layer 602b. can be placed.

The first conductive layer 602a may be a patterned metal layer, for example, a Cu plating layer.

The second conductive layer 602b may be a metal layer (eg, Cu layer) or a patterned metal layer.

For example, the first conductive layer 602a is patterned to include wires and pads electrically connected to the supports 220-1 to 220-4, the second coil 230, and the second position sensor 240. It may be in a converted form.

The first to third insulating layers 601, 603a, and 603b may be made of resin, for example, polyimide, but are not limited thereto.

The first pad 259b may be disposed on the lower surface of the second conductive layer 602b, and the second pad 259a may be disposed on the upper surface of the first conductive layer 602a.

For example, the lower surface of the first pad 259b may be positioned higher than the lower surface of the third insulating layer 603b of the circuit board 250.

For example, the second pad 259a of the pad portion 257 may be electrically connected to the corresponding one of the terminals 251 of the circuit board 250 by the patterned first conductive layer 602a.

The upper surface of the first conductive layer 602a may include a region 59a exposed from the second insulating layer 603a for contact with the second pad 259a, and the lower surface of the second conductive layer 602b may include It may include a region 59b exposed from the third insulating layer 603b for contact with the first pad 259b.

For example, the first pad 259b may be disposed in the exposed area 59b of the lower surface of the second conductive layer 602b, and the second pad 259a may be disposed in the exposed area 59b of the upper surface of the first conductive layer 602a. It may be placed in area 59a.

For example, the area of the first pad 259b in contact with the exposed area 59b of the lower surface of the second conductive layer 602b is the area of the first pad 259b in contact with the exposed area 59a of the upper surface of the first conductive layer 602a. 2 It may be larger than the area of the pad 259a.

The exposed area 14a of the circuit board 250 may be a portion of the patterned first conductive layer 602a exposed by the second insulating layer 603a, and the upper surface of the exposed area 14a is patterned. It may be the upper surface of the first conductive layer 602a.

The pad portions 41 to 44 and the pad portion 257 of the circuit board 250 may be spaced apart from each other, may be electrically separated, and may be located within the exposed area 14a.

For example, between the lower surface of the first pad 259b of the circuit board 250 and the lower surface of the third insulating layer 603b, or between the lower surface of the first pad 259b and the exposed area 321 of the second coupling portion 320. There may be a step in the direction from the bottom to the top of the circuit board 250, and the step may be 25.5 mm to 27.5 mm.

The third pad 605 of the pad portion 257 may be disposed on the side of the first insulating layer 601 and connects the second pad 259a and the first pad 259b of the pad portion 257. and may be a plating layer. For example, the thickness of each of the first pad 259b, the second pad 259a, and the third pad 605 of the pad portion 257 may be 10 mm to 12 mm.

For example, the third pad 605 of the pad portion 257 may be a gold (Au) plating layer, but is not limited thereto.

The exposed area 321 of the second coupling portion 320 of the terminals 1081a to 1081d may be coupled to the pad portion 257 of the circuit board 257 by a conductive adhesive member or solder, and the two may be electrically connected. You can.

The area of the first pad 259b of the pad portion 257 of the circuit board 250 may be larger than the area of the second pad 259a, but is not limited thereto.

Referring to FIG. 16, the ratio (H3/H1) of the first distance (H3) and the second distance (H1) may be 1.18 to 1.2, and the ratio of the first distance (H3) and the third distance (H) ( H3/H) can be 1.16 to 1.17. For example, the ratio (H3/H) may be 1.1667 and the ratio (H3/H1) may be 1.188.

The first distance H3 may be the distance from the lower surface of the upper springs 150-1 to 150-4 to the lower surface of the first coupling portion 310 of the terminals 1081a to 1081d. The second distance H1 may be the distance from the lower surface of the upper springs 150-1 to 150-4 to the lower surface of the circuit member 231. The third distance H may be the distance from the lower surface of the upper springs 150-1 to 150-4 to the lower surface of the circuit board 250.

As the thickness of the mobile phone becomes thinner, the height of the camera module decreases, and as the height of the camera module decreases, the length of the OIS wire (e.g., the above-described supports 220-1 to 220-4) of the lens driving device becomes shorter. , Due to this reduction in the length of the OIS wire, the current consumption may increase. If the diameter of the OIS wire is reduced to prevent this increase in current consumption and deterioration of reliability, there is a risk of the OIS wire being disconnected and the OIS driving. reliability may decrease.

In the embodiment, the length of the supports (220-1 to 220-4) is increased by coupling the supports (220-1 to 220-4) to the lower surfaces of the terminals (1081a to 1081d) located below the circuit board 250. This can reduce the intensity of the current flowing through the supports (220-1 to 220-4), thereby reducing power consumption, and OIS driving due to a decrease in the diameter of the supports (220-1 to 220-4). Deterioration in reliability can be prevented.

If the ratio (H3/H1) is less than 1.18 or the ratio (H3/H) is less than 1.16, the increase in the length of the supports (220-1 to 220-4) is insignificant, so the effect of reducing power consumption cannot be obtained, and the support ( It is impossible to prevent a decrease in the reliability of OIS drive due to a decrease in diameter (220-1 to 220-4).

Additionally, when the ratio (H3/H1) is greater than 1.2 or the ratio (H3/H) is greater than 1.17, the thickness of the lens driving device may increase.

For example, the distance H2 from the lower surface of the upper springs 150-1 to 150-4 to the upper surface of the circuit member 231 may be 1.86 mm.

For example, the height (or thickness in the optical axis direction) of the housing 140 may be 1.3 mm to 2 mm. For example, the height (or thickness in the optical axis direction) of the housing 140 may be 1.4 mm to 1.6 mm. For example, the height (or thickness in the optical axis direction) of the housing 140 may be 1.51 mm.

Figure 17a shows the coupling between the circuit board 25a and the terminal 8a by solder 86, and Figure 17b shows the coupling between the pad portion 257 and the terminal 1081a of the circuit board 250 according to the embodiment. indicates.

Referring to FIG. 17A, the circuit board 25a may include a pad portion 58 disposed only on the lower surface. When the pad portion 58 is disposed only on the lower surface of the circuit board 25a, the space between the lower surface of the circuit board 25a and the terminal 8a is narrow, so that the solder does not contact the circuit board 25a and the terminal 8a during soldering. Solderability deteriorates because it does not penetrate well, and this may cause electrical disconnection between the terminal 8a and the circuit board 250.

Referring to FIG. 17B, the lens driving device 100 according to the embodiment may include a conductive adhesive member or solder 410 that couples the terminals 1081a to 1081d and the pad portion 257 of the circuit board 250. there is.

The solder 410 may be disposed between the second coupling portion 320 (eg, exposed area 321) and the first pad 259b of the pad portion 257 of the circuit board 250. Additionally, solder 410 may be further disposed on the second pad 259a and the third pad 605.

For example, the solder 410 may be disposed between the first to third pads 259b, 259a, and 605 of the circuit board 250 and the second coupling portion 320 (eg, exposed area 321).

The pad portion 257 according to the embodiment includes a first pad 259b disposed on the lower part of the circuit board 250, and a third pad 605 provided on the side of the grooves 71a to 71d of the circuit board 250. , and a second pad 259a disposed on the upper part of the circuit board 250, so that during soldering, solder can be bonded to the third pad 605 and the second pad 259a of the circuit board 250. This may increase the surface tension of the solder, thereby increasing the penetration power of the solder between the first pad 259b of the circuit board 250 and the exposed area 231 of the terminals 1081a to 1081d. As a result, solderability between the pad portion 257 of the circuit board 250 and the terminals 1081a to 1081d can be improved and bonding strength can be improved, thereby preventing electrical disconnection between the terminal and the circuit board.

In addition, since the third pad 605 of the circuit board 250 has a curved shape, the contact area can be increased, thereby improving solderability between the pad portion 257 of the circuit board 250 and the terminals 1081a to 1081d. and can improve bonding strength.

The embodiment shown in FIGS. 1 to 17 does not include an AF position sensor for AF feedback driving, but is not limited thereto. In another embodiment, an AF position sensor for AF feedback driving may be further included. In this case, the AF position sensor may be located on the bobbin 110.

Additionally, in another embodiment, an AF position sensor and a sensing magnet may be further provided. In this case, the AF position sensor may be placed in either the housing or the bobbin, and the sensing magnet may be placed in the other one of the housing or the bobbin.

When the lens driving device according to the embodiment includes an AF position sensor, the embodiment may include a sufficient number of upper springs and supports to electrically connect the AF position sensor and the circuit board. Alternatively, the second elastic part may include a plurality of lower springs, and the AF position sensor and the circuit board may be electrically connected through the upper springs and lower springs.

Meanwhile, the lens driving device according to the above-described embodiment can be used in various fields, for example, camera modules or optical devices.

For example, the lens driving device 100 according to an embodiment forms an image of an object in space by using the characteristics of light, such as reflection, refraction, absorption, interference, and diffraction, and aims to increase the visual power of the eye, It may be included in an optical instrument for the purpose of recording and reproducing images by a lens, or for optical measurement, propagation or transmission of images, etc. For example, an optical device according to an embodiment may include a smartphone and a portable terminal equipped with a camera.

Figure 18 shows an exploded perspective view of the camera module 200 according to an embodiment.

Referring to FIG. 18, the camera module 200 includes a lens or lens barrel 400, a lens driving device 100, an adhesive member 612, a filter 610, a first holder 600, and a second holder 800. ), an image sensor 10810, a motion sensor 820, a control unit 830, and a connector 840.

A lens or lens barrel (lens barrel, 400) may be mounted on the bobbin 110 of the lens driving device 100.

The first holder 600 may be placed below the base 210 of the lens driving device 100. The filter 610 is mounted on the first holder 600, and the first holder 600 may be provided with a protrusion 500 on which the filter 610 is seated.

The adhesive member 612 may couple or attach the base 210 of the lens driving device 100 to the first holder 600. In addition to the adhesive role described above, the adhesive member 612 may also serve to prevent foreign substances from entering the lens driving device 100.

For example, the adhesive member 612 may be epoxy, thermosetting adhesive, ultraviolet curing adhesive, etc.

The filter 610 may serve to block light of a specific frequency band from light passing through the lens barrel 400 from entering the image sensor 10810. The filter 610 may be an infrared blocking filter, but is not limited thereto. At this time, the filter 610 may be arranged parallel to the x-y plane.

An opening may be formed in a portion of the first holder 600 where the filter 610 is mounted to allow light passing through the filter 610 to enter the image sensor 10810.

The second holder 800 is disposed below the first holder 600, and an image sensor 10810 may be mounted on the second holder 600. The image sensor 10810 is a site where light passing through the filter 610 is incident and an image included in the light is formed.

The second holder 800 may be equipped with various circuits, elements, and control units to convert the image formed on the image sensor 10810 into an electrical signal and transmit it to an external device.

The second holder 800 can be implemented as a circuit board on which an image sensor can be mounted, a circuit pattern can be formed, and various elements can be combined.

The image sensor 10810 may receive an image included in light incident through the lens driving device 100 and convert the received image into an electrical signal.

The filter 610 and the image sensor 10810 may be arranged to be spaced apart from each other in the first direction.

The motion sensor 820 is mounted on the second holder 800 and can be electrically connected to the control unit 830 through a circuit pattern provided on the second holder 800.

The motion sensor 820 outputs rotational angular velocity information resulting from the movement of the camera module 200. The motion sensor 820 may be implemented as a 2-axis or 3-axis gyro sensor, or an angular velocity sensor.

The control unit 830 is mounted on the second holder 800. The second holder 800 may be electrically connected to the lens driving device 100. For example, the second holder 800 may be electrically connected to the first coil 120, the second coil 230, and the position sensor 240 of the lens driving device 100.

For example, a driving signal may be provided to each of the first coil 120, the second coil 230, and the position sensor 240 through the second holder 800.

The connector 840 is electrically connected to the second holder 800 and may have a port for electrical connection to an external device.

FIG. 19 shows a perspective view of a portable terminal 200A according to an embodiment, and FIG. 20 shows a configuration diagram of the portable terminal 200A shown in FIG. 19.

19 and 20, the portable terminal (200A, hereinafter referred to as “terminal”) includes a body 850, a wireless communication unit 710, an A/V input unit 720, a sensing unit 740, and an input/output unit 720. It may include an output unit 750, a memory unit 760, an interface unit 770, a control unit 780, and a power supply unit 790.

The body 850 shown in FIG. 19 has a bar shape, but is not limited to this, and may be a slide type, folder type, or swing type in which two or more sub-bodies are coupled to enable relative movement. It may have various structures such as , swirl type, etc.

The body 850 may include a case (casing, housing, cover, etc.) that forms the exterior. For example, the body 850 may be divided into a front case 851 and a rear case 852. Various electronic components of the terminal may be built into the space formed between the front case 851 and the rear case 852.

The wireless communication unit 710 may be configured to include one or more modules that enable wireless communication between the terminal 200A and a wireless communication system or between the terminal 200A and the network where the terminal 200A is located. For example, the wireless communication unit 710 may be configured to include a broadcast reception module 711, a mobile communication module 712, a wireless Internet module 713, a short-range communication module 714, and a location information module 715. there is.

The A/V (Audio/Video) input unit 720 is for inputting audio or video signals and may include a camera 721 and a microphone 722.

The camera 721 may include the camera module 200 according to the embodiment shown in FIG. 18.

The sensing unit 740 monitors the current state of the terminal 200A, such as the open/closed state of the terminal 200A, the location of the terminal 200A, presence or absence of user contact, the direction of the terminal 200A, acceleration/deceleration of the terminal 200A, etc. It is possible to detect and generate a sensing signal to control the operation of the terminal 200A. For example, if the terminal 200A is in the form of a slide phone, it can sense whether the slide phone is opened or closed. In addition, it is responsible for sensing functions related to whether the power supply unit 790 supplies power and whether the interface unit 770 is connected to an external device.

The input/output unit 750 is for generating input or output related to vision, hearing, or tactile sensation. The input/output unit 750 can generate input data for controlling the operation of the terminal 200A and can also display information processed by the terminal 200A.

The input/output unit 750 may include a key pad unit 730, a display module 751, a sound output module 752, and a touch screen panel 753. The key pad unit 730 can generate input data through key pad input.

The display module 751 may include a plurality of pixels whose colors change according to electrical signals. For example, the display module 751 may be a liquid crystal display, a thin film transistor-liquid crystal display, an organic light-emitting diode, a flexible display, or a three-dimensional display. It may include at least one display (3D display).

The audio output module 752 outputs audio data received from the wireless communication unit 710 in call signal reception, call mode, recording mode, voice recognition mode, or broadcast reception mode, or stored in the memory unit 760. Audio data can be output.

The touch screen panel 753 can convert the change in capacitance that occurs due to the user's touch to a specific area of the touch screen into an electrical input signal.

The memory unit 760 may store programs for processing and controlling the control unit 780 and stores input/output data (e.g., phone book, messages, audio, still images, photos, videos, etc.). It can be stored temporarily. For example, the memory unit 760 may store images captured by the camera 721, such as photos or videos.

The interface unit 770 serves as a passage connecting external devices connected to the terminal 200A. The interface unit 770 receives data from an external device, receives power and transmits it to each component inside the terminal 200A, or transmits data inside the terminal 200A to an external device. For example, the interface unit 770 includes a wired/wireless headset port, an external charger port, a wired/wireless data port, a memory card port, a port for connecting a device equipped with an identification module, and audio I/O (Input/ Output) port, video I/O (Input/Output) port, and earphone port.

The controller 780 can control the overall operation of the terminal 200A. For example, the control unit 780 may perform related control and processing for voice calls, data communications, video calls, etc.

The control unit 780 may be equipped with a multimedia module 71081 for multimedia playback. The multimedia module 71081 may be implemented within the control unit 180 or may be implemented separately from the control unit 780.

The control unit 780 can perform pattern recognition processing to recognize handwriting or drawing input on the touch screen as text and images, respectively.

The power supply unit 790 can receive external power or internal power under the control of the control unit 780 and supply power necessary for the operation of each component.

The features, structures, effects, etc. described in the embodiments above are included in at least one embodiment of the present invention and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, etc. illustrated in each embodiment can be combined or modified and implemented in other embodiments by a person with ordinary knowledge in the field to which the embodiments belong. Therefore, contents related to such combinations and modifications should be construed as being included in the scope of the present invention.

Claims (1)

Base;
a housing disposed above the base;
a bobbin disposed within the housing;
a first coil and magnet for moving the bobbin in the optical axis direction;
an elastic member coupled to the bobbin and the housing;
a circuit board disposed on the base;
A terminal coupled to the base; and
It includes a support member connecting the elastic member and the terminal,
The terminal includes a first coupling part coupled to the base and coupled to one end of the support member by solder, a connecting part bent and extending from the first coupling part toward the circuit board, and connected to the connecting part and connected to the circuit board. A lens driving device including a second coupling portion coupled to.

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