KR102328866B1 - Apparatus for treating substrate - Google Patents

Abstract

Provided is a substrate processing apparatus capable of increasing the residence time of a chemical solution in the edge portion of the substrate by providing an edge ring on the side surface of the substrate and improving E/R for the edge portion of the substrate. The substrate processing apparatus may include: a support member supporting a substrate seated on a body and supporting the substrate using a plurality of support pins formed on the upper portion of the body; an ejection member for ejecting a chemical solution onto the substrate to clean the substrate; and a cup for collecting the chemical liquid sprayed on the substrate, wherein the support member includes an edge ring formed in a band shape along the outer side of the support pin and formed higher than the height of the substrate.

Description

Substrate processing apparatus {Apparatus for treating substrate}

The present invention relates to an apparatus for processing a substrate. More particularly, it relates to an apparatus for cleaning a substrate.

A semiconductor device can be manufactured by forming a predetermined pattern on a substrate. When a predetermined pattern is formed on a substrate, a plurality of processes may be continuously performed in a semiconductor manufacturing facility.

In general, a space in which a semiconductor manufacturing facility is located may be defined as a FAB. Inside this fab, a deposition process to form a film on a semiconductor substrate, a polishing process to planarize the film, a photolithography process to form a photo-resist pattern on the film (photo-resist pattern) lithography process, an etching process for forming a film into a pattern having electrical characteristics by using a photoresist pattern, an ion implantation process for implanting specific ions into a predetermined region of a semiconductor substrate, a source of contamination on a semiconductor substrate A plurality of processes, such as a cleaning process for removing , and an inspection process for inspecting the surface of the patterned semiconductor substrate, may be sequentially performed.

Korean Patent Publication No. 10-2019-0015412 (published date: 2019.02.13.)

In the cleaning process, a contamination source may be removed from the substrate using a chemical solution (eg, a high-temperature chemical). At this time, after the substrate is seated on the plurality of support pins formed on the stage, the substrate is rotated using the plurality of support pins, so that the chemical can reach the edge part of the substrate. .

However, before the chemical liquid reaches the edge portion of the substrate, the temperature of the chemical may be lowered by the airflow, and while the chemical moves from the center portion of the substrate to the edge portion, the temperature of the chemical may be lowered. As described above, when the temperature of the chemical is lowered at the edge portion of the substrate, E/R (Etch Rate) for the edge portion of the substrate may decrease.

The problem to be solved in the present invention is to install an edge ring on the side of the substrate, so that the residence time of the chemical solution in the edge portion of the substrate can be increased, and E/R for the edge portion of the substrate is improved To provide a substrate processing apparatus capable of

The problems of the present invention are not limited to the problems mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the following description.

One aspect of the substrate processing apparatus of the present invention for achieving the above object is to support a substrate to be seated on a body, and to support the substrate using a plurality of support pins formed on the upper portion of the body absence; a spraying member for spraying a chemical onto the substrate to clean the substrate; and a cup for collecting the chemical liquid sprayed onto the substrate, wherein the support member includes an edge ring formed in a band shape along an outer side of the support pin and formed higher than a height of the substrate.

The edge ring may include: a first region portion positioned at an upper side of the edge ring and disposed inside the body; and a second region located on the other upper side of the edge ring and farther from the substrate than the first region, wherein the second region may be formed to be higher than the first region.

The first region portion may be formed to have an inclination that increases in height as it moves away from the substrate.

The first region portion may include: a first end located at an upper side of the first region portion and close to the second region portion; and a second end positioned at the other upper side of the first region and close to the substrate, wherein the first end is higher than the second end.

The edge ring may include a body member formed on the body and formed adjacent to a sidewall of the substrate in the form of a sidewall; and a protrusion member extending from a side surface of the body member in a direction in which the substrate is located, and the protrusion member may be formed at a position lower than a height of the substrate.

The protrusion member may be formed to extend from a side surface of the body member so that a portion thereof is positioned on the bottom surface of the substrate.

The protrusion member may be formed so that an upper portion thereof has an inclination.

The body member may be formed with a hole penetrating the other side from the lower one side.

The edge ring may be formed of a material having heat retention.

The details of other embodiments are included in the detailed description and drawings.

1 is a plan view schematically illustrating an internal structure of a substrate processing system used for substrate cleaning.
2 is a cross-sectional view schematically illustrating an internal structure of a substrate processing apparatus according to an embodiment of the present invention.
3 is a first exemplary view illustrating an installation form of an edge ring constituting a substrate processing apparatus according to an embodiment of the present invention.
4 is a first exemplary view for explaining the function and effect of an edge ring constituting a substrate processing apparatus according to an embodiment of the present invention.
5 is a second exemplary view for explaining the function and effect of the edge ring constituting the substrate processing apparatus according to an embodiment of the present invention.
6 is a second exemplary view illustrating an installation form of an edge ring constituting a substrate processing apparatus according to an embodiment of the present invention.
7 is a third exemplary view illustrating an installation form of an edge ring constituting a substrate processing apparatus according to an embodiment of the present invention.
8 is a fourth exemplary view illustrating an installation form of an edge ring constituting a substrate processing apparatus according to an embodiment of the present invention.
9 is an exemplary view illustrating an installation form of an edge ring constituting a substrate processing apparatus according to another embodiment of the present invention.
10 is a first exemplary view illustrating an installation form of an edge ring constituting a substrate processing apparatus according to another embodiment of the present invention.
11 is an exemplary view for explaining the function and effect of an edge ring constituting a substrate processing apparatus according to another embodiment of the present invention.
12 is a second exemplary view illustrating an installation form of an edge ring constituting a substrate processing apparatus according to another embodiment of the present invention.
13 is a third exemplary view illustrating an installation form of an edge ring constituting a substrate processing apparatus according to another embodiment of the present invention.
14 is a fourth exemplary view illustrating an installation form of an edge ring constituting a substrate processing apparatus according to another embodiment of the present invention.
15 is a fifth exemplary view illustrating an installation form of an edge ring constituting a substrate processing apparatus according to another embodiment of the present invention.
16 is a third exemplary view for explaining functions and effects of an edge ring constituting a substrate processing apparatus according to an embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Advantages and features of the present invention, and a method for achieving them will become apparent with reference to the embodiments described below in detail in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments published below, but may be implemented in various different forms, only these embodiments make the publication of the present invention complete, and common knowledge in the technical field to which the present invention pertains It is provided to fully inform the possessor of the scope of the invention, and the present invention is only defined by the scope of the claims. Like reference numerals refer to like elements throughout.

Reference to an element or layer “on” or “on” another element or layer includes not only directly on the other element or layer, but also with intervening other layers or elements. include all On the other hand, reference to an element "directly on" or "immediately on" indicates that no intervening element or layer is interposed.

Spatially relative terms "below", "beneath", "lower", "above", "upper", etc. It can be used to easily describe a correlation between an element or components and other elements or components. The spatially relative terms should be understood as terms including different orientations of the device during use or operation in addition to the orientation shown in the drawings. For example, if an element shown in the figures is turned over, an element described as "beneath" or "beneath" another element may be placed "above" the other element. Accordingly, the exemplary term “below” may include both directions below and above. The device may also be oriented in other orientations, and thus spatially relative terms may be interpreted according to orientation.

It should be understood that although first, second, etc. are used to describe various elements, components, and/or sections, these elements, components, and/or sections are not limited by these terms. These terms are only used to distinguish one element, component, or sections from another. Accordingly, it goes without saying that the first element, the first element, or the first section mentioned below may be the second element, the second element, or the second section within the spirit of the present invention.

The terminology used herein is for the purpose of describing the embodiments and is not intended to limit the present invention. As used herein, the singular also includes the plural unless specifically stated otherwise in the phrase. As used herein, "comprises" and/or "comprising" refers to the presence of one or more other components, steps, operations and/or elements mentioned. or addition is not excluded.

Unless otherwise defined, all terms (including technical and scientific terms) used herein may be used with the meaning commonly understood by those of ordinary skill in the art to which the present invention belongs. In addition, terms defined in a commonly used dictionary are not to be interpreted ideally or excessively unless clearly defined in particular.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. A description will be omitted.

The present invention relates to a substrate processing apparatus used for cleaning a substrate. The substrate processing apparatus according to the present invention may include an edge ring installed on a side surface of the substrate.

The substrate processing apparatus according to the present invention can increase the residence time of a chemical (eg, a high-temperature chemical) in the edge part of the substrate through this, and thus The effect of improving E/R (Etch Rate) can be obtained. In addition, the substrate processing apparatus according to the present invention can also obtain the effect of securing E/R uniformity with respect to the substrate.

Hereinafter, the present invention will be described in detail with reference to drawings and the like.

1 is a plan view schematically illustrating an internal structure of a substrate processing system used for substrate cleaning.

Referring to FIG. 1 , the substrate processing system 100 may include an index module 110 and a process processing module 120 .

The index module 110 and the processing module 120 may be sequentially arranged in one direction. In this embodiment, the direction in which the index module 110 and the process processing module 120 are arranged is defined as the first direction 10 . In addition, a direction perpendicular to the first direction 10 when viewed from above is defined as the second direction 20 , and is perpendicular to a plane including the first direction 10 and the second direction 20 . The direction will be defined as the third direction 30 .

The index module 110 is disposed in front of the process processing module 120 . The index module 110 may be configured to include a load port 111 and a transport frame 112 .

The load port 111 is where the carrier 130 in which the substrate is accommodated is seated. A plurality of such load ports 111 may be provided in front of the transport frame 112 , and the plurality of load ports 111 may be arranged in a line along the second direction 20 .

1 illustrates that the index module 110 is provided with four load ports 111 . However, the present embodiment is not limited thereto. The number of load ports 111 may increase or decrease according to conditions such as process efficiency and footprint of the process processing module 120 .

The carrier 130 accommodates a plurality of substrates (eg, wafers). The carrier 130 may have a slot (not shown) provided therein to support the edge of the substrate.

A plurality of slots may be provided in the third direction 30 . In this case, the substrates may be stacked in a state spaced apart from each other along the third direction 30 and positioned in the carrier 130 . The carrier 130 may be implemented as, for example, a Front Opening Unified Pod (FOUP).

The transfer frame 112 transfers the substrate between the carrier 130 seated on the load port 111 and the buffer unit 121 . The transport frame 112 may include an index rail 113 and an index robot 114 .

The index rail 113 provides a path for the index robot 114 to move. The index rail 113 may be disposed so that its longitudinal direction is parallel to the second direction 20 .

The index robot 114 directly transports the substrate. The index robot 114 may be installed on the index rail 113 , and may linearly move along the second direction 20 on the index rail 113 .

The index robot 114 may include a first base 114a, a first body 114b, and an index arm 114c. Here, the first base 114a may be installed to be movable along the index rail 113 .

The first body 114b may be coupled to the first base 114a. The first body 114b may be provided to be movable along the third direction 30 on the first base 114a. In addition, the first body 114b may be provided to be rotatable on the first base 114a.

The index arm 114c is coupled to the first body 114b and may be provided to be movable forward and backward with respect to the first body 114b. A plurality of such index arms 114c may be provided on the first body 114b to be individually driven.

The plurality of index arms 114c may be stacked and disposed to be spaced apart from each other in the third direction 30 . A part of the plurality of index arms 114c is used to transfer the substrate from the process processing module 120 to the carrier 130 , and the other part is used to transfer the substrate from the carrier 130 to the process processing module 120 . can be used when When the plurality of index arms 114c are configured in this way, it is possible to obtain the effect of preventing particles generated from the substrate before processing from adhering to the substrate after processing during the process of the index robot 114 loading and unloading substrates. have.

The process processing module 120 may include a buffer unit 121 , a transfer chamber 122 , and a process chamber 125 .

The buffer unit 121 provides a space for the substrate to stay before being transferred between the transfer frame 112 and the transfer chamber 122 . The buffer unit 121 may be disposed between the transfer frame 112 and the transfer chamber 122 for this purpose.

The buffer unit 121 may be provided with a slot (not shown) in which the substrate is seated. A plurality of slots may be provided in the buffer unit 121 , and the plurality of slots may be provided to be spaced apart from each other in the third direction 30 . Meanwhile, in the buffer unit 121 , a surface facing the transfer frame 112 , a surface facing the transfer chamber 122 , etc. may be opened, respectively.

The transfer chamber 122 transfers a substrate between the buffer unit 121 and the process chamber 125 . The transfer chamber 122 may include a guide rail 123 and a main robot 124 . Meanwhile, the transfer chamber 122 may transfer a substrate between two different process chambers 125 .

The guide rail 123 provides a path for the main robot 124 to move. The guide rail 123 may be disposed so that its longitudinal direction is parallel to the first direction 10 .

The main robot 124 directly transports the substrate. The main robot 124 may be installed on the guide rail 123 , and may linearly move along the first direction 10 on the guide rail 123 .

The main robot 124 may include a second base 124a, a second body 124b, and a main arm 124c. Here, the second base 124a may be installed to be movable along the guide rail 123 .

The second body 124b may be coupled to the second base 124a. The second body 124b may be provided to be movable along the third direction 30 on the second base 124a. In addition, the second body 124b may be provided to be rotatable on the second base 124a.

The main arm 124c is coupled to the second body 124b, and may be provided to be movable forward and backward with respect to the second body 124b. A plurality of such main arms 124c may be provided on the second body 124b to be individually driven.

The plurality of main arms 124c may be stacked and disposed to be spaced apart from each other in the third direction 30 . A part of the plurality of main arms 124c may be used to transfer a substrate from the buffer unit 121 to the process chamber 125 , and the other part may be used to transfer a substrate from the process chamber 125 to the buffer unit 121 . It can also be used when

The transfer chamber 122 may have a longitudinal direction parallel to the first direction 10 . In this case, a plurality of process chambers 125 may be disposed on both sides of the transfer chamber 122 in the second direction 20 , and a plurality of process chambers 125 may be disposed on each side of the transfer chamber 122 along the first direction 10 . A process chamber 125 may be disposed.

The plurality of process chambers 125 may be stacked on each other. That is, the plurality of process chambers 125 may be arranged in an X * Y arrangement on one side of the transfer chamber 122 . Here, X is a natural number of 1 or more, meaning the number of process chambers 125 provided in a line along the first direction 10 , and Y is a natural number of 1 or more, provided in a line along the third direction 30 . It means the number of process chambers 125 to be used.

For example, when four process chambers 125 are provided on one side of the transfer chamber 122 , the four process chambers 125 may be arranged in an arrangement of 2 * 2 , one side of the transfer chamber 122 . When six process chambers 125 are provided, the six process chambers 125 may be arranged in a 3 * 2 arrangement.

Meanwhile, the number of process chambers 125 may increase or decrease. In addition, the process chamber 125 may be provided only on one side of the transfer chamber 122 , or may be provided on one side or both sides of the transfer chamber 122 as a single layer.

A substrate processing apparatus cleans a substrate using a chemical solution. Such a substrate processing apparatus may be provided in the process chamber 125 .

2 is a cross-sectional view schematically illustrating an internal structure of a substrate processing apparatus according to an embodiment of the present invention. The following description refers to FIGS. 1 and 2 .

The substrate processing apparatus 200 may be provided in a plurality of process chambers 125 having the same structure. However, the present embodiment is not limited thereto. The substrate processing apparatus 200 may be provided as having different structures in the plurality of process chambers 125 according to the type of the chemical solution, the type of the process method, and the like.

The plurality of process chambers 125 may be divided into a plurality of groups. In this case, substrate processing apparatuses in process chambers belonging to the same group may have the same structure, and substrate processing apparatuses in process chambers belonging to different groups may have different structures.

For example, when first process chambers belonging to the first group are disposed on one side of the transfer chamber 122 and second process chambers belonging to the second group are disposed on the other side of the transfer chamber 122 , the first process Substrate processing apparatuses in the chambers may have the same structure, and substrate processing apparatuses in the second process chambers may have the same structure. In addition, the substrate processing apparatuses in the first process chambers may have different structures from the substrate processing apparatuses in the second process chambers.

In addition, for example, third process chambers belonging to the third group are disposed on the lower layer on one side and the other side of the transfer chamber 122 , and the fourth group on the upper layer on each of the one side and the other side of the transfer chamber 122 . When the fourth process chambers belonging to , are disposed, substrate processing apparatuses in the third process chambers may have the same structure, and substrate processing apparatuses in the fourth process chambers may have the same structure. In addition, the substrate processing apparatuses in the third process chambers may have different structures from the substrate processing apparatuses in the fourth process chambers.

The substrate processing apparatus 200 may be configured to include, for example, a cup 210 , a support member 220 , a lifting unit 230 , a jetting member 240 , and a controller 250 as shown in FIG. 2 . can

The cup 210 provides a space in which a process for processing the substrate W is performed. The cup 210 may be formed so that its upper portion is open.

The cup 210 may include an internal collection container 211 , an intermediate collection container 212 , and an external collection container 213 . In this case, each of the recovery tubes 211 , 212 , and 213 may recover different treatment liquids from among the treatment liquids used in the process.

The internal recovery container 211 may be provided in an annular ring shape surrounding the support member 220 . In this case, the inner space 214 of the internal recovery container 211 may function as an inlet through which the treatment liquid flows into the internal recovery container 211 .

The intermediate recovery container 212 may be provided in the shape of an annular ring surrounding the inner recovery container 211 . In this case, the space 215 between the internal recovery container 211 and the intermediate recovery container 212 may function as an inlet through which the treatment liquid flows into the intermediate recovery container 212 .

The external collection container 213 may be provided in an annular ring shape surrounding the intermediate collection container 212 . In this case, the space 216 between the intermediate collection tube 212 and the external collection tube 213 may function as an inlet through which the treatment liquid flows into the external collection tube 213 .

Each of the recovery containers 211 , 212 , and 213 may be connected to recovery lines 217 , 218 , and 219 vertically extending downwardly from the bottom thereof, respectively. Each of the recovery lines 217 , 218 , and 219 may discharge the treatment liquid flowing in through the respective recovery troughs 211 , 212 and 213 to the outside. The treatment liquid discharged to the outside may be treated to be reused through a treatment liquid regeneration system (not shown).

The support member 220 supports the substrate W and rotates the substrate W during the process. The support member 220 may be disposed inside the cup 210 .

The support member 220 may include a body 221 , a support pin 222 , a chuck pin 223 , and a first support shaft 224 .

The body 221 may have an upper surface provided in a generally circular shape when viewed from above. A first support shaft 224 that can be rotated by a motor 225 may be fixedly coupled to the bottom surface of the body 221 .

The support pin 222 supports the substrate W on the body 221 . A plurality of such support pins 222 may be provided on the body 221 .

The plurality of support pins 222 may be formed to protrude upward from the upper surface of the body 221 . In addition, the plurality of support pins 222 may be disposed to be spaced apart from each other by a predetermined interval on the edge of the upper surface of the body 221 . The plurality of support pins 222 may be disposed to have an annular ring shape as a whole by a combination with each other, for example. The plurality of support pins 222 may support the rear edge of the substrate W so that the substrate W is spaced a predetermined distance from the upper surface of the body 221 through such a configuration.

The chuck pin 223 supports the side of the substrate W so that the substrate W is not laterally separated from the original position when the support member 220 rotates. A plurality of such chuck pins 223 may be provided on the body 221 like the support pins 222 , and may be formed to protrude upward from the upper surface of the body 221 .

The chuck pin 223 may be disposed farther from the center of the body 221 than the support pin 222 . The chuck pin 223 may be provided to be linearly movable between the standby position and the supporting position along the radial direction of the body 221 . Here, the standby position means a position farther from the center of the body 221 compared to the support position.

The chuck pin 223 may be positioned at a standby position when the substrate W is loaded/unloaded from the support member 220 , and may be positioned at a support position when a process is performed on the substrate W . The chuck pin 223 may be in contact with the side of the substrate W at the supporting position.

The lifting unit 230 linearly moves the cup 210 in the vertical direction. As the cup 210 linearly moves in the vertical direction, the relative height of the cup 210 with respect to the support member 220 may be changed.

The lifting unit 230 may include a bracket 231 , a moving shaft 232 , and a first driver 233 .

The bracket 231 is fixedly installed on the outer wall of the cup 210 . The bracket 231 may be coupled to the moving shaft 232 moved in the vertical direction by the first driver 233 .

When the substrate W is placed on or lifted from the support member 220 , the cup 210 may be lowered so that the support member 220 protrudes above the cup 210 . . In addition, when the process is performed, the height of the cup 210 may be adjusted so that the treatment liquid can be introduced into the predetermined collection troughs 211 , 212 and 213 according to the type of the treatment liquid supplied to the substrate W . .

For example, while the substrate W is treated with the first processing liquid, the substrate W may be positioned at a height corresponding to the inner space 214 of the internal collection container 211 . Also, while the substrate W is treated with the second processing liquid, the substrate W may be positioned at a height corresponding to the space 215 between the internal recovery container 211 and the intermediate recovery container 212 . In addition, while the substrate W is treated with the third processing liquid, the substrate W may be positioned at a height corresponding to the space 216 between the intermediate recovery container 212 and the external recovery container 213 .

Meanwhile, the lifting unit 230 may move the support member 220 in the vertical direction instead of the cup 210 .

The ejection member 240 supplies a processing liquid to the substrate W during a substrate processing process. For this purpose, the spray member 240 may include a nozzle support 241 , a nozzle 242 , a second support shaft 243 , and a second actuator 244 .

One or a plurality of injection members 240 may be provided. When a plurality of spraying members 240 are provided, a chemical solution, a rinse solution, an organic solvent, and the like may be provided through different spraying members 240 . The rinsing liquid may be the first fluid, and the organic solvent may be a mixture of isopropyl alcohol vapor and an inert gas, or an isopropyl alcohol liquid.

The longitudinal direction of the nozzle support 241 may be provided along the second direction 20 . The nozzle support 241 may be coupled to one end of the second support shaft 243 in a direction perpendicular to the longitudinal direction of the second support shaft 243 . The second actuator 244 may be coupled to the other end of the second support shaft 243 .

The nozzle 242 may be installed on the bottom surface of the end of the nozzle support 241 . This nozzle 242 may be moved to the process position and the standby position by the second actuator 244 . Here, the process position refers to a vertically upper area of the support member 220 that allows the nozzle 242 to discharge the treatment liquid onto the substrate W, and the standby position refers to a vertically upper area of the support member 220 . The excluded area, that is, an area outside the vertical upper area of the support member 220 .

The second support shaft 243 may be provided in its longitudinal direction along the third direction 30 . The second support shaft 243 may be coupled to the second actuator 244 at the lower end thereof.

The second actuator 244 rotates and elevates the second support shaft 243 . The second driver 244 may be connected to the controller 250 and controlled by the controller 250 .

Meanwhile, in FIG. 2 , the controller 250 is illustrated as being connected to the second driver 244 . However, the present embodiment is not limited thereto. The controller 250 may be connected to the first driver 233 as well as the second driver 244 to control the first driver 233 .

Meanwhile, the substrate processing apparatus 200 is disposed on the side surface of the substrate W in order to increase the time during which a chemical solution (eg, a high-temperature chemical) stays in an edge part of the substrate W. An edge ring may be installed on the support member 220 such that an edge ring is disposed. Hereinafter, this will be described.

3 is a first exemplary view illustrating an installation form of an edge ring constituting a substrate processing apparatus according to an embodiment of the present invention. The following description refers to FIG. 3 .

The edge ring 310 is disposed on the side surface of the substrate W on the body 221 of the support member 220 in order to increase the time that the chemical solution stays on the edge portion of the substrate W. The edge ring 310 may be installed in the form of a band on the outside of the plurality of support pins 222 along the plurality of support pins 222 supporting the substrate W.

The edge ring 310 may be formed in close contact with the substrate W. The edge ring 310 may be formed higher than the substrate W seated on the support pin 222 . When the edge ring 310 is formed in this way, as shown in FIG. 4 , the substrate W positioned inside the edge ring 310 until the chemical solution 320 reaches the height h1 of the edge ring 310 . ), so that the time for the chemical solution 320 to stay in the edge portion 330 of the substrate W may be increased. 4 is a first exemplary view for explaining the function and effect of an edge ring constituting a substrate processing apparatus according to an embodiment of the present invention.

It will be described again with reference to FIG. 3 .

The edge ring 310 may be formed of a material having heat retention. The edge ring 310 may be formed of, for example, quartz as a material.

The edge ring 310 may be formed so that the upper one side and the upper other side have different heights. If one upper side of the edge ring 310 is referred to as a first region portion 341 and the other upper side of the edge ring 310 is referred to as a second region portion 342 , the first region portion 341 and the second region portion Any one of the regions 342 may be formed to be higher than the other region.

When the second region portion 342 is formed to be higher than the first region portion 341 , the first region portion 341 is on the body 221 of the support member 220 inward than the second region portion 342 . It may be disposed on the , and may be disposed closer to the substrate W than the second region 342 . On the other hand, the second region 342 may be disposed outside the first region 341 on the body 221 of the support member 220 , and is farther from the substrate W than the first region 341 . It can be arranged to

When the first region portion 341 and the second region portion 342 are arranged in this way, as shown in FIG. 5 , the chemical solution 320 flows along the airflow 350 along the edge portion 330 of the substrate W and Even if it passes through the edge ring 310 and is discharged to the outside in turn, the chemical solution 320 is applied to the edge portion 330 of the substrate W due to the height difference between the first region portion 341 and the second region portion 342 . The residence time may be increased, and thus the influence of the airflow 350 may be minimized. 5 is a second exemplary view for explaining the function and effect of the edge ring constituting the substrate processing apparatus according to an embodiment of the present invention.

It will be described again with reference to FIG. 3 .

When the first region 341 is formed to be lower than the second region 342 , the first region 341 may be formed to have a slope. At this time, the first region portion 341 may be formed to have a first slope 361 in the form of a secondary curve, but is formed to have a second slope 362 in the form of a primary straight line as shown in FIG. 6 . It is also possible 6 is a second exemplary view illustrating an installation form of an edge ring constituting a substrate processing apparatus according to an embodiment of the present invention.

Meanwhile, when the first region 341 is formed to have an inclination, the first end 341a close to the second region 342 is higher than the second end 341b close to the substrate W. can be formed. That is, the first region 341 may be formed to have an inclination that increases from the second end 341b to the first end 341a.

As described above, in the edge ring 310 , when the second region 342 is formed to be higher than the first region 341 , the second region 342 is formed to be flat, and the first region portion 342 is formed to be flat. Reference numeral 341 may be formed to have an upward inclination in a direction in which the second region portion 342 is located.

However, the present embodiment is not limited thereto. The edge ring 310 may be formed in a step shape as shown in FIG. 7 . In this case, the first region 341 and the second region 342 may be formed to be flat, and the second region 342 may be formed to be higher than the first region 341 . 7 is a third exemplary view illustrating an installation form of an edge ring constituting a substrate processing apparatus according to an embodiment of the present invention.

A plurality of lamps 370 may be installed in the body 221 of the support member 220 as shown in FIG. 8 . 8 is a fourth exemplary view illustrating an installation form of an edge ring constituting a substrate processing apparatus according to an embodiment of the present invention.

The plurality of lamps 370 are for heating the substrate W seated on the body 221 of the support member 220 . The plurality of lamps 370 may be disposed in the width direction of the body 221 and may be implemented as an infrared lamp (IR lamp).

Meanwhile, in the present embodiment, the edge ring 310 is not limited to being formed higher than the substrate W seated on the support pin 222 . The edge ring 310 may be formed to have the same height as the substrate W seated on the support pin 222 as shown in FIG. 9 . 9 is an exemplary view illustrating an installation form of an edge ring constituting a substrate processing apparatus according to another embodiment of the present invention.

When the edge ring 310 is formed higher than the substrate W seated on the support pin 222 or is formed at the same height as the substrate W, the chemical solution 320 moves along the airflow 350 . Thus, it may be discharged to the outside through the upper portion of the substrate W and the upper portion of the edge ring 310 in turn.

However, the present embodiment is not limited thereto. The chemical solution 320 may be discharged to the outside through the upper portion of the substrate W and the side portion of the edge ring 310 in turn. Hereinafter, this will be described.

10 is a first exemplary view illustrating an installation form of an edge ring constituting a substrate processing apparatus according to another embodiment of the present invention.

According to FIG. 10 , the edge ring 310 may include a body member 410 and a protruding member 420 .

The body member 410 constitutes the body of the edge ring 310 . The body member 410 may be disposed on the body 221 of the support member 220 in the form of a band on the outside of the substrate W.

The body member 410 may not be in close contact with the substrate W, but may be formed to only be close to the edge portion 330 of the substrate W. The body member 410 may be formed to be higher than the height of the substrate W so that the sidewall portion 411 may be formed on the side of the edge portion 330 of the substrate W. As shown in FIG.

The protrusion member 420 is formed to protrude a predetermined length in the lateral direction from the side surface of the body member 410 . The protruding member 420 may be formed to protrude in an inner direction of the body 221 of the support member 220 , that is, in a direction in which the substrate W is positioned.

The protrusion member 420 may be formed at a position h3 lower than the height h2 of the substrate W. Also, the protrusion member 420 may be formed to pass through the edge portion 330 of the substrate W adjacent to the edge ring 310 and extend to the inside thereof.

When the protruding member 420 is formed in this way, as shown in FIG. 11 , when the chemical solution 320 moves along the airflow 350 , the movement of the chemical solution 320 is the side wall portion 411 of the body member 410 . can be inhibited by the , thus increasing the residence time of the chemical solution 320 in the edge portion 330 of the substrate (W), it is possible to minimize the influence of the airflow (350).

In addition, the chemical solution 320 passes through a zigzag path formed by the edge portion 330 of the substrate W and the protruding member 420 of the edge ring 310, and the chemical solution 320 Since it is possible to reduce the moving speed of the chemical solution 320 may further increase the time for staying in the edge portion 330 of the substrate (W). 11 is an exemplary view for explaining the function and effect of an edge ring constituting a substrate processing apparatus according to another embodiment of the present invention.

It will be described again with reference to FIG. 10 .

The protrusion member 420 may be formed to have a flat top surface. However, the present embodiment is not limited thereto. The protrusion member 420 may be formed so that the upper surface thereof has an inclination so that the chemical solution 320 can flow well in the downward direction.

When the upper surface of the protrusion member 420 is formed to have an inclination, as shown in FIG. 12 , the protrusion member 420 may be formed to have a linear inclination 431 . 12 is a second exemplary view illustrating an installation form of an edge ring constituting a substrate processing apparatus according to another embodiment of the present invention.

However, the present embodiment is not limited thereto. The protrusion member 420 may be formed to have a curved slope 432 as shown in FIG. 13 , or may be formed to have a stepped slope 433 as shown in FIG. 14 . 13 is a third exemplary view illustrating an installation form of an edge ring constituting a substrate processing apparatus according to another embodiment of the present invention, and FIG. 14 is an edge constituting an edge ring constituting the substrate processing apparatus according to another embodiment of the present invention. It is a fourth exemplary view showing the installation form of the ring.

On the other hand, when the upper surface of the protrusion member 420 is formed to have a slope, one side 441 of the upper surface located at a distance close to the body member 410 is an upper portion located at a far distance from the body member 410 . It may be formed to be higher than the other side 442 .

On the other hand, the body member 410 is a support member 220 along a path of the zigzag form in which the chemical solution 320 is formed by the edge portion 330 of the substrate W and the protruding member 420 of the edge ring 310 . A passage 450 through which the chemical liquid 320 can pass may be formed on its bottom surface as shown in FIG. 15 so that it can be discharged to the outside after being moved onto the body 221 of the 15 is a fifth exemplary view illustrating an installation form of an edge ring constituting a substrate processing apparatus according to another embodiment of the present invention.

The edge ring 310 according to various embodiments of the present invention has been described with reference to FIGS. 3 to 15 above. The edge ring 310 according to the present embodiment may be defined as follows.

First, the edge ring 310 is a mechanism that can partially add thermal energy to the wafer edge when the high-temperature chuck is configured.

Second, the edge ring 310 is a ring-shaped mechanism with an angle to the edge of the substrate.

Third, the edge ring 310 is a mechanism for compensating for temperature due to chemical stagnation under the edge portion of the substrate.

Fourth, the edge ring 310 is a mechanism for minimizing the cooling of the substrate edge portion by convection.

Fifth, the edge ring 310 may be configured in whole or in part of the edge portion of the substrate.

Sixth, the edge ring 310 may be made of a material (such as quartz) that can keep warm.

In the substrate processing apparatus 200 having the edge ring 310 according to the present embodiment, the E/R can be improved by installing the ring at the edge of the substrate to increase the time that high-temperature chemicals stay at the edge of the substrate.

According to FIG. 16 , the edge E/R improvement is expected in the case of the present embodiment 520 compared to the conventional 510 due to an increase in the chemical residence time, and E/R uniformity may also be secured by improving the edge part E/R. In addition, the temperature drop phenomenon can be prevented by minimizing the airflow at the edge of the substrate. 16 is a third exemplary view for explaining functions and effects of an edge ring constituting a substrate processing apparatus according to an embodiment of the present invention.

Although embodiments of the present invention have been described with reference to the above and the accompanying drawings, those of ordinary skill in the art to which the present invention pertains can practice the present invention in other specific forms without changing its technical spirit or essential features. You will understand that there is Therefore, it should be understood that the embodiments described above are illustrative in all respects and not restrictive.

100: substrate processing system 110: index module
111: load port 112: transport frame
120: process processing module 121: buffer unit
122: transfer chamber 125: process chamber
130: carrier 200: substrate processing apparatus
210: cup 220: support member
221: body 222: support pin
223: chuck pin 224: first support shaft
230: lifting unit 240: spraying member
250: controller 310: edge ring
320: chemical solution 330: edge portion of the substrate
341: first region portion 341a: first end
341b: second end 342: second region portion
350: airflow 370: lamp
410: body member 420: protruding member

Claims (9)

Supporting a substrate to be seated on a body, supporting the substrate using a plurality of support pins formed on the upper portion of the body, formed in a band shape along the outside of the support pins, and formed higher than the height of the substrate a support member comprising an edge ring;
a spraying member for spraying a chemical onto the substrate to clean the substrate; and
and a cup for recovering the chemical sprayed on the substrate,
The edge ring is
a body member formed on the body and formed adjacent to a side surface of the substrate in the form of a sidewall; and
and a protrusion member formed to extend from the side surface of the body member in a direction in which the substrate is located,
The protrusion member is formed at a position lower than a height of the substrate, and an upper portion thereof is formed to have an inclination. delete delete delete delete The method of claim 1,
The protrusion member is formed to extend from a side surface of the body member so that a part thereof is located on the bottom surface of the substrate. delete The method of claim 1,
The body member has a substrate processing apparatus in which a hole passing through the other side is formed from one lower side thereof. The method of claim 1,
The edge ring is a substrate processing apparatus formed of a material having a heat insulating material.

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