KR102274002B1 - Steam device and stripping system including the same - Google Patents

Abstract

An embodiment provides a steam device for applying steam to a substrate, comprising: a first steam unit; and a second steam part spaced apart from the first steam part, wherein the first steam part includes: a first nozzle part for spraying a fluid to the substrate; and a first transfer unit for moving the substrate in a first direction, wherein the second steam unit includes: a second nozzle unit for ejecting a fluid to the substrate; and a second nozzle unit for moving the substrate in a first direction, wherein a discharge pressure of the fluid from the first nozzle unit is smaller than a discharge pressure of the fluid from the second nozzle unit.

Description

STEAM DEVICE AND STRIPPING SYSTEM INCLUDING THE SAME

The embodiment relates to a steam device and a cleaning system comprising the same.

In recent years, display panels and semiconductor devices are becoming increasingly miniaturized, and problems such as scratching, uniformity of stains, thickness deviation, and fine bending of the panel that occur during cleaning are emerging. There is a problem that occurs when there is a problem with quality.

In this regard, the steam cleaning equipment for display is an equipment intended to increase the yield by removing foreign substances (organic and inorganic substances) generated during the panel production process. In particular, it is essential in the display manufacturing process, where production yield is a very important issue, and chemical cleaning and physical cleaning methods have been used in the past.

As a semiconductor device is manufactured by integrating fine circuit lines with high density, a corresponding precision polishing must be performed on the wafer surface. In order to more precisely polish the wafer, a chemical mechanical polishing process in which chemical polishing is concurrently performed as well as mechanical polishing may be performed.

This chemical mechanical polishing process is a wide area planarization that removes the height difference between the cell area and the surrounding circuit area due to the unevenness of the wafer surface that is generated while repeatedly performing masking, etching, and wiring processes during the semiconductor device manufacturing process, and the circuit formation contact/ It is a process of precision polishing the surface of a wafer in order to improve the surface roughness of the wafer due to the separation of the wiring film and the high-integration device.

In addition, the wafer on which the polishing process has been completed is held by the carrier head and subjected to a cleaning process of cleaning foreign substances attached to the process surface.

In addition, as semiconductors are miniaturized and highly integrated, the importance of cleaning efficiency of wafers is gradually increasing. In particular, if foreign substances remain on the surface of the wafer even after the cleaning process of the wafer is completed in the cleaning module, the yield is lowered, and the stability and reliability are lowered.

However, as it is necessary to additionally provide a preliminary cleaning space for performing preliminary cleaning separately from the cleaning module, it is disadvantageous to the layout of the equipment, and there is a problem in that wafer transfer and cleaning processes are complicated and cleaning time is increased.

The embodiment provides a steam device with improved cleaning effect.

In addition, there is provided a steam device in which the injection direction of the nozzle is different.

In addition, a steam device that is easy to minimize is provided.

The problem to be solved in the embodiment is not limited thereto, and it will be said that the purpose or effect that can be grasped from the solving means or embodiment of the problem described below is included.

A steam device according to an embodiment is a steam device for applying steam to a substrate, comprising: a first steam unit; and a second steam part spaced apart from the first steam part, wherein the first steam part includes: a first nozzle part for spraying a fluid to the substrate; and a first transfer unit for moving the substrate in a first direction, wherein the second steam unit includes: a second nozzle unit for ejecting a fluid to the substrate; and a second nozzle unit for moving the substrate in a first direction, wherein a discharge pressure of the fluid from the first nozzle unit is smaller than a discharge pressure of the fluid from the second nozzle unit.

The first nozzle unit may be spaced apart from the substrate by a first separation distance, the second nozzle unit may be spaced apart from the substrate by a second separation distance, and the first separation distance may be smaller than the second separation distance.

The first nozzle unit may form a first angle with a first imaginary line perpendicular to the substrate, and the first angle may be changed.

The second nozzle part may form a second angle with a second imaginary line perpendicular to the substrate, and the second angle may be smaller than the first angle.

The first nozzle part and the second nozzle part may be spaced apart from each other.

The first nozzle unit may include: a first upper surface into which a fluid is injected; a first lower surface to which the fluid is emitted; and a first through hole penetrating the first upper surface and the first lower surface from the inside.

The second nozzle unit may include a second upper surface into which the fluid is injected; a second lower surface from which the fluid is emitted; and a second through hole penetrating the second upper surface and the second lower surface from the inside.

An area of the first lower surface may be larger than an area of the second lower surface.

The first transfer unit and the second transfer unit may include a plurality of transfer rollers for transferring the substrate in a first direction.

Further comprising; a speed control unit for controlling the conveying speed of the first conveying unit and the conveying speed of the second conveying unit, wherein the speed control unit may control the conveying speed of the first conveying unit to be smaller than the conveying speed of the second conveying unit have.

According to an embodiment, a steam device having an improved cleaning effect may be implemented.

In addition, it is possible to manufacture a steam device in which the jetting direction of the nozzle is different.

In addition, it is possible to manufacture a steam device that can be easily minimized.

In addition, by applying the steam cleaning method compared to the chemical/physical cleaning method, the average size of the sprayed particles is small, and the damage to the fine pattern can be reduced by having a lower working pressure, and due to the small particle size The cleaning effect can be maximized by penetrating between the fine patterns.

Various and advantageous advantages and effects of the present invention are not limited to the above, and will be more easily understood in the course of describing specific embodiments of the present invention.

1 is a schematic diagram of a peeling system according to an embodiment;
2 is a perspective view of a peeling system according to an embodiment;
3 is a top view of a steam device of a peeling system according to an embodiment, and FIG. 4 is a side view of a steam device of a peeling system according to an embodiment;
5 is a side view of a peeling system according to one embodiment;
6 is a cross-sectional view of a first steam unit according to an embodiment;
7 is a perspective view of a first steam unit according to an embodiment;
8 is a bottom view of the first steam unit according to an embodiment;
9 is a side view of a first steam unit according to an embodiment;
10 is another side view of the first steam unit according to an embodiment;
11 is an isometric view of a second steam unit according to an embodiment;
12 is a side view of a second steam unit according to an embodiment;
13 is a conceptual diagram of a steam device according to another embodiment;
14 is a side view of a steam device according to another embodiment;
15 is an enlarged view of part A in FIG. 14;
16 is an enlarged view of part B in FIG. 14;
17 is a side view of a steam apparatus according to another embodiment;

Since the present invention can have various changes and can have various embodiments, specific embodiments are illustrated and described in the drawings. However, this is not intended to limit the present invention to specific embodiments, and it should be understood to include all modifications, equivalents and substitutes included in the spirit and scope of the present invention.

Terms including an ordinal number such as second, first, etc. may be used to describe various elements, but the elements are not limited by the terms. The above terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the second component may be referred to as the first component, and similarly, the first component may also be referred to as the second component. and/or includes a combination of a plurality of related listed items or any of a plurality of related listed items.

When a component is referred to as being “connected” or “connected” to another component, it is understood that the other component may be directly connected or connected to the other component, but other components may exist in between. it should be On the other hand, when it is mentioned that a certain element is "directly connected" or "directly connected" to another element, it should be understood that the other element does not exist in the middle.

The terms used in the present application are only used to describe specific embodiments, and are not intended to limit the present invention. The singular expression includes the plural expression unless the context clearly dictates otherwise. In the present application, terms such as “comprise” or “have” are intended to designate that a feature, number, step, operation, component, part, or combination thereof described in the specification exists, but one or more other features It should be understood that this does not preclude the existence or addition of numbers, steps, operations, components, parts, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning in the context of the related art, and should not be interpreted in an ideal or excessively formal meaning unless explicitly defined in the present application. does not

Hereinafter, the embodiment will be described in detail with reference to the accompanying drawings, but the same or corresponding components are given the same reference numerals regardless of reference numerals, and overlapping descriptions thereof will be omitted.

1 is a schematic diagram of a peeling system according to an embodiment, and FIG. 2 is a perspective view of a peeling system according to an embodiment.

The peeling system 1 includes a loader device 10 for loading a substrate, which is a base material including a wafer, glass, etc., a steam device 20 for cleaning the substrate, a rinse device 30 for cleaning the cleaned substrate, and the It may include a drying device 40 for drying the substrate, and an unloader device 50 for discharging the dried substrate to the outside.

First, the loader device 10 may load a plurality of substrates from the outside. In addition, the steam device 20 may remove foreign substances present on the surfaces of the loaded substrates. In this case, the steam device 20 may remove the foreign material through steam, and details thereof will be described below with reference to FIGS. 2 to 17 .

In addition, the rinsing device 30 may wash the substrate using a predetermined liquid. And the drying device 40 may dry the substrate. For example, the drying apparatus 40 may rotate the substrate by centrifugal force in a predetermined rpm range. Through this rotation, the cleaning liquid and the like can be easily removed. However, it is not limited to this method.

Thereafter, the unloader device 50 may take out the dried substrate to the outside. The unloader device 50 may be formed integrally with the loader device 10 , but is not limited thereto.

As described above, the peeling system 1 may take the substrate in and carry it out after cleaning, washing, and drying processes are sequentially performed. Accordingly, even if a foreign material is formed on the substrate that has undergone a process such as etching, it can be easily removed. Accordingly, it is possible to prevent malfunction and reliability deterioration due to foreign substances.

3 is a top view of a steam apparatus of a peeling system according to an embodiment, FIG. 4 is a side view of a steam apparatus of a peeling system according to an embodiment, and FIG. 5 is a side view of a peeling system according to an embodiment.

3 to 5 , the steam device 20 according to an embodiment may include a first steam unit 210 and a second steam unit 220 . In this case, the first steam unit 210 may be spatially separated from the second steam unit 220 . For example, the first steam unit 210 and the second steam unit 220 may be spaced apart and arranged side by side in the first direction (X-axis direction). Here, the first direction (X-axis direction) is a direction in which the substrate moves in the steam apparatus 20 , the second direction (Y-axis direction) is a direction perpendicular to the first direction (X-axis direction), and the third The direction (Z-axis direction) is a direction perpendicular to both the first direction (X-axis direction) and the second direction (Y-axis direction). All of these criteria can be equally applied to the following.

In addition, the first steam unit 110 includes a first inlet through which the substrate is introduced and a first outlet through which the substrate is discharged, and the second steam unit 120 includes a second inlet through which the substrate passing through the first steam unit enters. It may include a second outlet through which the substrate is discharged.

The first steam unit 110 may include a first nozzle unit 111 for spraying a fluid, and a first transfer unit 112 for moving the substrate in a first direction.

More specifically, the first steam unit 110 is connected to the first housing 113 and the first housing 113 surrounding the first nozzle unit 111 and includes a hollow first inlet line 114 . can

First, the first nozzle unit 111 may be connected to the first steam unit 110 . For example, the first nozzle unit 111 may be located below the upper surface of the first nozzle unit 111 . And the first nozzle unit 111 may include a plurality of first holes. The plurality of first holes may be sprayed onto the substrate through which steam introduced through the first inlet line 114 is transferred between the first transfer unit 112 and the first nozzle unit 111 . In an embodiment, the first transfer unit 112 may be spaced apart from the first nozzle unit 111 to form a space in which the substrate can be transferred. And by such a configuration, the first nozzle unit 111 can set the environment around the substrate to a desired temperature, humidity, etc. by spraying steam. In addition, the bonding force between the foreign material layer (hereinafter, organic material O) on the substrate and the substrate may be reduced.

In addition, the first housing 113 may be disposed above the first nozzle unit 111 and may be smaller than a planar area of the first nozzle unit 111 . Also, the first housing 113 may be disposed to surround regions of the plurality of first holes in the first nozzle unit 111 . Accordingly, the steam introduced through the first housing 113 may be efficiently discharged to the lower substrate through the first hole without loss.

Specifically, one end of the first inlet line 114 may be connected to the upper portion of the first housing 113 through a predetermined passage. In addition, the first inlet line 114 may be connected to a device that supplies steam at the other end. A device for supplying such steam may exist inside or outside the steam device 20 . In addition, the steam introduced through the first inlet line 114 may be introduced in a heated state by increasing to a predetermined temperature.

The first nozzle unit 111 may be disposed to have a height difference (hd) with the upper surface of the first steam unit 110 . With this configuration, the discharge pressure of the steam injected to the substrate through the second nozzle unit 121 may be greater than the discharge pressure of the steam injected to the substrate through the first nozzle unit 111 . In addition, by having a predetermined separation distance between the first nozzle unit 111 and the substrate, the spraying degree of steam to the substrate may be uniformly maintained. In addition, the first nozzle unit 111 may be located above the second nozzle unit 121 to be described later.

A detailed description of the first steam unit 110 will be described later.

In addition, the second steam unit 120 includes a second nozzle unit 121 for spraying a fluid, a second transfer unit 122 for moving the substrate in a first direction (X-axis direction), and a second inlet line 123 . can do.

First, there may be a plurality of second nozzle units 121 . And the second nozzle unit 121 may spray the fluid to the substrate below. Accordingly, the second nozzle unit 121 may have an outlet at a lower portion.

In addition, the fluid may consist of a mixture of various substances. According to an embodiment, the fluid may include steam provided from a steam supply unit (not shown), deionized water (DIW) provided from a deionized supply unit (not shown) in which deionized water (DI) is stored, and CDA, which is a cleaning gas. have. Hereinafter, it will be described that the first fluid means steam, the second fluid means DIW, and the third fluid means CDA.

These fluids may be provided to the first nozzle unit 121 through different inlet lines, respectively. Accordingly, there may be a plurality of inflow lines, and the second steam unit 120 may include a 2-1 inflow line 123a and a 2-2 inflow line 123b.

In addition, the second nozzle unit 121 may spray steam onto the substrate to remove the foreign material layer present on the substrate by indirect force. That is, the second nozzle unit 121 may remove the organic material O remaining on the substrate. A detailed description of the second nozzle unit 121 will be described later.

In addition, the second nozzle part 121 and the first nozzle part 111 may be spaced apart from each other, and the first transfer part 112 and the second transfer part 122 may also be spaced apart. In addition, the first transfer unit 112 and the second transfer unit 122 may rotate to move the substrate in the same direction (first direction).

The second transfer unit 122 may be disposed under the second steam unit 120 to move the substrate into the second steam unit 120 through the first transfer unit 112 . The second transfer unit 122 may include a plurality of transfer rollers that rotate like the first transfer unit 112 . In addition, the plurality of transfer rollers may be arranged side by side in the first direction (X-axis direction), and may rotate to transfer the substrate in the first direction (X-axis direction).

In this case, the transport speed S2 of the second transport unit 122 may be different from the transport speed S1 of the first transport unit 112 . Here, the transport speed is defined as a speed at which the substrate is transported by the transport unit. In an embodiment, the transfer speed of the first transfer unit 112 and the second transfer unit 122 may be controlled by the speed control unit 130 .

In addition, the steam device 20 may further include a transport tunnel disposed between the first steam unit 110 and the second steam unit 120 as will be described later. The transfer tunnel may provide a spatial connection between the first steam unit 110 and the second steam unit 120 . In addition, the transfer tunnel may be disposed on a path through which the substrate W is transferred from the first steam unit 110 to the second steam unit 120 . Accordingly, the substrate W subjected to the primary steam treatment in the first steam unit 110 may be moved to the second steam unit 120 to be subjected to secondary steam treatment.

At this time, the transfer tunnel T may be opened when the substrate W moves from the first steam unit 110 to the second steam unit 120 , and may be closed in other cases. For example, by installing a sensor in the first transfer unit 112 adjacent to the transfer tunnel T, and determining whether the substrate W is adjacent to the transfer tunnel T by obtaining information such as weight and pressure from the sensor, the transfer tunnel ( T) opening/closing can be controlled.

6 is a cross-sectional view of a first steam unit according to an embodiment, FIG. 7 is a perspective view of a first steam unit according to an embodiment, FIG. 8 is a bottom view of the first steam unit according to an embodiment, and FIG. A side view of a first steam unit according to an embodiment, and FIG. 10 is another side view of the first steam unit according to an embodiment.

6 to 10 , as described above, at this time, the first inlet line 114 is disposed above the first housing 113 , and the steam introduced through the hollow flows from the upper portion of the first housing 113 . It may move into the first housing 113 .

In this group, the first inlet line 114 may be centrally located on the upper surface of the first housing 113 . The first inlet line 114 may be disposed so as to overlap the intersection of the bisectors of the corners in contact with the plurality of side surfaces on the upper surface of the first housing 113 . Accordingly, the steam introduced through the first inlet line 114 may uniformly move as a whole in the first housing 113 .

Also, as described above, the first housing 113 may include a plurality of side surfaces. In an embodiment, the first housing 113 may include a 1-1 side surface 113a facing each other and a 1-2 side side 113b facing each other and connected to the 1-1 side surface 113a. . In this case, the length of the first-first side surface 113a in the first direction may be greater than the length in the third direction of the 1-2-th side surface 113b. That is, by setting the length of the side of the first housing 113 to correspond to the length in the first direction in which the substrate moves, the effect of separating foreign substances by steam may be further improved. Accordingly, a reduction in bonding force between the foreign material layer (hereinafter, organic material O) on the substrate by steam and the substrate may be further increased.

Also, the first nozzle unit 111 may be disposed under the first housing 113 as described above. In this case, the first nozzle unit 111 includes the first housing 113 and the first region 111a overlapping the first housing 113 in the second direction and the second region other than the first region 111a. The region 111b may be included. That is, the second region 111b may not overlap the first housing 113 in the second direction.

In addition, the second region 111b may be disposed to surround the first region 111a. That is, by having the second region 11b, the area of the first nozzle unit 111 on the plane XZ may be larger than that of the first housing 113 . Accordingly, the first nozzle unit 111 can easily prevent the steam inside the twelfth housing 113 from escaping to the outside while easily supporting the first housing 113 .

Also, the first nozzle unit 111 may be disposed to face the first inlet line 114 . For example, the first inlet line 114 may be located above the first steam unit 110 , and the first nozzle unit 111 may be located below the first inlet line 114 . In addition, the first inlet line 114 is connected to the upper surface of the first housing 113 , but the first nozzle part 111 may be located on the lower surface of the first housing 113 . As described above, the first nozzle unit 111 and the first inlet line 114 are positioned to face each other so that the steam inside the first housing 113 is uniformly discharged downward through the hole of the first nozzle unit 111 . can keep

Also, a plurality of holes may be disposed in the first nozzle unit 111 as described above, and the plurality of holes may be disposed in parallel and at regular intervals in the first direction and the third direction. Accordingly, the steam sprayed downward through the hole of the first nozzle unit 111 is uniformly irradiated to the moving substrate, so that the foreign material layer can be easily separated from the entire substrate. That is, the second steam unit 120 may provide an environment in which the foreign material layer is formed on the entire substrate by inertia by the fluid.

The above-described first steam unit may be formed in one piece or by assembling a plurality of modules and components. However, it is not limited to this configuration.

11 is an isometric view of a second steam unit according to an embodiment, and FIG. 12 is a side view of the second steam unit according to an embodiment.

11 and 12 , the second steam unit 120 may be divided into a plurality of layers.

Specifically, the second steam unit 120 may include a first steam member 121a, a second steam member 121b, a third steam member 121c, and a fourth steam member 121d.

The first steam member 121a may be disposed on the second steam member 121b. The second steam member 121b may be disposed on the third steam member 121c, and the third steam member 121c may be disposed on the fourth steam member 121d.

The first steam member 121a may cover the second steam member 121b and the third steam member 121c. That is, the first steam member 121a may be disposed to surround the side surfaces of the second steam member 121b and the third steam member 121c.

In addition, the area of the third steam member 121c may be larger than that of the second steam member 121b. In addition, the area of the fourth steam member 121d may be larger than that of the third steam member 121c. Also, the maximum area of the fourth steam member 121d may be the same as the maximum area of the first steam member 121a.

Also, a hole is disposed in a region where the fourth steam member 121d and the first steam member 121a contact each other, so that the fluid therein may be discharged downward through the hole.

First, the second steam member 121b may be connected to a fluid supply unit for supplying each fluid. That is, each of the second steam member 121b to the fourth steam member 121d may be connected to the second inlet line to receive the fluid. For example, the second steam member 121b may be connected to the 2-1 inlet line. For example, the second steam member 121b may receive steam, the third steam member 121c may receive DIW, and the fourth steam member 121d may receive CDA.

The second steam member 121b may include a first discharge hole h1, the third steam member 121c may include a second discharge hole h2, and the fourth steam member 121d. may include a third discharge hole.

Accordingly, the first fluid K1 and the second fluid K2 discharged on one side through the second steam member 121b and the third steam member 121c are respectively the first discharge hole h1 and the second discharge hole. It may move downward along the first steam member 121a past (h2). And the third fluid K3 discharged to the other side through the fourth steam member 121d may move downward along the fourth steam member 121d.

At this time, the second steam unit 120 includes a first side surface 1300 and a second side surface 1400 facing the first side surface 1300, connected to the first side surface 1300 and inclined downward. A second inclined surface 1200 connected to the first inclined surface 1100 and the second side surface 1400 , inclined downward, and in contact with the first inclined surface 1100 may be included.

In this case, the length of the first side surface 1300 in the second direction may be different from the length of the second side surface 1400 in the second direction. In an embodiment, the length of the first side surface 1300 in the second direction may be smaller than the length of the second side surface 1400 in the second direction. Also, the first inclined surfaces 1100 may have different lengths extending in the second direction. In an embodiment, the length of the first inclined surface 1100 extending in the second direction may be greater than the length of the second inclined surface 1200 extending in the second direction.

By controlling the length, the pressure (discharge pressure) discharged to the bottom after the discharged first fluid K1 and the second fluid K2 are mixed and finally mixed with the third fluid K3 can be easily controlled. At this time, through the discharge space between the first inclined surface 110 and the second inclined surface 1200, all of the first to third fluids may be mixed and discharged to the lower portion. Also, the above-described first discharge hole h1 to third discharge hole h3 may be plural. FIG. 13 is a conceptual diagram of a steam apparatus according to another embodiment, and FIG. 14 is a steam apparatus according to another embodiment. It is a side view, FIG. 15 is an enlarged view of part A in FIG. 14 , FIG. 16 is an enlarged view of part B in FIG. 14 , and FIG. 17 is a side view of a steam apparatus according to another embodiment.

13 and 14 , the steam device 20 according to another embodiment may include a first steam unit 210 and a second steam unit 220 . In this case, the first steam unit 210 may be spatially separated from the second steam unit 220 . The first steam unit 210 and the second steam unit 220 may be spaced apart from each other and arranged side by side in the first direction (X-axis direction). As described above, the first direction (X-axis direction) is a direction in which the substrate W moves in the steam apparatus 20 , and the second direction (Y-axis direction) is in the first direction (X-axis direction). The direction is perpendicular, and the third direction (Z-axis direction) is perpendicular to both the first direction (X-axis direction) and the second direction (Y-axis direction). In addition, components having the same name may be different according to the contents described in each embodiment, and parts not described may be easily changed to different embodiments. And the first steam unit 210 is a substrate The inlet may be introduced, and the second steam unit 220 may include an outlet through which the substrate is discharged.

First, the first steam unit 210 may include a plurality of first nozzle units 211 for spraying a fluid, and a first transfer unit 212 for moving the substrate W in a first direction. In addition, the second steam unit 220 may include a plurality of second nozzle units 221 for spraying a fluid and a second transfer unit 222 for moving the substrate W in a first direction (X-axis direction). have.

In addition, the second nozzle part 221 and the first nozzle part 211 may be spaced apart from each other, and the first transfer part 212 and the second transfer part 222 may also be spaced apart. In addition, the first transfer unit 212 and the second transfer unit 222 may rotate to move the substrate W in the same direction (first direction).

More specifically, the first nozzle unit 211 may include a plurality of nozzle devices, and the first nozzle unit 211 may also include a plurality of nozzle units. For example, the first nozzle unit 211 may include a 1-1 nozzle unit 211a, a 1-2 nozzle unit 211b, and a 1-3 nozzle unit 211c. In addition, the 1-1 nozzle part 211a, the 1-2 nozzle part 211b, and the 1-3 nozzle part 211c may be sequentially disposed in the first direction (X-axis direction).

The 1-1 nozzle unit 211a, the 1-2 nozzle unit 211b, and the 1-3 nozzle unit 211c may eject steam to the outside. That is, the first nozzle unit 211 may spray steam to set the environment around the substrate W to a desired temperature, humidity, or the like. Due to this configuration, the binding force of the foreign material layer (hereinafter, the organic material O) on the substrate W may be reduced.

Also, the first nozzle unit 211 may receive steam from a steam supply unit (not shown). In addition, the steam supply unit (not shown) may raise the steam to a predetermined temperature and maintain it in a heated state. That is, the first nozzle unit 211 may receive steam from a steam supply unit (not shown) through a steam pipe (not shown), and may spray the steam to the outside.

In addition, the second nozzle unit 221 may be formed of a nozzle device, and may be plural. For example, the second nozzle unit 221 may include a 2-1 nozzle unit 221a, a 2-2 nozzle unit 221b, and a 2-3 nozzle unit 221c. In addition, the 2-1 nozzle part 221a, the 2-2 nozzle part 221b, and the 2-3th nozzle part 221c may be sequentially disposed in the first direction (X-axis direction).

In addition, the 2-1 nozzle unit 221a, the 2-2 nozzle unit 221b, and the 2-3 nozzle unit 221c may receive steam from the above-described steam supply unit (not shown) and eject it to the outside. have. In addition, the second nozzle unit 221 may spray steam onto the substrate W to remove the foreign material layer present on the substrate W by indirect force. That is, the second nozzle unit 221 may remove the organic material O remaining on the substrate W.

In addition, the second nozzle unit 221 may receive steam from a steam supply unit (not shown) and additionally receive deionized water from a deionized supply unit (not shown) in which deionized water (DI) is stored. Furthermore, the second nozzle unit 221 may additionally receive a cleaning gas such as _{N 2 , CDA, or the like.} However, it is not limited to this type.

In addition, the first transfer unit 212 may be disposed under the first steam unit 210 to move the substrate W transferred from the loader device 10 . The first transfer unit 212 may include a plurality of rotating transfer rollers. In addition, the plurality of conveying rollers may be arranged side by side in the first direction (X-axis direction), and may rotate to convey the substrate W in the first direction (X-axis direction).

In addition, the first transfer unit 212 may be spaced apart from the first nozzle unit 211 to form a space in which the substrate W can be transferred.

The second transfer unit 222 may be disposed under the second steam unit 220 to move the substrate W into the second steam unit 220 through the first transfer unit 212 . The second transfer unit 222 may include a plurality of transfer rollers that rotate like the first transfer unit 212 . In addition, the plurality of conveying rollers may be arranged side by side in the first direction (X-axis direction), and may rotate to convey the substrate W in the first direction (X-axis direction).

In this case, the transport speed S2 of the second transfer unit 222 may be different from the transfer speed S1 of the first transfer unit 212 . Here, the transport speed is defined as a speed at which the substrate W is transported by the transport unit. In an embodiment, the transfer speed of the first transfer unit 212 and the second transfer unit 222 may be controlled by the speed control unit 230 .

Accordingly, the transfer speed S1 of the first transfer unit 212 may be smaller than the transfer speed S2 of the second transfer unit 222 . And even if the length in the first direction (X-axis direction) of the first transfer unit 212 is smaller than the length in the first direction (X-axis direction) of the second transfer unit 222 , the substrate W is transferred to the first transfer unit 212 . ) and the time present in the second transfer unit 222 may be the same. According to this configuration, the size of the first steam unit 210 and the second steam unit 220 can be easily reduced by adjusting the transport speed.

In addition, the steam device 20 may further include a transport tunnel T disposed between the first steam unit 210 and the second steam unit 220 . The transfer tunnel T may provide a spatial connection between the first steam unit 210 and the second steam unit 220 . In addition, the transfer tunnel T may be disposed on a path through which the substrate W is transferred from the first steam unit 210 to the second steam unit 220 . Accordingly, the substrate W subjected to the primary steam treatment in the first steam unit 210 may be moved to the second steam unit 220 to be subjected to secondary steam treatment.

At this time, the transfer tunnel T may be opened when the substrate W moves from the first steam unit 210 to the second steam unit 220 , and may be closed in other cases. For example, by installing a sensor in the first transfer unit 212 adjacent to the transfer tunnel T, and determining whether the substrate W is adjacent to the transfer tunnel T by obtaining information such as weight and pressure from the sensor, the transfer tunnel ( T) opening/closing can be controlled.

15 and 16 , as described above, the first nozzle unit 211 in the first steam unit 210 may be spaced apart from the substrate W to have a first separation distance h1. . In this case, the first separation distance h1 is the minimum distance between the substrate w and the first nozzle unit 211 . Also, the first nozzle unit 211 may spray steam around the substrate W. In this case, the first nozzle unit 211 may spray steam toward the upper surface of the substrate W, but is not limited thereto.

In addition, the first nozzle unit 211 may include a first upper surface 211-1 through which steam is injected and a first lower surface 211-2 through which steam is emitted. In addition, the first nozzle part 211 may include a first through hole H1 through which steam passes. The first through hole H1 may pass through the first upper surface 211-1 and the first lower surface 211-2 of the first nozzle unit 211 .

Also, the area of the first through hole H1 may change according to a location. For example, the area of the first through hole H1 includes a first area R1 that is the area of the first upper surface 211-1, a third area R3 that is an area of the first lower surface 211-2, and the first A second area R2 that is a minimum area may be included between the upper surface 211-1 and the first lower surface 211-2.

In this case, the area may decrease in the order of the first area R1 , the third area R3 , and the second area R2 . More specifically, the area of the first through hole H1 may gradually decrease to the second area R2 while maintaining the first area R1 along the steam flow direction. In addition, the area may gradually increase from the second area R2 to the third area S3 .

Accordingly, the first nozzle unit 211 according to the embodiment maintains the first area R1 to stabilize the flow of steam. In addition, as the area decreases up to the second area R2 , steam is compressed to increase the flow rate. In addition, the area is gradually increased up to the third area R3 so that the fluid (ie, steam) having an increased flow rate may be uniformly discharged to the outside.

Accordingly, the fluid injected to the first nozzle unit 211 may move toward the substrate W. At this time, the fluid may be positioned around the organic material O on the substrate W to reduce the bonding force K between the substrates W. In addition, the bonding force between the inorganic material (I) and the organic material (O) positioned between the fluid organic material (O) and the substrate (W) may also be reduced. Here, the organic material (O) is meant to include residues and impurities formed on the substrate (W) or the inorganic material (I).

In addition, in the second steam unit 220 , the second nozzle unit 221 may be spaced apart from the substrate W to have a second separation distance h2 . In this case, the second separation distance h2 is the minimum distance between the substrate w and the second nozzle unit 221 .

In addition, the second nozzle unit 221 may spray steam around the substrate W. In this case, the second nozzle unit 221 may spray steam toward the upper surface of the substrate W. In addition, the second nozzle unit 221 may include a second upper surface 221-1 through which steam is injected and a second lower surface 221-2 through which steam is emitted. In addition, the second nozzle part 221 may include a second through hole H2 through which steam passes.

The second through hole H2 may pass through the second upper surface 221-1 and the second lower surface 221-2 of the second nozzle unit 221 . Also, the area of the second through hole H2 may vary according to the location. For example, the area of the second through hole H2 is a fourth area R4 that is the area of the second upper surface 221-1, a sixth area R6 that is the area of the second lower surface 221-2, and a second area of the second through hole H2. A fifth area R5 that is the minimum area between the upper surface 221-1 and the second lower surface 221-2 may be included.

In this case, the area may decrease in the order of the fourth area R4 , the sixth area R6 , and the fifth area R5 . As described above, the area of the second through hole H2 may gradually decrease to the fifth area R5 while maintaining the fourth area R4 along the steam flow direction. In addition, the area may gradually increase from the fifth area R5 to the sixth area S6 .

Accordingly, the second nozzle unit 221 according to the embodiment may maintain the fourth area R4 to stabilize the flow of steam. In addition, as the area decreases up to the fifth area R5 , steam is compressed to increase the flow rate. In addition, the fluid (ie, steam) having an increased flow rate by gradually increasing the area up to the sixth area R6 may be uniformly discharged to the outside. Accordingly, the fluid injected to the second nozzle unit 221 may move toward the substrate W.

However, the sixth area R6 may be smaller than the above-described third area R3 . Accordingly, the discharge pressure of the first nozzle unit 211 may be smaller than the discharge pressure of the second nozzle unit 221 . In an embodiment, the discharge pressure by the first nozzle unit 211 may be 30% to 60% of the discharge pressure by the second nozzle unit 221 . Here, the discharge pressure is defined as a pressure at which a fluid (steam) is injected through the first nozzle unit 211 and the second nozzle unit 221 .

In addition, as an example, the discharge pressure of the fluid discharged through the second nozzle unit 221 may be 1.2 kg/cm ² to 1.5 kg/cm ² . In addition, the discharge pressure of the fluid discharged through the first nozzle unit 221 ^{may be 1.2 kg/cm 2} or less. However, it is not limited by this range.

Accordingly, the first steam unit 210 may concentrate the vapor around the substrate W, and the second steam unit 220 injects a fluid toward the substrate W to obtain the organic material O on the substrate W. The organic material O may be peeled off (L) from the substrate (W) or the like.

In addition, the second separation distance h2 may be smaller than the above-described first separation distance h1. That is, it is sufficient if the fluid injected through the first nozzle unit 211 is adjacent to the substrate W, but the fluid injected through the second nozzle unit 221 has a predetermined collision pressure on the substrate W. can Accordingly, the organic material (O) peeling efficiency by the fluid in the second nozzle unit 221 may be improved.

Also, by increasing the discharge pressure by the second nozzle unit 221 , the collision pressure with the substrate W may be increased.

Referring to FIG. 17 , the first nozzle unit 211 may be rotated to change an angle (hereinafter, referred to as a first angle θ1 ) formed with the first virtual line RL1 perpendicular to the substrate W . Alternatively, the second nozzle unit 221 may be disposed on the second virtual line RL2 perpendicular to the substrate W. As shown in FIG. However, the second nozzle unit 221 may also be disposed to have a predetermined angle with the second virtual line RL2 . However, the second nozzle unit 221 may be disposed to constantly maintain an angle (hereinafter, referred to as a second angle, θ2 ) formed with the second virtual line RL2 . That is, the second angle may be smaller than the first angle. With this configuration, the fluid sprayed from the plurality of first nozzle units 211 may be uniformly sprayed onto the substrate W.

Accordingly, the fluid injected through the first nozzle unit 211 may be uniformly distributed on the substrate W, and as described above, the bonding force between the organic material O on the substrate W and the substrate W is reduced. can do it

And since the second nozzle unit 221 maintains the second angle constant, the same collision pressure may be applied to the fluid on the substrate W in the second direction (Y-axis direction). Accordingly, it is possible to prevent the inorganic material on the substrate W from being peeled off by the fluid or from being damaged by the fluid on the upper surface of the substrate W.

Accordingly, the steam apparatus according to the embodiment can easily peel foreign substances or the like on the substrate W from the substrate W, and can easily prevent defects from occurring in the substrate W. Accordingly, the reliability of the electronic device including the substrate W is finally improved and malfunction due to foreign substances can be prevented from occurring.

The term '~ unit' used in this embodiment means software or a hardware component such as a field-programmable gate array (FPGA) or ASIC, and '~ unit' performs certain roles. However, '-part' is not limited to software or hardware. The '~ unit' may be configured to reside on an addressable storage medium or may be configured to refresh one or more processors. Thus, as an example, '~' denotes components such as software components, object-oriented software components, class components, and task components, and processes, functions, properties, and procedures. , subroutines, segments of program code, drivers, firmware, microcode, circuitry, data, databases, data structures, tables, arrays, and variables. The functions provided in the components and '~ units' may be combined into a smaller number of components and '~ units' or further separated into additional components and '~ units'. In addition, components and '~ units' may be implemented to play one or more CPUs in a device or secure multimedia card.

In the above, the embodiment has been mainly described, but this is only an example and does not limit the present invention, and those of ordinary skill in the art to which the present invention belongs are not exemplified above in the range that does not depart from the essential characteristics of the present embodiment It will be appreciated that various modifications and applications are possible. For example, each component specifically shown in the embodiment can be implemented by modification. And differences related to such modifications and applications should be construed as being included in the scope of the present invention defined in the appended claims.

Claims (10)

In the steam device for applying steam to the substrate,
a first steam unit; and
and a second steam unit spaced apart from the first steam unit,
The first steam unit,
a first nozzle unit for injecting a fluid to the substrate; and
Including; a first transfer unit for moving the substrate in a first direction;
The second steam unit,
a second nozzle unit for injecting a fluid to the substrate; and
and a second transfer unit for moving the substrate in a first direction,
The discharge pressure of the fluid from the first nozzle unit is smaller than the discharge pressure of the fluid from the second nozzle unit,
The second nozzle unit includes a first steam member, a second steam member, a third steam member, and a fourth steam member,
The first steam member is disposed on the second steam member,
The second steam member is disposed on the third steam member,
The third steam member is disposed on the fourth steam member,
The first steam member is disposed to surround the side surfaces of the second steam member and the third steam member,
The second steam unit includes a first discharge hole,
The third steam member includes a second discharge hole,
The fourth steam member includes a third discharge hole,
The first fluid and the second fluid discharged to one side through each of the first discharge hole and the second discharge hole move downward along the first steam member,
The third fluid discharged to the other side through the third discharge hole moves downward along the fourth steam member,
The second steam unit includes a first side, a second side facing the first side,
The length of the first side surface in a direction perpendicular to the direction in which the substrate moves is smaller than the length of the second side surface.
According to claim 1,
The first nozzle unit is spaced apart from the substrate by a first separation distance,
The second nozzle unit is spaced apart from the substrate by a second separation distance,
The first separation distance is smaller than the second separation distance.
According to claim 1,
The first nozzle part forms a first angle with a first imaginary line perpendicular to the substrate,
wherein the first angle is varied.
4. The method of claim 3,
The second nozzle part forms a second angle with a second imaginary line perpendicular to the substrate,
wherein the second angle is less than the first angle.
delete According to claim 1,
The first nozzle unit,
a first upper surface into which the fluid is injected;
a first lower surface to which the fluid is emitted; and
A steam device comprising a; a first through hole penetrating the first upper surface and the first lower surface from the inside.
7. The method of claim 6,
The second nozzle unit,
a second upper surface into which the fluid is injected;
a second lower surface from which the fluid is emitted; and
A steam device comprising a; a second through-hole penetrating the second upper surface and the second lower surface from the inside.
8. The method of claim 7,
An area of the first lower surface is greater than an area of the second lower surface.
According to claim 1,
The first transfer unit and the second transfer unit include a plurality of transfer rollers for transferring the substrate in a first direction.
According to claim 1,
A speed control unit for controlling the transfer speed of the first transfer unit and the transfer speed of the second transfer unit; further comprising,
The speed control unit is a steam device for controlling the transfer speed of the first transfer unit to be smaller than the transfer speed of the second transfer unit.

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