KR102246031B1 - Panel manufacturing method - Google Patents

Abstract

A method for manufacturing a panel including a cutting step of cutting the liquid crystal panel base material 1 along the intended cutting line 2, wherein the first glass mother substrate 3 and the second glass mother substrate 4 are each cut. Including an initial crack formation step of forming initial cracks 8 and 9, respectively, at the ends 3a and 4a located on the one end 2a side of the predetermined line 2, and the liquid crystal panel base material 1 Cutting process by advancing both initial cracks 8 and 9 according to heating by laser irradiation along the intended cutting line 2 and cooling by the coolant following this from the upper surface side of the liquid crystal panel base material 1 Was made to run.

Description

Panel manufacturing method {PANEL MANUFACTURING METHOD}

The present invention relates to a method for manufacturing a liquid crystal panel, an organic EL panel, and the like.

As is well known, a liquid crystal panel includes two glass substrates facing each other, a color filter substrate on which BM, RGB, and photo spacers are patterned, and a TFT substrate on which a thin film transistor or transparent electrode is patterned. Both substrates are bonded by sandwiching the applied sealing material along the circumferential edges thereof, and a liquid crystal material is enclosed in a space surrounded by the sealing material between the two substrates.

By the way, in the case of manufacturing a liquid crystal panel such as a liquid crystal TV or a mobile device, a plurality of liquid crystal panels may be manufactured at once by adopting the following method instead of individually manufacturing a single liquid crystal panel.

In this method, similarly to the first glass mother substrate (color filter mother substrate) formed by forming a pattern of BM, RGB, and photo spacers for multiple faces of a liquid crystal panel on one glass plate, similarly to a single glass plate, a multi-sided thin film transistor or transparent A second glass mother substrate (TFT mother substrate) formed by patterning electrodes is produced. Next, both mother substrates are bonded by sandwiching a plurality of sealing materials, and a liquid crystal panel base material including a plurality of liquid crystal panels is produced by sealing a liquid crystal material in each of the spaces surrounded by the sealing material. Finally, this liquid crystal panel base material can be cut and individual liquid crystal panels can be cut out from the base material.

Here, in the case of manufacturing a liquid crystal panel by the above-described method, a method for cutting a liquid crystal panel base material is disclosed in Patent Document 1.

In the same document, as shown in Fig. 6, laser is applied from the surface side to the liquid crystal panel base material 100 along the boundary Y (between the sealing materials 201 and 202) of the adjacent liquid crystal panels 101 and 102. (L1), a method of cutting the base material 100 by irradiating the laser L2 from the back side is disclosed. In this method, in each of the first glass mother substrate 100a present on the front side of the liquid crystal panel base material 100 and the second glass mother substrate 100b present on the back side, the lasers L1 and L2 are Films 301 and 302 having higher thermal conductivity than both mother substrates 100a and 100b are formed in advance on the back surface of the irradiated site. Thereby, when the liquid crystal panel base material 100 is cut, heat by laser irradiation is concentrated on the boundary Y through the films 301 and 302, and the base material 100 (both mother substrates 100a, 100b) Is cut.

Japanese Patent Publication No. 2002-224870

However, the method disclosed in Patent Document 1 has the following problems to be solved. In other words, in the method disclosed in the same document, in order to cut the liquid crystal panel base material, it is necessary to pre-form a film formation treatment on all portions that become the boundary between the adjacent liquid crystal panel in each of the first glass mother substrate and the second glass mother substrate. It becomes. Therefore, especially when there are a large number of liquid crystal panels to be cut out from the base material of the liquid crystal panel, the film forming process becomes complicated and the production efficiency deteriorates, and the production cost of the panel is increased by forming an essentially unnecessary film in the product. .

Further, in this method, the laser irradiated from the front side of the liquid crystal panel base material can cut only the first glass mother substrate, and the laser irradiated from the back side can cut only the second glass mother substrate. Therefore, when cutting a liquid crystal panel base material, it is essential to irradiate a laser from both the front side and the back side of the base material. In addition, the glass cutting method using a laser tends to be expensive compared to other glass cutting methods (eg, cleaving, etc.). For this reason, there is a concern of further increase in manufacturing cost due to irradiation of the laser from both the front and back sides.

In addition, such a problem is similarly a problem that may occur not only when cutting the liquid crystal panel base material, but also when cutting other panel base materials such as, for example, the base material of an organic EL panel. The present invention made in view of these circumstances makes it possible to cut the panel base material at a low cost and make it possible to easily cut the panel base material when individual panels are cut and manufactured by cutting the panel base material.

In order to solve the above problems, the present invention comprises a first glass mother substrate having a first glass substrate in each region divided by a planned cutting line, and a second glass substrate facing the first glass substrate in each region. By having the provided second glass mother substrate and a mounting member mounted so as to be interposed between the first glass substrate and the second glass substrate in each region, the first glass substrate, the second glass substrate, and the mounting member in each region As a method for manufacturing a panel including a cutting step of cutting the panel base material along an intended cutting line for a panel base material having a panel comprising as a component, in each of a first glass mother base plate and a second glass mother base plate Including an initial crack formation step of forming initial cracks at each end positioned at one end of the planned cutting line of the panel, heating by laser irradiation along the planned cutting line of the panel base material, and cooling by a refrigerant subsequent thereto. It is characterized in that the cutting process is performed by advancing both initial cracks as it is performed from one side of the panel base material.

According to this method, heating by laser irradiation to the panel base material along a predetermined cutting line and cooling by a coolant following this are performed from one side of the panel base material in the execution of the cutting step. Therefore, among the first glass mother substrate and the second glass mother substrate, a temperature gradient is generated in the mother substrate (hereinafter referred to as the irradiation source side mother substrate) positioned on the irradiation source side of the laser, thereby generating thermal stress. And, by this thermal stress, the initial crack advances along the planned cutting line. At this time, not only the mother substrate on the irradiation source side, but also in the mother substrate (hereinafter, referred to as the irradiation target side mother substrate) positioned on the irradiation target side of the laser, it is possible to advance the initial crack along the intended cutting line. It is assumed that such an action is obtained for the following reasons. That is, the mounting member is interposed between the irradiation source side mother substrate and the irradiation destination side mother substrate. It is assumed that the thermal stress generated in the mother substrate on the irradiation source side by the interposition of this mounting member is propagated to the mother substrate on the irradiated side through the mounting member, and the propagated stress is advancing the initial crack in the mother substrate on the irradiation side. . Thereby, both mother substrates are cut by both initial cracks advancing together, and the panel base material is cut. As described above, in this method, if heating by laser irradiation along the line to be cut and cooling by a coolant following this are performed from one side, according to this, the panel base material (the first glass mother substrate and the second glass mosquito Plate) can be cut. Therefore, it becomes possible to cut the panel base material at low cost and easily.

In the above method, the initial crack formation step may be performed by rolling the scribe wheel.

In this way, the initial crack formation process can be performed simply and quickly.

In the method described above, an end portion (hereinafter referred to as a first end) positioned at one end of the line to be cut in the first glass mother substrate and an end portion positioned at one end side of the line to be cut in the second glass mother substrate. It is preferable to position (hereinafter, referred to as a second end portion) shifted in the direction in which the intended cutting line extends.

In this way, one of the first end and the second end is in a state that protrudes from the other. In this way, in the initial crack formation step, it becomes possible to continuously form both initial cracks by simply rolling a single scribe wheel from one end of the line to be cut to the other end or from the other end to one end. .

In the above method, it is preferable that the length of the shift between the first end and the second end is set to 0.2 mm to 5 mm.

Of the first end and the second end, if the protruding length is 0.2 mm or more with respect to the protruding end of the first end and the second end, a sufficient length for the scribe wheel to roll on the protruding end can be secured. Therefore, it becomes possible to form an initial crack suitably with respect to the end of the protruding side. In addition, if the protruding length is less than 5 mm, it is possible to prevent the increase of unnecessary parts (parts installed to form initial cracks) in the base material of the panel as much as possible, thus avoiding high unreasonable manufacturing costs. It becomes possible. In these respects, if the length of the shift between the first end and the second end is set to 0.2 mm to 5 mm, it is possible to form an initial crack suitably and to avoid an unreasonable increase in manufacturing cost.

In the above method, it is preferable to perform the initial crack formation step by rolling the scribe wheel in a direction from the other end of the line to be cut to one end.

In this way, in the initial crack formation step, the scribe wheel is driven from the inner side of the panel base material toward the outer circumferential end. As a result, when both initial cracks are formed, a situation in which the rolling scribe wheel rides to the first end or the second end cannot occur. Therefore, it is possible to avoid unreasonable damage to the first end or the second end due to an impact when climbing.

In the above method, the initial crack formation step may be performed by irradiating a pulsed laser.

Usually, the gap formed between the first glass mother substrate and the second glass mother substrate is very narrow. For this reason, when the first end and the second end are not shifted in the direction in which the intended cutting line extends (when the first end and the second end overlap when the panel base material is viewed in a plan view), the scribe wheel is Even if you try to form an initial crack by entering between the two mother substrates, it may be difficult to do so. However, according to the pulsed laser, it is possible to form an initial crack at a location where the laser is condensed, regardless of whether the first end and the second end are positioned to be shifted. Thereby, both initial cracks can be reliably formed in a desired location.

In the above method, the conditions of laser irradiation in the cutting step are heated by laser irradiation and subsequent to the glass plate having a thickness equal to or greater than the sum of the thickness of the first glass mother substrate and the thickness of the second glass mother substrate. It is preferable to set the condition for cutting by advancing the initial crack formed at the edge of the glass plate by cooling with a coolant.

In this way, it becomes possible to cut the panel base material suitably.

In the above method, it is preferable to set the thickness of the first glass mother substrate and the second glass mother substrate to 10 μm to 300 μm.

In this way, since the thicknesses of the first glass mother substrate and the second glass mother substrate are sufficiently thin, it is possible to prevent damage to both the glass mother substrates at the time of cutting the panel mother substrate, and it becomes easy to cut the panel mother substrate.

In the above method, it is preferable that the width of the gap formed between the first glass mother substrate and the second glass mother substrate is 0.1 μm to 20 μm.

In this way, it becomes easier to cut the panel base material. It is assumed that this is because the thickness of the mounting member becomes thin, so that the thermal stress generated in the irradiation source side mother substrate is liable to propagate to the irradiation target side mother substrate through the mounting member.

(Effects of the Invention)

As described above, according to the present invention, when each panel is cut out and manufactured by cutting the panel base material, it is possible to cut the panel base material at low cost and simple.

1A is a perspective view showing a base material of a liquid crystal panel.
1B is a perspective view showing a state in which the first glass mother substrate is virtually removed from the liquid crystal panel base material shown in FIG. 1A.
2A is a plan view showing an initial crack formation step in the panel manufacturing method according to the first embodiment of the present invention.
2B is a plan view showing an initial crack formation step in the panel manufacturing method according to the first embodiment of the present invention.
3 is a plan view showing a cutting process in the panel manufacturing method according to the first embodiment of the present invention.
4A is a plan view showing a cutting process in the panel manufacturing method according to the first embodiment of the present invention.
4B is a plan view showing a state in which the first glass mother substrate is virtually removed from the liquid crystal panel base material shown in FIG. 4A.
5A is a longitudinal front view showing an initial crack formation step in a method for manufacturing a panel according to a second embodiment of the present invention.
5B is a longitudinal front view showing an initial crack formation step in a method for manufacturing a panel according to a second embodiment of the present invention.
6 is a longitudinal front view showing a conventional panel manufacturing method.

Hereinafter, a method of manufacturing a panel according to an embodiment of the present invention will be described with reference to the accompanying drawings. In addition, in the embodiment described below, the case where each liquid crystal panel is cut out by cutting a liquid crystal panel base material as a panel base material is taken as an example, and it demonstrates.

<First embodiment>

First, in the panel manufacturing method according to the first embodiment of the present invention, a liquid crystal panel base material to be cut will be described.

As shown in FIGS. 1A and 1B, the liquid crystal panel base material 1 includes a first glass substrate 31 in each area (two areas in this embodiment) partitioned by a line 2 to be cut. 1 glass mother substrate 3, a second glass mother substrate 4 provided with a second glass substrate 41 facing the first glass substrate 31 in each region, and a first glass substrate ( It has the sealing material 5 as a mounting member attached so that it may be interposed between 31) and the 2nd glass substrate 41. Thereby, the liquid crystal panel base material 1 is provided with the liquid crystal panel 11 which is a panel containing the 1st glass substrate 31, the 2nd glass substrate 41, and the sealing material 5 as a component in each area. I'm doing it. That is, this liquid crystal panel base material 1 also includes the liquid crystal panel 11 for two sides. In addition, the 1st glass mother substrate 3 (the 1st glass substrate 31), and the 2nd glass mother substrate 4 (the 2nd glass substrate 41) are comprised by alkali-free glass, for example. .

Each of the first glass mother substrate 3 and the second glass mother substrate 4 has a rectangular shape and has a thickness of 10 μm to 300 μm. In addition, the width of the gap (cell gap) formed between the mother substrates 3 and 4 is 0.1 µm to 20 µm. Each of the first glass substrates 31 included in the first glass mother substrate 3 is a color filter substrate on which a BM and RGB photo spacer (both not shown) is patterned. On the other hand, each second glass substrate 41 included in the second glass mother substrate 4 is a TFT substrate on which a thin film transistor or a transparent electrode (both not shown) is patterned. The sealing material 5 is interposed between the first glass substrate 31 and the second glass substrate 41 to bond both substrates 31 and 41 to each other, and the circumferential edges of both substrates 31 and 41 Therefore, it is formed. And a liquid crystal material (not shown) is enclosed in the space 6 surrounded by the sealing material 5. Further, a gap of a predetermined width is formed between the sealing members 5 adjacent to each other with the line to be cut 2 interposed therebetween. In addition, the sealing material 5 is constituted by, for example, an ultraviolet curable resin.

End 3a (hereinafter, referred to as the first end 3a) located on one end 2a side of the intended cutting line 2 in the first glass mosquito plate 3, and the second glass mosquito The end 4a (hereinafter referred to as the second end 4a) located on the one end 2a side of the intended cutting line 2 in the plate 4 is It is located out of direction. The length Z where the first end 3a and the second end 4a are shifted is 0.2 mm to 5 mm. As a result, the second end 4a protrudes from the first end 3a.

Here, the thickness of the first glass mother substrate 3 and the second glass mother substrate 4 is more preferably 10 μm to 100 μm. Further, the width of the gap formed between the mother substrates 3 and 4 is more preferably 0.1 µm to 10 µm, most preferably 0.1 µm to 5 µm. Further, the length Z where the first end 3a and the second end 4a are shifted is more preferably 0.5 mm to 3 mm. In addition, as the width of the gap formed between adjacent sealing members 5, it is preferable to set it as 1 mm-5 mm. By doing in this way, the liquid crystal panel base material 1 becomes an integral thing and it becomes easy to behave.

Hereinafter, a form in which the liquid crystal panel base material 1 is cut and each liquid crystal panel 11 is cut out by the panel manufacturing method according to the first embodiment will be described.

As shown in Figs. 2A to 4B, the manufacturing method of this panel is performed by a scribe wheel 7 of the first end 3a of the first glass mother substrate 3 and the second glass mother substrate 4 In the second end (4a), the initial crack formation process (Fig. 2a, Fig. 2b) to form initial cracks (8, 9), respectively, and laser irradiation along the intended cutting line (2) for the liquid crystal panel base material (1) Both initial cracks 8 and 9 are advanced by heating by heating and cooling by the refrigerant following this from the upper surface side of the liquid crystal panel base material 1, thereby cutting the liquid crystal panel base material 1 It includes a cutting process (Fig. 3, Fig. 4A, Fig. 4B).

In the initial crack formation step, a single scribe wheel 7 is rolled only once in the direction from the other end 2b side of the intended cutting line 2 to one end 2a side, as indicated by the white arrow in Fig. 2A. . That is, a single scribe wheel 7 is driven only once from the inside of the liquid crystal panel base material 1 toward the outer circumferential end. Here, it is preferable that the distance through which the scribe wheel 7 is driven is 1 mm to 10 mm. At this time, the scribe wheel 7 rolls on the first end 3a to form an initial crack 8, and then descends from the first end 3a to the second end 4a, and the second end ( 4a) The initial crack 9 is formed by rolling the phase. Further, if the pressure for pressing the scribe wheel 7 against the first end 3a and the second end 4a is kept constant, it is suitable for forming both initial cracks 8 and 9. Thereby, as shown in FIG. 2B, the formation of the initial crack 8 with respect to the 1st end 3a, and the formation of the initial crack 9 with respect to the 2nd end 4a are performed continuously. In addition, in this embodiment, both initial cracks 8 and 9 are formed on the upper surface side of the 1st end 3a and the 2nd end 4a.

In the cutting process, as shown in Fig. 3, the liquid crystal panel base material 1 is cooled by spraying a heating unit 10 heated by laser irradiation and a refrigerant (e.g., water in the form of mist). It is formed by adjoining the part 12. In addition, in this embodiment, laser irradiation and injection of the coolant are performed only from the upper surface side of the liquid crystal panel base material 1. Here, the condition of laser irradiation is for a glass plate having a thickness equal to or greater than the sum of the thickness of the first glass mother substrate 3 and the thickness of the second glass mother substrate 4, heating by laser irradiation, and a refrigerant following this. It is set as the condition for cutting by advancing the initial crack formed in the edge part of a glass plate by performing cooling. In other words, a condition for cutting a glass plate having a thickness equal to or greater than the sum of the thicknesses of the mother substrates 3 and 4 is cut by laser cutting. In addition, the laser irradiation conditions may be the conditions for cutting a glass plate having a thickness of 1.1 to 2.1 times the sum of the thicknesses of both mother substrates 3 and 4 by laser cutting. In addition, the laser irradiation conditions may be conditions for cutting a glass plate having a thickness of 1.4 to 2.0 times the sum of the thicknesses of both mother substrates 3 and 4 by laser cutting.

And, as indicated by the white arrow in FIG. 3, the heating part 10 and the cooling part 12 are moved from the one end 2a side of the cut line 2 toward the other end 2b side. The formation of the heating part 10 and the cooling part 12 is first performed only on the second end 4a protruding from the first end 3a. In addition, the temperature gradient generated by the heating unit 10 and the cooling unit 12 generates thermal stress, and this thermal stress cuts the initial crack 9 formed at the second end 4a to the intended cutting line 2 ).

When the heating unit 10 and the cooling unit 12 have passed through the second end 4a, the heating unit 10 and the cooling unit 12 are constituent elements of the liquid crystal panel base material 1 as shown in FIG. 4A. Phosphorus is formed on the first glass mother substrate 3 located on the upper surface side of the liquid crystal panel base material 1 (the laser irradiation source side) among the first glass mother substrate 3 and the second glass mother substrate 4 . As a result, the initial crack 8 formed in the first end portion 3a of the thermal stress advances along the intended cutting line 2, and the first glass mother substrate 3 is cut. At this time, as shown in FIG. 4B, not only the first glass mother substrate 3 but also the second glass mother substrate 4 located on the lower surface side (the irradiation target side of the laser) of the liquid crystal panel base material 1, The initial crack 9 advances along the intended cutting line 2, and the second glass mother substrate 4 is cut. That is, the initial crack 9 that has advanced to the second end 4a continues to advance.

It is assumed that such an action is obtained for the following reasons. In other words, the sealing material 5 is interposed between the first glass mother substrate 3 and the second glass mother substrate 4. By the interposition of the sealing material 5, the thermal stress generated in the first glass mother substrate 3 is propagated through the sealing material 5 to the second glass mother substrate 4, and the propagated stress is eliminated. It is assumed that the initial crack 9 is advancing in the 2 glass mother substrate 4. In addition, it is assumed that the propagation of thermal stress becomes more pronounced as the thickness of the first glass mother substrate 3 and the second glass mother substrate 4 decreases. Thereby, both mother substrates 3 and 4 are cut, and the liquid crystal panel base material 1 is cut.

Hereinafter, the operation and effect in the case of employing the method for manufacturing a panel according to the first embodiment will be described.

According to this panel manufacturing method, when heating by laser irradiation along the line 2 to be cut along the intended cutting line 2 on the liquid crystal panel base material 1 and cooling by a refrigerant subsequent thereto are performed from the upper surface side, the liquid crystal panel The base material 1 (the first glass mother substrate 3 and the second glass mother substrate 4) can be cut. Therefore, it becomes possible to cut the liquid crystal panel base material 1 at low cost and easily. In addition, (1) the condition of laser irradiation is the condition for cutting a glass plate having a thickness equal to or greater than the sum of the thicknesses of both mother substrates 3 and 4 by laser cutting, and (2) both mother substrates 3, When the thickness of 4) is 300 µm or less, and (3) the width of the gap formed between both mother substrates 3 and 4 is 20 µm or less, it becomes easier to cut the liquid crystal panel base material 1.

In addition, in the liquid crystal panel base material 1, the first end 3a and the second end 4a are positioned to be shifted in the direction in which the intended cutting line 2 extends, and from the first end 3a to the second end ( 4a) protrudes. Therefore, in the initial crack formation step, both initial cracks 8 and 9 are performed only by rolling a single scribe wheel 7 from the other end 2b side of the intended cutting line 2 to the one end 2a side only once. Can be formed continuously.

Further, the following effects can also be obtained by setting the length Z of the first end 3a and the second end 4a to be shifted from 0.2 mm to 5 mm. That is, it is possible to secure a sufficient length for the scribe wheel 7 to move on the second end 4a, and essentially unnecessary parts (initial cracks 9) in the liquid crystal panel base material 1 It is possible to prevent an increase in the number of parts installed for this purpose as much as possible, and thus it becomes possible to avoid an increase in unreasonable manufacturing cost. In addition, these effects are further enhanced by setting the length Z of the first end 3a and the second end 4a shifted within the range of 0.5 mm to 3 mm.

Further, in this panel manufacturing method, the scribe wheel 7 is rolled in a direction from the other end 2b side of the intended cutting line 2 toward the one end 2a side. Thereby, the scribe wheel 7 rolls from the inside of the liquid crystal panel base material 1 toward the outer circumferential end. Accordingly, in forming both initial cracks 8 and 9, a situation in which the rolling scribe wheel 7 is mounted on the first end 3a or the second end 4a cannot occur. Therefore, it is possible to avoid unreasonable damage to the first end 3a or the second end 4a due to the impact upon climbing.

Hereinafter, one specific example of the method for manufacturing a panel according to the first embodiment will be exemplified.

First, two glass substrates (OA-10G) manufactured by Nippon Denki Glass Co., Ltd. were prepared. Subsequently, by patterning two-sided transparent electrodes or the like on each of the two glass substrates, it was set as the first glass mother substrate 3 and the second glass mother substrate 4, respectively. In addition, both mother substrates 3 and 4 have a thickness of 100 μm. Next, the two mother substrates 3 and 4 are bonded by sandwiching the two-sided sealing material 5, and the liquid crystal material is enclosed in each of the spaces 6 surrounded by the sealing material 5 to form two-sided liquid crystals. The liquid crystal panel base material 1 including the panel 11 was produced. At this time, the width of the gap (cell gap) formed between the mother substrates 3 and 4 was set to 9 μm. In addition, for the liquid crystal panel base material 1, as shown in Table 1 below, seven different types of the first end portion 3a and the second end portion 4a were fabricated in different lengths (Z).

Subsequently, for each of the seven kinds of liquid crystal panel base materials 1, a scribe wheel 7 (diamond chip) is rolled in a direction from the other end 2b side of the intended cutting line 2 toward one end 2a side. To form both initial cracks (8, 9). Finally, by heating each liquid crystal panel base material 1 by laser irradiation and cooling by spraying mist water subsequent thereto, from the one end 2a side of the intended cutting line 2 to the other end ( Cutting of each liquid crystal panel base material 1 toward the 2b) side was tested. Conditions for laser irradiation, conditions for spraying mist water, and conditions for formation of both initial cracks 8 and 9 are common at the time of cutting each liquid crystal panel base material 1, and are as follows. Type of laser: CO2 laser, laser wavelength: 10.6㎛, laser scanning speed: 25mm/s, laser output: 15W, spray pressure of mist water: 0.06MPa, flow rate of mist water: 0.4ml/min, scribe The diameter of the wheel 7: 3 mm, the transmission speed of the scribe wheel 7: 10 mm/s.

As a result of testing the cutting of each liquid crystal panel base material 1 under the above conditions, the results were as shown in Table 1 below. Here, about the cutability shown in Table 1, "◎" indicates that the liquid crystal panel base material 1 could be cut satisfactorily, "○" indicates that the liquid crystal panel base material 1 was cut, and "x" Indicates that the liquid crystal panel base material 1 could not be cut.

From the results shown in Table 1, when the length Z of the first end 3a and the second end 4a is 0.2 mm or more, the liquid crystal panel base material 1 can be cut, and the length Z is 0.5. In the case of mm or more, it turns out that the liquid crystal panel base material 1 could be cut satisfactorily. Further, the second glass mother substrate 4 could not be cut about the liquid crystal panel base material 1 of Z=0.186 mm, which was impossible to cut. However, in this liquid crystal panel base material 1 as well, by forming an initial crack on the second glass base material 4 using sand paper in addition to the scribing wheel 7, the first glass base material 3 and At the same time, cutting of the second glass mother substrate 4 was also possible, so that the liquid crystal panel base material 1 could be cut.

<Second Embodiment>

Hereinafter, a method of manufacturing a panel according to a second embodiment of the present invention will be described. In addition, in the description of the second embodiment, elements that are the same as those already described in the first embodiment are denoted by the same reference numerals in the drawings for explaining the second embodiment, and the description is omitted. have. In addition, in the second embodiment, only differences from the first embodiment will be described.

The difference between the panel manufacturing method according to the second embodiment and the panel manufacturing method according to the first embodiment is that in the liquid crystal panel base material 1 to be cut, the first end portion 3a and the first end portion 3a 2 The end portion 4a is at the same position in the direction in which the intended cutting line 2 extends, and the point where both 3a and 4a are not shifted (in the first embodiment, Z = 0 mm) 5A and 5B, in the initial crack formation step, both initial cracks 8 and 9 are formed by irradiation of the picosecond laser 13 as a pulse laser.

In the present embodiment, when the initial crack 8 is formed with respect to the first end 3a and the initial crack 9 is formed with the second end 4a, the top surfaces of these end portions 3a and 4a The picosecond laser 13 is condensed at (the upper surface is the focus of the picosecond laser 13). In addition, the formation of both initial cracks 8 and 9 may be performed by irradiating a femtosecond laser as a pulse laser instead of the picosecond laser 13. Here, the wavelength of the pulsed laser may be appropriately selected from various wavelengths according to the absorption rate of the first glass mother substrate 3 and the second glass mother substrate 4 and the pulse width of the pulsed laser.

Hereinafter, the operation and effect in the case of employing the method for manufacturing a panel according to the second embodiment will be described.

Usually, the gap (cell gap) formed between the 1st glass mother substrate 3 and the 2nd glass mother substrate 4 is very narrow. For this reason, in the case where the first end 3a and the second end 4a are not shifted in the direction in which the intended cutting line 2 extends, the scribe wheel 7 is placed on both mother substrates 3 and 4 Even if an attempt is made to form the initial crack 9 by entering the cracks 9, the execution may be difficult. However, according to the picosecond laser 13, irrespective of whether the first end 3a and the second end 4a are positioned to be shifted, the initial cracks ( It is possible to form 8, 9). Thereby, both initial cracks 8 and 9 can be reliably formed in a desired location.

Here, the method of manufacturing a panel according to the present invention is not limited to the form described in each of the above embodiments. For example, in each of the above embodiments, individual liquid crystal panels are cut by cutting the liquid crystal panel base material including the liquid crystal panel on two sides, but of course, even when cutting the liquid crystal panel base material including the liquid crystal panel on three or more sides. It is possible to apply the method of manufacturing a panel according to the present invention.

Further, in the first embodiment, in the initial crack formation step, both initial cracks are formed by rolling the scribe wheel from the other end of the line to be cut to one end, but the scribe wheel is formed from one end to the other. It may be electrified to form both initial cracks. That is, both initial cracks may be formed by rolling the scribe wheel from the outer circumferential end of the liquid crystal panel base material toward the inside. Further, in the first embodiment, both initial cracks are continuously formed by rolling a single scribe wheel only once, but individual initial cracks may be formed respectively.

Further, in the second embodiment, both initial cracks are formed by irradiating a pulsed laser such as a picosecond laser or a femtosecond laser, but the present invention is not limited thereto. Instead of a pulsed laser, both initial cracks may be formed by irradiating a short-wavelength laser including a UV laser. Further, instead of the scribe wheel in the first embodiment and the pulse laser in the second embodiment, both initial cracks may be formed using, for example, sand paper or the like.

In addition, in each of the above embodiments, initial cracks are formed on the upper surface side of both the first end and the second end in the initial crack forming step, but the present invention is not limited thereto. In either of the first end and the second end, an initial crack may be formed on either the upper surface side or the lower surface side. For example, an initial crack may be formed on the upper surface side at the first end, and an initial crack may be formed on the lower surface side at the second end. In addition, in the case of forming an initial crack by irradiation of a pulsed laser as in the second embodiment, irrespective of whether the initial crack is formed on the first end and the upper surface side or the lower surface side of the second end, the laser May be irradiated from the upper surface side of the liquid crystal panel base material, or may be irradiated from the lower surface side (the same applies to the case of irradiating short wavelength lasers including UV lasers). In addition, as in the second embodiment, when the first end and the second end are at the same position in the direction in which the intended cutting line extends, the first end and the second end are rolled along the thickness direction of the liquid crystal panel base material. An initial crack may be formed at the second end.

Further, in each of the above embodiments, in the cutting step, laser irradiation is performed only from the upper surface side of the liquid crystal panel base material, and cooling is performed with a coolant following this, but these may be performed only from the lower surface side. In addition, in each of the above embodiments, the laser irradiation condition is a condition for cutting a glass plate having a thickness equal to or greater than the sum of the thicknesses of both mother substrates by laser cutting, but it is not necessary to do this.

In addition, in each of the above embodiments, individual liquid crystal panels are cut out by cutting the liquid crystal panel base material, but the method of manufacturing a panel according to the present invention is, for example, an organic EL panel base material including a plurality of organic EL panels. It is possible to apply also to the case of cutting out individual organic EL panels by cutting them.

1: liquid crystal panel base material 11: liquid crystal panel
2: Line to be cut 2a: One end of the line to be cut
3: first glass mosquito plate 3a: first end
31: first glass substrate 4: second glass mother substrate
4a: second end 41: second glass substrate
5: sealing material 7: scribe wheel
8, 9: initial crack 13: picosecond laser

Claims (9)

A first glass mother substrate having a first glass substrate in each region partitioned by a planned cutting line, and a second glass mother substrate having a second glass substrate facing the first glass substrate in each of the regions; By having a mounting member mounted so as to be interposed between the first glass substrate and the second glass substrate in each of the regions, the first glass substrate, the second glass substrate, and the mounting member are configured in the respective regions. With respect to a panel base material having a panel included as an element, as a method for manufacturing a panel including a cutting step of cutting the panel base material along the planned cutting line,
Including an initial crack forming step of forming initial cracks at each of the first end and the second end positioned at one end side of the line to be cut in each of the first glass mother substrate and the second glass mother substrate,
The cutting process is carried out by advancing both initial cracks by heating the panel base material by laser irradiation along the line to be cut and cooling by a coolant following it from one side of the panel base material. ,
In the first end of the first glass mother substrate, the second end of the second glass mother substrate is positioned to be shifted,
In the cutting process, as a first step, after cutting only the second end of the second glass mother substrate by advancing the initial crack formed at the second end, as a second step, at the first end The method of manufacturing a panel, characterized in that by simultaneously cutting the first glass mother substrate and the second glass mother substrate by starting the propagation of the formed initial crack and propagating both of the initial cracks. The method of claim 1,
The method of manufacturing a panel, characterized in that the initial crack formation step is performed by rolling a scribe wheel. The method of claim 2,
A method for manufacturing a panel, characterized in that, in the first end of the first glass mother substrate, a length in which the second end of the second glass mother substrate is shifted is 0.2 mm to 5 mm. delete The method according to claim 2 or 3,
The method of manufacturing a panel, wherein the initial crack formation step is performed by rolling the scribe wheel in a direction from the other end of the line to be cut to one end. The method of claim 1,
A method for manufacturing a panel, characterized in that the initial crack formation step is performed by irradiating a pulsed laser. The method according to any one of claims 1 to 3,
The conditions of the laser irradiation in the cutting step,
A glass plate having a thickness equal to or greater than the sum of the thickness of the first glass mother substrate and the thickness of the second glass mother substrate is heated by laser irradiation and then cooled by a coolant to the end of the glass plate. A method for manufacturing a panel, characterized in that conditions for cutting by advancing the formed initial crack. The method according to any one of claims 1 to 3,
The method of manufacturing a panel, wherein the first glass mother substrate and the second glass mother substrate have a thickness of 10 μm to 300 μm. The method according to any one of claims 1 to 3,
A method of manufacturing a panel, wherein the width of the gap formed between the first glass mother substrate and the second glass mother substrate is 0.1 μm to 20 μm.

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