CN106029591B - The manufacturing method of panel - Google Patents
The manufacturing method of panel Download PDFInfo
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- CN106029591B CN106029591B CN201580009294.7A CN201580009294A CN106029591B CN 106029591 B CN106029591 B CN 106029591B CN 201580009294 A CN201580009294 A CN 201580009294A CN 106029591 B CN106029591 B CN 106029591B
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- mother substrate
- base material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/027—Scoring tool holders; Driving mechanisms therefor
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
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- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Nonlinear Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Mathematical Physics (AREA)
- Thermal Sciences (AREA)
- Theoretical Computer Science (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Liquid Crystal (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
Abstract
In the manufacturing method of the panel comprising the cut off operation along cutting preset lines (2) cutting liquid crystal display panel base material (1), it is included in the end (3a of the first glass mother substrate (3) and the respective side one end (2a) for being located at cutting preset lines (2) of the second glass mother substrate (4), 4a) it is respectively formed initial crack (8, 9) initial crack formation process, with the heating based on laser irradiation carried out from the upper surface side of the liquid crystal display panel base material (1) to liquid crystal display panel base material (1) along cutting preset lines (2), and follow the cooling based on refrigerant of the heating, make two initial cracks (8, 9) it is in progress together, thus cut off operation is executed.
Description
Technical field
The present invention relates to the methods for manufacturing liquid crystal display panel, organic EL panel etc..
Background technique
It is well known that liquid crystal display panel, which has figure system, is formed with BM, RGB, the color filter substrate of photoresist spacer material and figure shape
At two panels glass substrate mutually opposed as the TFT substrate for having thin film transistor (TFT), transparent electrode.Two substrates are to clip along it
The mode of sealing element of peripheral part coating be bonded, be sealed with liquid in the space surrounded between two substrates by sealing element
Brilliant material.
However, in the case where manufacturing the liquid crystal display panel of liquid crystal display television, mobile device use etc., it is sometimes not separately manufactured
Liquid crystal display panel one by one, but using following such method come uniformly manufactured multiple liquid crystal display panels.
In the method, firstly, production is corresponding with multiple liquid crystal display panels by being formed in the upper figure system of a glass plate
First glass mother substrate (colour filter mother substrate) obtained from BM, RGB of amount, photoresist spacer material and by equally in a glass
It is female that the upper figure system of glass plate forms the second glass obtained from the thin film transistor (TFT) of amount corresponding with multiple liquid crystal display panels, transparent electrode
Substrate (TFT mother substrate).Then, by two mother substrates in a manner of clipping the sealing element of amount corresponding with multiple liquid crystal display panels
Fitting, and liquid crystal material is enclosed into the space surrounded by sealing element respectively, it thus produces and exists comprising multiple liquid crystal display panels
Interior liquid crystal display panel base material.Finally, the liquid crystal display panel base material is cut off, so as to cut out each liquid crystal display panel from the base material.
Here, being disclosed in patent document 1 in the case where manufacturing liquid crystal display panel using method as described above for cutting
The method of disconnected liquid crystal display panel base material.
Following method is disclosed in the publication: as shown in fig. 6, along the boundary Y of adjacent liquid crystal display panel 101,102
(between sealing element 201,202) irradiates laser L1 from surface side to liquid crystal display panel base material 100, irradiates laser from back side
Thus L2 cuts off the base material 100.In the method, respectively in the first glass for being present in the surface side of liquid crystal display panel base material 100
Glass mother substrate 100a and it is present on the second glass mother substrate 100b of back side, at the back side of the position of irradiation laser L1, L2
It is pre-formed with the film 301,302 of than two mother substrate 100a of thermal conductivity, 100b high.As a result, in cutting liquid crystal display panel base material 100
When, heat brought by laser irradiation concentrates on boundary Y via film 301,302, so as to cut off (the two female bases of base material 100
Plate 100a, 100b).
Citation
Patent document
Patent document 1: Japanese Unexamined Patent Publication 2002-224870 bulletin
Summary of the invention
Subject to be solved by the invention
However, in method disclosed in patent document 1, there are problems that following such should solve.That is, in the document
In disclosed method, in order to cut off liquid crystal display panel base material, need respectively in the first glass mother substrate and the second glass mother substrate
On, implement film process in advance at all sites on boundary for becoming adjacent liquid crystal display panel.Therefore, especially should be from liquid
In the case that the liquid crystal display panel quantity that crystal panel base material is cut out is more, film process are cumbersome, and manufacture efficiency is deteriorated, also, due also to
Unwanted film originally is formed on product and the increase of the manufacturing cost that leads to panel.
In addition, in the method, the laser irradiated from the surface side of liquid crystal display panel base material can only cut off the first glass mother
Substrate, the laser irradiated from back side can only cut off the second glass mother substrate.It therefore, must when cutting off liquid crystal display panel base material
Laser must be irradiated from this two side of the surface side and back side of the base material.Moreover, utilizing the cutting-off method of the glass of laser and other
The cutting-off method (for example, fractureing) of glass compare, have and be easy trend at high cost.Therefore, because from surface side and back
This two side of surface side irradiates laser, and may result in further increasing for manufacturing cost.
It should be noted that this problem can not only occur in the case where cutting off liquid crystal display panel base material, such as cutting off
It is similarly likely to occur in the case where the others panel base material such as base material of organic EL panel.In light of this situation, of the invention
Technical task be, in the case where cutting out each panel by cutting off panel base material and being manufactured, can be realized it is low at
The cutting of this and easy panel base material.
For solving the scheme of technical task
The present invention being made in order to solve the above problems provides a kind of manufacturing method of panel comprising female for panel
Material and cut off the cut off operation of the panel base material along cutting preset lines, the panel base material is included to be drawn by cutting preset lines
Each region divided has the first glass mother substrate of the first glass substrate；Have opposed with the first glass substrate in each region
Second glass mother substrate of two glass substrates；And in each region to be located between the first glass substrate and the second glass substrate
The loading component that is packed into of mode, thus panel base material each region have comprising the first glass substrate, the second glass substrate and
Component is packed into as the panel of constitutive requirements, the manufacturing method of panel is characterised by comprising initial crack formation process,
The end of first glass mother substrate and the respective one end for being located at cutting preset lines of the second glass mother substrate is respectively formed just
Beginning crackle, with the adding based on laser irradiation carried out from a surface side of the panel base material to panel base material along cutting preset lines
Heat and the cooling based on refrigerant of the heating is followed, two initial cracks is made to be in progress together, thus executes cutting work
Sequence.
According to this method, when executing cut off operation, to panel base material from a surface side of the panel base material carry out along
The heating based on laser irradiation of cutting preset lines and the cooling based on refrigerant for following the heating.Therefore, in the first glass
(following label is that source is female to the mother substrate of irradiation source in glass mother substrate and the second glass mother substrate, positioned at laser
Substrate) on generate temperature gradient and generate thermal stress.Also, under the action of the thermal stress, initial crack is predetermined along cutting
Line progress.At this point, not only on irradiation source mother substrate, the irradiation target side for being located at laser mother substrate (following label for
Irradiation target side mother substrate) on can also make initial crack along cutting preset lines progress.Think to obtain due to following
Obtain this effect.That is, being folded with loading component between irradiation source mother substrate and irradiation target side mother substrate.Think due to this
It is packed into the sandwiched of component, makes to irradiate the thermal stress generated on source mother substrate and propagate to via loading component to irradiate target side mother
Substrate, also, the stress that the propagation comes makes initial crack be in progress on irradiation target side mother substrate.As a result, by being in progress together
Two initial cracks cut off two mother substrates, to cut off panel base material.As described above, in the method, if from one side
Side carries out the heating based on laser irradiation along cutting preset lines and follows the cooling based on refrigerant of the heating, then
It can be accompanied by this to cut off panel base material (the first glass mother substrate and the second glass mother substrate).It therefore, being capable of low cost
And simply cut off panel base material.
In the methods described above, initial crack formation process can also be executed by making stitch marker rotation.
In such manner, it is possible to simplicity and promptly execution initial crack formation process.
In the methods described above, preferably make the end of the one end for being located at cutting preset lines in the first glass mother substrate
End (the following label of (following label is) and the one end for being located at cutting preset lines in the second glass mother substrate
For the second end) it is in staggered configuration on the direction that cutting preset lines extend.
In this way, becoming the state that the side in first end and the second end exceeds from another party.As a result, in initial crack
In formation process, only by making single stitch marker from one end side of cutting preset lines to another side or from another side
It is only rotated to one end primary, it will be able to be continuously formed two initial cracks.
In the methods described above, the length that preferably first end and the second end are staggered is 0.2mm~5mm.
About the end beyond side in first end and the second end, if the length exceeded is set as 0.2mm or more,
Enough length needed for then capable of ensuring stitch marker rotation on the end beyond side.It therefore, can be relative to beyond side
End is properly formed initial crack.In addition, if the length that will exceed be set as 5mm hereinafter, if can prevent panel as much as possible
The increase of base material unwanted position (position being arranged to form initial crack) originally, therefore, can be avoided manufacture at
Originally improper surging.It accordingly, can be suitably if the length that first end and the second end are staggered is set as 0.2mm~5mm
Initial crack is formed, and can be avoided the improper surging of manufacturing cost.
In the methods described above, preferably by making stitch marker in the another side from cutting preset lines towards the side of one end
It is rotated up, Lai Zhihang initial crack formation process.
In this way, stitch marker is rotated from the inside of panel base material towards outer circumference end in initial crack formation process.As a result,
When forming two initial cracks, the stitch marker that will not be rotated is more to such state of affairs on first end or the second end.
Therefore, the case where can be avoided the impact when upper due to damage undeservedly caused to first end, the second end.
In the methods described above, initial crack formation process can also be executed by irradiated with pulse laser.
In general, the gap being formed between the first glass mother substrate and the second glass mother substrate is very narrow.Therefore, first
End is with the second end (in overlook view panel base material not in the case where being in staggered configuration on cutting off the direction that preset lines extend
When, in the case that first end is overlapped with the second end), it is formed just even to enter stitch marker between two mother substrates
Beginning crackle, is also difficult to carry out sometimes.However, if no matter first end is matched with whether the second end is staggered using pulse laser
It sets, initial crack can be formed at the position for assembling the laser.Thereby, it is possible to landform reliable at desired position
At two initial cracks.
In the methods described above, preferably the condition of the laser irradiation in cut off operation is set as carrying out following glass plate
It heating based on laser irradiation and follows the cooling based on refrigerant of the heating, thus make the end for being formed in glass plate
For initial crack progress come condition when being cut off, the glass plate has the thickness of the first glass mother substrate and the second glass female
Thickness more than the sum of thickness of substrate.
In such manner, it is possible to be appropriately cut off panel base material.
In the methods described above, preferably by the thickness of the first glass mother substrate and the second glass mother substrate be set as 10 μm~
300μm。
In this way, since the thickness of the first glass mother substrate and the second glass mother substrate is very thin, it can prevent
In the cutting of panel base material, two glass mother substrates occur damaged, and are easy cutting panel base material.
In the methods described above, the gap between the first glass mother substrate and the second glass mother substrate will be preferably formed in
Width is set as 0.1 μm~20 μm.
In this way, being more easier to cut off panel base material.It is thought that because, by keeping the thickness for being packed into component thinning, thus
The thermal stress generated on irradiation source mother substrate is easy to propagate to irradiation target side mother substrate via the loading component.
Invention effect
As described above, according to the present invention, the case where each panel is manufactured is being cut out by cutting off panel base material
Under, it can be realized the cutting of low cost and easy panel base material.
Detailed description of the invention
Fig. 1 a is the perspective view for showing liquid crystal display panel base material.
Fig. 1 b is to show to assume that the liquid crystal display panel base material shown in Fig. 1 a takes down the vertical of the state after the first glass mother substrate
Body figure.
Fig. 2 a is that the initial crack shown in the manufacturing method of panel involved in first embodiment of the invention is formed
The top view of process.
Fig. 2 b is that the initial crack shown in the manufacturing method of panel involved in first embodiment of the invention is formed
The top view of process.
Fig. 3 is the vertical view for showing the cut off operation in the manufacturing method of panel involved in first embodiment of the invention
Figure.
Fig. 4 a is to show bowing for cut off operation in the manufacturing method of panel involved in first embodiment of the invention
View.
Fig. 4 b is to show to assume that the liquid crystal display panel base material shown in Fig. 4 a takes down bowing for the state after the first glass mother substrate
View.
Fig. 5 a is that the initial crack shown in the manufacturing method of panel involved in second embodiment of the present invention is formed
The vertical profile main view of process.
Fig. 5 b is that the initial crack shown in the manufacturing method of panel involved in second embodiment of the present invention is formed
The vertical profile main view of process.
Fig. 6 is the vertical profile main view for the manufacturing method for showing existing panel.
Specific embodiment
Hereinafter, being illustrated referring to manufacturing method of the attached drawing to panel involved in embodiments of the present invention.It needs
It is bright, in embodiments described below, cut out using the liquid crystal display panel base material by cutting as panel base material each
It is illustrated in case where liquid crystal display panel.
< first embodiment >
Firstly, for cutting object is become in the manufacturing method of the panel involved in first embodiment of the invention
Liquid crystal display panel base material is illustrated.
As shown in Figure 1 a, 1 b, liquid crystal display panel base material 1 is included in each region (this implementation divided by cutting preset lines 2
It is two regions in mode) have the first glass mother substrate 3 of the first glass substrate 31；Have and the first glass base in each region
Second glass mother substrate 4 of the second opposed glass substrate 41 of plate 31；And in each region to be located in the first glass substrate 31
The sealing element 5 as loading component that mode between the second glass substrate 41 is packed into.Liquid crystal display panel base material 1 is each as a result,
Region has the panel i.e. liquid comprising the first glass substrate 31, the second glass substrate 41 and sealing element 5 as constitutive requirements
Crystal panel 11.That is, the liquid crystal display panel base material 1 includes the liquid crystal display panel 11 of two tensors.It should be noted that the first glass mother substrate
3 (the first glass substrates 31) and the second glass mother substrate 4 (the second glass substrate 41) are for example made of alkali-free glass.
First glass mother substrate 3 and the second glass mother substrate 4 are respectively provided with rectangular shape, and its with a thickness of 10 μm~
300μm.In addition, the width in the gap (cell gap) being formed between two mother substrates 3,4 is 0.1 μm~20 μm.First glass
Each first glass substrate 31 that glass mother substrate 3 is included is that figure system is formed with BM, RGB, photoresist spacer material (equal illustration omitted)
Color filter substrate.On the other hand, each second glass substrate 41 that the second glass mother substrate 4 is included is that figure system is formed with film crystal
The TFT substrate of pipe, transparent electrode (equal illustration omitted).Sealing element 5 is folded in the first glass substrate 31 and the second glass substrate
41 are bonded two substrates 31,41 each other, and sealing element 5 is formed along the peripheral part of two substrates 31,41.And
And liquid crystal material (illustration omitted) is sealed in the space 6 surrounded by sealing element 5.In addition, across cutting 2 phase of preset lines
Adjacent sealing element 5 is formed with the gap of defined width each other.It should be noted that sealing element 5 is for example by ultraviolet curing
Resin is constituted.
(label is the end 3a of one end side 2a for being located at cutting preset lines 2 in first glass mother substrate 3 below
Portion 3a) and the end 4a of one end side 2a for being located at cutting preset lines 2 in the second glass mother substrate 4 (following label is
Portion 4a) it is in staggered configuration on the direction that cutting preset lines 2 extend.The length Z that first end 3a is staggered with the second end 4a is
0.2mm~5mm.Become the structure that the second end 4a exceeds from first end 3a as a result,.
Here, the thickness of the first glass mother substrate 3 and the second glass mother substrate 4 is more preferably 10 μm~100 μm.Separately
Outside, the width for being formed in the gap between two mother substrates 3,4 is more preferably 0.1 μm~10 μm, most preferably 0.1 μm~5 μm.
In addition, the length Z that first end 3a and the second end 4a are staggered is more preferably 0.5mm~3mm.In addition, as adjacent close
The width in the gap that sealing 5 is formed each other, preferably 1mm~5mm.In this way, liquid crystal display panel base material 1 as integral structure and
It is easy to function.
Hereinafter, for using panel involved in first embodiment manufacturing method come cut off liquid crystal display panel base material 1, from
And the mode for cutting out each liquid crystal display panel 11 is illustrated.
As shown in Fig. 2 a~Fig. 4 b, the manufacturing method of the panel includes: initial crack formation process (Fig. 2 a, Fig. 2 b), benefit
With stitch marker 7, respectively in the second end 4a shape of the first end 3a of the first glass mother substrate 3 and the second glass mother substrate 4
At initial crack 8,9；And cut off operation (Fig. 3, Fig. 4 a, Fig. 4 b), with to liquid crystal display panel base material 1 from the liquid crystal display panel base material
1 upper surface side carry out the heating along cutting preset lines 2 based on laser irradiation and follow the heating based on refrigerant
Cooling, so that two initial cracks 8,9 is in progress together, thus cut off liquid crystal display panel base material 1.
In initial crack formation process, as shown in the hollow arrow of Fig. 2 a, make single stitch marker 7 predetermined from cutting
The side other end 2b of line 2 is towards only rotation is primary on the direction of one end side 2a.That is, making single stitch marker 7 from liquid crystal display panel mother
The inside of material 1 only rotates once towards outer circumference end.Here, the distance for rotating stitch marker 7 is preferably 1mm~10mm.At this point, drawing
It after line wheel 7 rotates on first end 3a and forms initial crack 8, is fallen from first end 3a to the second end 4a,
It rotates on two end 4a and forms initial crack 9.It should be noted that if stitch marker 7 is pressed against first end 3a and
The pressure of two end 4a is kept constant, then is preferred in two initial cracks 8 of formation, 9 this respects.As a result, such as Fig. 2 b institute
Show, continuously carry out forming initial crack 8 to first end 3a and forms initial crack 9 to the second end 4a.It needs to illustrate
, in the present embodiment, two initial cracks 8,9 are both formed in the upper surface in first end 3a, the second end 4a
Side.
In cut off operation, as shown in figure 3, making the heating part being heated by laser irradiation 10 and passing through refrigerant
The injection of (such as misty water etc.) and cooled cooling end 12 is adjacently formed relative to liquid crystal display panel base material 1.It needs
It is bright, in the present embodiment, the spray of laser irradiation and refrigerant is only carried out from the upper surface side of liquid crystal display panel base material 1
It penetrates.Here, the condition of laser irradiation is set as carrying out the heating based on laser irradiation to following glass plate and follows the heating
Based on the cooling of refrigerant, make to be formed in the initial crack progress of the end of glass plate thus come condition when being cut off,
The glass plate has the thickness of the sum of the thickness of the first glass mother substrate 3 and the thickness of the second glass mother substrate 4 or more.That is,
It is set as cutting off that there are two the conditions when glass plate of thickness more than the sum of thickness of mother substrate 3,4 to cut off tool using laser.
It should be noted that the condition of laser irradiation can also be set as cutting off using laser, to cut off tool, there are two mother substrates 3,4
The condition when glass plate of the thickness of 1.1 times of the sum of thickness~2.1 times.Furthermore it is also possible to which the condition of laser irradiation is set as
Cut off that there are two when the glass plate of 1.4 times~2.0 times of thickness of the sum of the thickness of mother substrate 3,4 to cut off tool using laser
Condition.
Moreover, making heating part 10 and cooling end 12 from one end 2a of cutting preset lines 2 as shown in the hollow arrow of Fig. 3
Side is mobile towards the side other end 2b.The formation of the heating part 10 and cooling end 12 from first end 3a first only for exceeding
The second end 4a is carried out.Also, thermal stress, also, the heat are generated by the temperature gradient that heating part 10 and cooling end 12 generate
Stress makes the initial crack 9 for being formed in the second end 4a be in progress along cutting preset lines 2.
Heating part 10 and cooling end 12 are after terminating through the second end 4a, as shown in fig. 4 a, heating part 10 and
Cooling end 12 in the first glass mother substrate 3 and the second glass mother substrate 4 of the constitutive requirements as liquid crystal display panel base material 1,
It is formed on the first glass mother substrate 3 of the upper surface side (the irradiation source of laser) of liquid crystal display panel base material 1.Heat is answered as a result,
Power makes the initial crack 8 for being formed in first end 3a be in progress along cutting preset lines 2, thus the first glass mother substrate 3 of cutting.This
When, as shown in Figure 4 b, not only on the first glass mother substrate 3, in the lower face side (photograph of laser for being located at liquid crystal display panel base material 1
Penetrate target side) the second glass mother substrate 4 on, initial crack 9 also along cutting preset lines 2 be in progress, to cut off second glass
Glass mother substrate 4.That is, being continued to progress in the initial crack 9 that the second end 4a has been in progress.
Think to obtain this effect due to following.That is, in the first glass mother substrate 3 and the second glass mother substrate
Sealing element 5 is folded between 4.Think the sandwiched due to the sealing element 5, passes through the thermal stress generated on the first glass mother substrate 3
Second glass mother substrate 4 is propagated to by sealing element 5, also, the stress that the propagation comes makes initial crack 9 in second glass mother's base
It is in progress on plate 4.It should be noted that thinking that the thickness of the first glass mother substrate 3 and the second glass mother substrate 4 is thinner, heat is answered
The propagation of power is more significant.Two mother substrates 3,4 are cut off as a result, to cut off liquid crystal display panel base material 1.
Hereinafter, to use above-mentioned first embodiment involved in panel manufacturing method in the case where effect,
Effect is illustrated.
According to the manufacturing method of the panel, if being carried out from upper surface side along cutting preset lines 2 to liquid crystal display panel base material 1
Heating based on laser irradiation and the cooling based on refrigerant for following the heating, then can be accompanied by this to cut off the liquid
Crystal panel base material 1 (the first glass mother substrate 3 and the second glass mother substrate 4).Therefore, can low cost and simply cut off liquid
Crystal panel base material 1.It should be noted that the condition of laser irradiation is set as cutting off using laser to cut off with two by (1)
The condition when glass plate of thickness more than the sum of thickness of a mother substrate 3,4, (2) two mother substrates 3,4 with a thickness of 300 μm
Hereinafter, (3) make 20 μm of the width in the gap being formed between two mother substrates 3,4 hereinafter, being thus easier cutting liquid crystal surface
Plate base material 1.
In addition, first end 3a and the second end 4a are in the direction that cutting preset lines 2 extend in liquid crystal display panel base material 1
On be in staggered configuration, and the second end 4a exceeds from first end 3a.Therefore, in initial crack formation process, only by making list
One stitch marker 7 only rotates once from the side other end 2b of cutting preset lines 2 towards one end side 2a, it will be able to be continuously formed two
Initial crack 8,9.
In addition, being set as 0.2mm~5mm by the length Z that first end 3a and the second end 4a are staggered, additionally it is possible to obtain
Such effect below.That is, can ensure that stitch marker 7 rotates required enough length on the second end 4a, further, it is possible to
The increasing at the 1 unwanted position of script (position being arranged to form initial crack 9) of liquid crystal display panel base material is prevented as much as possible
Add, can be avoided the improper surging of manufacturing cost.It should be noted that by the way that first end 3a and the second end 4a be staggered
Length Z is located in the range of 0.5mm~3mm, and thus, it is possible to further increase said effect.
In addition, making stitch marker 7 in the side the other end 2b direction one from cutting preset lines 2 in the manufacturing method of the panel
The side of the end side 2a is rotated up.Stitch marker 7 is rotated from the inside of liquid crystal display panel base material 1 towards outer circumference end as a result,.Therefore, in shape
When at two initial crack 8,9, the stitch marker 7 that will not be rotated is more to thing such on first end 3a, the second end 4a
State.Therefore, can be avoided due to it is upper when impact and undeservedly to first end 3a, the second end 4a cause damage feelings
Condition.
Hereinafter, enumerating the concrete example of the manufacturing method of panel involved in an above-mentioned first embodiment.
Firstly, preparing the glass substrate (OA-10G) of two panels Japan Electric Glass commercial firm.Then, by respectively in two panels
The upper figure system of glass substrate forms the transparent electrode etc. of amount corresponding with two liquid crystal display panels, and first glass mother's base is thus respectively prepared
Plate 3, the second glass mother substrate 4.It should be noted that the thickness of two mother substrates 3,4 is 100 μm.Then, make two female bases
Plate 3,4 clips the sealing element 5 of amount corresponding with two liquid crystal display panels and is bonded, also, respectively to the space surrounded by sealing element 5
Liquid crystal material is enclosed in 6, to produce the liquid crystal display panel base material 1 including the liquid crystal display panel 11 comprising two tensors.At this point, two
The width in the gap (cell gap) formed between a mother substrate 3,4 is 9 μm.It should be noted that shown in table 1 described as follows,
Produce first end 3a and seven kinds of liquid crystal display panel base materials 1 that length Z that the second end 4a is staggered is mutually different.
Then, respectively be directed to seven kinds of liquid crystal display panel base materials 1, make stitch marker 7 (diamond chip) from cutting preset lines 2 it is another
The side of one end side 2b towards one end side 2a is rotated up, and forms two initial cracks 8,9.Finally, by female to each liquid crystal display panel
Material 1 carries out the heating based on laser irradiation and follows the cooling based on injection fog of the heating, thus from cutting preset lines
It attempts to carry out the cutting of each liquid crystal display panel base material 1 towards the side other end 2b in 2 one end side 2a.The condition of laser irradiation, fog
The formation condition of injection conditions and two initial cracks 8,9 is shared in the cutting of each liquid crystal display panel base material 1, and following institute
Show.The type of laser: CO2Laser, the wavelength of laser: 10.6 μm, the scanning speed of laser: 25mm/s, the output of laser: 15W,
The injection pressure of fog: 0.06MPa, the flow of fog: 0.4ml/min, the diameter of stitch marker 7: 3mm, the rotation speed of stitch marker 7
Degree: 10mm/s.
It is attempted after having carried out the cutting of each liquid crystal display panel base material 1 under the conditions described above, obtains the such knot of following tables 1
Fruit.Here, the cuttability shown in table 1, " ◎ " indicates the case where having cut off liquid crystal display panel base material 1 well, and "○" indicates
The case where having cut off liquid crystal display panel base material 1, "×" expression fail the case where cutting off liquid crystal display panel base material 1.
[table 1]
| Z[mm] | 0.186 | 0.252 | 0.361 | 0.412 | 0.513 | 0.679 | 0.865 |
| Cuttability | × | ○ | ○ | ○ | ◎ | ◎ | ◎ |
According to result shown in table 1 it is found that being 0.2mm or more in the length Z that first end 3a and the second end 4a are staggered
In the case where, liquid crystal display panel base material 1 can be cut off, in the case where length Z is 0.5mm or more, liquid crystal can be cut off well
Panel base material 1.It should be noted that the liquid crystal display panel base material 1 about the Z=0.186mm that can not be cut off, can not cut off second
Glass mother substrate 4.However, on the liquid crystal display panel base material 1, other than above-mentioned stitch marker 7, by using sand paper second
Initial crack is separately formed on glass mother substrate 4, and the second glass mother thus also can be simultaneously cut off with the first glass mother substrate 3
Substrate 4, so as to cut off liquid crystal display panel base material 1.
< second embodiment >
Hereinafter, being illustrated to the manufacturing method of panel involved in second embodiment of the present invention.It needs to illustrate
Be, in the explanation of the second embodiment, for in above-mentioned first embodiment it is stated that cross important document it is identical
Important document, by for illustrating to omit duplicate theory and assigning identical symbol in the attached drawing and specification of second embodiment
It is bright.In addition, in this second embodiment, being only illustrated to the difference with above-mentioned first embodiment.
Panel involved in the manufacturing method of panel involved in second embodiment and above-mentioned first embodiment
Manufacturing method is the difference is that following two points: in the liquid crystal display panel base material 1 for becoming cutting object, first end 3a and the
Two end 4a at same location, both first end 3a and the second end 4a on the direction that cutting preset lines 2 extend
Be not staggered this point (in above-mentioned first embodiment, Z=0mm)；As shown in Fig. 5 a, Fig. 5 b, work is formed in initial crack
In sequence, two initial cracks 8,9 this point are formed using as the irradiation of the picosecond laser 13 of pulse laser.
In the present embodiment, it is formed initially when forming initial crack 8 to first end 3a and to the second end 4a
When crackle 9, picosecond laser 13 is made to be gathered in the upper surface of above-mentioned end 3a, 4a (using upper surface as the coke of picosecond laser 13
Point).It should be noted that picosecond laser 13 can also be replaced for the formation of two initial cracks 8,9, and pass through irradiation
It is executed as the femtosecond laser of pulse laser.Here, the wavelength about pulse laser, according to the first glass mother substrate 3, second
The absorptivity of glass mother substrate 4, the pulse width of pulse laser and from various wavelength suitably select.
Hereinafter, for the work in the case where the manufacturing method for using panel involved in above-mentioned second embodiment
It is illustrated with, effect.
In general, the gap (cell gap) formed between the first glass mother substrate 3 and the second glass mother substrate 4 is very
It is narrow.Therefore, in first end 3a and the second end 4a not in the case where being in staggered configuration on cutting off the direction that preset lines 2 extend,
Initial crack 9 is formed even to enter stitch marker 7 between two mother substrates 3,4, is also difficult to carry out sometimes.However, if
Using picosecond laser 13, then no matter whether first end 3a and the second end 4a is in staggered configuration, and can make picosecond laser 13
The position of aggregation is respectively formed initial crack 8,9.Thereby, it is possible to desired position be reliably formed two initial cracks 8,
9。
Here, what the manufacturing method of panel according to the present invention was not limited to illustrate in above-mentioned each embodiment
Mode.For example, in above-mentioned each embodiment, using by the liquid crystal display panel including the liquid crystal display panel comprising two tensors
Base material is cut off to cut out the mode of each liquid crystal display panel, but the liquid including the liquid crystal display panel to the amount comprising three or more
In the case that crystal panel base material is cut off, the manufacturing method of panel according to the present invention can be also applied certainly.
In addition, in above-mentioned first embodiment, in initial crack formation process, using by make stitch marker from
Cutting preset lines another side the mode of two initial cracks is formed towards one end rotation, but can also make stitch marker from
One end forms two initial cracks towards another side rotation.That is, can also be by making stitch marker from liquid crystal display panel base material
Outer circumference end towards turning to the inside to form two initial cracks.In addition, in above-mentioned first embodiment, it is single by making
Stitch marker only rotate primary and be continuously formed two initial cracks, but each initial crack can also be formed separately.
In addition, using in above-mentioned second embodiment through irradiation picosecond laser, femtosecond laser isopulse laser
Form the mode of two initial cracks, but not limited to this.Pulse laser can also be replaced, by irradiating using UV laser as generation
The short wavelength laser of table forms two initial cracks.It should be noted that can also replace in above-mentioned first embodiment
Stitch marker, the pulse laser in second embodiment, and two initial cracks are formed using paper etc..
In addition, in above-mentioned each embodiment, in initial crack formation process, use for first end and
This both sides of the second end, surface side forms the mode of initial crack on it, but not limited to this.Can also first end with
And the either side of the upper surface side of the either end in the second end, lower face side forms initial crack.For example, can be first
The upper surface side of end forms initial crack, forms initial crack in the lower face side of the second end.It should be noted that such as
In the case that above-mentioned second embodiment forms initial crack by the irradiation of pulse laser like that, no matter by initial crack
It is formed in the upper surface side of first end and the second end, the which side of lower face side, it can be from liquid crystal display panel base material
Upper surface side irradiates the laser, or the laser can also be irradiated from lower face side (in irradiation using UV laser as the shortwave of representative
It is also identical in the case where long laser).In addition, being cut off in the first end as above-mentioned second embodiment and the second end
Preset lines extend direction on it is at same location in the case where, can also be by making stitch marker along liquid crystal display panel base material
Thickness direction rotates and forms initial crack in first end and the second end.
In addition, in cut off operation, being used to liquid crystal display panel base material only from upper surface in above-mentioned each embodiment
Side carries out laser irradiation and follows the mode of the cooling based on refrigerant of the laser irradiation, but can also use only under
Surface side carries out the mode of above-mentioned laser irradiation and above-mentioned cooling.In addition, in above-mentioned each embodiment, by laser irradiation
Condition be set as, cut off that there are two the items when glass plate of thickness more than the sum of thickness of mother substrate to cut off tool using laser
Part, but not necessarily use this condition.
In addition, cutting out each liquid crystal surface using by cutting liquid crystal display panel base material in above-mentioned each embodiment
The mode of plate, but the manufacturing method of panel according to the present invention for example also can be applied to by cutting off having comprising multiple amounts
Organic EL panel base material including machine EL panel cuts out the such situation etc. of each organic EL panel.
Drawing reference numeral explanation
1 liquid crystal display panel base material
11 liquid crystal display panels
2 cutting preset lines
One end of 2a cutting preset lines
3 first glass mother substrates
3a first end
31 first glass substrates
4 second glass mother substrates
4a the second end
41 second glass substrates
5 sealing elements
7 stitch markers
8,9 initial crack
13 picosecond lasers
Claims (7)
1. a kind of manufacturing method of panel comprising cut off cutting for the panel base material along cutting preset lines for panel base material
Disconnected process, the panel base material, which includes, has the first of the first glass substrate in each region divided by the cutting preset lines
Glass mother substrate；Has second glass mother's base of second glass substrate opposed with first glass substrate in each region
Plate；And be packed into each region in the mode being located between first glass substrate and second glass substrate
It is packed into component, thus the panel base material has in each region comprising first glass substrate, the second glass base
Plate and it is described be packed into component as constitutive requirements panel,
The manufacturing method of the panel is characterized in that,
Including initial crack formation process, in the first glass mother substrate and the second glass mother substrate is respective is located at
The first end and the second end of the one end of the cutting preset lines form initial crack respectively,
Shining based on laser along the cutting preset lines is carried out from a surface side of the panel base material with to the panel base material
The heating penetrated and the cooling based on refrigerant for following the heating, make two initial cracks be in progress together, thus to execute
Cut off operation is stated,
The first glass mother substrate and the second glass mother substrate with a thickness of 10 μm~300 μm,
The second end of the second glass mother substrate is located at super from the first end of the first glass mother substrate
Position out,
In the cut off operation, as first step, by making the initial crack for being formed in the second end be in progress
And the second end of the second glass mother substrate is only cut off, later, as second step, make to be formed in the first end
The initial crack in portion starts to be in progress, and two initial cracks is made to be in progress together, to cut off first glass simultaneously
Glass mother substrate and the second glass mother substrate.
2. the manufacturing method of panel according to claim 1, which is characterized in that
The initial crack formation process is executed by making stitch marker rotation.
3. the manufacturing method of panel according to claim 2, which is characterized in that
The second end of the second glass mother substrate is exceeded from the first end of the first glass mother substrate
Length be set as 0.2mm~5mm.
4. the manufacturing method of panel according to claim 2 or 3, which is characterized in that
By being rotated up the stitch marker towards the side of one end from the another side of the cutting preset lines, Lai Zhihang
The initial crack formation process.
5. the manufacturing method of panel according to claim 1, which is characterized in that
The initial crack formation process is executed by irradiated with pulse laser.
6. according to claim 1~3, manufacturing method of panel described in any one of 5, which is characterized in that
The condition of the laser irradiation in the cut off operation is set as carrying out based on laser irradiation following glass plate
It heats and follows the cooling based on refrigerant of the heating, thus make the initial crack progress for being formed in the end of the glass plate
Come condition when being cut off, the glass plate has the thickness and the second glass mother substrate of the first glass mother substrate
The sum of thickness more than thickness.
7. according to claim 1~3, manufacturing method of panel described in any one of 5, which is characterized in that
By the width in the gap being formed between the first glass mother substrate and the second glass mother substrate be set as 0.1 μm~
20μm。
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| JP2014-106947 | 2014-05-23 | ||
| JP2014106947 | 2014-05-23 | ||
| PCT/JP2015/064257 WO2015178358A1 (en) | 2014-05-23 | 2015-05-19 | Panel manufacturing method |
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| KR (1) | KR102246031B1 (en) |
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| JP6578533B1 (en) * | 2018-06-13 | 2019-09-25 | 株式会社Ｎｓｃ | Liquid crystal panel manufacturing method |
| JP7466829B2 (en) * | 2020-02-06 | 2024-04-15 | 日本電気硝子株式会社 | Glass plate manufacturing method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101031383A (en) * | 2004-05-11 | 2007-09-05 | 塔工程有限公司 | Device for cutting glass substrate and its method |
| JP2007261885A (en) * | 2006-03-29 | 2007-10-11 | Lemi Ltd | Cleaving method of piled glass |
| JP2010095414A (en) * | 2008-10-17 | 2010-04-30 | Linkstar Japan Co Ltd | Method for cutting mother glass substrate for display and brittle material substrate, and method for manufacturing display |
| JP2011116611A (en) * | 2009-12-07 | 2011-06-16 | Nippon Electric Glass Co Ltd | Method for cutting plate glass and cutting device therefor |
| WO2014030521A1 (en) * | 2012-08-21 | 2014-02-27 | 旭硝子株式会社 | Method for cutting composite sheet, method for cutting glass sheet, and cut piece of composite sheet |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2002224870A (en) | 2001-01-31 | 2002-08-13 | Seiko Epson Corp | Laser cutting method, electrooptic device manufacturing method, optoelectronic device and electronic apparatus |
| US8269138B2 (en) * | 2009-05-21 | 2012-09-18 | Corning Incorporated | Method for separating a sheet of brittle material |
| JP6032464B2 (en) * | 2011-05-13 | 2016-11-30 | 日本電気硝子株式会社 | Laminate cutting method |
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2015
- 2015-05-19 CN CN201580009294.7A patent/CN106029591B/en active Active
- 2015-05-19 WO PCT/JP2015/064257 patent/WO2015178358A1/en active Application Filing
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101031383A (en) * | 2004-05-11 | 2007-09-05 | 塔工程有限公司 | Device for cutting glass substrate and its method |
| JP2007261885A (en) * | 2006-03-29 | 2007-10-11 | Lemi Ltd | Cleaving method of piled glass |
| JP2010095414A (en) * | 2008-10-17 | 2010-04-30 | Linkstar Japan Co Ltd | Method for cutting mother glass substrate for display and brittle material substrate, and method for manufacturing display |
| JP2011116611A (en) * | 2009-12-07 | 2011-06-16 | Nippon Electric Glass Co Ltd | Method for cutting plate glass and cutting device therefor |
| WO2014030521A1 (en) * | 2012-08-21 | 2014-02-27 | 旭硝子株式会社 | Method for cutting composite sheet, method for cutting glass sheet, and cut piece of composite sheet |
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| KR102246031B1 (en) | 2021-04-29 |
| CN106029591A (en) | 2016-10-12 |
| TW201607661A (en) | 2016-03-01 |
| JP6512221B2 (en) | 2019-05-15 |
| KR20170010743A (en) | 2017-02-01 |
| TWI633963B (en) | 2018-09-01 |
| JPWO2015178358A1 (en) | 2017-04-20 |
| WO2015178358A1 (en) | 2015-11-26 |
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