KR102132094B1 - Electronic component mounting device and electronic component mounting method - Google Patents

Abstract

Provided is an electronic component mounting apparatus and an electronic component mounting method capable of aligning the position of a chip component and a position of a substrate with high precision with a short tact time.
A first formed of a transparent material and having a collet 28 that adsorbs and holds the chip component 13, is disposed on the opposite side of the chip component 13 with respect to the collet 28, and projects an image of the chip component 13 A second mirror (having a mirror 35 and a chip component recognition camera 34 for recognizing the chip component 13, disposed between the substrate 11 and the collet 28 and projecting an image of the substrate 11 ( 38) and a substrate recognition camera 37 that recognizes the substrate 11. The first mirror 35 and the second mirror 37 are integrally moved to the recognition operation positions A and B of the chip component 13 and the substrate 11, so that each of the chip component 13 and the substrate 11 is moved. An electronic component mounting apparatus 1 and an electronic component mounting method for recognizing a position and correcting a misalignment between the chip component 13 and the substrate 11 based on the recognition information.

Description

ELECTRONIC COMPONENT MOUNTING DEVICE AND ELECTRONIC COMPONENT MOUNTING METHOD}

The present invention relates to an electronic component mounting device and an electronic component mounting method.

When an electronic component such as a semiconductor chip (called a chip component) is mounted on a substrate, the chip components and the substrate are precisely aligned and then bonded. Such positional alignment is performed by recognizing the chip part recognition mark formed on the chip part and the substrate recognition mark formed on the substrate by a camera or the like, and managing the relative positional relationship of both recognition marks with a predetermined precision. It is common. An apparatus for mounting a chip component on a substrate is called an electronic component mounting apparatus, a die bonder, or a bonding apparatus.

As a means of aligning the position of the chip component and the substrate, an electronic device comprising a confirmation camera for recognizing the position of the chip component in the pickup position of the chip component and a recognition camera for recognizing the position of the chip component and the substrate in the bonding position There is a component mounting device. This electronic component mounting apparatus is said to be capable of recognizing the position of the chip component and the substrate by moving the confirmation camera together with the chip component when the chip component is moved from the pickup position to the bonding position (for example, patent literature) 1).

Further, as a means for aligning the position of the chip component and the substrate, a chip component recognition mark formed in two places of the chip component and a substrate recognition mark formed in two places of the substrate are projected onto the first mirror, and a pair of second mirrors By projecting to the CCD cameras corresponding to each of the second mirrors, recognizing the difference in the positions of the chip components and the substrate, driving the movable table holding the substrate and the movable table holding the head adsorbing the chip components It is said that the position of a chip component and a board|substrate is corrected (for example, refer patent document 2).

Japanese Patent Publication No. 2008-124382 International Publication No. 2006/129547

However, in the electronic component mounting apparatus described in Patent Document 1, the position of the chip component is recognized by the camera for confirmation, the chip component is moved to the position of the substrate recognition camera, and the chip component and the substrate are recognized by the recognition camera. There is a problem that the tact time is prolonged because it takes time to move the chip parts. In addition, when there is only one recognition camera, since the recognition camera and chip components are moved to the position of the board recognition operation, the tact time is longer due to more movement time, and the recognition is used as a reference for position recognition. There is a problem that the positional accuracy is difficult to obtain because the camera and chip parts are moved to the bonding position.

In the electronic component mounting apparatus described in Patent Document 2, the chip components are moved to a bonding position by a movable table and the substrate is moved to a bonding position by a movable table when the chip parts and the substrate are aligned. There is a problem in that an error due to the movement or a stop position error occurs, so that the required recognition precision is not obtained, and high-precision alignment of the chip component and the substrate cannot be performed.

Therefore, the present invention has been made to solve at least one of these problems, and is intended to provide an electronic component mounting apparatus and an electronic component mounting method capable of accurately aligning chip components and substrates with a short tact time.

[1] The electronic component mounting apparatus of the present invention is an electronic component mounting apparatus that bonds a chip component in a face-up position at a predetermined position on a substrate, and is formed of a transparent material, and has a bonding head having a collet that adsorbs and holds the chip component. And a first mirror disposed on the opposite side of the chip component adsorbed and held against the collet and projecting an image of the chip component, and a chip component recognition camera recognizing an image of the chip component projected by the first mirror. And a second mirror disposed between the substrate and the collet when recognizing the substrate and projecting an image of the substrate, a substrate recognition camera recognizing an image of the substrate projected by the second mirror, and the agent. A camera driver for moving the one mirror and the second mirror integrally to the recognition operation positions of the chip component and the substrate, and the chip component recognition camera and the substrate recognition camera to recognize each position of the chip component and the substrate And a control unit for correcting the positional deviation of the chip component and the substrate based on the information.

According to the electronic component mounting apparatus of the present invention, the first mirror and the second mirror are projected onto the image of the chip component and the substrate at the same recognition operation position, and the image is introduced by the chip component recognition camera and the substrate recognition camera, respectively, and the chip is introduced. An electronic component mounting device capable of aligning the position of the chip component and the substrate with high accuracy at a shorter tact time than the prior art that recognizes the location of the component and the substrate separately, in that the position of the component and the substrate can be recognized separately. Can provide.

[2] In the electronic component mounting apparatus of the present invention, the optical axis when the first mirror projects the image of the chip component and the optical axis when the second mirror projects the image of the substrate are the substrate It is preferable that it is arrange|positioned perpendicularly and coaxially with respect to the chip component deposition surface of the.

Since the optical axis of the first mirror and the optical axis of the second mirror coincide, the image of the chip component and the image of the substrate can be projected simultaneously with the same reference. That is, a high-precision position alignment (position) in that the chip parts recognition camera and the substrate recognition camera can recognize the image of the chip parts and the substrate projected on the same optical axis, and can recognize the position of the chip parts and the substrate with high precision. Correction) becomes possible.

[3] In the electronic component mounting apparatus of the present invention, the recognition operation positions are provided in at least two spaced apart locations, and the camera driving unit moves the first mirror and the second mirror to each of the recognition operation positions. It is preferable to have a camera X-axis driving unit to move and a camera Y-axis driving unit.

Here, the X-axis and the Y-axis refer to the X-direction and the Y-direction when the substrate is composed of an X-Y plane. In order to define the position of the chip component and the substrate, it is necessary to recognize both at least two or more recognition operation positions. Therefore, if the first mirror (camera unit for chip parts) and the second mirror (camera unit for board) are sequentially moved to each recognition operation position at the same time, the positions of the chip parts and the substrate can be recognized in a plurality of recognition operation positions in a short time. Can. In addition, since the optical axes of the first mirror and the second mirror are aligned, the positions of the chip parts and the substrate can be recognized with high precision in each recognition operation position, and high-precision position alignment is possible.

[4] In the electronic component mounting apparatus of the present invention, the bonding head includes a head Z-axis driving unit that moves the collet from the position where the collet holds and holds the chip component to the position where the chip component is bonded onto the substrate. , It is preferable to have a θ-axis driving unit for rotating the chip component parallel to the surface to be adsorbed.

Here, the Z axis refers to an axis perpendicular to the X-Y plane, and the θ axis refers to the Z axis at a specific plane position. The θ-axis driving unit is a collet, that is, a mechanism for rotating the chip component in the plane direction, and since the bonding head does not move in the plane direction (X direction, Y direction), errors caused by movement in the plane direction can be suppressed. This enables high-precision positional alignment of chip components and substrates.

[5] In the electronic component mounting apparatus of the present invention, the substrate is adsorbed and held by a substrate stage, and the substrate stage moves the substrate to a bonding target position, and is attached to the chip component at the bonding target position. It is preferable to have a substrate X-axis driving part and a substrate Y-axis driving part for correcting the positional displacement of the substrate with respect to.

With such a configuration, it is possible to align the position of the substrate with respect to the chip component by driving the substrate X-axis driver and the substrate Y-axis, so that both the substrate and the chip component are moved to determine the position of the substrate and the chip component. Compared to the technology, high-precision positional alignment is possible due to less influence of the movement precision and the movement stop precision in the plane direction.

[6] The electronic component mounting method of the present invention is an electronic component mounting method in which a chip component is bonded in a face-up position to a predetermined position on a substrate, a process of picking up the chip component and conveying it to a bonding location, and formed of a transparent material A process of adsorbing and holding the chip component on a collet; a process of recognizing the position of the chip component and the substrate at a first recognition operation position in at least two recognition operation positions; and the chip at a different recognition operation position. A step of recognizing the position of the component and the substrate; a process of correcting the positional deviation of the chip component and the substrate based on the recognition information of each of the recognition operation positions; and after correcting the positional deviation, the chip component It characterized in that it comprises a step of bonding to a predetermined position on the substrate.

According to the electronic component mounting method of the present invention, the position of the chip component and the substrate can be separately recognized by the chip component recognition camera and the substrate recognition camera, since the positions of the chip components and the substrate can be simultaneously recognized at the same recognition operation position. It is possible to provide an electronic component mounting method capable of performing bonding by aligning the positions of the chip components and the positions of the substrates with high precision at a shorter tact time than the conventionally recognized prior art.

[7] In the electronic component mounting method of the present invention, in the step of recognizing the chip component and the substrate, it is preferable to simultaneously recognize the chip component and the substrate on the same optical axis.

In this way, it is possible to recognize the chip component and the substrate at the same time on the same position basis, and it is possible to recognize the position of the chip component and the substrate with high precision.

[8] In the electronic component mounting method of the present invention, in the process of correcting the positional deviation of the chip component and the substrate, based on the position recognition information obtained by the step of recognizing the position of the chip component and the substrate, It is preferable to include a process of correcting the position of the substrate with respect to the chip component, and a process of correcting the posture of the chip component in the planar direction with respect to the substrate after correction.

Since the position of the chip component and the substrate in the X and Y directions is shifted, the substrate side is moved, and the posture of the chip component relative to the substrate is corrected by rotating the chip component. It becomes possible to suppress the stop position error).

1 is a plan view showing a schematic configuration of an electronic component mounting device 1 according to an embodiment.
FIG. 2 is a front view showing the electronic component mounting device 1 as viewed from the lower side of FIG. 1.
3 is a perspective view showing an example of a state in which the chip component 13 is bonded to the substrate 11.
4 is an explanatory diagram schematically showing the alignment of the chip components 13 and the substrate 11.
5 is a process flow chart showing a main process of the electronic component mounting method according to the embodiment.

Hereinafter, the electronic component mounting apparatus 1 and the electronic component mounting method according to the embodiment of the present invention will be described with reference to FIGS. 1 to 5.

[Configuration of the electronic component mounting device 1]

1 is a plan view showing a schematic configuration of an electronic component mounting apparatus 1 according to an embodiment, and FIG. 2 is a front view showing the electronic component mounting apparatus 1 as viewed from the lower side of FIG. 1. In the drawings to be described later, the left and right directions shown in FIG. 1 are referred to as the Y direction or the Y axis, and the up and down directions shown as the X direction or the X axis. In addition, the vertical direction with respect to the X-Y plane will be described in the Z direction or the vertical direction.

The configuration of the electronic component mounting apparatus 1 will be described with reference to FIGS. 1 and 2. The electronic component mounting apparatus 1 includes a substrate stage 12 for holding a substrate 11 on a base mount 10, a chip component stage 14 for holding a chip component 13, and a substrate ( A bonding head 15 disposed above 11 and bonding the chip component 13 to the substrate 11, and a recognition camera unit for detecting the position of the chip component 13 and the location of the substrate 11 ( 16).

The substrate 11 is, for example, a glass substrate, a resin substrate, a film substrate, and a metal substrate, and the material is not limited, and is a large substrate capable of mounting a large number of chip parts 13 or a small size mounting a small number of chip parts. It may be a substrate. On the surface of the substrate 11, an adhesive layer (not shown) capable of bonding the chip components 13 is provided. As the adhesive layer, a thermosetting adhesive may be applied, or a thermosetting adhesive film may be adhered, and the formation range of the adhesive layer may be the entire surface of the substrate 11 or the bonding position of the chip parts 13 or may have adhesiveness on the surface. It is preferable to select the chip component 13 that does not move on the substrate 11. When conductivity is required for the bonding surface between the substrate 11 and the chip component 13, Ag paste may be used as the adhesive layer, or the chip component 13 and the substrate 11 may be bonded by a process bonding technique. .

As the chip component 13, for example, it is an electronic component that is not limited to the type or size, such as an IC chip, a semiconductor chip, an optical element, or a surface mount component, and the face faces upward with the active surface facing upward with respect to the substrate 11. It is intended to be bonded to a substrate (described as bonding). When the chip component 13 is a semiconductor chip or an IC chip, the chip component 13 is a reorganized wafer 17 having a circular shape by full dicing. Therefore, the chip component stage 14 is a wafer stage, and an expander stage is used to easily pick up the chip components 13 one by one. In the following description, the chip component stage 14 may be described as the wafer stage 14.

The substrate stage 12 moves the substrate 11 to a bonding position by the substrate X-axis driver 18 and the substrate Y-axis driver 19, and also aligns the position of the chip component 13 and the substrate 11 ( The substrate 11 is moved in the X-direction and the Y-direction in order to correct the displacement.

The wafer stage 14 has an X-axis driving unit and a Y-axis driving unit (not shown), and moves the position of the chip component 13 to be bonded to a position where it can be picked up. In this example, as shown in Fig. 1, the pick-up position of the chip component 13 is set as the center position of the wafer 17, but it is sufficient to provide a rule so that the moving distance of the wafer 17 can be shortened. It is not limited to the location. Above the wafer stage 14, a wafer recognition camera (not shown) is arranged, recognizes the chip component 13 as a bonding object, and moves the chip component 13 as a pickup object to a pickup position based on this recognition information. .

The bonding head 15 includes a head Z-axis driving part 26 provided on a horizontal column 25 standing on the base stand 10 and a collet holding frame movable in the Z direction (up and down) by the head axis driving part 26. (27). The collet holding frame 27 is a frame body in which the side and upper and lower sides of the recognition camera unit 16 side are opened as shown in Fig. 2, and the opening of the lower side is made of a transparent material such as glass. The collet 28 made is attached. The collet 28 is provided with a plurality of suction holes (not shown), and the suction holes are connected to a vacuum generator (not shown), so that the chip component 13 can be adsorbed and held.

The collet holding frame 27 is connected to the θ-axis driving unit 29 and rotates the collet holding frame 27 about the θ axis 30. That is, the θ-axis driving unit 29 rotates the chip component 13 that is adsorbed and held by the collet 28. The chip component 13 is adsorbed and held by the collet 28 so that the center (center of the drawing) of the chip component is on the θ axis 30.

As shown in FIG. 2, the recognition camera unit 16 is arrange|positioned between the chip component camera unit 31 arrange|positioned above the collet 28, and the collet 28 and the board|substrate stage 12. It has a camera unit 32 for a substrate. The chip component camera unit 31 and the substrate camera unit 32 are integrally fixed with a gap in the vertical direction by the support block 33. The chip component camera unit 31 includes a chip component recognition camera 34, a first mirror 35 projecting an image of the chip component 13 through the collet 28, and a first mirror 35. It is comprised with the lens 36 which inputs the image of the projected chip component 13 to the chip component recognition camera 34. On the other hand, the substrate camera unit 32 includes a substrate recognition camera 37, a second mirror 38 projecting a part of the substrate 11, and a substrate 11 projected by the second mirror 38. It is comprised with the lens 36 which inputs an image to the board|substrate recognition camera 37. As the first mirror 35 and the second mirror 38, a prism is used in this example, but may be a half mirror.

The chip component camera unit 31 and the substrate camera unit 32 each have a light source 39 and a third mirror 40. In the camera unit 31 for chip components, light emitted from the light source 39 is irradiated to the chip components 13 through the third mirror 40, the lens 36 and the first mirror 35, The reflected light from the chip component 13 is input to the chip component recognition camera 34. In the substrate camera unit 32, light emitted from the light source 39 is irradiated to the substrate 11 through the third mirror 40, the lens 36 and the second mirror 38, and the substrate ( The reflected light from 11) is input to the substrate recognition camera 37. As shown in Fig. 2, the first mirror 35 and the second mirror 38 include an optical axis L when the first mirror 35 projects the image of the chip component 13, and a second mirror. When the 38 is projecting the image of the substrate 11, the optical axis L is arranged so that the chip component deposition surface 11A of the substrate 11 is vertical and coaxial. The optical axis L does not change even when the camera unit 16 for recognition moves. 2, the case where the optical axis L and the (theta) axis 30 are on the same axis is illustrated. Further, the optical axis L is an optical axis between the first mirror 35 and the chip component 13 among the optical components connecting the chip component recognition camera 34, the first mirror 35, and the chip component 13, It is an optical axis between the second mirror 38 and the substrate 11 among the optical axes connecting the chip component recognition camera 34, the second mirror 38, and the substrate 11.

The recognition camera unit 16 has a camera Y-axis driving unit 41 and a camera X-axis driving unit 42 as camera driving units, and the camera unit 31 for chip components and the camera unit 32 for substrates are Y-direction. , Move horizontally in the X direction. The recognition camera unit 16 has a position where the first mirror 35 projects the image of the chip component 13 by the camera Y-axis driving unit 41, and a retracted position (a position that does not affect bonding). The first mirror 35 and the second mirror are moved. Since the optical axis L of the first mirror 35 and the second mirror 38 is always coaxial, the recognition camera unit 16 simultaneously positions the image of the chip component 13 and the substrate 11 at the same time. It can be introduced in the standard.

As shown in FIG. 1, the electronic component mounting apparatus 1 includes a wafer stage 14, a pickup arm 45 for picking up the individualized chip components 13 on the wafer stage 14, and a pickup arm ( It has a chip shuttle arm 46 that receives the chip parts 13 from 45 and conveys them to the bonding head 15. A wafer recognition camera (not shown) is provided above the wafer stage 14, and the chip component stage 14 is moved in the X and Y directions based on the recognition information of the wafer recognition camera, and picked up. The target chip component 13 is moved below the adsorption portion of the pickup arm 45. The pick-up arm 45 is movable in the X-direction and the Z-direction, and picks up a good product and a chip component 13 at a bonding target position from the wafer 17. The chip component 13 is conveyed in a face-up attitude.

The chip shuttle arm 46 is arranged below the pick-up arm 45, and from the pick-up arm 45 at a predetermined position in the X direction (approximately intermediate position between the chip component stage 14 and the bonding head 15). The chip parts 13 are received in a face-up position, and the chip parts 13 are conveyed to a position where the collet 28 of the bonding head 15 can be adsorbed. The bonding head 15 adsorbs the chip component 13 in a face-up position by lowering the collet 28 by the head Z-axis driving unit 26 when the chip component 13 comes directly under the collet 28. It holds, and raises the chip component 13 to a predetermined height, and stops. Thereafter, the presence or absence of a positional deviation between the chip component 13 and the substrate 11 is detected, and the positional deviation is corrected to bond the chip component 13 to a predetermined position on the substrate 11. The operation and mounting method of the electronic component mounting apparatus 1 for mounting the chip component 13 on the substrate 11 will be described in detail in the section of the electronic component mounting method described later.

3 is a perspective view showing an example of a state in which the chip component 13 is bonded to the substrate 11. The electronic component mounting device 1 is a device that primarily bonds the chip component 13 (semiconductor chip, etc.) to the substrate 11 in a face-up state in Fan Out Wafer Level technology. Therefore, the substrate 11 has a rectangular shape, a circular shape, and various sizes. In the example shown in Fig. 3, nine chip parts 13 are bonded to the rectangular substrate 11 in the X direction and nine in the Y direction, but the number and arrangement of the chip parts 13 is not limited to this. .

Chip component recognition marks R1 and R2 are formed diagonally on the chip component 13, and substrate recognition marks M1 and M2 are formed on the substrate 11 diagonally in the same direction as the chip component 13. The chip part recognition mark and the substrate recognition mark are so-called alignment marks, and are not limited to two places, but may be arranged in three or four places, but the chip parts 13 are formed to correspond to one by one. .

4 is an explanatory diagram schematically showing the positional alignment of the chip component 13 and the substrate 11, and FIG. 4(a) shows the positional alignment (without misalignment), and FIG. 4 (B) is a diagram showing a state in which position shift is recognized. In the example shown in Fig. 4A, the substrate recognition marks M1 and M2 are arranged on a straight line connecting the chip component recognition marks R1 and R2 formed on the chip component 13. The area surrounded by the dotted line A is the first recognition operation position A, and the area surrounded by the dotted line B is the second recognition operation position B. That is, the chip part recognition mark R1 and the substrate recognition mark M1 are recognized by the recognition camera unit 16 at the first recognition operation position A, and the chip part recognition mark R2 and the substrate recognition mark M2 are moved to the second recognition operation position B. The position of the camera is recognized by the recognition camera unit 16, and the position shift (position shift and posture in the X direction and the Y direction of the substrate 11 with respect to the chip component 13) is recognized.

In the example shown in Fig. 4, the shapes of the chip part recognition marks R1 and R2 and the substrate recognition marks M1 and M2 are respectively rectangular and circular, but the shape is not limited to a square or a circular shape, and may be triangular or cross. In addition, the number of chip component recognition marks and the substrate recognition marks may be at least two, and may be increased in the same manner as three or four. When the first recognition operation position A and the second recognition operation position B enter the field of view of the first mirror 35 and the second mirror 38, it is also possible to perform a single recognition operation.

FIG. 4B shows an example in the case where the substrate 11 is misaligned with respect to the chip component 13. In the 1st recognition operation position A, the board|substrate 11 has X1 in X direction with respect to the chip component 13, and Y1 in Y direction. The position of M1 to be indicated is indicated by M1-0. In the 2nd recognition operation position B, the board|substrate 11 has position shift of X2 in the X direction and Y2 in the Y direction with respect to the chip component 13. The position of M2 to be present is indicated by M2-0. From the position misalignment information recognized at the first recognition operation position A and the second recognition operation position B, the position correction amount of the substrate 11 with respect to the chip component 13 is calculated by the control unit (not shown), and the X direction and Position correction in the Y direction is performed by driving the substrate stage 12. In the case where the positional deviations in the first recognition operation position A and the second recognition operation position B are different, the substrate 11 is rotated relative to the chip component 13 (inclined in the plane direction). If the posture is corrected by rotating the chip component 13, high-precision positional alignment of the chip component 13 and the substrate 11 can be performed. The control unit controls at least the recognition camera unit 16 to obtain the position information of the chip component 13 and the substrate 11, and adjusts the position and posture of the chip component 13 and the substrate 11 to perform position correction. It has a function to control.

The electronic component mounting apparatus 1 described above is formed of a transparent material and has a bonding head 15 having a collet 28 that adsorbs and holds the chip component 13, and a chip that is adsorbed and held by the collet 28. A first mirror 35 disposed on the opposite side of the component 13 to project the image of the chip component 13, and a chip component recognition camera for recognizing the image of the chip component 13 projected by the first mirror 35 34, the second mirror 38 disposed between the substrate 11 and the collet 28 and projecting the image of the substrate 11, and the image of the substrate 11 projected by the second mirror 38 The camera Y-axis, which is a camera driving unit that moves the substrate recognition camera 37 and the first mirror 35 and the second mirror 38 to recognize the chip parts 13 and the substrate 11 in a recognized operation position. It has a driving part 41 and a camera X-axis driving part 42. In addition, the electronic component mounting apparatus 1 is based on the chip component recognition camera 34 and the board recognition camera 37, the chip component 13 and the board 11 based on the recognition information of each position of the chip component 13 ) And a control unit (not shown) for correcting the positional deviation of the substrate 11.

The electronic component mounting apparatus 1 simultaneously projects the chip component 13 and the substrate 11 by the first mirror 35 and the second mirror 38 at the same recognition operation position, and each of the chip component recognition cameras ( 34) and the position of the chip component 13 and the substrate 11, respectively, in that the position of the chip component 13 and the substrate 11 can be recognized by introducing an image by the substrate recognition camera 37, respectively. It becomes possible to align the position of the chip component 13 and the position of the substrate 11 with high precision with a short tact time than the conventionally recognized prior art.

In the electronic component mounting apparatus 1, the optical axis L when the first mirror 35 projects the image of the chip component 13 and the second mirror 38 project the image of the substrate 11. The optical axis L at this time is perpendicular to the chip component adhered surface 11A of the substrate 11 and is arranged on the same axis. With this configuration, the image of the chip component 13 and the substrate 11 can be projected simultaneously with the same reference. That is, the image of the chip component 13 and the substrate 11 projected on the same optical axis by the chip component recognition camera 34 and the substrate recognition camera 37 can be recognized by the same position reference, and the chip component 13 and High-precision position alignment (position correction) is possible in that the position of the substrate 11 can be recognized with high precision.

In the electronic component mounting apparatus 1, the above-mentioned recognition operation positions are provided at least two spaced apart locations. In this example, in which two recognition operation positions are provided, the first mirror (from the first recognition operation position A to the second recognition operation position B) by the camera X-axis driving unit 42 and the camera Y-axis driving unit 41 that are camera driving units ( 35) and the second mirror 38 are moved. In this way, when the first mirror 35 and the second mirror 38 are simultaneously moved from the first recognition operation position A to the second recognition operation position B, the chip component 13 is placed in two recognition operation positions in a short time. And the position of the substrate 11 can be recognized. In addition, since the optical axes L of the first mirror 35 and the second mirror 38 are matched, the positions of the chip parts 13 and the substrate 11 can be recognized with high precision in each recognition operation position. This enables high-precision position alignment.

In the electronic component mounting apparatus 1, the bonding head 15 extends from the position where the collet 28 adsorbs and holds the chip component 13 to the position where the chip component 13 is bonded onto the substrate 11. It has a head Z-axis driving unit 26 to move, and a θ-axis driving unit 29 for rotating the chip component 13 parallel to the chip component to-be-adsorbed surface 11A. Since the bonding head 15 has no movement in the plane direction (X direction, Y direction), it is possible to suppress errors due to movement in the plane direction, so that the high precision of the chip component 13 and the substrate 11 can be suppressed. Positioning of degrees becomes possible. The posture misalignment between the chip component 13 and the substrate 11 can be corrected by rotating the substrate stage 12, but the correction by rotating the chip component 13 is smaller because the rotational trajectory is small. Becomes possible.

The board|substrate 11 is hold|maintained and adsorbed by the board|substrate stage 12, and the board|substrate stage 12 moves the position of the chip component 13 to the bonding target position, and recognition operation position (1st recognition operation position A and 2nd) It has a substrate X-axis driving unit 18 and a substrate Y-axis driving unit 19 for correcting the movement to the recognition operation position B) and the positional deviation of the substrate 11 relative to the chip component 13. In this way, the substrate 11 and the chip component (in terms of the positional alignment of the substrate 11 relative to the chip component 13 is possible by the substrate X-axis driving unit 18 and the substrate Y-axis driving 19. With respect to the conventional technique of moving both sides of 13) to determine the positions of the substrate 11 and the chip component 13, there is little influence of the movement precision or the movement stop precision in the plane direction, and high-precision position alignment is possible. After transferring the chip component 13 to the chip shuttle arm 46, while the chip shuttle arm 46 conveys the chip component 13 to the bonding position (i.e., the adsorption position by the collet 28), the pickup arm By making the operation to return 45 to the pick-up position, it becomes possible to further shorten the tact time.

[Method of mounting electronic components]

5 is a process flow chart showing a main process of the electronic component mounting method. Referring to FIGS. 1 to 4, description will be given along the process flow shown in FIG. 5. First, the substrate 11 is supplied to the substrate stage 12 and adsorbed and held (step S1). In this case, it is assumed that the wafer 17 previously diced is supplied to a predetermined position of the wafer stage 14. The substrate stage 12 is moved to move the substrate 11 to a bonding target position (step 2). The bonding target position is just below the collet 28 of the bonding head 15. Next, the chip component 13 is picked up from the wafer 17 by the pick-up arm 45 (step S3). In the wafer 17, the chip component 13, which is a pickup target, is moving to a pickup position in the movable range of the pickup arm 45.

The pick-up arm 45 moves to the standby position of the chip shuttle arm 46, and transmits the chip component 13 to the chip shuttle arm 46. The chip shuttle arm 46 conveys the chip component 13 to the bonding position (step S4). That is, the chip component 13 is transported to the adsorption position of the collet 28 of the bonding head 15. The collet 28 adsorbs and holds the chip component 13 (step S5). The chip component 13 is adsorbed so that the center (the center of the drawing) is the center of rotation of the collet 28 (θ axis 30).

Subsequently, the recognition camera unit 16 is driven to move the first mirror 35 and the second mirror 38 to the first recognition operation position A (step S6). In the first recognition operation position A, the chip recognition mark R1 is recognized by the chip component recognition camera 34, and the substrate recognition mark M1 is recognized by the substrate recognition camera 37 (step S7). Since the optical axis L of the first mirror 35 and the second mirror 38 is coaxial, the chip component recognition camera 34 and the substrate recognition camera 37 have the chip component recognition mark R1 and the substrate recognition mark It is possible to introduce M1 as an image based on the same position, and the positional displacement direction and the amount of positional displacement of the chip component 13 and the substrate 11 at the first recognition operation position A are recognized.

Next, the recognition camera unit 16 is driven to move the first mirror 35 and the second mirror 38 to the second recognition operation position B (step S8). At the second recognition operation position B, the chip recognition mark R2 is recognized by the chip component recognition camera 34, and the substrate recognition mark M2 is recognized by the substrate recognition camera 37 (step S9). Since the optical axes L of the first mirror 35 and the second mirror 38 are coaxial, the chip component recognition camera 34 and the substrate recognition camera 37 are chip component recognition marks R2 and substrate recognition marks M2. Can be introduced as an image based on the same position, and the positional displacement direction and the amount of positional displacement of the chip component 13 and the substrate 11 at the second recognition operation position B are detected. In the second recognition operation position B, when the recognition operation ends, the recognition camera unit 16 is driven, and the first mirror 35 and the second mirror 38 are evacuated to a position that does not interfere with the bonding operation. It is made (step S10).

The control unit determines the correction amount based on the position shift direction and the position shift amount recognized in each of the first recognition operation position A and the first recognition operation position B, and drives the substrate stage 12 to the chip component 13. The displacement of the position of the substrate 11 with respect to the X direction and the Y direction is corrected, and the displacement of the posture of the chip component 13 with respect to the substrate 11 is corrected by rotating the collet 28 (step S11). After the position correction is completed, the chip component 13 is pressed and pressed to a predetermined position on the substrate 11 (step S12). Then, the chip parts 13 are bonded to all the bonding target positions of the substrate 11, and then the substrate 11 is removed (step S13).

The electronic component mounting method described above includes a process of picking up the chip component 13 and conveying it to a bonding position, a process of adsorbing and holding the chip component 13 on a collet 28 formed of a transparent material, and at least two locations. In the recognition operation position, the process of recognizing the position of the chip component 13 and the substrate 11 at the first recognition operation position A, and the position of the chip component 13 and the substrate 11 at the second recognition operation position B The process of recognizing and the process of correcting the positional deviation of the chip component 13 and the substrate 11 based on the recognition information of each recognition operation position, and after correcting the positional deviation, the chip component 13 is substrated It includes the process of bonding to the predetermined position of (11).

The chip parts 13 and the substrate can be recognized by the chip parts recognition camera 34 and the substrate recognition camera 37 at the same time in the same recognition operation position. It is possible to perform bonding by aligning the positions of the chip parts 13 and the positions of the substrates 11 with high precision at a shorter tact time than the prior art that recognizes the positions of (11) separately. According to this electronic component mounting method, the positional accuracy after bonding of each of the chip components 13 is represented by σ as the standard deviation, and the amount of positional deviation within the range of 3σ is within 2 μm, and bonding to the substrate 11 The positional accuracy of the entire chip parts 13 was within 3 µm in the range of 3σ.

In the process of recognizing the chip parts 13 (chip part recognition marks R1, R2) and the substrate 11 (substrate recognition marks M1, M2), the chip parts and the substrate are simultaneously recognized on the same optical axis L. In this way, it is possible to recognize the chip component 13 and the substrate 11 at the same time based on the same position, and it is possible to recognize the position of the chip component 13 and the substrate 11 with high precision.

In the process of correcting the positional deviation between the chip component 13 and the substrate 11, the position of the chip component 13 (chip component recognition marks R1, R2) and the position of the substrate 11 (substrate recognition marks M1, M2) The process of correcting the position of the board|substrate 11 with respect to the chip component 13 based on the position recognition information obtained by the process of recognizing and the attitude|position of the chip component 13 with respect to the board|substrate 11 after correction in the plane direction It includes the process of correcting. The position of the chip component 13 and the substrate 11 in the X and Y directions is shifted based on the chip component 13, and the attitude of the chip component 13 with respect to the substrate 11 is Since the chip component 13 is rotated and corrected based on the position of the substrate 1 after the positional deviation correction, it becomes possible to suppress the movement error (or movement stop position error) when performing the position correction.

1: Electronic component mounting device
11: Substrate
12: substrate stage
13: chip parts
14: chip component stage (wafer stage)
15: bonding head
16: camera unit for recognition
17: wafer
18: substrate X-axis driving unit
19: substrate Y-axis driving unit
28: collet
29: θ-axis driving unit
31: camera unit for chip parts
32: board camera unit
34: chip part recognition camera
35: first mirror
37: substrate recognition camera
38: second mirror
45: pickup arm
46: chip shuttle arm
A: First recognition operation position
B: Second recognition operation position
L: Optical axis
R1, R2: chip part recognition mark
M1, M2: Substrate recognition mark

Claims (8)

An electronic component mounting apparatus for bonding a chip component in a face-up position at a predetermined position on a substrate,
A bonding head formed of a transparent material and having a collet for adsorbing and holding the chip component;
A first mirror that is disposed on the opposite side of the chip component that is adsorbed and held against the collet and projects an image of the chip component, and a chip component recognition camera that recognizes an image of the chip component projected by the first mirror;
A second mirror disposed between the substrate and the collet when recognizing the substrate and projecting an image of the substrate, and a substrate recognition camera recognizing an image of the substrate projected by the second mirror,
A camera driving unit that integrally moves the first mirror and the second mirror to the recognition operation positions of the chip component and the substrate;
It has a control unit for correcting the positional deviation of the chip component and the substrate based on the recognition information of each position of the chip component and the substrate by the chip component recognition camera and the substrate recognition camera,
In the chip component recognition camera, light emitted from a light source is irradiated to the chip component through the first mirror, and reflected light from the chip component is projected to the chip component recognition camera through the first mirror, Recognize the image of the chip component,
In the substrate recognition camera, the light emitted from the light source is irradiated to the substrate through the second mirror, and the reflected light from the substrate is projected to the substrate recognition camera through the second mirror, thereby image of the substrate To recognize,
The optical axis when the first mirror projects the image of the chip component and the optical axis when the second mirror projects the image of the substrate are perpendicular to and coaxial with the chip component deposition surface of the substrate. By being arranged, images of the chip component and the substrate can be simultaneously introduced,
Electronic component mounting device, characterized in that. According to claim 1,
The recognition operation positions are provided in at least two spaced apart locations,
The camera driving unit includes a camera X-axis driving unit and a camera Y-axis driving unit for moving the first mirror and the second mirror at each of the recognition operation positions,
Electronic component mounting device, characterized in that. The method according to claim 1 or 2,
The bonding head includes: a head Z-axis driving unit that moves the collet from a position where the chip component adsorbs and holds the chip component to a position where the chip component is bonded onto the substrate; and the chip component relative to the surface to which the chip component is adsorbed It has a θ-axis driving part that rotates in parallel.
Electronic component mounting device, characterized in that. The method according to claim 1 or 2,
The substrate is adsorbed and held by the substrate stage,
The substrate stage has a substrate X-axis driver and a substrate Y-axis driver for moving the substrate to a bonding target position and correcting the positional displacement of the substrate with respect to the chip component at the bonding target position,
Electronic component mounting device, characterized in that. delete delete delete delete

Images