KR102102907B1 - Organic light emitting diode display device and method for manufacturing the same - Google Patents

Abstract

The present invention improves the cutting method of the cutting surface and the edge surface of the light emitting display panel during manufacturing of the organic light emitting diode display device, thereby blocking light leakage and preventing cracking and breakage, thereby manufacturing yield. An organic light emitting diode display and a method of manufacturing the same, wherein a plurality of pixel regions are formed to display an image; And a coating cover covering a portion of the outer surface portion of the light emitting display panel and a portion or all of the side surface of the light emitting display panel, and thereby covering a portion of the rear surface of the light emitting display panel and a portion of the side surface or the entire surface. It is characterized by.

Description

Organic light emitting diode display device and its manufacturing method {ORGANIC LIGHT EMITTING DIODE DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME}

The present invention improves the cutting method of the cutting surface and the edge surface of the light emitting display panel during manufacturing of the organic light emitting diode display device, thereby blocking light leakage and preventing cracking and breakage, thereby manufacturing yield. It relates to an organic light emitting diode display and a manufacturing method to improve the.

Since the organic light emitting diode display uses a self-emissive display panel that emits light by itself, a contrast ratio is large, an ultra-thin display can be realized, and a response time of several microseconds is easily realized. Do.

A plurality of pixels composed of three-color (R, G, B) sub-pixels are arranged in a matrix form on the light-emitting display panel of the organic light emitting diode display, and the other substrate is composed of an encapsulated substrate composed of sub-pixels. do. Each sub-pixel consists of an organic light emitting diode (OLED) and an OLED driving circuit that independently drives the OLED. Recently, a dual panel type panel in which an OLED and an OLED driving circuit are formed on different substrates and combined with each substrate facing each other is also produced.

The light emitting display panels are produced through various process processes such as a process of depositing and patterning a conductive metal layer or an insulating layer, a process of bonding each substrate, and scribing or cutting the bonded substrates by size. do. Here, the cutting process is performed not only when cutting the substrates by size, but also when cutting a FPR (Flim-type Patterned Retarder) and a polarizer attached to the front surface of the substrate.

Recently, a borderless type light emitting display panel that does not form a front cover or a bezel on the front outer portion or side of the light emitting display panel may be produced so that the design portion can be highlighted. When manufacturing such a borderless type light emitting display panel, a process of separately applying a sealant to the cutting surface of the light emitting display panel had to be performed.

However, in order to apply the sealant to the cutting surface of the light emitting display panel, the FPR and polarizing plate attached to the front of the substrate had to be accurately cut to match the size of the substrate, leading to a longer cutting time, and the edge parts of the substrate could be damaged or cracked. Defects such as occurrences have also occurred. In particular, since a sealant such as UV resin is applied to the cutting surface of the light-emitting display panel vertically disposed with respect to the ground, the sealant flows down or clumps, and the cover surface is irregular and easily torn off, causing light leakage, etc. Defects also occurred.

The present invention is to solve the above problems, by blocking the light leakage and cracking by improving the cover method of the cutting (cutting) and edge (Edge) surface of the light emitting display panel during the manufacture of the organic light emitting diode display device ) It is an object of the present invention to provide an organic light emitting diode display device and a method of manufacturing the same to prevent generation and damage and improve the manufacturing yield.

An organic light emitting diode display according to an embodiment of the present invention for achieving the above object is a plurality of pixel areas are formed a light emitting display panel for displaying an image; And a coating cover covering a portion of the outer surface portion of the light emitting display panel and a portion or all of the side surface of the light emitting display panel, and thereby covering a portion of the rear surface of the light emitting display panel and a portion of the side surface or the entire surface. It is characterized by.

The coating cover is coated and configured to cover a part or all of the side surfaces formed perpendicular to the outer part of the at least one side, while being applied and coated on the outer part of at least one side of the outer part of the rear surface of the light emitting display panel formed in a quadrilateral shape. It is characterized by.

The coating cover is formed by curing a black or colored epoxy resin applied to each of the outer portions of at least one side of the outer portion of the rear surface of the light-emitting display panel that is disposed upside down, and the black or colored epoxy resin is provided on the light-emitting display panel It is characterized by being coated and cured to cover a portion of the rear surface of the front substrate and the edge surface and side surfaces.

At least one polarizing member of a polarizing plate and a FPR (Flim-type Patterned Retarder) is further provided on the front surface of the light emitting display panel, and at least one polarizing member of the polarizing plate and the FPR is wider than the front substrate area of the light emitting display panel. It is characterized by being formed by cutting.

The coating cover is formed by curing a black or colored epoxy resin applied to each of the outer portions of at least one side of the outer portion of the rear surface of the light-emitting display panel that is disposed upside down, and the black or colored epoxy resin is provided on the light-emitting display panel It is characterized by being coated and cured to cover a part of the back and side of the front substrate and a part of the back and side of the at least one polarizing member.

In addition, a method of manufacturing an organic light emitting diode display according to an embodiment of the present invention for achieving the above object is a light emitting display panel manufacturing step for displaying an image; And coating a black or colored epoxy resin on a part of the outer surface of the light-emitting display panel and a part or all of the side surface of the light-emitting display panel to cover the entire outer surface and a side or all of the side surface of the light-emitting display panel. And forming a cover.

The coating cover forming step comprises placing and attaching at least one polarizing member of a polarizing plate and a FPR (Flim-type Patterned Retarder) to the front surface of the light emitting display panel, wherein at least one polarizing member area of the FPR and the polarizing plate displays the light emitting Cutting at least one polarizing member of the FPR and the polarizing plate so that the area of the front substrate provided on the panel is the same or larger, and an outer side of at least one side of the outer periphery of the rear surface of the light emitting display panel on which the at least one polarizing member is cut. It characterized in that it comprises the step of applying the black or colored epoxy resin of each of the parts.

At least one polarizing member of the polarizing plate and the FPR is characterized in that it is cut wider than the front substrate area of the light emitting display panel.

The step of applying the black or colored epoxy resin is a part of a side surface formed perpendicular to the outer portion of at least one side of the outer portion of the rear surface of the light emitting display panel in which the black or colored epoxy resin is formed in a quadrilateral shape, and the outer portion of the at least one side. It is characterized by applying and coating to cover the entire side.

In the step of applying the black or colored epoxy resin, the black or colored epoxy resin is perpendicular to the outer portion of at least one side of the outer portion of the rear surface of the front substrate provided with the light-emitting display panel and the outer portion of the at least one side. Characterized in that the coating and coating to cover a portion or the entire side of the formed portion, and a portion of the back and side of the at least one polarizing member.

The coating cover forming step further comprises placing and attaching at least one polarizing member of a polarizing plate and an FPR on the front surface of the light emitting display panel, and each of the outer portions of at least one side of the outer surface of the rear surface of the light emitting display panel disposed in an inverted manner. Applying a black or colored epoxy resin, after the black or colored epoxy resin is cured, the area of at least one of the FPR and the polarizing plate is equal to or larger than the area of the front substrate provided on the light emitting display panel. It characterized in that it comprises the step of cutting at least one polarizing member of the FPR and the polarizing plate as possible.

In the step of applying the black or colored epoxy resin, the black or colored epoxy resin is perpendicular to the outer portion of at least one side of the outer portion of the rear surface of the front substrate provided with the light-emitting display panel and the outer portion of the at least one side. Characterized in that the coating and coating to cover a portion or the entire side of the formed portion, and a portion of the back and side of the at least one polarizing member.

Cutting the at least one polarizing member of the FPR and the polarizing plate is characterized in that a part of the black or colored epoxy resin is cut together with at least one of the polarizing member of the FPR and the polarizing plate.

The black or colored epoxy resin is characterized in that it maintains a state that covers both the outer edge portion and the side edge surface of the front substrate.

An organic light emitting diode display device and a method of manufacturing the same according to an embodiment of the present invention having the above characteristics can improve the cutting method of the cutting surface and the edge surface of the light emitting display panel when manufacturing the light emitting display panel. You can.

Accordingly, it is possible to prevent and block side light leakage of the organic light emitting diode display panel, and to prevent cracking and breakage of the cutting surface or the edge surface, thereby improving the manufacturing process yield.

1 is a front view schematically showing an organic light emitting diode display according to an embodiment of the present invention.
FIG. 2 is a rear configuration diagram showing the organic light emitting diode display shown in FIG. 1.
Figure 3 is a cross-sectional view showing the II 'of Figure 2 cut.
4A to 4C are cross-sectional views illustrating a method of manufacturing the light emitting display panel illustrated in FIGS. 1 and 3.
5A to 5C are cross-sectional views of another process for explaining a method of manufacturing the light emitting display panel shown in FIGS. 1 and 3.

Hereinafter, an organic light emitting diode display device and a method of manufacturing the same according to an embodiment of the present invention having the above characteristics will be described in more detail with reference to the accompanying drawings.

1 is a front view schematically showing an organic light emitting diode display according to an exemplary embodiment of the present invention. And, FIG. 2 is a rear configuration diagram showing the organic light emitting diode display shown in FIG. 1.

The organic light emitting diode display illustrated in FIGS. 1 and 2 includes a light emitting display panel 1 in which a plurality of pixel areas are formed to display an image; A gate integrated circuit 2 for driving the gate lines GL of the light emitting display panel 1; A data integrated circuit 3 for driving the data lines DL of the light emitting display panel 1, respectively; And a part of the outer portion of the rear surface of the light-emitting display panel 1 and a portion or all of the side surface of the light-emitting display panel 1, which is coated and adhered to cover a portion of the rear surface of the light-emitting display panel 1 or the entire side surface. It has a coating cover (28).

In the light emitting display panel 1, a plurality of sub-pixels PXLs are arranged in a matrix form in each pixel area to display an image. Each sub-pixel PXL is an organic light emitting diode and its organic light emitting diode. And a diode driving circuit that independently drives the light emitting diodes. Specifically, one sub-pixel PXL includes a diode driving circuit connected to one gate line GL, a data line DL and a power supply line PL, and light emission connected between the diode driving circuit and the second power signal. A diode is provided. Here, the diode driving circuits supply the analog image signal from the connected data line DL to the organic light emitting diode while charging the supplied analog image signal to maintain the light emission state.

The plurality of data integrated circuits 3 are respectively mounted on the data circuit film 4 and connected between the light emitting display panel 1 and each source printed circuit board 5. In addition, the gate integrated circuit 2 may be mounted on a separate gate circuit film (not shown) or disposed in a non-display area of the light emitting display panel 1.

Each of the plurality of data integrated circuits 3 is a data control signal from a timing controller (not shown), for example, a source start pulse (SSP), a source shift clock (SSC), and a source output enable The analog video signal is supplied to each data line by using (SOE; Source Output Enable) signal. In other words, each of the data integrated circuits 3 latches the digital data signal inputted according to the SSC, and outputs it in units of horizontal lines in response to the SOE signal inputted through the timing controller. Then, each data integrated circuit 3 converts the horizontal line unit image data into an analog image voltage, that is, an image signal, and outputs it.

The gate integrated circuit 2 includes a gate control signal from a timing controller, for example, a gate start pulse (GSP), a gate shift clock (GSC), and a gate output (GOE). Enable) scan pulse or gate low voltage is supplied to each gate line using a signal. In other words, each of the gate integrated circuits 2 shifts the GSP from the timing controller according to the GSC to sequentially supply scan pulses to each gate line.

As shown in FIG. 2, the coating cover 28 is coated and coated on the outer portion of at least one side of the outer surface portion of the light emitting display panel 1, that is, the outer surface of the light emitting display panel 1 formed in a quadrilateral shape, It is configured to be coated so as to cover a part or the entire side surface formed vertically with the outer portion of at least one side.

In more detail, when manufacturing a borderless type light emitting display panel 1 that does not separately form a front cover or a bezel, which forms the outer shape of the light emitting display panel 1, first, the light emitting display panel 1 ) It cuts polarizing members such as FPR (Flim-type Patterned Retarder) and polarizer attached to the front side. Then, the rear surface of the light emitting display panel 1 is turned upside down. Thereafter, a black or colored epoxy resin is coated and coated on the outer side of at least one side of the outer surface of the rear surface of the light emitting display panel 1 in the upper direction of the light emitting display panel 1 disposed upside down. At this time, the applied black or colored epoxy resin is coated to cover a part of the side surface or the entire side surface formed perpendicularly to the outer part with the outer part of at least one side.

Meanwhile, the order of coating and coating of the epoxy resin and the cutting process of the epoxy resin including the polarizing member such as a polarizing plate may be performed interchangeably. That is, when a polarizing member such as an FPR and a polarizing plate is attached to the front surface of the light emitting display panel 1, the rear surface of the light emitting display panel 1 is turned upside down to at least one of the outer peripheries of the rear surface of the light emitting display panel 1 A black or colored epoxy resin is first applied and coated on the outer side of one side. In addition, the FPR of the light emitting display panel 1 and a polarizing member such as a polarizing plate may be cut.

Since the epoxy resin is one of the thermosetting plastics and has a fast curing speed and strong adhesion, in addition to the adhesive function, it functions as a coating cover 28 that protects the outer edge and side edge surfaces of the light emitting display panel 1 in a certain form. Hereinafter, an example in which a black epoxy resin is applied will be described.

FIG. 3 is a cross-sectional view of the I-I 'section of FIG.

Referring to FIG. 3, the light emitting display panel 1 is formed by depositing and patterning a conductive metal layer or an insulating layer on the front substrate 10 to form pixels, and scribing or cutting the front substrate 10 by size. It is manufactured through process processes such as bonding the front substrate 10 and the rear cap (or encapsulation substrate EC).

After at least one polarizing member of the polarizing plate 24 and the FPR 25 is further attached to the front surface of the manufactured light emitting display panel 1, that is, the front surface of the front substrate 10, it is similar to the area of the front substrate 10. Laser cutting. In order to prevent the front substrate 10 from being damaged by laser cutting, it is preferable to cut the area of polarizing members such as FPR and polarizing plate to be cut wider than the area of the front substrate 10. After the FPR and the polarizing plate are cut, the light emitting display panel 1 is placed upside down, and then black epoxy resin is coated and coated on each of the outer sides of at least one side of the rear surface of the light emitting display panel 1.

On the other hand, as described above, the coating and coating process of the epoxy resin and the cutting process sequence of the epoxy resin including a polarizing member such as a polarizing plate may be performed interchangeably. In this case, when a polarizing member such as an FPR and a polarizing plate is attached to the front surface of the light emitting display panel 1, a black or colored epoxy resin is first applied and coated on the outer surface of at least one side of the outer surface of the light emitting display panel 1 do. In addition, the FPR of the light emitting display panel 1 and a polarizing member such as a polarizing plate may be cut.

The coated black epoxy resin is coated to cover the side surface of the front substrate 10 formed perpendicularly to the outer portion along with the outer portion of at least one side. The black epoxy resin is quickly bonded and cured to function as a coating cover 28 that protects the outer peripheral portion of the light emitting display panel 1 and the side and edge surfaces of the front substrate 10 in a certain form.

On the other hand, the front substrate 10 disposed on the front surface includes a gate electrode 11 formed in the non-emission region of the front substrate 10 and a gate insulating film 12 formed on the front surface of the front substrate 10 including the gate electrode 11. ), The semiconductor layer 13 formed on the gate insulating film 12 so as to overlap with the gate electrode 11, on the ohmic contact layer 14 and the ohmic contact layer 14 formed so as to overlap on both edges of the semiconductor layer 13 And a protective film 17 formed on the front surface of the front substrate 10 including the source / drain electrodes 15 and 16 formed on the source / drain electrodes 15 and 16. Here, the gate electrode 11, the source / drain electrodes 15, 16, the semiconductor layer 13, the ohmic contact layer 14, the gate insulating film 12, and the protective film 17 form one switching element. .

In addition, a contact hole 18 penetrating the protection film 17 for each sub-pixel area is formed in the protection layer 17 to expose a portion of the drain electrode 16, and the first electrode 19 is provided in each contact hole 18. This is formed and is in electrical contact with the drain electrode. In addition, the front substrate 10 includes a pixel defining layer 23 formed in a non-emission region of the front substrate 10 including a contact hole 18 and an organic emission layer 21 formed on the surface of the first electrode 19 in the emission region ), A second electrode 22 formed on the front surface of the front substrate 10 including the organic emission layer 21 is further formed. The first electrode 19, the organic light emitting layer 21, and the second electrode 22 form one light emitting cell.

4A to 4C are process cross-sectional views illustrating a method of manufacturing the light emitting display panel shown in FIGS. 1 and 3.

The manufacturing method of the light emitting display panel according to the exemplary embodiment of the present invention will be described with reference to FIGS.

Referring to FIG. 4A, first, a gate metal material is deposited on the front substrate 10 and patterned to form the gate electrode 11. Then, after depositing the gate insulating film 12 on the front surface of the front substrate 10 including the gate electrode 11, a semiconductor layer forming material and an ohmic contact layer forming material and a source / drain forming material on the gate insulating film 12 Are sequentially deposited.

Thereafter, the semiconductor layer 13 and the ohmic contact layer 14 and the source / drain electrodes 15 and 16 are patterned by simultaneously or sequentially patterning the semiconductor layer forming material and the ohmic contact layer forming material and the source / drain forming material. And a switching element made of, for example.

Next, by forming a protective layer 17 on the front surface of the front substrate 10 including the switching element and the gate insulating film 12 and patterning the contact hole 18 so that the drain electrode 16 of the switching element is exposed to a predetermined region. To form. Then, by depositing ITO, IZO, AZO or its equivalent material, i.e., the first electrode 19, on the front substrate 10 by a deposition method such as PPECVD (Plasma Enhanced Chemical Vapor Deposion) or sputtering, and patterning the same The first electrode 19 is formed. Here, the first electrode 19 is in electrical contact with the drain electrode 16 of the switching element through the contact hole 18.

Silicon oxide (SiOx), silicon nitride (SiNx), photo acrylic, etc., by methods such as PECVD, spin coating, and spinless coating on the front surface of the front substrate 10 on which the first electrode 19 is formed. (photo acryl), benzocyclobutene (BCB), and deposited an insulating material. By patterning this, the pixel defining layer 23 is formed to correspond to the non-emission region where the switching element is formed, and the insulating pattern 28 is formed together.

Thereafter, the organic emission layer 21 is formed on the entire surface of the first electrode 19 of the emission region where the first electrode 19 is formed by using a printing method, a shadow mask method, or a laser induced thermal imaging method. . That is, although not shown in detail in the drawings, the organic light emitting layer 21 is formed by a hole injection layer (HIL), a hole transport layer (HTL), a light emitting layer (OEL), an electron injection layer (EIL), and an electron transport layer (such as a shadow mask method or a thermal transfer method). ETL).

At least one of aluminum (Al), aluminum alloy (AlNd), copper (Cu), and copper alloy having a relatively small work function value by performing a PECVD or sputtering process on the front surface of the front substrate 10 on which the organic light emitting layer 21 is formed. A second electrode 22 having a structure in which silver / calcium (Ag / Ca) or the like is stacked on a metal material is formed. The second electrode 22 is formed to cover the entire surface of the organic emission layer 21 including the pixel defining layer 23. In this way, after all of the pixel areas are disposed and formed on the front substrate 10, the back cap EC is bonded to heat all the pixel areas.

At least one polarizing member, such as the polarizing plate 24 and the FPR 25, is simultaneously or sequentially attached to the front surface of the front substrate 10 to which the rear cap EC is bonded, and the attached FPR 25 and the polarizing plate 24 ), The polarizing member is similar to the area of the front substrate 10, or the front substrate 10 is laser cut wider than the area of the front substrate 10 so as not to be damaged by laser cutting.

As shown in FIG. 4B, after cutting of the FPR 25 and the polarizing plate 24, the light emitting display panel 1 is placed upside down, and then at least one side of the outer periphery of the rear surface of the light emitting display panel 1 is placed upside down. A black epoxy resin 28a is applied to each outer portion. At this time, the black epoxy resin 28a is applied along the outer periphery of the rear surface of the light-emitting display panel 1 from the top of the light-emitting display panel 1 disposed upside down.

As shown in FIG. 4C, the black epoxy resin 28a has a side formed vertically with respect to a rear outer portion of the light emitting display panel 1, that is, the front front substrate 10 forming the light emitting display panel 1 It is coated to cover both the edge side and side. In addition, although not shown in the drawings, the black epoxy resin 28a is made of a polarizing plate 24 or an FPR 25 including the edge surfaces and side surfaces of the front front substrate 10 constituting the light emitting display panel 1. It is also coated to cover all sides of the polarizing member. The black epoxy resin thus formed is quickly bonded and cured to function as a coating cover 28 for protecting the outer surface of the light-emitting display panel 1 and the side and edge surfaces of the front substrate 10 in a certain form.

When the black epoxy resin 28a is applied to the back surface of the light emitting display panel 1, the polarizing member can be cut larger than the light emitting display panel 1, and when the polarizing member is cut, the front substrate 10 cracks. The production process yield can be improved by preventing occurrence and damage.

5A to 5C are cross-sectional views illustrating another process for manufacturing the light emitting display panel shown in FIGS. 1 and 3.

Referring to FIGS. 5A to 5C, another method of manufacturing the light emitting display panel according to the present invention will be described.

Referring to FIG. 5A, after all of the pixel areas are disposed and formed on the front substrate 10, a back cap EC is bonded to heat all of the pixel areas. Then, at least one polarizing member such as the polarizing plate 24 and the FPR 25 is simultaneously or sequentially attached to the front surface of the front substrate 10 to which the rear cap EC is bonded.

After the FPR (25) and the polarizing plate (24) are attached, the light emitting display panel (1) is placed upside down, and then a black epoxy resin is applied to each of the outer parts of at least one side of the rear surface of the light emitting display panel (1). (28a) is applied. At this time, the black epoxy resin 28a is applied along the outer periphery of the rear surface of the light-emitting display panel 1 from the top of the light-emitting display panel 1 disposed upside down.

As shown in FIG. 5B, after the black epoxy resin 28a is applied and cured, the FPR is such that the area of the polarizing member such as the FPR 25 and the polarizing plate 24 becomes equal to the area of the front substrate 10 as much as possible. 25 and the polarizing plate 24 are cut. Here, a part of the cured black epoxy resin 28a may be cut together with the FPR 25 and the polarizing plate 24. At this time, it is preferable that the front substrate 10 on which the image is displayed is laser cut wider than the area of the front substrate 10 so as not to be damaged by laser cutting.

As shown in FIG. 5C, the black epoxy resin 28a has its side formed perpendicularly to the outer periphery of the rear surface of the light emitting display panel 1, that is, the front front substrate 10 forming the light emitting display panel 1 It is preferably cut to keep both edge faces and sides covered. The black epoxy resin 28a is quickly bonded and cured to function as a coating cover 28 to protect the outer surface of the light emitting display panel 1 and the side and edge surfaces of the front substrate 10 in a certain form.

As described above, the organic light emitting diode display device and the manufacturing method according to an embodiment of the present invention, by allowing the black epoxy resin (28a) to be applied to the back surface of the light emitting display panel (1), the light emitting display of the polarizing member It is possible to cut larger than the panel 1, and it is possible to improve the manufacturing process yield by preventing cracking and breakage of the front substrate 10 when cutting the polarizing member.

In addition, when the coating cover 28 of the light emitting display panel 1 is formed, it is improved to cover both the cutting surface and the edge surface from the rear surface of the light emitting display panel 1, thereby improving the Side light leakage can be blocked.

In the detailed description of the present invention described above, the present invention has been described with reference to preferred embodiments of the present invention, but those skilled in the art or those skilled in the art will appreciate the present invention as set forth in the claims below. It is apparent that various modifications and changes can be made to the present invention without departing from the spirit and technology.

1: light emitting display panel 2: gate integrated circuit
3: data integrated circuit 4: data circuit film
5: data circuit board 10: front board
11: Gate electrode 15: Source electrode
16: drain electrode 21: organic light emitting layer
28: coated cover EC: back cap

Claims (14)

A light emitting display panel in which a plurality of pixel areas are formed to display an image; And
It is provided with a coating cover for covering a portion of the outer peripheral portion of the light-emitting display panel and a portion or all of the side surface of the light-emitting display panel by covering and adhering to the outer portion of the light-emitting display panel and a portion or side of the entire surface,
The coating cover is configured by curing a black or colored epoxy resin applied to each of the outer portions of at least one side of the outer portion of the rear surface of the light emitting display panel that is disposed upside down,
The black or colored epoxy resin is an organic light emitting diode display device, characterized in that applied and cured to cover a part of the back surface and the edge surface and side of the front substrate provided on the light emitting display panel. According to claim 1,
The coating cover
It is characterized in that it is applied and coated on the outer portion of at least one side of the outer portion of the rear surface of the light emitting display panel formed in a quadrangular shape, while being coated to cover a part or all of the side surfaces formed perpendicularly to the outer portion of the at least one side. Organic LED display. delete According to claim 2,
At least one polarizing member of a polarizing plate and a FPR (Flim-type Patterned Retarder) is further provided on the front surface of the light emitting display panel,
The at least one polarizing member of the polarizing plate and the FPR is an organic light emitting diode display device, characterized in that formed by cutting the same or larger than the front substrate area of the light emitting display panel. The method of claim 4,
The coating cover
The black or colored epoxy resin applied to each of the outer portions of at least one side of the outer portion of the rear surface of the light-emitting display panel that is disposed upside down is cured,
The black or colored epoxy resin is an organic light emitting diode display, characterized in that the coated and cured to cover a part of the back and side of the front substrate and a portion of the at least one polarizing member provided on the light emitting display panel. A light emitting display panel manufacturing step of displaying an image; And
A coating cover covering a portion of the rear outer portion of the light-emitting display panel and a portion or the entire side of the rear-side of the light-emitting display panel by applying a black or colored epoxy resin to a portion or all of the side surface of the light-emitting display panel. And forming a
The black or colored epoxy resin is a method of manufacturing an organic light emitting diode display device, characterized in that it maintains a state that covers both the outer surface and the edge surface of the rear side of the front substrate provided on the light emitting display panel. The method of claim 6,
The coating cover forming step
Disposing and attaching at least one polarizing member of a polarizing plate and a FPR (Flim-type Patterned Retarder) on the front surface of the light emitting display panel,
Cutting at least one polarizing member of the FPR and the polarizing plate such that an area of at least one polarizing member of the FPR and the polarizing plate is maintained equal to or larger than an area of the front substrate provided on the light emitting display panel, and
A method of manufacturing an organic light emitting diode display device comprising the step of applying the black or colored epoxy resin to each of the outer portions of at least one side of the outer portion of the rear surface of the light emitting display panel where the at least one polarizing member is cut. The method of claim 7,
At least one polarizing member of the polarizing plate and the FPR
A method of manufacturing an organic light emitting diode display, characterized in that it is cut wider than the front substrate area of the light emitting display panel. The method of claim 7,
The step of applying the black or colored epoxy resin is
The black or colored epoxy resin is coated and coated so as to cover a part of the side surface or the entire surface formed vertically with the outer portion of at least one side of the outer surface portion of the rear surface of the light emitting display panel formed in a quadrilateral shape. A method of manufacturing an organic light emitting diode display, characterized in that. The method of claim 7,
The step of applying the black or colored epoxy resin is
The outer portion of at least one side of the outer portion of the rear surface of the front substrate on which the black or colored epoxy resin is provided on the light-emitting display panel, and a part or the entire side of the side surface formed perpendicular to the outer portion of the at least one side, and Method of manufacturing an organic light emitting diode display, characterized in that the coating and coating to cover a portion of the back and side of the at least one polarizing member. The method of claim 6,
The coating cover forming step
Disposing and attaching at least one polarizing member of the polarizing plate and the FPR to the front of the light emitting display panel,
Applying the black or colored epoxy resin to each of the outer portions of at least one side of the outer portion of the rear surface of the light-emitting display panel that is disposed upside down;
After the black or colored epoxy resin is cured, at least one polarizing member of the FPR and the polarizing plate is maintained such that the area of at least one polarizing member of the FPR and the polarizing plate is equal to or larger than the area of the front substrate provided on the light emitting display panel. Method of manufacturing an organic light emitting diode display, comprising the step of cutting. The method of claim 11,
The step of applying the black or colored epoxy resin is
The outer portion of at least one side of the outer portion of the rear surface of the front substrate on which the black or colored epoxy resin is provided on the light-emitting display panel, and a part or the entire side of the side surface formed perpendicular to the outer portion of the at least one side, and Method of manufacturing an organic light emitting diode display, characterized in that the coating and coating to cover a portion of the back and side of the at least one polarizing member. The method of claim 12,
Cutting the at least one polarizing member of the FPR and the polarizing plate is
A method of manufacturing an organic light emitting diode display, characterized in that a part of the black or colored epoxy resin is cut together with a part of at least one polarizing member among the FPR and the polarizing plate. delete

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