KR102033795B1

KR102033795B1 - Sheet adhesion apparatus and sheet adhesion method

Info

Publication number: KR102033795B1
Application number: KR1020130078825A
Authority: KR
Inventors: 가즈히사 야마구치; 히데아키 가토
Original assignee: 린텍 가부시키가이샤
Priority date: 2012-07-06
Filing date: 2013-07-05
Publication date: 2019-10-17
Also published as: KR20140005821A; TW201407697A; TWI623985B; JP6007008B2; CN103531504A; CN103531504B; JP2014017307A

Abstract

The sheet attaching apparatus 1 includes a frame accommodating means 3 capable of accommodating a plurality of ring frames RF integrated with the wafer WF via the adhesive sheet AS, and among the ring frames RF and the wafer WF. Support means 7 for supporting at least the ring frame RF, movable mounting means 8 for taking out the ring frame RF from the frame accommodating means 3 and moving the mounted frame to the support means 7, and the support means. Attachment means 9 for contacting and attaching the adhesive sheet AS to the ring frame RF or the ring frame RF and the wafer WF supported by (7), and the frame accommodating means 3 includes: It is comprised so that a ring frame RF can be accommodated vertically.

Description

Sheet attaching device and sheet attaching method {SHEET ADHESION APPARATUS AND SHEET ADHESION METHOD}

The present invention relates to a sheet attaching apparatus and a sheet attaching method.

DESCRIPTION OF RELATED ART Conventionally, the mounting apparatus which adheres an adhesive tape to a ring frame and adheres a semiconductor wafer (henceforth a "wafer") to the ring frame with this adhesive tape is known (for example, literature 1: Japan) See Patent Application Publication No. 2005-33119.

The mounting apparatus of this document 1 includes a ring frame supply unit for horizontally stacking the surfaces of the ring frames in the horizontal plane direction, and the ring frame conveying mechanism is arranged one by one from the upper side of the ring frames stored horizontally. It is comprised so that adsorption hold | maintains and conveys to the position which affixes an adhesive tape.

However, in the configuration as described in Document 1, since the ring frame supply unit is configured to horizontally stack the ring frames, there is a problem that the operator must support the ring frame with both hands and supply the ring frame supply unit. In particular, in the case of a large ring frame, it is very difficult to put the ring frame in a horizontal stacking position with respect to gravity, and even if a plurality of ring frames are supplied at a time in order not to lower the operation rate of the apparatus, If the work is not supported by both hands, horizontal stacking cannot be accommodated.

An object of the present invention is to provide a sheet attaching apparatus and a sheet attaching method which can easily supply a frame member.

In order to achieve the above object, the apparatus for attaching a sheet of the present invention includes a frame accommodating means capable of accommodating a plurality of frame members integrated with an adherend through an adhesive sheet, and a support for supporting at least the frame member among the frame member and the adherend. Means for removing the frame member from the frame accommodating means and moving the mounting means to the support means, and attaching the adhesive sheet to the frame member or frame member and the adherend supported by the support means. The attachment means is provided, and the said frame accommodating means employ | adopts the structure which is comprised so that it can be accommodated with the said frame member as a vertical arrangement.

At this time, it is preferable that the said frame accommodating means is equipped with the press means which presses the said frame member to one direction in the sheet | seat attachment apparatus of this invention.

Moreover, in the sheet sticking apparatus of this invention, it is preferable that the said frame accommodating means is equipped with the attitude | position holding means which moves the lower part of the said frame member to one direction.

Moreover, in the sheet sticking apparatus of this invention, it is preferable that the said frame accommodating means is equipped with the pushing means which prevents the said frame member from taking out several sheets simultaneously by the said moving mounting means.

On the other hand, in the sheet attachment method of the present invention, the frame member is housed in a plurality of vertically arranged frame members integrated with an adherend through an adhesive sheet, and the frame member is supported by support means for supporting at least the frame member of the frame member and the adherend. Is mounted, and the structure which adjoins and attaches the said adhesive sheet to the frame member or frame member and the to-be-adhered body supported by the said support means is employ | adopted.

According to the present invention as described above, the frame accommodating means is configured to be accommodated with the frame member in the vertical arrangement, so that the operator can easily supply the frame member to the accommodating means. In particular, when the frame member has an opening like a ring frame, the operator can insert the palm or finger into the opening to suspend the ring frame, so that even if it is a large ring frame, even if it is a large ring frame, it does not face gravity It becomes possible to make a lamination | stacking attitude, and it becomes possible to supply a plurality of ring frames to a accommodating means with one hand at a time.

The term "vertical arrangement" as used herein refers to a state in which the frame member is loaded in a direction along the direction in which the frame member is attracted to gravity when the frame member is held at a position away from the center of gravity.

At this time, when the pressing means is adopted for the frame accommodating means, the movable mounting means can always carry and mount the frame member at the same position.

In addition, when the attitude | position holding means is employ | adopted as the frame accommodating means, the movement mounting means can always hold | maintain and mount the frame member of the same attitude | position.

In addition, when the pressing means is adopted as the frame accommodating means, when the movable mounting means takes out the frame member, the adjacent frame members can also be taken out at the same time and prevented from being scattered.

BRIEF DESCRIPTION OF THE DRAWINGS The top view of the sheet sticking apparatus which concerns on one Embodiment of this invention.
2A is a sectional view of the frame receiving means.
2B is an operation explanatory diagram of the mobile mounting means.
2C is an operation explanatory diagram of the mobile mounting means.
Figure 3 is a BB arrow of Figure 2b.

EMBODIMENT OF THE INVENTION Hereinafter, one Embodiment of this invention is described based on drawing.

In addition, X axis | shaft, Y axis | shaft, and Z axis | shaft in this embodiment have a relationship orthogonal to each other, X axis | shaft and Y axis | shaft make an axis in a horizontal plane, and Z axis makes an axis orthogonal to a horizontal plane. In addition, in this embodiment, when a direction is shown based on the case seen from the arrow AR direction parallel to a Y axis, "upper" is an arrow direction of a Z axis, "lower" is the opposite direction, and "left" is X It is an arrow direction of an axis | shaft, "right" is the reverse direction, "before" is an arrow direction of the Y axis, and "after" is the reverse direction.

In FIG. 1, the sheet attachment apparatus 1 is a ring as a frame member integrated with the wafer WF via the wafer accommodating means 2 which can accommodate a plurality of wafers WF as an adherend, and the adhesive sheet AS. A frame accommodating means 3 capable of accommodating a plurality of frames RF, a support means 7 for supporting at least a ring frame RF among the ring frame RF and the wafer WF, a wafer accommodating means 2, and The mobile mounting means 8 which takes out the wafer WF and the ring frame RF from the frame accommodating means 3, and mounts it on the support means 7, and the ring frame RF supported by the support means 7; Or it is provided with the attachment means 9 which contacts and adheres the adhesive sheet AS to the ring frame RF and the wafer WF, and is supported by the frame 10. As shown in FIG.

Here, on the outer circumferential surface of the ring frame RF, four curved portions RF2 and four curved portions RF1 disposed respectively between the four flat portions RF1 and the adjacent flat portions RF1 at 90 ° intervals. The V notches RF3 disposed in two adjacent curved portions RF2 of the curved portions RF2 are provided, and the opening portion RF4 is formed inside.

The wafer accommodating means 2 consists of the wafer cassette 21 which can accommodate the horizontal stacking of the wafer WF having the protective sheet PS (refer to the drawing indicated by reference sign AA in FIG. 1) on the surface in the vertical direction. And detachably supported with respect to the frame 10.

As shown in FIG. 2A, the frame accommodating means 3 is configured to be accommodated with the ring frame RF as a vertical arrangement, and includes a housing case 30 that accommodates the ring frame RF, and the accommodation. Pressing means 40 for pressing the ring frame RF accommodated in the case 30 in one direction (right), and posture maintaining means 50 for moving the lower portion of the ring frame RF in one direction (right). Equipped.

The storage case 30 is installed upright from the rectangular box-shaped bottom part 31 extending in the left-right direction, and from both ends of the front and rear of the bottom part 31, and the planar part which opposes the ring frame RF ( A pair of side parts 32 and a bottom face, which are larger than the dimensions between the RF1 and smaller than the dimensions between the opposing curved portions RF2 and support the outer edge of the ring frame RF, The left side surface part 33 which stands up from the left edge of the edge part 31, and the right side surface part 34 which stands up from the right edge of the bottom part 31, and the recessed part 34A was formed in the center, and the right side surface part A gap between at least one and less than two sheets of the ring frame RF is formed between the 34 and the plurality of ring frames RF to be taken out (drawn) at the same time by the movable mounting means 8. The pressing means 38 is provided. The handle part 35 is provided in the side part 32 located in front, and the movement mounting which approached the movement mounting means 8 which shows the housing case 30 by the solid line in FIG. 1 by operating this handle 35 is shown. Between the position and the supply position spaced apart from the moving mounting means 8 shown by the dashed-dotted line in FIG. 1, it is provided so that extraction is possible in the front-back direction via the rail which is not shown in figure. In addition, the handle 35 may be provided on the left side surface portion 33, and may be configured to be pulled out in the left and right directions through a rail (not shown) between the supply positions shown by the dashed-dotted lines in FIG. It is good also as a structure which can be taken out in the front-back direction and the left-right direction.

The pressurizing means 40 is each linear motor 41 through the linear motor 41 as a pair of drive apparatus provided in the inside of the bottom part 31, and the opening 36 formed in the upper surface of the bottom part 31. The pressure plate 43 provided so that the slider 42 of () may be connected is provided.

The posture maintaining means 50 is provided inside the bottom part 31, and is supported by a pair of frames 55 and is rotatably provided by a rotation motor 51 as a drive device. , The driven pulley 53 rotatably supported by the frame 55, the drive pulley 52 and the driven pulley 53 are wound, and the upper surface is the upper surface of the bottom surface portion 31 through the opening 36. Furthermore, it is provided with the endless belt 54 provided so that it may be located slightly upward.

The support means 7 includes a table 72 having a support surface 71 capable of adsorbing and holding the wafer WF and the ring frame RF by suction means such as a pressure reducing pump or a vacuum ejector (not shown). The linear motor 73 as a drive device which supports the 72 with the slider 74 is provided.

The movement mounting means 8 is equipped with the articulated robot 81 as a drive apparatus, and the holding means 82 provided in the front-end | tip part of this articulated robot 81. As shown in FIG. The articulated robot (81) is a so-called six-axis robot having joints rotatable in six places, and the wafer (WF) and the ring held by the holding means (82) within the working range of the articulated robot (81). The frame RF is configured to be movable at any position and at any angle. The holding means 82 has a plurality of suction holes 83 formed therebetween, and a frame suction part 84 provided at two right and left positions, and a plurality of suction holes 85 are formed between the frame suction parts 84. And a holding means 88 which is provided with a wafer adsorption portion 86 and a height below the thickness of the ring frame RF and protrudes from the holding surface 87 of the holding means 82 or is not protruding. have. The frame adsorption part 84 and the wafer adsorption part 86 are connected to the articulated robot 81, respectively, and are connected to suction means, such as a pressure reduction pump and a vacuum ejector, which are not shown, respectively, and the wafer WF or ring frame ( RF) can be adsorbed and held.

On the left side of the movable mounting means 8, the outer edge position of the wafer WF, the orientation marks such as V notches and orientation flats (not shown) formed on the wafer WF, the circuit pattern, the street, or the ring frame RF The detection means 89 which consists of an optical sensor, an imaging device, etc. which can detect an outer edge, an inner edge position, and V notch RF3 etc. which are provided in the outer periphery of the ring frame RF is provided.

As shown in the figure from the AR direction shown by the code | symbol AA in FIG. 1, the attachment means 9 is the disk RS which the adhesive sheet AS temporarily attached to one surface of the strip | belt-shaped peeling sheet RL. ), The support shaft 91 which supports), the peeling plate 92 which turns over the peeling sheet RL, and peels the adhesive sheet AS, and peels and the adhesive sheet AS comes into contact with the wafer WF, and is attached. A press roller 93 serving as a pressing means, a drive roller 95 which is driven to rotate by the rotary motor 94 as a driving device, and a pinch roller 96 which sandwiches the release sheet RL into the drive roller 95. And a recovery roller 97 for recovering the release sheet RL.

In addition, in the case of this embodiment, the peeling means 12 which peels the protective sheet PS adhering to the wafer WF and the unnecessary member accommodating box which are not shown in figure for collect | recovering the peeled protective sheet PS are provided together Although these are not essential requirements of this invention, detailed description is abbreviate | omitted. In addition, as the peeling means 12, what was described in the peeling apparatus prior art documents, such as Japanese Patent Application No. 2008-285288 and Japanese Patent Application No. 2011-55508, can be illustrated, for example, As an unnecessary member accommodating box, It will not be limited at all as long as it can receive and collect | recover the protective sheet PS.

In the above sheet attachment apparatus 1, the procedure of attaching the adhesive sheet AS to the wafer WF and the ring frame RF is demonstrated.

First, as shown in the drawing shown by the code | symbol AA in FIG. 1, the disk RS is set to the attachment means 9, and the wafer cassette 21 is set to the position shown in FIG. Then, when the handle 35 is gripped and the housing case 30 is taken out from the moving mounting position to the supply position indicated by the two-dot chain line or the one-dot chain line in FIG. 1, the pressurizing means 40 drives the linear motor 41. As shown by the dashed-dotted line in FIG. 2A, the pressure plate 43 is moved to the left end part. The operator then supplies any number of ring frames RF vertically into the housing case 30. At this time, the operator can supply the ring frame RF into the housing case 30 while the user puts his or her finger in the opening RF4 of the ring frame RF, thereby providing the ring frame RF. A plurality of sheets can be simultaneously supplied into the housing case 30 with one hand. And when an operator presses the supply completion switch which is not shown in figure, the attitude | position holding means 50 drives the rotating motor 51, and the endless belt 54 is rotationally driven clockwise in FIG. 2A, FIG. 2B, FIG. 2C. At the same time, the pressurizing means 40 drives the linear motor 41, and moves the press plate 43 to the right direction as shown by the solid line in FIG. 2A. Thereby, the ring frame RF accommodated in the housing case 30 is moved to the right direction as a whole, and the ring frame RF located in the right end part and the right side surface part 34 are in intimate state, and the said ring frame ( RF) posture is maintained. Thereafter, the operator moves the housing case 30 to the movement mounting position.

Then, the mobile mounting means 8 drives the articulated robot 81, the holding means 82 is inserted into the wafer cassette 21 to bring the wafer adsorption portion 86 into contact with the wafer WF. The suction means (not shown) is driven to adsorb and hold the wafer WF to move the wafer WF to a position that can be detected by the detection means 89. Next, the detection means 89 detects the outer edge position of the wafer WF and the V notch position (not shown), and these various data are output to the control means (not shown). When various data of the wafer WF are input to the control means (not shown), the center position of the wafer WF is calculated, and the movement mounting means 8 drives the articulated robot 81, and the wafer WF It loads on the support surface 71 of the table 72 waiting in the position shown by the dashed-dotted line in FIG. 1 so that a center position and a V notch position which are not shown in figure may become a predetermined position. When the wafer WF is loaded, the support means 7 drives the suction means (not shown) to adsorb and hold the wafer WF.

In addition, the movement mounting means 8 drives the articulated robot 81, and as shown in Figs. 2B and 3, the holding means 82 is inserted into the recessed portion 34A of the right side surface portion 34. After contacting the frame adsorption portion 84 to the right side of the ring frame RF located at the right end of the housing case 30, the suction means (not shown) is driven to drive the ring frame (at the right end) Adsorption of RF) is maintained. Next, the mobile mounting means 8 drives the articulated robot 81, and pulls the ring frame RF positioned at the right end upward. At this time, since the ring frame RF positioned at the right end portion is pressed by the pressing means 40 and the posture holding means 50 to the right side surface portion 34, only the suction force of the frame suction portion 84 alone can be drawn out. Although there is no case, such a problem does not occur because the locking means 88 is caught by the opening RF4 of the ring frame RF. In addition, when drawing the ring frame RF located at the right end, the ring frame RF adjacent to the left side of the ring frame RF located at the right end may also be simultaneously drawn and scattered. By means of the means 38, no such problem arises. Also, as shown in FIG. 2C, even when the ring frame RF positioned at the right end is not in close contact with the right side surface portion 34 even by the rotational driving of the endless belt 54, the frame adsorption portion ( It is possible to detect that the pressure due to suction at 84 does not fall, and the holding means 82 can be rotated clockwise as shown in Fig. 2C. When the ring frame RF located at the right end is drawn out from the housing case 30, the ring frame RF adjacent to the left side of the ring frame RF located at the right end is connected to the pressing means 40. It is pressed to the right side surface part 34 by the attitude | position holding means 50. FIG.

Thereafter, the movement mounting means 8 drives the articulated robot 81, moves the ring frame RF to a position that can be detected by the detection means 89, and the detection means 89 detects the wafer described above. The same operation as in the case of (WF) is performed, and after that, the center position of the opening portion RF4 of the ring frame RF coincides with the center position of the wafer WF supported on the table 72, and also The ring frame RF is mounted on the support surface 71 of the table 72 with the V notch RF3 of the ring frame RF facing a predetermined direction. When the ring frame RF is loaded, the support means 7 drives the suction means (not shown) to suck and hold the ring frame RF.

Next, the support means 7 drives the linear motor 73, moves the table 72 to the left direction, and detects that the wafer WF and the ring frame RF have reached a predetermined position, not shown. When detected by the means, in synchronization with the movement of the table 72, the attachment means 9 drives the rotary motor 94 to feed out the master RS. Thereby, the adhesive sheet AS is peeled off from the peeling plate 92, and the peeled adhesive sheet AS is pressed against the wafer WF and the ring frame RF by the press roller 93, and is attached, and FIG. As shown by the solid line in single, the wafer support WK is formed. In this way, when the wafer support body WK is formed, it will be detected by the detection means not shown, and the support means 7 will stop the linear motor 73. FIG. Then, the mobile mounting means 8 drives the articulated robot 81, lifts up and down the wafer support WK, and transfers it to an unshown delivery means having an adsorption support surface that faces the support surface 71. Then, the transfer means lowers the wafer support WK and loads it on the support surface 71 again. Thereby, the wafer support body WK is supported by the support surface 71 in the state which turned protective sheet PS upward. Subsequently, the peeling means 12 attaches the peeling tape which is not shown to the protective sheet PS, pulls out the peeling tape, and peels the protective sheet PS from the wafer WF (in detail, peeling apparatus) See prior art). When the protective sheet PS is peeled off from the wafer WF, the mobile mounting means 8 drives the articulated robot 81, and the wafer adsorption portion 86 is brought into contact with the peeled protective sheet PS, not shown. The suction means which has not been driven is driven, and the protective sheet PS is adsorbed and held and discarded in an unnecessary member storage box (not shown). And the protective sheet PS is peeled off, and the wafer support body WK is conveyed to another process by the conveyance means which is not shown in figure, and the table 72 is returned to the position shown by the dashed-dotted line in FIG. The same operation as described above is repeated.

According to the above embodiment, the operator can easily supply the ring frame RF to the housing case 30, and even if it is a large ring frame RF, for example, even if it is a large ring frame RF, it is a vertical stacking attitude. In addition, it becomes possible to supply a plurality of ring frames to the accommodating means with one hand at a time.

As mentioned above, although the best structure, method, etc. for implementing this invention are disclosed by the said description, this invention is not limited to this. That is, the present invention is mainly shown and described in particular with respect to specific embodiments, but the embodiments, embodiments, shapes, materials, quantities, and the like of the embodiments described above without departing from the technical spirit and desired range of the present invention. In other detailed configurations, those skilled in the art can make various modifications. In addition, the description which limited the shape, material, etc. which were disclosed above was described as illustration in order to make understanding of this invention easy, and since it does not limit this invention, it is a part of limitation of these shapes, materials, etc., or The description in the name of a member except all limitations is included in this invention.

For example, in the said embodiment, the ring frame RF is illustrated as a frame member, and it accommodates in the accommodation case 30 in the state suspended by putting a hand or a finger into the opening RF4 of the said ring frame RF. Although the case has been described, even in a frame member without an opening, when the position deviated from the center of gravity of the frame member is set in a direction along the direction in which the frame member is attracted to gravity (in a direction not against gravity) The structure which can supply the said frame member to a accommodating means is enough.

In addition, only the ring frame RF may be mounted on the table 72, and the adhesive sheet AS may be attached to the ring frame RF.

Further, the pressing plate 43 is configured to be driven by an endless belt similar to the endless belt 54 of the posture maintaining means 50, or is configured to be pulled by an elastic member such as a spring so that the ring frame RF is made. You may make it pressurize.

In addition, as shown by the dashed-dotted line in FIG. 1, the holding part 61 which has the frame adsorption part 60 which can adsorb and hold | maintain the ring frame RF located in the right end of the storage case 30, and the holding part The V notch detecting means 62 capable of detecting the V notch RF3 of the ring frame RF held by the 61 and the holding part 61 are movable to the left and right, and the ring frame RF is provided. Transmission means 6 having a rotary motor 63 as a drive device rotatable in the plane of the ring frame RF and a linear motor 64 as a drive device capable of lifting and lowering the rotary motor 63 in the vertical direction. You may install Then, the transmission means 6 drives the rotary motor 63, the holding frame 61 sucks and holds the ring frame RF positioned at the right end of the housing case 30, and drives the linear motion motor 64. Then, the ring frame RF located at the right end is drawn out. Thereafter, the transmission means 6 drives the rotary motor 63, rotates the ring frame RF by a predetermined angle, and detects the position of the V notch by the V notch detecting means 62, and then the V notch is The rotary motor 63 is stopped and positioned so as to be a predetermined position. And the movement mounting means 8 may drive the articulated robot 81, and the holding means 82 may hold | maintain the ring frame RF positioned by the transmission means 6.

In addition, the kind, material, etc. of the to-be-adhered body and adhesive sheet AS in this invention are not specifically limited, For example, adhesive sheet AS has an intermediate | middle layer between a base sheet and an adhesive bond layer, Three or more layers, such as having a cover layer on the upper surface of the base sheet, and furthermore, a so-called double-sided adhesive sheet capable of peeling off the base sheet from the adhesive layer, may be used as such a double-sided adhesive sheet. It may have, or may be a single layer or a multilayer having no intermediate layer. The adherend may be a semiconductor wafer, and the adhesive sheet AS may be a protective sheet, a dicing tape, a die attach film, or the like. At this time, a semiconductor wafer can illustrate a silicon semiconductor wafer, a compound semiconductor wafer, etc., The adhesive sheet AS adhering to such a semiconductor wafer is not limited to these, Arbitrary sheets, films, tapes, etc. Uses, adhesive sheets, and the like can be applied. In addition, the to-be-adhered body may be a board | substrate of an optical disk, and the adhesive sheet AS may have a resin layer which comprises a recording layer. As mentioned above, as a to-be-adhered body, not only another to-be-adhered body, such as a glass plate, a steel plate, ceramics, a wooden board, or a resin board, but a member, articles, etc. of arbitrary forms can be made into object.

As the drive device in the above embodiment, a rotary motor, a linear motor, a linear motor, a single axis robot, an electric machine such as an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, a rotary cylinder, or the like can be adopted. At the same time, it is also possible to employ a combination of them directly or indirectly (some overlap with those exemplified in the embodiment).

Claims

Frame accommodating means capable of accommodating a plurality of frame members integrated with the adherend through an adhesive sheet;
Support means for supporting at least a frame member of the frame member and the adherend;
Moving mounting means for taking out the frame member from the frame accommodating means and moving it to the supporting means;
And attachment means for contacting and attaching the adhesive sheet to the frame member or the frame member and the adherend supported by the supporting means,
The said frame accommodating means is comprised so that the said frame member can be accommodated vertically, and the attitude | position holding means which moves the lower part of the said frame member to one direction is characterized by the above-mentioned.

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