KR101997497B1 - Apparatus for testing temperature - Google Patents

Abstract

Provided is an apparatus for testing the temperature of a memory module, which comprises a cold and hot unit applying cold and hot energy to a memory module, so that the temperature control can be efficiently and quickly performed. The cold and hot unit includes a thermoelectric element generating cold and hot energy, a heat transfer block installed on one side of the thermoelectric element to cool or heat the memory module, a heat dissipation unit installed on the other side of the thermoelectric element and the heat is transferred with the thermoelectric element, and a coupling unit coupling the thermoelectric element, the heat dissipation unit, and the heat transfer block. The coupling unit includes a fixing bolt passing through a hold formed in the front surface of the heat dissipation unit and the thermoelectric element to be coupled to the heat transfer block, and fixing between the thermoelectric element, the heat dissipation unit, and the heat transfer block; and an elastic member elastically installed between the fixing bolt and the heat dissipation unit.

Description

[0001] APPARATUS FOR TESTING TEMPERATURE [0002]

Disclosed is a temperature checking apparatus for checking the temperature reliability of a memory module.

Generally, a large amount of RAM (Random Access Memory) is used as a memory for a computer, a mobile phone, and a solid state disk (SSD).

As devices become smaller and smaller, the RAM used as memory is becoming smaller and more highly integrated. A plurality of RAMs are integrated to form a single memory module.

The memory module is subjected to a temperature reliability test before shipment because various conditions are used and defects may occur due to self heat generation. As the semiconductor becomes more and more integrated, the amount of self-heating increases, and the temperature reliability test is a very important test.

Korean Patent No. 10-1396539 discloses a conventional memory module temperature inspecting device developed and patent registered by the present applicant.

In recent years, the number of memory modules to be inspected at one time has been increasing due to demand for faster inspection. Accordingly, as the system becomes larger and the amount of power used increases, it is required to develop a device capable of miniaturization, low power consumption, and high speed temperature inspection.

A memory module temperature inspection device is provided that enables temperature control to be performed more efficiently and quickly.

A memory module temperature inspection apparatus is provided that can be miniaturized by reducing its size.

A memory module temperature inspection apparatus is provided that can improve the temperature lowering speed and uniformity.

A memory module temperature inspection apparatus is provided that can mitigate the thermal deformation shock caused by temperature.

The temperature inspecting apparatus of this embodiment includes a cold / warm unit for applying cold / hot energy to an object to be inspected, wherein the cold / hot unit includes a thermoelectric element for generating cold and hot energy, a heat transfer And a heat dissipation unit provided on the other surface of the thermoelectric element and performing heat transfer with the thermoelectric element.

The temperature inspection apparatus of this embodiment includes a work module installed on a base frame and having at least one inspection object disposed on a surface thereof, at least one cold temperature unit And a moving unit for moving the cold / hot module relative to the work module to couple or separate the cold / hot module to or from the work module.

And a horizontal moving part installed on the base frame for moving the work module to the cold / hot module position.

The moving unit may include a supporting member provided on the base frame, and a vertical driving unit installed on the supporting member and connected to the cooling module to move the cooling module vertically.

The moving unit may further include at least one guide bar installed on the cold / hot module and extending upward, and a guide holder formed on the support member and inserted and guided by the guide bar.

The horizontal moving part may include a moving truck installed with the operation module and moved along a rail extending horizontally along the base frame, and a horizontal driving part for moving the moving truck.

The cold / hot module includes a support plate on which at least one or more cooling / heating units are detachably mounted, a connection unit that is installed on the support plate and is detachably coupled to and electrically connected to each of the cooling / heating units, And a side cover surrounding the space between the object and the inspection object.

And a supply pipe extending to the inside of the side cover and having a hole for spraying clean air between the cold / warm unit and the inspection object.

The cooling / heating unit further includes a coupling unit for coupling the thermoelectric element, the heat dissipation unit, and the heat transfer block. The coupling unit is coupled to the heat transfer unit through the coupling hole formed in the heat dissipation unit and the front surface of the thermoelectric module, A fixing bolt for fixing the heat transfer block between the fixing bolt and the heat transmission block, and an elastic member elastically installed between the fixing bolt and the heat radiation portion.

The heat dissipation unit may include a water cooling block in which cooling water is circulated.

The water-cooled block may include a stopper protruding from at least one end of the surface on which the thermoelectric element is in contact and regulating the position of the thermoelectric element on the side of the thermoelectric element.

The temperature inspection apparatus may further include a connection bolt fastened between the heat dissipation unit and the support plate, and an elastic spring fitted to the connection bolt and elastically installed between the support plate and the heat dissipation unit.

And at least one guide pin formed on the support plate and a guide hole formed in the heat dissipation unit and into which the guide pin is inserted.

The heat transfer block may include a stopper protruding from at least one end of the surface on which the thermoelectric element is in contact and regulating the position of the thermoelectric element on the side of the thermoelectric element.

The heat transfer block includes a plate portion in contact with the thermoelectric element, and an end portion protruding outward from the plate portion and in contact with the inspection object, and the plate portion may have a quadrangular pyramid shape.

The heat transfer block includes a plate portion in contact with the thermoelectric element, and an end protruding outward from the plate portion and in contact with the inspection object, and the plate portion may have a hemispherical shape.

The heat transfer block may include a suction hole formed on an inspection surface, a vacuum line extending inward through a side surface of the heat transfer block and connected to the suction hole, and applying a vacuum suction force to the inspection surface.

The cooling / heating unit may further include a temperature sensor installed in the heat transfer block and detecting a temperature applied to the memory module.

Wherein the thermoelectric element includes a plurality of semiconductors arranged at intervals, a semiconductor unit arranged in a pattern set at an upper end and a lower end of the semiconductor and including an upper electrode and a lower electrode electrically connected to the semiconductor, And a sealing member sealing the inside between the first heat transfer plate and the second heat transfer plate and sealing the inside between the first heat transfer plate and the second heat transfer plate, And an intermediate heat transfer plate is provided between the semiconductor units.

The semiconductor units may have the same number of semiconductors.

Each of the semiconductor units may have the same semiconductor arrangement position.

The size of the semiconductor of each semiconductor unit gradually decreases from the first heat transfer plate to the second heat transfer plate.

The semiconductor of each of the semiconductor units may have a structure in which the height gradually decreases from the first heat transfer plate to the second heat transfer plate.

The thermoelectric element may have at least one fastening hole formed between the first heat transfer plate and the second heat transfer plate.

And a moisture-proof coating material is applied to the side surface of the semiconductor to form a coating layer.

The coating layer may be formed on the inner surface of the upper electrode and the lower electrode connected to the semiconductor.

The coating material constituting the coating layer may be a carbon-based organic coating or a carbon-based inorganic coating.

The sealing member may be installed between the semiconductor and the semiconductor inside the thermoelectric element.

The sealing member may be made of an epoxy material including silicon particles.

The silicon particles may be contained in an amount of 2 to 20% by weight based on the total amount of the sealing member.

The cooling / heating unit may have at least two or more thermoelectric elements, and each thermoelectric element may have a laminated structure.

Each of the thermoelectric elements may have the same size.

Each of the thermoelectric elements may have the same number of semiconductors.

Each of the thermoelectric elements may have the same arrangement position of the semiconductors provided therein.

Each of the thermoelectric elements may have a structure in which the size of the semiconductor gradually decreases from the first heat transfer plate to the second heat transfer plate.

Each of the thermoelectric elements may have a structure in which the height of each semiconductor gradually decreases from the first heat transfer plate to the second heat transfer plate.

Each of the thermoelectric elements may have at least one fastening hole formed between the first heat transfer plate and the second heat transfer plate.

The cooling / heating unit may further include an intermediate thermal block installed between the thermoelectric elements.

As described above, according to the present embodiment, the temperature can be controlled more quickly and effectively by constructing a plurality of semiconductor layers stacked in one thermoelectric element. Accordingly, the inspection time for the memory module can be shortened due to the rapid temperature drop and the productivity can be increased.

Further, the structure is simpler, the assembly is easy, and a lower temperature can be realized at low power without increasing the size of the thermoelectric element.

Further, it is possible to prevent a decrease in strength without increasing the size of the thermoelectric element. Thus, the stiffness of the thermoelectric element can be enhanced, and the thermoelectric element can be pressed and adhered tightly with a larger pressure, thereby maximizing the heat transfer efficiency.

Further, since the structural rigidity of the thermoelectric element can be ensured and the thermoelectric element can be passed through the thermoelectric element, the device can be further downsized.

The temperature uniformity can be maintained even when the inspection object body generates heat.

It is possible to mitigate the thermal deformation impact depending on the temperature.

It is possible to easily detach the cold / warm unit individually, and to simply disassemble the thermoelectric element when the thermoelectric element of the cold / warm unit is defective.

1 is a perspective view showing a temperature inspection apparatus according to the present embodiment.
2 is a schematic side view of a temperature inspection apparatus according to the present embodiment.
3 is a perspective view showing the cold / warm module of the temperature inspection apparatus according to the present embodiment.
4 is a schematic view showing a cold / warm unit provided in the cold / hot module of the temperature inspection apparatus according to the present embodiment.
5 is a schematic cross-sectional view of the cold / warm unit according to the present embodiment.
6 and 7 are schematic cross-sectional views illustrating a heat transfer block of a cold / warm unit according to the present embodiment.
8 is an exploded perspective view of the thermoelectric device according to the present embodiment.
9 is a partially cutaway perspective view of the thermoelectric device according to the present embodiment.
10 is a schematic cross-sectional view of a thermoelectric device according to this embodiment.
11 to 15 are schematic sectional views showing various embodiments of the cold / warm unit of the temperature inspecting apparatus.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings so that those skilled in the art can easily carry out the present invention. It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention. Wherever possible, the same or similar parts are denoted using the same reference numerals in the drawings.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the invention. The singular forms as used herein include plural forms as long as the phrases do not expressly express the opposite meaning thereto. Means that a particular feature, region, integer, step, operation, element and / or component is specified, and that other specific features, regions, integers, steps, operations, elements, components, and / And the like.

All terms including technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the art to which the present invention belongs. Predefined terms are further interpreted as having a meaning consistent with the relevant technical literature and the present disclosure, and are not to be construed as ideal or very formal meanings unless defined otherwise.

Hereinafter, the embodiment will exemplify a temperature inspection apparatus for inspecting a memory module (hereinafter referred to as a memory module) on which a mobile RAM used as a test object is mounted, such as a mobile phone. Of course, the present apparatus is not limited to the object to be inspected, and can be applied to a memory module used in various apparatuses.

Figs. 1 and 2 show the configuration of a temperature inspection apparatus according to the present embodiment.

As shown in the drawing, the inspection apparatus of the present embodiment includes a work module 2 mounted on a base frame 300 and having at least one or more memory modules M disposed on a surface thereof, A cold / hot module 1 having at least one cold / warm unit (see 100 in FIG. 3) for applying cold and hot energy to a placed inspection object, And a moving part 310 for coupling or disconnecting the work module 2 to the work module 2.

The base frame 300 may be a square lattice-shaped frame structure. The base frame 300 stably supports the work module 2 and the cold / hot module 1. The base frame 300 may further include a horizontal moving part 320 for positioning the working module 2 under the cooling / heating module 1. [

In this embodiment, the work module 2 provided with the memory module is moved in the horizontal direction, and the cold / hot module 1 equipped with the cold / warm unit is vertically moved. Therefore, the cold / hot module 1 and the work module 2 can be separated or combined with each other to perform a necessary operation easily. The arrangement and moving direction of the cold / hot module 1 and the work module 2 in the base frame 300 can be variously modified.

The horizontal moving part 320 horizontally moves the working module 2, if necessary, and selectively places it under the cooling / heating module 1.

The horizontal moving part 320 includes a moving carriage 324 which is moved along a rail 322 extending horizontally along the base frame 300 to which the working module 2 is installed and a moving carriage 324, And a horizontal driving unit 326 for moving the driving unit 326. The rail 322 extends horizontally from the outside of the cold / warm module 1 toward the lower portion of the cold / A moving carriage 324 equipped with a work module 2 is placed on the rail 322.

The horizontal driver 326 may include, for example, a linear motor extending along the rail 322. The horizontal driving unit is applicable to all of the structural surfaces capable of reciprocating the moving carriage along the rails.

When the linear motor is driven, the moving carriage moves along the rail, and the work module 2 provided on the moving carriage 324 is moved to the outside of the cold / hot module 1 or directly below the cold / hot module 1.

The cold / hot module 1 is moved according to the operation of the moving part 310 in a state where the work module 2 is moved directly below the cold / hot module 1, and is brought into close contact with the work module 2. Thus, the cold / warm unit provided in the cold / hot module 1 can apply the cold / warm energy to the memory module disposed in the work module 2, and the temperature can be inspected.

The moving unit 310 is installed on the supporting member 312 and the supporting member 312 installed on the base frame 300 and is connected to the cooling module 1 to move the cooling module 1 up and down (Not shown).

The moving unit 310 may further include at least one guide bar 318 installed in the cold / hot module 1 and extending upward to be inserted into the guide holder 316 formed in the support member 312, have. By moving the guide bar 318 along the guide holder 316, the cold / hot module 1 can be stably moved without being deviated to any one side. The guide bar 318 may be installed at four corners of the cold / Therefore, when the cold / hot module 1 is maintained in a horizontal state without staggering more stably, it can be moved up and down.

The vertical drive unit 314 may be, for example, a structure for converting the rotational force of the motor to the linear motion of the feed screw shaft 315. That is, the motor-driven gear rotates, and the feed screw shaft screwed to the female screw is moved, so that the cold / hot module 1 installed on the feed screw shaft 315 can be moved up and down.

The working module 2 can be understood as a constituent part in which the memory module M to be inspected is mounted and inspected. In the work module 2, many components connected to the memory module may be provided for checking the performance of the memory module according to the temperature. In the work module 2, the memory module is located on the upper side opposite to the cold / hot module 1, thereby forming a work space for temperature inspection. In this embodiment, the work module 2 can mount a plurality of memory modules. The memory module mounting position of the work module 2 corresponds to the cold / warm unit position of the cold /

Thus, when the cold / hot module 1 is placed on the work module 2, the cold / hot units of the cold / hot module 1 are brought into contact with the respective memory modules M of the work module 2 to apply cold and hot energy.

3, the cold / hot module 1 includes a support plate 200 to which a plurality of cooling / heating units 100 for detachably attaching cool / hot energy to the memory module M, a support plate 200, A connection unit 210 provided on the support member 200 and electrically connected to the cooling and heating unit 100 so as to be detachably and individually connected to the cooling and heating unit 100; And may include a wrapping side cover 220.

On the opposite side of the side plate 220 of the support plate, a cover 240 may be installed to cover the internal wires of the cold / hot module 1 and form an external shape. As shown in FIG. 2, the cover 240 constitutes the upper part of the cold / hot module 1 and may be connected to the conveying screw shaft 315 of the vertical driving unit described above. Further, guide bars 318 may be provided at four corners of the cover 240, respectively. The guide bar extends upwardly through the guide holder of the support member. Accordingly, when the vertical driving unit is driven, the cold / hot module 1 including the cover is vertically moved up and down while maintaining a horizontal state.

The support plate 200 is a flat plate structure and is detachably mounted with a plurality of cooling / heating units 100 arranged on the surface thereof with an interval therebetween. The size and shape of the support plate 200 can be variously modified.

A connection portion 210 for electrical connection with each cold / warm unit 100 is provided along the front end of the support plate 200. The connection part 210 may be a female or male connector structure detachably coupled to each other. For example, the connection unit 210 may be a male connector to which the female connectors 46 and 47 of the cold / warm unit 100 are coupled. A plurality of connection units 210 may be provided for each cold / warm unit provided in the support plate 200. Therefore, by separating the connectors simply by using the connecting portion 210, the electrical connection of the corresponding cold / warm unit 100 can be cut off, and the cold / hot unit can be separated from the supporting plate 200 individually.

Therefore, only the cold / warm unit requiring replacement can be easily detached from the connector easily.

A side cover 220 is installed around the support plate 200. The cooling / heating unit 100 installed on the support plate 200 is surrounded by the side cover 220 and positioned inside the side cover 220. As the cold / hot module 1 descends, the side cover is brought into close contact with the top of the work module 2. The side cover 220 contacts the upper portion of the work module 2 to cover the space between the memory module M and the cold / warm unit 100, that is, the inspection space for the memory module,

A supply pipe 230 for supplying clean dry air (CDA) is extended inside the side cover 220. The clean air is supplied to the space where the inspection is performed through the supply pipe 230 with the moisture removed air. On the surface of the supply pipe 230, a hole 232 for spraying clean air between the cold / warm unit and the memory module in accordance with the position of the cool / hot unit 100 is formed. When the clean air is supplied to the supply pipe 230, the clean air is blown through the holes 232 to be blown between the cold / warm unit and the memory module, where heat is transferred. Therefore, it is possible to prevent sexual intercourse from occurring in the examination space surrounded by the side cover 220 including the space between the cold / warm unit and the memory module by the clean air.

The lower end of the side cover 220 is in contact with the upper surface of the work module 2 on which the memory module is placed and a sealing member 222 may be installed at the lower end of the side cover for maintaining airtightness between the side cover and the work module 2. [ have. Thus, the airtightness of the lower end of the side cover is maintained, and it is possible to effectively prevent the clean air injected to the inside of the side cover from escaping to the outside.

4 and 5 show a cold / warm unit according to the present embodiment.

The cold / warm unit 100 of this embodiment can apply cold / warm energy such as cold or hot to the memory module M.

Thus, the inspection apparatus applies heat or cold heat to the memory module (M) placed in the inspection space through the cooling / heating unit (100) to perform a temperature reliability check.

The cooling / heating unit 100 includes a thermoelectric element 10 for generating cold and hot energy, a heat transfer block 40 provided on one surface of the thermoelectric element 10 to apply cooling or heating to the memory module M, And a heat dissipation unit 50 installed on the other surface of the thermoelectric element 10 and performing heat transfer with the thermoelectric element 10.

In the cold / warm unit 100, the heat transfer block 40, the thermoelectric element 10 and the heat radiating portion 50 are disposed in order on the memory module placed on the inspection table. In the following description, the vertical direction means upward and downward directions along the y-axis direction in Fig. For convenience of explanation, a structure in which the memory module (M) to be inspected is located along the y-axis direction and inspection is performed will be described as an example.

A thermoelectric module is a device that produces a temperature difference through a voltage difference by utilizing a cooling effect generated when a bipolar semiconductor is combined. When a voltage is applied to a thermoelectric device, a temperature difference occurs on both sides of the device. When the temperature is lowered by cooling a relatively high temperature surface, the temperature of the other surface is rapidly lowered due to the temperature difference.

In the cold / warm unit 100 of the present embodiment, one thermoelectric element 10 is provided between the heat radiating portion 50 and the heat transfer block 40. The thermoelectric element 10 may have a structure in which a plurality of semiconductor units 21, 22, and 23 are stacked. The thermoelectric element may be provided with a female connector 47 for electrical connection with the connection part. The structure of the thermoelectric element will be described later.

By providing the thermoelectric element 10 in which a plurality of semiconductor units are stacked in this way, the cold-heating unit 100 of the present embodiment can realize a lower temperature even at a low power and can control the temperature more quickly and effectively .

The radiator may include a water-cooling block (52) through which cooling water is circulated. The water cooling block 52 is connected to a cooling water supply portion (not shown) for circulating and supplying the cooling water. Thus, the cooling water circulates from the supply part to the inside of the water-cooling block 52, thereby dissipating heat on the other surface of the thermoelectric element 10. [ The heat dissipating unit 50 is not limited to the water cooling block 52, and a heat dissipating structure of a blowing type including a heat dissipating fin and a heat dissipating fan for supplying outside air to the heat dissipating fin can be applied, for example.

The cooling / heating unit 100 is tightly coupled with the water-cooling block 52 and the heat-transfer block 40 disposed on the upper and lower sides of the thermoelectric element 10 along the y-axis direction of FIG.

The cooling unit 100 of the present embodiment has a structure in which a fixing bolt 62 is fastened at the center to press-fix the water-cooling block 52, the thermoelectric element 10, and the heat transfer block 40. For example, a hole 56 for inserting the fixing bolt 62 is formed in the upper part of the water-cooling block 52, and a fixing bolt 62 is formed in the heat transfer block 40 at a position corresponding to the hole 56 And an internal thread hole 42 to be fastened is formed. A coupling hole 12 through which the fixing bolt 62 passes is formed at a position corresponding to the hole 56 in the thermoelectric element 10. The fixing bolt 62 is fastened and tightened to the female screw hole 42 of the heat transfer block 40 through the hole 56 and the fastening hole 12 to secure the thermoelectric element 10 to the water- So that it can be assembled by being pressed against the block 40.

As described above, since the fixing bolt 62 is attached to the central portion of the cold / warm unit 100, the size of the cold / warm unit 100 can be further reduced.

In the conventional case, the water-cooled block and the heat transfer block are fastened at a position deviated from the thermoelectric element for reasons of durability and efficiency of the thermoelectric element. Therefore, it is necessary to form the water-cooling block and the heat transfer block sufficiently larger than the thermoelectric elements. The size of the water-cooling block 52 and the heat transfer block 40 can be reduced to the size of the thermoelectric transducer 10, as the fixing bolt 62 passes through the central portion of the thermoelectric transducer 10, And the size of the entire apparatus can be further miniaturized. The specific structure and operation of the thermoelectric element 10 will be described later.

In addition, in this embodiment, the cold / warm unit may further include an elastic member 64 elastically installed between the fixing bolt and the water-cooling block 52. The elastic member 64 may be, for example, an elastic spring. 5, the elastic member 64 may be fitted to the fixing bolt 62 and be elastically installed between the bolt head of the fixing bolt and the water-cooling block.

The elastic member (64) applies an elastic force to the water cooling block (52). The water-cooled block 52, the thermoelectric element 10, and the heat transfer block 40 are pressed by the elastic member 64 and closely contacted with each other.

The elastic member 64 cushions the impact applied to the cold / warm unit by the thermal deformation of the thermoelectric element 10, and maintains the close contact state of the water-cooled block and the heat transfer block with respect to the thermoelectric element. The thermoelectric element is thermally deformed according to the temperature change and the thickness is varied. The thickness may refer to the length in the vertical direction along the y-axis in Fig. The thermoelectric element 10 of the present embodiment is formed in a multi-layered structure so as to be able to cope with a very wide temperature change, and its thickness is very large. Therefore, the larger the thickness of the thermoelectric element, the greater the amount of change in thickness due to thermal expansion and heat shrinkage. As the thickness of the thermoelectric element 10 is varied, the elastic member 64 absorbs shocks absorbed by the water-cooling block 52 and the heat-transfer block 40 to buffer the shock. For example, when the thermoelectric element is thermally expanded to increase its thickness, the water-cooled block is pushed out, and the elastic member is compressed to absorb the shock.

As described above, the elastic member 64 can stably maintain the engagement state of the cold / warm unit irrespective of the thickness change due to thermal expansion and heat shrinkage of the thermoelectric element.

In this embodiment, the water-cooling block 52 is a rectangular structure, and a plurality of holes are formed through the holes from the side to the inside to form a channel through which cooling water flows in the water-cooling block. The side wall of the water-cooled block may be provided with a stopper for blocking the hole. Thus, the cooling water passage can be formed more easily in the water-cooled block. At the center of the water-cooled block, a hole 56 into which a fixing bolt for joining the cooling / heating unit is inserted is formed.

The water-cooled block 52 is installed in the support plate 200. The water-cooled block may be fixed to the support plate 200 via a connection bolt 70. For example, the corner between the water-cooled block and the support plate 200 can be fastened and fixed by the connection bolts 70.

In this embodiment, the water-cooling block 52 can be installed on the support plate 200 so as to be able to elastically flow along the vertical direction. Therefore, the cold / warm unit 100 flows vertically and can stably contact the memory module.

The apparatus of the present embodiment may include an elastic spring 72 that is inserted between the support plate 200 and the heat dissipation unit and is resiliently mounted to the connection bolt 70 that is fastened between the water cooling block 52 and the support plate 200 have. The connection bolts 70 couple between the support plate 200 and the water-cooling block of the cold / warm unit. The connection bolts 70 may be respectively fitted into holes formed in the four corners of the water-cooled block, and may be coupled to the fastening holes formed in the support plate 200. The elastic spring 72 is fitted to the connection bolt 70 and is elastically installed between the support plate 200 and the water-cooling block 52. The heat transfer block 40 of the cold / warm unit is pressed on the memory module M by the elastic spring 72 and tightly contacted.

The cooling / heating unit 100 is installed on the support plate 200 via the elastic spring 72, so that the cooling / heating unit 100 flows up and down with respect to the support plate 200, so that shocks transmitted to the cooling / heating unit can be buffered. The elastic spring 72 absorbs the impact energy generated in the inspection process of the memory module M between the support plate 200 and the cold / warm unit 100.

Also, the cooling / heating unit 100 can be moved up and down with respect to the support plate 200 via the elastic spring 72, so that it is possible to effectively cope with the memory module M having various thicknesses. Accordingly, the cold / warm unit is vertically moved according to the actual thickness of the various memory modules, so that the heat transfer block 40 can always be closely contacted to the memory module M.

Accordingly, it is possible to prevent damage to the device or the memory module, and to stably maintain the heat transfer efficiency between the heat transfer block and the memory module.

A guide pin 74 is provided on the support plate 200 so that the cooling and heating unit 100 can be accurately moved up and down with respect to the support plate 200. A guide pin 74 is provided on the water- A guide hole 76 to be inserted can be formed.

As shown in FIG. 5, two guide holes 76 are formed on the right and left sides, respectively, around the hole 56 formed at the center of the water-cooling block 52. Two guide pins (74) are vertically installed along the vertical direction of the support plate (200) in accordance with the position of the guide holes (76).

Thus, when the water-cooling block 52 is assembled to the support plate 200, the guide pin 74 is inserted into the guide hole 76. Therefore, the cooling / heating unit 100 is guided along the guide pin 74 inserted in the guide hole 76 of the water-cooling block, and can be moved up and down exactly without being biased or tilted to one side. Therefore, the heat transfer block can be accurately brought into close contact with the memory module even in the cold / warm unit flow.

In this embodiment, the water-cooling block 52 may further include a stopper 78 protruding from at least one end of the surface on which the thermoelectric element 10 is in contact and regulating the position of the thermoelectric device on the side. The stopper 78 may be formed on both opposite ends of the water-cooling block 52. The stopper 78 is protruded to a predetermined length so that the thermoelectric element 10 can be caught.

The stopper 78 regulates the position of the thermoelectric element when the water-cooling block 52 and the thermoelectric element 10 are assembled. Thus, the thermoelectric element 10 is regulated by the stopper 78 at the contact surface of the water-cooled block 52, and can be brought into contact with the water-cooled block without being shifted outward or shifted in position.

The heat transfer block 40 is brought into close contact with the memory module M to apply heat or heat to the memory module M.

6, the heat transfer block 40 in this embodiment may include a plate portion 41 contacting the thermoelectric element 10 and an end portion 43 extending downward from the plate portion and contacting the memory module. have. The end portion 43 may extend from the center of the plate portion 41 to the lower portion and may have a size corresponding to that of the memory module. The plate portion and the end portion are integrally formed.

In this embodiment, the plate portion may be in the form of a quadrangular pyramid having an inclined surface toward the end portion.

In another embodiment, the plate portion may be in the shape of a hemispherical protruding toward the end portion, as shown in Fig.

As described above, since the plate portion is formed in the shape of a quadrangular pyramid or a hemisphere toward the end portion, the heat capacity can be further increased. Thus, the temperature of the heat transfer block can be prevented from suddenly changing or fluctuating when the memory module generates heat, and the temperature uniformity can be further secured.

A plurality of slits may be formed on the surface of the end portion 43 so as to increase the heat transfer efficiency. The heat capacity can be reduced by reducing the cross-sectional area of the end portion by the slit. Thus, the energy required for end cooling and heating can be minimized through faster heat transfer.

At the center of the heat transfer block 40, a female screw hole 42 for bolt fastening is formed. The female screw hole 42 is for assembling the cold / warm unit, and the fixing bolt 62 passes through the thermoelectric element 10 and is fastened.

A temperature sensor 44 for detecting the temperature applied to the memory module M may be further provided at the end 43 of the heat transfer block. A hole 45 for mounting the temperature sensor is formed deeply at the lower end of the end portion 43 for installing the temperature sensor 44. Accordingly, the temperature sensor 44 is installed as close as possible to the memory module M in the hole 45, so that the temperature of the cold / hot heat applied to the memory module through the end portion 43 can be accurately detected.

The electric wires connected to the temperature sensor 44 extend outward through the holes and have a female connector 46 for connection with the connection part 210 at the tip thereof.

In this embodiment, the heat transfer block 40 may further include a stopper 48 protruding from at least one end of the surface on which the thermoelectric element 10 contacts, and regulating the position of the thermoelectric device on the side. The stopper 48 may be formed at both opposite ends of the heat transfer block. The stopper 48 is protruded to a predetermined length so that the thermoelectric element 10 can be caught.

The stopper 48 regulates the position of the thermoelectric element when the heat transfer block 40 and the thermoelectric element 10 are assembled. Accordingly, the thermoelectric element 10 is regulated by the stopper 78 at the contact surface of the heat transfer block 40 so that it can be brought into contact with the heat transfer block without being shifted outward or shifted in position.

As mentioned above, the stopper for regulating the position of the thermoelectric element is installed in the water cooling block in addition to the heat transfer block. Therefore, even when the heat transfer block, the thermoelectric element, and the water-cooled block are fixed by one fixing bolt when assembling the cold / warm unit, the positions of the components can be precisely adjusted by the stopper and assembled without shaking.

Hereinafter, a thermoelectric device according to this embodiment will be described with reference to FIGS. 8 to 10. FIG.

The thermoelectric element 10 of the present embodiment includes a semiconductor unit 20, a first heat transfer plate 24 and a second heat transfer plate 26 bonded to the outside of the semiconductor unit, and a first heat transfer plate 24, And a sealing member 30 sealing between the front ends of the heat transfer plates 26 to seal the inside thereof.

The thermoelectric element 10 of the present embodiment includes a plurality of semiconductor units 20 and a plurality of semiconductor units may be stacked between the first heat transfer plate 24 and the second heat transfer plate 26.

Each semiconductor unit may include a plurality of semiconductors 13 arranged at intervals, a top electrode 16 and a bottom electrode 17 arranged in a pattern set at the top and bottom of the semiconductor and electrically connected to the semiconductor.

A plurality of semiconductors 13 are disposed on the same plane with an interval therebetween to form respective semiconductor units 20.

The semiconductor units stacked and arranged in the thermoelectric element 10 serve to dissipate the heat of the neighboring semiconductor units so that heat is radiated in multiple stages in one thermoelectric element 10. [ Accordingly, by using one thermoelectric element 10, it is possible to drive with a low power, and a lower temperature can be realized quickly and effectively.

Hereinafter, in this embodiment, a structure in which three semiconductor units are stacked will be described as an example. However, the present device is also applicable to a structure in which two or more thermoelectric elements 10 are stacked in addition to three.

In the following description, the lower or the lower part means the lower side along the y axis in Fig. 8, and the upper side or the upper side means the upper side along the y axis. For convenience of explanation, the respective semiconductor units stacked in order from the bottom along the y-axis direction are referred to as a first semiconductor unit 21, a second semiconductor unit 22 and a third semiconductor unit 23. The semiconductor unit 20 may refer to all of the stacked semiconductor units. The plate contacting the heat transfer block 40 is referred to as a first heat transfer plate 24 and the plate contacting the water cooling block 52 as an upper surface of the thermoelectric element 10 is referred to as a second heat transfer plate 24. [ (26).

The first semiconductor unit 21 gives a temperature condition for inspection to the memory module M substantially through the lower surface thereof and the second semiconductor unit 22 is provided on the upper surface of the first semiconductor unit 21, The heat of the heat exchanger 21 is dissipated. Further, the third semiconductor unit 23 dissipates the heat of the second semiconductor unit 22 from the upper surface of the second semiconductor unit 22. As the heat is radiated in multiple layers within the thermoelectric element 10, the first heat transfer plate 24 contacting the first semiconductor unit 21 can be cooled or heated more quickly and effectively.

In this embodiment, each semiconductor unit 20 may have the same structure. That is, each of the semiconductor units 20 has the same number of semiconductors 13, and the semiconductors 13 are arranged at the same position at the same intervals.

Thus, the plurality of stacked semiconductor units 20 may all be formed with the same area size having the same quantity of the semiconductor 13. Therefore, even if a plurality of semiconductor units are laminated in multiple stages, the thermoelectric elements 10 of this embodiment can have a sufficient structural rigidity because the area of each semiconductor unit is constant.

The semiconductor 13 of each semiconductor unit is composed of an N-type semiconductor 14 and a P-type semiconductor 15 and arranged alternately with each other. In the pattern in which the upper electrode 16 and the lower electrode 17 are arranged at the upper and lower ends The N-type semiconductor 14 and the P-type semiconductor 15 are electrically connected. In the following description, reference numeral 13 designates a semiconductor regardless of the N-type or P-type, and reference numerals 14 and 15 designate an N-type semiconductor and a P-type semiconductor, respectively.

The first semiconductor unit 21 is made up of a plurality of semiconductors 13 arranged on the first heat transfer plate 24. A plurality of semiconductors 13 stacked on the semiconductors 13 of the first semiconductor unit 21 constitute the second semiconductor unit 22. The plurality of semiconductors 13 stacked on the semiconductor 13 of the second semiconductor unit 22 constitute the third semiconductor unit 23. [

An intermediate heat transfer plate 28 is provided between the first semiconductor unit 21 and the second semiconductor unit 22 and between the second semiconductor unit 22 and the third semiconductor unit 23, Can be installed.

In this embodiment, the first semiconductor unit 21 is installed between the first heat transfer plate 24 and the intermediate heat transfer plate 28, and the second semiconductor unit 22 is installed between the intermediate heat transfer plates 28 And the third semiconductor unit 23 is installed between the intermediate heat transfer plate 28 and the second heat transfer plate 26.

The intermediate heat transfer plate 28 may be made of the same material as the first heat transfer plate 24 or the second heat transfer plate 26, for example. The intermediate heat transfer plate 28 is a plate-like structure that insulates the semiconductors of the respective semiconductor units. The heat generated between the adjacent semiconductor units with the intermediate heat transfer plate 28 therebetween is conducted to the intermediate heat transfer plate 28. Thus, heat is exchanged in the intermediate heat transfer plate 28, and heat generated in one semiconductor unit is heat-treated.

The first heat transfer plate (24) and the second heat transfer plate (26) are sized to cover the entire semiconductor unit and form opposite surfaces of the thermoelectric element (10). A plurality of semiconductor units 20 are stacked and installed between the two first heat transfer plates 24 and the second heat transfer plates 26.

In this embodiment, the first heat transfer plate 24, the second heat transfer plate 26, and the intermediate heat transfer plate 28 have a structure in which a fastening hole 12 is formed through the entire surface.

The fastening holes 12 may be formed in the same size and the same size in the first heat transfer plate 24, the second heat transfer plate 26, and the intermediate heat transfer plate 28.

As shown in FIG. 8, in the present embodiment, the fastening holes 12 may have a structure in which one thermoelectric element 10 is formed at the central portion thereof. The fastening holes 12 can be variously modified in terms of the number of forming and forming positions of the structural surface formed through the thermoelectric elements 10.

As mentioned above, the thermoelectric element 10 of this embodiment secures the structural rigidity as the number of semiconductors of the stacked semiconductor units 20 is the same. Thus, even if the fastening hole 12 is formed through the thermoelectric element 10 as described above, the structural rigidity can be prevented from being lowered. Therefore, in the present embodiment, the thermoelectric element 10 can be assembled by forming the fastening hole 12 in the thermoelectric element 10, and the size of the cold / warm unit 100 can be further reduced do.

The semiconductor units 20 may be connected in series or in parallel. For example, the semiconductor of the first semiconductor unit 21 and the semiconductor of the second semiconductor unit 22 are connected to each other along the current flow, and the semiconductor of the second semiconductor unit 22 and the semiconductor of the third semiconductor unit 23 Can be electrically connected.

Thus, as shown in FIG. 9, by connecting two electric wires 18 and 19 to the thermoelectric element 10, current can be applied to the plurality of stacked semiconductor units. Therefore, the current application structure of the thermoelectric element 10 can be further simplified, and current can be applied to the entire semiconductor of the thermoelectric element 10 through only two wires connected to the thermoelectric element.

In this manner, the number of wires and the wiring structure applied to the device can be simplified by simplifying the electrical connection structure to the thermoelectric elements 10 while stacking the plurality of semiconductors in the vertical direction. Thus, the structure of the apparatus can be simplified and the apparatus can be made compact.

10, a first heat transfer plate 24 and an intermediate heat transfer plate 28, an intermediate heat transfer plate 28 and an intermediate heat transfer plate 28 and a second heat transfer plate (not shown) are formed along the circumference of the thermoelectric element 10 26 are provided with a sealing member 30 therebetween. The sealing member 30 may be filled in the inner space of the thermoelectric element 10 and may also be provided between the semiconductor 13 and the semiconductor 13. Accordingly, the thermoelectric element 10 can further enhance the moisture shielding effect by the sealing member 30 and the durability of the thermoelectric element 10 by shock absorption.

In this embodiment, the sealing member 30 may be made of an epoxy material 32 comprising silicon particles 34. When the sealing member is made of a silicon material, moisture is penetrated into the thermoelectric element 10 due to the micro-gap of the silicon material itself. In addition, when the sealing member is made of an epoxy material, the sealing member is hardened at a low temperature and the external shock can not be absorbed.

However, the sealing member 30 of the present embodiment includes the silicon particles 34 in the epoxy 32, so that the thermoelectric element 10 can simultaneously secure the action effect by the epoxy and the action effect by the silicon. Thus, the thermoelectric element 10 of the present embodiment is configured such that the sealing member 30 blocks the gap between the first heat transfer plate 24 and the intermediate heat transfer plate 28 and the second heat transfer plate 26 more reliably at a low temperature, It is possible to prevent penetration and to absorb the external impact applied to the thermoelectric element 10, thereby enhancing durability.

In this embodiment, the silicon particles 34 may be included in an amount of 2 wt% to 21 wt% with respect to the total sealing member 30. When the silicon particles are mixed in less than 2% by weight, the sealing member is hardened at a low temperature and it is difficult to secure the durability of the thermoelectric element, and the thermoelectric element may be damaged due to external impact. If the amount of the silicon particles exceeds 21% by weight, the external moisture can penetrate into the thermoelectric element through the silicon particles, thereby failing to perform the role of the sealing member properly.

As shown in FIG. 10, the thermoelectric element 10 of the present embodiment has a structure in which a coating layer 36 is formed by coating a side surface of a semiconductor with a moisture-proof paint to prevent corrosion by moisture.

The coating layer 36 may be formed on the inner surfaces of the upper electrode 16 and the lower electrode 17 connected to the semiconductor in addition to the side of the semiconductor 13.

In this embodiment, the coating layer 36 may be formed of a carbon-based organic coating or a carbon-based inorganic coating. That is, the thermoelectric element 10 forms the coating layer 36 by applying the paint to the side surfaces of the semiconductor and the inner surfaces of the upper electrode and the lower electrode connected to the semiconductor.

Various methods can be applied to form the coating layer, and the thickness of the coating layer is not particularly limited, and can be variously modified.

In this embodiment, since the coating layer 36 is made of a carbon-based organic coating or a carbon-based inorganic coating, the coating layer 36 can sufficiently ensure heat resistance, weather resistance, chemical stability, electrical insulation, etc. with respect to the internal structure of the thermoelectric element 10 do.

As described above, the present thermoelectric element 10 includes a semiconductor through the coating layer 36 to form a coating on the thermoelectric element internal constituent portion, thereby improving the moisture resistance and preventing the thermoelectric element from corroding . In addition, the coating layer 36 increases the strength of the semiconductor 13 to increase the durability of the thermoelectric element 10 against the load applied to the thermoelectric element and the external impact.

Here, the semiconductor 13 of each semiconductor unit 20 is gradually reduced in size from the first heat transfer plate 24 to the second heat transfer plate 26 along the y-axis direction. In this embodiment, the height of the semiconductor 13 of each semiconductor unit gradually decreases from the lower portion to the upper portion along the y-axis direction. The height means the length in the y-axis direction.

10, the semiconductor height B of the second semiconductor unit 22 is relatively smaller than the semiconductor height A of the first semiconductor unit 21, The semiconductor height C of the third semiconductor unit 23 is relatively small.

Thus, the resistance capacities of the respective semiconductor units stacked in the thermoelectric conversion element 10 are different from each other, while the sizes of the semiconductor units 20 and the number of the semiconductors are the same. That is, by varying the sizes of the semiconductors 13 in the stacked semiconductor units, the resistance value of the semiconductor gradually decreases from the first semiconductor unit 21 to the third semiconductor unit 23.

In each semiconductor unit, the amount of heat depends on the resistance value of the semiconductor. Thus, in this embodiment, the number of semiconductor units is the same, so that the amount of heat of each semiconductor unit can be made different while maintaining the same heat dissipation area between the stacked semiconductor units.

Thus, in the present embodiment, the second semiconductor unit 22 has a relatively large heat quantity with respect to the first semiconductor unit 21 stacked in the thermoelectric element 10, and the third semiconductor unit 23 has a relatively large amount of heat, (22). ≪ / RTI > Accordingly, the amount of heat can be further increased from the first semiconductor unit 21 to the third semiconductor unit 23.

As described above, by driving only one thermoelectric element 10, the amount of heat is increased in multiple stages through the plurality of semiconductor units 20 provided therein while using low power, so that it is possible to realize a lower temperature more quickly and effectively do.

According to the above structure, a current is applied to the thermoelectric element 10 of the present embodiment to apply heat or heat to the memory module M.

11 to 15 show various embodiments of the cold / warm unit having the thermoelectric element of the above structure.

Fig. 11 shows a cold / warm unit 100 having a single thermoelectric element 10 including three-stage semiconductor units as described above. The laminated structure of the semiconductor unit and the structure of the thermoelectric element are replaced with the contents described above, and a detailed description thereof will be omitted. Cooling blocks 52 and heat transfer blocks 40 are disposed at upper and lower ends of the thermoelectric element 10, respectively. The fixing bolt 62 passes through the center of the cold / warm unit 100 to fix the water-cooling block 52, the thermoelectric element 10, and the heat transfer block 40 to each other. In this embodiment, since three semiconductor units having different capacities are stacked in one thermoelectric element while one thermoelectric element is used, a lower temperature can be realized even at a low power.

Fig. 12 shows another embodiment of the cooling / heating unit, in which a separate high capacity thermoelectric element 101 is additionally provided in addition to the thermoelectric element 10 of the embodiment shown in Fig.

The cooling and heating unit 100 according to the embodiment of FIG. 12 has two thermoelectric elements 10 and 101 stacked between the water-cooling block 52 and the heat transfer block 40 and an intermediate thermal block 102 installed between the two thermoelements Structure. The fixing bolt 62 passes through the central portion of the cooling / heating unit 100 to fix the water cooling block 52, the thermoelectric elements 10 and 101, the intermediate thermal block 102 and the heat transfer block 40.

The thermoelectric element 10 disposed under the two thermoelectric elements is a thermoelectric element as mentioned in FIG. 11, and the thermoelectric elements stacked thereon are high-capacity thermoelectric elements 101 having only one semiconductor unit. The term " high capacity " means that the amount of heat is relatively larger than that of the uppermost semiconductor unit among the semiconductor units included in the thermoelectric element of this embodiment. The high-capacity thermoelectric element 101 is also the same size as the thermoelectric element disposed at the bottom. A hole is also formed in the central portion of the high-capacity thermoelectric element 10 and the intermediate thermal block 102 so that the fixing bolt 62 is also passed therethrough. The fixing bolt 62 is fastened between the water cooling block 52 and the heat transfer block 40 through the two thermoelectric elements 10 and 101 and the intermediate thermal block 102.

In the case of the cold / warm unit 100 shown in Fig. 12, another high-capacity thermoelectric element 101 is provided on the thermoelectric element 10 so that the heat generated in the lower thermoelectric element 10 is absorbed by the high- So that the thermoelectric element 101 can further radiate heat. Thus, the cooling temperature can be further lowered.

The cooling / heating unit 100 of the embodiment shown in FIG. 13 has a structure in which a plurality of thermoelectric elements 111, 112, and 113 having different capacities are stacked. In FIG. 13, a structure in which three thermoelectric elements are stacked is illustrated, but the present invention is not limited thereto, and two or four thermoelectric elements may be provided.

In the cooling / heating unit 100 according to the embodiment of FIG. 13, three thermoelectric elements 111, 112 and 113 are stacked between the water-cooling block 52 and the heat transfer block 40. The fixing bolt 62 passes through the center of the cold / warm unit 100 to fix the water-cooling block 52, the thermoelectric elements 111, 112, and 113, and the heat transfer block 40.

The three thermoelectric elements have different capacities. The cooling unit 100 of the present embodiment has a structure in which the amount of heat of each thermoelectric element gradually increases from the heat transfer block 40 toward the water cooling block 52. [

The thermoelectric elements 111, 112, and 113 have the same size, and the number and arrangement positions of the semiconductors included therein are the same. However, the semiconductor provided in each thermoelectric element has a different height.

That is, as shown in FIG. 13, the semiconductor height of the thermoelectric element 112 disposed above the semiconductor height of the thermoelectric element 111 disposed at the lowermost position is relatively small, and the height of the thermoelectric element 113 are relatively smaller.

Therefore, the resistance capacity of each of the thermoelectric elements stacked is different even though the size and arrangement of the thermoelectric elements and the number of the semiconductors are the same. That is, by varying the semiconductor sizes of the stacked thermoelectric elements, the resistance value of each thermoelectric element gradually decreases toward the uppermost thermoelectric element.

In each thermoelectric element, the amount of heat depends on the resistance value of the semiconductor. Therefore, in this embodiment, the amount of heat of each thermoelectric element can be made different while keeping the size of each thermoelectric element the same.

Therefore, in the case of this embodiment, relatively low capacity thermoelectric elements 111, relatively large capacity thermoelectric elements 112, and relatively high capacity thermoelectric elements 113 are stacked from the lower side.

By lowering the semiconductor size of each thermoelectric element from the lower side to the upper side, the heat quantity of the thermoelectric element can be further increased, thereby realizing a lower temperature.

The stacked three thermoelectric elements 111, 112, and 113 have holes formed in the center thereof so that the fixing bolts 62 pass through the holes. The fixing bolt 62 passes through the three thermoelectric elements and is fastened between the water cooling block 52 and the heat transfer block 40.

In the case of a structure in which three thermoelectric elements are laminated in this manner, by varying the semiconductor sizes of the thermoelectric elements, it is possible to keep the sizes of the thermoelectric elements stacked unlike the conventional one. Thus, even if the rigidity of each thermoelectric element is sufficiently secured and a hole for fastening the fixing bolt 62 is formed in the center portion, deterioration of the structural rigidity can be prevented. Accordingly, in the present embodiment, the cold / warm unit 100 can be assembled through the central portion of the thermoelectric device, and the size of the cold / warm unit 100 can be further reduced while ensuring sufficient rigidity.

FIG. 14 shows another embodiment of the cold / warm unit 100, in which a separate high capacity thermoelectric element 121 is additionally provided in addition to the three thermoelectric elements 111, 112 and 113 of the embodiment shown in FIG.

14, the thermoelectric elements 111, 112 and 113 having the structure shown in FIG. 13 are laminated between the water-cooling block 52 and the heat transfer block 40, and the intermediate thermal block 122 is interposed therebetween And a separate high-capacity thermoelectric element 121 is stacked. The thermoelectric elements 111, 112 and 113 disposed under the intermediate thermal anneal 122 have the same structure as the thermoelectric elements mentioned in FIG. A thermoelectric element 121 stacked thereon is a high-capacity thermoelectric element having only one semiconductor unit. The high capacity means that the amount of heat is relatively larger than that of the uppermost thermoelectric element 113 among the thermoelectric elements disposed under the intermediate thermal anneal. The high-capacity thermoelectric elements 121 are also the same size as the thermoelectric elements disposed at the bottom. A hole is also formed in the central portion of the high-capacity thermoelectric element 121 and the intermediate thermal block 122 so that the fixing bolt 62 is also passed therethrough. The fixing bolt (62) is fastened between the water cooling block (52) and the heat transfer block (40) through the four thermoelectric elements and the intermediate thermal block.

In the case of the cold / warm unit 100 shown in FIG. 14, another high-capacity thermoelectric element 121 is provided on the three stacked thermoelectric elements 111, 112, and 113 so that heat generated in the lower thermoelectric element The thermoelectric element 121 of the heat exchanger can further radiate heat. Thus, the cooling temperature can be further lowered.

Fig. 15 illustrates another embodiment of the cold / warm unit.

15, a plurality of thermoelectric elements 131 and 132 in which a plurality of semiconductor units having the same heat amount are stacked are stacked, and the thermoelectric elements 131 and 132 have a different heat amount.

The thermoelectric elements 131 and 132 having two heat amounts different from each other are stacked between the water cooling block 52 and the heat transfer block 40. Each thermoelectric element has a structure in which a plurality of semiconductor units are stacked. An intermediate thermal relay 133 may be further provided between the two thermoelectric elements 131 and 132.

In FIG. 15, a structure in which two thermoelectric elements are laminated is illustrated, but the present invention is not limited thereto, and three or more thermoelectric elements may be provided. The fixing bolt 62 passes through the center of the cooling / heating unit 100 to fix the water-cooling block 52, the two thermoelectric elements 131 and 132, and the heat transfer block 40.

Each of the thermoelectric elements 131 and 132 has a structure in which two semiconductor units 100 are stacked. The number of semiconductor units is not limited to two but may be three or more. The structure in which the semiconductor unit 100 is stacked is the same as that described in FIG. 11 only in the number of stacks, so that detailed description of the stacked structure of the semiconductor units will be omitted.

The number and arrangement of the semiconductor units of the semiconductor units 100 provided in the thermoelectric elements 131 and 132 are the same. Also, the number and arrangement of semiconductors are the same among the thermoelectric elements.

The two stacked thermoelectric elements 131 and 132 are all formed with holes through which the fixing bolts 62 pass. The fixing bolt 62 passes through the two thermoelectric elements 131 and 132 and is fastened between the water cooling block 52 and the heat transfer block 40.

As described above, it is possible to keep the sizes of the thermoelectric elements stacked to be the same, unlike the related art. Thus, even if the rigidity of each thermoelectric element is sufficiently secured and a hole for fastening the fixing bolt 62 is formed in the center portion, deterioration of the structural rigidity can be prevented. Accordingly, in the present embodiment, the cold / warm unit 100 can be assembled through the central portion of the thermoelectric device, and the size of the cold / warm unit 100 can be further reduced while ensuring sufficient rigidity.

In this embodiment, the two thermoelectric elements have different capacities. The cooling unit 100 of the present embodiment has a structure in which the amount of heat of each thermoelectric element increases from the heat transfer block 40 toward the water cooling block 52. [ Each of the thermoelectric elements has the same size, and the number and arrangement positions of the semiconductors provided therein are the same. However, the semiconductor provided in each thermoelectric element has a different height.

That is, as shown in Fig. 15, the semiconductor height of the thermoelectric element 132 disposed above the semiconductor height of the thermoelectric element 131 disposed below the intermediate thermal block 133 is relatively small .

Therefore, the resistance capacity of each of the thermoelectric elements stacked is different even though the size and arrangement of the thermoelectric elements and the number of the semiconductors are the same. That is, by varying the semiconductor sizes of the stacked thermoelectric elements, the thermoelectric elements disposed above the thermoelectric elements at the bottom are smaller in resistance value.

In each thermoelectric element, the amount of heat depends on the resistance value of the semiconductor. Therefore, in this embodiment, the amount of heat of each thermoelectric element can be made different while keeping the size of each thermoelectric element the same.

Thus, in the case of this embodiment, a thermoelectric element 131 having a relatively low capacity is disposed below and a thermoelectric element 132 with a high capacity is stacked on the lower side with respect to the intermediate thermal block 133. By lowering the semiconductor size of each thermoelectric element from the lower side to the upper side, the heat quantity of the thermoelectric element can be further increased, thereby realizing a lower temperature.

Hereinafter, a case where the memory module M is subjected to a low temperature test by applying cold heat will be described as an example.

The current flows to the semiconductor 13 of each semiconductor unit 20 stacked in the thermoelectric element 10 by driving the thermoelectric element 10. The lower surface of the first semiconductor unit 21 is cooled to a relatively low temperature and cold air is applied to the memory module M through the first heat transfer plate 24 to which the first semiconductor unit 21 is in contact.

The upper surface of the first semiconductor unit 21 is heat-dissipated through the heat exchange with the second semiconductor unit 22 by the heat-generating surface to maintain the temperature difference with the lower surface.

The lower surface of the second semiconductor unit 22 is cooled to a relatively low temperature and the cool air is supplied to the upper surface of the first semiconductor unit 21 through the intermediate heat transfer plate 28 in contact with the lower surface of the second semiconductor unit 22. [ . Thus, the upper surface of the first semiconductor unit 21 is cooled while being radiated by the second semiconductor unit 22.

The upper surface of the second semiconductor unit 22 is heat-dissipated through the heat exchange with the third semiconductor unit 23 to maintain the temperature difference with the lower surface. The lower surface of the third semiconductor unit 23 is cooled to a relatively low temperature and the cool air is supplied to the upper surface of the second semiconductor unit 22 through the intermediate heat transfer plate 28 in contact with the lower surface of the third semiconductor unit 23. [ . Thus, the upper surface of the second semiconductor unit 22 is cooled while being radiated by the third semiconductor unit 23.

The upper surface of the third semiconductor unit 23 is heat-treated through the water-cooling block 52 provided on the second heat transfer plate 26 as a heat generating surface.

As described above, in this embodiment, another semiconductor unit is stacked and heat-exchanged on one semiconductor unit in one thermoelectric element 10, so that cold air at a lower temperature can be applied quickly.

Compare Comparative Example Example Remarks Minimum temperature -45 ° C -65 ° C -21 ℃ difference Power consumption 170W 100W 40% reduction size 8 x 8 x 6 cm 5 × 5 × 5cm 32% reduction volume 384 125 Temperature falling speed 23 minutes 11 minutes 50% reduction

The characteristics of the cold / warm unit manufactured according to the present embodiment were compared with those of the prior art.

Table 1 shows experimental results of the cold / warm unit having the thermoelectric device according to the present embodiment as mentioned above, and the comparative example shows the result of the experiment on the cold / hot unit in which a plurality of thermoelectric elements are stacked according to the related art Respectively.

In this experiment, two thermoelectric elements were stacked in the cold / warm unit of the comparative example, one thermoelectric device of 121W class (DC 24V, 6A) of 50 × 50 mm and one thermoelectric device of 50W (DC 12V, 4A) of 30 × 30 mm size.

In the cooling / heating unit of the embodiment, one thermoelectric element of 102W class (DC12V, 8.5A) having a size of 40 x 40 mm was used.

As shown in Table 1, it can be confirmed that the maximum temperature of -45 ° C can be applied to the comparative example, while the temperature can be lowered to -65 ° C in the embodiment. As for power consumption, it can be seen that the power saving effect of the embodiment is about 40% as compared with the comparative example, and the size can be further reduced as compared with the comparative example.

Among the comparative items in Table 1, the temperature lowering rate is an item for measuring the time taken for one cycle of raising the temperature from -40 ° C to 125 ° C and then decreasing the temperature to -40 ° C again. It can also be seen that, in terms of the temperature lowering speed, the lowering rate of the embodiment is 50% or more faster than that of the comparative example.

While the illustrative embodiments of the present invention have been shown and described, various modifications and alternative embodiments may be made by those skilled in the art. These variations and other embodiments are to be considered and included in the appended claims so as not to depart from the true spirit and scope of the invention.

1: cold module 2: work module
10: thermoelectric element 12: fastening hole
13: semiconductor 16: upper electrode
17: lower electrode 20: semiconductor unit
21: first semiconductor unit 22: second semiconductor unit
23: third semiconductor unit 24: first heat transfer plate
26: second heat transfer plate 28: intermediate heat transfer plate
30: sealing member 36: coating layer
40: heat transfer block 42: female thread hole
41: plate portion 43: end portion
44: Temperature sensor 46, 47: Connector
48, 48: stopper 50:
52: water cooling block 62: fixing bolt
64: elastic member 70: connecting bolt
72: Elastic spring 74: Guide pin
76: Guide holder 100: Cooling unit
200: support plate 210:
220: side cover 230: supply pipe
240: Cover 300: Base frame
310: moving part 312: supporting member
314 Vertical drive 318 Guide bar
320: horizontal moving part 322: rail
324: Moving truck 326:

Claims (20)

And a cold / warm unit for applying cold / hot energy to the object to be inspected,
The cooling / heating unit includes a thermoelectric element for generating cold / hot energy, a heat transfer block provided on one surface of the thermoelectric element for applying cool air or heat to the object to be inspected, a heat dissipating portion provided on the other surface of the thermoelectric element, And a coupling portion for coupling the heat dissipation portion and the heat transfer block,
The coupling portion includes a fixing bolt which penetrates a hole formed in a front surface of the heat dissipating portion and the thermoelectric element and is fastened to the heat transfer block and fixes the thermoelectric element to the heat dissipating portion and the heat transfer block, Wherein the elastic member is made of an elastic material. The method according to claim 1,
Wherein the thermoelectric element includes a semiconductor unit including a plurality of semiconductors arranged at intervals and an upper electrode and a lower electrode electrically connected to the semiconductor in a pattern set at an upper end and a lower end of the semiconductor, And a sealing member sealing the inside between the first heat transfer plate and the second heat transfer plate and sealing the inside between the first heat transfer plate and the second heat transfer plate, And an intermediate heat transfer plate is provided between each of the semiconductor units. 3. The method of claim 2,
Wherein the cooling / heating unit has a structure in which at least two thermoelectric elements are stacked, each of the thermoelectric elements has the same size, and the height of the semiconductor of each thermoelectric element gradually decreases from the heat-conducting block to the heat- Device. The method of claim 3,
Wherein the cooling / heating unit further comprises at least one intermediate thermal block installed between the thermoelectric elements. 3. The method of claim 2,
Wherein a size of the semiconductor of each semiconductor unit gradually decreases from the first heat transfer plate to the second heat transfer plate. 6. The method of claim 5,
Wherein the height of the semiconductor of each semiconductor unit gradually decreases from the first heat transfer plate to the second heat transfer plate. The method according to claim 6,
Wherein the cold / warm unit further comprises a relatively high capacity thermoelectric device stacked on the thermoelectric module. The method according to claim 1,
Wherein the heat dissipation unit includes a water-cooled block in which cooling water is circulated, and the water-cooled block includes a stopper protruding from at least one end of a surface of the thermocouple in contact with the thermocouple, . The method according to claim 1,
Wherein the heat transfer block includes a stopper protruding from at least one end of a surface of the thermoelectric element on which the thermoelectric element is in contact and regulating a position of the thermoelectric device on the side of the thermoelectric element. The method according to claim 1,
Wherein the heat transfer block includes a plate portion that is in contact with the thermoelectric element and an end portion that protrudes outward from the plate portion and is in contact with the inspection object, and the plate portion has a quadrangular pyramid shape. The method according to claim 1,
Wherein the heat transfer block includes a plate portion in contact with the thermoelectric element and an end portion protruding outward from the plate portion in contact with the inspection object, and the plate portion has a hemispherical shape. 12. The method according to any one of claims 1 to 11,
A cold module installed on the base frame and having at least one or more inspection objects disposed on the surface thereof, at least one or more cooling / heating units moved to the operation module and applying cold energy to the inspection objects disposed in the operation module, And a moving unit for moving the cold / hot module relative to the work module to couple or separate the cold / hot module to or from the work module. 13. The method of claim 12,
The cold / hot module includes a support plate on which at least one or more cooling / heating units are detachably mounted, a connection unit that is installed on the support plate and detachably connected to each of the cooling / heating units individually, And a side cover surrounding the space. 14. The method of claim 13,
Further comprising a supply pipe extending inside the side cover and having a hole for injecting clean air between the cold / warm unit and the inspection object. 14. The method of claim 13,
A connection bolt fastened between the heat dissipating unit and the support plate, and an elastic spring inserted between the support plate and the heat dissipation unit. 14. The method of claim 13,
At least one guide pin formed on the support plate, and a guide hole formed in the heat dissipation unit and into which the guide pin is inserted. 13. The method of claim 12,
And a horizontal movement unit installed on the base frame for moving the work module to the cold / hot module position. 18. The method of claim 17,
Wherein the moving unit includes a supporting member provided on the base frame and a vertical driving unit installed on the supporting member and connected to the cooling module to move the cooling module vertically. 19. The method of claim 18,
Wherein the moving unit further includes at least one guide bar installed on the cold / hot module and extending upward, and a guide holder formed on the support member and guided by the guide bar inserted therein. 18. The method of claim 17,
Wherein the horizontal moving part includes a moving truck installed with the work module and moved along a rail horizontally extending along the base frame, and a horizontal driving part moving the moving truck.

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