CN106098641A - A kind of integrated circuit package structure of high efficiency and heat radiation - Google Patents
A kind of integrated circuit package structure of high efficiency and heat radiation Download PDFInfo
- Publication number
- CN106098641A CN106098641A CN201610455196.2A CN201610455196A CN106098641A CN 106098641 A CN106098641 A CN 106098641A CN 201610455196 A CN201610455196 A CN 201610455196A CN 106098641 A CN106098641 A CN 106098641A
- Authority
- CN
- China
- Prior art keywords
- bearing seat
- load bearing
- plate
- metallic heat
- heat radiating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses the integrated circuit package structure of a kind of high efficiency and heat radiation, it is fixed with metallic heat radiating plate on its insulation support plate, the radiating frame of several " time " fonts is formed on the outside of metallic heat radiating plate, the load bearing seat being fixedly arranged in the middle of rectangle of metallic heat radiating plate, the center of load bearing seat forms the placement hole of rectangle, in IC chip grafting is fixed on the placement hole of load bearing seat and be resisted against on metallic heat radiating plate；Groove is formed on the radiating frame of metallic heat radiating plate two opposite sides, extension board is all formed on the side of load bearing seat, one group of extension board that load bearing seat is relative is plugged on the groove of radiating frame and forms side plate, side plate is fixed on insulation support plate and on the outer wall of the radiating frame that is resisted against metallic heat radiating plate outer layer, and another group extension board that load bearing seat is relative is plugged in the radiating frame of heat dissipation metal inner cord.The present invention uses the structure that the metallic heat radiating plate of special shape combines with integrated antenna package, it is achieved integrated circuit can realize high efficiency and heat radiation in running.
Description
Technical field:
The present invention relates to the technical field of integrated circuit, more specifically to the integrated antenna package of a kind of high efficiency and heat radiation
Structure.
Background technology:
Electronic industry constantly reduces the size of electronic component, and is continuing to increase function at electronic component so that integrated electricity
Function and the complexity on road constantly promote.And this trend also orders about the encapsulation technology of integrated circuit component towards small size, height
The direction of foot number and high electricity/thermal efficiency is developed, and meets predetermined industrial standard.Owing to high-effect integrated circuit component produces more
High heat, and existing compact package technology only provides designer fraction of cooling mechanism, it is therefore desirable to small-sized at it
On encapsulating structure, design radiator structure is so that realizing high efficiency and heat radiation, extends the service life of integrated circuit.
Summary of the invention:
The purpose of the present invention is aiming at the deficiency of prior art, and provides the integrated antenna package of a kind of high efficiency and heat radiation
Structure, it is to set up radiator structure on the encapsulating structure of integrated circuit, it is thus possible to realize high efficiency and heat radiation, indirectly extends integrated electricity
The service life on road.
For achieving the above object, the technical solution used in the present invention is as follows:
The integrated circuit package structure of a kind of high efficiency and heat radiation, including insulation support plate, insulation support plate is fixed with heat dissipation metal
Plate, the outside of metallic heat radiating plate forms the radiating frame of several " time " fonts, metallic heat radiating plate be fixedly arranged in the middle of square
The load bearing seat of shape, the center of load bearing seat forms the placement hole of rectangle, and IC chip grafting is fixed on the arrangement of load bearing seat
In hole and be resisted against on metallic heat radiating plate；Groove is formed, the side of load bearing seat on the radiating frame of metallic heat radiating plate two opposite sides
All forming extension board on limit, one group of extension board that load bearing seat is relative is plugged on the groove of radiating frame and forms side plate, side
Plate is fixed on insulation support plate and on the outer wall of the radiating frame that is resisted against metallic heat radiating plate outer layer, another group that load bearing seat is relative
Extension board is plugged in the radiating frame of heat dissipation metal inner cord, and the radiating frame of heat dissipation metal inner cord forms some dissipating
Backing；If setting on the load bearing seat of IC chip both sides and being fixed with dry contact, side plate is fixed with some stitch, stitch and
Contact is electrically connected.
Described load bearing seat use isolation material, the stitch on load bearing seat with contact on the dual-side that load bearing seat is identical.
If forming dry contact on the upper surface of described IC chip, contact is by the contact on wire and load bearing seat
It is electrically connected.
The bottom surface of the extension board of described load bearing seat side is located in the same horizontal plane, and the bottom surface of load bearing seat is less than extension board
Bottom surface.
Some louvre a are all formed on the radiating frame of described metallic heat radiating plate both sides and load bearing seat.
Described stitch or contact are the most linearly evenly distributed on load bearing seat or side plate.
The beneficial effects of the present invention is: it uses the metallic heat radiating plate of special shape to combine with integrated antenna package
Structure, it is achieved integrated circuit can realize high efficiency and heat radiation in running, such that it is able to extend the service life of integrated circuit.
Accompanying drawing illustrates:
Fig. 1 is the structural representation that invention is three-dimensional；
Fig. 2 is the structural representation that invention is overlooked；
Fig. 3 is the structural representation of invention section view；
Fig. 4 is the structural representation of invention metallic heat radiating plate.
In figure: 1, insulation support plate；2, metallic heat radiating plate；21, radiating frame；211, groove；22, fin；3, load bearing seat；
31, placement hole；32, extension board；33, side plate；4, contact；5, stitch；6, IC chip；61, contact；A, louvre.
Detailed description of the invention:
Embodiment: as shown in Fig. 1 is to 4, the integrated circuit package structure of a kind of high efficiency and heat radiation, including insulation support plate 1, insulation
It is fixed with metallic heat radiating plate 2 on support plate 1, the outside of metallic heat radiating plate 2 forms the radiating frame 21 of several " time " fonts,
The load bearing seat 3 being fixedly arranged in the middle of rectangle of metallic heat radiating plate 2, the center of load bearing seat 3 forms the placement hole 31 of rectangle, integrated electricity
In road chip 6 grafting is fixed on the placement hole 31 of load bearing seat 3 and be resisted against on metallic heat radiating plate 2；Metallic heat radiating plate 2 two opposite sides
Radiating frame 21 on form groove 211, the side of load bearing seat 3 all forms extension board 32, a group that load bearing seat 3 is relative
Extension board 32 is plugged on the groove 211 of radiating frame 21 and forms side plate 33, side plate 33 be fixed on insulation support plate 1 on and against
On the outer wall of the radiating frame 21 of metallic heat radiating plate 2 outer layer, another group extension board 32 that load bearing seat 3 is relative is plugged on metal and dissipates
In the radiating frame 21 of hot plate 2 internal layer, the radiating frame 21 of metallic heat radiating plate 2 internal layer forms some fin 22；Integrated
If setting on the load bearing seat 3 of circuit chip 6 both sides and being fixed with dry contact 4, side plate 33 is fixed with some stitch 5, stitch 5 and connecing
Point 4 is electrically connected.
Described load bearing seat 3 uses isolation material, and the stitch 5 on load bearing seat 3 and contact 4 are at the identical dual-side of load bearing seat 3
On.
If forming dry contact 61 on the upper surface of described IC chip 6, contact 61 is by wire and load bearing seat 3
Contact 4 be electrically connected.
The bottom surface of the extension board 32 of described load bearing seat 3 side is located in the same horizontal plane, and the bottom surface of load bearing seat 3 is less than extending
The bottom surface of plate 32.
Some louvre a are all formed on the radiating frame 21 of described metallic heat radiating plate 2 both sides and load bearing seat 3.
Described stitch 5 or contact 4 are the most linearly evenly distributed on load bearing seat 3 or side plate 33.
Operation principle: the present invention is the encapsulating structure of integrated circuit, it adds metallic heat radiating plate 2 to increase heat radiation, and
Metallic heat radiating plate 2 offers radiating frame 21 and the fin 22 of " returning " character form structure of multilamellar, improves radiating efficiency, opens simultaneously
If louvre a, and the channel for heat dissipation of the radiating frame 21 of load bearing seat 3 unplugged " time " character form structure of its encapsulating structure, real
Existing air circulation, it is achieved high efficiency and heat radiation.
Claims (6)
1. an integrated circuit package structure for high efficiency and heat radiation, including insulation support plate (1), it is characterised in that: in insulation support plate (1)
It is fixed with metallic heat radiating plate (2), the outside of metallic heat radiating plate (2) forms the radiating frame (21) of several " time " fonts,
The load bearing seat (3) being fixedly arranged in the middle of rectangle of metallic heat radiating plate (2), the center of load bearing seat (3) forms the placement hole of rectangle
(31) in, IC chip (6) grafting is fixed on the placement hole (31) of load bearing seat (3) and be resisted against on metallic heat radiating plate (2)；
Groove (211) is formed, equal molding on the side of load bearing seat (3) on the radiating frame (21) of metallic heat radiating plate (2) two opposite sides
Having extension board (32), one group of extension board (32) that load bearing seat (3) is relative is plugged on groove (211) the molding of radiating frame (21)
There are side plate (33), side plate (33) to be fixed in insulation support plate (1) and are resisted against the radiating frame (21) of metallic heat radiating plate (2) outer layer
Outer wall on, another group extension board (32) that load bearing seat (3) is relative is plugged on the radiating frame (21) of metallic heat radiating plate (2) internal layer
In, the radiating frame (21) of metallic heat radiating plate (2) internal layer forms some fin (22)；IC chip (6) both sides
Load bearing seat (3) if on set and be fixed with dry contact (4), side plate (33) is fixed with some stitch (5), stitch (5) and contact
(4) it is electrically connected.
The integrated circuit package structure of a kind of high efficiency and heat radiation the most according to claim 1, it is characterised in that: described load bearing seat
(3) use isolation material, the stitch (5) on load bearing seat (3) with contact (4) on the dual-side that load bearing seat (3) is identical.
The integrated circuit package structure of a kind of high efficiency and heat radiation the most according to claim 1, it is characterised in that: described integrated electricity
Road chip (6) if upper surface on form dry contact (61), contact (61) are by the contact (4) on wire and load bearing seat (3)
It is electrically connected.
The integrated circuit package structure of a kind of high efficiency and heat radiation the most according to claim 1, it is characterised in that: described load bearing seat
(3) bottom surface of the extension board (32) of side is located in the same horizontal plane, and the bottom surface of load bearing seat (3) is less than the end of extension board (32)
Face.
The integrated circuit package structure of a kind of high efficiency and heat radiation the most according to claim 1, it is characterised in that: described metal dissipates
Some louvres (a) are all formed on the radiating frame (21) of hot plate (2) both sides and load bearing seat (3).
The integrated circuit package structure of a kind of high efficiency and heat radiation the most according to claim 1, it is characterised in that: described stitch
Or contact (4) is the most linearly evenly distributed on load bearing seat (3) or side plate (33) (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610455196.2A CN106098641B (en) | 2016-06-20 | 2016-06-20 | A kind of integrated circuit package structure of heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610455196.2A CN106098641B (en) | 2016-06-20 | 2016-06-20 | A kind of integrated circuit package structure of heat dissipation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106098641A true CN106098641A (en) | 2016-11-09 |
| CN106098641B CN106098641B (en) | 2018-09-21 |
Family
ID=57238736
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610455196.2A Active CN106098641B (en) | 2016-06-20 | 2016-06-20 | A kind of integrated circuit package structure of heat dissipation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106098641B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107993990A (en) * | 2017-12-12 | 2018-05-04 | 王孝裕 | A kind of 16 pin high-density integrated circuit package structures |
| CN108538891A (en) * | 2018-04-23 | 2018-09-14 | 北京蜃景光电科技有限公司 | Micro display device, display system and heat dissipation piece preparation method |
| CN110010568A (en) * | 2019-04-16 | 2019-07-12 | 常州信息职业技术学院 | Elcetronic package structure |
| CN110970377A (en) * | 2019-12-18 | 2020-04-07 | 冯聪 | Packaging device convenient for packaging integrated circuit chip |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4323914A (en) * | 1979-02-01 | 1982-04-06 | International Business Machines Corporation | Heat transfer structure for integrated circuit package |
| US5885853A (en) * | 1990-06-22 | 1999-03-23 | Digital Equipment Corporation | Hollow chip package and method of manufacture |
| US20010039078A1 (en) * | 1996-11-21 | 2001-11-08 | Schroen Walter H | Wafer level packaging |
| JP2004072113A (en) * | 2002-08-05 | 2004-03-04 | Texas Instruments Inc | Thermally strengthened integrated circuit package |
| CN203553132U (en) * | 2013-11-20 | 2014-04-16 | 常州唐龙电子有限公司 | Thin carrier tape-type integrated circuit package |
-
2016
- 2016-06-20 CN CN201610455196.2A patent/CN106098641B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4323914A (en) * | 1979-02-01 | 1982-04-06 | International Business Machines Corporation | Heat transfer structure for integrated circuit package |
| US5885853A (en) * | 1990-06-22 | 1999-03-23 | Digital Equipment Corporation | Hollow chip package and method of manufacture |
| US20010039078A1 (en) * | 1996-11-21 | 2001-11-08 | Schroen Walter H | Wafer level packaging |
| JP2004072113A (en) * | 2002-08-05 | 2004-03-04 | Texas Instruments Inc | Thermally strengthened integrated circuit package |
| CN203553132U (en) * | 2013-11-20 | 2014-04-16 | 常州唐龙电子有限公司 | Thin carrier tape-type integrated circuit package |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107993990A (en) * | 2017-12-12 | 2018-05-04 | 王孝裕 | A kind of 16 pin high-density integrated circuit package structures |
| CN108538891A (en) * | 2018-04-23 | 2018-09-14 | 北京蜃景光电科技有限公司 | Micro display device, display system and heat dissipation piece preparation method |
| CN110010568A (en) * | 2019-04-16 | 2019-07-12 | 常州信息职业技术学院 | Elcetronic package structure |
| CN110970377A (en) * | 2019-12-18 | 2020-04-07 | 冯聪 | Packaging device convenient for packaging integrated circuit chip |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106098641B (en) | 2018-09-21 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20180808 Address after: 315400 22 Xingshun Road, Zhongyi Ningbo ecological park, Yuyao, Ningbo, Zhejiang. Applicant after: Ningbo silicon electronics (Ningbo) Limited by Share Ltd Address before: 523000 productivity building 406, high tech Industrial Development Zone, Songshan Lake, Dongguan, Guangdong Applicant before: Dongguan Lianzhou Intellectual Property Operation Management Co.,Ltd. |
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| TA01 | Transfer of patent application right | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |