KR101958637B1 - Substrate treating apparatus and substrate treating method - Google Patents

Abstract

The present invention relates to a substrate processing apparatus and a substrate processing method. A substrate processing apparatus according to an embodiment of the present invention includes: a substrate supporting unit having a support plate having a seating surface for supporting a substrate on which an exposure process is performed; A liquid supply unit for supplying a liquid for development processing onto the substrate; And a heating unit for heating the substrate to perform a baking process.

Description

[0001] DESCRIPTION [0002] Substrate treating apparatus and substrate treating method [

The present invention relates to a substrate processing apparatus and a substrate processing method.

Various processes such as photolithography, etching, ashing, thin film deposition, and cleaning processes are performed for manufacturing semiconductor devices and flat panel display panels. Among these processes, the photolithography process sequentially performs the application, exposure, and development steps. The coating step is a step of applying a photosensitive liquid such as a resist to the surface of the substrate. The exposure process is a process for exposing a circuit pattern on a substrate having a photosensitive film formed thereon. The developing step is a step of selectively developing the exposed region of the substrate.

The developing process may include a developer supplying step, a rinsing liquid supplying step, and a drying step. The developing solution supplying step, the rinse solution supplying step, and the drying step are sequentially performed. The developing solution supplying step is a step of supplying the developing solution onto the substrate and developing the exposed area, and the rinsing solution supplying step is a step of rinsing the process by-products and residual developing solution generated by the developing solution. The drying step is a step of drying the rinsing liquid remaining on the substrate.

The present invention provides a substrate processing apparatus and a substrate processing method for efficiently processing a substrate.

The present invention also provides a substrate processing apparatus and a substrate processing method capable of performing a developing process and a baking process in one chamber.

According to an aspect of the present invention, there is provided a lithographic apparatus comprising: a substrate supporting unit having a support plate having a seating surface for supporting a substrate on which an exposure process is performed; A liquid supply unit for supplying a liquid for development processing onto the substrate; And a heating unit for heating the substrate to perform a baking process.

In addition, the seating surface may be provided in a smaller area than the substrate.

Further, the heating unit may include a first heating member positioned below the substrate supported by the substrate supporting unit.

The first heating member may include a heating plate having a shape that surrounds the periphery of the support plate; And a first heater provided on the heating plate.

The first heating member may further include a lifting member for lifting the heating plate.

Further, the heating unit may further include a second heating member positioned above the substrate supported by the substrate supporting unit.

In addition, the second heating member may heat the region located on the support plate in the substrate.

Further, a suction hole is formed in the seating surface, and the substrate supporting unit includes: a rotating shaft for rotating the supporting plate; And a vacuum member for depressurizing the adsorption holes.

According to another aspect of the present invention, there is provided a method of manufacturing a semiconductor device, A developing step of supplying a liquid for development processing to the substrate; And a baking step of heating the substrate while the substrate is placed on the support plate.

Further, the support plate may be provided with a smaller area than the substrate, and the baking step may be performed through the first heating member positioned below the substrate.

Further, in the baking step, heating of the central region of the substrate may be performed through a second heating member positioned above the substrate.

The developing step may include: supplying a processing solution for development to the substrate; Supplying a rinsing liquid to the substrate; And a drying step of heating the substrate.

According to one embodiment of the present invention, a substrate processing apparatus and a substrate processing method that can efficiently process a substrate can be provided.

Further, according to an embodiment of the present invention, a substrate processing apparatus and a substrate processing method capable of performing a developing process and a baking process in one chamber can be provided.

1 is a top view of the substrate processing apparatus.
Fig. 2 is a view of the device of Fig. 1 viewed from the direction AA.
Fig. 3 is a view of the device of Fig. 1 viewed from the BB direction. Fig.
Fig. 4 is a view of the apparatus of Fig. 1 viewed from the CC direction. Fig.
5 is a cross-sectional view showing the post-exposure process chamber.
FIG. 6 is a plan view showing the post-exposure process chamber of FIG. 5; FIG.
7 is a perspective view showing the nozzle unit of Fig.
FIG. 8 is a perspective view showing the first heating member of FIG. 5; FIG.
9 and 10 are views showing a state in which liquid is supplied to the substrate.
11 is a view showing a state in which the substrate is dried.
12 is a graph showing the rotation speed of the substrate while the liquid is supplied to the substrate and dried.
13 is a view showing a first heating member according to another embodiment.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The embodiments of the present invention can be modified in various forms, and the scope of the present invention should not be construed as being limited to the following embodiments. This embodiment is provided to more fully describe the present invention to those skilled in the art. Thus, the shape of the elements in the figures has been exaggerated to emphasize a clearer description.

The facilities of this embodiment can be used to perform a photolithography process on a substrate such as a semiconductor wafer or a flat panel display panel. In particular, the apparatus of this embodiment can be used to perform a coating process and a developing process on a substrate, which is connected to an exposure apparatus. Hereinafter, a case where a wafer is used as a substrate will be described as an example.

1 is a view of the apparatus of FIG. 1 viewed from the direction AA, FIG. 3 is a view of the apparatus of FIG. 1 viewed from a direction BB, FIG. 4 is a cross- In the CC direction.

1 to 4, the substrate processing apparatus 1 includes a load port 100, an index module 200, a first buffer module 300, a coating and developing module 400, a second buffer module 500 An exposure pre- and post-processing module 600, and an interface module 700. The load port 100, the index module 200, the first buffer module 300, the application and development module 400, the second buffer module 500, the pre-exposure processing module 600, and the interface module 700, Are sequentially arranged in one direction in a single direction.

Hereinafter, the load port 100, the index module 200, the first buffer module 300, the coating and developing module 400, the second buffer module 500, the pre-exposure processing module 600, 700 are referred to as a first direction 12 and a direction perpendicular to the first direction 12 as viewed from above is referred to as a second direction 14 and a direction in which the first direction 12 and the second And a direction perpendicular to the direction 14 is referred to as a third direction 16.

The substrate W is moved in a state accommodated in the cassette 20. At this time, the cassette 20 has a structure that can be sealed from the outside. For example, as the cassette 20, a front open unified pod (FOUP) having a door at the front can be used.

Hereinafter, the load port 100, the index module 200, the first buffer module 300, the application and development module 400, the second buffer module 500, the pre-exposure processing module 600, 700 will be described in detail.

The load port 100 has a mounting table 120 on which the cassette 20 accommodating the substrates W is placed. A plurality of mounts 120 are provided, and the mounts 200 are arranged in a line along the second direction 14. [ In Fig. 2, four placement tables 120 are provided.

The index module 200 transfers the substrate W between the cassette 20 placed on the table 120 of the load port 100 and the first buffer module 300. The index module 200 has a frame 210, an index robot 220, and a guide rail 230. The frame 210 is provided generally in the shape of an inner rectangular parallelepiped and is disposed between the load port 100 and the first buffer module 300. The frame 210 of the index module 200 may be provided at a lower height than the frame 310 of the first buffer module 300 described later. The index robot 220 and the guide rail 230 are disposed within the frame 210. The index robot 220 is moved in the first direction 12, the second direction 14 and the third direction 16 so that the hand 221 that directly handles the substrate W can be moved and rotated in the first direction 12, the second direction 14, . The index robot 220 has a hand 221, an arm 222, a support 223, and a pedestal 224. The hand 221 is fixed to the arm 222. The arm 222 is provided with a stretchable structure and a rotatable structure. The support base 223 is disposed along the third direction 16 in the longitudinal direction. The arm 222 is coupled to the support 223 to be movable along the support 223. The support 223 is fixedly coupled to the pedestal 224. The guide rails 230 are provided so that their longitudinal direction is arranged along the second direction 14. The pedestal 224 is coupled to the guide rail 230 so as to be linearly movable along the guide rail 230. Further, although not shown, the frame 210 is further provided with a door opener for opening and closing the door of the cassette 20.

The first buffer module 300 has a frame 310, a first buffer 320, a second buffer 330, a cooling chamber 350, and a first buffer robot 360. The frame 310 is provided in the shape of an inner rectangular parallelepiped and is disposed between the index module 200 and the application and development module 400. The first buffer 320, the second buffer 330, the cooling chamber 350, and the first buffer robot 360 are located within the frame 310. The cooling chamber 350, the second buffer 330, and the first buffer 320 are sequentially disposed in the third direction 16 from below. The second buffer 330 and the cooling chamber 350 are located at a height corresponding to the coating module 401 of the coating and developing module 400 described later and the coating and developing module 400 at a height corresponding to the developing module 402. [ The first buffer robot 360 is spaced apart from the second buffer 330, the cooling chamber 350 and the first buffer 320 by a predetermined distance in the second direction 14.

The first buffer 320 and the second buffer 330 temporarily store a plurality of substrates W, respectively. The second buffer 330 has a housing 331 and a plurality of supports 332. The supports 332 are disposed within the housing 331 and are provided spaced apart from each other in the third direction 16. One substrate W is placed on each support 332. The housing 331 is constructed so that the index robot 220, the first buffer robot 360 and the developing robot 482 of the developing module 402 described later mount the substrate W on the support 332 in the housing 331 (Not shown) in the direction in which the index robot 220 is provided, in the direction in which the first buffer robot 360 is provided, and in the direction in which the developing robot 482 is provided, so that the developing robot 482 can carry it in or out. The first buffer 320 has a structure substantially similar to that of the second buffer 330. The housing 321 of the first buffer 320 has an opening in a direction in which the first buffer robot 360 is provided and in a direction in which the application unit robot 432 located in the application module 401 described later is provided. The number of supports 322 provided in the first buffer 320 and the number of supports 332 provided in the second buffer 330 may be the same or different. According to one example, the number of supports 332 provided in the second buffer 330 may be greater than the number of supports 322 provided in the first buffer 320.

The first buffer robot 360 transfers the substrate W between the first buffer 320 and the second buffer 330. The first buffer robot 360 has a hand 361, an arm 362, and a support base 363. The hand 361 is fixed to the arm 362. The arm 362 is provided in a stretchable configuration so that the hand 361 is movable along the second direction 14. The arm 362 is coupled to the support 363 so as to be linearly movable along the support 363 in the third direction 16. The support base 363 has a length extending from a position corresponding to the second buffer 330 to a position corresponding to the first buffer 320. The support member 363 may be provided longer in the upward or downward direction. The first buffer robot 360 may be provided so that the hand 361 is simply driven in two directions along the second direction 14 and the third direction 16.

The cooling chamber 350 cools the substrate W, respectively. The cooling chamber 350 has a housing 351 and a cooling plate 352. The cooling plate 352 has an upper surface on which the substrate W is placed and a cooling means 353 for cooling the substrate W. [ As the cooling means 353, various methods such as cooling with cooling water and cooling using a thermoelectric element can be used. In addition, the cooling chamber 350 may be provided with a lift pin assembly (not shown) for positioning the substrate W on the cooling plate 352. The housing 351 is provided with an index robot 220 so that the developing robot 482 provided in the index robot 220 and a developing module 402 to be described later can carry the substrate W into or out of the cooling plate 352 (Not shown) in the direction provided and the direction in which the developing robot 482 is provided. Further, the cooling chamber 350 may be provided with doors (not shown) for opening and closing the above-described opening.

The application and development module 400 performs a process of applying a photoresist on the substrate W before the exposure process and a process of developing the substrate W after the exposure process. The application and development module 400 has a generally rectangular parallelepiped shape. The coating and developing module 400 has a coating module 401 and a developing module 402. The application module 401 and the development module 402 are arranged so as to be partitioned into layers with respect to each other. According to one example, the application module 401 is located on top of the development module 402.

The application module 401 includes a process of applying a photosensitive liquid such as a photoresist to the substrate W and a heat treatment process such as heating and cooling for the substrate W before and after the resist application process. The application module 401 has a resist application chamber 410, a bake chamber 420, and a transfer chamber 430. The resist application chamber 410, the bake chamber 420, and the transfer chamber 430 are sequentially disposed along the second direction 14. [ The resist application chamber 410 and the bake chamber 420 are positioned apart from each other in the second direction 14 with the transfer chamber 430 interposed therebetween. A plurality of resist coating chambers 410 are provided, and a plurality of resist coating chambers 410 are provided in the first direction 12 and the third direction 16, respectively. In the figure, six resist coating chambers 410 are provided. A plurality of bake chambers 420 are provided in the first direction 12 and the third direction 16, respectively. In the drawing, six bake chambers 420 are provided. Alternatively, however, the bake chamber 420 may be provided in a greater number.

The transfer chamber 430 is positioned in parallel with the first buffer 320 of the first buffer module 300 in the first direction 12. In the transfer chamber 430, a dispenser robot 432 and a guide rail 433 are positioned. The transfer chamber 430 has a generally rectangular shape. The applicator robot 432 is connected to the bake chambers 420, the resist application chambers 400, the first buffer 320 of the first buffer module 300, and the first buffer module 500 of the second buffer module 500 And transfers the substrate W between the cooling chambers 520. The guide rails 433 are arranged so that their longitudinal directions are parallel to the first direction 12. The guide rails 433 guide the applying robot 432 to move linearly in the first direction 12. The applicator robot 432 has a hand 434, an arm 435, a support 436, and a pedestal 437. The hand 434 is fixed to the arm 435. The arm 435 is provided in a stretchable configuration so that the hand 434 is movable in the horizontal direction. The support 436 is provided so that its longitudinal direction is disposed along the third direction 16. The arm 435 is coupled to the support 436 so as to be linearly movable in the third direction 16 along the support 436. The support 436 is fixedly coupled to the pedestal 437 and the pedestal 437 is coupled to the guide rail 433 so as to be movable along the guide rail 433.

The resist coating chambers 410 all have the same structure. However, the types of the photoresist used in each of the resist coating chambers 410 may be different from each other. As an example, a chemical amplification resist may be used as the photoresist. The resist coating chamber 410 applies a photoresist on the substrate W. [ The resist coating chamber 410 has a housing 411, a support plate 412, and a nozzle 413. The housing 411 has a cup shape with an open top. The support plate 412 is located in the housing 411 and supports the substrate W. [ The support plate 412 is rotatably provided. The nozzle 413 supplies the photoresist onto the substrate W placed on the support plate 412. The nozzle 413 has a circular tube shape and can supply photoresist to the center of the substrate W. [ Alternatively, the nozzle 413 may have a length corresponding to the diameter of the substrate W, and the discharge port of the nozzle 413 may be provided as a slit. In addition, the resist coating chamber 410 may further be provided with a nozzle 414 for supplying a cleaning liquid such as deionized water to clean the surface of the substrate W to which the photoresist is applied.

The bake chamber 420 heat-treats the substrate W. For example, the bake chambers 420 may be formed by a prebake process for heating the substrate W to a predetermined temperature to remove organic substances and moisture on the surface of the substrate W, A soft bake process is performed after coating the substrate W on the substrate W, and a cooling process for cooling the substrate W after each heating process is performed. The bake chamber 420 has a cooling plate 421 or a heating plate 422. The cooling plate 421 is provided with a cooling means 423 such as a cooling water or a thermoelectric element. The heating plate 422 is also provided with a heating means 424, such as a hot wire or a thermoelectric element. The cooling plate 421 and the heating plate 422 may be provided in a single bake chamber 420, respectively. Optionally, some of the bake chambers 420 may include only the cooling plate 421, and the other portions may include only the heating plate 422.

The development module 402 includes a development process of supplying a developer to obtain a pattern on the substrate W to remove a part of the photoresist and a heat treatment process such as heating performed on the substrate W before and after the development process do. The development module 402 has a post-exposure process chamber 800, and a transfer chamber 480. [ The post-exposure process chamber 800, and the transfer chamber 480 are sequentially disposed along the second direction 14. The post-exposure process chamber 800 can be positioned on both sides of the second direction 14 with the transfer chamber 480 therebetween. A plurality of post-exposure process chambers 800 are provided and are provided in plural in the first direction 12 and the third direction 16, respectively. In the drawing, an example in which 18 post-exposure processing chambers 800 are provided is shown.

The transfer chamber 480 is positioned in parallel with the second buffer 330 of the first buffer module 300 in the first direction 12. In the transfer chamber 480, the developing robot 482 and the guide rail 483 are positioned. The delivery chamber 480 has a generally rectangular shape. The developing robot 482 is connected to the post-exposure processing chambers 800, the second buffer 330 and the cooling chamber 350 of the first buffer module 300, and the second cooling chamber 350 of the second buffer module 500, (540). ≪ / RTI > The guide rail 483 is arranged such that its longitudinal direction is parallel to the first direction 12. The guide rail 483 guides the developing robot 482 to linearly move in the first direction 12. The developing sub-robot 482 has a hand 484, an arm 485, a supporting stand 486, and a pedestal 487. The hand 484 is fixed to the arm 485. The arm 485 is provided in a stretchable configuration to allow the hand 484 to move in a horizontal direction. The support 486 is provided so that its longitudinal direction is disposed along the third direction 16. The arm 485 is coupled to the support 486 such that it is linearly movable along the support 486 in the third direction 16. The support table 486 is fixedly coupled to the pedestal 487. The pedestal 487 is coupled to the guide rail 483 so as to be movable along the guide rail 483.

The post-exposure process chambers 800 all have the same structure. However, the types of developers used in the post-exposure process chambers 800 may be different from each other. The post-exposure process chamber 800 is provided with an apparatus for developing and baking a substrate. The post-exposure process chamber 800 removes a region of the photoresist on the substrate W where light is irradiated. At this time, the area of the protective film irradiated with the light is also removed. Depending on the type of selectively used photoresist, only the areas of the photoresist and protective film that are not irradiated with light can be removed. Thereafter, the post-exposure process chamber 800 heats the substrate to perform the baking process.

5 is a cross-sectional view showing the post-exposure process chamber, and Fig. 6 is a plan view showing the post-exposure process chamber of Fig.

5 and 6, the post-exposure process chamber 800 includes a substrate support unit 810, a processing vessel 820, a lift unit 840, a liquid supply unit 850, a heating unit 900, And a controller 890.

The substrate supporting unit 810 supports and rotates the substrate W. The substrate support unit 810 includes a support plate 812, rotation drive members 814 and 815, and a vacuum member 818. The support plate 812 supports the substrate. The support plate 812 is provided to have a circular plate shape. The support plate 812 may have a larger diameter than the bottom surface of the upper surface. The side surface connecting the upper surface and the lower surface of the support plate 812 can be oriented downwardly inclined as the center axis is approached. The upper surface of the support plate 812 is provided as a seating surface on which the substrate W is seated. The seating surface has an area smaller than that of the substrate W. The seating surface supports the central region of the substrate W. A plurality of suction holes 816 are formed on the seating surface. The suction hole 816 may be a hole 816 for depressurizing the substrate placed on the seating surface to adsorb the substrate. A vacuum member 818 is connected to the suction hole 816. According to one example, the diameter of the seating surface may be smaller than the radius of the substrate W. [ The vacuum member 818 may be a pump for depressurizing the adsorption holes 816.

The rotation drive members 814 and 815 rotate the support plate 812. The rotation drive members 814 and 815 include a rotation shaft 814 and a driver 815. The rotary shaft 814 is provided so as to have a tubular shape whose longitudinal direction faces up and down. The rotary shaft 814 is coupled to the bottom surface of the support plate 812. The driver 815 transmits the rotational force to the rotating shaft 814. The rotary shaft 814 is rotatable about the central axis by the rotational force provided from the driver 815. [ The support plate 812 is rotatable together with the rotation shaft 814. The rotating speed of the rotating shaft 814 is adjusted by a driving unit 815 so that the rotating speed of the substrate W can be adjusted. For example, the driver 815 may be a motor.

The processing vessel 820 provides a processing space in which a developing process and a bake process are performed. The processing vessel 820 recovers the liquid used in the developing process. The processing vessel 820 can also discharge fumes generated during the bake process. The processing vessel 820 is provided in the form of a cup having an open top. The processing vessel 820 includes an inner recovery cylinder 822 and an outer recovery cylinder 826. Each of the recovery cylinders 822 and 826 recovers liquids of different kinds from each other. The inner recovery cylinder 822 is provided in an annular ring shape surrounding the substrate support member 810 and the outer recovery cylinder 826 is provided in an annular ring shape surrounding the inner recovery cylinder 822. Each of the inner space 822a of the inner recovery cylinder 822 and the space 826a between the outer recovery cylinder 826 and the inner recovery cylinder 822 are respectively connected to the inner recovery cylinder 822 and the outer recovery cylinder 826, And serves as an inflow port. Recovery bins 822b and 826b extending perpendicularly to the bottom of the recovery bins 822 and 826 are connected to the recovery bins 822 and 826, respectively. Each of the recovery lines 822b and 826b separates and discharges the liquid introduced through each of the recovery cans 822 and 826. [ The discharged liquid can be reused through an external treatment liquid regeneration system (not shown).

The lift unit 840 adjusts the relative height between the processing container 820 and the substrate supporting unit 810. For example, the elevating unit 840 can move the processing vessel 820 in the vertical direction. The lifting unit 840 includes a bracket 842, a moving shaft 844, and a driver 846. The bracket 842 connects the processing vessel 820 and the moving shaft 844. The bracket 842 is fixed to the vertical wall 822 of the processing vessel 820. The moving shaft 844 is provided such that its longitudinal direction is directed up and down. The upper end of the moving shaft 844 is fixedly coupled to the bracket 842. The moving shaft 844 is moved up and down by the actuator 846 and the processing vessel 820 is movable up and down together with the moving shaft 844. [ For example, the actuator 846 may be a cylinder or a motor.

The liquid supply unit 850 supplies liquid onto the substrate W supported by the substrate holding unit 810. [ The liquid supply unit 850 includes a nozzle moving member 860, a nozzle unit 870, and a cleaning nozzle 880. The nozzle moving member 860 moves the nozzle unit 870 to the process position and the standby position. Here, the process position is a position where each nozzle unit 870 is vertically opposed to the substrate W, and a standby position is a position out of the process position. The nozzle moving member 860 linearly moves the nozzle unit 870. According to one example, the nozzle unit 870 can be moved linearly in the first direction 12.

The nozzle moving member 860 includes a guide rail 862 and a support arm 864. The guide rails 862 are located on one side of the processing vessel. The guide rails 862 are provided so as to have a longitudinal direction parallel to the moving direction of each of the nozzle units 870 and 880. For example, the longitudinal direction of the guide rail 862 may be provided so as to face the first direction 12. The support arm 864 is provided to have a bar shape. The support arms 864 are provided so as to have a longitudinal direction perpendicular to the guide rails 862 when viewed from above. for example. The longitudinal direction of the support arm 864 may be provided to face the second direction 14. A nozzle unit 870 is coupled to one end of the support arm 864. The other end of the support arm 864 is provided on the guide rail 862. Thus, the support arm 864 and the nozzle unit 870 are movable together along the lengthwise direction of the guide rail 862.

7 is a perspective view showing the nozzle unit of Fig.

7, the nozzle unit 870 includes a body 872, a rinse nozzle 874, a first treatment nozzle 876, and a second treatment nozzle 878. [ The nozzle unit 870 discharges the treatment liquid and the rinse liquid.

The body 872 supports a rinse nozzle 874, a first process nozzle 876, and a second process nozzle 878. The body 872 is fixedly coupled to the bottom surface of one end of the support arm 864. A rinse nozzle 874, a first processing nozzle 876, and a second processing nozzle 878 are fixedly coupled to the bottom surface of the body 872, respectively.

The rinse nozzle 874 discharges the wetting liquid in a streaming manner. The rinse nozzle 874 is positioned adjacent to the first treatment nozzle 876 and the second treatment nozzle 878. [ The rinse nozzle 874 and the first process nozzle 878 may be arranged along the first direction 12 when viewed from above. The rinse nozzle 874 has a circular stream outlet. The stream discharge port is provided so as to face in the vertical downward direction. For example, the rinse liquid may be pure water (DIW).

The first treatment nozzle 876 discharges the treatment liquid in a stream manner. The first processing nozzle 876 has a circular stream discharge port. The stream discharge port is provided so as to face in the vertical downward direction.

The second processing nozzle 878 discharges the processing liquid in a liquid curtain system. The second treatment nozzle 878 has a slit-shaped slit discharge port. The slit discharge port has a longitudinal direction parallel to the guide rail 862. The slit discharge port may have a longitudinal direction toward the first direction (12). The slit discharge port is provided so as to face downward inclined direction. The second treatment nozzle 878 may be provided with a downward slope so as to discharge the liquid at the same point as the first treatment nozzle 876. [ The slit discharge port is provided so as to have a length shorter than the radius of the substrate (W). According to one example, the slit discharge port may be provided so as to be directed in a downward inclined direction from the second processing nozzle 878 toward the first processing nozzle 876. [ The second processing nozzle 878 is located at one side of the first processing nozzle 876. The second treatment nozzle 878 is positioned opposite to the first treatment nozzle 876. [ The second treatment nozzle 878 and the first treatment nozzle 876 may be arranged along the second direction 14 as viewed from above. For example, the treatment liquid discharged by the second treatment nozzle 878 and the first treatment nozzle 876 may be the same kind of liquid. The treatment liquid may be a developer.

The heating unit 900 heats the substrate W. The heating unit 900 includes a first heating member 910 and a second heating member (930 in Fig. 11).

FIG. 8 is a perspective view showing the first heating member of FIG. 5; FIG.

Referring to FIG. 8, the first heating member 910 includes a heating plate 912, a first heater 914, and an elevating member 916.

The first heating member 910 heats the first area A of the substrate W. [ According to one example, the first region A may be an edge region. The first region A may be a region that does not correspond to the seating surface. The first heating member 910 is positioned below the substrate W.

The heating plate 912 is provided in an annular ring shape surrounding the support plate 812. The heating plate 912 may have the same outer diameter as the substrate W or may be provided larger than the outer diameter. The heating plate 912 may have an inner diameter equal to or greater than the bottom diameter of the support plate 812. A first heater 914 is provided in the heating plate 912. The first heater 914, like the heating plate 912, is provided to have an annular ring shape. The heating plate 912 is vertically opposed to the first area A of the substrate W. [ That is, the heating plate 912 heats the first region A under the substrate W. [

The elevating member 916 adjusts the relative height between the heating plate 912 and the substrate W. The elevating member 916 lifts one of the heating plate 912 and the supporting plate 812. In the present embodiment, it is assumed that the elevating member 916 moves the heating plate 912 up and down. The elevating member 916 moves the heating plate 912 and the support plate 812 so as to have a first gap D1 or a second gap D2. Here, the second interval D2 is defined as a smaller interval than the first interval D1. According to one example, the heating plate 912 and the substrate W may be moved to the first position to have the first distance D1 and to the second position to have the second distance D2. The second position may be a position adjacent to the substrate W so that the first heater 914 heats the substrate W. [ For example, the elevating member 916 may be one or a plurality of cylinders.

The cleaning nozzle 880 supplies the cleaning liquid to the bottom surface of the substrate W. [ The cleaning nozzle 880 is movable up and down by the elevating member 916 of the heating unit 900. The cleaning nozzle 880 is provided on the upper surface of the heating plate 912 of the heating unit 900. The discharge port of the cleaning nozzle 880 is provided so as to be vertically upward. The cleaning nozzle 880 supplies the cleaning liquid to the bottom edge region of the substrate W. [ For example, the cleaning liquid may be the same liquid as the rinse liquid. The cleaning liquid may be pure water (DIW). Alternatively, the discharge port of the cleaning nozzle 880 may be provided to face upward.

The second heating member 930 heats the second region B of the substrate W different from the first region A. [ According to one example, the second region B may be a central region. The second region B may be a region corresponding to the seating surface. The second heating member 930 is positioned above the substrate W. The second heating member 930 includes a second heater 932 and a moving member 934. The second heater 932 may have a shape corresponding to the support plate 812. The second heater 932 has a diameter equal to or smaller than the seating surface of the support plate 812. For example, the second heating member 930 may have the same temperature as the first heating member 910. If the first region A of the substrate W is a part of the entire region, the second region B may be the remainder.

The movable member 934 moves the second heater 932 to the heating position and the standby position. The movable member 934 may be provided in the form of an arm. The shifting member 934 supports the second heater 932. The movable member 934 is swingable by a driving member (not shown). The movable member 934 moves the second heater 932 to a heating position opposed to the substrate W and to a standby position outside the heating position. Here, the heating position is a position where the second heater 932 heats the second region B of the substrate W, and the standby position is a position deviated from the vertical upper side of the substrate W. The heating position is a position in which the second heater 932 and the second region B are opposed to each other in the vertical direction. The gap D3 between the second heater 932 and the second region B at the heating position may be the same as the second gap D2. Accordingly, the first region A and the second region B can be heated to the same temperature.

The controller 890 controls the configuration of the post-exposure processing chamber 800. The controller 890 controls the liquid supply unit 850 so that the process liquid and the rinsing liquid are sequentially supplied onto the substrate W. The controller 890 controls the cleaning liquid to be supplied to the bottom surface of the substrate W while the processing liquid and the rinse liquid are being supplied onto the substrate W. [ When the supply of the rinse liquid is completed, the controller 890 stops the liquid supplied to the substrate W, and performs the drying process of the substrate W. According to an example, the substrate W is rotated at the processing speed V1 while the processing liquid is supplied onto the substrate W, and the substrate W is rotated at the rinsing speed V2 during the supply of the rinsing liquid , And in the drying step, the substrate W is rotated at a drying speed (V3). The drying speed V3 may be slower than the processing speed V1 and the rinsing speed V2.

Fig. 12 is a graph showing the rotation speed of the substrate while the liquid is supplied to the substrate and dried. Fig. 9 is a view showing a state where the liquid is supplied to the substrate, Fig. to be.

Referring to Figs. 9 and 12, a method of treating the substrate W includes a liquid supply step and a drying step (S30). The liquid supply step includes a process liquid supply step (S10) and a rinsing liquid supply step (S20). The process liquid supply step (S10), the rinsing liquid supply step (S20), and the drying step (S30) proceed sequentially. When the process liquid supply step (S10) proceeds, the substrate W is rotated at the processing speed V1, and the process liquid is supplied to the upper surface of the substrate W. The cleaning liquid is supplied to the bottom surface of the substrate W at the first position where the heating plate 912 and the substrate W have the first interval D1. The cleaning liquid may be a liquid heated by the first heater 914. The cleaning liquid can clean the bottom surface of the substrate W and adjust the temperature of the substrate W to the process temperature. When the process liquid supply step (S10) is completed, the supply of the process liquid is stopped.

When the rinsing liquid supply step (S20) is started, the substrate W is rotated at the rinsing speed (V2), and the rinsing liquid is supplied to the upper surface of the substrate W. The rinsing liquid rinses the treatment liquid remaining on the substrate W. A cleaning liquid is supplied to the bottom surface of the substrate W. The cleaning liquid may be a liquid heated by the first heater 914. The cleaning liquid is supplied to the bottom surface of the substrate W at the first position where the heating plate 912 and the substrate W have the first interval D1. The rinse speed V2 may be faster than the processing speed V1. When the rinsing liquid supply step (S20) is completed, the supply of the rinsing liquid and the rinsing liquid is stopped. The treatment liquid is recovered in the outer recovery tank 826, and the rinsing liquid can be recovered in the inner recovery tank 822.

When the drying step S30 is performed, the substrate W is rotated at the drying speed V3. The heating plate 912 is moved to the first position so as to have the first gap D1 with the substrate W and the second heater 932 is moved to the heating position. The first heater 914 heats the first area A of the substrate W and the second heater 932 heats the second area B of the substrate W. The first heating member 910 and the second heating member 930 heat each region at the same temperature. The gap between the second heater 932 and the second region B may be the same as the second gap D2. The drying speed (V3) may be less than 20 RPM.

Alternatively, the operator can heat the first region A and the second region B to different temperatures by adjusting the second gap D2.

In the above-described embodiment, the substrate W is rotated more slowly in the drying step S30 than in the process liquid supply step S10 and the rinsing liquid supply step S20. Accordingly, the pattern formed on the substrate W during the process of evaporating the rinsing liquid can be reduced. The first region A of the substrate W is heated by the first heating member 910 and the second region B of the substrate W is heated by the second heating member 930. [ As a result, the drying efficiency of the substrate W can be improved.

When the drying step S30 is completed, a baking step is performed.

When the bake process is started, the heating plate 912 heats the bottom surface of the substrate W. The distance between the heating plate 912 and the substrate W may be the same as the second distance D2. Further, the distance between the heating plate 912 and the substrate W may be shorter than the second distance D2. At this time, the substrate W may be in a stopped or rotated state. When the substrate W is rotated, the speed at which the substrate W is rotated may be equal to or less than the drying speed V3.

The heating plate 912 can heat the substrate W in contact with the bottom surface of the substrate W when the substrate W is provided in a stationary state.

The second heating member 930 may perform a bake process on the central region of the substrate W in a manner similar to the drying step S30. When the distance between the heating plate 912 and the substrate W is different from the second distance D2, the heating temperature of the second heating member 930 is higher than the drying step S30 The substrate can be heated.

In addition, the post-exposure processing chamber 800 can perform the post-baking process in a manner similar to the baking process after the drying step or the developing process, before the developing process with the treating liquid is performed.

13 is a view showing a first heating member according to another embodiment.

Referring to FIG. 13, a plurality of heating plates 912 may be provided. The heating plate 911 has a arc shape and can be arranged along the circumferential direction of the support plate 812. [ The heating plates 911 may be combined with each other to have an annular ring shape. Each of the heating plates 911 may be provided with a first heater 914. The respective heating plates 911 can be simultaneously moved up and down by the elevating member 916. [

2 to 5, the second buffer module 500 is provided as a path through which the substrate W is transferred between the coating and developing module 400 and the pre- and post-exposure processing module 600. The second buffer module 500 performs a predetermined process on the substrate W such as a cooling process or an edge exposure process. The second buffer module 500 includes a frame 510, a buffer 520, a first cooling chamber 530, a second cooling chamber 540, an edge exposure chamber 550, and a second buffer robot 560 I have. The frame 510 has a rectangular parallelepiped shape. The buffer 520, the first cooling chamber 530, the second cooling chamber 540, the edge exposure chamber 550, and the second buffer robot 560 are located within the frame 510. The buffer 520, the first cooling chamber 530, and the edge exposure chamber 550 are disposed at a height corresponding to the application module 401. The second cooling chamber 540 is disposed at a height corresponding to the development module 402. The buffer 520, the first cooling chamber 530, and the second cooling chamber 540 are sequentially arranged in a row along the third direction 16. The buffer 520 is disposed along the first direction 12 with the transfer chamber 430 of the application module 401. [ The edge exposure chamber 550 is spaced a certain distance in the second direction 14 from the buffer 520 or the first cooling chamber 530.

The second buffer robot 560 carries the substrate W between the buffer 520, the first cooling chamber 530, and the edge exposure chamber 550. A second buffer robot 560 is positioned between the edge exposure chamber 550 and the buffer 520. The second buffer robot 560 may be provided in a structure similar to that of the first buffer robot 360. The first cooling chamber 530 and the edge exposure chamber 550 perform a subsequent process on the substrates W that have been processed in the application module 401. The first cooling chamber 530 cools the substrate W processed in the application module 401. The first cooling chamber 530 has a structure similar to the cooling chamber 350 of the first buffer module 300. The edge exposure chamber 550 exposes its edge to the substrates W that have undergone the cooling process in the first cooling chamber 530. [ The buffer 520 temporarily stores the substrate W before the substrates W processed in the edge exposure chamber 550 are transported to a preprocessing module 601 described later. The second cooling chamber 540 cools the substrates W before the processed substrates W are transferred to the developing module 402 in the post-processing module 602 described later. The second buffer module 500 may further have a buffer added to the height corresponding to the development module 402. In this case, the substrates W processed in the post-processing module 602 may be temporarily stored in the added buffer and then conveyed to the developing module 402.

The pre- and post-exposure processing module 600 can process a process of applying a protective film for protecting the photoresist film applied to the substrate W during liquid immersion exposure when the exposure apparatus 1000 performs the liquid immersion exposure process. In addition, the pre- and post-exposure processing module 600 may perform a process of cleaning the substrate W after exposure. In addition, when the coating process is performed using the chemically amplified resist, the pre- and post-exposure processing module 600 can process the post-exposure bake process.

The pre-exposure post-processing module 600 has a pre-processing module 601 and a post-processing module 602. The pre-processing module 601 performs a process of processing the substrate W before the exposure process, and the post-process module 602 performs a process of processing the substrate W after the exposure process. The pre-processing module 601 and the post-processing module 602 are arranged so as to be partitioned into layers with respect to each other. According to one example, the preprocessing module 601 is located on top of the post-processing module 602. The preprocessing module 601 is provided at the same height as the application module 401. The post-processing module 602 is provided at the same height as the developing module 402. The pretreatment module 601 has a protective film application chamber 610, a bake chamber 620, and a transfer chamber 630. The protective film application chamber 610, the transfer chamber 630, and the bake chamber 620 are sequentially disposed along the second direction 14. The protective film application chamber 610 and the bake chamber 620 are positioned apart from each other in the second direction 14 with the transfer chamber 630 therebetween. A plurality of protective film application chambers 610 are provided and are arranged along the third direction 16 to form layers. Alternatively, a plurality of protective film application chambers 610 may be provided in the first direction 12 and the third direction 16, respectively. A plurality of bake chambers 620 are provided and are disposed along the third direction 16 to form layers. Alternatively, a plurality of bake chambers 620 may be provided in the first direction 12 and the third direction 16, respectively.

The transfer chamber 630 is positioned in parallel with the first cooling chamber 530 of the second buffer module 500 in the first direction 12. In the transfer chamber 630, a pre-processing robot 632 is located. The transfer chamber 630 has a generally square or rectangular shape. The preprocessing robot 632 is connected between the protective film application chambers 610, the bake chambers 620, the buffer 520 of the second buffer module 500 and the first buffer 720 of the interface module 700, The substrate W is transferred. The preprocessing robot 632 has a hand 633, an arm 634, and a support 635. The hand 633 is fixed to the arm 634. The arm 634 is provided with a retractable structure and a rotatable structure. The arm 634 is coupled to the support 635 so as to be linearly movable along the support 635 in the third direction 16.

The protective film applying chamber 610 applies a protective film for protecting the resist film on the substrate W during liquid immersion exposure. The protective film application chamber 610 has a housing 611, a support plate 612, and a nozzle 613. The housing 611 has a cup shape with its top opened. The support plate 612 is located in the housing 611 and supports the substrate W. [ The support plate 612 is rotatably provided. The nozzle 613 supplies a protective liquid for forming a protective film onto the substrate W placed on the supporting plate 612. The nozzle 613 has a circular tube shape and can supply the protective liquid to the center of the substrate W. [ Alternatively, the nozzle 613 may have a length corresponding to the diameter of the substrate W, and the discharge port of the nozzle 613 may be provided with a slit. In this case, the support plate 612 may be provided in a fixed state. The protective liquid includes a foamable material. The protective liquid may be a photoresist and a material having a low affinity for water. For example, the protective liquid may contain a fluorine-based solvent. The protective film application chamber 610 supplies the protective liquid to the central region of the substrate W while rotating the substrate W placed on the support plate 612.

The bake chamber 620 heat-treats the substrate W coated with the protective film. The bake chamber 620 has a cooling plate 621 or a heating plate 622. The cooling plate 621 is provided with a cooling means 623 such as a cooling water or a thermoelectric element. Or heating plate 622 is provided with a heating means 624, such as a hot wire or a thermoelectric element. The heating plate 622 and the cooling plate 621 may be provided in a single bake chamber 620, respectively. Optionally, some of the bake chambers 620 may have only the heating plate 622, while others may only have the cooling plate 621.

The post-processing module 602 has a cleaning chamber 660, a post-exposure bake chamber 670, and a delivery chamber 680. The cleaning chamber 660, the transfer chamber 680, and the post-exposure bake chamber 670 are sequentially disposed along the second direction 14. Accordingly, the cleaning chamber 660 and the post-exposure baking chamber 670 are positioned apart from each other in the second direction 14 with the transfer chamber 680 therebetween. A plurality of cleaning chambers 660 are provided and may be disposed along the third direction 16 to form layers. Alternatively, a plurality of cleaning chambers 660 may be provided in the first direction 12 and the third direction 16, respectively. A plurality of post-exposure bake chambers 670 are provided and may be disposed along the third direction 16 to form layers. Alternatively, a plurality of post-exposure bake chambers 670 may be provided in the first direction 12 and the third direction 16, respectively.

The transfer chamber 680 is positioned in parallel with the second cooling chamber 540 of the second buffer module 500 in the first direction 12 as viewed from above. The transfer chamber 680 has a generally square or rectangular shape. A post processing robot 682 is located in the transfer chamber 680. The post-processing robot 682 is connected to the cleaning chambers 660, post-exposure bake chambers 670, the second cooling chamber 540 of the second buffer module 500, and the second And transfers the substrate W between the buffers 730. The postprocessing robot 682 provided in the postprocessing module 602 may be provided with the same structure as the preprocessing robot 632 provided in the preprocessing module 601. [

The cleaning chamber 660 cleans the substrate W after the exposure process. The cleaning chamber 660 has a housing 661, a support plate 662, and a nozzle 663. The housing 661 has a cup shape with an open top. The support plate 662 is located in the housing 661 and supports the substrate W. [ The support plate 662 is rotatably provided. The nozzle 663 supplies the cleaning liquid onto the substrate W placed on the support plate 662. As the cleaning liquid, water such as deionized water may be used. The cleaning chamber 660 supplies the cleaning liquid to the central region of the substrate W while rotating the substrate W placed on the support plate 662. Optionally, while the substrate W is rotating, the nozzle 663 may move linearly or rotationally from the central region of the substrate W to the edge region.

The post-exposure bake chamber 670 heats the substrate W subjected to the exposure process using deep UV light. The post-exposure baking step heats the substrate W and amplifies the acid generated in the photoresist by exposure to complete the property change of the photoresist. The post-exposure bake chamber 670 has a heating plate 672. The heating plate 672 is provided with a heating means 674 such as a hot wire or a thermoelectric element. The post-exposure bake chamber 670 may further include a cooling plate 671 therein. The cooling plate 671 is provided with a cooling means 673 such as a cooling water or a thermoelectric element. Further, a bake chamber having only the cooling plate 671 may be further provided.

As described above, the pre-processing module 601 and the post-processing module 602 in the pre-exposure processing module 600 are provided to be completely separated from each other. The transfer chamber 630 of the preprocessing module 601 and the transfer chamber 680 of the postprocessing module 602 are provided in the same size and can be provided so as to completely overlap each other when viewed from above. Further, the protective film application chamber 610 and the cleaning chamber 660 may be provided to have the same size as each other and be provided so as to completely overlap with each other when viewed from above. Further, the bake chamber 620 and the post-exposure bake chamber 670 are provided in the same size, and can be provided so as to completely overlap each other when viewed from above.

The interface module 700 transfers the substrate W between the exposure pre- and post-processing module 600 and the exposure apparatus 1000. The interface module 700 has a frame 710, a first buffer 720, a second buffer 730, and an interface robot 740. The first buffer 720, the second buffer 730, and the interface robot 740 are located within the frame 710. The first buffer 720 and the second buffer 730 are spaced apart from each other by a predetermined distance and are stacked on each other. The first buffer 720 is disposed higher than the second buffer 730. The first buffer 720 is positioned at a height corresponding to the preprocessing module 601 and the second buffer 730 is positioned at a height corresponding to the postprocessing module 602. The first buffer 720 is arranged in a line along the first direction 12 with the transfer chamber 630 of the preprocessing module 601 while the second buffer 730 is arranged in the postprocessing module 602, Are arranged in a line along the first direction 12 with the transfer chamber 630 of the transfer chamber 630. [

The interface robot 740 is spaced apart from the first buffer 720 and the second buffer 730 in the second direction 14. The interface robot 740 carries the substrate W between the first buffer 720, the second buffer 730 and the exposure apparatus 1000. The interface robot 740 has a structure substantially similar to that of the second buffer robot 560.

The first buffer 720 temporarily stores the substrates W processed in the preprocessing module 601 before they are transferred to the exposure apparatus 1000. The second buffer 730 temporarily stores the processed substrates W in the exposure apparatus 1000 before they are transferred to the post-processing module 602. The first buffer 720 has a housing 721 and a plurality of supports 722. The supports 722 are disposed within the housing 721 and are provided spaced apart from each other in the third direction 16. One substrate W is placed on each support 722. The housing 721 is movable in the direction in which the interface robot 740 is provided and in the direction in which the interface robot 740 and the preprocessing robot 632 transfer the substrate W to and from the support table 722, 632 are provided with openings (not shown) in the direction in which they are provided. The second buffer 730 has a structure substantially similar to that of the first buffer 720. However, the housing 731 of the second buffer 730 has an opening (not shown) in the direction in which the interface robot 740 is provided and in a direction in which the postprocessing robot 682 is provided. Only the buffers and robots can be provided as described above without providing a chamber for performing a predetermined process on the substrate W in the interface module.

The foregoing detailed description is illustrative of the present invention. In addition, the foregoing is intended to illustrate and explain the preferred embodiments of the present invention, and the present invention may be used in various other combinations, modifications, and environments. That is, it is possible to make changes or modifications within the scope of the concept of the invention disclosed in this specification, within the scope of the disclosure, and / or within the skill and knowledge of the art. The embodiments described herein are intended to illustrate the best mode for implementing the technical idea of the present invention and various modifications required for specific applications and uses of the present invention are also possible. Accordingly, the detailed description of the invention is not intended to limit the invention to the disclosed embodiments. It is also to be understood that the appended claims are intended to cover such other embodiments.

100: Load port 200: Index module
300: first buffer module 400: application and development module
500: second buffer module 600: pre-exposure processing module
700: Interface module

Claims (18)

A substrate supporting unit having a supporting plate on which an upper surface is provided with a seating surface for supporting a substrate on which an exposure process has been performed;
A liquid supply unit for supplying a liquid for development processing onto the substrate; And
A heating unit for heating the substrate to perform a baking process;
A controller,
The controller controls the liquid supply unit and the heating unit so that the heating unit performs the baking process after the liquid supply unit supplies the liquid to the substrate and performs the developing process,
Wherein the seating surface is provided in a smaller area than the substrate,
The heating unit includes:
A first heating member positioned below the substrate supported by the substrate supporting unit;
Further comprising a second heating member positioned above the substrate supported by the substrate support unit,
And the second heating member heats an area of the substrate located on the support plate. delete delete The method according to claim 1,
Wherein the first heating member comprises:
A heating plate having a shape to surround the periphery of the support plate;
And a first heater provided on the heating plate. 5. The method of claim 4,
Wherein the first heating member comprises:
And a lifting member for lifting the heating plate. delete delete The method according to claim 1,
A suction hole is formed on the seating surface,
Wherein the substrate supporting unit comprises:
A rotating shaft for rotating the support plate;
And a vacuum member for depressurizing the adsorption holes. Placing the substrate on which the exposure process has been performed on a support plate;
A developing step of supplying a liquid for development processing to the substrate after the step of positioning the substrate on the support plate; And
And a baking step of heating the substrate in a state in which the substrate is placed on the support plate after the developing step,
Wherein the support plate is provided in a smaller area than the substrate,
Wherein the baking step is performed through a first heating member positioned below the substrate,
The heating of the central region of the substrate in the baking step is performed through a second heating member positioned above the substrate,
And the second heating member heats an area of the substrate located on the support plate. delete delete 10. The method of claim 9,
In the developing step,
Supplying a processing solution for development to the substrate;
Supplying a rinsing liquid to the substrate; And
And a drying step of heating the substrate. 6. The method of claim 5,
The elevating member
Wherein a relative height between the heating plate and the support plate is adjusted at a first interval in the developing process and at a second interval in the baking process,
Wherein the second gap is smaller than the first gap. 10. The method of claim 9,
The method comprises:
Wherein the developing step adjusts the support plate and the first heating member at a first interval, and the baking step adjusts the support plate and the first heating member at a second interval,
Wherein the second gap is smaller than the first gap. An apparatus for processing a substrate,
A coating and developing module for performing a coating and developing process on a substrate;
And an interface module for connecting the coating and developing module to an external exposure apparatus,
Wherein the coating and developing module comprises:
An application module;
And a developing module laminated with the application module,
The coating module includes an application chamber for performing the application process so as to perform a coating process of applying a photosensitive liquid to a substrate and a heat treatment process for heating the substrate before or after the application process in different chambers and a bake chamber Respectively,
Wherein the development module includes a post-exposure process chamber for performing the development process and the heat treatment process so that a development process for developing a substrate by supplying a developer to a substrate, and a heat treatment process for heating the substrate before or after the development process are performed in the same chamber, Is provided,
The post-exposure processing chamber includes:
A substrate supporting unit having a supporting plate on which an upper surface is provided with a seating surface for supporting a substrate on which an exposure process has been performed;
A liquid supply unit for supplying a liquid for development processing onto the substrate;
A heating unit for heating the substrate to perform a baking process;
A controller,
The controller controls the liquid supply unit and the heating unit so that the heating unit performs the baking process after the liquid supply unit supplies the liquid to the substrate and performs the developing process,
Wherein the seating surface is provided in a smaller area than the substrate,
The heating unit includes:
A first heating member positioned below the substrate supported by the substrate supporting unit;
Further comprising a second heating member positioned above the substrate supported by the substrate support unit,
And the second heating member heats an area of the substrate located on the support plate. delete 16. The method of claim 15,
Wherein the first heating member comprises:
A heating plate having a shape to surround the periphery of the support plate;
A first heater provided on the heating plate;
And a lifting member for lifting the heating plate. 18. The method of claim 17,
The elevating member
Wherein a relative height between the heating plate and the support plate is adjusted at a first interval in the developing process and at a second interval in the baking process,
Wherein the second gap is smaller than the first gap.

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