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KR101940369B1 - Pick-up tool for transferring semiconductor die - Google Patents

Pick-up tool for transferring semiconductor die Download PDF

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Publication number
KR101940369B1
KR101940369B1 KR1020150178572A KR20150178572A KR101940369B1 KR 101940369 B1 KR101940369 B1 KR 101940369B1 KR 1020150178572 A KR1020150178572 A KR 1020150178572A KR 20150178572 A KR20150178572 A KR 20150178572A KR 101940369 B1 KR101940369 B1 KR 101940369B1
Authority
KR
South Korea
Prior art keywords
collet
holder
groove
pick
coupling groove
Prior art date
Application number
KR1020150178572A
Other languages
Korean (ko)
Other versions
KR20170070720A (en
Inventor
김재목
Original Assignee
에스케이하이닉스 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 에스케이하이닉스 주식회사 filed Critical 에스케이하이닉스 주식회사
Priority to KR1020150178572A priority Critical patent/KR101940369B1/en
Publication of KR20170070720A publication Critical patent/KR20170070720A/en
Application granted granted Critical
Publication of KR101940369B1 publication Critical patent/KR101940369B1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/799—Apparatus for disconnecting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B65G2249/045—Details of suction cups suction cups

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The present technology discloses a pick-up tool for picking up and transporting individual die (DIE) through a sawing process in a semiconductor package manufacturing process. The pick-up tool for semiconductor die transfer according to the present invention has a collet holder with a shank protruding from its upper portion and a collet holder formed at its bottom with an engaging groove for engaging the collet. The rear surface and both side surfaces of the engaging groove are surrounded by wall surfaces of constant height On the other hand, the front surface may be opened without forming a wall surface, and a separation groove may be formed in the wall surface formed on the rear surface to push the collet fitted in the coupling groove out of the coupling groove.

Description

PICK-UP TOOL FOR TRANSFERRING SEMICONDUCTOR DIE [0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pick-up tool for picking up and transporting individual die (DIE) through a sawing process in the manufacture of a semiconductor package, Up and down directions of the collet holder, and a collet can be detachably attached to the collet holder in the horizontal and vertical directions.

In general, a process of attaching an individual chip (or "die") to a substrate such as a lead frame or a printed circuit board (PCB) using an epoxy adhesive is a chip attaching process do. In order to perform such a chip attaching step, a step of cutting and separating the wafer into individual chip units must be preceded.

As described above, in the semiconductor chip package process, the wafer on which a plurality of chips are formed is cut into individual chip units, and the individual chips that have been cut are picked up for attaching the individual chips to the package body, A transferring process is required. At this time, the semiconductor chip transfer device for picking up and transferring the semiconductor chip from the wafer by a vacuum adsorption method is called a pick-up tool.

The pick-up tool generally has a vacuum valve with a holder vacuum hole, a collet holder connected to the lower end of the vacuum valve and exposed to the holder vacuum hole at the bottom, and a vacuum adsorption hole communicating with the vacuum hole of the collet holder, And a collet which is inserted and sealed in the coupling groove.

In these pick-up tools, collet holders are used semi-permanently, but collets are replaced periodically.

However, when the collet is hermetically coupled to the coupling groove formed on the bottom surface of the collet holder, the collet can be detached and attached only vertically (up and down) when the collet is detached and attached.

The present invention seeks to provide a pick-up tool that allows an operator to easily attach the collet to the collet holder and easily separate it from the collet holder.

A pick-up tool for semiconductor die transfer according to an embodiment of the present invention is a pick-up tool for semiconductor die transfer having a collet holder in which a shank is projected on an upper portion and a collet is fitted on a bottom portion thereof, Wherein the first and second side surfaces are surrounded by wall surfaces of a predetermined height, the front surface is opened without forming a wall surface, and the wall surface formed on the rear surface is provided with a separating groove capable of pushing the collet, .

The pick-up tool for semiconductor die transfer according to an embodiment of the present invention allows the operator to easily attach the collet to the collet holder and easily separate it from the collet holder.

1 is a plan view of a collet holder in a pick-up tool according to an embodiment of the present invention;
FIG. 2 is an exploded front view showing a collet holder and a collet separated from each other in a pick-up tool according to an embodiment of the present invention; FIG.
3 is an exploded rear view showing a collet holder and a collet separated from each other in a pickup tool according to an embodiment of the present invention;
FIG. 4 is an exploded side view showing a collet holder and a collet separated from each other in a pick-up tool according to an embodiment of the present invention; FIG.
5A is a view showing a state in which a collet is attached to a collet holder in a vertical direction;
5B is a view showing a state in which the collet is attached to the collet holder in the horizontal direction;
5c is a view showing a state in which a collet is attached to a collet holder in an oblique direction;

Hereinafter, some embodiments of the present invention will be described in detail with reference to exemplary drawings. It should be noted that, in adding reference numerals to the constituent elements of the drawings, the same constituent elements are denoted by the same reference symbols as possible even if they are shown in different drawings. In the following description of the embodiments of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the difference that the embodiments of the present invention are not conclusive.

FIG. 1 is a plan view of a collet holder in a pick-up tool according to an embodiment of the present invention. FIGS. 2 to 4 are perspective views showing a collet holder and a collet separated from each other in a pickup tool according to an embodiment of the present invention, A rear view, and a side view of the separation.

The pick-up tool according to the present embodiment includes a collet holder 10 and a collet 20.

The collet holder 10 is mounted on a transfer means for transferring a die on a wafer, and a shank 11 protruding from the upper side is mounted on the transfer means. A holder vacuum hole 12 for receiving a vacuum suction force from the conveying means is formed in the shank 11. The holder vacuum hole 12 is exposed to the bottom surface 13 of the collet holder 10. At the bottom of the collet holder 10, an engaging groove 14, which is a space into which the collet 20 is fitted, is formed. At this time, the coupling groove 14 may have a rectangular shape on the bottom surface to which the collet 20 is attached.

Particularly, in the present embodiment, the coupling groove 14 into which the collet 20 is fitted is formed with a wall surface formed in a "C" shape, i.e., a rear surface and both side surfaces of the coupling groove 14, 14 has a wall surface structure in which a wall surface is not formed and is completely opened. A separation groove 18 is formed at the center of the rear surface 17 opposed to the opened front surface.

For example, when the bottom surface of the engaging groove 14 has a rectangular shape, the conventional engaging groove 14 has a structure in which the engaging groove 14 is surrounded by four wall surfaces protruding from the edges of four sides surrounding the bottom surface 13 Respectively. However, in the present embodiment, among the four wall surfaces, the front surface of the coupling groove 14 is opened without forming a wall surface, and wall surfaces are formed only on the rear surface and both side surfaces, thereby forming a " C " Further, a separation groove 18 is formed in the rear surface 17 of the coupling groove 14. At this time, the back surface 17 is not formed integrally with the collet holder 10, but may be formed in a form in which a separately manufactured plate is attached.

At this time, the separation groove 18 is a groove formed so that an operator can push the collet 20 fitted into the coupling groove 14 with a finger to remove the collet 20. The operator pushes the collet 20 into the engaging groove 14 by pushing the finger into the separating groove 18 when separating the collet 20 fitted into the engaging groove 14 from the collet holder 10, The collet 20 can be easily separated from the collet holder 10 by pushing the collet 20 toward the front side of the collet holder 10.

In this embodiment, when the collet 20 is fitted into the engaging groove 14 by opening the front surface of the engaging groove 14, the operator moves the collet 20 in the vertical direction as well as in the horizontal direction, (14). Further, even if the collet 20 is fitted in the engaging groove 14 in the oblique direction, the collet 20 can be inserted into the engaging groove 14 more easily and stably.

In FIGS. 2 and 3, only the case where the separation groove 18 is formed in a semicircular shape is shown, but the shape is not limited to the semicircular shape.

Since the magnets 15 and 16 are formed inside the collet holder 10 so that the collet 20 can be more easily fitted and attached to the coupling groove 14 by the magnetic forces of the magnets 15 and 16 So that the collet 20 fitted with the fitting 20 can be more stably fixed to the coupling groove 14 to maintain the horizontal state.

Particularly, in this embodiment, not only the magnet 15 is formed inside the bottom surface 13 of the collet holder 13, but also the collet 16 is formed by forming the magnet 16 inside the rear surface 17 10 to be engaged with the engaging groove 14 in the horizontal direction, the collet 10 can be completely engaged with the engaging groove 14. That is, when only the magnet 15 is formed in the upper surface of the coupling groove 14, when the collet 10 is slidably inserted into the coupling groove 14 through the front surface of the coupling groove 14, The collet 10 may not reach the rear face 17 of the engaging groove 14 due to the magnetic force of the collet 10. Therefore, by forming the magnet 16 in the rear face 17 of the coupling groove 14, the collet 10 is completely brought into close contact with the rear face 17 by the magnetic force of the magnet 16 formed on the rear face 17 To be intertwined. In addition, the collet 20 to be fitted together can be more stably fixed by being subjected to magnetic forces from the top and rear sides by the magnets 15 and 16.

Two magnets may be arranged symmetrically on the right and left sides of the holder vacuum hole 12 and two magnets may be disposed on the left and right sides of the separation groove 18 symmetrically with respect to the magnet 16 .

The collet 20 has a metal plate 22 which is brought into contact with the bottom surface of the collet holder 10, that is, the bottom surface of the engaging groove 14, by a magnetic force when the collet 20 is engaged with the collet holder 10, And adhered to the bottom surface of the metal plate 22.

The adsorption rubber 24 may have a bottom surface convex downward from the center. The adsorption rubber 24 preferably has an appropriate surface resistance in order to prevent static electricity in contact with the semiconductor chip. To this end, the adsorption rubber 24 comprises 70 to 80% by weight of a main component of rubber or silicone, 3 to 15% by weight of an antistatic agent, 2 to 20% by weight of a carbonaceous material of either carbon black or graphite, 0.5 to 10 wt% of carbon nanotubes can be compression molded to have a surface resistance of 10 ^ 4 to 10 ^ 12 / sq or a nonconductive property of 10 ^ 13 / sq or more.

The collet 20 is communicated with the holder vacuum hole 12 of the collet holder 10 while passing through the metal plate 22 and the adsorption rubber 24 so as to disperse the vacuum suction force by the holder vacuum hole 12. [ A plurality of vacuum holes 26 are formed at regular intervals. When a vacuum suction force is applied to the pick-up tool through the holder vacuum hole 12, the vacuum suction force is dispersed through one or a plurality of vacuum holes 26 to vacuum adsorb the die on the wafer.

A detachment process of the pick-up tool of the present invention having the above-described structure will be described below.

5 is a view showing a state in which the collet is fitted to the collet holder.

The pick-up tool according to the present embodiment allows the operator to move the collet 20 closer to the coupling groove 14 of the collet holder 10 in the vertical direction, The metal plate 22 of the collet 20 is attracted to the bottom surface of the collet holder 10 by the magnetic force so that the collet 20 is engaged with the engaging groove 14 of the collet holder 10.

5B, the collet 20 is inserted through the front surface of the engaging groove 14 so that the collet 20 is inserted into the engaging groove 14 of the collet holder 14, The collet 20 can be coupled to the collet holder 10 by moving in the horizontal direction. At this time, the collet 20 can be fitted into the coupling groove 14 by the magnetic force of the magnet 16 embedded in the rear surface 17 of the coupling groove 14.

Further, in this embodiment, the collet 20 can be fitted into the collet holder 10 also in the oblique direction, not the vertical direction or the horizontal direction, as shown in FIG. 5C.

The operator inserts the collet 20 into the separating groove 18 formed in the rear surface 17 of the engaging groove 14 and inserts the collet 20 into the engaging groove 14, (14). Thus, the collet 20 can be easily removed in the direction opposite to that of Fig. 6B.

The foregoing description is merely illustrative of the technical idea of the present invention, and various changes and modifications may be made by those skilled in the art without departing from the essential characteristics of the present invention.

Therefore, the embodiments disclosed in the present invention are intended to illustrate rather than limit the scope of the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. The scope of protection of the present invention should be construed according to the following claims, and all technical ideas within the scope of equivalents should be construed as falling within the scope of the present invention.

10: Collet holder
11: The shank
12: Holder vacuum hole
13: Bottom of collet holder
14: Coupling groove
15, 16: Magnetic
17: Rear of coupling groove
18: separation groove
20: Collet
22: metal plate
24: Adsorption rubber
26: Vacuum hole

Claims (4)

A pick-up tool for semiconductor die transfer, comprising: a collet holder having an upper portion formed with a shank and a lower portion formed with a coupling groove into which a collet is fitted,
The rear surface and both side surfaces of the coupling groove are formed with wall surfaces of a predetermined height that are not bent but extend only in a vertical direction, and the front surface is opened without forming a wall surface,
A separating groove is formed on a wall surface formed on the rear surface so that the collet fitted in the coupling groove can be pushed out from the coupling groove,
Wherein a first magnet is embedded in a bottom surface of the coupling groove and a second magnet is embedded in both side walls of the separation groove on the rear surface. delete delete 2. The apparatus of claim 1,
Wherein the semiconductor die has a semi-circular shape.
KR1020150178572A 2015-12-14 2015-12-14 Pick-up tool for transferring semiconductor die KR101940369B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020150178572A KR101940369B1 (en) 2015-12-14 2015-12-14 Pick-up tool for transferring semiconductor die

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020150178572A KR101940369B1 (en) 2015-12-14 2015-12-14 Pick-up tool for transferring semiconductor die

Publications (2)

Publication Number Publication Date
KR20170070720A KR20170070720A (en) 2017-06-22
KR101940369B1 true KR101940369B1 (en) 2019-01-18

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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102185034B1 (en) * 2018-06-27 2020-12-01 세메스 주식회사 Module for aligning bonding tool and die bonding apparatus having the same
KR102469767B1 (en) * 2020-12-01 2022-11-23 (주)마이크로컨텍솔루션 Collet, pick-up machine and manufacturing method for collet
KR102535165B1 (en) * 2021-07-15 2023-05-26 (주)성진테크 Magnetic pin block injector

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200425068Y1 (en) * 2006-04-28 2006-09-01 한양정밀 (주) apparatus for transfering die

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0766268A (en) * 1993-08-20 1995-03-10 Sony Corp Suction device of semiconductor chip
KR100843222B1 (en) * 2006-12-22 2008-07-02 삼성전자주식회사 Apparatus for transferring a semiconductor chip and method of transferring a semiconductor chip using the same
KR101035167B1 (en) * 2009-06-12 2011-05-17 이정구 Rubber pick-up frame equiped with guiding block
KR20130026144A (en) * 2011-09-05 2013-03-13 삼성전자주식회사 Collet assembly for attaching a die
KR101482870B1 (en) * 2013-06-28 2015-01-15 세메스 주식회사 Apparatus for exchanging a collet

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200425068Y1 (en) * 2006-04-28 2006-09-01 한양정밀 (주) apparatus for transfering die

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