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KR101870289B1 - Semiconductor die bonding collet - Google Patents

Semiconductor die bonding collet Download PDF

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Publication number
KR101870289B1
KR101870289B1 KR1020170080812A KR20170080812A KR101870289B1 KR 101870289 B1 KR101870289 B1 KR 101870289B1 KR 1020170080812 A KR1020170080812 A KR 1020170080812A KR 20170080812 A KR20170080812 A KR 20170080812A KR 101870289 B1 KR101870289 B1 KR 101870289B1
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KR
South Korea
Prior art keywords
groove
pattern
collet
shape
vacuum
Prior art date
Application number
KR1020170080812A
Other languages
Korean (ko)
Inventor
이은자
Original Assignee
주식회사 기주테크
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 주식회사 기주테크 filed Critical 주식회사 기주테크
Priority to KR1020170080812A priority Critical patent/KR101870289B1/en
Application granted granted Critical
Publication of KR101870289B1 publication Critical patent/KR101870289B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)

Abstract

According to an embodiment of the present invention, a semiconductor die bonding collet comprises: a collet holder having a vacuum hole penetrating through an upper surface and a lower surface and a groove pattern groove formed for a plurality of line grooves to form a pattern on the upper surface; and a collet plate coupled to a lower portion of the collet holder, and provided for a suction hole to be penetrated. Therefore, vacuum suction efficiency can be improved.

Description

Semiconductor die bonding collet < RTI ID = 0.0 >

The present invention relates to a collet for semiconductor die bonding used in semiconductor die bonding.

Generally, a semiconductor package front process is manufactured by a wafer sawing process, a die attach process, a wire bonding process, a molding process, or an encapsulation process.

In the semiconductor die bonding process, a die, which has been separated into individual semiconductor chips by using a diamond blade, is detached from the wafer and is bonded to a leadframe or a printed circuit board (or a leadframe) using a bonding means such as an epoxy or die bonding film Such as a PCB, to a base frame of a semiconductor package.

 On the other hand, the size and thickness of the semiconductor package are becoming smaller and smaller as the development of electronic products pursuing miniaturization and light weight and shortening is progressively reduced. In addition, when a plurality of semiconductor chips are mounted on one lead frame or a printed circuit board The use of stacked packages is becoming commonplace. Accordingly, since the thickness of the semiconductor chip also becomes gradually thinner, a new technique for minimizing the damage to the semiconductor chip in the semiconductor chip bonding process is required.

In the current semiconductor assembly market, a collet with higher precision is required to apply a more advanced semiconductor package in the die bonding process. Accordingly, various types of collets have been developed, and recently, magnetic collets have been developed. The magnetic collet is advantageous for tilt and misalign because it utilizes the characteristics of magnetism and vacuum.

FIG. 1 is a plan view of a collet proposed in Korean Patent Laid-Open No. 10-2015-0101867, and FIG. 2 is a cross-sectional view taken along the line A-A 'in FIG.

Referring to FIGS. 1 and 2, the collet may include a collet plate 20 and a collet holder 10 having a plurality of vacuum holes 11. The position and structure of the suction holes 21 to be formed in the collet plate 20 are determined according to the vacuum holes 11 formed in the collet holder 10.

However, since the conventional collet holder 10 is made of a rubber material, the vacuum adsorption site is limited and the vacuum release is not performed well in the adsorbed state. Further, in the case of the collet plate 20, there is a limit in that it can not have a simple structure because it has a plurality of coupling hole configurations for coupling with the collet holder 10.

Korean Patent Publication No. 10-2015-0101867

SUMMARY OF THE INVENTION It is an object of the present invention to provide a collet for semiconductor die bonding capable of improving the vacuum adsorption efficiency over the entire area. Another object of the present invention is to provide a collet for semiconductor die bonding which is easily released from vacuum in an adsorbed state.

A collet holder includes a vacuum hole passing through an upper surface and a lower surface, and a groove pattern groove formed on the upper surface and having a plurality of line grooves formed thereon. And a collet plate coupled to a lower portion of the collet holder, the collet plate including a suction hole penetrated therethrough.

The vacuum holes formed in the collet holder and the suction holes formed in the collet plate may be formed in a single number in positions opposed to each other.

The groove pattern groove may be formed in a shape of '+' shape, 'X' shape, 'O' shape, or '□' shape at the center point of the groove pattern groove.

The pattern shape of the groove pattern groove may be a pattern shape of any one of a lattice pattern, a diamond pattern, an X shape, and a circular pattern.

The grooves of the groove pattern grooves are formed by two spaced apart vertical grooves and a rectangular groove having a horizontal bottom surface, a triangular groove having a shape in which two inclined groove walls are connected to each other, a triangular groove groove having two inclined groove walls spaced apart, A columnar groove having two vertical grooves spaced apart from each other, a concave bottom surface, and a hemispherical groove recessed in the shape of a hemisphere of the concave.

And a groove formed in an edge of the collet holder, wherein a groove groove connecting the groove pattern groove and the outside is formed.

The width of the rim groove may be characterized by a fine groove having a width smaller than the width of the groove pattern groove.

According to the embodiment of the present invention, the vacuum adsorption efficiency is improved and the vacuum release can be performed well in the adsorbed state.

FIGS. 1 and 2 illustrate a conventional collet for semiconductor die bonding. FIG.
3 is an exploded perspective view of a collet for semiconductor die bonding according to an embodiment of the present invention.
4 is an exploded perspective view of a collet for semiconductor die bonding according to an embodiment of the present invention.
5 is a cross-sectional view of a collet for semiconductor die bonding according to an embodiment of the present invention.
FIG. 6 is a top view of a collet holder according to an embodiment of the present invention. FIG.
FIG. 7 is a top view of a collet holder having a vacuum hole according to an embodiment of the present invention. FIG.
8 is a pattern example of a groove pattern groove according to an embodiment of the present invention.
FIG. 9 is an illustration of a groove groove groove according to an embodiment of the present invention. FIG.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention, and how to achieve them, will be apparent from the following detailed description of embodiments thereof taken in conjunction with the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the exemplary embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete and will fully convey the concept of the invention to those skilled in the art. And the present invention is only defined by the scope of the claims. In the following description, well-known functions or constructions are not described in detail since they would obscure the invention in unnecessary detail.

FIG. 3 is a perspective exploded view of a collet for semiconductor die bonding according to an embodiment of the present invention, FIG. 4 is an assembled perspective view of a collet for semiconductor die bonding according to an embodiment of the present invention, FIG. 6 is a top view of a collet holder according to an embodiment of the present invention, and FIG. 7 is a top view of a collet holder having a vacuum hole according to an embodiment of the present invention FIG. 8 is a view illustrating a pattern of a groove pattern groove according to an embodiment of the present invention, and FIG. 9 is an illustration of an example of a groove pattern groove according to an embodiment of the present invention.

The collet for semiconductor die bonding of the present invention includes a collet plate (200) and a collet holder (100).

The collet plate 200 is a plate coupled to a lower portion of the collet holder 100, and the collet plate 200 is made of a metal material. At the center of the collet plate 200, a suction hole 210 penetrating the upper and lower surfaces of the collet plate 200 is formed. The adsorption holes 210 may be formed by passing through the collet plate 200 from the upper surface to the lower surface thereof. Therefore, workability, vacuum and stability can be improved.

The collet holder 100 may be made of a nonconductive rubber, silicone or urethane which does not generate static electricity, and may be made of a dissipative and conductive material.

The collet holder 100 penetrates the inside and is provided with a single vacuum hole 110 for vacuum suction of a semiconductor die (not shown). The vacuum hole 110 may be formed to pass through the upper surface and the lower surface. Although the vacuum hole 110 may have a cylindrical shape, the structure of the vacuum hole 110 is not limited as described above, and the design of the vacuum hole 110 may be changed in various designs .

The vacuum holes 110 formed in the collet holder 100 and the suction holes 210 formed in the collet plate 200 are formed in a single number in positions opposed to each other. The vacuum pressure of the vacuum hole 110 of the collet holder 100 can be efficiently transferred to the suction hole 210 of the collet plate 200.

Further, the vacuum hole 110 of the collet holder 100 may be formed in any one of the '+' shape, the 'X' shape, the 'O' shape, and the '□' shape at the center point of the groove pattern groove 120 . Therefore, the vacuum hole 110 having a '+' shape or an 'X' shape or a 'O' shape or a '□' shape can increase the vacuum attraction force.

In addition, the collet holder 100 is formed with groove pattern grooves 120 formed by patterning a plurality of line grooves on the upper surface. The groove pattern groove 120 means that a groove is formed as a pattern shape in which a plurality of line grooves are repeated.

By forming the groove pattern grooves 120 on the entire top surface of the collet holder 100 as described above, the vacuum is formed as a whole, and the surface contact surface can be reduced by ½ or more, so that the vacuum bonding force can be increased 2.5 times .

7, the edge groove may be a groove formed in the edge of the collet holder 100, and the groove pattern groove 120 and the outside may be formed in the edge of the collet holder 100, It is a connecting groove. It is preferable that the width of the edge groove be formed to be a width smaller than the width of the groove pattern groove 120. [ Therefore, it is possible to easily release the vacuum in a vacuum state.

The groove pattern grooves 120 formed on the upper surface of the collet holder 100 may have various shapes. For example, the grooves may have a lattice shape shown in FIG. 8 (a), a diamond pattern shown in FIG. 8 (b) (c), and the circular pattern shown in Fig. 8 (d). Various pattern shapes may be applied depending on the required degree of vacuum attraction force. As shown in FIG. 8 (e), fine grooves may be included in the drawing, and the entire surface may be a fine groove, as shown in FIG. 8 (f).

9, the grooves of the groove pattern grooves 120 may have any one of a rectangular groove, a triangular groove, a triangular groove, a columnar groove, and a hemispherical groove.

9 (a), and the triangular grooves are formed in a shape in which two inclined groove walls are connected to each other as shown in FIG. 9 (b) And the triangular cross-sectional groove refers to a groove shape having two inclined groove walls spaced apart from each other as shown in FIG. 9 (c) and a horizontal bottom surface, and the columnar grooves are formed as shown in FIG. 9 (d) Refers to a groove shape having two vertical groove walls and a concave bottom surface spaced apart from each other, and the hemispherical groove refers to a groove shape that is formed in the shape of a hemisphere of a concave as shown in FIG. 9 (e). Accordingly, various groove shapes may be applied depending on the degree of vacuum attraction force required.

The embodiments of the present invention described above are selected and presented in order to assist those of ordinary skill in the art from among various possible examples. The technical idea of the present invention is not necessarily limited to or limited to these embodiments Various changes, modifications, and other equivalent embodiments are possible without departing from the spirit of the present invention.

100: collet holder
110: Vacuum hole
120: groove pattern groove
200: collet plate
210: adsorption hole

Claims (7)

delete delete delete delete delete delete And a groove pattern groove formed on the upper surface so as to form a pattern in which a plurality of line grooves are repeated and a surface contact surface of which is 1/2, and a collet formed of a sodal conductive material and a conductive material, holder; And
A collet plate coupled to a lower portion of the collet holder, the collet plate including a suction hole penetrating the upper surface and the lower surface;
Lt; / RTI >
The vacuum holes formed in the collet holder and the suction holes formed in the collet plate are formed in a single number at positions opposed to each other,
The vacuum hole
Shaped groove is formed in the center of the groove pattern groove in one of '+' shape, 'X' shape, 'O' shape, and '□' shape,
The pattern shape of the groove pattern grooves may be,
A grid pattern, a diamond pattern, an X-shaped pattern, and a circular pattern,
The groove shape of the groove pattern groove
A triangular groove having a shape in which two inclined groove walls are connected to each other, a triangular groove groove having two spaced inclined groove walls and a horizontal floor, two vertical groove walls spaced apart from each other, A columnar groove having a concave bottom surface, and a hemispherical groove formed in the shape of a hemisphere of the concave,
Wherein a groove formed in an edge of the collet holder is formed with a groove groove for connecting the groove pattern groove and the outside,
Wherein a width of the edge groove is smaller than a width of the groove pattern groove.
KR1020170080812A 2017-06-26 2017-06-26 Semiconductor die bonding collet KR101870289B1 (en)

Priority Applications (1)

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KR1020170080812A KR101870289B1 (en) 2017-06-26 2017-06-26 Semiconductor die bonding collet

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KR1020170080812A KR101870289B1 (en) 2017-06-26 2017-06-26 Semiconductor die bonding collet

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102448731B1 (en) 2021-10-20 2022-09-29 주식회사 페코텍 Collet and Collet Assembly

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3363704B2 (en) * 1996-06-14 2003-01-08 三洋電機株式会社 Leak collet and method of manufacturing semiconductor device
KR200414775Y1 (en) * 2006-02-10 2006-04-24 한양정밀 (주) apparatus for transfering die
KR20120073225A (en) * 2009-09-09 2012-07-04 쿨리케 앤드 소파 다이 본딩 게엠베하 Tool for picking a planar object from a supply station
KR20150101867A (en) 2014-02-27 2015-09-04 주식회사 페코텍 Collet for boding semiconductor die

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3363704B2 (en) * 1996-06-14 2003-01-08 三洋電機株式会社 Leak collet and method of manufacturing semiconductor device
KR200414775Y1 (en) * 2006-02-10 2006-04-24 한양정밀 (주) apparatus for transfering die
KR20120073225A (en) * 2009-09-09 2012-07-04 쿨리케 앤드 소파 다이 본딩 게엠베하 Tool for picking a planar object from a supply station
KR20150101867A (en) 2014-02-27 2015-09-04 주식회사 페코텍 Collet for boding semiconductor die

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102448731B1 (en) 2021-10-20 2022-09-29 주식회사 페코텍 Collet and Collet Assembly

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