KR101827060B1 - Flexible flat cable module, power supplying device and display apprarus comprising the same - Google Patents

Abstract

The present invention relates to a flexible flat cable module which is excellent in mechanical characteristics, thermal characteristics and electrical characteristics even under high temperature and high humidity conditions and has improved connection structure with other electrical and electronic parts through anisotropic conductive connection, A connetorless type power supply unit, and a display device having the same.

Description

TECHNICAL FIELD [0001] The present invention relates to a flexible flat cable module, a power supply device having the flexible flat cable module, and a display device.

The present invention relates to a flexible flat cable module (FFC module) having excellent mechanical characteristics, thermal characteristics and electrical characteristics under high temperature and high humidity conditions, a power supply with improved coupling structure between the flexible flat cable module and a printed circuit board And a display device having the same.

2. Description of the Related Art In general, a display device such as a liquid crystal display (LCD) is widely used as a flat panel display device because it can be driven by a low power and has a clear color reproduction capability. However, unlike a CRT or a PDP, an LCD is a non-light emitting device in which a display panel itself can not emit light directly. A backlight unit using a fluorescent lamp or the like is separately required to irradiate light from the back surface of the LCD panel to the panel.

BACKGROUND ART [0002] A backlight used in a liquid crystal display device is divided into a front dimming type (or a direct down type) and a side dim type (or edge type) according to a method of arranging an LED (Light Emitting Diode) light source. In the direct-lighting method, the LED light source is disposed under the diffusion plate of the flat plate. Since the shape of the light source appears on the liquid crystal panel, a space between the light source and the liquid crystal must be sufficiently secured and maintained. Since the light scattering means must be separately installed for distribution, there is a limit to the thinness. In addition, edge-lighting is a method of providing a light source on the side of a light guide panel of a flat plate and then dispersing the light on the entire surface by using a light guide plate, There is room.

Meanwhile, in most backlight devices, wiring is performed using a general wire cable as shown in FIG. 5. In this case, a connector is necessarily used for connection between a circuit board and a general wire cable. The use of such a connector not only increases the cost, but also limits the thickness of the display device due to the increase in the thickness of the component.

It is an object of the present invention to provide a flexible flat cable module (FFC module) having excellent mechanical properties, thermal characteristics and electrical characteristics even under high temperature and high humidity conditions and improved connection structure with other electric and electronic parts through conductive anisotropic connection .

It is also an object of the present invention to provide a connectorless power supply device capable of realizing low cost while maintaining the connection stability and improving the coupling structure between the flexible flat cable module and the circuit board, .

In order to achieve the above object, the present invention provides a semiconductor device comprising: a conductor; A flexible flat cable covering the conductor and including an insulating film in which an adhesive layer and a resin layer are laminated in order; And an anisotropic conductive layer disposed on the exposed conductor of the flexible flat cable, wherein the flexible flat cable module has a contact resistance (? _PCT ) after being maintained at a temperature of 121 占 폚, a humidity of 100% and a pressure of 2 atm for 48 hours The ratio (? _PCT /? _R ) of the contact resistance (? _R ) at the initial time (0 hr) for the flexible flat cable module is in the range of 1.0 to 2.5.

In the present invention, the contact resistance (Ω _PCT ) value of the flexible flat cable module after maintaining at a temperature of 121 ° C., a humidity of 100% and a pressure of 2 atm for 48 hours may be 10 mΩ or less.

In the present invention, the peel strength value of the flexible flat cable with respect to the anisotropic conductive layer after being held for 48 hours under a condition of 121 占 폚, 100% humidity and 2 atm may be 1.00 to 5.00 kgf / cm.

In the present invention, the anisotropic conductive layer may be selected from the group consisting of an anisotropic conductive film (ACF), an anisotropic conductive paste (ACP), and an anisotropic conductive adhesive (ACA).

In the present invention, the flexible flat cable and the anisotropic conductive layer are integrally joined to each other, and one end or both ends of the joint body may be connectorless type.

In the present invention, the adhesive layer may include a polymer resin.

In the present invention, the polymer resin may include a polyester resin.

In the present invention, the polymer resin includes at least two polyester resins, and the polyester resin may be a mixture of a first polyester resin having a molecular weight of 1,000 to 15,000 and a second polyester resin having a molecular weight of 20,000 to 35,000 have.

In the present invention, the adhesive layer may include at least one curing agent.

In the present invention, the curing agent may be a compound containing at least one of an isocyanate group, a block isocyanate group, and a carbodiimide group.

In the present invention, the curing agent may be contained in an amount of 6 to 60 parts by weight based on 50 parts by weight of the polymer resin.

In the present invention, the adhesive layer may further include one or more flame retardant fillers.

In the present invention, the flame retardant filler may be at least one selected from the group consisting of a halogen flame retardant, a phosphorus flame retardant, a nitrogen flame retardant, a metal flame retardant, and an antimony flame retardant.

According to another embodiment of the present invention, A flexible flat cable covering the conductor and including an insulating film in which an adhesive layer and a resin layer are laminated in order; And at the initial time (0hr) for the contact resistance (Ω _HTST) after holding for a flexible flat cable module provided with an anisotropic conductive layer disposed on the exposed conductors of the flexible flat cable, 1,000hrs under temperature conditions 120 ℃ Provides a flexible flat cable module with a ratio of contact resistance (Ω _R ) (Ω _HTST / Ω _R ) in the range of 1.0 to 2.5.

In the present invention, the contact resistance (? _HTST ) value of the flexible flat cable module after being maintained at a temperature of 120 占 폚 for 1,000 hours may be 10 m? _Or less.

In the present invention, the peel strength value of the flexible flat cable to the anisotropic conductive layer after being maintained at a temperature of 120 DEG C for 1000 hours may be 1.00 to 5.00 kgf / cm.

According to another embodiment of the present invention, there is provided a semiconductor device comprising: a conductor; A flexible flat cable covering the conductor and including an insulating film in which an adhesive layer and a resin layer are laminated in order; And an anisotropic conductive layer disposed on the exposed conductor of the flexible flat cable, wherein the flexible flat cable module has an initial _{value of} contact resistance (? _HTHH ) after holding for 1,000 hours under a condition of a temperature of 85 占 폚 and a humidity of 85% And a ratio (? _HTHH /? _R ) of the contact resistance (? _R ) at a time (0 hr) in the range of 1.0 to 2.5.

In the present invention, the value of the contact resistance (? _HTHH ) of the flexible flat cable after being maintained at a temperature of 85 占 폚 and a humidity of 85% for 1,000 _hours may be 10 m? _Or less.

In the present invention, the peel strength value of the flexible flat cable to the anisotropic conductive layer after being maintained at a temperature of 85 DEG C and a humidity of 85% for 1000 hours may be 1.00 to 5.00 kgf / cm.

The present invention also relates to a printed circuit board, And a flexible flat cable module as described above, wherein the printed circuit board and the flexible cable are electrically connected directly by the anisotropic conductive layer in the flexible flat cable module.

In the present invention, the printed circuit board may be electrically connected to a light source that generates light, and may supply power to the light source.

In the present invention, the printed circuit board may be a printed circuit board (MPCB) having a circuit pattern layer and a photo solder resist (PSR) layer for insulating the circuit pattern layer.

In the present invention, the power supply device may include a plurality of printed circuit boards, and both ends of the flexible flat cable module may be connected in series with the respective printed circuit boards.

In the present invention, the power supply device may include a plurality of flexible flat cable modules, and both ends of the printed circuit board may be connected to the respective flexible flat cable modules.

The circuit pattern layer of the printed circuit board in the present invention; And a reinforcing portion for reinforcing a bonding strength between the flexible flat cable module and the flexible flat cable module. The reinforcing portion may be formed of a thermosetting resin adhesive.

In addition, the present invention provides a display device having the power supply device described above.

In the present invention, the printed circuit board included in the power supply unit may be a component that controls a light source of a backlight unit (BLU).

The flexible flat cable module provided by the present invention is excellent in mechanical characteristics and electrical characteristics under high temperature / high humidity environmental conditions, has excellent heat resistance characteristics such as heat shrinkability and denaturation, The electrical connection structure with the parts is improved

In addition, the connectorless type power supply device improved in the coupling structure between the flexible flat cable module and the circuit board in the present invention is excellent in mechanical characteristics, heat resistance characteristics and electrical characteristics, It is possible to realize a low cost and a thinness.

1 is a schematic view showing a cross-sectional structure of a flexible flat cable according to an embodiment of the present invention.
2 is a schematic cross-sectional view of a flexible flat cable module according to an embodiment of the present invention.
3 schematically shows a cross-sectional structure of a power supply device in which a flexible printed circuit board and a flexible flat cable module are electrically connected according to an embodiment of the present invention.
4 schematically shows a cross-sectional structure of a power supply device in which a flexible printed circuit board and a flexible flat cable module are electrically connected according to another embodiment of the present invention.
5 is a view showing a conventional general wire cable to which a connector is coupled on one side.
6 is a view illustrating a configuration of a power supply apparatus in which a flexible printed circuit board and a flexible flat cable module are electrically connected according to an embodiment of the present invention.
7 is a view showing a method of measuring the contact resistance of the flexible flat cable module according to the present invention.
8 is a graph showing changes in contact resistance with time under severe conditions of the flexible flat cable modules of Example 2 and Comparative Example 4 in Experimental Example 4. FIG.
9 is a graph showing changes in peel strength with time under severe conditions of the flexible flat cable modules of Example 2 and Comparative Example 4 in Experimental Example 5. FIG.
10 is a graph showing changes in contact resistance with time under severe conditions of Flexible Flat Cable Modules of Example 2 and Comparative Example 4 in Experimental Example 5. FIG.
11A and 11B schematically show a display device including a light source and a power supply according to another embodiment of the present invention.
12A and 12B are enlarged views of a connection structure between a backlight unit and a flexible flat cable module included in the display device of FIG. 11B.

Hereinafter, preferred embodiments of the present invention will be described. However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Further, the embodiments of the present invention are provided to more fully explain the present invention to those skilled in the art.

BACKGROUND ART Recently, flexible flat cables (FFC) used in various electronic devices and automobile fields are mainly used in a high temperature environment due to heat generation of electronic components. Therefore, high mechanical characteristics, heat resistance characteristics, and electrical characteristics are required under severe conditions such as high temperature and high humidity Is required.

The inventors of the present invention have found a flexible flat cable module having improved connection structure with other electrical and electronic parts while maintaining excellent mechanical characteristics, heat resistance and electrical characteristics under such severe conditions as described above, and thus the present invention has been accomplished.

Further, the present invention can provide a connectorless type power supply device having an improved bonding structure through the above-described conductive flat connection between the flexible flat cable and the circuit board. Therefore, a low cost and thin type .

<Flexible Flat Cable>

According to an embodiment of the present invention, there is provided a semiconductor device comprising: a conductor; And a flexible flat cable (FFC) having excellent mechanical properties, thermal characteristics, and electrical characteristics under high temperature / high humidity conditions by laminating an insulating film in which an adhesive layer, an intermediate layer and a resin layer are laminated in order on at least one surface of the conductor. to provide.

More specifically, the flexible flat cable 100 has a structure including a plurality of flat plate-like conductors 10 having a predetermined width and thickness and a pair of insulating films 20 covering both surfaces of the conductor .

1 schematically shows a cross-sectional structure of a flexible flat cable (FFC) 100 according to an embodiment of the present invention. The adhesive layer 21 is laminated on both surfaces of a conductor 10, The intermediate layer 22 is laminated, and the resin layer 23 is laminated on the other side of the intermediate layer.

In the flexible flat cable (FFC) according to the present invention, the type of the conductor 10 is not particularly limited, but may be made of a conductive metal such as copper, tin-plated copper, or nickel-plated copper. As the conductor, a thin conductive metal is preferable.

The thickness and the shape of the conductor are not particularly limited, and conventional conductors known in the art can be used without limitation. For example, in consideration of the sliding property of the flexible flat cable (FFC) 100, the thickness of the conductor may be in the range of 20 to 50 mu m.

In the flexible flat cable (FFC) according to the present invention, the insulating film 20 covering the conductor has a structure in which the adhesive layer 21, the intermediate layer 22 and the resin layer 23 are laminated in order.

The adhesive layer 21 serves to bond the insulation film 20 to the conductor 10 and the intermediate layer 22 is positioned between the adhesive layer 21 and the resin layer 23 to form the adhesive layer 21 And the resin layer 23 is positioned at an outermost position of the insulating film 20 and the conductor 10 is insulated from the outside. .

In the flexible flat cable (FFC) according to the present invention, the ratio of the tensile stress (TR) at room temperature to the tensile stress (TH) after the insulation film (20) is maintained at a temperature of 85 캜 and a humidity of 85% (TH / TR) is 0.9 to 1.0, more preferably 0.93 to 1.0.

In the present invention, the ratio (TH / TR) of the tensile stress (TR) at room temperature to the tensile stress (TH) after maintaining the insulating film at a temperature of 85 DEG C and a humidity of 85% The same and similar mechanical properties as the room temperature condition can be maintained. On the other hand, when the TH / TR ratio is less than 0.9, the crosslinked chain in the polymer resin contained in the adhesive layer or the intermediate layer is broken, and mechanical strength and bending property may be significantly deteriorated. Therefore, in the present invention, it is desirable to control the ratio (TH / TR) of the tensile stress (TR) at room temperature to the tensile stress (TH) after maintaining the insulating film at 85 ° C and 85% However, it is desirable to control to 1.0 or less in consideration of feasibility and economic situation.

According to another embodiment of the present invention, the insulating film has a high elongation (EH) of 85 to 105% after being maintained for 1000 hours under a condition of a temperature of 85 and a humidity of 85%, that is, under harsh conditions.

In the present invention, the tensile stress (TR) at room temperature of the insulating film may have a high value of 130 to 140 MPa.

In addition, in the present invention, the insulating film may have a very high tensile stress (TH) of 115 to 135 MPa after the insulation film is maintained under a severe condition of 85 ° C and 85% humidity for 1000 hours.

In the present invention, the insulation film provided as described above has a shrinkage ratio in the longitudinal direction (MD) of 0.20 to 0.35%, a shrinkage ratio in the width direction (TD) of 0.08 to 0.13%, and a shrinkage ratio in the width direction (MD / TD) of the shrinkage ratio of 2.5 to 3.0 can be further improved.

In the insulating film of the present invention, the adhesive layer may include a polymer resin, and the polymer resin may be a polyester resin, a polyimide resin, a polyethylene resin, a polyurethane resin, and a polyphenylene sulfide resin At least one selected from the group consisting of a polyester resin and a polyester resin.

As the polyester resin usable as the polymer resin in the present invention, it is preferable to use two or more kinds of polyester resins, more preferably a first polyester resin having a molecular weight of 1,000 to 15,000, 35,000 or a mixture thereof may be used, more preferably at least two kinds of first polyester resins, at least two second polyester resins, or at least one first polyester resin and one kind A mixture of at least one first polyester resin and at least one second polyester resin may be used.

However, the types of polyester resins usable in the present invention are not limited to those described above, but may be selectively used depending on the characteristics of the product to be implemented.

In the insulating film of the present invention, it is preferable that the adhesive layer includes at least one curing agent.

At this time, the kind of the curing agent may be a compound containing at least one functional group of an isocyanate group, a block isocyanate group, and a carbodiimide group. More specifically, the present invention relates to a process for producing a polyisocyanate compound, which comprises reacting 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, diphenylmethane-4,4'-diisocyanate, xylene diisocyanate, isophorone diisocyanate, polyethylene phenyldiisocyanate and hexamethylene A polyisocyanate, a polyisocyanate, a polyisocyanate, a polyisocyanate, a polyisocyanate, a polyisocyanate, a polyisocyanate, a polyisocyanate, a polyisocyanate, a polyisocyanate, and a polyisocyanate, no.

In the present invention, the curing agent is used in an amount of 6 to 60 parts by weight, preferably 6 to 26 parts by weight, more preferably 8 to 22 parts by weight, more preferably 8 to 8 parts by weight, based on 50 parts by weight of the polymer resin contained in the adhesive layer. To 18 parts by weight can further improve mechanical properties such as tensile strength, elongation and heat shrinkage and flexural properties. When the content of the polymer resin is 100 parts by weight, the content of the curing agent may be doubled.

In the present invention, at least 6 parts by weight of a curing agent relative to 50 parts by weight of the polymer resin is used to obtain the above-mentioned effect, and more preferably 8 parts by weight or more of the curing agent is required to cause cross-linking between the polyesters It is possible to exhibit excellent mechanical properties even under severe conditions. However, when the curing agent is used in an amount of more than 26 parts by weight, the adhesive layer becomes hard, resulting in poor flexibility and flexibility, and a low elongation percentage.

Further, in the present invention, one or more flame retardant fillers may be further added to impart the flame retardancy to the adhesive layer.

Although the type of the flame retardant filler is not particularly limited, the flexible flat cable (FFC) according to the present invention has a flame retardancy that passes the UL standard vertical burning test (VW-1 test) owing to the addition of the flame retardant filler .

More specifically, as the flame retardant filler, at least one selected from the group consisting of a halogen flame retardant, a phosphorus flame retardant, a nitrogen flame retardant, a metal flame retardant and an antimony flame retardant may be used, and preferably at least one kind And more preferably 3 kinds or more and 5 kinds or less of compounds may be mixed and used.

Specific examples of the flame retardant in the present invention include chlorine-based flame retardants such as chlorinated paraffin, chlorinated polyethylene, chlorinated polyphenyl and perchloropentacyclodecane; Ethylene bispentabromobenzene, ethylene bispentabromodiphenyl, tetrabromoethane, tetrabromobisphenol A, hexabromobenzene, decabromobiphenyl ether, tetrabromophthalic anhydride, polydibromophenylene oxide, Brominated flame retardants such as hexabromocyclodecane and ammonium bromide; Alkyl phosphates, alkyl phosphates, dimethyl phosphonates, phosphonates, halogenated phosphonate esters, trimethyl phosphates, tributyl phosphates, trioctyl phosphates, tributoxyethyl phosphates, octyldiphenyl phosphates, tricresyl phosphates, Tris (2-chloropropyl) phosphate, tris (2,3-dichloropropyl) phosphate, tris (2,3-dibromopropyl) phosphate, dicyclohexylphosphine, (Chloropropyl) monooctyl phosphate, polyphosphonate, polyphosphate, aromatic polyphosphate, di (2-ethylhexyl) phosphate, tris (bromocloropropyl) phosphate, bis Phosphoric acid esters such as bromo neopentyl glycol and tris (diethylphosphinic acid) aluminum Is a compound; Polyols such as phosphonate type polyols, phosphate type polyols and halogen element-containing polyols; Aluminum hydroxide, magnesium hydroxide, magnesium carbonate, antimony trioxide, antimony trichloride, zinc borate, antimony borate, boric acid, antimony molybdate, molybdenum oxide, phosphorus oxide, calcium silicate, titanium dioxide, zirconium compound, tin compound , A metal powder or an inorganic compound such as oxonite, calcium aluminate hydrate, copper oxide, metallic copper powder, calcium carbonate and barium metaborate; Nitrogen compounds such as melamine cyanurate, triazine, isocyanurate, urea, guanidine and the like; And other compounds such as silicone-based polymers, ferrocene, fumaric acid, and maleic acid. Among them, halogen-based flame retardants such as a bromine-based flame retardant and a chlorine-based flame retardant are preferable.

In the present invention, the content of the flame retardant filler is not particularly limited, but it is preferably at least 5 parts by weight, preferably at least 10 parts by weight, more preferably at least 15 parts by weight based on 50 parts by weight of the polymer resin The upper limit of the amount is preferably 75 parts by weight, preferably 65 parts by weight, more preferably 60 parts by weight. If the content of the flame retardant filler exceeds the upper limit value described above, the effect of improving the flame retardancy may not be sufficiently improved as compared with the increase in the addition amount, which may be economically problematic and the flexibility may be lowered and the elongation percentage may be lowered due to the increase of the filler content.

In the present invention, a flame retarding additive, a pigment, an antioxidant, a masking agent, a lubricant, a processing stabilizer, a plasticizer, a foaming agent reinforcing agent, an antistatic agent, A colorant, a filler, a granule, a metal deactivator, a silane coupling agent, and the like.

The present invention provides a method for producing the above-described insulating film.

More specifically, a preferred embodiment for producing the insulating film includes the steps of mixing and synthesizing at least one polyester resin, at least one curing agent, and at least one flame-retardant filler to prepare a first solvent; Mixing and synthesizing at least one polyester resin, at least one curing agent, and an inorganic filler to prepare a second solvent; Coating the resin layer with the second solvent to form an intermediate layer; And coating and drying the first solvent on the intermediate layer to form an adhesive layer.

In the method for producing an insulating film, the polyester resin, the curing agent and the flame-retardant filler are overlapped with those described in the above-mentioned insulating film, and detailed description thereof is omitted.

The kind of the inorganic filler used for the production of the second solvent is not particularly limited, and for example, silica (SiO ₂ ) can be used.

The present invention also provides a method of manufacturing a flexible flat cable (FFC) including the above-described insulating film.

More specifically, a preferred embodiment for manufacturing the flexible flat cable (FFC) includes: preparing two insulating films; And interposing a conductor between the adhesive layers of the two insulating films and then joining them.

In the present invention, it is possible to further perform a step of cutting the insulating film to a desired size before attaching the insulating film to the conductor.

<Flexible Flat Cable Module>

The present invention also relates to a semiconductor device comprising: a conductor; A flexible flat cable covering the conductor and including an insulating film in which an adhesive layer and a resin layer are laminated in order; And an anisotropic conductive layer disposed on the exposed conductor of the flexible flat cable.

2 schematically illustrates a cross-sectional structure of a flexible flat cable module 200 according to an embodiment of the present invention. An anisotropic conductive layer 150 is stacked on a flexible flat cable 100, And an anisotropic conductive layer 150 is disposed on the exposed portion of the conductor 10 of the flexible flat cable.

The flexible flat cable module 200 has an improved connection structure with other electrical and electronic components through an anisotropic conductive connection, but also a test for evaluating the reliability of a conventional electronic component package, such as a pressure cooker test (PCT) Thermal characteristics and electrical characteristics of the same or similar to normal temperature conditions under high temperature storage test (HTST) and high temperature and high humidity test conditions.

According to an embodiment of the present invention, the flexible flat cable module has a contact resistance at an initial time (0 hr) to a contact resistance (Ω _PCT ) after holding at 48 ° C. under a condition of a temperature of 121 ° C., a humidity of 100% (Ω _R) ratio _(PCT Ω / Ω _R) will be 1.0 to 2.5, preferably of 1.0 to 2.0 may have a range.

In the present invention, the flexible flat cable module has a contact resistance (Ω _PCT ) value of 10 mΩ or less after being held at a temperature of 121 ° C., a humidity of 100%, and a pressure of 2 atm for 48 hours, Electrical characteristics and mechanical properties that are almost the same as or similar to the normal temperature conditions can be maintained.

The flexible flat cable module has a peel strength value of 1.00 to 5.00 kgf / cm 2 for the flexible flat cable to the anisotropic conductive layer after being maintained at 121 ° C, 100% humidity and 2 atmospheric pressure for 48 hours, Preferably from 1.00 to 3.00 kgf / cm.

According to another embodiment of the present invention, the flexible flat cable module has a ratio (Ω) of the contact resistance (Ω _R ) at an initial time (0 hr) to a contact resistance (Ω _HTST ) _HTST /? _R ) is in the range of 1.0 to 2.5, preferably 1.0 to 2.0.

In the present invention, the contact resistance (? _HTST ) value of the flexible flat cable module after being maintained at a temperature of 120 占 폚 for 1,000 hours is 10 m? Or less, preferably 7.0 m? Or less.

Further, the flexible flat cable module has a peel strength value of 1.00 to 5.00 kgf / cm, preferably 1.00 to 3.00 kgf / cm &lt; 2 &gt; for the flexible flat cable to the anisotropic conductive layer after being maintained at a temperature of 120 DEG C for 1,000 hours. / cm. &lt; / RTI &gt;

According to another embodiment of the present invention, the flexible flat cable module has a contact resistance at an initial time (0 hr) to a contact resistance (? _HTHH ) after maintaining 1,000 hrs under a condition of a temperature of 85 ° C and a humidity of 85% the Ω _R) ratio _(HTHH Ω / Ω _R) of 1.0 to 2.5, preferably of may be a 1.0 to 2.0 range.

In the present invention, the contact resistance (? _HTHH ) value of the flexible flat cable module after being maintained at a temperature of 85 ° C and a humidity of 85% for 1,000 _hours is 10 m? _Or less, preferably 6.0 m? _Or less.

In addition, the peel strength value of the flexible flat cable to the anisotropic conductive layer after maintaining the temperature of the flexible flat cable module at a temperature of 85 DEG C and a humidity of 85% for 1000 hours is preferably 1.00 to 5.00 kgf / cm, Lt; RTI ID = 0.0 &gt; kgf / cm. &Lt; / RTI &gt;

In the flexible flat cable module 200 according to the present invention, the flexible flat cable (FFC) 100 is the same as that described above, and its detailed description will be omitted.

The insulating film 20 is omitted from one or both ends of the flexible flat cable 100 and a part of the conductor 100 is exposed to the outside in order to connect to a connection terminal formed on a printed circuit board or other electric electronic components .

In the flexible flat cable module 200 of the present invention, the anisotropic conductive layer 150 is a medium for electrically connecting the above-described flexible flat cable 100 to the terminals of other electric / electronic components.

The anisotropic conductive layer 150 generally refers to a film-shaped adhesive in which conductive particles are dispersed in an insulating binder resin functioning as an adhesive. The anisotropic conductive layer 150 is a film-like adhesive having electrical conductivity in the film thickness direction, Means a polymer membrane having electric anisotropy and adhesion.

In the present invention, the anisotropic conductive layer 150 can be used without any particular limitation in its constitution, form, and the like, provided that it is a material having anisotropic and conductive properties common in the art. For example, an anisotropic conductive film (ACF), an anisotropic conductive paste (ACP), and an anisotropic conductive adhesive (ACA).

The anisotropic conductive layer 150 may be formed of a film-like connecting material in which conductive particles are dispersed in an insulating binder containing a thermosetting resin. For example, a binder resin composition in which conductive particles are dispersed is applied onto a base film Lt; / RTI &gt; Or in the form of a paste in which conductive particles are dispersed in the insulating binder. At this time, the components of the binder and the conductive particles and / or the composition thereof are not particularly limited and may be appropriately selected within the range of ordinary components and ranges known in the art.

The flexible flat cable module 200 according to the present invention can be manufactured according to a conventional method known in the art. For example, when the anisotropic conductive layer 150 is in a paste state, the anisotropic conductive paste may be coated on the exposed conductor of the flexible flat cable 100 and dried. Alternatively, when the anisotropic conductive layer 150 is in the form of a sheet or a film, the anisotropic conductive film may be disposed on the exposed conductor 10 of the flexible flat cable 100, laminated, and then pressed.

In the flexible flat cable module 200 manufactured as described above, the flexible flat cable 100 and the anisotropic conductive layer 150 are integrally joined to each other, and one end or both ends of the joint body have a connectorless structure . Accordingly, the flexibility and flatness characteristics of the conventional flexible flat cable can be exhibited as it is, and a remarkable volume reduction effect can be obtained when the flexible flat cable is provided in the display device.

<Power supply>

In addition, the present invention provides a power supply for a power supply, preferably a light source for a display device, in which the above-mentioned flexible flat cable module and the circuit board are electrically connected through a conductive anisotropic connection.

As shown in FIG. 5, the conventional general power cable has at least one connector coupled thereto, and is electrically connected to the printed circuit board through the connector. When such a connector is provided, there is a limitation in reducing the thickness of the final display device, as well as an increase in cost due to the use of the connector.

In contrast, in the present invention, the flexible flat cable module and the printed circuit board are electrically connected to each other, and the flexible flat cable module and the circuit board are directly and physically and electrically connected to each other by the anisotropic conductive layer without using a separate connector , Innovative thickness and volume reduction are possible (see Fig. 6).

More specifically, FIG. 3 schematically illustrates a cross-sectional structure of a power supply 500 according to an embodiment of the present invention, including a printed circuit board 300; And the flexible flat cable module 200. The printed circuit board 300 and the flexible flat cable 100 are electrically connected to each other by an anisotropic conductive layer 150 in the flexible flat cable module 200, -bonding).

In the power supply 500 according to the present invention, the printed circuit board 300 can use any conventional circuit board known in the art without limitation. For example, the printed circuit board 300 may have a plurality of chips associated with a light source, a backlight driving circuit, a camera driving circuit, a power driving circuit, and the like.

In the present invention, the printed circuit board 300 may be a printed circuit board 300 that is electrically connected to a light source for generating light and supplies power to the light source. A circuit pattern (terminal) having a predetermined shape is formed on at least one surface of the printed circuit board 300. Particularly, a copper circuit pattern layer 310 and a photo solder resist (PSR) 320 layer for insulating the circuit layer (MPCB) formed thereon.

The power supply apparatus 500 of the present invention may include a plurality of printed circuit boards 300 that are different from each other in terms of structure and / or function. At this time, each of the printed circuit boards 300 may be connected in series through both ends of the flexible flat cable module 200.

The power supply unit 500 may include a plurality of flexible flat cable modules 200. The two ends of the flexible printed cable 300 may be connected to the flexible flat cable module 200, It can be connected.

More specifically, the power supply device of the present invention includes: a first printed circuit board including terminals and having a plurality of light sources (e.g., LED chips) mounted thereon; A second printed circuit board including a terminal and providing power to the first printed circuit board; And a flexible flat cable module, wherein both ends of the flexible flat cable module are connected in series between terminals of the first printed circuit board and the second printed circuit board, wherein both ends of the printed circuit board are Of the flexible flat cable module.

The present invention may further include a reinforcing part 400 for reinforcing a bonding strength between the printed circuit board 300 and the flexible flat cable module 200 constituting the power supply device.

4 schematically illustrates a cross-sectional structure of a power supply 510 according to another embodiment of the present invention. In FIG. 4, a portion where the printed circuit board 300 and the flexible flat cable module 200 are overlapped with each other, For example, the flexible flat cable 100 connected to the printed circuit board 300 further includes a reinforcing part 400 at a lower end thereof.

That is, when the flexible flat cable 100 and the metal printed circuit board 300 are joined together by the conductive anisotropic layer 150, the flexible flat cable 100 may be bent and twisted.

Unlike the conventional semiconductor encapsulant (EMC) in which the entire semiconductor chip is wrapped and packed, the reinforcing part 400 of the present invention uses a small amount of the flexible flat cable module 200 and the metal printed circuit board 300 Thereby enhancing the bonding strength of the bonded body structure. It can also serve as an adhesive, heat-dissipating function, and protecting against external impacts.

In the present invention, the reinforcing portion 400 may be made of any conventional reinforcing material known in the art, for example, an under-fill component. For example, a conventional thermosetting resin adhesive in the field can be used, and preferably an epoxy resin adhesive.

As long as the reinforcing portion 400 can increase the bonding strength, there is no particular limitation on its thickness, shape and position. For example, the flexible flat cable module 200 is preferably formed at a contact portion where the printed circuit board 300 and the flexible flat cable module 200 are connected.

A method of forming the reinforcing portion 400 in the present invention is not particularly limited. For example, after the printed circuit board 300 and the flexible flat cable module 200 are bonded to each other, a reinforcing material is applied to the connection portion of the bonded body Followed by post-curing. The reinforcing member 400 formed by curing is filled with the reinforcing material that has been applied as described above since it penetrates and fills between the contact area where the printed circuit board 300 and the flexible flat cable module 200 are connected, The contact portion and the space therebetween are firmly fixed and bonded to each other, thereby significantly increasing the bonding strength. At this time, the coating and curing conditions of the reinforcing material can be appropriately adjusted according to the kind of the reinforcing material to be used, and for example, it can be cured at 120 to 150 ° C for 5 to 30 minutes.

According to another embodiment of the present invention, the peel strength value of the flexible flat cable module 200 to the printed circuit board 300 in the power supply 510 may be 1.55 kgf / cm or more. In this case, if the power supply includes the reinforcing part 400, the peeling strength of the flexible flat cable module to the printed circuit board significantly increases. For example, the peeling strength of the flexible flat cable module may be 1.55 kgf / cm or more and 4.5 kgf / .

In addition, the present invention provides a method of constructing the above-described power supply device by anisotropic conductive connection between terminals of a printed circuit board and terminals of a flexible flat cable module.

In one preferred embodiment of the connecting method, a flexible flat cable module is laminated on a circuit pattern of the printed circuit board, and the circuit pattern of the printed circuit board and the anisotropic conductive layer of the flexible flat cable are laminated so as to face each other step; And heating and pressing the lamination portion with a heating and pressing member.

In another preferred embodiment of the connecting method, after the anisotropic conductive layer and the conductor exposed portion of the flexible flat cable (FFC) are sequentially stacked on the circuit pattern of the printed circuit board, For example, by heating and pressing.

The present invention may further include a step of forming a reinforcing portion in contact with one side surface of the lamination portion, if necessary.

The conductor 10 of the flexible flat cable module 200 is electrically connected to the conductive circuit pattern 300 formed on the printed circuit board 300 through the conductive particles of the anisotropic conductive layer 150, (Not shown).

<Display device>

Further, the present invention provides a display device including the power supply device described above.

Here, the display device can be applied to a conventional flat panel display device known in the art without limitation, and examples thereof include a liquid crystal display (LCD), a light emitting diode (LED), a touch panel, A field emission display (FED), a PDA, a plasma display panel (PDP), a backlight unit (BLU), a light source component, and the like.

11A and 11B schematically illustrate the structure of a display device 700 and 710 according to an embodiment of the present invention. The display device 700 includes a light source 600 and a light source (500, 510) for supplying power to the power supply unit.

More specifically, the display device 700, 710 of the present invention includes: a flat panel panel for displaying an image; A light source (600) for outputting light to the flat panel panel; And a power supply unit (500, 510) for supplying power to the light source. The metal printed circuit board included in the power supply units 500 and 510 may be a component that controls the light sources of the light source 600, preferably a backlight unit (BLU).

Although the light source 600 and the power supply units 500 and 510 are separately shown in FIGS. 11A and 11B, the light source 600 may be a metal of the power supply units 500 and 510, And may be already mounted on the printed circuit board. In the case of the light source 600 mounted on the metal printed circuit board as described above, the light source is not limited to the structure shown in FIG. 11 in which the light source is connected to the power supply units 500 and 510, and the structure is electrically connected to the flexible flat cable module 200 Lt; / RTI &gt;

The power supply devices 500 and 510 have flexibility and flatness, and do not include a connector and occupy a considerably small volume. Therefore, the power supply devices 500 and 510 can contribute to a thin display device having the same. The display device of the present invention having such a power supply device can be applied to both of the conventional front illuminated type (direct down type) and the side illuminated type (edge type), and in particular, the side illuminated type (or edge type) desirable.

In the display apparatuses 700 and 710 of the present invention, the arrangement space of the light source 600 and the power supply apparatuses 500 and 510 is not particularly limited. For example, in the display apparatuses 700 and 710 shown in FIGS. 11A and 11B, As shown in FIG.

12 (a) and 12 (b) are enlarged views of a connection structure of a backlight unit (BLU) 800 and a flexible flat cable module 200 according to an embodiment of the present invention. The metal printed circuit board 802 or the metal core printed circuit board 803 on which the light source (for example, the LED chip 801) mounted on the backlight unit 800 is mounted is connected to the flexible flat cable module (200).

Hereinafter, the present invention will be described more specifically by way of specific examples. The following examples are provided to aid understanding of the present invention, and the scope of the present invention is not limited thereto.

 [Examples 1 to 6 and Comparative Examples 1 to 6]

&Lt; Production of insulating film &

25 parts by weight of a reactive polyester resin (molecular weight 8,000 / glass transition temperature 61 DEG C) and reactive polyester resin (molecular weight 30,000 / glass transition temperature 80 DEG C, respectively) were dissolved in a solvent composed of toluene 80 and 90 parts by weight of methyl ethyl ketone A resin solution was prepared, and 50 parts by weight of a flame retardant filler for improving flame retardancy was added and mixed. Then, an isocyanate curing agent was added in the amounts shown in Table 1 to prepare a first solvent for an adhesive layer of 2,000 cps or more. The isocyanate curing agent was added immediately prior to coating with a factor affecting the elapsed time of the resin composition to prepare a mixture.

Further, 20 parts by weight of silica was added to 80 parts by weight of a mixed resin of a polyester resin (molecular weight 5,000 / glass transition temperature 51 DEG C) and a reactive polyester resin (molecular weight 20,000 / glass transition temperature 35 DEG C) . A second solvent was coated on one surface of a stretched polyethylene film in a coating amount of 10 g / m ² in a comma-coat method and dried to form an intermediate layer. Then, a first solvent was coated on the intermediate layer in a coating amount of 100 g / m ² And dried to form an adhesive layer having a thickness of 20 mu m to produce an insulating film.

<Manufacture of flexible flat cable>

As described above, conductors of 35 mu m in thickness were interposed between the two adhesive films prepared in Examples 1 to 6 and Comparative Examples 1 to 6, and then laminated at a speed of 0.8 m / min to obtain a laminate of Examples 1 to 6 and And flexible flexible cables (FFC) of Comparative Examples 1 to 6, respectively.

<Manufacture of flexible flat cable module>

After exposing the conductor to one end of the flexible flat cable, an anisotropic conductive film (CP7652K) was laminated on the exposed part and then pressed for 20 seconds under the conditions of 180 DEG C and 0.2 MPa, 6 and Comparative Examples 1 to 6 were fabricated.

<Power supply manufacturing>

An anisotropic conductive film (CP7652K, manufactured by Dextelles Co., Ltd.) and a flexible flat cable having a conductor exposed at one end thereof were sequentially laminated on the circuit pattern of the metal printed circuit board, and then pressed for 20 seconds under the conditions of 180 ° C and 0.2 MPa The power supply devices of Examples 1 to 6 and Comparative Examples 1 to 6 were respectively manufactured.

division Composition (parts by weight) The first polyester
(Molecular weight: 1,000 to 15,000) The second polyester
(Molecular weight 20,000 to 35,000) Hardener Flame retardant filler Example 1 25 25 8 50 Example 2 25 25 10 50 Example 3 25 25 14 50 Example 4 25 25 18 50 Example 5 25 25 22 50 Example 6 25 25 26 50 Comparative Example 1 25 25 One 50 Comparative Example 2 25 25 3 50 Comparative Example 3 25 25 5 50 Comparative Example 4 25 25 - 50 Comparative Example 5 50 - 14 50 Comparative Example 6 - 50 14 50

[Experimental Example 1]

The insulation films prepared in Examples 1 to 6 and Comparative Examples 1 to 6 were maintained at normal temperature (TR) and temperature (TH) at 85 DEG C and 85% humidity for 1000 hours, , And the results are shown in Table 2. &lt; tb &gt; &lt; TABLE &gt; The curing agent content is based on 50 parts by weight of polyester.

Hardener content Room temperature tensile stress
(TR) High temperature and high humidity tensile stress
(TH) Curing agent content and tensile stress ratio
(TH / TR) Example 1 8 134 128 0.96 Example 2 10 138 131 0.95 Example 3 14 139 129 0.93 Example 4 18 135 125 0.93 Example 5 22 131 118 0.90 Example 6 26 130 117 0.90 Comparative Example 1 One 115 88 0.77 Comparative Example 2 3 119 94 0.79 Comparative Example 3 5 128 108 0.84 Comparative Example 4 - 112 75 0.67 Comparative Example 5 14 89 72 0.81

As can be seen from Table 2, the insulating films of Examples 1 to 6 according to the present invention exhibit excellent properties in a severe condition as compared to a room temperature condition in the range of TH / TR of 0.90 to 0.96. However, in Comparative Examples 1 to 6, the mechanical characteristics under severe conditions were much lower than those at room temperature.

[Experimental Example 2]

The elongation ratios (EH) of the insulating films prepared in Examples 1 to 6 and Comparative Examples 1 to 6 after maintaining the elongation (ER) at normal temperature and the temperature at 85 ° C and the humidity at 85% for 1000 hours were evaluated, Table 3 shows the results. The curing agent content is based on 50 parts by weight of polyester.

Hardener content Room temperature elongation
(ER) High temperature and high humidity extensibility
(EH) Example 1 8 120 92 Example 2 10 123 97 Example 3 14 125 103 Example 4 18 121 105 Example 5 22 104 89 Example 6 26 109 85 Comparative Example 1 One 104 77 Comparative Example 2 3 109 78 Comparative Example 3 5 117 82 Comparative Example 4 - 98 75 Comparative Example 5 14 85 75

As shown in Table 3, the insulating films of Examples 1 to 6 according to the present invention had a high elongation (EH) of 85 to 105% after holding at a temperature of 85 ° C and a humidity of 85% for 1000 hours have. On the other hand, it can be seen that the insulation films of Comparative Examples 1 to 6 have a stretch ratio (EH) of 75 to 82% at a severe condition after being maintained at a temperature of 85 ° C and a humidity of 85% for 1000 hours.

 [Experimental Example 3]

The insulating films prepared in Examples 1 to 6 and Comparative Examples 1 to 6 were maintained for 1000 hours under conditions of a heat shrinkage rate of 85 DEG C and a humidity of 95% for 1000 hours under the conditions of a temperature of 85 DEG C and a humidity of 85% The results are shown in Table 4 below.

However, specific evaluation criteria for the above flexibility and appearance are as follows.

1. Flexibility assessment

Under the conditions of temperature 85 ° C and humidity 95%, the number of times of insulation film was measured by sliding the insulation film until the resistance of the conductor increased by at least 10% compared to the conventional one.

?: 100,000 times or more,?: 70 to 100,000 times,?: 50 to 70,000 times, X: 50,000 times or less

2. Appearance evaluation

The evaluation was made as to whether delamination occurred under the conditions of a temperature of 85 캜 and a humidity of 85%.

?: Occurrence of delamination over 2,000 hours,?: Occurrence of delamination between 1,500 and 2,000 hours,?: Occurrence of delamination between 1,000 and 1,500 hours, X: delamination of delamination below 1,000 hours

Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Comparative Example 1 Comparative Example 2 Comparative Example 3 Comparative Example 4 Comparative Example 5 8 10 14 18 22 26 One 3 5 - 14 0.30 0.20 0.20 0.20 0.20 0.20 0.75 0.60 0.40 0.80 0.35 0.10 0.08 0.08 0.08 0.08 0.08 0.25 0.20 0.15 0.30 0.13 3 2.5 2.5 2.5 2.5 2.5 3 3 2.67 2.67 2.69 ◎ ◎ ◎ ○ ○ ○ △ ○ ○ △ △ ◎ ◎ ◎ ○ ○ ○ △ ○ ○ △ △

As shown in Table 4, the insulation films of Examples 1 to 6 according to the present invention had MDs of about 0.2 to 0.3% and TDs of 0.08 to 0.10% It can be seen that the heat shrinkage ratio has a remarkably low value, and the properties of flexibility and appearance are also excellent.

[Experimental Example 4]

The pressure cooker test was performed as described below using the flexible flat cable module manufactured in Example 2 and Comparative Example 4 as follows.

More specifically, the contact resistance after the flexible flat cable module manufactured in Example 2 and Comparative Example 4 was held for 48 hours under the conditions of a temperature of 121 占 폚, a humidity of 100% and a pressure of 2 atm, and a peel strength P / S) were measured, and the appearance of these was evaluated. The results are shown in Table 5 and FIG.

The evaluation method and evaluation criteria of Experimental Example 4 are as follows.

1) The contact resistance of the flexible flat cable module was measured using a Keysight B2901A Source Meter as shown in FIG.

2) The peel strength of the anisotropic conductive film was measured at 90 ° (vertical) adhesive force (kgf / cm) for a flexible flat cable at a tensile speed of 300 mm / min and Instron 8942 UTM was used.

3) Appearance was evaluated by whether or not delamination occurred after holding at a temperature of 121 ° C, a humidity of 100% and a pressure of 2 atm for 48 hours. (OK: no delamination, Dela .: delamination)

Test time (hr) 0h 24h 48h 72h Contact resistance
(mΩ) Comparative Example 4 6.3 81,300 1,195,000 - Example 2 3.6 3.9 4.1 6.2 Peel strength
(ACF Bonding Peel Strength)
(kgf / cm) Comparative Example 4 1.426 0.344 0.073 - Example 2 1.431 1.409 1.386 1.125 Visual inspection Comparative Example 4 OK Dela. Dela. - Example 2 OK OK OK OK

As shown in Table 5, in Comparative Example 4 of the conventional hot melt type, the contact resistance significantly increased and the peel strength tended to become poor after 24 hours under severe conditions, and ignition occurred over 50 hours 8).

In contrast, the flexible flat cable module according to the present invention maintains a contact resistance of 10 m? Or less, which is significantly lower than that of the conventional hot melt type comparative example 4 even under severe conditions, and has excellent peel strength and appearance characteristics.

[Experimental Example 5]

A high temperature storage test (HTST) was performed using the flexible flat cable module manufactured in Example 2 and Comparative Example 4 as described below.

More specifically, the contact resistance after holding the flexible flat cable module manufactured in Example 2 and Comparative Example 4 under the condition of a temperature of 120 占 폚 for 1000 hours and the peel strength (P / S) of the anisotropic conductive film were measured And the appearance thereof was evaluated. The results are shown in Table 6 and Figs. 9 to 10.

The evaluation method and evaluation criteria of Experimental Example 5 are as follows.

1) The contact resistance of the flexible flat cable module was measured using a Keysight B2901A Source Meter as shown in FIG.

2) The peel strength of the anisotropic conductive film was measured at 90 ° (vertical) adhesive force (kgf / cm) for a flexible flat cable at a tensile speed of 300 mm / min and Instron 8942 UTM was used.

3) Appearance was evaluated by whether or not delamination occurred after holding at a temperature of 120 ° C for 1000 hours. (OK: no delamination, Dela .: delamination)

Test time (hr) 0h 200h 400h 600h 800h 1000h Contact resistance
(mΩ) Comparative Example 4 6.3 6.8 7.6 35.0 38.6 35.7 Example 2 3.6 3.8 3.9 4.6 5.2 4.7 Peel strength
(ACF Bonding Peel Strength)
(kgf / cm) Comparative Example 4 1.426 1.436 1.157 1.100 1.029 0.955 Example 2 1.432 1.452 1.385 1.392 1.375 1.386 Visual inspection Comparative Example 4 OK OK OK OK OK OK Example 2 OK OK OK OK OK OK

As shown in Table 6, it can be seen that the flexible flat cable module according to the present invention has a significantly lower contact resistance value than the flexible flat cable of the conventional hot melt type comparative example 4 even under harsh conditions.

In particular, it was confirmed that the flexible flat cable module of the present invention retained 10 m? Or less even under 1000 hours under severe conditions and had excellent peel strength characteristics (see FIGS. 9 to 10).

[Experimental Example 6]

A high temperature and high humidity test (HTHH) was performed using the flexible flat cable module manufactured in Example 2 and Comparative Example 4 as described below.

The contact resistance and the peel strength (P / S) of the flexible flat cable manufactured in Example 2 and Comparative Example 4 were measured after being maintained at a temperature of 85 ° C and a humidity of 85% for 1000 hours And their appearance was evaluated. The results are shown in Table 7 below.

The evaluation method and evaluation criteria of Experimental Example 6 are as follows.

1) The contact resistance of the flexible flat cable module was measured using a Keysight B2901A Source Meter as shown in FIG.

2) The peel strength of the anisotropic conductive film was measured at 90 ° (vertical) adhesive force (kgf / cm) for a flexible flat cable at a tensile speed of 300 mm / min and Instron 8942 UTM was used.

3) Appearance was evaluated by whether or not delamination occurred after holding at a temperature of 85 ° C and a humidity of 85% for 1000 hours. (OK: no delamination, Dela .: delamination)

Test time (hr) 0h 200h 400h 600h 800h 1000h Contact resistance
(mΩ) Comparative Example 4 6.3 6.8 7.3 49.2 48.3 56.4 Example 2 3.6 3.5 3.7 4.1 4.4 4.6 Peel strength
(ACF Bonding Peel Strength)
(kgf / cm) Comparative Example 4 1.426 0.599 0.600 0.593 0.573 0.421 Example 2 1.432 1.402 1.399 1.321 1.295 1.120 Visual inspection Comparative Example 4 OK OK OK OK OK Dela. Example 2 OK OK OK OK OK OK

As shown in Table 7, in Comparative Example 4 of the conventional hot melt type, the contact resistance remarkably increased and the peel strength also tended to become low as 600 hours passed under severe conditions.

In contrast, the flexible flat cable module according to the present invention maintains a remarkably low contact resistance value of less than 5 m? Even after 1000 hours under severe conditions, and has excellent peel strength and appearance characteristics.

[Experimental Example 7]

The bonding strength between the flexible flat cable module manufactured in the above example and the metal printed circuit board was evaluated as follows.

The following Example 7 is a process for producing a flexible printed circuit board (hereinafter, referred to as &quot; EPC &quot;) produced by sequentially laminating an anisotropic conductive film (EMA 1880A-25) on a circuit pattern of a metal printed circuit board (MPCB) and a flexible flat cable Lt; / RTI &gt; Example 8 is a bonded body manufactured by applying an epoxy resin adhesive type underfill as a reinforcing material to a joint portion where a flexible flat cable and a metal printed circuit board come into contact with each other in the junction body of the above Example 7, and then curing.

At this time, after fixing the metal printed circuit board among the assemblies of Examples 7 to 8 to a universal testing machine (UTM), the flexible flat cable was pulled in the direction of 90 degrees to measure the maximum load (max load) Respectively. The above method is a measurement of the adhesive strength under the condition of 50.8 mm / min, which is an evaluation standard of IPC-TM650 2.4.9, and the results are shown in Table 8 below.

Example 7 Example 8 binder Anisotropic conductive film
(ACF) Reinforced portion
(Underfill WE-1007) Condition 175 ° C, 15 sec 120 ℃ 20 minutes
(Or 150 ° C for 5 minutes) P / S (kgf / cm) 1.54 4.46

As can be seen from Table 8, the flexible flat cable module according to Example 7 including the reinforcing portion has a bonding strength characteristic improved by about three times as compared with Example 2 not including the reinforcing portion.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, It will be obvious to those of ordinary skill in the art.

10: conductor 20: insulating film
21: adhesive layer 22: middle layer
23: Resin layer 100: Flexible flat cable
150: anisotropic conductive layer 200: flexible flat cable module
300: printed circuit board 310: circuit pattern
320: PSR layer 400: reinforcing portion
500, 510: power supply 600: light source
700, 710: Display device 800: Backlight unit (BLU)
801: LED chip 802: metal printed circuit board
803: Metal core printed circuit board 804: Through hole

Claims (25)

Conductor;
A flexible flat cable covering the conductor and including an insulation film in which an adhesive layer, an intermediate layer and a resin layer are laminated in this order; And
A flexible flat cable module comprising an anisotropic conductive layer disposed on an exposed conductor of the flexible flat cable,
Wherein the adhesive layer comprises two or more polyester polymer resins and a curing agent,
Wherein the polyester polymer resin comprises at least one first polyester resin having a molecular weight of 1,000 to 15,000 and at least one second polyester resin having a molecular weight of 20,000 to 35,000,
The curing agent is contained in an amount of 8 to 26 parts by weight based on 50 parts by weight of the polymer resin contained in the adhesive layer,
(Ω _PCT / Ω _R ) of the contact resistance (Ω _R ) at an initial time (0 hr) to a contact resistance (Ω _PCT ) after maintaining at a temperature of 121 ° C., a humidity of 100% To 2.5. &Lt; / RTI &gt; The method according to claim 1,
Wherein the value of contact resistance (? _PCT ) after maintaining at a temperature of 121 占 폚, a humidity of 100% and a pressure of 2 atm for 48 hours is not more than 10 m?. The method according to claim 1,
Wherein the flexible flat cable has a Peel Strength value of 1.00 to 5.00 kgf / cm for the anisotropic conductive layer after being maintained at a temperature of 121 DEG C, a humidity of 100% and a pressure of 2 atm for 48 hours. module. The method according to claim 1,
Wherein the anisotropic conductive layer is selected from the group consisting of an anisotropic conductive film (ACF), an anisotropic conductive paste (ACP), and an anisotropic conductive adhesive (ACA). The method according to claim 1,
Wherein the flexible flat cable and the anisotropic conductive layer are integrally joined to each other and one end or both ends of the joint body are of a connectorless type. delete delete The method according to claim 1,
Wherein the adhesive layer comprises at least one curing agent,
Wherein the curing agent is a compound containing at least one functional group selected from an isocyanate group, a block isocyanate group, and a carbodiimide group. The method according to claim 1,
Wherein the adhesive layer further comprises at least one flame retardant filler,
Wherein the flame retardant filler is at least one selected from the group consisting of a halogen-free flame retardant, a phosphorus flame retardant, a nitrogen flame retardant, a metal flame retardant, and an antimony flame retardant. Conductor;
A flexible flat cable covering the conductor and including an insulation film in which an adhesive layer, an intermediate layer and a resin layer are laminated in this order; And
A flexible flat cable module comprising an anisotropic conductive layer disposed on an exposed conductor of the flexible flat cable,
Wherein the adhesive layer comprises two or more polyester polymer resins and a curing agent,
Wherein the polyester polymer resin comprises at least one first polyester resin having a molecular weight of 1,000 to 15,000 and at least one second polyester resin having a molecular weight of 20,000 to 35,000,
The curing agent is contained in an amount of 8 to 26 parts by weight based on 50 parts by weight of the polymer resin contained in the adhesive layer,
(? _HTST /? _R ) of the contact resistance (? _R ) at an initial time (0 hr) with respect to the contact resistance (? _HTST ) after 1,000 hours holding at a temperature of 120 占 폚 is in the range of 1.0 to 2.5 Flexible flat cable module. 11. The method of claim 10,
Wherein the value of the contact resistance (? _HTST ) after being maintained at a temperature of 120 占 폚 for 1,000 hours is 10 m? Or less. 11. The method of claim 10,
Wherein the flexible flat cable has a peel strength value of 1.00 to 5.00 kgf / cm for the anisotropic conductive layer after being maintained at a temperature of 120 占 폚 for 1000 hours. Conductor;
A flexible flat cable covering the conductor and including an insulation film in which an adhesive layer, an intermediate layer and a resin layer are laminated in this order; And
A flexible flat cable module comprising an anisotropic conductive layer disposed on an exposed conductor of the flexible flat cable,
Wherein the adhesive layer comprises two or more polyester polymer resins and a curing agent,
Wherein the polyester polymer resin comprises at least one first polyester resin having a molecular weight of 1,000 to 15,000 and at least one second polyester resin having a molecular weight of 20,000 to 35,000,
The curing agent is contained in an amount of 8 to 26 parts by weight based on 50 parts by weight of the polymer resin contained in the adhesive layer,
(Ω _HTHH / Ω _R ) of the contact resistance (Ω _R ) at an initial time (0 hr) to a contact resistance (Ω _HTHH ) after maintaining 1,000 hrs at 85 ° C. and 85% And a flexible flat cable module. 14. The method of claim 13,
_{Wherein the} value of the contact resistance (? _HTHH ) after maintaining 1,000 hours at 85 ° C and 85% humidity is 10 m? _Or less. 14. The method of claim 13,
Wherein the flexible flat cable has a peel strength value of 1.00 to 5.00 kgf / cm for the anisotropic conductive layer after being maintained at a temperature of 85 DEG C and a humidity of 85% for 1000 hours. Printed circuit board; And
A flexible flat cable module according to any one of claims 1 to 5 and 8 to 15
Wherein the printed circuit board and the flexible flat cable are electrically connected to each other by an anisotropic conductive layer in the flexible flat cable module. 17. The method of claim 16,
Wherein the printed circuit board is electrically connected to a light source that generates light, and supplies power to the light source. 17. The method of claim 16,
Wherein the printed circuit board is a metal printed circuit board (MPCB) on which a circuit pattern layer and a photo solder resist (PSR) layer for insulating the circuit pattern layer are formed. 17. The method of claim 16,
Wherein the power supply device includes a plurality of printed circuit boards,
Wherein both ends of the flexible flat cable module are connected in series with the respective printed circuit boards. 17. The method of claim 16,
Wherein the power supply comprises a plurality of flexible flat cable modules,
Wherein each flexible flat cable module is connected to both ends of the printed circuit board. 19. The method of claim 18,
A circuit pattern layer of the printed circuit board; And a reinforcing portion for reinforcing a bonding strength between the flexible flat cable module and the flexible flat cable module. 22. The method of claim 21,
Wherein the reinforcing portion is formed from a thermosetting resin adhesive. A display device comprising the power supply device of claim 16. 24. The method of claim 23,
Wherein the printed circuit board is a part for controlling a light source of a backlight unit (BLU). 24. The method of claim 23,
A liquid crystal display (LCD), a light emitting diode (LED), a touch panel, a field emission display (FED), a PDA, a plasma display panel (PDP) backlight unit and a light source component.

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