KR101766717B1 - Light Emitting Device Package - Google Patents

Abstract

A light emitting device package according to an embodiment includes a body having a cavity formed therein, first and second lead frames disposed in the body, a light emitting element electrically connected to the first and second lead frames, And a coating layer disposed between the resin layer and the light emitting element, wherein the coating layer includes a first concave portion including a recessed region and a protruding region, and at least a part of the phosphor is disposed in a recessed region.

Description

[0001] Light Emitting Device Package [0002]

An embodiment relates to a light emitting device package.

Light Emitting Diode (LED) is a device that converts electrical signals into light by using the characteristics of compound semiconductors. It is widely used in household appliances, remote control, electric signboard, display, and various automation devices. There is a trend.

On the other hand, the light generated in the light emitting device in the light emitting device package passes through a predetermined resin layer, and the light emitting phosphor excites the phosphor in the resin layer to generate the intended light. Therefore, it is necessary to secure uniformity and distribution of light in the light emitting device package through uniform distribution of the phosphor in the resin layer.

Embodiments provide a light emitting device package in which a phosphor layer included in a resin layer is uniformly distributed by forming a coating layer including a concavo-convex portion between a light emitting element and a resin layer of a light emitting device package, thereby improving the uniformity and distribution of light.

A light emitting device package according to an embodiment includes a body having a cavity formed therein, first and second lead frames disposed in the body, a light emitting element electrically connected to the first and second lead frames, And a coating layer disposed between the resin layer and the light emitting element, wherein the coating layer includes a first concavo-convex portion including a recessed region and a protruding region, and at least a part of the phosphor is disposed in the recessed region.

On the other hand, the coating layer includes an insulating material.

On the other hand, the light-emitting element includes a light-transmitting electrode layer.

On the other hand, the translucent electrode layer includes the second concave-convex portion.

In the light emitting device package according to the embodiment, a coating layer including concave and convex portions is formed between the light emitting device and the resin layer to uniformly distribute the fluorescent material contained in the resin layer, thereby improving the uniformity and distribution of light.

Further, the light emitting element is more reliably protected by the coating layer formed between the light emitting element and the resin layer.

1A is a perspective view illustrating a light emitting device package according to an embodiment,
1B is a cross-sectional view illustrating a light emitting device package according to an embodiment,
Fig. 1C is an enlarged view showing the area A shown in Fig. 1B,
FIG. 1D is an enlarged view showing the area A shown in FIG. 1B,
FIG. 1E is an enlarged view showing the area A shown in FIG. 1B,
FIG. 1F is an enlarged view showing the area A shown in FIG. 1B,
FIG. 1G is an enlarged view showing the area A shown in FIG. 1B,
2A is a cross-sectional view illustrating a light emitting device package according to an embodiment,
FIG. 2B is an enlarged view showing a region B shown in FIG. 2A,
3 is a cross-sectional view illustrating a light emitting device package according to an embodiment,
4A is a perspective view illustrating a lighting device including a light emitting device package according to an embodiment,
FIG. 4B is a cross-sectional view illustrating a lighting device including a light emitting device package according to an embodiment,
5 is an exploded perspective view illustrating a liquid crystal display device including a light emitting device package according to an embodiment, and FIG.
6 is an exploded perspective view illustrating a liquid crystal display device including a light emitting device package according to an embodiment.

The thickness and size of each layer in the drawings are exaggerated, omitted, or schematically shown for convenience and clarity of explanation. Also, the size of each component does not entirely reflect the actual size. The same reference numerals are used for the same components.

Hereinafter, embodiments will be described in detail with reference to the drawings.

1A to 1G are a perspective view and a cross-sectional view illustrating a light emitting device package according to an embodiment.

In order to describe the shape of the light emitting device package 100 according to the embodiment in detail, the longitudinal direction Z of the light emitting device package 100, the horizontal direction Y perpendicular to the longitudinal direction Z, And a height direction X perpendicular to the longitudinal direction Z and the horizontal direction Y. [

1B is a cross-sectional view of the light emitting device package 100 of FIG. 1A cut in the longitudinal direction Z and the height direction X and viewed in the horizontal direction Y. FIG.

1A to 1G, a light emitting device package 100 according to an embodiment includes a body 110 having a cavity 120 formed therein, first and second lead frames 140 and 150 disposed on the body 110, A light emitting element 130 electrically connected to the first and second lead frames 140 and 150 and a phosphor 162 and a resin layer 160 molded in the cavity 120 and a resin layer 160 And a coating layer 170 disposed between the light emitting device 130 and the light emitting device 130. The coating layer 170 includes a first concave and convex portion 180. [

The body 110 may be made of a resin material such as polyphthalamide (PPA), silicon (Si), aluminum (Al), aluminum nitride (AlN), liquid crystal polymer (PSG), polyamide 9T (SPS), a metal material, sapphire (Al ₂ O ₃ ), beryllium oxide (BeO), and a printed circuit board (PCB). The body 110 may be formed by injection molding, etching, or the like, but is not limited thereto.

The inner surface of the body 110 may be formed with an inclined surface. The reflection angle of the light emitted from the light emitting device 130 can be changed according to the angle of the inclined surface, and thus the directivity angle of the light emitted to the outside can be controlled.

Concentration of light emitted to the outside from the light emitting device 130 increases as the directional angle of light decreases. Conversely, as the directional angle of light increases, the concentration of light emitted from the light emitting device 130 to the outside decreases.

The shape of the cavity 120 formed in the body 110 may be circular, square, polygonal, elliptical, or the like, and may have a curved shape, but the present invention is not limited thereto.

The light emitting device 130 is electrically connected to the first and second lead frames 140 and 150. The light emitting device 130 may be a light emitting diode.

The light emitting diode may be, for example, a colored light emitting diode that emits light such as red, green, blue, or white, or a UV (Ultra Violet) light emitting diode that emits ultraviolet light. In addition, one or more light emitting diodes may be arranged.

In addition, the light emitting diode is applicable to both a horizontal type in which all the electric terminals are formed on the upper surface, a vertical type formed in the upper and lower surfaces, or a flip chip .

The resin layer 160 may be molded into the cavity 120 so as to cover the light emitting device 130.

The resin layer 160 may be formed of silicon, epoxy, or other resin material. The resin layer 160 may be formed by molding a predetermined resin material in the cavity 120, and then UV-curing the resin material.

The resin layer 160 may include a fluorescent material 162 and the fluorescent material 162 may be selected to be a wavelength of light emitted from the light emitting device 130 so that the light emitting device package 100 may emit white light. have.

The phosphor may be one of a blue light emitting phosphor, a blue light emitting phosphor, a green light emitting phosphor, a yellow light emitting phosphor, a yellow light emitting phosphor, a yellow red light emitting phosphor, an orange light emitting phosphor, and a red light emitting phosphor depending on the wavelength of light emitted from the light emitting device 130. Can be applied.

That is, the phosphor may be excited by the light having the first light emitted from the light emitting device 130 to generate the second light. For example, when the light emitting element 130 is a blue light emitting diode and the phosphor is a yellow phosphor, the yellow phosphor may be excited by blue light to emit yellow light, and blue light and blue light emitted from the blue light emitting diode As the excited yellow light is excited, the light emitting device package 100 can provide white light.

Similarly, when the light emitting device 130 is a green light emitting diode, a magenta fluorescent substance or a mixture of blue and red fluorescent materials is used. When the light emitting device 130 is a red light emitting diode, a cyan fluorescent material or a mixture of blue and green fluorescent materials For example.

Such a fluorescent material may be a known fluorescent material such as a YAG, TAG, sulfide, silicate, aluminate, nitride, carbide, nitridosilicate, borate, fluoride or phosphate.

The first and second lead frames 140 and 150 may be formed of a metal material such as titanium, copper, nickel, gold, chromium, tantalum, (Pt), tin (Sn), silver (Ag), phosphorus (P), aluminum (Al), indium (In), palladium (Pd), cobalt (Co), silicon (Si), germanium , Hafnium (Hf), ruthenium (Ru), and iron (Fe). Also, the first and second lead frames 140 and 150 may have a single-layer structure or a multi-layer structure, but the present invention is not limited thereto.

The first and second lead frames 140 and 150 are separated from each other and electrically separated from each other. The light emitting device 130 is disposed on the first lead frame 140 and the first lead frame 140 can be electrically connected to the light emitting device 130 directly or through a conductive material have. Also, the second lead frame 150 may be electrically connected to the light emitting device 130 by the wire 134, but is not limited thereto. Accordingly, when power is supplied to the first and second lead frames 140 and 150, power may be applied to the light emitting device 130. Meanwhile, a plurality of lead frames (not shown) may be disposed on the body 110 and each lead frame (not shown) may be electrically connected to the light emitting device (not shown), but is not limited thereto.

The coating layer 170 may be disposed between the resin layer 160 and the light emitting device 130.

The coating layer 170 may be disposed on at least one layer between the light emitting device 130 and the resin layer 160 and may be formed to cover the light emitting device 130 as shown in FIG. The light emitting device 130 may be disposed on the first and second lead frames 140 and 150, and a predetermined material may be applied and cured.

The coating layer 170 may be formed of an insulating material, and may be formed of, for example, a silicone resin including any one of SiO ₂ , SiN, and Al ₂ O ₃ , or an epoxy resin, but is not limited thereto.

On the other hand, if the coating layer 170 is too thick, the light emission luminance of the light emitting device 130 may be lowered. If the coating layer 170 is too thin, the light distribution of the light emitting device 130 may be deteriorated. The thickness d of the coating layer 170 may be greater than the thickness of one period of the multiple quantum well structure (not shown) included in the light emitting device 130. For example, the thickness d of the coating layer 170 may be 20 nm- Lt; / RTI >

The coating layer 170 may include a first concave portion 180.

The first irregular portion 180 may be formed by etching the coating layer 170 by a predetermined etching process or by forming the first irregular portion 180 in the process of coating the light emitting device 130 with the coating layer 170 But not limited to,

The first irregular portion 180 is formed to include several protruding regions 182 and a recessed region 184 and the shapes of the protruded region 182 and the recessed region 184 may be randomly formed, A polygonal cross section, or a round cross section as shown in Figs. 1C to 1E, but is not limited thereto. Further, the shape of each protruding region 182 and the recessed region 184 may be different from each other, but is not limited thereto.

1G, the coating layer 170 may be formed to cover the light emitting device 130, and the first concave-convex portion 180 may be formed on the coating layer 170 formed on the lateral region of the light emitting device 130 have. In addition, the first concave-convex portion 180 may be formed in a concave-convex pattern having a predetermined pattern, but is not limited thereto.

One portion of the resin layer 160 and a part of the phosphor 162 may be disposed in the recessed region 184 of the first concave and convex portion 180 as the first concave and convex portion 180 is formed in the coating layer 170 have.

Since the resin layer 160 before curing is formed in a liquid phase, the fluorescent material 162 in the resin layer 160 can settle down to the lower portion of the resin layer 160 due to its own mass, The probability that the phosphors 162 are distributed is small and the distribution thereof is also non-uniform.

However, since the resin layer 160 is molded in the recessed region 184 of the first concave-convex portion 180, the phosphor 162 included in the resin layer 160 is disposed in the recessed region 184, ), And a uniform distribution of the phosphor 162 becomes possible.

The probability that the fluorescent substance 162 is distributed on the light emitting device 130 increases and the fluorescent substance 162 is uniformly distributed on the light emitting device 130 so that the uniformity and distribution of light of the light emitting device package 100 can be improved have. In addition, since the light generated by the light emitting element 130 can be dispersed by the first concave-convex portion 180, the light directing angle and the light distribution of the light emitting device package 100 can be improved. Further, the luminous efficiency of the light emitting device package 100 can be improved, and deterioration of the phosphor 162 due to the partial distribution of the phosphor 162 can be prevented.

Meanwhile, since the coating layer 170 is formed to surround the light emitting device 130, the light emitting device 130 can be prevented from being damaged due to penetration of foreign substances such as moisture. A coating layer 170 including a first concavo-convex portion 180 is formed between the light emitting device 130 and the resin layer 160 to bond the light emitting device 130 and the resin layer 160, And the resin layer 160 are prevented from being peeled off from each other so that the reliability of the light emitting device package 100 can be improved.

The width w and the depth h of the recessed region 184 may be larger than the size of the phosphor 162 so that the phosphor 162 may be disposed. For example, the width w may have a size of 100 nm to 500 μm, and the depth h may have a size of 10 nm to 99 μm.

2A is a cross-sectional view of a light emitting device package according to an embodiment, and FIG. 2B is an enlarged view of a region B shown in FIG. 2A.

2A and 2B, a light emitting device package 200 according to an embodiment includes a body 210 having a cavity 220 formed therein, first and second lead frames 240 and 250 disposed on the body 210, A light emitting element 230 electrically connected to the first and second lead frames 240 and 250, a resin layer 260 including a phosphor and molded in the cavity 220, and a resin layer 260, And a coating layer 270 disposed between the devices 230. The coating layer 270 includes a first concave portion 280 and the light emitting device 230 includes a light transmitting electrode layer 232. The light transmitting electrode layer 232 may include a second uneven portion 290.

The first and second lead frames 240 and 250, the resin layer 260, the coating layer 270, and the first concavo-convex portion 280 are formed on the surface of the body 210, the cavity 220, Since duplicate description is omitted.

The light transmitting electrode layer 232 is formed of a material having electrical conductivity and light transmittance. For example, ITO, IZO (In-ZnO), GZO (Ga-ZnO), AZO (Al- And at least one of IGZO (In-Ga ZnO), IrO _x , RuO _x , RuO _x / ITO, Ni / IrO _x / Au, and Ni / IrO _x / Au / ITO. Since the light transmitting electrode layer 232 is formed on the light emitting device 230, a current crowding phenomenon in which a current transferred from the wire 234 to the light emitting device 230 is concentrated in a certain region is prevented, Emitting efficiency of the device 230 and the light emitting device package 200 can be improved.

On the other hand, the thickness of the coating layer 270 may be equal to or greater than the thickness of the light-transmitting electrode layer 232.

The second uneven portion 290 may be formed on the transparent electrode layer 232.

The second concave-convex portion 290 includes several protruding regions 292 and a recessed region 284 and the shapes of the protruding region 292 and the recessed region 284 can be randomly formed, A polygonal cross section, or a rounded cross section as described above, but is not limited thereto. In addition, the second concave-convex portion 290 may be formed in a concavo-convex pattern having a predetermined pattern, but is not limited thereto.

The contact area between the coating layer 270 and the light emitting device 230 can be increased by forming the second concave and convex portions 290 on the light transmitting electrode layer 232, Can be improved. Also, the light emitted from the light emitting device 230 can be prevented from being totally reflected or absorbed at the interface between the light transmitting electrode layer 232 and the coating layer 270, and the light emitting efficiency of the light emitting device package 200 can be improved.

3 is a cross-sectional view illustrating a light emitting device package according to an embodiment.

Referring to FIG. 3, the light emitting device package 300 may include an optical sheet 390, and the optical sheet 390 may include a base portion 392 and a prism pattern 394. FIG.

The base portion 392 is made of a transparent material having excellent thermal stability as a support for forming the prism pattern 394. The base portion 392 is made of, for example, polyethylene terephthalate, polycarbonate, polypropylene, polyethylene, polystyrene, But the present invention is not limited thereto.

Further, the base portion 392 may include a phosphor (not shown). For example, the base portion 392 can be formed by curing the fluorescent material (not shown) evenly dispersed in the material forming the base portion 392. When the base portion 392 is formed as described above, the phosphor (not shown) can be uniformly distributed throughout the base portion 392. Therefore, when the optical sheet 390 including a phosphor is attached to the light emitting device package 300, uniformity and distribution of light of the light emitting device package 300 can be improved.

On the other hand, a three-dimensional prism pattern 394 for refracting and condensing light can be formed on the base portion 392. The material constituting the prism pattern 394 may be acrylic resin, but is not limited thereto.

The prism patterns 394 include a plurality of linear prisms arranged in parallel with one another along one direction on one side of the base portion 392 and the vertical section with respect to the axial direction of the linear prisms may be triangular.

Since the prism pattern 394 has an effect of condensing light, the directivity of light can be improved when the optical sheet 390 is attached to the light emitting device package 300 of FIG.

Meanwhile, the prism pattern 394 may include a phosphor (not shown).

The fluorescent material (not shown) is dispersed in the prism pattern 394 to form a prism pattern 394, for example, by mixing it with an acrylic resin to form a paste or slurry state, .

When a phosphor (not shown) is included in the prism pattern 394, the light uniformity and distribution of the light emitting device package 300 are improved. In addition to the light focusing effect by the prism pattern 394, The directivity angle of the light emitting device package 300 can be improved.

4A is a perspective view illustrating a lighting device including a light emitting device module according to an embodiment, and FIG. 4B is a cross-sectional view illustrating a C-C 'sectional view of the lighting device of FIG. 4A.

4B is a cross-sectional view of the lighting device 400 of FIG. 4A cut in the longitudinal direction Z and the height direction X and viewed in the horizontal direction Y. FIG.

4A and 4B, the lighting apparatus 400 may include a body 410, a cover 430 coupled to the body 410, and a finishing cap 450 positioned at both ends of the body 410 have.

The light emitting device module 440 is coupled to a lower surface of the body 410. The body 410 is electrically connected to the light emitting device package 444 through a conductive material such that heat generated from the light emitting device package 444 can be emitted to the outside through the upper surface of the body 410. [ And may be formed of a metal material having excellent heat dissipation effect, but is not limited thereto.

The light emitting device package 444 may be disposed on the substrate 442 in multiple colors, in a multi-row manner to form a module. The light emitting device package 444 may be disposed at equal intervals or may be disposed with various distances as required. As such a substrate 442, MCPCB (Metal Core PCB) or FR4 PCB can be used.

The light emitting device package 444 includes a light emitting element (not shown), and the light emitting element (not shown) is coated with a coating layer (not shown) Not shown) can be uniformly distributed, and thus the luminous efficiency of the light emitting device package 444 and the illumination device 400 can be improved.

The cover 430 may be formed in a circular shape so as to surround the lower surface of the body 410, but is not limited thereto.

The cover 430 protects the internal light emitting device module 440 from foreign substances or the like. The cover 430 may include diffusion particles to prevent glare of the light generated in the light emitting device package 444 and uniformly emit light to the outside and may include at least one of an inner surface and an outer surface of the cover 430 A prism pattern or the like may be formed on one side. Further, the phosphor may be coated on at least one of the inner surface and the outer surface of the cover 430.

Since the light generated from the light emitting device package 444 is emitted to the outside through the cover 430, the cover 430 must have a high light transmittance and sufficient to withstand the heat generated from the light emitting device package 444. [ The cover 430 may be made of polyethylene terephthalate (PET), polycarbonate (PC), polymethyl methacrylate (PMMA), or the like. It is preferable that it is formed of a material.

The finishing cap 450 is located at both ends of the body 410 and can be used for sealing the power supply unit (not shown). In addition, the fin 450 is formed on the finishing cap 450, so that the lighting device 400 according to the embodiment can be used immediately without a separate device on the terminal from which the conventional fluorescent lamp is removed.

5 is an exploded perspective view of a liquid crystal display device including an optical sheet according to an embodiment.

5, the liquid crystal display device 500 may include a liquid crystal display panel 510 and a backlight unit 570 for providing light to the liquid crystal display panel 510 in an edge-light manner.

The liquid crystal display panel 510 can display an image using the light provided from the backlight unit 570. The liquid crystal display panel 510 may include a color filter substrate 512 and a thin film transistor substrate 514 facing each other with a liquid crystal therebetween.

The color filter substrate 512 can realize the color of an image to be displayed through the liquid crystal display panel 510.

The thin film transistor substrate 514 is electrically connected to a printed circuit board 518 on which a plurality of circuit components are disposed via a driving film 517. [ The thin film transistor substrate 514 may apply a driving voltage provided from the printed circuit board 518 to the liquid crystal in response to a driving signal provided from the printed circuit board 518. [

The thin film transistor substrate 514 may include a thin film transistor and a pixel electrode formed as a thin film on another substrate of a transparent material such as glass or plastic.

The backlight unit 570 includes a light emitting device module 520 that outputs light, a light guide plate 530 that changes the light provided from the light emitting device module 520 into a surface light source and provides the light to the liquid crystal display panel 510, A plurality of films 550, 566, and 564 for uniformly distributing the luminance of light provided from the light guide plate 530 and improving vertical incidence, and a reflective sheet (not shown) for reflecting light emitted to the rear of the light guide plate 530 to the light guide plate 530 540).

The light emitting device module 520 may include a PCB substrate 522 to which a plurality of light emitting device packages 524 and a plurality of light emitting device packages 524 are disposed to form a module.

The light emitting device package 524 includes a light emitting element (not shown), and the light emitting element (not shown) is coated with a coating layer (not shown) The light emitting device package 524 and the backlight unit 570 can be improved in luminous efficiency.

The backlight unit 570 includes a diffusion film 566 for diffusing light incident from the light guide plate 530 toward the liquid crystal display panel 510 and a prism film 550 for enhancing vertical incidence by condensing the diffused light And may include a protective film 564 for protecting the prism film 550. [

6 is an exploded perspective view of a liquid crystal display device including an optical sheet according to an embodiment. However, the parts shown and described in Fig. 5 are not repeatedly described in detail.

6, the liquid crystal display 600 may include a liquid crystal display panel 610 and a backlight unit 670 for providing light to the liquid crystal display panel 610 in a direct-down manner.

Since the liquid crystal display panel 610 is the same as that described with reference to FIG. 5, detailed description is omitted.

The backlight unit 670 includes a plurality of light emitting element modules 623, a reflective sheet 624, a lower chassis 630 in which the light emitting element module 623 and the reflective sheet 624 are accommodated, And a plurality of optical films 660 disposed on the diffuser plate 640.

The light emitting device module 623 may include a PCB substrate 621 to which a plurality of light emitting device packages 622 and a plurality of light emitting device packages 622 are disposed to form a module.

The light emitting device package 622 includes a light emitting element (not shown), and the light emitting element (not shown) is coated with a coating layer (not shown) The light emitting device package 622 and the backlight unit 670 can be improved in luminous efficiency.

The reflective sheet 624 reflects light generated from the light emitting device package 622 in a direction in which the liquid crystal display panel 610 is positioned, thereby improving light utilization efficiency.

The light emitted from the light emitting element module 623 is incident on the diffusion plate 640 and the optical film 660 is disposed on the diffusion plate 640. The optical film 660 is composed of a diffusion film 666, a prism film 650, and a protective film 664.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, It should be understood that various modifications may be made by those skilled in the art without departing from the spirit and scope of the present invention.

110: body 130: light emitting element
160: resin layer 170: coating layer
180: uneven portion

Claims (15)

A body formed with a cavity;
First and second lead frames disposed on the body;
A light emitting element electrically connected to the first and second lead frames and having a transparent electrode layer on the upper portion;
A resin layer disposed in the cavity and including a phosphor; And
And a coating layer disposed between the resin layer and the transparent electrode layer, the coating layer including a first concavo-convex portion including a recessed region at a portion in contact with the resin layer,
Wherein the transparent electrode layer includes a second concavo-convex portion in contact with the coating layer,
Side surfaces of the light-transmitting electrode layer and the coating layer are in contact with the resin layer,
Wherein at least a part of the phosphor is disposed in a recessed region of the first concavo-
The depth of the recessed region of the first concavo-convex portion is 10 nm to 99 μm,
Wherein the thickness of the coating layer is 20 nm to 100 μm. delete The method according to claim 1,
Wherein the coating layer comprises:
At least one of SiO ₂ , SiN, and Al ₂ O ₃ ,
And the width of the recessed region of the first concavo-convex portion is 100 nm to 500 μm. delete delete delete delete delete delete delete delete delete The method according to claim 1 or 3,
And a base portion disposed on the body, and a prism pattern disposed on the base portion. A lighting device comprising the light emitting device package according to claim 13. A liquid crystal display device comprising the light emitting device package according to claim 13.

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