KR101883344B1 - Light Emitting Device Array - Google Patents

Abstract

The light emitting device array according to an embodiment of the present invention includes a main frame, a plurality of light emitting devices located on the main frame, a body positioned on the main frame and having a cavity such that the light emitting device is located inside the body, And first and second lead frames electrically connected to the element.

Description

[0001] Light Emitting Device Array [

Embodiments relate to a light emitting device array in which heat dissipation is easy and reliability in bonding with an electrode is improved by disposing a plurality of light emitting devices and a body on one main frame.

As a typical example of a light emitting device, a light emitting diode (LED) is a device for converting an electric signal into an infrared ray, a visible ray, or a light using the characteristics of a compound semiconductor, and is used for various devices such as household appliances, remote controllers, Automation equipment, and the like, and the use area of LEDs is gradually widening.

In general, miniaturized LEDs are made of a surface mount device type for mounting directly on a PCB (Printed Circuit Board) substrate, and therefore an LED lamp used as a display device is also being developed as a surface position element type . Such a surface position element can replace a conventional simple lighting lamp, which is used for a lighting indicator for various colors, a character indicator, an image indicator, and the like.

As the use area of the LED is widened as described above, it is important to increase the luminance of the LED as the brightness required for a lamp used in daily life and a lamp for a structural signal is increased.

On the other hand, since a high-luminance light source is required, the light emitting device package is used in an array manner. However, when the light emitting device package is coupled to the array, there is a problem that defective solder is generated.

Embodiments provide a light emitting device array having a plurality of light emitting devices and a body disposed on one main frame, which facilitates heat dissipation and improves reliability in bonding with electrodes.

The light emitting device array according to an embodiment of the present invention includes a main frame, a plurality of light emitting devices located on the main frame, a body positioned on the main frame and having a cavity such that the light emitting device is located inside the body, And first and second lead frames electrically connected to the element.

Since the light emitting device array according to the embodiment includes the light emitting device on the metal main frame, it is easy to emit heat generated from the light emitting device.

In addition, since the number of light emitting elements increases during the process of increasing the brightness of the array, the heat generated can be appropriately emitted, thereby extending the lifetime of the light emitting element array and improving reliability.

1 is a perspective view showing a light emitting element array according to an embodiment.
2 is a cross-sectional view taken along line A-A of the light emitting device array of FIG.
3 is a plan view showing the light emitting element array of FIG.
4 is a perspective view showing a light emitting element array according to another embodiment.
Fig. 5 is a cross-sectional view of the light emitting element array of Fig. 4 cut along the BB line. Fig.
6 is a cross-sectional view of a light emitting element array according to yet another embodiment.
7 is a cross-sectional view of a light emitting element array according to another embodiment.
8 is a plan view of a light emitting element array according to yet another embodiment.
9 is a plan view of a light emitting element array according to another embodiment.
10 is a plan view of a light emitting element array according to yet another embodiment.
11 is a perspective view of a light emitting element array according to another embodiment.
12 is a perspective view illustrating a lighting device including a light emitting device array according to an embodiment.
13 is a cross-sectional view showing a CC 'cross-section of the illumination device of FIG.
14 is an exploded perspective view of a liquid crystal display device including a light emitting element array according to an embodiment.
15 is an exploded perspective view of a liquid crystal display device including a light emitting element array according to an embodiment.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention, and the manner of achieving them, will be apparent from and elucidated with reference to the embodiments described hereinafter in conjunction with the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. To fully disclose the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. Like reference numerals refer to like elements throughout the specification.

The terms spatially relative, "below", "beneath", "lower", "above", "upper" May be used to readily describe a device or a relationship of components to other devices or components. Spatially relative terms should be understood to include, in addition to the orientation shown in the drawings, terms that include different orientations of the device during use or operation. For example, when inverting an element shown in the figures, an element described as "below" or "beneath" of another element may be placed "above" another element. Thus, the exemplary term "below" can include both downward and upward directions. The elements can also be oriented in different directions, so that spatially relative terms can be interpreted according to orientation.

The terminology used herein is for the purpose of illustrating embodiments and is not intended to be limiting of the present invention. In the present specification, the singular form includes plural forms unless otherwise specified in the specification. It is noted that the terms "comprises" and / or "comprising" used in the specification are intended to be inclusive in a manner similar to the components, steps, operations, and / Or additions.

Unless defined otherwise, all terms (including technical and scientific terms) used herein may be used in a sense commonly understood by one of ordinary skill in the art to which this invention belongs. Also, commonly used predefined terms are not ideally or excessively interpreted unless explicitly defined otherwise.

The thickness and size of each layer in the drawings are exaggerated, omitted, or schematically shown for convenience and clarity of explanation. Also, the size and area of each component do not entirely reflect actual size or area.

Further, the angle and direction mentioned in the description of the structure of the light emitting device in the embodiment are based on those shown in the drawings. In the description of the structure of the light emitting device in the specification, reference points and positional relationship with respect to angles are not explicitly referred to, refer to the related drawings.

FIG. 1 is a perspective view showing a light emitting element array according to an embodiment, FIG. 2 is a sectional view taken along line A-A of FIG. 1, and FIG. 3 is a plan view showing the light emitting element array of FIG.

1 to 3, the light emitting device array 100 includes a main frame 110, a plurality of light emitting devices 130 positioned on the main frame 110, a body 130 disposed on the main frame 110, And first and second lead frames 142a and 142b that are electrically connected to the light emitting device 130 through the body 120 and the body 120. [

Here, the main frame 110 is a member serving as a body and a heat dissipation path. The main frame 110 may include a material having a high thermal conductivity to easily discharge the heat generated from the light emitting device 130 to the outside. For example, the main frame 110 may include a metal material. However, the present invention is not limited thereto.

In addition, although the main frame 110 is shown as being long by one character in FIG. 1, the main frame 110 may have various arrangements. This will be described later.

2, the width of the upper portion may be different from the width of the lower portion. In particular, the width of the lower portion of the main frame 110 may be greater than the width of the upper portion of the main frame 110 The heat generated in the light emitting device 130 can be effectively radiated to the outside. That is, the main frame 110 includes an upper frame 110a and a lower frame 110b, and a width of the lower frame 110b may be greater than a width of the upper frame 110a. The lower frame 110b and the upper frame 110a may be formed integrally with each other by including a stepped surface or an inclined surface. However, the present invention is not limited thereto, and the main frame 110 may have various shapes.

Further, the main frame 110 may include a step or an inclined surface in order to prevent electrical shorting with the first and second lead frames 141 and 142. However, the shape of the main frame 110 is not limited thereto.

A reflective layer (not shown) may be further included on the main frame 110. That is, a reflective layer may be disposed on the surface on which the light emitting device 130 is positioned, so that the light generated from the light emitting device 130 can be directed upward. The lower surface of the main frame 110 may be flat so as to ensure adhesion when the light emitting device array 100 is fixed to an electrode or the like. However, the present invention is not limited thereto.

The plurality of light emitting devices 130 may be spaced apart from each other by a predetermined distance on the main frame 110. There is no limitation on the manner in which the light emitting device 130 is located on the main frame 110, and the light emitting device 130 can be mounted by bonding or the like. However, the present invention is not limited thereto.

The light emitting device 130 is electrically connected to the first and second lead frames 141 and 142. For example, as shown in FIG. 2, the light emitting device 130 is located in the main frame 110, and the light emitting device 130 and the first and second lead frames 141 and 142 are wire- But not limited to,

The light emitting device 130 may be, for example, a light emitting diode. The light emitting diode may be, for example, a colored light emitting diode that emits light such as red, green, blue, or white, or a UV (Ultra Violet) light emitting diode that emits ultraviolet light. In addition, the light emitting device 130 may be positioned on one or more of the body 120.

In addition, the light emitting device 130 may alternatively include red, green, or blue light emitting devices to realize white light.

The body 120 may include a plurality of first and second lead frames 141 and 142 and a cavity c along the longitudinal direction of the main frame 110. That is, a plurality of bodies 120 may be positioned on the main frame 110.

The body 120 may be made of a resin material such as polyphthalamide (PPA), silicon (Si), aluminum (Al), aluminum nitride (AlN), liquid crystal polymer (PSG), polyamide 9T (SPS), a metal material, sapphire (Al ₂ O ₃ ), beryllium oxide (BeO), and a printed circuit board (PCB). The body 120 may be formed by injection molding, etching, or the like, but is not limited thereto.

The body 120 may include a wall portion surrounding the cavity c and a lower portion formed below the wall portion. The inner surface of the wall portion may include an inclined surface. The reflection angle of the light emitted from the light emitting device 130 can be changed according to the angle of the inclined surface, and thus the directivity angle of the light emitted to the outside can be controlled.

Concentration of light emitted to the outside from the light emitting device 130 increases as the directional angle of light decreases. Conversely, as the directional angle of light increases, the concentration of light emitted from the light emitting device 130 to the outside decreases.

The shape of the cavity c formed on the body 120 may be circular, square, polygonal, elliptical, or the like, but the shape may be curved. Further, the cavity c may be formed to a depth enough to expose the upper surface of the main frame 110.

Although the shape of the body 120 is shown as a hexahedron in FIG. 1, it is not limited thereto and may have various shapes.

The body 120 may be disposed at both end portions of the main frame 110 in the width direction and in a portion of the upper portion thereof, and may be coupled to the main frame 110. Although the size of the body 120 is not limited, the size of the body 120 can be adjusted in consideration of the shapes of the first and second lead frames 141 and 142 and the electrical short. The distance between the bodies 120 can be freely adjusted in consideration of heat emission generated in the light emitting device 130. [ Although they are spaced apart from each other in FIG. 1, they may be integrally formed. But is not limited thereto.

The lower surface of the body 120 may be positioned on the same plane as the lower surface of the main frame 110 so as to ensure adhesion when the light emitting device array 100 is fixed to an electrode or the like. However, the present invention is not limited thereto.

The inside of the cavity (c) may further include a resin layer.

The resin layer may be formed of silicon, epoxy, or other resin material. The resin layer may be filled in the cavity (c), and then may be formed by ultraviolet ray or thermal curing.

In addition, the resin layer may include a phosphor, and the phosphor may be selected to a wavelength of light emitted from the light emitting device 130 so that the light emitting device array 100 may emit white light.

The phosphor may be one of a blue light emitting phosphor, a blue light emitting phosphor, a green light emitting phosphor, a yellow light emitting phosphor, a yellow light emitting phosphor, a yellow red light emitting phosphor, an orange light emitting phosphor, and a red light emitting phosphor depending on the wavelength of light emitted from the light emitting device 130. Can be applied.

That is, the phosphor may be excited by the light having the first light emitted from the light emitting device 130 to generate the second light. For example, when the light emitting element 130 is a blue light emitting diode and the phosphor is a yellow phosphor, the yellow phosphor may be excited by blue light to emit yellow light, and blue light and blue light emitted from the blue light emitting diode As a result of the excitation of the excited yellow light, the light emitting device array 100 can provide white light.

Similarly, when the light emitting device 130 is a green light emitting diode, a magenta fluorescent substance or a mixture of blue and red fluorescent materials is used. When the light emitting device 130 is a red light emitting diode, a cyan fluorescent material or a mixture of blue and green fluorescent materials For example.

Such a fluorescent material may be a known fluorescent material such as a YAG, TAG, sulfide, silicate, aluminate, nitride, carbide, nitridosilicate, borate, fluoride or phosphate.

The resin layer may further include a light diffusion material for diffusing light emitted from the light emitting device 130. Here, the light diffusing material may be any one of titanium oxide (TiO ₂ ), barium oxide (BaO), silicon dioxide (SiO ₂ ), magnesium oxide (MgO) and Y ₂ O ₃ , or titanium dioxide TiO ₂ ) , there may be mixing barium oxide (BaO), silicon dioxide (SiO _2), at least two or more of magnesium (MgO), and Y ₂ O ₃ oxide. It is possible to induce irregular reflection of light generated in the light emitting device 130 by using a light diffusing material.

On the other hand, the resin layer may have various shapes and may be disposed on the same plane as the upper surface of the wall portion of the body 120, or may include a convex or concave shape. When the resin layer has a convex shape, it contributes to light diffusion. When the resin layer has a concave shape, it contributes to light concentration. However, the present invention is not limited thereto.

The first and second lead frames 141 and 142 may be electrically connected to the light emitting device 130. That is, the first and second lead frames 141 and 142 serve to apply power to the light emitting device 130.

The first and second lead frames 141 and 142 may be made of a metal material such as titanium, copper, nickel, gold, chromium, tantalum, (Pt), tin (Sn), silver (Ag), phosphorus (P), aluminum (Al), indium (In), palladium (Pd), cobalt (Co), silicon (Si), germanium , Hafnium (Hf), ruthenium (Ru), and iron (Fe). In addition, the first and second lead frames 141 and 142 may be formed to have a single layer or a multilayer structure, and two lead frames 141 and 142 or several lead frames (not shown) And the present invention is not limited thereto.

The first and second lead frames 141 and 142 are positioned through the body 110 and the first lead frame 140 and the second lead frame 142 may be separated from each other and electrically separated from each other. Accordingly, when power is supplied to the first and second lead frames 141 and 142, power may be applied to the light emitting device 130.

When the main frame 110 is made of a metal material to easily dissipate the heat generated from the light emitting device 130, the first and second lead frames 141 and 142 are electrically connected to the main frame 110, (Not shown). The body 120 may be disposed in a space between the main frame 110 and the first and second lead frames 141 and 142.

Here, the first and second lead frames 141 and 142 may include at least one bend or bend in order to prevent moisture and the like from being infiltrated into the inside of the body 120. However, the present invention is not limited thereto. The first and second lead frames 141 and 142 are connected to the inner lead frames 141a and 142a and the inner lead frames 141a and 142a which are partially exposed by the cavity c and pass through the body 120 And external lead frames 141b and 142b exposed to the outside.

The inner lead frames 141a and 142a and the light emitting device 130 can be wire-bonded by the wires 150. [

The outer lead frames 141b and 142b are exposed to the outside of the body 120 and may have various shapes and sizes. In addition, although it is shown that the main frame 110 is electrically short-circuited and arranged in the width direction of the main frame 110 in FIG. 1 for convenience of operation, the present invention is not limited thereto.

The lower surfaces of the outer lead frames 141b and 142b are formed in the same plane as the lower surface of the main frame 110 and the lower surface of the body 120 in consideration of adhesion when the light emitting device array 100 is fixed to the electrodes, Lt; / RTI > However, the present invention is not limited thereto.

FIG. 4 is a perspective view illustrating a light emitting device array according to another embodiment, and FIG. 5 is a cross-sectional view of the light emitting device array of FIG. 4 taken along line B-B.

Referring to FIGS. 4 and 5, the light emitting device array 200 according to the embodiment has a groove 211 formed in the main frame 210 as compared with the embodiment of FIG. 1, There is a difference in that the electrode 221 is formed.

The groove 211 may be formed along the longitudinal direction at a lower portion of the main frame 210. The number of grooves 211 is not limited, and a plurality of grooves 211 may be formed. Heat generated in the light emitting device 230 is transmitted to the main frame 210. At this time, the grooves 211 serve to discharge the heat of the main frame 210 in contact with external air.

The body groove 221 may be formed along the longitudinal direction of the main frame 210 at a lower portion of the body 220. The number of the body grooves 221 is not limited, and an appropriate number can be formed in consideration of the size of the light emitting device array 200 and the like. The body groove 221 can prevent the solder from overflowing toward the main frame 210 when the electrodes and the external lead frames 241b and 242b are soldered.

6 is a cross-sectional view of a light emitting element array according to yet another embodiment.

Referring to FIG. 6, there is a difference in the positions of the outer lead frames 341b and 342b in the light emitting device array 300 according to the embodiment, as compared with the embodiment of FIG.

The lower surfaces of the outer lead frames 341b and 342b may be positioned higher than the lower surfaces of the body 320 and the main frame 310. [ Therefore, when the outer lead frames 341b and 342b are fixed to the electrodes and the like, space for the solder or the paste can be ensured. In addition, it is possible to prevent the solder or paste from overflowing toward the main frame 310.

7 is a cross-sectional view of a light emitting element array according to another embodiment.

Referring to FIG. 7, the light emitting device array 400 according to the embodiment differs from the embodiment of FIG. 1 in that the main frame 410 includes at least one protrusion 412.

The protrusion 412 is disposed on a surface of the main frame 410 which is in contact with the body 120 to increase the coupling force between the body 420 and the main frame 410, And the like are prevented from being invaded. The number of protrusions 412 is not limited, and an appropriate number can be selected in consideration of the size, area, and the like of the body 220. The shape of the protrusion 412 may have various shapes.

8 is a plan view of a light emitting element array according to yet another embodiment, Fig. 9 is a plan view of a light emitting element array according to yet another embodiment, Fig. 10 is a plan view of a light emitting element array according to yet another embodiment, 1 is a perspective view of a light emitting device array according to an embodiment.

Referring to FIGS. 8 to 10, the light emitting device array 500 of the embodiment shows the arrangement of the main frames 510 in various forms.

Referring to FIG. 8, the light emitting device array 500 of the embodiment may be arranged in a circular shape with the main frame 510 being curved. At this time, the body 520 and the light emitting device 530 may be disposed along the main frame 510.

Referring to FIG. 9, in the light emitting device array 500 of the embodiment, the main frame 510 may be disposed with at least one bend. At this time, the body 520 and the light emitting device 530 may be disposed along the main frame 510.

Referring to FIG. 10, the light emitting device array 500 of the embodiment may be arranged with the main frame 510 having a lattice shape. The body 520 and the light emitting device 530 are disposed along the main frame 510 and the auxiliary frame 511 is interposed between the main frames 510. [ So that the positions of the main frames 510 can be fixed.

As described above, while the main frames 510 are arranged in various ways, heat dissipation is easy in a high brightness and high heat dissipation structure, and defects can be reduced at the time of soldering.

11 is a perspective view of a light emitting element array according to another embodiment.

Referring to FIG. 11, the light emitting device array 1000 according to the embodiment has a structure in which the first lead frames 1141 can be electrically connected to each other as compared with the embodiment of FIG. 1, and the second lead frames 1142 Can also be electrically connected.

For example, there is a difference that the outer lead frames 1141b and 1142b of the first and second lead frames 1141 and 1142 are electrically connected to each other. That is, the outer lead frames 1141b of the first lead frames 1141 are electrically connected to each other, and the outer lead frames 1142b of the second lead frames 1142 are electrically connected to each other.

A conductive member 1160 may be disposed between the outer lead frames 1141b and 1142b. The material of the conductive member 1160 may be the same material as that of the first and second lead frames 1141 and 1142. Therefore, since the external lead frames 1141b and 1142b and the electrodes do not interfere with each other, the reliability of the light emitting device array 1000 can be improved.

12 is a perspective view showing a lighting device including a light emitting device array according to an embodiment, and FIG. 13 is a sectional view showing a C-C 'sectional view of the lighting device of FIG.

12 and 13, the lighting device 600 may include a body 610, a cover 630 coupled to the body 610, and a finishing cap 650 positioned at opposite ends of the body 610 have.

The light emitting device array 100 is coupled to the lower surface of the body 610. The body 610 is electrically conductive so that heat generated from the light emitting device array 100 can be emitted to the outside through the upper surface of the body 610. [ And a metal material having an excellent heat dissipation effect.

The light emitting device array 100 may be mounted in a multi-color or multi-row manner to form an array. The light emitting device arrays 100 may be disposed at equal intervals, or may be positioned at various distances as needed.

The cover 630 may be formed in a circular shape so as to surround the lower surface of the body 610, but is not limited thereto.

The cover 630 protects the internal light emitting device array 100 from foreign substances or the like. The cover 630 may include diffusion particles so as to prevent glare of light generated in the light emitting device package 644 and uniformly emit light to the outside, and may include at least one of an inner surface and an outer surface of the cover 630 A prism pattern or the like may be formed on one side. Further, the phosphor may be applied to at least one of the inner surface and the outer surface of the cover 630.

Since the light emitted from the light emitting device array 100 is emitted to the outside through the cover 630, the cover 630 must have a high light transmittance and sufficient heat resistance to withstand the heat generated in the light emitting device array 100 The cover 630 is preferably formed of a material including polyethylene terephthalate (PET), polycarbonate (PC), polymethyl methacrylate (PMMA), or the like .

The finishing cap 650 is located at both ends of the body 610 and can be used to seal the power supply unit (not shown). In addition, the finishing cap 650 is provided with the power supply pin 652, so that the lighting apparatus 600 according to the embodiment can be used immediately without a separate device on the terminal from which the conventional fluorescent lamp is removed.

14 is an exploded perspective view of a liquid crystal display device including a light emitting element array according to an embodiment.

14, the liquid crystal display 700 may include a liquid crystal display panel 710 and a backlight unit 770 for providing light to the liquid crystal display panel 710 in an edge-light manner.

The liquid crystal display panel 710 can display an image using light provided from the backlight unit 770. The liquid crystal display panel 710 may include a color filter substrate 712 and a thin film transistor substrate 714 facing each other with a liquid crystal therebetween.

The color filter substrate 712 can realize the color of an image to be displayed through the liquid crystal display panel 710.

The thin film transistor substrate 714 is electrically connected to a printed circuit board 718 on which a plurality of circuit components are placed via a driving film 717. [ The thin film transistor substrate 714 may apply a driving voltage provided from the printed circuit board 718 to the liquid crystal in response to a driving signal provided from the printed circuit board 718. [

The thin film transistor substrate 714 may include a thin film transistor and a pixel electrode formed as a thin film on another substrate of a transparent material such as glass or plastic.

The backlight unit 770 includes a light emitting device array 100 that outputs light, a light guide plate 730 that converts light provided from the light emitting device array 100 into a surface light source and provides the light to the liquid crystal display panel 710, A plurality of films 752, 766, and 764 for uniformly distributing the luminance of light provided from the light guide plate 730 and improving vertical incidence and a reflective sheet (reflective plate) for reflecting light emitted to the rear of the light guide plate 730 to the light guide plate 730 747).

The backlight unit 770 includes a diffusion film 766 for diffusing light incident from the light guide plate 730 toward the liquid crystal display panel 710 and a prism film 752 for enhancing vertical incidence by condensing the diffused light. , And may include a protective film 764 for protecting the prism film 750.

15 is an exploded perspective view of a liquid crystal display device including a light emitting element array according to an embodiment. However, the parts shown and described in Fig. 14 are not repeatedly described in detail.

15, the liquid crystal display device 800 may include a liquid crystal display panel 810 and a backlight unit 870 for providing light to the liquid crystal display panel 810 in a direct-down manner.

Since the liquid crystal display panel 810 is the same as that described in Fig. 14, the detailed description is omitted.

The backlight unit 870 includes a plurality of light emitting device arrays 100, a reflective sheet 824, a lower chassis 830 in which the light emitting device array 100 and the reflective sheet 824 are accommodated, And a plurality of optical films 860. The diffuser plate 840 and the plurality of optical films 860 are disposed on the light guide plate 840. [

The reflective sheet 824 reflects light generated from the light emitting device package 822 in a direction in which the liquid crystal display panel 810 is positioned, thereby improving light utilization efficiency.

On the other hand, the light generated in the light emitting device array 100 is incident on the diffusion plate 840, and the optical film 860 is disposed on the diffusion plate 840. The optical film 860 may include a diffusion film 866, a prism film 850, and a protective film 864.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be taken by way of illustration, It can be seen that various modifications and applications are possible. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

Claims (18)

Mainframe;
A plurality of light emitting elements positioned on the main frame;
A body positioned on the main frame and having a cavity such that the light emitting device is located inside; And
And first and second lead frames passing through the body and electrically connected to the light emitting element,
The first and second lead frames include an inner lead frame exposed in the cavity and an outer lead frame connected to the inner lead frame and exposed to the outside of the body,
The main frame includes:
And an upper frame and a lower frame extending from the plurality of light emitting elements to the outside and having different widths,
The width of the lower frame is larger than the width of the upper frame,
Wherein the plurality of light emitting elements are spaced apart from each other by a predetermined distance on the main frame,
Wherein the external lead frame is disposed in the width direction of the main frame,
Wherein the first and second lead frames and the main frame are spaced apart from each other,
A groove is formed in the lower portion of the main frame along the longitudinal direction,
And a body groove is formed in a lower portion of the body along the longitudinal direction of the main frame. delete The method according to claim 1,
Wherein the main frame includes a metal material,
The main frame further includes a reflective layer,
Wherein the body is disposed in a spaced space between the main frame and the first and second lead frames. delete delete delete The method according to claim 1,
Wherein the first and second lead frames comprise at least one bend or bend,
Wherein the lower frame and the upper frame include a stepped surface or an inclined surface. delete delete The method according to claim 1,
And the lower surface of the body is located on the same plane as the lower surface of the main frame. delete delete The method according to claim 1,
The lower surface of at least one of the body or the main frame has a different height from the lower surface of the outer lead frame,
And the lower surface of the outer lead frame is positioned on the same plane as the lower surface of the body and the main frame. delete delete delete delete The method according to claim 1,
And a protrusion disposed on a surface where the main frame and the body are in contact with each other.

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