KR101718852B1

KR101718852B1 - Test socket with flexible contacts complex

Info

Publication number: KR101718852B1
Application number: KR1020150104584A
Authority: KR
Inventors: 전진국; 박성규
Original assignee: 주식회사 오킨스전자
Priority date: 2015-07-23
Filing date: 2015-07-23
Publication date: 2017-03-24
Also published as: KR20170012773A

Abstract

The present invention relates to a test socket having a flexible contact complex, and more particularly to a socket having a board portion provided with a flexible contact complex, a socket portion having a plurality of contact pins contacted with a mounted module to be tested, And a coupling portion for coupling the socket portion to the board portion so that the contact complex and the plurality of contact pins are electrically connected.
According to the present invention as described above, the manufacturing process and cost can be reduced as compared with the conventional one in the form of a flexible film, and since a DUT board is included, production of a separate advantageous board is omitted, It is possible to maintain the elasticity even in the repeated test of the semiconductor device, and the reliability of the product can be improved.

Description

[0001] The present invention relates to a test socket having a flexible contact complex,

More particularly, the present invention relates to a socket for testing, which maintains elasticity even in repetitive testing, simplifies the structure, improves the connecting force, and reduces manufacturing steps and costs, thereby improving working efficiency To a test socket having a flexible contact composite.

Generally, surface mount type semiconductor devices such as IC devices and IC devices are composed of LGA (Land Grid Array), BGA (Ball Grid Array), CSP (Chip Sized Package) type and the like, For example.

As one of such tests, for example, the burn-in test may be performed by applying a temperature and a voltage higher than normal operating conditions to the semiconductor device before the semiconductor device is applied to the electronic device as described above, It is checked whether or not.

In the conventional semiconductor device testing apparatus, as shown in FIG. 1, in order to verify the durability and reliability of a device in a test process, a semiconductor device is mounted on a test socket and is coupled to a device under test (DUT) board The test will be performed.

Such a burn-in socket comprises a base 1 having a central opening 1a as shown in Fig. 1; A cover (3) which is vertically movably coupled to the base (1) with the elastic member (2) interposed therebetween; A contact composite 4 inserted into the opening 1a of the base 1 and having a plurality of contact pins 4a; A latch (5) which moves to the open and support position in accordance with the upward and downward movement of the cover (3); And an adapter (6) mounted on the base and on which the semiconductor device (10) is placed.

For example, in the case of a burn-in test, a test is performed by electrically connecting to a test board at a high temperature of about 120 ° C. At this time, a test socket as shown in FIG. 1 is applied.

However, in the case of these conventional test sockets, the contact pins 4a are placed in the composite body to physically contact the lower DUT board and the connection terminals of the upper test device, so that the contact portions are easily worn by repetitive use, It is difficult to carry out a test with a signal transmission characteristic with a semiconductor device to be tested and the manufacturing of a contact complex also has to be complicated in several steps.

SUMMARY OF THE INVENTION Accordingly, the present invention has been made keeping in mind the above problems occurring in the prior art, and it is an object of the present invention to provide a flexible contact complex having a board portion provided with a flexible contact complex, a socket portion having a plurality of contact pins, And a coupling part for coupling the socket part to the board part so that the plurality of contact pins are electrically connected to each other. In addition, it is possible to reduce the manufacturing process and cost in the form of a flexible film, ) Test board having a flexible contact composite capable of improving work efficiency by omitting the manufacture of a separate lead-free board and capable of maintaining elasticity even in repeated testing of semiconductor devices, Is to provide.

In order to accomplish the above object, the present invention provides a semiconductor device comprising: a board portion provided with a flexible contact complex; a socket portion having a plurality of contact pins contacted with a mounted module to be tested; and a plurality of contact pins electrically connected to the plurality of contact pins, And a coupling portion for coupling the socket portion to the board portion to be connected thereto.

Preferably, the coupling portion includes coupling protrusions extending from the lower ends of the contact pins of the socket portion, and coupling grooves formed in the flexible contact complex of the board portion corresponding to the coupling protrusions, Is fitted and fixed in the corresponding engaging groove.

The board unit may include a substrate body made of a flexible material, a first probe provided at a central portion of the substrate body and having a plurality of first connection portions to be connected to the plurality of contact pins, And a plurality of wires formed on the substrate main body to electrically connect the first connection portions of the first probe and the second connection portions of the second probes to each other, And a board base in which each of the second probes of the flexible contact complex is positioned at the corresponding end and a central portion is protruded so that the first probe projects upwardly, Respectively.

The first connection portion may include a nickel layer formed along an edge of the coupling groove and a gold layer formed so as to cover the periphery of the coupling groove including the nickel layer. When the coupling protrusion is fixed to the coupling groove, A part of the gold layer is deformed by the engaging projections that have passed through the engaging grooves and the mutual contact area is increased.

Further, an elastic portion is provided between the flexible contact complex where the first probe is located and the board base, and elastically supports the lower side of the first probe during a module test.

The elastic portion may be any one of a rubber, a rubber, and a spring.

And a second elastic portion for covering and protecting the second probe.

The socket portion may include a socket base positioned above the board portion, a plurality of contact pins provided in the socket base, a socket cover coupled to the socket base so as to be movable up and down, And an adapter mounted on the socket base and on which the semiconductor device is placed.

As described above, according to the test socket having the flexible contact composite according to the present invention, it is possible to reduce the manufacturing process and cost in the form of a flexible film, as well as a DUT board Accordingly, it is possible to improve the working efficiency by omitting the production of an additional advantageous board and to maintain the elasticity even in the repeated test of the semiconductor device, which is a very useful and effective invention that can improve the reliability of the product.

1 is a view showing a conventional semiconductor device testing apparatus,
Figure 2 shows a test socket with a flexible contact composite according to the invention,
3 is a cross-sectional view of an AA of a test socket having a flexible contact composite according to the present invention,
Figure 4 is a diagram of a flexible contact composite in accordance with the present invention,
5 is a view showing a BB sectional view of a test socket having a flexible contact composite according to the present invention,
6 is a view showing a coupling part according to the present invention,
7 is a view illustrating a state in which a second elastic portion is further provided on a board portion according to the present invention.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

It should be noted that the present invention is not limited to the scope of the present invention but is only illustrative and various modifications are possible within the scope of the present invention.

Fig. 2 shows a test socket with a flexible contact composite according to the invention, Fig. 3 shows an AA cross-sectional view of a test socket with a flexible contact composite according to the invention, Fig. 4 5 is a view showing a sectional view taken along line BB of a test socket having a flexible contact complex according to the present invention, and Fig. 6 is a view showing a coupling portion according to the present invention And FIG. 7 is a view illustrating a state in which a second elastic portion is further provided on the board according to the present invention.

As shown in the drawing, a test socket 10 having a flexible contact complex is composed of a board portion 100, a socket portion 200, and a coupling portion 300.

The board portion 100 is provided with a flexible contact complex 110 and the socket portion 200 is formed with a plurality of contact pins 220 which are in contact with a mounted module 20 to be tested.

The coupling unit 300 is provided to couple the socket unit 200 to the board unit 100 so that the flexible contact complex 110 and the plurality of contact pins 220 are electrically connected.

3 to 5, the board 100 includes a flexible contact complex 110 and a board base 120.

4, the flexible contact complex 110 includes a substrate main body 112, a first probe 114, a second probe 116, and a wiring 118.

The substrate main body 112 is made of a flexible material and is formed of a flexible film.

The first probe 114 is provided at a central portion of the substrate main body 112 and is formed with a plurality of first connection portions 115 to be connected to the plurality of contact pins 220.

The second probe 116 is formed with a plurality of second connection portions 117 provided at each end of the substrate main body 112.

The wiring 118 is formed in the substrate main body 112 so as to electrically connect the first connecting portion 115 of the first probe 114 and the second connecting portion 117 of each second probe 116 do.

The center of the board base 120 is protruded such that each second probe 116 of the flexible contact complex 110 is positioned at the corresponding end and the first probe 114 protrudes upward.

The board unit 100 is a DUT board.

Here, as shown in FIG. 6, the coupling portion 300 includes the coupling protrusion 310 and the coupling groove 320.

The coupling protrusions 310 are extended from the lower ends of the respective contact pins 220 of the socket unit 200 and the coupling grooves 320 are formed in the flexible contact complexes of the board unit 100 110).

As each of the coupling protrusions 310 is fitted and fixed in the corresponding coupling groove 320, the socket portion 200 is fixed to the board portion 100.

Each of the coupling grooves 320 is formed in each first connection part 115 of the first probe 114.

The first connection part 115 is formed of a nickel layer 115a and a gold layer 115b.

The nickel layer 115a is formed along the edge of the coupling groove 320 and the gold layer 115b is formed to cover the periphery of the coupling groove 320 including the nickel layer 115a.

A part of the gold layer 115b is deformed by the coupling protrusion 310 passing through the coupling groove 320 when the coupling protrusion 310 is fixed to the coupling groove 320,

The elastic part 130 is further provided between the flexible contact complex 110 and the board base 120 where the first probe 114 is located.

The elastic part 130 elastically supports the lower side of the first probe 114 in a module test and may be formed of any one of rubber, rubber and spring, and may be composed of a rubber or a spring set .

7, a second elastic part 140 for covering and protecting the second probe 116 is further provided.

The second elastic part 140 may mitigate an impact transmitted from the outside, thereby protecting the second probe 116 and extending its service life.

The socket unit 200 includes a socket base 210, a contact pin 220, a socket cover 230, a latch 240, a spring 250, and an adapter 260.

The socket base 210 is located on the upper side of the board unit 100 and the contact pins 220 are provided in the socket base 210 in a plurality.

The socket cover 230 is coupled to the socket base 210 so as to be movable up and down, and the latch 240 is moved to the open and support position in accordance with the upward and downward movement of the socket cover 230.

The spring 250 urges the latch 240 to move to the support position and the adapter 260 is mounted on the socket base 210 and the module 20 to be tested is positioned.

10: Test socket 100: Board part
110: Flexible contact composite 112:
114: first probe 115: first connection
116: second probe 117: second connection
118: wiring 120: board base
130: Elastic part 200: Socket part
210: socket base 220: contact pin
230: socket cover 240: latch
250: spring 260: adapter
300: engaging portion 310: engaging projection
320: Coupling groove

Claims

A board portion provided with a flexible contact complex;
A socket having a plurality of contact pins in contact with a mounted module to be tested; And
And a coupling portion for coupling the socket portion to the board portion so that the flexible contact complex and the plurality of contact pins are electrically connected,
Wherein,
A first probe provided at a central portion of the substrate main body and having a plurality of first connection portions to be connected to the plurality of contact pins, a plurality of second connection portions provided at each end of the substrate main body, And a plurality of wires formed on the substrate main body to electrically connect the first connection portions of the first probe and the second connection portions of the second probes to each other. And
And a board base in which each second probe of the flexible contact complex is positioned at the corresponding end and a central portion is protruded so that the first probe projects upward,
The coupling portion
An engaging protrusion extending from a lower end of each contact pin of the socket portion; And
And a coupling groove formed in the flexible contact complex of the board portion corresponding to each of the coupling protrusions,
Wherein the coupling groove is formed in each first connection portion of the first probe.

delete

The connector according to claim 1,
A nickel layer formed along an edge of the coupling groove; And
And a gold layer formed to cover the periphery of the coupling groove including the nickel layer,
Wherein a part of the gold layer is deformed by the coupling protrusion passing through the coupling groove when the coupling protrusion is fixed to the coupling groove, thereby increasing the mutual contact area.

The method according to claim 1,
And a flexible portion between the flexible contact complex where the first probe is located and an elastic portion between the flexible contact complex and the board base to elastically support the lower side of the first probe during a module test. socket.

6. The connector according to claim 5,
Characterized in that it is a rubber, a rubber, and a spring.

The method according to claim 1,
And a second elastic portion for covering and protecting the second probe.

The socket according to claim 1,
A socket base positioned above the board unit;
A plurality of contact pins provided in the socket base;
A socket cover coupled to the socket base so as to be movable up and down;
A latch which is moved to the open and support position in accordance with the upward and downward movement of the socket cover;
A spring for urging the latch to move to a support position; And
And an adapter mounted on the socket base and on which the semiconductor device is placed.