KR101658438B1 - Substrate Bonding Apparatus for Organic Electro Luminescent device - Google Patents

Abstract

A substrate laminating apparatus for an organic electroluminescence element is disclosed.

The apparatus for laminating a substrate for an organic electroluminescence device according to the present invention is a device for laminating a substrate for an organic electroluminescence element having a chamber whose lower end is in a vacuum state, An upper substrate having an organic light emitting diode and spaced apart from the lower substrate by a distance therebetween and having a metal seal therebetween; an upper substrate disposed above the upper substrate; And a mechanism positioned between the rubber and the upper substrate for transferring the pressure applied from the rubber to the upper substrate, the mechanism transferring heat with pressure to the upper substrate.

Cigarettes, jigs, fixtures, metal seals, heat, rubber,

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a substrate bonding apparatus for an organic electroluminescent device,

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a substrate laminating apparatus, and more particularly, to a laminating apparatus for an organic electroluminescence element capable of improving a laminating efficiency.

A typical example of a flat panel display (FPD) used in recent years is a liquid crystal display (LCD) having light weight and low power consumption.

However, since the liquid crystal display device is a light-receiving type device that displays an image by adjusting the amount of light coming from the outside, a separate light source for illuminating the liquid crystal display panel, that is, a backlight unit, , Brightness, contrast (contrast), viewing angle, and large-sized features. Therefore, efforts are being made to develop a new flat panel display capable of overcoming these drawbacks.

One of the new flat panel displays, organic electroluminescent device (OLED), is also called an organic light emitting diode (OLED), and is a self-luminous type device using an organic electroluminescent film as a light emitting layer. There is no need to provide a backlight unit of the present invention, which is advantageous in terms of fixed tax and power consumption.

The organic electroluminescent device can be driven by a low-voltage direct current, has a high response speed, and is entirely solid. Therefore, the organic electroluminescent device is resistant to an external impact and has a wide temperature range.

Therefore, in recent years, an organic light emitting diode device has been actively developed as a display panel of a portable information terminal such as a mobile computer, a portable telephone, a portable game machine, and an electronic book, instead of a liquid crystal display.

The glass light emitting diode device includes an active matrix organic light emitting diode (OLED) OLED having a swinging device formed of a thin film transistor (TFT) for each pixel, and a passive matrix type organic light emitting diode Device (OLED).

In general, the organic light emitting diode includes first and second electrodes and an organic light emitting portion formed between the two electrodes.

Meanwhile, the organic light emitting diode is encapsulated in order to prevent the operation life of the organic light emitting diode from being shortened due to moisture or oxygen introduced from the outside.

As a method for the encapsulation, there is a method of using a metal seal. When the upper and lower glass substrates are attached to each other, pressure is applied to the upper substrate with a silicone rubber of a bonding equipment .

At this time, in order to maximize the pressure inside the cementation equipment, the lower part is made to be in a vacuum state, and pressure is applied to the upper glass substrate with the rubber. The bonding equipment includes a heat plate disposed below the lower substrate to dissolve the metal seal. Therefore, the upper and lower substrates are bonded together by attaching the deposited portion by melting the metal on the contact surfaces of the upper and lower substrates.

The encapsulation method of the organic light emitting diode device using the metal seal is a method in which a pressure is applied to the upper substrate by using a rubber of silicone material and is attached to the upper substrate. The combined force is lowered. Such deterioration of adhesion force adversely affects the function of preventing moisture permeation and oxygen, which are the functions of encapsulation, thereby lowering the reliability of the product.

An object of the present invention is to provide a substrate adhering apparatus for an organic electroluminescence element which can improve the reliability of a product by increasing an adhesion force.

The apparatus for laminating a substrate for an organic electroluminescence element according to an embodiment of the present invention includes a chamber for holding a lower substrate, the chamber being positioned in the chamber and having a chamber in which a lower end is in a vacuum state, A heat plate disposed between the stage and the lower substrate and transferring heat to the lower substrate as a heat source; an upper substrate having an organic light emitting diode spaced apart from the lower substrate by a space between the metal seal and the upper substrate; And a mechanism for transferring the pressure applied from the rubber to the upper substrate, the mechanism being located between the rubber and the upper substrate, the pressure being applied to the upper substrate Heat is transferred.

The apparatus for bonding an organic electroluminescence device substrate according to the present invention has a structure in which a heat source is installed and pressure is applied to the upper substrate to improve the encapsulation function by heat bonding to improve the bonding force and improve the reliability of the product .

Hereinafter, embodiments according to the present invention will be described with reference to the accompanying drawings.

1 is a view illustrating an apparatus for bonding a substrate of an organic electroluminescent device according to an embodiment of the present invention.

1, an apparatus 100 for bonding a substrate of an organic electroluminescent device according to an embodiment of the present invention includes a stage 150 in which a lower substrate 120 is placed in a closed chamber, And an upper substrate 110 spaced apart from the lower substrate 120.

The apparatus 100 for bonding a substrate of an organic electroluminescent device according to an exemplary embodiment of the present invention includes a rubber material 160 for applying pressure when a top substrate 110 and a bottom substrate 120 are bonded together, A jig 130 located between the rubber 160 and the upper substrate 110 and capable of generating heat and a jig 130 positioned below the lower substrate 120 and serving as a heat source of the lower substrate 120 And a heat plate 140 for performing heat treatment.

An organic light emitting diode (not shown) is formed on the upper substrate 110, and a thin film transistor (not shown) array is formed on the lower substrate 120 to drive the organic light emitting diode.

The rubber 160 applies pressure to the upper substrate 110 to bond the upper substrate 110 and the lower substrate 120 together. As described above, the rubber 160 is made of a silicon material.

The jig 130 has a concavo-convex pattern as a mechanism capable of generating heat by contacting with the upper portion of the upper substrate 110. When the size of the concavo-convex pattern is about 80 to 120% of the upper substrate 110, the variable temperature is about 60 to 150 ° C. The shape of the concavo-convex pattern included in the jig 130 can be modified as much as possible.

At this time, the jig 130 is made of a metal material having a high thermal conductivity without being deformed in shape by the pressure of the rubber (160).

Since the jig 130 is located below the rubber 160, when the rubber 160 applies pressure to the jig 130, the jig 130 is positioned below the jig 130. Thereby transferring the pressure to the upper substrate 110. In this process, since the jig 130 generates heat, the heat is transferred to the upper substrate 110 together with the pressure.

The lower end of the sealed chamber is evacuated to maximize the pressure inside the lid 100.

A face seal 170 is provided between the lower substrate 120 and the upper substrate 110 to secure rigidity from an external impact and first and second metal seals 170 and 170 for preventing moisture permeation from the outside to ensure reliability. The metal seals 190a and 190b and the first and second metal seals 190a and 190b are disposed at upper and lower portions of the first and second metal seals 190a and 190b, The first to fourth adhesive layers 180a to 180d for bonding are located.

The first and second metal seals 190a and 190b are formed by encapsulation to prevent the life of the organic light emitting diode formed on the upper substrate 110 from being shortened by moisture or oxygen introduced from the outside, ).

When heat is generated in the heat plate 140, the heat is transferred to the lower substrate 120 to melt the first and second metal seals 190 and 190b.

At the same time, since the heat is transferred to the upper substrate 110 through the jig 130, first and second metal seals (not shown) positioned between the upper substrate 110 and the lower substrate 120 190a and 190b are melted to easily adhere the upper substrate 110 and the lower substrate 120 together.

As shown in FIG. 2, an organic light emitting diode device 200 is formed on the upper substrate 110. The organic light emitting diode device 200 has a structure in which an organic light emitting portion 115 is sandwiched between a pair of electrodes, that is, a first electrode 113 and a second electrode 117.

The first electrode 113 is formed on the upper substrate 110 to serve as an anode and an organic light emitting portion 115 is formed on the first electrode 113. The organic light emitting portion 115 The second electrode 117 is formed to serve as a cathode.

The organic light emitting portion 115 has a multilayer structure in which a hole injecting layer 115a, a hole transporting layer 115b, an organic light emitting layer 115c, an electron transporting layer 115d, and an electron injecting layer 115e are stacked together .

When a voltage is applied to the organic light emitting diode device 200 having the above structure, electrons move and current flows. In the first electrode 113, a hole is formed in the hole injection layer 115a, Electrons are sequentially passed through the electron injection layer 115e and the electron transport layer 115d to pass through the organic light emitting layer 115c and then to the organic light emitting layer 115c. 115c.

Here, electrons and holes that are encountered in the organic light emitting layer 115c generate excitons having high energy, and the excitons fall into low energy to generate light.

The color of the light changes according to the organic material constituting the organic light emitting layer 115c and a full color is formed by using each organic material that emits red, green, .

As described above, according to the present invention, the substrate adhering apparatus for an organic electroluminescent device functions as a heat source between a rubber for applying pressure to an upper substrate and an upper substrate, And transfers heat to the upper substrate.

Accordingly, the apparatus for attaching a substrate for an organic electroluminescence device according to the present invention transfers heat to the upper substrate and transfers heat to the lower substrate through a heat plate, thereby forming a metal seal The upper substrate and the lower substrate are easily joined together by melting a metal seal.

As a result, according to the present invention, the upper substrate and the lower substrate can be efficiently bonded together by increasing the bonding force, and the upper and lower substrates are heated simultaneously to melt the metal seal The encapsulation characteristics for protecting the organic light emitting element can be improved and the reliability of the product can be improved.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is evident that many alternatives, modifications and variations will be apparent to those skilled in the art. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a view showing an apparatus for bonding a substrate of an organic electroluminescent device according to an embodiment of the present invention. FIG.

2 shows an organic light emitting diode according to the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS FIG.

100: substrate bonding apparatus 110: upper substrate

113: first electrode 115: organic light emitting portion

115a: Hole injection layer 115b: Hole transport layer

115c: organic light emitting layer 115d: electron transporting layer

115c: electron injection layer 117: second electrode

120: lower substrate 130: jig

140: Heat plate 150: Stage

160: Rubber 170: Face seal

180a to 180d: first to fourth adhesive layers 190a and 190b: first and second metal seals

Claims (8)

A chamber having a lower end in a vacuum state; A stage positioned within the chamber and supporting a lower substrate; A heat plate positioned between the stage and the lower substrate and transferring heat to the lower substrate as a heat source; An upper substrate spaced apart from the lower substrate by a metal seal and including an organic light emitting diode; A rubber positioned above the upper substrate and applying pressure to the upper substrate; And And a mechanism disposed between the rubber and the upper substrate to transmit heat to the upper substrate as a heat source and transmit the pressure applied from the rubber to the upper substrate, Wherein the structure includes a concavo-convex pattern that is in contact with the upper substrate and is made of a metal material whose shape is not deformed by the pressure of the rubber, Wherein the metal seal is encapsulated by the heat of the lower substrate and the upper substrate to protect the organic light emitting diode disposed on the upper substrate. delete The method according to claim 1, Wherein the concavo-convex pattern has a size of 80 to 120% of the size of the upper substrate. delete The method according to claim 1, Wherein the variable temperature of the fixture is 60 to 150 占 폚. delete delete The method according to claim 1, Further comprising first to fourth adhesive layers, Wherein the metal seal comprises first and second metal seals, Wherein the first adhesive layer is positioned between an upper portion of the first metal seal and the upper substrate, Wherein the second adhesive layer is positioned between a lower portion of the first metal seal and the lower substrate, Wherein the third adhesive layer is positioned between an upper portion of the second metal seal and the upper substrate, And the fourth adhesive layer is positioned between a lower portion of the second metal seal and the lower substrate.

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